TWM400660U - Solder-free heat dissipation module of LED lamp - Google Patents

Solder-free heat dissipation module of LED lamp Download PDF

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Publication number
TWM400660U
TWM400660U TW99218241U TW99218241U TWM400660U TW M400660 U TWM400660 U TW M400660U TW 99218241 U TW99218241 U TW 99218241U TW 99218241 U TW99218241 U TW 99218241U TW M400660 U TWM400660 U TW M400660U
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Taiwan
Prior art keywords
heat
top surface
edge
hole
heat dissipation
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TW99218241U
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Chinese (zh)
Inventor
yu-feng Zhao
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Ming Fong Rong Co Ltd
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Priority to TW99218241U priority Critical patent/TWM400660U/en
Publication of TWM400660U publication Critical patent/TWM400660U/en

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Description

M400660 五、新型說明: 【新型所屬之技術領域】 本創作係關於一種led燈具散熱裝置,尤指一種免焊 接LED燈具散熱模組,係主要在於使用不焊接的方式製作 該LED燈具散熱模組以減少成本及避免空焊造成的不良影 響。 【先前技術】M400660 V. New description: [New technical field] This creation is about a heat dissipation device for LED lamps, especially a heat-dissipating module for solderless LED lamps. The main purpose is to make the LED thermal module without soldering. Reduce costs and avoid the adverse effects of air welding. [Prior Art]

LED為新時代之產物,由於其既省電、又可提供充足 的光源’因此已經在許多方面慢慢取代傳統燈泡或省電燈 泡的角色’成為照明器材的主角。現用之LED燈具皆配有 一散熱模組’雖然散熱模組的型態大多不同,但散熱原理 與其組成構件均大同小異,主要皆於L E D電路板下設置一 散熱鰭片組,讓LED電路板產生之熱能導引至散熱鰭片散 逸,習用之散熱鰭片雖有多種型態與組合模式,唯皆具有 共通點:為將散熱鰭片組固定,必須將其焊接於一固定 物上,該固定物可為一圓筒狀、一長方體或一正方體。 以下列舉一種習用之LED燈散熱模組,請進一步參閱 圖9及圖10’係為習用LED燈具散熱模組平面剖面圖及鰭 片立體圖,其中包含有: -鰭片組80 ’係包含複數個鰭片81,並排列成一環形 —各,„、曰片81係於侧邊延伸有—侧面折邊82,頂邊延伸有 面折邊83及-金屬環接合片85,底邊延伸有—底面折 4 ’其中忒頂面折邊83的二相對邊緣分別形成有一頂面 3 M400660 勹片1及頂面勾孔832,並於表面上形成有複數個圓孔 ’且σ時,各鰭片81以其頂面折邊的頂面勾片831勾 住其中相鄰的鰭片81之頂面折邊83上的頂面勾孔M2; 此外’各鍺片底面折邊84的二相對邊緣分別形成有底面勾 片841及底面勾孔842,於組裝時各緒片底面勾片Mi 勾住相鄰鰭片81的底面勾孔842;組裝完成後複數鰭片81 之側面折邊82構成一圓柱壁面’並於鰭片組8〇令形成一 圓柱空間;至於該金屬環接合片85上則形成有一接合孔 φ 851 ; 一金屬套筒90’係為一圓筒狀,匹配並***鰭片組8〇 的圓柱空間;又該金屬套筒90之底面形成一開口,而頂面 形成一電線孔91,又該金屬套筒9〇外壁焊接於該鰭片組 80各鰭片81的側面折邊82所構成的圓柱壁面; 一套環11 0,係套於鰭片組8 0頂面外緣的金屬環接合 片85,並在其内緣形成有一細環11〇1卡接於該各鰭片81 的接合孔851,以避免鰭片81頂部外緣尖銳割傷使用者,; • 及 一絕緣底座7 0 ’其開口朝上,底部連接一電源連接座 71,該鰭片組80與金屬套筒90焊接後係設置於該絕緣底 座70開口内。 以上為既有L E D燈具散熱模組的結構說明,欲組裝一 LED燈具,係進一步將一 LED電路板1〇1設置於鰭片組8〇 頂面折邊83及金屬套筒90上;由於該LED電路板1〇1底 部有複數個凸枉1 〇 3 ’故可對應***該鰭片組8 〇各缝片81 頂面折邊83上的圓孔833’並使該LED電路板ιοί的底面 4 M400660 與該各鰭片81的頂面折邊83及金屬套筒9〇的頂面接觸; 而該LED電路板1〇1電線1〇2則穿過金屬套筒9〇上的電 線孔91,進而焊接於絕緣底座7〇底部的電源連接座W, 至此完成LED燈具的組裝。當LED電路板1〇1開始運作 時如此忒LED電路板101所產生的熱能即可一部分藉由 與其接觸的各鰭片81頂面折邊83將熱能傳導至各鰭片081 逸散,另一部分則藉由與金屬套筒9〇頂面接觸傳導至 片81逸散。 ^ 由上述說明可知,該鰭片組80的圓柱空間***與其匹 配的金屬套筒9〇,撐開鰭片組80的各鰭片81固定成環狀, 欲進-步加強金屬套筒9Q與各81的連接強度,再進 一步將各鰭片81側面折邊82焊接在金屬套筒9〇外壁上; 如此一來,不僅增加製造成本,在焊接製程中金屬套筒9〇 會因沾染焊錫不均勻,因此造成空焊,造成金屬套筒卯外 壁無法全面與各鰭片81側面折邊82接觸,而降低熱傳導 效率’又焊接的製成產生了大量的污染,此製程不甚理想。 【新型内容】 有鑑於上述現有LED燈具散熱模組之技術缺陷,本創 作的主要目的係提出一種免焊式LED燈具散熱模組。 欲達上述目的所使用的主要技術手段係令該免焊式 LED燈具散熱模組包含有: 一絕緣底座,其底部内側緣形成一環狀内緣,該環狀 内緣上-X置有複數個凸點,該絕緣底座上緣内側表面形成 有一細凸環; 5 M4U0660 套筒,其頂面形成一導線開孔,底面為一開口,底 4外緣有形成有一環狀突緣,該環狀突緣放置於該絕緣底 座%狀内緣上’且該套筒的環狀突緣對應該絕緣底座環狀 ㈣的&點處’形成有複數個穿1 ’以固定於該絕緣底座 環狀内緣上;LEDs are the product of a new era. Because they save electricity and provide sufficient light source, they have gradually replaced the traditional light bulb or the role of power-saving light bulbs in many aspects, becoming the protagonist of lighting equipment. The current LED lamps are equipped with a heat dissipation module. Although the types of the heat dissipation modules are mostly different, the heat dissipation principle and the components thereof are similar. The main purpose is to provide a heat dissipation fin set under the LED circuit board to enable the LED circuit board to be produced. The thermal energy is guided to the heat dissipation fins. Although the conventional heat dissipation fins have various types and combination modes, they all have a common point: in order to fix the heat dissipation fin group, it must be welded to a fixture, the fixture It can be a cylinder, a cuboid or a cube. The following is a conventional LED lamp heat dissipation module. Please refer to FIG. 9 and FIG. 10' for a planar view of the heat dissipation module of the conventional LED lamp and a perspective view of the fin, which includes: - the fin group 80' includes a plurality of The fins 81 are arranged in a ring shape, and each of the louvers 81 has a side flange 82 extending from the side, a top flange 83 and a metal ring joint 85 extending from the top edge, and a bottom surface extending from the bottom surface. Folding 4', wherein the two opposite edges of the top surface flange 83 are respectively formed with a top surface 3 M400660 and a top surface hook hole 832, and a plurality of round holes ' and σ are formed on the surface, and each fin 81 The top surface hook piece 831 with its top surface is hooked to the top surface hook hole M2 of the top surface flange 83 of the adjacent fin 81; and the two opposite edges of the bottom surface of the bottom piece 84 are respectively formed. The bottom surface hook piece 841 and the bottom surface hook hole 842 are assembled. When assembled, the bottom surface hook piece Mi hooks the bottom surface hook hole 842 of the adjacent fin piece 81; after the assembly is completed, the side flange 82 of the plurality of fins 81 forms a cylindrical wall surface. 'and forming a cylindrical space in the fin group 8; as for the metal ring bonding piece 85, A joint hole φ 851; a metal sleeve 90' is a cylindrical shape that matches and is inserted into the cylindrical space of the fin group 8〇; and the bottom surface of the metal sleeve 90 forms an opening, and the top surface forms a wire hole 91. And the outer wall of the metal sleeve 9 is welded to the cylindrical wall surface formed by the side flange 82 of each fin 81 of the fin group 80; a set of rings 11 0 is sleeved on the outer edge of the top surface of the fin group 80; a metal ring engaging piece 85, and a thin ring 11〇1 is formed on the inner edge thereof to engage with the engaging hole 851 of the fins 81, so as to prevent the outer edge of the top of the fin 81 from sharply cutting the user, and an insulation The base 7 0 ' has its opening facing upward, and the bottom is connected with a power connection seat 71. The fin set 80 is soldered to the metal sleeve 90 and disposed in the opening of the insulating base 70. The above is the structure of the heat dissipation module of the LED lamp. In order to assemble an LED lamp, an LED circuit board 1〇1 is further disposed on the fin group 8 top surface flange 83 and the metal sleeve 90; since the LED circuit board 1〇1 has a plurality of protrusions at the bottom枉1 〇3', so that the circular hole 833' of the top flap 34 of each of the slits 81 can be correspondingly inserted into the fin group 8 The bottom surface 4 M400660 of the LED circuit board ιοί is in contact with the top surface flange 83 of the fins 81 and the top surface of the metal sleeve 9〇; and the LED circuit board 1〇1 wire 1〇2 passes through the metal sleeve The wire hole 91 on the barrel 9 is further welded to the power connection seat W at the bottom of the insulating base 7 to complete the assembly of the LED lamp. When the LED circuit board 1〇1 starts to operate, the heat generated by the LED circuit board 101 is thus generated. That is, a portion of the fins 81 that are in contact therewith can conduct thermal energy to the fins 081 to escape, and the other portion is conducted to the sheet 81 by contact with the top surface of the metal sleeve 9. ^ As can be seen from the above description, the cylindrical space of the fin group 80 is inserted into the matching metal sleeve 9〇, and the fins 81 of the fin group 80 are fixed in a ring shape, and the metal sleeve 9Q is to be stepped up. The connection strength of each 81 further welds the side flanges 82 of the fins 81 to the outer wall of the metal sleeve 9; thus, the manufacturing cost is not increased, and the metal sleeve 9 is not contaminated by solder during the soldering process. Uniform, thus causing void welding, causing the outer wall of the metal sleeve to not fully contact the side flanges 82 of the fins 81, thereby reducing the heat transfer efficiency' and the welding is produced with a large amount of pollution, which is not ideal. [New content] In view of the technical defects of the above-mentioned existing LED lamp heat dissipation module, the main purpose of this creation is to propose a solderless LED lamp heat dissipation module. The main technical means used to achieve the above purpose is that the solderless LED lamp heat dissipation module comprises: an insulating base, the bottom inner edge of which forms an annular inner edge, and the annular inner edge has a plurality of -X a bump, a fine convex ring is formed on the inner surface of the upper edge of the insulating base; 5 M4U0660 sleeve, the top surface of which forms a wire opening, the bottom surface is an opening, and the outer edge of the bottom 4 is formed with an annular flange, the ring The flange is placed on the inner edge of the insulating base and the annular flange of the sleeve is formed with a plurality of holes 1 at the & point of the insulating base ring (four) to be fixed to the insulating base ring On the inner edge

