M429992 五、新型說明： 【新型所屬之技術領域】 [0001] 本創作係有關於一種熱管散熱結構，尤指一種兼具有較 佳熱傳效率及抗重力能力佳，進而更可達到介面熱阻小 的效果之熱管散熱結構。 [先前技術] [0002] 隨著電腦、智慧電子裝置及其他電器設備之微小型化、 高性能化日趨顯著，此代表著用於其内部之熱傳元件及 散熱元件亦相同需配合朝微小型化及薄型化方向設計， 藉以符合使用者之需求。 熱管係為一種導熱效率極佳之導熱元件，其熱傳效率係 優於銅及鋁等金屬數倍乃至數十倍左右，因此於各種熱 關聯設備中用作冷卻用元件。 熱管就形狀而言，係區分有圓管形狀之熱管、截面積呈D 形狀之熱管、平板熱管等，主要係被用於冷卻電子設，備 中熱源之傳導，而由於為了便於安裝至被冷卻部件及為 了使接觸面能獲得較大之面積，故所述之平板熱管為現 階段被廣為使用，另外隨著冷卻機構之小型化、省空間 化，使用熱管來作為熱傳導之電子設備亦相同大量選擇 平板熱管來應用。 而傳統熱管結構其有多種的之製造方法，例如係於一中 空管體中填入金屬粉末，並將該金屬粉末透過燒結之方 式於該令空管體内壁形成一毛細結構層，其後對該管體 進行抽真空填入工作流體最後封管，又或於所述中空管 體内置入金屬材質之網狀體，該網狀毛細結構體會展開 1()12()125#單編號A0101 第3頁/共20頁 1012003753-0 M429992 並自然的向外伸張貼覆至該中空管體内壁以形成一毛細 結構層，其後對該管體進行抽真空填入工作流體最後封 管，但現今因電子設備之微小薄型化需求，致需將熱管 製作成平板型。 所述平板熱管雖可達到薄型化之目的，但卻延伸出另一 問題，由於該平板熱管係將金屬粉末燒結於熱管管徑之 内壁表面，令其燒結體得完整全面的彼覆於壁面上，致 使對該平板熱管加壓時，該平板熱管内部位於加壓面兩 側之毛細結構（即燒結之金屬粉末或網狀毛細結構體） 易受到擠壓破壞，進而由該平板熱管之内壁脫落，故令 該薄型熱管之熱傳效能大幅降低或甚者失能；此外雖該 平板熱管能達到熱源傳導，但由於平板熱管其於製成薄 型化後，因為薄化之目的造成内部毛細結構之毛細力不 足，致使工作流體阻塞蒸汽通道，再者，也因平板熱管 薄型化加工時管内流道面積減少，故使毛細力降低，導 致最大熱輸送量亦降低，其主要原因一者為該平板熱管 整體薄型化後導致平板熱管内容積減少，另一原因越是 薄型化經過壓扁後之平板熱管造成中央凹陷後封閉阻塞 該蒸汽通道。 故為解決前述習知缺點，該項領域之業者係於該平板熱 管内部腔室中***一芯棒，該芯棒沿著軸向形成一特定 之切口形狀，並由該切口與該腔室内壁所形成之空間填 充金屬粉末，並進行燒結形成毛細結構，最後拔出該芯 棒，再針對該毛細結構所位於腔室之中央部位施以加壓 加工製成扁平狀，毛細結構與該腔室内壁平坦部分熱性 接觸，且於該腔室中毛細結構兩側設有空隙作為蒸汽通 1隨12#單编號删1 第4頁/共20頁 1012003753-0 M429992 道使用即可獲得較佳蒸汽通道阻抗，但因毛細截面狹小 ，故使毛細力降低，造成抗重力熱效率及熱傳效率差， 則此項缺點則為現行極須改善之重點。 【新型内容】 [0003] 爰此，為有效解決上述之問題，本創作之主要目的在提 供一種具有較佳熱傳效率之熱管散熱結構。 本創作之次要目的，係在提供一種具有達到抗重力能 力佳及介面熱阻小的效果之熱管散熱結構。 本創作之次要目的，係在提供一種具有單位面積能承 受較大的熱功率衝擊之熱管散熱結構。 為達上述目的，本創作係提供一種熱管散熱結構，係 包括一本體及至少一第一毛細結構，該本體具有一第一 内側、一相對該第一内側之第二内侧、一第三内側、一 相對該第三内側之第四内側及至少一腔室，該腔室内填 充有工作流體；並該第一毛細結構係設在該腔室内，且 具有一第一部分及一第二部分，該第一部分係形成在該 第一内側上，而該第二部分則從該第一部分之兩側沿相 , 鄰該第三、四内側延伸構成，並該第一部分之厚度大於 該第二部分之厚度；透過該本體的第一、三、四内側上 分別形成有所述第一部分與第二部分，藉以令於該腔室 内的汽態工作流體充分通暢，進而有效達到絕佳的熱傳 效率、抗重力能力佳、壓力阻抗小以及單位面積能承受 較大的熱功率衝擊等諸多效果者。 【實施方式】 [0004] 本創作之上述目的及其結構與功能上的特性，將依據所 10120125^W A0101 第5頁/共20頁 1012003753-0 财29992 附圖式之較佳實施例予以說明。 本創作係一種熱管散熱結構’請參閱第1、2圖示，係 顯示本創作之第一較佳實施例之立體及剖面示意圖；該 熱管散熱結構係包括一本體1及至少一第一毛細結構16 , 其中s玄本體1係具有一第一内側11、一第二内側12、一第 三内側13、一第四内側14及至少一腔室15，該第一内側 11係相對第二内側12，該第三内側13則相對第四内側14 ，並前述第一、二、三、四内側11、12、13、14共同界 定所述腔室15，該腔室15内填充有工作流體，前述工作 流體係可為純水、無機化合物、醇類、酮類、液態金屬 、冷煤及有機化合物其中任一。其中前述腔室15壁面（即 第一、二、三、四内側11、12、13、14)係成光滑壁面 〇 另者前述第一毛細結構16於該較佳實施例係以燒結粉 末體做說明，但並不侷限於此，於具體實施時，亦可選 擇為網目、纖維體、網目及燒結粉末組合及微結構體其 中任一；並該第一毛細結構16係設於前述腔室15内，且 其具有一第一部分161及一第二部分162，該第一部分 161係形成在該第一内側11上，所述第二部分162則從該 第一部分161的兩側沿相鄰該第三、四内侧丨3、14延伸構 成’並該第一部分161之厚度大於該第二部分162之厚度 ，泛指所述第一部分161的徑向延伸體積大於該第二部分 162的徑向延伸體積。 1012003753-0 所以透過所述第一内側11其上第一部分161之厚度大 於第三、四内側13、14其上第二部分162之厚度，使該第 一内侧11的外部可承受吸附對應較大功率的發熱元件所 10120125^^^ Α0101 Μ P 共 20 頁 M429992 產生之熱1 ,換言之，就是該第一毛細結構16的單位面 積較大，使得可承受較大的熱功率衝擊，相對的熱傳量 亦比較大，進而由於該第二内側12其上未設有第一毛細 結構16，以減少該腔室丨5内的汽態工作流體2(如參閱第 3B圖示）流動至第二内側12上的壓力阻抗，藉以有效大幅 提升汽液循環效率。 故藉由本創作之第一毛細結構16的第一、二部分161 、162分別設置於該腔室15内的第一、三、四内侧u、 13、14上結合一體的設計，俾使有效達到較佳熱傳效率 及減少壓力阻抗，進而有效提升汽液循環效率。 請參閱第3A、3B圖示，係顯示本創作之第二較佳實施 例之實施立體及剖面示意圖，並辅以參閱.第2圖示；該本 較佳實施例主要是將前述第一較佳實施例之熱管散熱結 構貼設在相對的至少一發熱元件4(如中央處理器、繪圖 晶片、南北橋晶片或其他執行處理晶片）上，亦即該本體 1之第一内側11的外部與至少一發熱元件4相對應傳導熱 量時’透過該第一、三、四内側1丨、丨3、丨4的第一、二 部分161、162其上液態工作流體3迅速吸附熱量而產生蒸 發’以轉換為汽態工作流體2，使該汽態工作流體2因第 二内侧12上未設有第一毛細結構1 6，而促使該汽態工作 流體2能快速朝相對第二内侧12上流動，等待該汽態工作 流體2到第二内側12上受冷卻而冷凝轉換為液態工作流體 3後’該液態工作流體3藉由重力回流至第一内側11上的 第一部分161及第三、四内側13、14上的第二部分162繼 續汽液循環，藉以有效達到絕佳的散熱效果。 