WO2014048049A1 - Integrated led lamp with built-in glue heat dissipation system - Google Patents
Integrated led lamp with built-in glue heat dissipation system Download PDFInfo
- Publication number
- WO2014048049A1 WO2014048049A1 PCT/CN2013/000142 CN2013000142W WO2014048049A1 WO 2014048049 A1 WO2014048049 A1 WO 2014048049A1 CN 2013000142 W CN2013000142 W CN 2013000142W WO 2014048049 A1 WO2014048049 A1 WO 2014048049A1
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- WIPO (PCT)
- Prior art keywords
- heat
- heat dissipation
- heat conducting
- glue
- conducting plate
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
- F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the invention relates to an integrated LED lamp with a built-in glue filling and cooling system, belonging to the technical field of LED illumination sources.
- LED lamps as a hot direction of LED light source applications have always been the focus of research by various manufacturers.
- LED chips are prone to light decay at higher temperatures, and their heat dissipation effects directly affect
- the use effect and longevity of the existing integrated LED lamps are generally equipped with a heat sink to assist heat dissipation, but the existing heat sink and the heat source have poor contact, the local temperature is too high, and the heat dissipation path is single, and the heat dissipation effect is poor.
- the invention provides an integrated glue lamp heat dissipation system, which can achieve an integrated LED lamp with good heat dissipation effect and uniform temperature.
- the technical solution of the present invention is an integrated LED lamp with a built-in glue filling and cooling system, comprising a lamp cover, a lamp cap, a heat dissipating shell, a heat conducting board, a power source, and an LED chip
- the potting heat dissipating system comprises a heat dissipating shell
- the heat dissipation plate is fixed to the lamp cap, the upper part is fixed to the lamp cap, the upper part is fixed to the lamp cover, the heat conduction plate is fixed on the upper part of the heat dissipation case, the LED chip is attached to the heat conduction plate, and the thermal conductive glue is filled on the heat conduction plate and In the space formed by the heat dissipation housing, the thermal grease covers the power source.
- the thermally conductive paste is initially a flowing liquid that is in intimate contact with the heat conducting plate and the heat sink housing. The heat generated by the LED chip and the heat generated by the power source are in the same heat dissipation path, so that the temperature of the LED lamp is uniform throughout.
- Figure 1 is a schematic diagram of the structure of an integrated LED lamp with a built-in glue filling and cooling system.
- An integrated LED lamp with a built-in glue filling and cooling system comprises a lamp cover 1 , a lamp base 7 , a heat dissipation housing 6 , a heat conduction plate 3 , a power source 5 , and an LED chip 2 , wherein the glue is filled
- the heat dissipation system includes a heat dissipation housing 6, a heat conduction plate 3, and a thermal conductive adhesive 4; the lower portion of the heat dissipation housing 6 is fixed to the lamp holder 7, the upper portion and the lamp cover 1 are fixedly connected, and the heat conduction plate 3 is fixed to the upper portion of the heat dissipation housing 6, the LED chip 2 is attached to the heat conducting plate 3, and the thermal conductive adhesive 4 is filled in a space formed by the heat conducting plate 3 and the heat dissipating casing 6, and the thermal conductive adhesive 4 wraps the power source 5.
- the thermal conductive adhesive 4 is filled in the space formed by the heat conducting plate 3 and the heat dissipating casing 6, and the thermal conductive adhesive 4 wraps the power source 5, heat. Uniform diffusion, eventually conducted to the surface of the heat sink housing.
- the invention solves the problem that the heat conduction path is single and the contact thermal resistance is large, the local temperature is high, and the heat conduction efficiency is not high.
- the thermal paste 4 is initially a flowing liquid which is in full contact with the heat conducting plate 3 and the heat sink housing 6. The heat generated by the LED chip 2 and the heat generated by the power source 5 are in the same heat dissipation path, so that the temperature of the LED lamp is hooked everywhere.
- the material of the lampshade 1 is a transparent or colored material to which a phosphor is added.
- the thermal conductive adhesive 4 adopts a room temperature curing thermal conductive potting silicone TPC-213 produced by Shanghai Zhuoyou Chemical Technology Co., Ltd.
- the glue-filling heat-dissipating system of the present invention is a heat-dissipating system capable of quickly introducing heat generated by an LED and a power source to a surface of a product and then radiating it to the air through a surface in contact with air.