B 一…、鰭片組,係包含有複數個散熱鰭片,並排列成 %狀體’該各散熱鰭片皆於頂部形成有一頂面折邊,甘 底部形成-底面折邊,且於底部外側向内形成有一凹緣, 又該頂面折邊上有一 L型的頂面勾片…頂面勾孔及複类 個圓孔,而該底面折邊上有L型的一底面勾片及一底面或 孔豸各鰭片的頂面勾片勾住相鄰鰭片的頂面勾孔,且肩 办勾片勾住底面勾孔,該散熱韓片組底部接於該套筒環狀 ★緣=上緣’該散熱韓片組各散熱韓片的底面折邊與該套 f的%狀犬緣緊密結合,各散熱韓片垂直於套筒的外壁緊 :’且该各散熱鰭片的凹緣卡接於該絕緣底座上緣的細凸 玉衣上, 散熱底座,係為—JU般北,甘L ...^ M 4 w盤狀,其上、下表面上對應該 複數沖壓Γ有讀個圓形孔洞及 ..# /成有複數個導線孔及複數個結合 =面=孔洞對應—沖壓',該沖麼柱穿過各散熱 :Γ對應圓形孔洞,#沖虔突出於圓形孔洞的 冲[柱、,使其扣緊於該各散熱續片頂面折邊。 上述組裝過程甲係將散妹 緣底座f k拉 …一曰片組與套筒直接卡接於絕 緣底座上,套筒可將散熱轉片 連同散熱韓片組卡固在絕缘底座上Q疋為爾’亦可 緣底座上,而省去焊接固定的步 6 M400660 驟,不僅節省工業製作成本亦減少環境污染。 本創作次一目的係提供一種提高散熱效率的免焊式 led燈具散熱模組,意即上述絕緣底座及套筒於其外壁上 分別形成散熱孔’提供與空氣的對流空間,使散熱縛片的 熱能散逸成效更佳。 【實施方式】 請參閱圖1至7,本創作免焊式LED燈具散熱模組, 其包含有: -絕緣底座10,其底部内側緣形成一環狀内緣12,底 部外側形成複數個透氣孔122,該透氣孔122内側形成有 斜向透氣孔123穿透内表面,該環狀㈣12上設置有複數 個凸點121,該絕緣底座1〇上緣内側表面形成有一 101 ; -套筒20’其了頁面形成一導線開孔22,底面為一開口, 底部外緣有形成有—環狀突緣23,該環狀突緣23放置於該 &座1 0 %狀内緣12上,且該套筒2〇的環狀突緣23 上形成有複數個穿231結合於該絕緣底座1()環狀内緣 的凸.點121上,且側面外表面形成有複數個透氣條孔 各透氣條孔21兩側邊各形成有-斜向透氣條孔211穿 透内表面’又該套筒20材質係為塑膠,亦可為金屬材質; —散熱鰭片組30 ’係包含有複數個散熱轉片31,並排 歹:成-環狀體’該各散熱賴片31皆於頂邊形成有一頂面折 及一細凹緣35’於底邊形成-底面折邊33且於底部 外側向内形成有一凹緣34,該頂面折邊32上有一匕型的頂 7 M400660 圖1 Ο :為習用LED燈具散熱模組之鰭片立體圖。B... The fin group includes a plurality of fins arranged in a %-shaped body. The fins are formed with a top surface folded at the top, and the bottom portion is formed with a bottom edge and a bottom portion. The outer side is formed with a concave edge inwardly, and the top surface has an L-shaped top surface hook piece, a top surface hook hole and a plurality of round holes, and the bottom surface has an L-shaped bottom surface hook piece and The top surface of each fin or the fin of the fins hooks the top surface of the adjacent fins, and the shoulder hooks hook the bottom hook hole, and the bottom of the heat dissipation Korean group is connected to the sleeve ring ★ Edge = upper edge 'The bottom surface of each of the heat-dissipating Korean film sets is closely combined with the %-shaped dog's edge of the set f, and the heat-dissipating Korean pieces are perpendicular to the outer wall of the sleeve: 'and the heat-dissipating fins The concave edge is fastened to the fine convex jade on the upper edge of the insulating base, and the heat-dissipating base is like a JU-like north, and has a disk shape, and the upper and lower surfaces are correspondingly stamped. Have read a circular hole and .. / / have a plurality of wire holes and a plurality of combinations = face = hole corresponding - stamping ', the punch column through the heat dissipation: Γ corresponding to the circular hole Hole, #冲虔 protrudes from the circular hole [column, so that it is fastened to the top surface of each heat sink. In the above assembly process, the armor base fk is pulled... The cymbal group and the sleeve are directly connected to the insulating base, and the sleeve can fix the heat-dissipating fin together with the heat-dissipating Korean group on the insulating base. 'It can also be used on the base, eliminating the need to weld the fixed step 6 M400660, which not only saves industrial production costs but also reduces environmental pollution. The second purpose of the present invention is to provide a solderless LED lamp heat dissipation module for improving heat dissipation efficiency, that is, the insulating base and the sleeve respectively form a heat dissipation hole on the outer wall thereof to provide a convection space with the air, so that the heat dissipation tab Thermal energy dissipation is better. [Embodiment] Referring to Figures 1 to 7, the heat-free module for the solderless LED lamp of the present invention comprises: - an insulating base 10 having an annular inner edge 12 formed at the bottom inner edge and a plurality of vent holes formed on the outer side of the bottom portion 122, the vent hole 122 is formed with an oblique vent hole 123 penetrating the inner surface, the ring (four) 12 is provided with a plurality of bumps 121, the inner surface of the upper edge of the insulating base 1 is formed with a 101; - the sleeve 20' The page forms a wire opening 22, the bottom surface is an opening, and the bottom outer edge is formed with an annular flange 23, and the annular flange 23 is placed on the 10% inner edge 12 of the & The annular flange 23 of the sleeve 2 is formed with a plurality of through holes 231 coupled to the convex point 121 of the annular inner edge of the insulating base 1 and the outer surface of the side surface is formed with a plurality of gas permeable holes for ventilation. The two sides of the strip hole 21 are formed with an oblique gas permeable hole 211 penetrating the inner surface. The sleeve 20 is made of plastic or metal. The heat sink fin set 30' contains a plurality of heat sinks. The rotating piece 31 is arranged side by side: a ring-shaped body. The heat-dissipating sheets 31 are formed with a top surface folded on the top side. The concave edge 35' is formed on the bottom edge - a bottom edge flange 33 and a concave edge 34 is formed inwardly on the outer side of the bottom portion. The top surface flange 32 has a top type 7 M400660. Fig. 1 Ο: is a conventional LED lamp heat dissipation module A perspective view of the fins.

【主要元件符號說明】 10絕緣底座 101細凸環 11電源座 12環狀内緣 121凸點 122透氣孔 123斜向透氣孔 20套筒 21透氣條孔 211斜向透氣條孔 22導線開孔 23環狀突緣 231穿孔 30散熱鰭片組 31散熱鰭片 32頂面折邊 321頂面勾片 322頂面勾孔 323圓孔 33底面折邊 331底面勾片 332底面勾孔 34凹緣 35細凹緣 40散熱底板 42導線孔 43結合孔 44圓形孔洞 45沖壓柱 50金屬環 51結合細環 52金屬環氣孔 70絕緣底座 71電源連接座 80鰭片組 M400660 81鰭片 82側面折邊 83頂面折邊 831頂面勾片 832頂面勾孔 833圓孔 84底面折邊 841底面勾片 842底面勾孔 85金屬接合片 851接合孔 90金屬套筒 91電線孔 101 LED電路 102導線 103凸枉 110套環 1101細環 11[Main component symbol description] 10 Insulation base 101 Thin convex ring 11 Power supply seat 12 Annular inner edge 121 Bump 122 Ventilation hole 123 Oblique venting hole 20 Sleeve 21 Venting hole 211 Oblique venting hole 22 Wire opening 23 Annular flange 231 perforation 30 heat sink fin group 31 heat sink fin 32 top surface fold 321 top surface hook piece 322 top surface hook hole 323 round hole 33 bottom side flange 331 bottom surface hook piece 332 bottom surface hook hole 34 concave edge 35 thin Concave edge 40 heat sink base plate 42 wire hole 43 joint hole 44 round hole 45 stamping column 50 metal ring 51 combined with thin ring 52 metal ring air hole 70 insulation base 71 power connection seat 80 fin group M400660 81 fin 82 side flange 83 top Flap 831 top hook 832 top hook hole 833 round hole 84 bottom hem 841 bottom hook 842 bottom hook hole 85 metal joint 851 joint hole 90 metal sleeve 91 wire hole 101 LED circuit 102 wire 103 bulge 110 sets of rings 1101 thin ring 11

