TWM413089U

TWM413089U - The thermal dissipation structure of LED lamp

Info

Publication number: TWM413089U
Application number: TW99201581U
Authority: TW
Inventors: Ya-Li Wu
Original assignee: Ya-Li Wu
Priority date: 2010-01-26
Filing date: 2010-01-26
Publication date: 2011-10-01

Description

M41J089 99. 0 1 . 熱模組’由於多了一條散熱途徑，可同步將電路基板上的熱量帶走，因此健效率提冑又可絕緣，可增純Led使用壽命。三、英文新型摘要：四、指定代表圓：M41J089 99. 0 1. The thermal module 'synchronizes the heat on the circuit board because it has a heat dissipation path. Therefore, the heat efficiency is improved and the insulation can be insulated, which can increase the service life of the Led. Third, the new English abstract: Fourth, the designated representative circle:

(一）本案指定代表圖為：第（3)圖 (一）本代表圖之元件代表符號說明: 1導流葉片散熱結構之led燈具 U導流葉片散熱模組 12 —般傳統的散熱模組 13 LED基板模組 14燈罩 15導流葉片電源座模組五、新型說明：【新型所屬之技術領域】本創作係有關於一種具導流葉片散熱結構之LED燈具，尤指一種可絕緣防觸電且可發揮較大散熱能力之LE：D燈具結構。【先前技術】按，環保節能減碳是目前世界的趨勢，LED固態照明訴求省電節 M413089 年；Γ.‘，·. 能，由於目前廣泛採用之高亮度LED，使用時會產生g溫，因此必，須配合適當的散熱方式，以發散該高亮度LED的熱量，高亮度LED 、·晶片模組之發熱量愈來愈高，使得散熱成為維持LED燈具照明系統正常運作的重要課題。通常會以散熱片附於LE:D晶片模組發熱元件表面，將熱排除於LED燈具照明系統外，以防止^^晶片模組元件過熱而光衰，及延長元件使用壽命。(1) The representative representative figure of this case is: (3) Figure (1) The symbol representing the symbol of the representative figure: 1 The led lamp of the guide vane heat dissipation structure U guide vane heat dissipation module 12 The general heat dissipation module 13 LED Substrate Module 14 Lampshade 15 Guide Vane Power Seat Module V. New Description: [New Technology Field] This creation is about an LED lamp with a heat dissipation structure for the guide vane, especially one that can be insulated and protected against electric shock. The LE:D luminaire structure can be used for greater heat dissipation. [Prior Art] According to, environmental protection, energy saving and carbon reduction is the current trend in the world. LED solid-state lighting appeals to the power-saving section M413089; Γ.',·. Yes, due to the widely used high-brightness LED, g temperature will be generated when used. Therefore, it is necessary to cooperate with an appropriate heat dissipation method to dissipate the heat of the high-brightness LED. The heat generation of the high-brightness LED and the chip module is becoming higher and higher, so that heat dissipation is an important issue for maintaining the normal operation of the LED lamp illumination system. The heat sink is usually attached to the surface of the LE:D chip module heating element to exclude heat from the LED lighting system to prevent overheating and light decay of the chip module components and to extend component life.

LED燈具照明系統的散熱方法，主要靠自然對流將熱帶走，目前傳統LED燈具照明缺失如下· (一）LED燈具散熱器表面溫度太高太燙因燈具空間受限，散熱器不能太大，目前LED燈具表面績仍嫌不足，散熱器表面溫度太高太燙，一般加塑膠外罩〖1(圖1和圖2)做隔離，防止曼傷’加塑膠雖可防止费傷，但熱阻增加散熱變差。 (一）散熱器絕緣性不良，有觸電危險散熱器材料-般是紹、銅金屬材質會導電，目前DC通燈具的電源供應H緊臨賴器旁，因此散魅有導電安規問題，另外目前 AC LED疋父流電’ AC LED焊接在電路版上，再用散熱器導熱膏與散熱器黏合，因此散熱器會導電，有高壓電安規問題，一般加塑膠外罩11(圖1和圖2)做隔離，防止觸電，但加塑膠外罩會影響散埶。 (三）LED燈具電源座密不通風 M413089 98.12. ur* I 1 ，4 ♦ 傳統電源座模組’僅用一外殼將電源Pcb缺住，^外殼沒有對流孔’料通風散熱差，peb板上高溫料常會過熱而燒毀，燈具電源座哥命減短。由上可知，上述的LED燈具結構，在絕緣性及散熱效率上可加以改善本創作人有感以上LED燈具絕緣性及散熱效率之可改善乃提出種可絶緣又可增加散熱效率的LED燈具結構設計。【新型内容】本創作的主要目的，係改進傳統LE：D燈具結構的絕緣性不良、易導電有觸電危險及散熱不良之缺失，乃提供—種具導流葉錄熱模組之LED燈具、纟。構，②結構由多數片絕緣材質散熱片圍繞成環形絕緣散熱模組’再結合LED基板模組、導流葉片電源座模組和燈罩組成一絕緣且高散熱效率之LED燈具。 • 一& 父流Led晶片電路基板有高壓電，金屬材質散熱模組上也會導電，為防止觸電，傳統上都加上塑膠外罩，包圍住會導電金屬材質的散熱 _組來做絕緣’但因為加上外罩導致通風不良散熱懸，造成LED過熱光衰燒毁。本創作乃採用導流葉片散熱模組，緊密接合於電路基板上，當做另一組散熱模組’其散熱模組葉片可導流又可絕緣，再搭配一般傳統散熱模峰成複合式散熱模組，由於多了—條散熱途徑’可同步將電The cooling method of the LED lighting system mainly relies on natural convection to go tropical. At present, the traditional LED lighting is missing as follows. (1) The surface temperature of the LED lamp radiator is too high. The space is limited due to the limitation of the lamp. The radiator cannot be too large. The surface performance of LED lamps is still insufficient. The surface temperature of the radiator is too high and too hot. Generally, the plastic cover is 〗 1 (Fig. 1 and Fig. 2) to prevent the injury. Although the plastic can prevent the injury, the thermal resistance increases the heat dissipation. Getting worse. (1) The heat sink has poor insulation and there is danger of electric shock. The heat sink material is generally made of Shao, copper metal material will be conductive. At present, the power supply H of the DC through lamp is close to the device, so there is a problem of conductive safety. AC LED 疋 parent 流 ' AC LED soldered on the circuit board, and then use the heat sink thermal paste to adhere to the heat sink, so the heat sink will be conductive, there are high voltage electrical safety problems, generally plus plastic cover 11 (Figure 1 and Figure 2 ) Do isolation to prevent electric shock, but adding a plastic cover will affect the dilation. (3) LED lamp power supply is not ventilated M413089 98.12. ur* I 1 , 4 ♦ The traditional power supply module 'only uses one casing to short the power Pcb, ^ the casing has no convection hole' material ventilation and poor heat dissipation, peb board High temperature materials often overheat and burn, and the power supply of the lamp is shortened. It can be seen from the above that the above-mentioned LED lamp structure can be improved in insulation and heat dissipation efficiency. The creator feels that the above LED lamp insulation and heat dissipation efficiency can be improved, and an LED lamp structure which can be insulated and can increase heat dissipation efficiency is proposed. design. [New content] The main purpose of this creation is to improve the insulation of the traditional LE:D lamp structure, the risk of electric shock, the risk of electric shock and the lack of heat dissipation. It is also provided with an LED lamp with a guide leaf recording module. Hey. The structure is composed of a plurality of sheets of insulating material heat sinks surrounding the annular insulating heat dissipation module. The LED substrate module, the guide vane power socket module and the lamp cover are combined to form an insulated and high heat dissipation LED lamp. • A & parent flow Led chip circuit board has high voltage, metal material heat dissipation module will also be conductive, in order to prevent electric shock, traditionally added plastic cover, surrounded by conductive metal material heat dissipation _ group for insulation 'But because of the addition of the cover, the ventilation is poor, and the LED is overheated and burned. This creation uses a guide vane heat dissipation module, which is tightly bonded to the circuit board. As another set of heat dissipation modules, the heat dissipation module blades can be insulated and insulated, and then combined with the conventional heat dissipation mode peak into a composite heat dissipation mode. Group, because there is more - the heat dissipation path can be synchronized

，可增加燈Led使用 M413089 路基板上的熱量帶走，因此散熱效率提高又可絕緣哥^命。 v 、緣是’依據本創作之主要目的，乃在提供-導流葉片散熱模組結構之LED燈具’該結構由導流葉片散熱模組，再結合LED基板模組、一般傳統散熱模組、導流葉#電源錄組和料喊—絕緣且高散熱效率之LED燈具。 4 LED燈具主要組成結構如下： (一）導流葉片散熱模組、 (二）一般傳統散熱模組、 (三）對流孔電源座模組、 (四） LED基板模組和 (五）燈罩The lamp Led can be used to carry away the heat on the M413089 road substrate, so that the heat dissipation efficiency is improved and the insulation can be insulated. v, the edge is 'according to the main purpose of this creation, is to provide - guide vane cooling module structure of LED lamps' structure of the guide vane cooling module, combined with LED substrate module, general traditional thermal module, Guide vane #Power recording group and material shouting - insulated and high heat dissipation efficiency LED lamps. The main components of the 4 LED lamps are as follows: (1) The heat dissipation module of the guide vane, (2) the general conventional heat dissipation module, (3) the convection hole power socket module, (4) the LED substrate module and (5) the lampshade