- the heat dissipation system adopts a heat medium whose medium is initially liquid, can fill a sealed space composed of a heat dissipation shell and a heat conduction plate, and can penetrate into a narrow gap between the power components, and changes the liquid heat conduction after a certain period of time changes. It is a soft thermal solid material with stable performance.
- the heat dissipation system requires a good contact between the soft heat conductive solid material and the heat conduction plate in a large area, and the heat conduction plate mainly uses a soft heat conductive solid material as a heat conduction path.
- the specific heat dissipation principle is: the heat generated by the LED chip 2 is conducted to the heat conducting plate 3, and then transmitted to the soft heat conductive solid material thermal conductive adhesive 4, and then the heat radiating outer casing 6 is radiated, and the heat radiating outer casing 6 disperses the heat with good surface convection and surface radiation. Spilled into the air.
- the heat generated by the components of the power supply 5 is conducted to the thermal conductive solid thermal conductive adhesive 4, and then transmitted to the dispersion.
- the heat housing 6, the heat sink housing 6 dissipates heat into the air with good surface convection and surface radiation.
- the heat generated by the LED chip 2 is solved, and the heat generated by the power source 5 is also solved, and the system temperature is uniform and the overall performance is good.
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
An integrated LED lamp with a built-in glue heat dissipation system, which comprises a lamp shade (1), a lamp holder (7), a heat dissipation housing (6), a heat conducting plate (3), a power supply (5) and an LED chip (2). The glue heat dissipation system comprises the heat dissipation housing (6), the heat conducting plate (3) and heat conducting glue (4). A lower part of the heat dissipation housing is fixedly connected to the lamp holder, and an upper part is fixedly connected to the lamp shade. The heat conducting plate is fixedly connected to the upper part of the heat dissipation housing. The LED chip is attached onto the heat conducting plate. The heat conducting glue is filled in a space formed by the heat conducting plate and the heat dissipation housing, and the heat conducting glue enwraps the power supply. As the LED chip is attached onto the heat conducting plate, heat energy generated by the LED chip can be dissipated quickly; and as the heat conducting glue is filled in the space formed by the heat conducting plate and the heat dissipation housing, and the heat conductive glue enwraps the power supply, the heat energy can be dissipated uniformly and can be conducted to a surface of the heat dissipation housing. Problems of a single heat energy conducting path, large contact thermal resistance, high local temperature and low heat conducting efficiency are solved.
Description
一种内置灌胶散热***的一体化 LED灯 Integrated LED lamp with built-in glue filling and cooling system
技术领域 Technical field
本发明涉及一种内置灌胶散热***的一体化 LED灯， 属于 LED照明光源技术领域。 The invention relates to an integrated LED lamp with a built-in glue filling and cooling system, belonging to the technical field of LED illumination sources.
背景技术 Background technique
目前， 一体化 LED灯作为 LED光源应用的一个热门方向， 一直是各厂家投入研究的热 点， 就一体化 LED灯而言， LED芯片在较高温度下， 容易出现光衰， 其散热效果直接影响 其使用效果和寿命， 为此， 现有一体化 LED灯一般都配有散热器辅助散热， 但现有散热器 与热源接触不良， 出现局部温度过高， 又因为散热途径单一， 散热效果差。 At present, integrated LED lamps as a hot direction of LED light source applications have always been the focus of research by various manufacturers. As far as integrated LED lamps are concerned, LED chips are prone to light decay at higher temperatures, and their heat dissipation effects directly affect The use effect and longevity of the existing integrated LED lamps are generally equipped with a heat sink to assist heat dissipation, but the existing heat sink and the heat source have poor contact, the local temperature is too high, and the heat dissipation path is single, and the heat dissipation effect is poor.
发明内容 Summary of the invention
本发明为了克服现有一体化 LED灯散热效果差和局部高温的缺点， 提供了一种内置灌 胶散热***， 能达到散热效果好和温度均匀化的一体化 LED灯。 In order to overcome the shortcomings of the conventional integrated LED lamp with poor heat dissipation effect and local high temperature, the invention provides an integrated glue lamp heat dissipation system, which can achieve an integrated LED lamp with good heat dissipation effect and uniform temperature.