續參閱第3C、3D圖示，係為該本較佳實施例之另一實 1〇蘭^單驗删1 第7頁/共20頁 1012003753-0 M429992 施立體及剖面示意圖；主要是將前述本體i之第二内側i2 的外部對接至少-散熱單元5，其中該散熱單元5係為散 熱器 '散熱組及水冷裝置其中任―，且其用以加速 冷部流動到第二内側i 2上的汽態工作流體2而冷凝轉換為 液態工作流體3，以有效提升汽液循環效果，進而更可達 到絕佳的散熱效果。 清參閱第4圖示，係顯示本創作之第三較佳實施例之 抽不意圖’並輔以參閱第i圖示；該較佳實施例的結構 及連結關係及其功效大致與前述第一較佳實施例相同， 故在此不重新贅述，其兩者不同處在於：前述該本體k 第二内側12上區分有一毛細形成區121及至少一未有毛細 形成區122，其中該未有毛細形成區122係為第二内側12 此區域上未形成有毛細結構，且所述未有毛細形成區122 係位於該毛細形成區121兩旁，且其分別鄰近對應的第三 、四内側1 3、14。 另者前述該本體1内更設有至少一增生毛細部17 ,該 增生毛細部17係選擇為網目、纖維、燒結粉末、網目及 燒結粉末組合及微結構體其中任一；並前述增生毛細部 17係設置在該第二内側12之毛細形成區121上，且相對該 第一部分161。 又者該增生毛細部17具有一自由端171，該自由端 171係從該毛細形成區121上延伸延接相對的第一毛細結 構16的第一部分161 ;於該較佳實施例之增生毛細部η係 大致呈山丘狀，但並不侷限於此，於具體實施時，亦可 為不同形狀態樣，如梯狀、矩狀或錐狀。 再者前述第一毛細結構16與增生毛細部丨7及蒸汽腔室 ]0120125#單編號A01〇l 第8頁/共20頁 1012003753-0 M429992M429992 V. New description: [New technical field] [0001] This creation is about a heat pipe heat dissipation structure, especially a combination of better heat transfer efficiency and anti-gravity ability, and thus can achieve interface thermal resistance. Small effect heat pipe cooling structure. [Prior Art] [0002] As the miniaturization and high performance of computers, smart electronic devices, and other electrical devices become more and more prominent, this means that the heat transfer components and heat dissipating components used in the same are also required to be small and small. Designed for thinning and thinning, to meet the needs of users. The heat pipe is a heat-conducting element with excellent heat conduction efficiency, and its heat transfer efficiency is several times or even several tens of times higher than that of metals such as copper and aluminum, and thus it is used as a cooling element in various heat-related equipment. In terms of shape, the heat pipe is divided into a heat pipe having a circular tube shape, a heat pipe having a D-shaped cross section, a flat heat pipe, and the like, and is mainly used for cooling an electronic device, and is used for heat conduction, and is convenient for mounting to the cooled component. In order to obtain a large area of the contact surface, the flat heat pipe is widely used at the present stage, and the electronic device using the heat pipe as the heat conduction is also the same as the cooling mechanism is miniaturized and space-saving. Select a flat heat pipe to apply. The conventional heat pipe structure has various manufacturing methods, for example, filling a hollow pipe body with metal powder, and sintering the metal powder to form a capillary structure layer on the inner wall of the hollow pipe, followed by The tube body is vacuum-filled into the last sealing tube of the working fluid, or the mesh body of the metal material is built into the hollow tube body, and the network capillary structure body is unfolded 1 () 12 () 125 # single number A0101 Page 3 of 201012003753-0 M429992 and naturally outwardly spread over the inner wall of the hollow tube to form a capillary structure layer, after which the tube is vacuumed and filled with the working fluid and finally sealed. However, due to the small and thin requirements of electronic equipment, it is necessary to make the heat pipe into a flat type. Although the flat