其中， (一）導流葉片散熱模組: S亥散熱模組有一接觸面，係與LED基板緊密接觸貼合，之間可塗導熱膏域他導齡f，可將LED單元熱源的熱，經由LED 基板傳導職熱模組上，再散到大氣中，散熱歡賴氣孔處有導流葉片，讓空氣對流進入LED燈具中，增進散熱。導流葉片散熱模組’可緊密接觸於Led基板之正面，Led基板上LED獅的熱，經由Led基板傳導到該散熱模組上，再散到大 5 M413089 ·· '1 - 1'^ ：r 年月Ώϋ 氣中。導流葉片散熱模組’可緊密接觸於Led基板之背面，Led基板上LED熱源的熱’經由Led基板傳導到該散熱模組上，再散到大氣中。導流葉片散熱模組，可緊密接觸於Led基板之侧面，Led基板上LED熱源的熱，經由LED基板傳導到該散熱模組上，再散到大氣中。導流葉片散熱模組，可同時緊密接觸於Led基板之正面、背面’LED基板上LED熱源的熱’經由Led基板傳導到該散熱模組上，再散到大氣中。導流葉片散熱模組，可置放於Led基板之外圍，但不直接接觸 LED基板做熱傳導，基板上⑽熱源的熱，經由一般傳統散熱模組或接合零件傳導到該散熱模組上，再散到大氣中。可增加另外一般傳統散熱模組與LED基板接合，組成複合式散熱模組，該-般傳統散熱模組置於導流葉片散熱模組内圍，同步將LED基板上LED單元的熱，分鑛導到—般傳統散熱模組和導流葉>1散賴組上，再散到大氣中。上述之複合式散熱結構之LED燈具，其巾料_片散熱模組外圍氣孔處’也可林開對航閉合仅絕緣錄材料，如陶兗複合材質，絕雜佳，_财本身有·魏孔耻導流 6 葉片散熱模組外圍氣孔處可不開對流孔，直接利用陶究〜本-身之微結構氣孔散熱。導流葉片散熱模組之外圍氣孔處的散熱鰭片，相鄰環繞成環型結構’斜鼠孔處的散熱則，可如同百«複料的散熱雜片葉片’葉片彼此有間隙，葉U度可為任意駿，可導流讓氣流順暢，增進散熱。Among them, (1) guide vane heat dissipation module: S Hai heat dissipation module has a contact surface, which is closely contacted with the LED substrate, and can be coated with a thermal paste to guide the age of f, which can heat the heat source of the LED unit. Through the LED substrate, the thermal module is transmitted to the atmosphere, and the heat dissipation is controlled by the guide vanes at the air holes, so that the air convection enters the LED lamp to improve heat dissipation. The heat guide module of the guide vane can be in close contact with the front surface of the Led substrate, and the heat of the LED lion on the Led substrate is transmitted to the heat dissipation module via the Led substrate, and then dispersed to the large 5 M413089 ·· '1 - 1'^: r Years and months. The guide vane heat dissipating module ' can be in close contact with the back surface of the Led substrate, and the heat of the LED heat source on the Led substrate is conducted to the heat dissipating module via the Led substrate and then dissipated into the atmosphere. The heat sink module of the guide vane can be in close contact with the side of the Led substrate, and the heat of the LED heat source on the Led substrate is conducted to the heat dissipation module via the LED substrate and then dispersed into the atmosphere. The heat sink module of the guide vane can be in close contact with the front surface of the Led substrate and the heat of the LED heat source on the back surface of the LED substrate is conducted to the heat dissipation module via the Led substrate and then dispersed into the atmosphere. The heat sink module of the guide vane can be placed on the periphery of the Led substrate, but does not directly contact the LED substrate for heat conduction, and the heat of the heat source on the substrate (10) is transmitted to the heat dissipation module via a conventional heat dissipation module or a joint component, and then Dissipated into the atmosphere. The additional conventional heat dissipation module and the LED substrate can be added to form a composite heat dissipation module. The conventional heat dissipation module is placed in the inner circumference of the heat dissipation module of the guide vane, and the heat of the LED unit on the LED substrate is synchronously divided. Guided to the traditional cooling module and the guide vane > 1 scattered group, and then dispersed into the atmosphere. The above-mentioned composite heat-dissipating structure LED lamp, the towel material _ sheet heat-dissipating module peripheral vent hole 'can also be opened to the navigation closed only the insulation recording material, such as ceramic enamel composite material, excellent miscellaneous, _ wealth itself has Wei Hole shame diversion 6 The venting hole at the periphery of the blade heat dissipation module can be opened without convection holes, and the micro-structure pores of the ceramic body can be directly used for heat dissipation. The fins at the peripheral air holes of the heat-dissipating fins of the guide vane are adjacent to the loop-shaped structure. The heat dissipation at the angle of the rat is like a heat-dissipating blade of the multi-material. The blades have a gap with each other. The degree can be any spring, which can make the air flow smooth and improve the heat dissipation.

該散熱模域錢的散熱則葉片城線型，該流線可隨流場做最佳化_面設計，可設計成各種流線曲面，例如複雜不規則的多曲面、雙曲面、”扭曲面、單曲面、圓弧曲面等，可讓流體更平滑的通過，提高散熱效率。The heat dissipation of the heat dissipation mode is the blade city line type, and the stream line can be optimized with the flow field. The surface design can be designed into various streamline surfaces, such as complex and irregular multi-surfaces, hyperboloids, and "distorted surfaces. Single curved surfaces, arc surfaces, etc., allow fluid to pass smoothly, improving heat dissipation efficiency.

該散熱模組氣錢的散細片葉片可為—般平面型，可如同百葉窗平面型複數片的散熱葉片，葉片彼此有間隙，葉片角度可為任意角度’可導流讓氣流順暢，增進散熱。 (二）一般傳統散熱模組一般傳統散熱模組，常㈣材料有贼銅...等，常用的製造方式有轉型、壓鑄、沖壓鰭片和熱管散熱模組等。 (三）導流葉片電源座模組傳統電源座做，伽—外殼將電源帕板包住，密不通風月丈熱不良，pcb板上咼溫零件常會過熱而燒毀。本電源座模組採内、外雙殼設計，電源pcb板置於内毅中， 7 M413089 9θΓΪ2Γ〇1…' "r ； Γ. ^；；内吸中灌導熱膠，可防塵防水，兼具導熱功能，可將帥以高 ’皿令件降溫’且電源座外殼有對流孔，可讓流體對流更順暢，增加散熱效率。且電源座外殼有通風導流葉片，該通風導流葉片為流線型’該流線可隨流場做最佳化的曲面設計，可設計成各種 μ線曲面’例如飛機機翼流線曲面，複雜不規則的多曲面、雙曲面、s型扭曲面、單曲面、圓弧曲面等，可讓流體更平滑的通過，The heat dissipating module of the heat dissipating module can be generally flat type, and can be like a heat dissipating blade of a plurality of louver plane type, the blades have a gap with each other, and the blade angle can be any angle 'flowable to make the air flow smooth, and the heat dissipation is improved. . (2) General traditional heat-dissipation modules Generally, traditional heat-dissipation modules, often (four) materials have thief copper...etc. Commonly used manufacturing methods include transformation, die-casting, stamping fins and heat pipe cooling modules. (3) Guide vane power base module The traditional power supply base is made, the gamma-shell will enclose the power supply board, and the air is not ventilated. The heat of the moon is poor, and the temperature components on the pcb board often overheat and burn. The power socket module adopts inner and outer double-shell design, and the power pcb board is placed in the inner Yi, 7 M413089 9θΓΪ2Γ〇1...' "r ; Γ. ^;; The inner heat-absorbing adhesive is dust-proof and waterproof. With a heat-conducting function, it can cool down the 'high-dish handles' and the power supply housing has a convection hole, which makes the fluid convection smoother and increases the heat dissipation efficiency. The power supply housing has a ventilating guide vane, and the ventilating guide vane is streamlined. The streamline can be optimized with the flow field to be designed into a variety of μ-line surfaces, such as aircraft wing streamline surfaces, complex Irregular multi-surfaces, hyperboloids, s-shaped torsion surfaces, single surfaces, arc surfaces, etc., allow fluid to pass smoothly,

提高散熱效率。 (四）LED基板模組 LED基板高導熱綠之金屬材質馳，L職板模組之熱量，傳熱到曲面散熱片上，再經由曲面散熱片散熱到大氣中。 (五）燈罩係罩在L E D單元上。【實施方式】請參閱第3圖至第14圖，本創作係提供—種導流葉片散熱模組之 LED燈具結構丨（圖3及圖4)，其主要組成結構如下： (一）導流葉片散熱模組11(圖3和圖12) (二）一般傳統散熱模組12(圖3和圖13) (三）對流孔電源座模組15(圖3和圖14) (四） LED基板模組13(圖3和圖11) (五）燈罩14(圖3) (一）導流葉片散熱模組： °亥散熱模組有—接觸面lla(® 5)，係與LED基板緊密接觸貼。可將LED單元熱源的熱，經由LED基板傳導到散熱模組上，再政到大氣中，該模組外圍有氣孔，讓空氣對流進入LED燈具中，增進散熱。Improve heat dissipation efficiency. (IV) LED Substrate Module The LED substrate has a high thermal conductivity green metal material, and the heat of the L job board module is transferred to the curved heat sink and then radiated to the atmosphere via the curved heat sink. (5) The lampshade is attached to the L E D unit. [Embodiment] Please refer to Figure 3 to Figure 14. This creation provides the LED lamp structure of the guide vane cooling module (Figure 3 and Figure 4). The main components are as follows: (1) Diversion Blade heat dissipation module 11 (Fig. 3 and Fig. 12) (2) General conventional heat dissipation module 12 (Fig. 3 and Fig. 13) (3) convection hole power socket module 15 (Fig. 3 and Fig. 14) (4) LED substrate Module 13 (Fig. 3 and Fig. 11) (5) Lamp cover 14 (Fig. 3) (1) Guide vane heat dissipation module: °Hai heat dissipation module has - contact surface 11a (® 5), which is in close contact with the LED substrate paste. The heat of the LED unit heat source can be transmitted to the heat dissipation module via the LED substrate, and then passed to the atmosphere. The module has air holes around the module to allow air to convect into the LED lamp to improve heat dissipation.

導流葉片散熱模組，可緊密接觸於Led基板之正面13a(圖 5) Led基板上LED熱源的熱，經由Led基板傳導到該散熱模組上’再散到大氣中。導流葉片散熱模組，可緊密接觸於Led基板之背面13b(圖 6) ’ Led基板上LE1D熱源的熱，經由Led基板傳導到該散熱模組上，再散到大氣中。The guide vane heat dissipation module can be in close contact with the front surface 13a of the Led substrate (Fig. 5). The heat of the LED heat source on the Led substrate is conducted to the heat dissipation module via the Led substrate and then dispersed into the atmosphere. The heat sink module of the guide vane can be in close contact with the heat of the LE1D heat source on the back surface 13b of the Led substrate (Fig. 6), and is conducted to the heat dissipation module via the Led substrate and then dispersed into the atmosphere.

導流葉片散熱模組’可緊密接觸於Led基板之側面13c(圖乃， Led基板上LED熱源的熱，經由LED基板傳導到該散熱模組上，再散到大氣t。導流葉片散熱模組，可同時緊密接觸於Led基板之正面丨丨a(圖 8)和背面lib(圖8)，LED基板上LED熱源的熱，經由Led基板傳導到該散熱模組上，再散到大氣中。導流葉片散熱模組，可置放於Led基板之外圍lib(圖9)，但不直接接觸LED基板做熱傳導’基板上LED熱源的熱，經由一般 9 傳統散熱模_辩軸_驗上，到kb 可增加另外一般傳統散熱模組（圖13和圖5)與LED基板（圖 11和圖5)接合’ _仏她触，該_綠錄熱模組置於導流葉錄級_圍’财將led基板上[ED單元的熱分別傳導到-般傳統散熱模組和導流葉片散熱模组上，再散到大氣中。上述複合式散麵組，其中該導流葉片散麵組外圍氣孔處也可為不開對流孔閉合式之絕緣性佳材料，如陶竞複合材質，絕緣性佳’因為陶究本身有微結構氣孔’因此導流葉片散熱模組外圍氣孔處可不_流孔，直接__本权微結構氣孔散熱。導流葉片散熱模組之外圍氣孔處的散熱鰭片15b(圖14)，相鄰環繞成環型結構，該外圍氣孔處的散熱則，可如同百葉窗複數片的散熱韓片葉片，葉片彼此有間隙，葉片角度可為任意角度，可導流讓氣流順暢，增進散熱。該散熱模組氣孔處的散熱鰭片葉片為流線型15a(圖14)，該流線可隨流場做最佳化的曲面設計，可設計成各種流線曲面，例如飛機機翼流線曲面，複雜不規則的多曲面、雙曲面、s型扭曲面、單曲面、圓弧曲面...等，可讓流體更平滑的通過，提高散熱效率。該散熱模纽氣孔處的散熱葉片町為一般平面型，如同百葉窗 M413089 iJ-trz- Ό· j 平面型複數片的散熱葉片，葉片彼此有間隙，葉片角度可為任意· 角度，可導流讓氣流順暢，増進散熱效率。 (二）一般傳統散熱模組12 (圖4) 一般傳統散熱模組’常用的材料有鋁或銅…等，常用的製造方式有織型、闕、沖壓H片和加熱管的散熱模組等。 (二）導流葉片電源座模組15(圖3和圖14)The guide vane heat dissipation module ' can be in close contact with the side surface 13c of the Led substrate (Fig., the heat of the LED heat source on the Led substrate is conducted to the heat dissipation module via the LED substrate, and then dispersed to the atmosphere t. The guide vane heat dissipation mold The group can be in close contact with the front surface 丨丨a (Fig. 8) and the back lib (Fig. 8) of the Led substrate at the same time, and the heat of the LED heat source on the LED substrate is transmitted to the heat dissipation module via the Led substrate, and then dispersed into the atmosphere. The guide vane heat dissipation module can be placed on the periphery of the Led substrate lib (Fig. 9), but does not directly contact the LED substrate for heat conduction. The heat of the LED heat source on the substrate is passed through the general 9 conventional heat dissipation mode. To kb, another general conventional heat dissipation module (Fig. 13 and Fig. 5) can be added to the LED substrate (Fig. 11 and Fig. 5) to join the '_仏 her touch, and the _ green recording module is placed at the guide vane level _ On the LED substrate, the heat of the ED unit is transmitted to the conventional heat dissipation module and the heat dissipation module of the guide vane, and then dispersed into the atmosphere. The above composite surface group, wherein the guide vane surface The outer vents of the group can also be insulated materials with no convection closed, such as Tao Jing composite material. , Insulation is good 'Because ceramics itself has micro-structured pores', so the outer pores of the guide vane cooling module can not be _ flow holes, directly __ the right micro-structure vents heat dissipation. The heat dissipating fins 15b (Fig. 14) are adjacently wound into a ring-shaped structure, and the heat dissipation at the peripheral air holes can be like the heat dissipating of the plurality of louver blades of the louver, the blades have a gap with each other, and the blade angle can be any angle, which can be guided. The flow allows the airflow to be smooth and the heat dissipation is improved. The fins of the heat dissipation fin of the heat dissipation module are streamlined 15a (Fig. 14), and the flow line can be optimized with the flow field to be designed into various streamlined surfaces. For example, aircraft wing streamline surfaces, complex and irregular multi-surfaces, hyperboloids, s-shaped twisted surfaces, single curved surfaces, arc surfaces, etc., allow fluid to pass more smoothly, improving heat dissipation efficiency. The heat-dissipating blade at the new air hole is generally flat, like the blinds M413089 iJ-trz- Ό· j planar heat sink blades, the blades have a gap with each other, the blade angle can be any angle, can guide the flow (2) General traditional heat dissipation module 12 (Fig. 4) Generally, the traditional heat dissipation module 'used materials are aluminum or copper...etc. Commonly used manufacturing methods include woven, 阙, stamped H-piece and heating. The heat dissipation module of the tube, etc. (2) The guide vane power socket module 15 (Fig. 3 and Fig. 14)