本发明的技术方案是， 一种内置灌胶散热***的一体化 LED灯， 包括灯罩、 灯头、 散 热壳体、 导热板、 电源、 LED芯片， 其特点是， 所述灌胶散热***包括散热壳体、 导热板、 导热胶； 所述散热壳体下部与灯头固接， 上部和灯罩固接， 导热板固接在散热壳体上部， LED 芯片贴在导热板上， 导热胶填充在导热板和散热壳体所组成的空间中， 导热胶包裹着 电源。 The technical solution of the present invention is an integrated LED lamp with a built-in glue filling and cooling system, comprising a lamp cover, a lamp cap, a heat dissipating shell, a heat conducting board, a power source, and an LED chip, wherein the potting heat dissipating system comprises a heat dissipating shell The heat dissipation plate is fixed to the lamp cap, the upper part is fixed to the lamp cap, the upper part is fixed to the lamp cover, the heat conduction plate is fixed on the upper part of the heat dissipation case, the LED chip is attached to the heat conduction plate, and the thermal conductive glue is filled on the heat conduction plate and In the space formed by the heat dissipation housing, the thermal grease covers the power source.
由于 LED芯片贴在导热板上， 使 LED芯片产生的热能迅速扩散开， 导热胶填充在导热 板和散热壳体所组成的空间中， 导热胶包裹着电源， 热量均匀扩散， 最终传导到散热壳体 表面。 解决了热量传导途径单一且接触热阻大， 局部温度高， 导热效率不高的问题。 所述 的导热胶初始为流动的液体， 其与导热板和散热壳体充分接触。 LED芯片产生的热量和电 源产生的热量在同一个散热途径中， 使 LED灯各处温度均匀。 Since the LED chip is attached to the heat conducting plate, the thermal energy generated by the LED chip is rapidly diffused, and the thermal conductive rubber is filled in the space formed by the heat conducting plate and the heat dissipating casing, the thermal conductive rubber wraps the power source, the heat is uniformly diffused, and finally transmitted to the heat dissipating case. Body surface. The invention solves the problem that the heat conduction path is single and the contact thermal resistance is large, the local temperature is high, and the heat conduction efficiency is not high. The thermally conductive paste is initially a flowing liquid that is in intimate contact with the heat conducting plate and the heat sink housing. The heat generated by the LED chip and the heat generated by the power source are in the same heat dissipation path, so that the temperature of the LED lamp is uniform throughout.
附图说明 DRAWINGS
图 1为一种内置灌胶散热***的一体化 LED灯结构示意图。 Figure 1 is a schematic diagram of the structure of an integrated LED lamp with a built-in glue filling and cooling system.
具体实施方式 detailed description
一种内置灌胶散热***的一体化 LED灯， 如图 1所示， 包括灯罩 1、 灯头 7、 散热壳 体 6、 导热板 3、 电源 5、 LED芯片 2， 其特点是， 所述灌胶散热***包括散热壳体 6、 导 热板 3、 导热胶 4; 所述散热壳体 6下部与灯头 7固接， 上部和灯罩 1固接， 导热板 3固 接在散热壳体 6上部， LED芯片 2贴在导热板 3上， 导热胶 4填充在导热板 3和散热壳体 6所组成的空间中， 导热胶 4包裹着电源 5。 An integrated LED lamp with a built-in glue filling and cooling system, as shown in FIG. 1 , comprises a lamp cover 1 , a lamp base 7 , a heat dissipation housing 6 , a heat conduction plate 3 , a power source 5 , and an LED chip 2 , wherein the glue is filled The heat dissipation system includes a heat dissipation housing 6, a heat conduction plate 3, and a thermal conductive adhesive 4; the lower portion of the heat dissipation housing 6 is fixed to the lamp holder 7, the upper portion and the lamp cover 1 are fixedly connected, and the heat conduction plate 3 is fixed to the upper portion of the heat dissipation housing 6, the LED chip 2 is attached to the heat conducting plate 3, and the thermal conductive adhesive 4 is filled in a space formed by the heat conducting plate 3 and the heat dissipating casing 6, and the thermal conductive adhesive 4 wraps the power source 5.
由于 LED芯片 2贴在导热板 3上， 使 LED芯片 2产生的热能迅速扩散开， 导热胶 4填 充在导热板 3和散热壳体 6所组成的空间中， 导热胶 4包裹着电源 5， 热量均匀扩散， 最 终传导到散热壳体表面。 解决了热量传导途径单一且接触热阻大， 局部温度高， 导热效率 不高的问题。 所述的导热胶 4初始为流动的液体， 其与导热板 3和散热壳体 6充分接触。 LED芯片 2产生的热量和电源 5产生的热量在同一个散热途径中，使 LED灯各处温度均勾。 Since the LED chip 2 is attached to the heat conducting plate 3, the thermal energy generated by the LED chip 2 is rapidly diffused, and the thermal conductive adhesive 4 is filled in the space formed by the heat conducting plate 3 and the heat dissipating casing 6, and the thermal conductive adhesive 4 wraps the power source 5, heat. Uniform diffusion, eventually conducted to the surface of the heat sink housing. The invention solves the problem that the heat conduction path is single and the contact thermal resistance is large, the local temperature is high, and the heat conduction efficiency is not high. The thermal paste 4 is initially a flowing liquid which is in full contact with the heat conducting plate 3 and the heat sink housing 6. The heat generated by the LED chip 2 and the heat generated by the power source 5 are in the same heat dissipation path, so that the temperature of the LED lamp is hooked everywhere.
所述的灯罩 1的材质为透明的或者有色的添加有荧光粉的材质。 The material of the lampshade 1 is a transparent or colored material to which a phosphor is added.
所述的导热胶 4 采用由上海卓尤化工科技有限公司生产的室温固化导热灌封硅胶 TPC- 213。 The thermal conductive adhesive 4 adopts a room temperature curing thermal conductive potting silicone TPC-213 produced by Shanghai Zhuoyou Chemical Technology Co., Ltd.
本发明的灌胶散热***一种能够将 LED和电源产生的热量很快导入到产品表面， 再通 过与空气接触的表面散发到空气中的散热***。 该散热***采用一种介质在初期为液态的 导热物， 能够填充散热壳体和导热板组成的密闭空间， 且能够渗入电源元器件间狭小的间 隙中， 经过一定时间段变化， 液态导热物转变成一种软性导热固态物， 且性能稳定。 该散 热***要求软性导热固体物和导热板大面积良好接触， 导热板主要以软性导热固态物作为 热传导的通路。 具体热耗散原理是： LED芯片 2产生的热传导到导热板 3， 再传导到软性 导热固态物导热胶 4， 再传导散热外壳 6， 散热外壳 6以良好的表面对流和表面辐射将热 量散溢到空气中。 电源 5元器件产生的热， 传导到软性导热固态物导热胶 4， 再传导到散
热壳体 6， 散热壳体 6以良好的表面对流和表面辐射将热量散溢到空气中。 这样在一个系 统中， 既解决了 LED芯片 2产生的热， 也解决了电源 5产生的热， 而且***温度均匀， 整 体性能良好。
The glue-filling heat-dissipating system of the present invention is a heat-dissipating system capable of quickly introducing heat generated by an LED and a power source to a surface of a product and then radiating it to the air through a surface in contact with air. The heat dissipation system adopts a heat medium whose medium is initially liquid, can fill a sealed space composed of a heat dissipation shell and a heat conduction plate, and can penetrate into a narrow gap between the power components, and changes the liquid heat conduction after a certain period of time changes. It is a soft thermal solid material with stable performance. The heat dissipation system requires a good contact between the soft heat conductive solid material and the heat conduction plate in a large area, and the heat conduction plate mainly uses a soft heat conductive solid material as a heat conduction path. The specific heat dissipation principle is: the heat generated by the LED chip 2 is conducted to the heat conducting plate 3, and then transmitted to the soft heat conductive solid material thermal conductive adhesive 4, and then the heat radiating outer casing 6 is radiated, and the heat radiating outer casing 6 disperses the heat with good surface convection and surface radiation. Spilled into the air. The heat generated by the components of the power supply 5 is conducted to the thermal conductive solid thermal conductive adhesive 4, and then transmitted to the dispersion. The heat housing 6, the heat sink housing 6 dissipates heat into the air with good surface convection and surface radiation. Thus, in one system, the heat generated by the LED chip 2 is solved, and the heat generated by the power source 5 is also solved, and the system temperature is uniform and the overall performance is good.
Claims
1. 一种内置灌胶散热***的一体化 LED灯， 包括灯罩 （1 )、 灯头 （7)、 散热壳体 （6)、 导热板（3)、 电源（5)、 LED芯片（2)， 其特征在于， 所述灌胶散热***包括散热壳体（6)、 导热板 （3 )、 导热胶 （4); 所述散热壳体 （6) 下部与灯头 （7) 固接， 上部和灯罩 （1 ) 固接， 导热板 （3) 固接在散热壳体 （6) 上部， LED芯片 （2) .贴在导热板 （3) 上， 导热 胶（4)填充在导热板 (3)和散热壳体（6)所组成的空间中， 导热胶（4)包裹着电源（5)。
1. An integrated LED lamp with a built-in glue filling and cooling system, comprising a lampshade (1), a lamp cap (7), a heat dissipating casing (6), a heat conducting plate (3), a power source (5), and an LED chip (2). The glue filling heat dissipation system comprises a heat dissipation shell (6), a heat conduction plate (3) and a heat conductive glue (4); the lower part of the heat dissipation housing (6) is fixed with the lamp holder (7), the upper part and the lamp cover (1) fixed, the heat conducting plate (3) is fixed on the upper part of the heat dissipating case (6), the LED chip (2) is attached to the heat conducting plate (3), and the thermal conductive glue (4) is filled in the heat conducting plate (3) and In the space formed by the heat dissipation housing (6), the thermal conductive adhesive (4) wraps around the power supply (5).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103614561A CN102900980A (en) | 2012-09-26 | 2012-09-26 | Integrated light-emitting diode (LED) lamp of built-in glue-filling heat dissipation system |
| CN201210361456.1 | 2012-09-26 |
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| Publication Number | Publication Date |
|---|---|
| WO2014048049A1 true WO2014048049A1 (en) | 2014-04-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2013/000142 WO2014048049A1 (en) | 2012-09-26 | 2013-02-16 | Integrated led lamp with built-in glue heat dissipation system |
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| CN (1) | CN102900980A (en) |
| WO (1) | WO2014048049A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102900980A (en) * | 2012-09-26 | 2013-01-30 | 上海顿格电子贸易有限公司 | Integrated light-emitting diode (LED) lamp of built-in glue-filling heat dissipation system |
| CN104806912A (en) * | 2015-04-08 | 2015-07-29 | 深圳博用科技有限公司 | Adjustable all-round light LED lamp |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201368435Y (en) * | 2009-02-18 | 2009-12-23 | 深圳鸿森光电有限公司 | Heat radiating structure of LED (light emitting diode) lighting lamp |
| CN102200233A (en) * | 2011-06-20 | 2011-09-28 | 广州莱迪光电股份有限公司 | Light-emitting diode (LED) bulb lamp structure |
| CN202024114U (en) * | 2010-12-21 | 2011-11-02 | 宝霖科技股份有限公司 | Light emitting diode lamp |
| CN102338360A (en) * | 2010-07-26 | 2012-02-01 | 富士迈半导体精密工业（上海）有限公司 | Radiator and lighting device adopting same |
| CN202382043U (en) * | 2011-11-23 | 2012-08-15 | 彩虹集团公司 | Light source device of bulb lamp |
| CN102900980A (en) * | 2012-09-26 | 2013-01-30 | 上海顿格电子贸易有限公司 | Integrated light-emitting diode (LED) lamp of built-in glue-filling heat dissipation system |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102230582A (en) * | 2011-06-20 | 2011-11-02 | 广州莱迪光电股份有限公司 | Safe light emitting diode (LED) ball-bulb lamp |
| CN103174950A (en) * | 2011-12-20 | 2013-06-26 | 富准精密工业(深圳)有限公司 | Light-emitting diode bulb |
| CN203162584U (en) * | 2012-09-26 | 2013-08-28 | 上海顿格电子贸易有限公司 | Integrated LED lamp with built-in glue heat-dissipating system |
-
2012
- 2012-09-26 CN CN2012103614561A patent/CN102900980A/en active Pending
-
2013
- 2013-02-16 WO PCT/CN2013/000142 patent/WO2014048049A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201368435Y (en) * | 2009-02-18 | 2009-12-23 | 深圳鸿森光电有限公司 | Heat radiating structure of LED (light emitting diode) lighting lamp |
| CN102338360A (en) * | 2010-07-26 | 2012-02-01 | 富士迈半导体精密工业（上海）有限公司 | Radiator and lighting device adopting same |
| CN202024114U (en) * | 2010-12-21 | 2011-11-02 | 宝霖科技股份有限公司 | Light emitting diode lamp |
| CN102200233A (en) * | 2011-06-20 | 2011-09-28 | 广州莱迪光电股份有限公司 | Light-emitting diode (LED) bulb lamp structure |
| CN202382043U (en) * | 2011-11-23 | 2012-08-15 | 彩虹集团公司 | Light source device of bulb lamp |
| CN102900980A (en) * | 2012-09-26 | 2013-01-30 | 上海顿格电子贸易有限公司 | Integrated light-emitting diode (LED) lamp of built-in glue-filling heat dissipation system |
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|---|---|
| CN102900980A (en) | 2013-01-30 |
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