Claims (1)

M400660 六、申請專利範圍: 1.一種免焊式LED燈具散熱模組,係包含有: 一絕緣底座,其底部内側緣形成—環狀内緣,該環狀 内緣上設置有複數個凸,點,該絕緣底座上緣内側表面形成 有一細凸環; _套筒,其頂面形成一導線開孔,底面為一開口,底 部外緣有形成有-環狀突緣,該環狀突緣放置於該絕緣底 座環狀内緣上’且該套筒的環狀突緣對應該絕緣底座環狀 内緣的凸點處’形成有複數個穿1,以固定於該絕緣底座 環狀内緣上; -散熱鰭片組,係包含有複數個散熱鰭片,並排列成 -環狀體,該各散熱韓片皆於頂部形成有一頂面折邊,於 底部形成-底面折邊’且於底部外側向内形成有一凹緣, X頂面折邊上有匕型的頂面勾片、一頂面勾孔及複數 個圓孔,而該底面折邊上有L型的一底面勾片及一底面勾 孔,邊各鰭片的頂面勾片勾住相鄰鰭片的頂面勾孔且底面 片勹住底面勾孔,忒散熱鰭片組底部抵接於該套筒環狀 ^緣的上緣,忒散熱鰭片組各散熱鰭片的底面折邊與該套 :的裱狀突緣緊密結合,各散熱鰭片垂直於套筒的外壁緊 Λ ’且忒各散熱鰭片的凹緣卡接於該絕緣底座上緣的細凸 環上; 一散熱底座,係為一圓 各政熱轉片的頂面折邊圓孔 複數沖壓柱,並進_步形成 孔’其中各圓形孔洞對應一 盤狀’其上、下表面上對應該 分別形成有複數個圓形孔洞及 有複數個導線孔及複數個結合 沖壓柱’該沖壓柱穿過各散熱 12M400660 VI. Application Patent Range: 1. A solderless LED lamp heat dissipation module comprising: an insulating base, the bottom inner edge of which forms an annular inner edge, and the annular inner edge is provided with a plurality of convexities, a small convex ring is formed on the inner surface of the upper edge of the insulating base; the sleeve has a wire opening on the top surface, an opening in the bottom surface, and an annular flange formed on the outer edge of the bottom, the annular flange a plurality of piercings 1 formed on the annular inner edge of the insulating base and the annular flange of the sleeve corresponding to the annular inner edge of the insulating base is fixed to the annular inner edge of the insulating base The heat-dissipating fin group includes a plurality of heat-dissipating fins and is arranged in a ring-shaped body, and each of the heat-dissipating Korean films has a top surface folded at the top, and a bottom surface folded at the bottom a concave edge is formed inwardly on the outer side of the bottom portion, and a top surface hook piece on the top surface of the X top surface, a top surface hook hole and a plurality of round holes, and an L-shaped bottom surface hook piece on the bottom surface folding edge and a bottom hook hole, the top surface of each fin is hooked to the top of the adjacent fin The bottom hole and the bottom piece are clamped to the bottom hook hole, and the bottom of the heat dissipation fin group abuts against the upper edge of the sleeve ring edge, and the bottom surface of each heat dissipation fin of the heat dissipation fin group is folded and the cover: The heat-dissipating fins are tightly coupled to each other, and the heat-dissipating fins are perpendicular to the outer wall of the sleeve and the concave edges of the heat-dissipating fins are engaged with the thin convex rings on the upper edge of the insulating base; The top surface of the political heat transfer sheet has a plurality of punched cylinders, and the hole is formed into a hole. The circular holes correspond to a disk shape. The upper and lower surfaces are respectively formed with a plurality of circular holes and a plurality of circular holes. Wire holes and a plurality of combined stamping columns 'the stamping column passes through each heat sink 12
TW99218241U 2010-09-21 2010-09-21 Solder-free heat dissipation module of LED lamp TWM400660U (en)

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