M407597 五、新型說明： 【新型所屬之技術領域】 [0001] 本創作是有關一種電子元件之散熱組裝結構，尤指 一種兼具有防電磁波干擾及提昇散熱效率功能之電子元 件散熱結構。 【先前技術】 [0002] 傳統應用於發熱型電子元件（如：功率晶體、積體 電路、L E D等元件）之散熱結構，其大多係以一金屬 散熱片直接貼合於該電子元件之發熱面上，藉由熱傳導 方式將該電子元件之熱量經由該金屬散熱片對外發散， 同時，可另配合風扇或其它$«1@置，.·強制驅動該 金屬散熱片周侧之空氣形成»提:昇.莫I熱效果。 [0003] 再者，一般應用於電子元件防電磁波干擾之隔離裝 置，其多係以一具導磁性之金屬罩設置於該電子元件周 側與上方，以適當阻隔電礴波.，:藉以噠到防止電磁波干 擾之功效，而隨著各種不應用1電路之散熱與防電磁波 淨 ' ^ ψ 干擾需求的增加，往往需奏同^舟真有散熱與防電磁波干 擾等相關結構之設置；然而，基於加工困難度及生產成 本之考量，上述傳統之金屬罩與金屬散熱片並不適合將 其強制整合，而目前在市面上亦未見有相關之結構被揭 露，因此，如何能在不影響電子元件正常散熱功能下， 提昇對於該電子元件之電磁波干擾防護能力，乃為相關 業者所亟待努力之課題。 [0004] 有鑑於習見之電磁波干擾防護及散熱裝置於應用上 表單编號A0101 第3頁/共14頁 M407597 有上述缺點，創作人乃針對該些缺點研究改進之道，終 於有本創作產生。 【新型内容】 [0005] 本創作之主要目的在於提供一種電子元件之散熱組 裝結構，其可於電子元件周側形成具導磁性之防護隔離 ，以有效避免外部之電磁波干擾。 [0006] 本創作之另一目的在於提供一種電子元件之散熱組 裝結構，其可有效提昇散熱元件之導熱效率，進而增進 整體之散熱效果。 [0007] 丨1昨的技術手段 設:&電路板上 x^TT .1 為達成上述目的及功效碎4_« βι * 電子元件的發熱面上；複數 互充份密集 包括：至少一散熱元件，係5 (或密合接觸）地設置於該電子元件周側之電路板上， 並使各連結元件之至少局部部位係與該散熱元件相抵觸 [0008] 依上述結構，其中該複數:連'結孓件係形成電性連接 ，且其中至少一連結元件係與該電路板上之接地點形成 電性連接。 [0009] [0010] [0011] 依上述結構，其中該散熱元件表側形成有一可提昇 導熱效率之導熱層。 依上述結構，其中該連結元件表側形成有一可提昇 導熱效率之導熱層。 為使本創作的上述目的、功效及特徵可獲致更具體 表單編號Α0101 第4頁/共14頁 [0012] 的暸解，茲依下列附圖說明如下： 【實施方式】 請參各圖所示，明顯可看出，本創作主要包括：散 熱元件1與連結元件2等部份，其中該散熱元件i表側 具有一接觸面1 1，該接觸面丄i係可與一設於電路板 4上電子元件3的發熱面3 1相接觸，以利於發散該電 子元件3經由發熱面3 1所產生之熱量，連結元件2係 為一金屬（導磁）材質製成，其具有一可結合固定（焊 接或抵觸）於電路板4上之底部2 1，於該底部2丄上 可、.，巫由彈性支撐部2 2連結一抵觸面2 3，使該抵觸 且 面2 3得以彈性接觸於該 於該底部21上另設有-定麗驗靜中係為 凹槽），而該抵觸面23上則延伸設置一被定位部23 1 (圖示中係為一釣部），藉由該被定位部2 3 1 (鉤 部）伸入定位部2 1 1 (凹槽）邛，可形求一滑動行程 之限制，同時，配合該彈株&楗部貪2‘ϋ撐，可 抵觸面2 3得以㈣有效分i之接觸面丄 1的狀態；上述結構於實際^用g,可利用複數連結元 件2相互充份密集（或密合接觸）地設置於該電子元件 3周侧之電路板4上並使各連結元件2之抵觸面2 3保 持與散熱元件1之接觸面1 1相抵觸，而各連結元件2 之底部2則係結合於電路板4上，藉以於該電子元件3 周側形成一圍繞，且使其中至少一連結元件2與該電路 板4上之接地點形成電性連接，再配合該散熱元件工（ 多為金屬材質）設置於電子元件3上方，可形成一完整 表單編號A0101 第5頁/共14頁 M407597 之電磁波隔離，使該電子元件3得以免受外部電磁波之 干擾。 [0013] 本創作上述結構+，若該電路板4表面無法提供該 連結元件2接地之連結位置，則可於電路板4上設有至 少一與接地點電性連接之固定座41(具有内螺紋）， 而該散熱元件1則可經由一導電之固定元件42(可為 一螺栓）結（螺）合固定於該固定座4 1上，如此，不 但可固定該散熱元件1，亦可使各連結元件2依序經由 散熱元件1、固定元件42、固定座4 1而形成接地， 其亦可達到相同之電磁波隔離功能；同時，該散熱元件 1表側可依需要形成有一^之;導熱層1 2 (連結元件2亦可依需要形:¾有層,）"，藉以增進 ： ..... 整體之散熱效果。 [0014] 综合以上所述，本創作電子元件之散熱組裝結構確 可達成防電磁波干擾、提昇散、熱:效„率之功来，實為一具 新穎性及進步性之創作，爰板法提办申,請新型專利；惟 上述說明之内容，僅為本倉ί作^較,佳實施例說明，舉凡 -•.,.ίί·* # - * -^ο. -ι-ν« 依本創作之技術手段與範疇所延伸之變化、修飾、改變 或等效置換者，亦皆應落入本創作之專利申請範圍内。 【圖式簡單說明】 [0015] 第1圖係本創作之結構分解圖。 [0016] 第2圖係本創作所應用之彈片的一可行實施例結構圖。 [0017] 第3圖係第2圖之彈片受力時的動作示意圖。 [0018] 第4圖係本創作之整體組合圖。 表單編號A0101 第6頁/共14頁 M407597M407597 V. New Description: [New Technology Field] [0001] This creation is about a heat-dissipating assembly structure of electronic components, especially an electronic component heat-dissipation structure that has the functions of preventing electromagnetic interference and improving heat dissipation efficiency. [Prior Art] [0002] A heat dissipation structure conventionally applied to a heat-generating electronic component (such as a power crystal, an integrated circuit, an LED, etc.), which is mostly attached to a heat-generating surface of the electronic component by a metal heat sink. The heat of the electronic component is radiated to the outside through the metal heat sink by heat conduction, and at the same time, the fan or other $«1@,@····································· l. Mo I heat effect. [0003] Furthermore, it is generally applied to an isolation device for preventing electromagnetic wave interference of electronic components, and a plurality of metal shields are disposed on the circumference and the upper side of the electronic component to appropriately block the electric wave. To prevent the interference of electromagnetic waves, and with the increase of the heat dissipation and anti-electromagnetic wave net of the various circuits that do not apply 1 circuit, the demand for interference is often increased, and it is often necessary to match the settings of the relevant structures such as heat dissipation and electromagnetic wave interference; however, based on Considering the difficulty