heat pipe can achieve the purpose of thinning, it extends another problem. Since the flat heat pipe sinters the metal powder on the inner wall surface of the heat pipe diameter, the sintered body is completely and completely covered on the wall surface. When the flat heat pipe is pressurized, the capillary structure (that is, the sintered metal powder or the mesh capillary structure) on the both sides of the pressing surface of the flat heat pipe is easily crushed and destroyed, and is further detached from the inner wall of the flat heat pipe. Therefore, the heat transfer efficiency of the thin heat pipe is greatly reduced or it is dissipated; in addition, although the flat heat pipe can achieve heat source conduction, since the flat heat pipe is thinned, the internal capillary structure is caused by thinning. Insufficient capillary force causes the working fluid to block the steam passage. Moreover, the area of the flow passage in the tube is reduced when the flat heat pipe is thinned, so that the capillary force is reduced, and the maximum heat transfer amount is also reduced. The main reason is that the flat plate is the flat plate. The thinning of the heat pipe leads to a reduction in the internal volume of the flat heat pipe, and the other reason is that the flattened heat pipe is flattened by the flattened heat pipe. The recess is closed to block the steam passage. Therefore, in order to solve the above-mentioned conventional disadvantages, a person in the field inserts a core rod into the inner chamber of the flat heat pipe, and the core rod forms a specific slit shape along the axial direction, and the inner wall of the chamber is formed by the slit. The formed space is filled with metal powder and sintered to form a capillary structure, and finally the mandrel is pulled out, and then the central portion of the chamber where the capillary structure is located is subjected to press processing to form a flat shape, and the capillary structure and the chamber are The flat portion of the wall is in thermal contact, and a gap is provided on both sides of the capillary structure in the chamber as steam pass 1 to obtain better steam with 12# single number deletion 1 page 4 / total 20 pages 1012003753-0 M429992 Channel impedance, but due to the narrow capillary section, the capillary force is reduced, resulting in poor anti-gravity thermal efficiency and heat transfer efficiency. This shortcoming is the focus of current improvement. [New Content] [0003] In order to effectively solve the above problems, the main purpose of the present invention is to provide a heat pipe heat dissipation structure having better heat transfer efficiency. The secondary purpose of this creation is to provide a heat pipe heat dissipation structure that achieves the effects of high anti-gravity and low thermal resistance. The secondary purpose of this creation is to provide a heat pipe heat dissipation structure that can withstand a large thermal power impact per unit area. In order to achieve the above object, the present invention provides a heat pipe heat dissipation structure, comprising a body and at least one first capillary structure, the body having a first inner side, a second inner side opposite to the first inner side, and a third inner side. a fourth inner side and at least one chamber opposite to the third inner side, the chamber is filled with a working fluid; and the first capillary structure is disposed in the chamber and has a first portion and a second portion, the first portion a portion is formed on the first inner side, and the second portion is formed from the two sides of the first portion along the phase, adjacent to the third and fourth inner sides, and the thickness of the first portion is greater than the thickness of the second portion; The first portion and the second portion are respectively formed on the inner sides of the first, third, and fourth sides of the body, so that the vapor working fluid in the chamber is sufficiently fluent, thereby effectively achieving excellent heat transfer efficiency and anti-gravity. Good performance, low pressure resistance and large thermal power impact per unit area. [Embodiment] [0004] The above object of the present invention and its structural and functional characteristics will be explained in accordance with a preferred embodiment of the 10120125^W A0101 page 5 / 20 page 1012003753-0 29992 . The present invention relates to a heat pipe heat dissipation structure. Please refer to FIGS. 1 and 2 for a perspective view of a first preferred embodiment of the present invention. The heat pipe heat dissipation structure includes a body 1 and at least a first capillary structure. 16 . The squat body 1 has a first inner side 11 , a second inner side 12 , a third inner side 13 , a fourth inner side 14 , and at least one chamber 15 . The first inner side 11 is opposite to the second inner side 12 . The third inner side 13 is opposite to the fourth inner side 14, and the first, second, third, and fourth inner sides 11, 12, 13, 14 collectively define the chamber 15, the chamber 15 is filled with a working fluid, the foregoing The workflow system can be any of pure water, inorganic compounds, alcohols, ketones, liquid metals, cold coal, and organic compounds. Wherein the wall surface (i.e., the first, second, third, and fourth inner sides 11, 12, 13, 14) of the chamber 15 is formed into a smooth wall surface, and the first capillary structure 16 is formed in the preferred embodiment as a sintered powder body. The invention is not limited thereto, and may be selected as any one of a mesh, a fiber body, a mesh, a sintered powder combination and a microstructure in a specific implementation; and the first capillary structure 16 is disposed in the chamber 15 Internally, and having a first portion 161 and a second portion 162, the first portion 161 is formed on the first inner side 11, and the second portion 162 is adjacent to the first side of the first portion 161. 3. The fourth inner side 3, 14 extends to constitute 'and the thickness of the first portion 161 is greater than the thickness of the second portion 162, generally referring to the radial extension volume of the first portion 161 being greater than the radial extension volume of the second portion 162. . 