CN203851415U - Metallic pasting film capable of accelerating heat dissipation - Google Patents
Metallic pasting film capable of accelerating heat dissipation Download PDFInfo
- Publication number
- CN203851415U CN203851415U CN201420282799.3U CN201420282799U CN203851415U CN 203851415 U CN203851415 U CN 203851415U CN 201420282799 U CN201420282799 U CN 201420282799U CN 203851415 U CN203851415 U CN 203851415U
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- metal substrate
- adhesive
- layer
- metal
- heat radiation
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- Expired - Fee Related
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Abstract
The utility model discloses a metallic pasting film capable of accelerating heat dissipation. The metallic pasting film comprises a metallic substrate. At least one surface of the metallic substrate is equipped with multiple upward protrusions. The surface, equipped with the protrusions, of the metallic substrate is coated with an adhesive layer covering the protrusions. The adhesive layer is covered with release paper provided with a release layer. The metallic pasting film has an advantage of quickly transferring heat generated by a heating element in a housing to the housing.
Description
Technical field
The utility model relates to adhesive film, especially relates to a kind of metal adhesive film that can accelerate heat radiation.
Background technology
Generally use along with electronic products such as mobile phone, panel computer, notebook computers, the element that battery or CPU can generate heat at work, if can not dispel the heat in time, will be for affecting its working effect, further can cause the destruction of equipment, and these elements are generally arranged in product casing, this has more affected their radiating effect, some product dispels the heat by adhesive film between heater element and device housings now, but bad because of the thermal conductivity of adhesive film itself, still can not solve well heat dissipation problem.
Utility model content
For addressing the above problem, the purpose of this utility model is to provide a kind of metal adhesive film that can accelerate heat radiation.
The utility model is realized by following technical measures, a kind of metal adhesive film that can accelerate heat radiation, comprise metal substrate, the at least one side of described metal substrate is provided with a plurality of projections that make progress, described metal substrate has protruding one side and is coated with the protruding adhesive-layer of covering, and described adhesive-layer is also coated with the release liners with release layer outward.
As a kind of optimal way, two faces of described metal substrate are all provided with a plurality of projections that make progress.
As a kind of optimal way, described metal substrate is copper metal substrate, aluminum metal substrate, ferrous metal substrate, silver metal substrate or Al-alloy metal substrate.
As a kind of optimal way, the thickness of described metal substrate is 0.05mm-0.5mm.
As a kind of optimal way, described adhesive-layer is acrylic compounds adhesive-layer or silicone based adhesive-layer.
As a kind of optimal way, the top of described projection is the plane parallel with metal substrate.
As a kind of optimal way, the outer surface of described release liners is also provided with one deck release layer, is coated with an adhesive paper on described release layer, and described adhesive paper is coated with adhesive-layer in the one side of release layer.
One side of the present utility model sticks on the shell of heat radiation, another side sticks on chip or heater element surface, thereby utilize and there is protruding metal substrate as main heat exchange pattern, very strong radiating effect can be realized, the problems such as damage of facilities that rise and cause because of the temperature of chip in housing or heater element can be suppressed.
Accompanying drawing explanation
Fig. 1 is the cross-sectional view of the utility model one embodiment;
Fig. 2 is the cross-sectional view of another embodiment of the utility model.
Embodiment
Below in conjunction with embodiment and contrast accompanying drawing the utility model is described in further detail.
A kind of metal adhesive film that can accelerate heat radiation of the present embodiment, please refer to Fig. 1, comprise metal substrate 1, the at least one side of described metal substrate 1 is provided with a plurality of projections that make progress 101, the one side that described metal substrate 1 has projection 101 is coated with the adhesive-layer 2 that covers projection 101, outside described adhesive-layer 2, is also coated with the release liners 4 with release layer 3.
The one side of this product sticks on the shell of heat radiation, another side sticks on chip or heater element surface, thereby utilize the metal substrate 1 with projection 101 as main heat exchange pattern, very strong radiating effect can be realized, the problems such as damage of facilities that rise and cause because of the temperature of chip in housing or heater element can be suppressed.
The metal adhesive film that can accelerate heat radiation of the present embodiment, please refer to Fig. 1, can also be specifically that two faces of metal substrate 1 are all provided with a plurality of projections that make progress 101 on the basis of previous technique scheme.