傳統電源座模組，僅用一外殼將電源pcb板包住，密不通風散熱不良，pcb板上高溫零件常會過熱而燒毀。本電源座模組採内、外雙殼設計，電源pcb板置於内殼中，内殼中灌導熱膠，可防塵防水，兼具導熱功能，可將pcb板上高酿零件降溫，且電源座外殼有對流孔，可讓流體對流更順暢，增加散熱效率。且電源座外殼有通風導流葉片，該通風導流葉片為抓線里it",〔線可隨流場做最佳化的曲面設計，可設計成各種流線曲面，例如複雜不規則的多曲面、雙曲面、3型扭曲面、單曲面、圓弧曲面..·等’可讓流體更平滑的通過，提高散熱效率。 (六）LED基板模組 LED基板翻高導熱綠之金屬材f紐，l 量，傳熱細_仏觸崎㈣咖大氣^ (七）燈罩係罩在LED單元上。【圖式簡單說明】 M413089 ^ΐ2Γ〇ΪΤΓ j 年尸J Γ ，：-- 第1圖係習知塑膠外殼散熱結構之LED燈具立體圖 - 第2圖係習知塑膠外殼散熱結構之LED燈具組立圖 . 第3圖係本創作導流葉片散熱結構之led燈具立體圖第4圖係本創作導流葉片散熱結構之led燈具組立圖第5圖係本創作導流葉片散熱模組接觸mLE：d基板正面圖第6圖係本創作導流葉片散熱模組接觸於LED基板背面圖 ^ 第7圖係本創作導流葉片散熱模組接觸於LE：D基板側面圖第8圖係本創作導流葉片散熱模組同時接觸於LE：D基板正面和側面圖第9圖係本創作導流葉片散熱模組不接觸於LED基板圖第10圖係本創作外殼對流孔電源座模組立體圖第11圖係本創作LE：D基板模組立體圖第12圖係本創作導流葉片散熱模組立體圖第13圖係本創作一般傳統散熱模組立體第14圖係本創作導流葉片電源座模組立體圖【主要元件符號說明】〔習知〕 1塑膠外殼散熱結構之LED燈具 11塑膠外殼散熱結構 lla塑膠外殼對流氣孔 12 M413089 12 —般傳統散熱模組 12a散熱本體 13 LED基板模組 14燈罩〔本創作〕The traditional power socket module only uses a casing to enclose the power pcb board, which is not ventilated and has poor heat dissipation. The high temperature parts on the pcb board often overheat and burn. The power socket module adopts inner and outer double-shell design, the power pcb board is placed in the inner shell, the inner shell is filled with thermal conductive glue, which is dustproof and waterproof, and has heat conduction function, can cool the high-filled parts on the pcb board, and the power source The housing has a convection hole that allows fluid convection to be smoother and increases heat dissipation efficiency. The power supply housing has a ventilating guide vane, which is a trapping line in the line. The line can be optimized with the flow field to design a variety of streamline surfaces, such as complex irregularities. Surfaces, hyperboloids, 3-type twisted surfaces, single-surfaces, arc-shaped surfaces, etc. can allow smoother fluid flow and improve heat dissipation efficiency. (6) LED substrate module LED substrate is turned high and heat-conducting green metal material f, l quantity, heat transfer fine _ 仏仏 ( (4) coffee atmosphere ^ (7) lampshade is attached to the LED unit. [Simple description of the diagram] M413089 ^ΐ2Γ〇ΪΤΓ j Year of the corpse J Γ , :-- The first picture is a three-dimensional diagram of the LED lamp of the conventional plastic case heat dissipation structure - Figure 2 is a diagram of the LED lamp assembly of the conventional plastic case heat dissipation structure Figure 3 is a perspective view of the led lamp of the creative guide vane heat dissipation structure. Fig. 4 is a diagram of the led lamp assembly of the creative guide vane heat dissipation structure. Figure 5 is the creation of the guide vane heat dissipation module contact mLE: d substrate front Fig. 6 is the rear view of the LED guide plate of the creative guide vane. Fig. 7 is the schematic diagram of the heat sink module of the present guide blade. The contact lens of the LE:D substrate is connected to the side view of the LE:D substrate. The module is in contact with the LE:D substrate at the front and the side view. Figure 9 is a schematic diagram of the original guide vane heat dissipation module that does not touch the LED substrate. Figure 10 is a perspective view of the convection hole power socket module of the creation shell. Creation LE: D substrate module perspective view Figure 12 is the creation of the guide vane cooling module stereo view Figure 13 This is the creation of the traditional traditional thermal module stereo Figure 14 is the creation of the guide vane power supply module module stereo [main components Symbolic []] LED 1 conventional heat-dissipating structure of the plastic housing 11 of plastic lamp housing convection heat dissipation structure lla plastic housing hole 12 M413089 12 - like a conventional heat dissipation module body 12a radiating board 13 LED module 14 of the present shade [Creation]

[導流葉片散熱模組結構之LED燈具 11導流葉片散熱模組 11a散熱模組正面 lib散熱模組背面 11c散熱模組側面 12 —般傳統散熱模組 12a散熱本體 13 LED基板模組 13a LED基板正面 13b LED基板背面 13c LED基板側面 14燈罩 15導流葉片電源座模組 15a電源座外殼葉片 15b對流孔 13 M413089 % 15c PCB板 15d PCB板緊密接觸LED基板之電線 15e電源座内殼[The guide vane heat dissipation module structure LED lamp 11 guide vane heat dissipation module 11a heat dissipation module front lib heat dissipation module back 11c heat dissipation module side 12 - general heat dissipation module 12a heat dissipation body 13 LED substrate module 13a LED Substrate front side 13b LED substrate back side 13c LED board side 14 lamp cover 15 guide vane power socket module 15a power socket shell blade 15b convection hole 13 M413089 % 15c PCB board 15d PCB board close contact LED board wire 15e power socket inner casing

Claims

六、申請專利範圍： L 一種導流葉片散熱結構之LED燈具，係包括：至少一L ED單元；一 Led基板，係提供該L E D單元結合於其上；一導流葉片散熱模組，係與Led基板緊密接觸，可將哪單元熱源的熱，經纟Led基板傳導到散熱模組上，再散到大氣中，該散麵組外圍氣孔處有導流葉片，讓空氣順暢對流進入燈具中’增加散熱效率； -電路板，至少包括-電路迴路，可與ω基板结合之哪單元做電性連接； -電源底座，其係為巾线體，電路板設置於内；以及一燈罩，係罩在LED單元上》 2·如申請專利範圍第1項所述導流葉片散熱結構之⑽燈具其中導流葉片散熱模組’可緊密接觸於Led基板之正面，W基板上⑽ 熱源的熱’經由Led基板傳導到該散熱模組上，再散到大氣中。 3. 如申請專利範圍第工項所述導流葉片散熱結構之哪燈具，其中導流葉片散熱模組，可緊密接觸於Led基板之f面，Led基板上⑽ 熱源的熱，經由Led基板傳導到該散熱模組上，再散到大氣中。 4. 如申請專利範圍第1項所述導流葉片散熱結構之LED燈具，其中導流葉片散熱模組’可緊密接觸於Led基板之侧面，Led基板上Sixth, the scope of application for patents: L LED lamp for heat dissipation structure of the guide vane, comprising: at least one L ED unit; a Led substrate, which is provided with the LED unit coupled thereto; a heat guiding module for the guide vane The Led substrate is in close contact, and the heat of the heat source of the unit can be transmitted to the heat dissipation module through the 纟Led substrate, and then dispersed into the atmosphere, and the guide vanes at the peripheral air holes of the surface group allow the air to smoothly flow into the lamp. Increase the heat dissipation efficiency; - the circuit board includes at least a circuit circuit, which unit can be electrically connected with the ω substrate; - a power base, which is a towel body, the circuit board is disposed therein; and a lamp cover, a cover In the LED unit, (2) the guide vane heat dissipation structure according to the first aspect of the patent application, wherein the guide vane heat dissipation module ' can be in close contact with the front surface of the Led substrate, and the heat of the heat source on the W substrate is The Led substrate is conducted to the heat dissipation module and then dispersed into the atmosphere. 3. For the lamp of the heat dissipation structure of the guide vane according to the application of the patent scope, the heat guide module of the guide vane can be in close contact with the f surface of the Led substrate, and the heat of the heat source of the Led substrate is transmitted through the Led substrate. Go to the cooling module and then dissipate it into the atmosphere. 4. The LED lamp of the guide vane heat dissipation structure according to claim 1, wherein the guide vane heat dissipation module ′ is in close contact with the side of the Led substrate, on the Led substrate

M413089 led熱源的熱’經由Led基板傳導到該散熱模組上，再散^大氣. 中。 .5.如申請專利範圍第1項所述導流葉片散熱結構之LE：D燈具，其中導流葉片散熱模組，可同時緊密接觸於Led基板之正面和背面，Led . 基板上LED熱源的熱，經由Led基板傳導到該散熱模組上，再散到大氣中。 • 6.如申請專利範圍第1項所述導流葉片散熱結構之UD燈具，其中導流葉片散熱模組，可置放於Led基板之外圍，但不直接接觸Led 基板做熱傳導，基板上LED熱源的熱，經由接合零件傳導到該散熱模組上，再散到大氣中。 7.如申請專利範圍帛2、3、4、5或6項所述導流葉片散熱、结構之⑽ 燈具，其中可增加另外一般傳統散熱模組與Led基板緊密接觸，組成複合式散賴組，該—般傳統散鋪組置於導流㈣散熱模組内 *目’同步將Led基板iLED單元的熱’分別傳導到-般傳統散熱模組和導流葉片散熱模組上，再散到大氣中。 8·如申請專利範圍第1項所述導流葉片散熱結構之LED燈具，其中導々IL葉片政熱模組之外圍氣孔處的導流葉片，相鄰環繞成環型結構，葉片彼此有間隙，葉片角度可為任意角度，可導流讓氣流順暢’增進散熱。 9·如申請專利範圍第8項所述導流葉片散熱結構之燈具，其中 M413089 年月M413089 The heat of the led heat source is conducted to the heat dissipation module via the Led substrate, and then dispersed into the atmosphere. .5. The LE:D lamp of the guide vane heat dissipation structure according to claim 1, wherein the guide vane heat dissipation module can be in close contact with the front and back sides of the Led substrate at the same time, Led. LED heat source on the substrate The heat is conducted to the heat dissipation module via the Led substrate and then dispersed into the atmosphere. 6. The UD lamp of the guide vane heat dissipation structure according to claim 1, wherein the guide vane heat dissipation module can be placed on the periphery of the Led substrate, but does not directly contact the Led substrate for heat conduction, and the LED on the substrate The heat of the heat source is conducted to the heat dissipation module via the joint part and then to the atmosphere. 7. If the application of the patent scope 帛 2, 3, 4, 5 or 6 of the guide vane heat dissipation, the structure of the (10) luminaire, which can add another general conventional heat dissipation module and the Led substrate in close contact to form a composite scatter group The conventional traditional scatter group is placed in the diversion (4) heat dissipation module, and the heat of the Led substrate iLED unit is respectively transmitted to the conventional heat dissipation module and the guide blade heat dissipation module, and then dispersed. In the atmosphere. 8. The LED lamp of the guide vane heat dissipation structure according to claim 1, wherein the guide vane at the peripheral air hole of the guide leaf IL thermal module is adjacent to the ring-shaped structure, and the blades have a gap with each other. The blade angle can be any angle, and the flow can be made to smooth the airflow to enhance heat dissipation. 9. The luminaire for the heat dissipation structure of the guide vane according to item 8 of the patent application, wherein M413089