1012003753-0 Therefore, the thickness of the first portion 161 on the first inner side 11 is greater than the thickness of the second portion 162 on the third and fourth inner sides 13, 14 so that the outer portion of the first inner portion 11 can withstand a larger adsorption. Power heating element 10120125^^^ Α0101 Μ P Total 20 pages M429992 Heat generated 1, in other words, the unit area of the first capillary structure 16 is large, so that it can withstand large thermal power shock, relative heat transfer The amount is also relatively large, and thus the second inner side 12 is not provided with the first capillary structure 16 to reduce the flow of the working fluid 2 (as shown in FIG. 3B) in the chamber 丨5 to the second inner side. The pressure resistance on 12 is used to effectively increase the vapor-liquid circulation efficiency. Therefore, the first and second portions 161 and 162 of the first capillary structure 16 of the present invention are respectively disposed on the first, third, and fourth inner sides u, 13, and 14 in the chamber 15, and the design is integrated. The heat transfer efficiency is better and the pressure resistance is reduced, thereby effectively improving the vapor-liquid circulation efficiency. Please refer to FIGS. 3A and 3B for a perspective view and a cross-sectional view showing a second preferred embodiment of the present invention, which is supplemented by reference to FIG. 2; the preferred embodiment is mainly to The heat pipe heat dissipation structure of the preferred embodiment is attached to the opposite at least one heat generating component 4 (such as a central processing unit, a drawing chip, a north-south bridge wafer or other processing wafer), that is, the outer side of the first inner side 11 of the body 1 When at least one of the heating elements 4 is relatively heat-conducting, the first and second portions 161, 162 of the first, third, and fourth inner sides 1 , 3 , and 4 are rapidly adsorbed by the liquid working fluid 3 to generate evaporation. In order to convert to the vapor working fluid 2, the vapor working fluid 2 causes the vapor working fluid 2 to rapidly flow toward the opposite second inner side 12 due to the absence of the first capillary structure 16 on the second inner side 12. Waiting for the vaporous working fluid 2 to be cooled on the second inner side 12 to be condensed and converted into the liquid working fluid 3, the liquid working fluid 3 is returned by gravity to the first portion 161 and the third and fourth portions on the first inner side 11 Second on the inside 13, 14 162 min vapor continued fluid circulation, thereby effectively achieve the excellent cooling effect. Continuing to refer to the 3C and 3D diagrams, which is a perspective view and a cross-sectional view of another embodiment of the present preferred embodiment, which is the same as the third embodiment of the present invention; Externally docking at least the heat dissipating unit 5 of the second inner side i2 of the body i, wherein the heat dissipating unit 5 is a radiator 'heat dissipation group and a water cooling device, and is used to accelerate the cold portion to flow to the second inner side i 2 The vapor working fluid 2 is condensed and converted into a liquid working fluid 3 to effectively enhance the vapor-liquid circulation effect, thereby achieving an excellent heat dissipation effect. 