The metal adhesive film that can accelerate heat radiation of the present embodiment, please refer to Fig. 1, can also be specifically that metal substrate 1 is copper metal substrate, aluminum metal substrate, ferrous metal substrate, silver metal substrate or Al-alloy metal substrate on the basis of previous technique scheme.
The metal adhesive film that can accelerate heat radiation of the present embodiment, please refer to Fig. 1, can also be specifically that the thickness of metal substrate 1 is 0.05mm-0.5mm on the basis of previous technique scheme.
The metal adhesive film that can accelerate heat radiation of the present embodiment, please refer to Fig. 1, can also be specifically that adhesive-layer 3 is acrylic compounds adhesive-layer or silicone based adhesive-layer on the basis of previous technique scheme.
The metal adhesive film that can accelerate heat radiation of the present embodiment, please refer to Fig. 1, on the basis of previous technique scheme, can also be specifically, and the top of projection 101 is the plane parallel with metal substrate 1.Thereby increase heat transfer area.
The metal adhesive film that can accelerate heat radiation of the present embodiment, please refer to Fig. 2, on the basis of previous technique scheme, can also be specifically, the outer surface of release liners 4 is also provided with one deck release layer 5, on described release layer 5, be coated with an adhesive paper 7, described adhesive paper 7 is coated with adhesive-layer 6 in the one side of release layer 5.When the article surface that will paste has dust or particle, first adhesive paper 7 is opened, utilize the adhesive-layer 6 on sticky adhesive paper 7 surfaces that dust or particle are sticked up.Thereby there is the effect of energy clean article surface dirt or particle, thereby increase the firm pasting degree of product.
More than that the metal adhesive film that can accelerate to dispel the heat to the utility model is set forth; be used for helping to understand the utility model; but execution mode of the present utility model is not restricted to the described embodiments; anyly do not deviate from the change done under the utility model principle, modification, substitute, combination, simplify; all should be equivalent substitute mode, be included in protection range of the present utility model in.
Claims (7)
1. can accelerate the metal adhesive film dispelling the heat for one kind, it is characterized in that: comprise metal substrate, the at least one side of described metal substrate is provided with a plurality of projections that make progress, described metal substrate has protruding one side and is coated with the protruding adhesive-layer of covering, and described adhesive-layer is also coated with the release liners with release layer outward.
2. the metal adhesive film that can accelerate heat radiation according to claim 1, is characterized in that: two faces of described metal substrate are all provided with a plurality of projections that make progress.
3. the metal adhesive film that can accelerate heat radiation according to claim 1, is characterized in that: described metal substrate is copper metal substrate, aluminum metal substrate, ferrous metal substrate, silver metal substrate or Al-alloy metal substrate.
4. the metal adhesive film that can accelerate heat radiation according to claim 1, is characterized in that: the thickness of described metal substrate is 0.05mm-0.5mm.
5. the metal adhesive film that can accelerate heat radiation according to claim 1, is characterized in that: described adhesive-layer is acrylic compounds adhesive-layer or silicone based adhesive-layer.
6. the metal adhesive film that can accelerate heat radiation according to claim 1, is characterized in that: the top of described projection is the plane parallel with metal substrate.
7. energy according to claim 1 is accelerated the metal adhesive film of heat radiation, it is characterized in that: the outer surface of described release liners is also provided with one deck release layer, on described release layer, be coated with an adhesive paper, described adhesive paper is coated with adhesive-layer in the one side of release layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420282799.3U CN203851415U (en) | 2014-05-29 | 2014-05-29 | Metallic pasting film capable of accelerating heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420282799.3U CN203851415U (en) | 2014-05-29 | 2014-05-29 | Metallic pasting film capable of accelerating heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203851415U true CN203851415U (en) | 2014-09-24 |
Family
ID=51564379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420282799.3U Expired - Fee Related CN203851415U (en) | 2014-05-29 | 2014-05-29 | Metallic pasting film capable of accelerating heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203851415U (en) |
-
2014
- 2014-05-29 CN CN201420282799.3U patent/CN203851415U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140924 Termination date: 20170529 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |