TW201541019A - Attaching method for self-adhesive substrate - Google Patents
Attaching method for self-adhesive substrate Download PDFInfo
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- TW201541019A TW201541019A TW103115056A TW103115056A TW201541019A TW 201541019 A TW201541019 A TW 201541019A TW 103115056 A TW103115056 A TW 103115056A TW 103115056 A TW103115056 A TW 103115056A TW 201541019 A TW201541019 A TW 201541019A
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Abstract
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本發明係關於電子裝置之技術領域，尤指用以替代傳統製程之一種自黏基板之貼裝方法。 The present invention relates to the technical field of electronic devices, and more particularly to a self-adhesive substrate mounting method for replacing a conventional process.
近年來，發光二極體(Light-Emitting Diode,LED)係廣泛地被應用於日常生活之照明裝置方面。請參閱第一圖，係習用的一種LED燈具的***圖。如第一圖所示，該LED燈具1’包括：一座體11’、一接電座12’、一驅動控制模組13’、一電路基板14’、與一燈罩15’，其中，電路基板14’之上焊接有複數個LED元件16’；並且，透過螺絲141’與螺孔(111’,142’)之輔助，係使得該電路基板14’被鎖固於該座體11’之一設置表面112’上；此外，電路基板14’之導線143’係穿過挖設於該設置表面112’之一導線孔113’而與設於該接電座12’內的該驅動控制模組13’達成電性連接，使得該複數個LED元件16’能夠受到該驅動控制模組13’之電力驅動而發光。 In recent years, Light-Emitting Diode (LED) has been widely used in lighting devices for everyday life. Please refer to the first figure, which is an exploded view of a conventional LED luminaire. As shown in the first figure, the LED lamp 1' includes: a body 11', a socket 12', a drive control module 13', a circuit board 14', and a lamp cover 15', wherein the circuit board 14' is soldered with a plurality of LED elements 16'; and, with the aid of the screw 141' and the screw holes (111', 142'), the circuit substrate 14' is locked to one of the bases 11' In addition, the wire 143' of the circuit board 14' passes through the wire hole 113' of one of the setting surfaces 112' and the driving control module disposed in the power receiving seat 12'. 13' is electrically connected such that the plurality of LED elements 16' can be driven by the power of the drive control module 13' to emit light.
上述LED燈具1’之構成相當簡單，因此逐漸成為目 前普遍使用之LED球泡燈結構；然，本案的發明人經長期研究後發現，現有的該LED燈具1’之構成顯現出幾個實務面的缺陷： The above-mentioned LED lamp 1' is relatively simple in composition, and thus gradually becomes the target The LED bulb lamp structure commonly used before; however, after long-term research, the inventor of the present invention found that the existing composition of the LED lamp 1' shows several practical defects:
1.製造程序無法單一化。該LED燈具1’通常必須利用人工將電路基板14’鎖固至該座體11’之設置表面112’上，其中過程無法藉由輔助制具完成，導致該LED燈具1’的製造程序無法單一化，造成製造成本無法有效壓低。 1. The manufacturing process cannot be simplistic. The LED lamp 1' usually has to manually lock the circuit substrate 14' to the setting surface 112' of the seat body 11'. The process cannot be completed by the auxiliary tool, and the manufacturing process of the LED lamp 1' cannot be single. The manufacturing costs cannot be effectively reduced.
2.散熱效果不佳。該LED燈具1’係使用電路基板14’來承載該複數個LED元件16’，使得該些LED元件16’能通過電路基板14’而與接電座12’內的驅動控制模組13’達成電性連接；然而，電路基板14’通常為玻纖板(fiberglass)，其導熱、散熱效果並不佳，因而導致該些LED元件16’工作時所產生的熱無法藉由電路基板14’而傳導至座體11’(座體11’通常為最佳的散熱材)。 2. The heat dissipation effect is not good. The LED lamp 1 ′ uses the circuit substrate 14 ′ to carry the plurality of LED elements 16 ′, so that the LED elements 16 ′ can be reached through the circuit substrate 14 ′ and the driving control module 13 ′ in the charging base 12 ′. Electrical connection; however, the circuit substrate 14' is usually a fiberglass, and the heat conduction and heat dissipation effects are not good, so that the heat generated when the LED elements 16' are operated cannot be prevented by the circuit substrate 14'. Conducted to the body 11' (the seat 11' is usually the best heat sink).
因此，本案之發明人有鑑於現有的LED燈具其構成上仍具有許多缺點與不足，故極力加以研究發明，終於研發完成本發明之一種自黏基板之貼裝方法。 Therefore, the inventors of the present invention have invented the invention in view of the fact that the existing LED lamps still have many shortcomings and disadvantages, and finally developed a self-adhesive substrate mounting method of the present invention.
本發明之主要目的，在於提供一種具有自黏基板之電子裝置之貼裝方法，其中，本發明之貼裝方法係藉由一自黏基板聯板之製作以及一貼裝制具之輔助使用，達到可 以快速地將焊接有複數個電子元件之自黏基板貼裝至任一種電子裝置之電子線路承載體的設置部之上，其製作過程不需要使用任何螺絲鎖付工具，因此能夠達到製造程序單一化、快速量產化之目的。此外，透過本發明之貼裝方法所製得的具有自黏基板之電子裝置，其因為不具有任何底部承載基板，因此其搭載的複數個電子元件工作時所產生的熱，係能夠藉由自黏基板底部的絕緣導熱黏著層而有效地傳導至電子線路承載體，最後經由電子線路承載體而將熱散逸至空氣中，達到有效散熱之目的。 The main purpose of the present invention is to provide a mounting method for an electronic device having a self-adhesive substrate, wherein the mounting method of the present invention is assisted by the fabrication of a self-adhesive substrate and a mounting tool. Reach The method of quickly mounting a self-adhesive substrate on which a plurality of electronic components are soldered to the mounting portion of an electronic circuit carrier of any electronic device does not require any screw-locking tool, thereby achieving a single manufacturing process. The purpose of chemical production and rapid mass production. In addition, since the electronic device having the self-adhesive substrate produced by the mounting method of the present invention does not have any bottom-bearing substrate, the heat generated when the plurality of electronic components mounted thereon can be operated by The insulating and thermally conductive adhesive layer on the bottom of the adhesive substrate is effectively conducted to the electronic circuit carrier, and finally the heat is dissipated into the air via the electronic circuit carrier to achieve effective heat dissipation.
因此，為了達成本發明上述之目的，本案之發明人提出一種具有自黏基板之電子裝置之貼裝方法，係包括以下主要步驟：(1)提供至少一自黏基板聯板，並於該自黏基板聯板上製作出一自黏基板；其中，該自黏基板至少包括一銅線路層與一絕緣導熱黏著層，並且該絕緣導熱黏著層連接有一離型層；(2)根據一電子裝置之一電子線路承載體的一設置部的外型，於該自黏基板聯板上將該自黏基板製作成複數個電子元件基板；(3)將複數個電子元件分別焊接至該複數個電子元件基板上的該銅線路層；(4)依序取下每一個焊接有該複數個電子元件的電子元 件基板；以及 (5)去除附於該電子元件基板上的該離型層，並藉由該絕緣導熱黏著層將該電子元件基板貼附至該電子線路承載體的該設置部之上。 Therefore, in order to achieve the above object of the present invention, the inventors of the present invention have proposed a mounting method for an electronic device having a self-adhesive substrate, which comprises the following main steps: (1) providing at least one self-adhesive substrate board, and Forming a self-adhesive substrate on the adhesive substrate board; wherein the self-adhesive substrate comprises at least a copper circuit layer and an insulating and thermally conductive adhesive layer, and the insulating and thermally conductive adhesive layer is connected with a release layer; (2) according to an electronic device a shape of a mounting portion of the electronic circuit carrier, wherein the self-adhesive substrate is formed into a plurality of electronic component substrates on the self-adhesive substrate board; (3) soldering the plurality of electronic components to the plurality of electronic components The copper circuit layer on the component substrate; (4) sequentially removing each of the electronic components soldered with the plurality of electronic components Substrate substrate; (5) removing the release layer attached to the electronic component substrate, and attaching the electronic component substrate to the mounting portion of the electronic circuit carrier by the insulating and thermally conductive adhesive layer.
<本發明> <present invention>
1‧‧‧電子裝置 1‧‧‧Electronic device
11‧‧‧電子線路承載體 11‧‧‧Electronic line carrier
12‧‧‧接電座 12‧‧‧Electrical stand
13‧‧‧自黏基板 13‧‧‧ Self-adhesive substrate
14‧‧‧電子元件 14‧‧‧Electronic components
15‧‧‧燈罩 15‧‧‧shade
130‧‧‧離型層 130‧‧‧ release layer
131‧‧‧絕緣導熱黏著層 131‧‧‧Insulation and thermal adhesion layer
132‧‧‧銅線路層 132‧‧‧ copper circuit layer
133‧‧‧上絕緣層 133‧‧‧Upper insulation
134‧‧‧印刷層 134‧‧‧Printing layer
111‧‧‧設置部 111‧‧‧Setting Department
16‧‧‧控制驅動模組 16‧‧‧Control drive module
S01~S05‧‧‧方法步驟 S01~S05‧‧‧ method steps
2‧‧‧自黏基板聯板 2‧‧‧Self-adhesive substrate board
1331‧‧‧電子元件焊接孔 1331‧‧‧Electronic component soldering holes
132a‧‧‧銅層 132a‧‧‧ copper layer
135‧‧‧彎折區 135‧‧‧Bending area
10‧‧‧框架 10‧‧‧Frame
17‧‧‧底座 17‧‧‧Base
18‧‧‧支撐架 18‧‧‧Support frame
19‧‧‧照明模組 19‧‧‧Lighting module
1A‧‧‧導光板 1A‧‧‧Light guide plate
1B‧‧‧擴散板 1B‧‧‧Diffuser
3‧‧‧貼裝制具 3‧‧‧Placement Tools
31‧‧‧基層 31‧‧‧ grassroots
32‧‧‧電子元件置入孔 32‧‧‧Electronic component insertion hole
31a‧‧‧中央制具部 31a‧‧‧Central Manufacturing Division
32a‧‧‧彎折制具部 32a‧‧‧Bending Department
33a‧‧‧電子元件置入孔 33a‧‧‧Electronic component insertion hole
133a‧‧‧下絕緣層 133a‧‧‧lower insulation
133b‧‧‧中央區 133b‧‧‧Central District
<習知> <知知>
1’‧‧‧LED燈具 1'‧‧‧LED lamps
11’‧‧‧座體 11’‧‧‧
12’‧‧‧接電座 12'‧‧‧Electrical stand
13’‧‧‧驅動控制模組 13'‧‧‧Drive Control Module
14’‧‧‧電路基板 14'‧‧‧ circuit board
15’‧‧‧燈罩 15’‧‧‧shade
16’‧‧‧LED元件 16'‧‧‧LED components
111’‧‧‧螺孔 111’‧‧‧ screw hole
112’‧‧‧設置表面 112’‧‧‧Set the surface
113’‧‧‧導線孔 113’‧‧‧Wire hole
141’‧‧‧螺絲 141’‧‧‧ screws
142’‧‧‧螺孔 142’‧‧‧ screw hole
143’‧‧‧導線 143’‧‧‧Wire
第一圖係習用的一種LED燈具的***圖；第二圖係一種具有自黏基板之電子裝置的***圖；第三圖係電子裝置之一自黏基板的結構圖；第四圖係本發明之自黏基板之貼裝方法的流程圖；第五圖係一自黏基板聯板的上視圖；第六A圖至第六F圖係自黏基板聯板的製程示意圖；第七A圖至第七F圖係自黏基板聯板的製程示意圖；第八圖係電子裝置的***圖；第九圖係自黏基板的上視圖；第十A圖係電子裝置的***圖；第十B圖係電子裝置的***圖；第十一圖係電子裝置的***圖；第十二圖係電子裝置的***圖；第十三圖係電子裝置的***圖；第十四A圖係電子裝置的***圖； 第十四B圖係電子裝置的***圖；第十五圖係一貼裝制具的立體圖；第十六圖係貼裝制具與自黏基板的側面剖視圖；第十七A圖與第十七B圖為貼裝製程示意圖；第十八A圖、第十八B圖與第十八C圖為貼裝製程示意圖；第十九圖為自黏基板的結構圖；第二十A圖至第二十D圖係自黏基板聯板的製程示意圖；第二十一圖係自黏基板的結構圖；第二十二A圖至第二十二D圖係自黏基板聯板的製程示意圖；第二十三圖係電子裝置的***圖；以及第二十四圖係電子裝置的***圖。 The first figure is an exploded view of a conventional LED lamp; the second figure is an exploded view of an electronic device having a self-adhesive substrate; the third figure is a structural view of a self-adhesive substrate of the electronic device; A flowchart of a mounting method of a self-adhesive substrate; a fifth view is a top view of a self-adhesive substrate plate; a sixth A-64th to a sixth F-line is a schematic view of a process of a self-adhesive substrate plate; The seventh F is a schematic diagram of the process of the self-adhesive substrate plate; the eighth figure is an exploded view of the electronic device; the ninth is a top view of the self-adhesive substrate; the tenth A is an exploded view of the electronic device; An explosion diagram of an electronic device; an eleventh diagram is an explosion diagram of the electronic device; a twelfth diagram is an explosion diagram of the electronic device; a thirteenth diagram is an explosion diagram of the electronic device; and a fourteenth diagram is an explosion of the electronic device Figure Figure 14B is an exploded view of the electronic device; the fifteenth diagram is a perspective view of a mounting tool; the sixteenth is a side sectional view of the mounting tool and the self-adhesive substrate; and the seventeenth A and tenth Figure 7B is a schematic diagram of the mounting process; the eighteenth A, eighteenth and eightyth Cth are schematic views of the mounting process; the nineteenth is a structural drawing of the self-adhesive substrate; The 20th D is a schematic diagram of the process of the self-adhesive substrate plate; the 21st is a structure diagram of the self-adhesive substrate; and the 22nd to the 22nd D is a process diagram of the self-adhesive substrate plate The twenty-third figure is an exploded view of the electronic device; and the twenty-fourth is an exploded view of the electronic device.
為了能夠更清楚地描述本發明所提出之一種自黏基板之貼裝方法，以下將配合圖式，詳盡說明本發明之較佳實施例。 In order to more clearly describe a method of attaching a self-adhesive substrate according to the present invention, a preferred embodiment of the present invention will be described in detail below with reference to the drawings.
於說明本發明之一種自黏基板之貼裝方法之前，先以LED球泡燈為例來說明具有自黏基板之電子裝置的相關結構。請參閱第二圖，係一種具有自黏基板之電子裝置的***圖。如第二圖所示，該電子裝置1為一LED球泡燈，且其係由一電子線路承載體11、一接電座12、一自黏基板 13、與一燈罩15所構成。 Before describing a mounting method of a self-adhesive substrate of the present invention, an LED flash bulb is taken as an example to describe a related structure of an electronic device having a self-adhesive substrate. Please refer to the second figure, which is an exploded view of an electronic device having a self-adhesive substrate. As shown in the second figure, the electronic device 1 is an LED bulb, and is composed of an electronic circuit carrier 11, a battery holder 12, and a self-adhesive substrate. 13. It is composed of a lampshade 15.
請同時參考第三圖，係該自黏基板13的結構圖。如第二圖與第三圖所示，自黏基板13之表面為焊接有複數個電子元件14之一銅線路層132，且其底面為一絕緣導熱黏著層131，並且該絕緣導熱黏著層131連接有一離型層130。自黏基板13係透過該絕緣導熱黏著層131而設於該電子線路承載體11之一設置部111之上，且銅線路層132係與該接電座12內的一控制驅動模組16達成電性連接。 通常，為了保護銅線路層132，會於銅線路層132之上進一步設置一上絕緣層133以作為線路覆蓋層；更進一步地，將一印刷層134印刷於該上絕緣層133之上，例如印刷或噴塗具反射效果的白漆，使得該印刷層134成為一光反射層。或者，當本發明之自黏基板之貼裝方法應用於其它電子裝置之上時，印刷層所具有之特定色彩也可以是綠色、黃色、或者其它美觀之色彩。 Please refer to the third figure at the same time, which is a structural diagram of the self-adhesive substrate 13. As shown in the second and third figures, the surface of the self-adhesive substrate 13 is a copper circuit layer 132 soldered with a plurality of electronic components 14, and the bottom surface thereof is an insulating and thermally conductive adhesive layer 131, and the insulating and thermally conductive adhesive layer 131 A release layer 130 is attached. The self-adhesive substrate 13 is disposed on the one portion 111 of the electronic circuit carrier 11 through the insulating and thermally conductive adhesive layer 131, and the copper circuit layer 132 is connected to a control driving module 16 in the power receiving base 12. Electrical connection. Generally, in order to protect the copper wiring layer 132, an upper insulating layer 133 is further disposed on the copper wiring layer 132 as a wiring covering layer; further, a printing layer 134 is printed on the upper insulating layer 133, for example, for example. The white lacquer having a reflective effect is printed or sprayed such that the printed layer 134 becomes a light reflecting layer. Alternatively, when the mounting method of the self-adhesive substrate of the present invention is applied to other electronic devices, the specific color of the printed layer may be green, yellow, or other beautiful colors.
接著，便可開始介紹本發明之一種自黏基板之貼裝方法。請參閱第四圖，係本發明之自黏基板之貼裝方法的流程圖；並請同時參閱第五圖，係一自黏基板聯板的上視圖。如第四圖與第五圖所示，該貼裝方法是首先執行步驟(S01)，提供至少一自黏基板聯板2，並於該自黏基板聯板2上製作出一自黏基板13；如第三圖所繪示的自黏基板13的分解圖，該自黏基板13至少包括一銅線路層132與一絕 緣導熱黏著層131，並且該絕緣導熱黏著層131連接有一離型層130。並且，如第三圖與第五圖所示，該銅線路層132表面覆蓋有一上絕緣層133，且該上絕緣層133具有複數個電子元件焊接孔1331，用以露出銅線路層132所具有的複數個焊點。再者，上絕緣層133之上更覆蓋有一印刷層134。 Next, a method of attaching a self-adhesive substrate of the present invention can be started. Please refer to the fourth figure, which is a flow chart of the mounting method of the self-adhesive substrate of the present invention; and also refers to the fifth figure, which is a top view of a self-adhesive substrate board. As shown in the fourth and fifth figures, the mounting method first performs the step (S01), provides at least one self-adhesive substrate board 2, and forms a self-adhesive substrate 13 on the self-adhesive substrate board 2. As shown in the third figure, the self-adhesive substrate 13 includes at least a copper circuit layer 132 and a The edge is thermally conductively attached to the layer 131, and the insulating and thermally conductive adhesive layer 131 is connected to the release layer 130. Moreover, as shown in the third and fifth figures, the copper circuit layer 132 is covered with an upper insulating layer 133, and the upper insulating layer 133 has a plurality of electronic component soldering holes 1331 for exposing the copper wiring layer 132. Multiple solder joints. Furthermore, the upper insulating layer 133 is further covered with a printed layer 134.
繼續地參閱第六A圖至第六F圖所繪示的自黏基板聯板2的製程示意圖，以及第七A圖至第七F圖所繪示的製程示意圖。其中，第六A圖至第六F圖係以側面剖視的方式繪出該製程示意圖，且第七A圖至第七F圖係以上視的方式繪出該製程示意圖。如第六A圖與第七A圖所示，步驟(S01)所述的自黏基板聯板2，其製作方式係首先提供一上絕緣層133，並對該上絕緣層133加工，使得該上絕緣層133具有複數個電子元件焊接孔1331；其中，若以LED球泡燈為例，電子元件焊接孔1331指的是LED元件焊接孔。接著，如第六B圖與第七B圖所示，將該上絕緣層133與一銅層132a貼合，然後如第六C圖所示將該銅層132a加工成該銅線路層132。繼續地如第六D圖所示，將一印刷層134印刷於該上絕緣層133之上。最後，如第六E圖與第七C圖所示，將該銅線路層132與該絕緣導熱黏著層131貼合，以獲得該自黏基板聯板2。 Continuing to refer to the process schematic diagram of the self-adhesive substrate board 2 illustrated in FIGS. 6A to 6F, and the process diagrams illustrated in FIGS. 7A to 7F. 6A to 6F are schematic views of the process are depicted in a side cross-sectional view, and the process diagrams are drawn in the manner of the above-mentioned seventh to seventh F drawings. As shown in FIG. 6A and FIG. 7A, the self-adhesive substrate board 2 according to the step (S01) is formed by first providing an upper insulating layer 133 and processing the upper insulating layer 133 so that the The upper insulating layer 133 has a plurality of electronic component soldering holes 1331; wherein, in the case of the LED bulb, the electronic component soldering holes 1331 refer to the LED component soldering holes. Next, as shown in FIGS. 6B and 7B, the upper insulating layer 133 is bonded to a copper layer 132a, and then the copper layer 132a is processed into the copper wiring layer 132 as shown in FIG. Continuing as shown in FIG. 6D, a printed layer 134 is printed over the upper insulating layer 133. Finally, as shown in FIG. 6E and FIG. 7C, the copper wiring layer 132 is bonded to the insulating and thermally conductive adhesive layer 131 to obtain the self-adhesive substrate bonding plate 2.
完成該自黏基板聯板2之製造後，如第四圖與第七 D圖所示，本發明之貼裝方法係接著執行步驟(S02)，根據一電子裝置1之一電子線路承載體11的一設置部111的外型，於該自黏基板聯板2上將該自黏基板13製作成複數個適當形狀的電子元件基板。舉例來說，第二圖所示的電子裝置1為一LED球泡燈，且其電子線路承載體11之設置部111為圓形；因此，所述電子元件基板的適當形狀便是圓形。 After the manufacture of the self-adhesive substrate board 2, as shown in the fourth and seventh As shown in FIG. D, the mounting method of the present invention is followed by the step (S02). According to the appearance of a setting portion 111 of the electronic circuit carrier 11 of the electronic device 1, the self-adhesive substrate board 2 will be The self-adhesive substrate 13 is formed into a plurality of electronic component substrates having appropriate shapes. For example, the electronic device 1 shown in the second figure is an LED bulb, and the setting portion 111 of the electronic circuit carrier 11 is circular; therefore, the appropriate shape of the electronic component substrate is circular.
如第八圖繪出的電子裝置的***圖所示，所述電子裝置1為一全周光LED燈具，則電子線路承載體11之設置部111係為一360°的柱體(圓形或者多角形)；此時，如第九圖所繪出的自黏基板13的上視圖，自黏基板13係被切割成具有一個中央區133b與複數個彎折區135的電子元件基板；其中，該中央區133b係對應地設置在柱體狀的設置部111的頂部表面，且該複數個彎折區135係於下折後貼附於柱體狀的設置部111的側邊表面(如第八圖所示)。 As shown in the exploded view of the electronic device depicted in FIG. 8 , the electronic device 1 is a full-circumference LED lamp, and the setting portion 111 of the electronic circuit carrier 11 is a 360° cylinder (circular or Polygon); at this time, as shown in the ninth drawing, the self-adhesive substrate 13 is cut into an electronic component substrate having a central portion 133b and a plurality of bending regions 135; The central portion 133b is correspondingly disposed on the top surface of the column-shaped installation portion 111, and the plurality of bending regions 135 are attached to the side surface of the cylindrical portion 111 after being folded down (eg, Figure 8).
或者，如第十A圖繪出的電子裝置的***圖所示，所述電子裝置1為一LED日光燈，則電子線路承載體11之設置部111係為一長形設置面；此時，對應於該長形設置面，自黏基板13(包括絕緣導熱黏著層131、銅線路層132與上絕緣層133)亦被切割成長形狀，進而被對應地設置在電子線路承載體11的設置部111之上。 Alternatively, as shown in the exploded view of the electronic device depicted in FIG. 10A, the electronic device 1 is an LED fluorescent lamp, and the setting portion 111 of the electronic circuit carrier 11 is an elongated setting surface; The self-adhesive substrate 13 (including the insulating and thermally conductive adhesive layer 131, the copper wiring layer 132 and the upper insulating layer 133) is also cut into a long shape on the elongated mounting surface, and is correspondingly disposed in the setting portion 111 of the electronic circuit carrier 11 Above.
此外，如第十B圖繪出的電子裝置的立體圖所示， 所述電子裝置1為一LED格柵燈，且該LED檯燈包括一框架10、多個電子線路承載體11與一擴散板1B；其中，該電子線路承載體11為凹谷狀燈罩(lighting unit housing)，且其底面為一方形狀設置部111；此時，對應於該方形狀的設置部111，自黏基板13(包括絕緣導熱黏著層131、銅線路層132與上絕緣層133亦被切割成方形，進而被對應地設置在該設置部111之上。 In addition, as shown in the perspective view of the electronic device depicted in FIG. The electronic device 1 is an LED grid lamp, and the LED table lamp comprises a frame 10, a plurality of electronic circuit carriers 11 and a diffusion plate 1B; wherein the electronic circuit carrier 11 is a lighting unit The bottom surface is a one-side shape setting portion 111; at this time, the self-adhesive substrate 13 (including the insulating and thermally conductive adhesive layer 131, the copper wiring layer 132, and the upper insulating layer 133) is also cut corresponding to the square-shaped mounting portion 111. The square shape is further provided correspondingly on the setting portion 111.
另外，如第十一圖繪出的電子裝置的立體圖所示，所述電子裝置1為一LED檯燈，且該LED檯燈包括一底座17、一支撐架18與一照明模組19；其中，該照明模組19之電子線路承載體11的設置部111係為一方形設置面；此時，對應於該方形設置面，自黏基板13(包括絕緣導熱黏著層131、銅線路層132與上絕緣層133亦被切割成方形，進而被對應地設置在該設置部111之上。 In addition, as shown in the perspective view of the electronic device, the electronic device 1 is an LED table lamp, and the LED table lamp includes a base 17, a support frame 18 and a lighting module 19; The setting portion 111 of the electronic circuit carrier 11 of the lighting module 19 is a square setting surface; at this time, the self-adhesive substrate 13 (including the insulating and thermally conductive adhesive layer 131, the copper wiring layer 132 and the upper insulating layer) corresponding to the square setting surface The layer 133 is also cut into square shapes and is correspondingly disposed above the setting portion 111.
如第十二圖繪出的電子裝置的立體圖所示，所述電子裝置1為一車用LED燈，且該車用LED燈包括一(散熱)電子線路承載體11；其中，該電子線路承載體11之一設置部111係為一外凸柱體；此時，對應於該外凸柱體，自黏基板13(包括絕緣導熱黏著層131、銅線路層132與上絕緣層133亦被切割成適當的形狀，進而被對應地設置在該設置部111之上。 As shown in the perspective view of the electronic device depicted in FIG. 12, the electronic device 1 is a vehicle LED lamp, and the vehicle LED lamp includes a (heat dissipation) electronic circuit carrier 11; wherein the electronic circuit carrier The one portion 111 of the body 11 is an outer convex cylinder; at this time, the self-adhesive substrate 13 (including the insulating and thermally conductive adhesive layer 131, the copper wiring layer 132 and the upper insulating layer 133 is also cut corresponding to the outer convex pillar). The appropriate shape is further provided correspondingly on the setting portion 111.
再者，如第十三圖繪出的電子裝置的***圖所示， 所述電子裝置1為一LED環形燈，且該LED環形燈包括一電子線路承載體11、一導光板1A與一擴散板1B；其中，該電子線路承載體11之一設置部111係為一環形設置面；此時，對應於該環形設置面，自黏基板13(包括絕緣導熱黏著層131、銅線路層132與上絕緣層133亦被切割成帶狀並進一步地繞成環形，進而被對應地設置在該設置部111之上。 Furthermore, as shown in the exploded view of the electronic device depicted in FIG. The electronic device 1 is an LED ring lamp, and the LED ring lamp includes an electronic circuit carrier 11 , a light guide plate 1A and a diffuser plate 1B. The one portion 111 of the electronic circuit carrier 11 is a ring. At this time, corresponding to the annular setting surface, the self-adhesive substrate 13 (including the insulating and thermally conductive adhesive layer 131, the copper wiring layer 132 and the upper insulating layer 133 is also cut into a strip shape and further wound into a ring shape, thereby being Correspondingly, it is disposed above the setting portion 111.
此外，如第十四A圖繪出的電子裝置的***圖所示，所述電子裝置1為一LED背光模組，且該LED背光模組之電子線路承載體11係直接作為一平板電腦之背板(鋁蓋板)。其中，該電子線路承載體11之一設置部111係為一平面；此時，對應於該平面，自黏基板13(包括絕緣導熱黏著層131、銅線路層132與上絕緣層133亦被切割成複數個長條狀，進而以陣列形式被對應地設置在該設置部111之上。於此，進一步補充說明的是，第十四圖繪出的長條狀的自黏基板13與該複數個電子元件14之組合，也可以稱為LED燈條。並且，除了上述LED燈具的示範性應用例以外，本發明之自黏基板之貼裝方法也可以應用在其它各種LED照明裝置，例如：LED路燈、LED筒燈、LED天花板燈、LED燭泡燈、LED球泡燈、LED燈管、LED節能燈、LED藝術燈、或LED配飾燈。 In addition, as shown in the exploded view of the electronic device depicted in FIG. 14A, the electronic device 1 is an LED backlight module, and the electronic circuit carrier 11 of the LED backlight module is directly used as a tablet computer. Back plate (aluminum cover). Wherein, the one portion 111 of the electronic circuit carrier 11 is a flat surface; at this time, the self-adhesive substrate 13 (including the insulating and thermally conductive adhesive layer 131, the copper wiring layer 132 and the upper insulating layer 133 is also cut corresponding to the plane). The plurality of strips are formed in an array, and are correspondingly disposed on the setting portion 111. Here, further, the strip-shaped self-adhesive substrate 13 depicted in FIG. The combination of the electronic components 14 may also be referred to as an LED light bar. Moreover, in addition to the exemplary application examples of the above LED lamps, the mounting method of the self-adhesive substrate of the present invention can also be applied to other various LED lighting devices, for example: LED street lights, LED downlights, LED ceiling lights, LED candle lights, LED bulbs, LED tubes, LED energy-saving lamps, LED art lights, or LED accessory lights.