該散熱模組氣孔處的散熱料驗咖，該流線型可隨；場做最佳化的曲面設計’可設計成各種流線曲面，例如飛機冑翼流線曲面，複雜不規則的多曲面、雙曲面、8型扭曲面、單曲面、圓弧曲面等，可讓流體更平滑的通過’提高散熱效率。 1 〇·如申請專利範圍第8項所述導流葉片散熱結構之LED燈具，其中該散麵組氣孔處的散熱葉片為一般直線平面型，可如同百葉窗複數片直線平面的散熱葉片。 1L如申請專利範圍第6項所述導流葉片散熱結構之led燈具，其中導流葉片散熱模組’可置放於Led基板之外圍，不直接接觸Led 基板做熱傳導’但連接於另_散熱模組上，基板上LED熱源的熱，經由-般傳統散熱模組或接合零件傳導到導流葉片散麵組上，再散到大氣中。 12. 如申请專利範圍第7項所述之導流葉片散熱結構之哪燈具，其中複合式散熱模組之導流葉片散熱模組，該導流葉片散熱模組外圍氣孔處’為不開對流孔閉合式之絕緣性佳材料，如陶瓷複合材質’絕緣性佳，直接利用陶瓷本身之微結構氣孔散熱。 13. 如申請專利範圍第1項所述導流葉片散熱結構之LED燈具，其中電源底座採内、外雙殼設計，電源pcb板置於内殼中，内殼中灌導熱膠’可防塵防水，兼具導熱功能，可將pcb板上高溫零件降溫’且電源底座外殼有對流孔，可讓流體對流更順暢，增加散熱 17 IDO. 年 A .2 6作月！^: 效率β 如申請專利範圍第13項所述導流葉片散熱結構之LED燈具，其中電源底絲内、外雙殼設計，該電聽座之外殼有通風導流葉片’可導絲流贿流更卿，增加散熱效率。如申請專利麵第14項所述導流葉錄熱結構之LED燈具，其中電源底座外殼有通風導流葉片，該通風導流葉片為流線型曲面葉片’該葉片可隨流場做最佳化的曲面設計，可設計成各種流線曲面’例如飛機機翼流線曲面，複雜不規則的多曲面、雙曲面、s 型扭曲面、單曲面、圓弧曲面等，可導流讓流體更平滑的通過，提高散熱效率。The heat dissipation material at the air vent of the heat dissipation module can be designed as a streamlined surface design, which can be designed into various streamline surfaces, such as aircraft flap streamline surfaces, complex irregular multi-surfaces, and double Curved surfaces, 8-shaped twisted surfaces, single curved surfaces, curved surfaces, etc., allow fluid to pass smoothly to improve heat dissipation efficiency. 1 〇。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。 1L is a led lamp for a heat dissipation structure of a guide vane according to claim 6, wherein the guide vane heat dissipation module 'can be placed on the periphery of the Led substrate without directly contacting the Led substrate for heat conduction' but connected to another heat sink On the module, the heat of the LED heat source on the substrate is conducted to the guide vane surface group via a conventional heat dissipation module or a joint component, and then dispersed into the atmosphere. 12. The lamp of the heat dissipation structure of the guide vane according to claim 7 of the patent application, wherein the guide vane heat dissipation module of the composite heat dissipation module has a convection at the periphery of the heat dissipation module of the guide vane The hole-closed insulating material, such as ceramic composite material, has good insulation and directly uses the micro-structured pores of the ceramic itself to dissipate heat. 13. For the LED lamp of the heat-dissipating structure of the guide vane according to claim 1, wherein the power base adopts an inner and outer double-shell design, the power pcb board is placed in the inner casing, and the inner shell is filled with the thermal conductive glue to be dustproof and waterproof. It has a heat conduction function, which can cool the high temperature parts on the pcb board and has a convection hole in the power base housing, which can make the fluid convection smoother and increase the heat dissipation. 17 IDO. Year A.2 6 months! ^: Efficiency β, such as the LED lamp of the guide vane heat dissipation structure according to claim 13 of the patent scope, wherein the inner and outer double-shell design of the power supply bottom wire, the outer casing of the electro-acoustic seat has a ventilation guide vane, which can guide the bribe Flow more Qing, increase heat dissipation efficiency. The LED lamp of the guide vane recording structure according to claim 14, wherein the power base casing has a ventilation guide vane, and the ventilation guide vane is a streamlined curved blade. The blade can be optimized with the flow field. Surface design, can be designed into a variety of streamlined surfaces 'such as aircraft wing streamline surface, complex irregular multi-surface, hyperboloid, s-shaped twist surface, single surface, arc surface, etc., can guide the flow to make the fluid smoother Pass, improve heat dissipation efficiency.