of processing and the cost of production, the above-mentioned traditional metal cover and metal heat sink are not suitable for forced integration. However, there is no related structure disclosed in the market, so how can it not affect the normal electronic components? Under the heat dissipation function, it is an urgent task for the related industry to improve the electromagnetic wave interference protection capability of the electronic component. [0004] In view of the electromagnetic wave interference protection and heat sink device used in the application form number A0101 Page 3 of 14 M407597 The above shortcomings, the creator is to improve the way to deal with these shortcomings, and finally have this creation. [New Content] [0005] The main purpose of this creation is to provide a heat dissipating assembly structure for electronic components, which can form a magnetically isolated protective isolation on the periphery of the electronic component to effectively avoid external electromagnetic interference. Another object of the present invention is to provide a heat dissipating assembly structure for an electronic component, which can effectively improve the heat conduction efficiency of the heat dissipating component, thereby improving the overall heat dissipation effect. [0007] 丨1 yesterday's technical means: & circuit board x ^ TT .1 in order to achieve the above purpose and function broken 4_« βι * electronic components of the heating surface; complex inter-complementary inclusions include: at least one heat-dissipating component a system 5 (or a close contact) disposed on a circuit board on a peripheral side of the electronic component, and at least a portion of each of the connecting components is in conflict with the heat dissipating component. [0008] According to the above structure, wherein the plurality: The junctions form an electrical connection, and wherein at least one of the connection elements is electrically connected to a ground point on the circuit board. [0011] According to the above structure, the heat dissipation layer is formed on the front side of the heat dissipating member with a heat conductive layer capable of improving heat conduction efficiency. According to the above structure, the heat conducting layer for improving the heat transfer efficiency is formed on the front side of the connecting member. In order to make the above-mentioned purpose, function and features of the present creation more specific form number Α0101, page 4/14 pages [0012], the following figures are explained as follows: [Embodiment] Please refer to the figures. It can be clearly seen that the present invention mainly includes: a portion of the heat dissipating component 1 and the connecting component 2, wherein the surface of the heat dissipating component i has a contact surface 1-1, and the contact surface 可i can be connected to an electronic device disposed on the circuit board 4. The heat generating surface 31 of the component 3 is in contact with each other to facilitate dissipating heat generated by the electronic component 3 via the heat generating surface 31. The connecting component 2 is made of a metal (magnetic conductive) material, and has a bondable fixing (welding) Or the bottom portion 2 on the circuit board 4, on the bottom 2, can be connected to the bottom surface 2, and the elastic contact portion 2 2 is coupled to an abutting surface 23, so that the contact and the surface 23 are elastically contacted. The bottom portion 21 is further provided with a groove in the setting, and the abutting surface 23 is extended with a positioning portion 23 1 (in the figure, a fishing portion), by which the positioning portion is positioned The portion 2 3 1 (hook portion) projects into the positioning portion 2 1 1 (groove) 邛, and can form a sliding stroke The limitation, at the