如第十四B圖繪出的電子裝置的***圖所示，所述 電子裝置1為一LED背光模組，且該LED背光模組之電子線路承載體11為一ㄇ形罩體。其中，該電子線路承載體11之一設置部111係為一平面；此時，對應於該平面，自黏基板13(包括絕緣導熱黏著層131、銅線路層132與上絕緣層133亦被切割成長條狀，進而以類似燈條的形式而被對應地設置在該設置部111之上。 As shown in the exploded view of the electronic device depicted in FIG. 14B, The electronic device 1 is an LED backlight module, and the electronic circuit carrier 11 of the LED backlight module is a dome-shaped cover. Wherein, the one portion 111 of the electronic circuit carrier 11 is a flat surface; at this time, the self-adhesive substrate 13 (including the insulating and thermally conductive adhesive layer 131, the copper wiring layer 132 and the upper insulating layer 133 is also cut corresponding to the plane). The strip is formed in a strip shape and is correspondingly disposed on the setting portion 111 in the form of a light bar.
接著，如第四圖、第六F圖與第七E圖所示，於步驟(S03)中，係將複數個電子元件14分別焊接至該複數個電子元件基板上的該銅線路層132。完成焊接有複數個電子元件14之電子元件基板的製作後，可先將整個自黏基板聯板2送至一測試區，以對每一個電子元件基板進行電性測試。若以LED燈具為例說明，前述電子元件14指的是LED元件，且電性測試指的是點燈測試。 Next, as shown in FIG. 4, FIG. 6F and FIG. EE, in step (S03), a plurality of electronic components 14 are soldered to the copper wiring layer 132 on the plurality of electronic component substrates, respectively. After the fabrication of the electronic component substrate having the plurality of electronic components 14 is completed, the entire self-adhesive substrate bonding board 2 can be sent to a test area to perform electrical testing on each of the electronic component substrates. If the LED lamp is taken as an example, the aforementioned electronic component 14 refers to the LED component, and the electrical test refers to the lighting test.
繼續地，如第四圖與第七F圖所示，便可接著 執行步驟(S04)，依序取下每一個焊接有該複數個電子元件14的電子元件基板；其中，該電子元件基板包含自黏基板13與複數個電子元件14，且自黏基板13的底部還連接有離型層130。如此，於步驟(S05)中，只要去除附於該自黏基板13底部的離型層130，便可藉由該絕緣導熱黏著層131將自黏基板13貼附至任一電子裝置1的電子線路承載體11之設置部111之上(電子裝置1的應用例可參考第八圖至第十四圖)。 Continuing, as shown in the fourth and seventh F, Step (S04), sequentially removing each of the electronic component substrates to which the plurality of electronic components 14 are soldered; wherein the electronic component substrate comprises the self-adhesive substrate 13 and the plurality of electronic components 14, and the bottom of the self-adhesive substrate 13 A release layer 130 is also attached. Thus, in the step (S05), the self-adhesive substrate 13 can be attached to the electronic device of any electronic device 1 by the insulating and thermally conductive adhesive layer 131 as long as the release layer 130 attached to the bottom of the self-adhesive substrate 13 is removed. The setting portion 111 of the line carrier 11 is above (the application example of the electronic device 1 can be referred to the eighth to fourteenth drawings).
關於前述步驟(S05)，其可以由工程人員手工去除該離型層130之後，再將自黏基板13貼附至任電子裝置1的電子線路承載體11的設置部111之上。並且，為了利於量產製作，本發明之貼裝方法同時提供利用一貼裝制具之輔助來完成步驟(S05)。如第十五圖所繪出的貼裝制具3的立體圖以及第十六圖所繪出的貼裝制具3與自黏基板13的側面剖視圖，利用貼裝制具3之輔助來完成步驟(S05)係首先提供一貼裝制具3，其中該貼裝制具3包括一基層31，且基層31上挖設有複數個電子元件置入孔32。接著，將取下的該電子元件基板(包含自黏基板13與複數個電子元件14翻面置於該基層31之上，使得該自黏基板13上的複數個電子元件14分別嵌入該複數個電子元件置入孔32之中。然後，如第十七A圖所繪出的貼裝製程示意圖，去除附於該自黏基板13底部的離型層130，並將該電子裝置1的電子線路承載體11翻面置於該自黏基板13的底部，使得該絕緣導熱黏著層131貼附至電子線路承載體11的該設置部111之上。最後，如第十七B圖所繪出的貼裝製程示意圖，移除該貼裝制具3，便完成將則該電子元件基板(包含自黏基板13與複數個電子元件14)設置於該電子裝置1的電子線路承載體11的設置部111之上。(第十七B圖所繪示之電子線路承載體11為LED球泡燈之散熱燈座)。 Regarding the foregoing step (S05), the self-adhesive substrate 13 may be attached to the setting portion 111 of the electronic circuit carrier 11 of any electronic device 1 after the release layer 130 is manually removed by an engineer. Moreover, in order to facilitate mass production, the mounting method of the present invention simultaneously provides the step of completing the step (S05) with the aid of a mounting tool. A perspective view of the mounting tool 3 as depicted in FIG. 15 and a side cross-sectional view of the mounting tool 3 and the self-adhesive substrate 13 depicted in the sixteenth embodiment, with the aid of the mounting tool 3 to complete the steps (S05) First, a mounting tool 3 is provided, wherein the mounting tool 3 includes a base layer 31, and a plurality of electronic component insertion holes 32 are dug in the base layer 31. Next, the removed electronic component substrate (including the self-adhesive substrate 13 and the plurality of electronic components 14 is placed on the base layer 31 such that the plurality of electronic components 14 on the self-adhesive substrate 13 are respectively embedded in the plurality of electronic components 14 The electronic component is placed in the hole 32. Then, as shown in FIG. 17A, the release layer 130 attached to the bottom of the self-adhesive substrate 13 is removed, and the electronic circuit of the electronic device 1 is removed. The carrier 11 is placed on the bottom of the self-adhesive substrate 13 such that the insulating and thermally conductive adhesive layer 131 is attached to the mounting portion 111 of the electronic circuit carrier 11. Finally, as depicted in FIG. The mounting process diagram removes the mounting tool 3, and the electronic component substrate (including the self-adhesive substrate 13 and the plurality of electronic components 14) is disposed in the setting portion of the electronic circuit carrier 11 of the electronic device 1. Above the 111. (The electronic circuit carrier 11 shown in FIG. 17B is a heat sink of the LED bulb).
此外，本發明之貼裝方法又提供另外一種利用貼裝 制具之輔助方式來完成步驟(S05)。如第十八A圖所繪出的貼裝製程示意圖，利用貼裝制具3之輔助來完成步驟(S05)係首先提供一貼裝制具3，其中該貼裝制具包括一中央制具部31a與複數個彎折制具部32a，且該複數個彎折制具部32a係與該中央制具部31a樞接；並且，該中央制具部31a與該複數個彎折制具部32a之上係挖設有複數個LED置入孔33a。接著，如第十八A圖所繪出的貼裝製程示意圖，將取下的該電子元件基板(包含自黏基板13與複數個電子元件14)翻面置於該中央制具部31a與該複數個彎折制具部32a之上，使得該電子元件基板的複數個電子元件14分別嵌入該複數個電子元件置入孔33a之中。然後，如第十八B圖所繪出的貼裝製程示意圖，去除附於該電子元件基板上的該離型層130，並將該電子線路承載體11翻面置於該電子元件基板上，使得該自黏基板13底部的該絕緣導熱黏著層131貼附至電子線路承載體11的該設置部111之上。最後，移除該貼裝制具3，便完成將則該電子元件基板(包含自黏基板13與複數個電子元件14)設置於該電子裝置1的電子線路承載體11的設置部111之上。(第十八C圖所繪示之電子線路承載體11為全周光LED球泡燈之燈座)。 In addition, the mounting method of the present invention provides another use of mounting The auxiliary method of the tool is used to complete the step (S05). As shown in FIG. 18A, the mounting process diagram is completed by using the aid of the mounting tool 3 (S05). First, a mounting tool 3 is provided, wherein the mounting tool comprises a central tooling. a portion 31a and a plurality of bending device portions 32a, and the plurality of bending device portions 32a are pivotally connected to the central tool portion 31a; and the central tool portion 31a and the plurality of bending device portions A plurality of LED insertion holes 33a are provided on the upper portion of 32a. Next, as shown in FIG. 18A, the electronic component substrate (including the self-adhesive substrate 13 and the plurality of electronic components 14) is turned over and placed on the central tool portion 31a. The plurality of electronic component boards 14 are embedded in the plurality of electronic component mounting holes 33a. Then, as shown in FIG. 18B, the release layer 130 attached to the electronic component substrate is removed, and the electronic circuit carrier 11 is turned over on the electronic component substrate. The insulating and thermally conductive adhesive layer 131 at the bottom of the self-adhesive substrate 13 is attached to the mounting portion 111 of the electronic circuit carrier 11 . Finally, the mounting device 3 is removed, and the electronic component substrate (including the self-adhesive substrate 13 and the plurality of electronic components 14) is disposed on the setting portion 111 of the electronic circuit carrier 11 of the electronic device 1. . (The electronic circuit carrier 11 shown in FIG. 18C is a lamp holder of a full-period LED bulb lamp).
如此，上述說明係已清楚、完整說明了本發明所提供的一種具有自黏基板之電子裝置之貼裝方法。然而，必 須再行補充的是，該自黏基板13的結構並不限於第三圖所繪出的結構(至少包含絕緣導熱黏著層131、銅線路層132與上絕緣層133)；於不同的應用中，自黏基板13的另一實施例的結構圖是繪示於第十九圖之中。其中，自黏基板13至少包含印刷層134、銅線路層132、下絕緣層133a、與絕緣導熱黏著層131。因此，為了因應不同的自黏基板13結構，前述步驟(S01)之細部步驟也必須調整如下：如第二十A圖所繪示的製程示意圖，首先的細部步驟係提供一下絕緣層133a與一銅層132a，並將該下絕緣層133a與該銅層132a貼合；接著，如第二十B圖所繪示的製程示意圖，將該銅層132a加工成該銅線路層132。然後，如第二十C圖所繪示的製程示意圖，將該銅層132a加工成銅線路層132，並將一印刷層134印刷於該銅線路層132之上。繼續地，如第二十D圖所繪示的製程示意圖，將該下絕緣層133a與該絕緣導熱黏著層131貼合。 Thus, the above description has clearly and completely explained the mounting method of an electronic device having a self-adhesive substrate provided by the present invention. However, it must It should be added that the structure of the self-adhesive substrate 13 is not limited to the structure depicted in the third figure (including at least the insulating and thermally conductive adhesive layer 131, the copper wiring layer 132 and the upper insulating layer 133); in different applications. A structural view of another embodiment of the self-adhesive substrate 13 is shown in the nineteenth diagram. The self-adhesive substrate 13 includes at least a printed layer 134, a copper wiring layer 132, a lower insulating layer 133a, and an insulating and thermally conductive adhesive layer 131. Therefore, in order to respond to the different self-adhesive substrate 13 structure, the detailed steps of the foregoing step (S01) must also be adjusted as follows: As shown in the twentieth embodiment, the first detailed step provides an insulating layer 133a and a The copper layer 132a is bonded to the copper layer 132a. Then, the copper layer 132a is processed into the copper wiring layer 132 as shown in FIG. Then, as shown in the process diagram of FIG. 10C, the copper layer 132a is processed into a copper wiring layer 132, and a printed layer 134 is printed on the copper wiring layer 132. Continuing, the lower insulating layer 133a is bonded to the insulating and thermally conductive adhesive layer 131 as shown in the twentieth diagram.