4 is a schematic view showing the third preferred embodiment of the present invention and is accompanied by reference to the i-th diagram; the structure and the connection relationship of the preferred embodiment and its efficacy are substantially the same as the first The preferred embodiment is the same, so it will not be repeated here. The difference between the two is that the second inner side 12 of the body k has a capillary forming region 121 and at least one capillary-free forming region 122, wherein the capillary is not present. The formation region 122 is a second inner side 12, and no capillary structure is formed on the region, and the non-capillary formation region 122 is located on both sides of the capillary formation region 121, and is adjacent to the corresponding third and fourth inner sides 13 respectively. 14. In addition, the body 1 further includes at least one hyperplastic capillary portion 17 selected from the group consisting of a mesh, a fiber, a sintered powder, a mesh and a sintered powder combination, and a microstructure; and the aforementioned hyperplastic capillary portion The 17 series is disposed on the capillary forming region 121 of the second inner side 12 and opposed to the first portion 161. Further, the hyperplastic capillary portion 17 has a free end 171 extending from the capillary forming region 121 to extend over the first portion 161 of the opposing first capillary structure 16; in the hyperplastic capillary portion of the preferred embodiment The η system is generally hill-like, but is not limited thereto. In specific implementation, it may be in a different shape state, such as a ladder shape, a rectangular shape or a cone shape. Furthermore, the first capillary structure 16 and the hyperplastic capillary portion 7 and the vapor chamber]0120125# single number A01〇l page 8/total 20 pages 1012003753-0 M429992
—-----^，h 工'i « r/f 巴图；^ 风的， 該第二蒸汽通道152係為該第一、二、四内侧丨】、、 四内側11、1 2、 2 14與第一毛細結構16及增生毛細部17所包圍形成的。 續參閱第4、5圖所示，所以當該本體丨之第一内側u 的外部貼設在至少一發熱元件4上，並該發熱為件4產生 熱量時’透過該第一、三、四内側11、13、14的第一、 | 二部分161、162其上液態工作流體3迅速吸附熱量而產生 蒸發，以轉換為汽態工作流體2，使於第一蒸汽通道κι 、 與第二蒸汽通道1 52内的汽態工作流體2因對應的第二内 側12其上未有毛細形成區122，而促使所述第一、二蒸汽 通道151、152内的汽態工作流體2能快速朝相對的未有毛 細形成區122流動，等待第一、二蒸汽通道κι、152内 的汽態工作流體2各自到第二内侧12其上未有毛細形成區 122受冷卻’而冷凝轉換為液態工作流體3後，第一、二 • 蒸汽通道151、152内的液態工作流體3會藉由重力或增生 毛細部17之毛細力回流至第一内側11上的第一部分丨61及 第三、四内側13、14上的第二部分162繼續汽液循環，藉 以有效達到絕佳的散熱效果，進而得有效達到較佳熱傳 效率及減少壓力阻抗的功效。 1012003753-0 請參閱第6圖示，係顯示本創作之第四較佳實辨例之 剖面示意圖；該較佳實施例的結構及連結關係及其功效 大致與前述第三較佳實施例相同，該本較佳實施例主要 是將前述第三較佳實施例之增生毛細部17改設計成為是 第一毛細結構16之第一部分161上所延伸構成的，亦即該 10120125#"單編號A0101 第9頁/共20頁 較佳實施之增生毛細部17係設在該第一部分161上，且相 對該第二内侧12 ;換言之，就是所述增生毛細部17之自 由端171係從第一部分161上延伸連接相對的毛細形成區 121 〇 請參閱第7圖示，係顯示本創作之第五較佳實施例之 剖面示意圖；該較佳實施例的結構及連結關係及其功效 大致與前述第一較佳實施例相同，其兩者差異處在於： 前述腔室15壁面更設有一第二毛細結構18，該第二毛細 結構18係形成在该本體1之第一、二、三、四内側I〗、I? ' 13、14上，且與相對的第一毛細結構16相接；並於該 較佳實施之第一毛細結構18係以微溝槽做說明，但並不 侷限於此，於本創作實際實施時，亦可選擇為網目、纖 維體、燒結粉末體及網目與燒結粉末組合其中任一，合 先陳明。 以上所述，本創作相較於習知具有下列優點： 1. 可提升最大熱傳效率； 2. 抗重力能力佳； 3. 介面熱阻小； 4. 由於第一毛細結構的單位面積較大，使得可承受較大 的熱功率衝擊，相對的熱傳量亦比較大。 惟以上所述者’僅係本創作之較佳可行之實施例而已 ’·舉凡利用本創作上述之方法、形狀、構造、裳置所為 之變化，皆應包含於本案之權利範圍内。 【圖式簡單說明】 [0005] 10120125产早编號 第1圖係本創作之熱管散熱結構立體示意圖； 第2圖係本創作之第一較佳實施例之剖面示意圖； A0101 第10頁/共20頁 1012003753-0 M429992 第3A圖係本創作之第二較佳實施例之實施立體示意圖； _圖係本_之第二較佳實施例之實施剖面示意圖； 第3C圖縣創作之第二較佳實關之另—實施立體示意 園， 第3D圖係本創作之第二較佳實施例之另—實施剖面示意 fgl · 園， 第4圖係本創作之第三較佳實施例之剖面示意圖； 第5圖係本創作之第三較佳實施例之實施剖面示意圖； 第6圖係本創作之第四較佳實施例之剖面示意圖；—————————-^,h工'i « r/f Batu; ^ wind, the second steam passage 152 is the first, second, fourth inner 丨], four inner side 11, 12 2 14 is formed by being surrounded by the first capillary structure 16 and the hyperplastic capillary portion 17. Continuing to refer to Figures 4 and 5, so that when the outer portion of the first inner side u of the body is attached to at least one of the heat generating elements 4, and the heat is generated by the heat generated by the member 4, 'through the first, third, fourth The first, second portions 161, 162 of the inner sides 11, 13, 14 have a liquid working fluid 3 rapidly adsorbing heat to cause evaporation to be converted into a vapor working fluid 2 for the first steam passage κι and the second steam The vaporous working fluid 2 in the passage 1 52 causes the vaporous working fluid 2 in the first and second steam passages 151, 152 to rapidly face each other due to the corresponding second inner side 12 having no capillary forming region 122 thereon. The uncapillary forming zone 122 flows, waiting for each of the vapor working fluids 2 in the first and second steam passages κ, 152 to the second inner side 12 without the capillary forming zone 122 being cooled' and condensing into a liquid working fluid After 3, the liquid working fluid 3 in the first and second steam passages 151, 152 is returned to the first portion 丨 61 and the third and fourth inner sides 13 on the first inner side 11 by the capillary force of the gravity or hyperplastic capillary portion 17 The second portion 162 on 14, continues the vapor-liquid cycle, In order to effectively achieve excellent heat dissipation, it is effective to achieve better heat transfer efficiency and reduce pressure resistance. 1012003753-0, which is a cross-sectional view showing a fourth preferred embodiment of the present invention; the structure and the connection relationship of the preferred embodiment and its function are substantially the same as those of the third preferred embodiment. In the preferred embodiment, the hyperplastic capillary portion 17 of the third preferred embodiment is modified to be formed by extending the first portion 161 of the first capillary structure 16, that is, the 10120125#"single number A0101 The hyperplastic capillary portion 17 preferably implemented on the 9th/20th page is disposed on the first portion 161 and opposite to the second inner side 12; in other words, the free end 171 of the hyperplastic capillary portion 17 is from the first portion 161. The upper capillary-forming region 121 is extended and connected. Referring to FIG. 7 , a cross-sectional view of the fifth preferred embodiment of the present invention is shown. The structure and the connection relationship of the preferred embodiment and the effect thereof are substantially the same as the first The difference between the two embodiments is as follows: The wall surface of the chamber 15 is further provided with a second capillary structure 18, and the second capillary structure 18 is formed on the inner side of the first, second, third and fourth sides of the body 1. 〗, I? ' 13 And 14 is connected to the first first capillary structure 16; and the first capillary structure 18 in the preferred embodiment is described by a micro-groove, but is not limited thereto, and is actually implemented in the present practice. It can also be selected as a mesh, a fibrous body, a sintered powder body, and a combination of a mesh and a sintered powder. As mentioned above, this creation has the following advantages compared with the conventional ones: 1. It can improve the maximum heat transfer efficiency; 2. It has good anti-gravity ability; 3. The interface thermal resistance is small; 4. The unit area of the first capillary structure is larger. Therefore, it can withstand a large thermal power shock, and the relative heat transfer amount is relatively large. However, the above description is only a preferred embodiment of the present invention. Any changes to the methods, shapes, structures, and skirts described above are intended to be included in the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS [0005] 10120125 Early No. 1 is a perspective view of the heat pipe heat dissipation structure of the present invention; FIG. 2 is a schematic cross-sectional view of the first preferred embodiment of the present invention; A0101 Page 10 / Total 20 pages 1012003753-0 M429992 FIG. 3A is a perspective view showing the implementation of the second preferred embodiment of the present invention; FIG. 3 is a schematic cross-sectional view showing the second preferred embodiment of the present invention; The other is the implementation of the third preferred embodiment of the second preferred embodiment of the present invention. The cross-sectional schematic diagram of the third preferred embodiment of the present invention is shown in FIG. 5 is a schematic cross-sectional view showing a third preferred embodiment of the present invention; and FIG. 6 is a cross-sectional view showing a fourth preferred embodiment of the present invention;
第7圖係本創作之第五較佳實施例之剖面示意圖。 【主要元件符號說明】 [0006]本體 ... 1 第一毛細結構… 16 第一内側 ... 11 第一部分 ... 161 第二内側 … 12 第二部分 … 162 毛細形成.區 … 121 增生毛細部 … 17 未有毛細形成區… 122 自由端 … 171 第三内側 … 13 第二毛細結構… 18 第四内側 ... 14 汽態工作流體… 2 腔室 ... 15 液態工作流體… 3 第—蒸汽通道 … 151 發熱元件 .·. 4 第一?矣汽通道 … 152 散熱單元 … 5 101.20125#單編號 A0101 第11頁/共20頁 1012003753-0Figure 7 is a schematic cross-sectional view showing a fifth preferred embodiment of the present invention. [Main component symbol description] [0006] Body... 1 First capillary structure... 16 First inner side... 11 First part... 161 Second inner side... 12 Second part... 162 Capillary formation. Area... 121 Hyperplasia Capilla... 17 No capillary formation... 122 Free end... 171 Third inside... 13 Second capillary structure... 18 Fourth inner side... 14 Vapor working fluid... 2 Chamber... 15 Liquid working fluid... 3 No.—Steam passage... 151 Heating element.·. 4 First? Steam passage... 152 Cooling unit... 5 101.20125#单编号A0101 Page 11 of 201012003753-0