same time, with the elastic strain & 楗 贪 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 is disposed on the circuit board 4 on the peripheral side of the electronic component 3 in a sufficiently dense (or close contact) manner, and the contact surface 2 3 of each of the connecting elements 2 is kept in contact with the contact surface 1 1 of the heat dissipating component 1 The bottom portion 2 of each of the connecting elements 2 is coupled to the circuit board 4, thereby forming a surrounding on the peripheral side of the electronic component 3, and electrically connecting at least one of the connecting components 2 to a grounding point on the circuit board 4. Further, the heat dissipating component (mostly metal material) is disposed above the electronic component 3 to form an electromagnetic wave isolation of a complete form number A0101, page 5/14, M407597, so that the electronic component 3 is protected from external electromagnetic waves. . [0013] In the above structure +, if the surface of the circuit board 4 cannot provide the connection position of the connection element 2 to the ground, at least one fixing seat 41 electrically connected to the ground point can be disposed on the circuit board 4 (with the inside) The heat dissipating component 1 can be fixed to the fixing base 41 via a conductive fixing component 42 (which can be a bolt), so that not only the heat dissipating component 1 but also the heat dissipating component 1 can be fixed. Each of the connecting elements 2 is sequentially grounded via the heat dissipating component 1, the fixing component 42, and the fixing base 41, and can also achieve the same electromagnetic wave isolation function; at the same time, the surface of the heat dissipating component 1 can be formed as needed; 1 2 (Linking element 2 can also be shaped as needed: 3⁄4 has layers,) ", to enhance: ..... overall heat dissipation effect. [0014] In summary, the heat dissipating assembly structure of the electronic component of the present invention can achieve electromagnetic wave interference prevention, heat dissipation, and heat efficiency, which is a novelty and progressive creation. Please apply for a new type of patent; only the content of the above description is only for this warehouse. For better example, the description of the example -,.,.ίί·* # - * -^ο. -ι-ν« The changes, modifications, changes or equivalent replacements of the technical means and scope of this creation shall also fall within the scope of the patent application of this creation. [Simplified illustration] [0015] Figure 1 is the creation of this [0016] Fig. 2 is a structural view of a possible embodiment of a shrapnel to which the present invention is applied. [0017] Fig. 3 is a schematic view showing the action of the shrapnel of Fig. 2 when subjected to force. [0018] Fig. 4 This is the overall combination of the creation. Form No. A0101 Page 6 of 14 M407597
[0019] 第5圖係本創作之整體組合剖面圖。 【主要元件符號說明】 [0020] 1____ .散熱元件 [0021] 11.·. .接觸面 ' [0022] 12... .導熱層 [0023] 2____ .連結元件 [0024] 21… •底部 [0025] 211.. .定位部（凹槽） [0026] 22… .彈性支撐部 [0027] 23... .抵觸面 [0028] 231.. .被定位部（鉤部）[0019] Figure 5 is a cross-sectional view of the overall combination of the present creation. [Description of main component symbols] [0020] 1____. Heat dissipating component [0021] 11.·.. Contact surface '[0022] 12... Thermal conduction layer [0023] 2____. Connecting element [0024] 21... • Bottom [0025 211.. Positioning portion (groove) [0026] 22... Elastic support portion [0027] 23... Abutment surface [0028] 231.. Positioned portion (hook portion)
[0029] 3.....電子元件 [0030] 31.. ..發熱面 [0031] 4… ..電路板 [0032] 41.. ..固定座 [0033] 42.. ..固定元件[0029] 3.. Electronic Components [0030] 31... Heating Surface [0031] 4... Circuit Board [0032] 41... Fixing Seat [0033] 42.. Fixing Elements
表單編號A0101 第7頁/共14頁Form No. A0101 Page 7 of 14