此外，必須再行補充的是，該自黏基板13的結構並不限於第三圖與第十九圖所繪出的結構；於不同的應用中，自黏基板13的另一實施例的結構圖是繪示於第二十一圖之中。其中，自黏基板13至少包含印刷層134、上絕緣層133、銅線路層132、下絕緣層133a、與絕緣導熱黏著層131。因此，為了因應不同的自黏基板13結構，前述步驟(S01)之細部步驟也可以調整如下： 如第二十二A圖所繪示的製程示意圖，首先的細部步驟係提供一下絕緣層133a與一銅層132a，並將該下絕緣層133a與該銅層132a貼合；接著，如第二十二B圖所繪示的製程示意圖，將該銅層132a加工成該銅線路層132；然後，如第二十二C圖所繪示的製程示意圖，將提供一上絕緣層133並對該上絕緣層133加工，並將該上絕緣層133與一銅層132a貼合。最後，如第二十二D圖所繪示的製程示意圖，將一印刷層134印刷於該上絕緣層133之上，並將該下絕緣層133a與該絕緣導熱黏著層131貼合。 In addition, it must be added that the structure of the self-adhesive substrate 13 is not limited to the structures depicted in the third and nineteenth embodiments; in another application, the structure of another embodiment of the self-adhesive substrate 13 The figure is shown in the twenty-first figure. The self-adhesive substrate 13 includes at least a printed layer 134, an upper insulating layer 133, a copper wiring layer 132, a lower insulating layer 133a, and an insulating and thermally conductive adhesive layer 131. Therefore, in order to respond to the different self-adhesive substrate 13 structure, the detailed steps of the foregoing step (S01) can also be adjusted as follows: As shown in the process diagram of FIG. 22A, the first detailed step provides an insulating layer 133a and a copper layer 132a, and the lower insulating layer 133a is bonded to the copper layer 132a; then, as in the second 12B, the copper layer 132a is processed into the copper circuit layer 132; then, as shown in the circuit diagram of FIG. 22C, an upper insulating layer 133 is provided and The upper insulating layer 133 is processed, and the upper insulating layer 133 is bonded to a copper layer 132a. Finally, as shown in the process diagram of FIG. 22D, a printed layer 134 is printed on the upper insulating layer 133, and the lower insulating layer 133a is bonded to the insulating and thermally conductive adhesive layer 131.
於此，必須特別說明的是，上述關於本發明之各種應用例都是以LED發光裝置為主，然而，本發明之貼裝方法也可以應用在其它電子裝置之中。請參閱第二十三圖，係具有自黏基板之電子裝置的***圖，其中，第二十三圖所示之電子裝置1為一智慧型手機，其各種電子元件14係焊接於自黏基板13。如圖所示，自黏基板13至少包含絕緣導熱黏著層131、銅線路層132與上絕緣層133，且該絕緣導熱黏著層131、銅線路層132與上絕緣層133係貼附於該電子裝置(智慧型手機)之背殼的內表面之上；亦即，該背殼在此作為電子線路承載體11，且其內表面在此作為該設置部111。 Here, it must be particularly noted that the above various application examples of the present invention are mainly LED light-emitting devices, however, the mounting method of the present invention can also be applied to other electronic devices. Please refer to the twenty-third figure, which is an exploded view of an electronic device having a self-adhesive substrate. The electronic device 1 shown in the twenty-third figure is a smart phone, and various electronic components 14 are soldered to the self-adhesive substrate. 13. As shown in the figure, the self-adhesive substrate 13 includes at least an insulating and thermally conductive adhesive layer 131, a copper wiring layer 132 and an upper insulating layer 133, and the insulating and thermally conductive adhesive layer 131, the copper wiring layer 132 and the upper insulating layer 133 are attached to the electron. Above the inner surface of the back shell of the device (smartphone); that is, the back shell serves here as the electronic circuit carrier 11 and the inner surface thereof serves as the arrangement 111 here.
請參閱第二十四圖，係具有自黏基板之電子裝置的***圖，其中，第二十四圖所示之電子裝置1為一平板 電腦，其各種電子元件14係焊接於自黏基板13。如圖所示，自黏基板13至少包含絕緣導熱黏著層131、銅線路層132與上絕緣層133，且該絕緣導熱黏著層131、銅線路層132與上絕緣層133係貼附於該電子裝置1(平板電腦)之背殼的內表面之上；亦即，該背殼在此作為電子線路承載體11，且其內表面在此作為該設置部111。 Referring to FIG. 24, an exploded view of an electronic device having a self-adhesive substrate, wherein the electronic device 1 shown in FIG. The computer has various electronic components 14 soldered to the self-adhesive substrate 13. As shown in the figure, the self-adhesive substrate 13 includes at least an insulating and thermally conductive adhesive layer 131, a copper wiring layer 132 and an upper insulating layer 133, and the insulating and thermally conductive adhesive layer 131, the copper wiring layer 132 and the upper insulating layer 133 are attached to the electron. Above the inner surface of the back shell of the device 1 (tablet); that is, the back shell serves here as the electronic circuit carrier 11 and the inner surface thereof serves here as the arrangement 111.
於此，必須特別說明的是，關於本發明之貼裝方法於第二十三圖所示之智慧型手機以及第二十四圖所示之平板電腦之應用，其最主要的功效係藉由將各種電子元件14設於自黏基板13之上並同時將自黏基板13直接黏貼於電子裝置1之背殼的方式，使得該些電子元件14工作時所產生的熱能夠直接地透過自黏基板13傳導至背殼，然後由背殼直接將熱散逸至大氣之中。 Therefore, it should be particularly noted that the most important function of the mounting method of the present invention is the smart phone of the twenty-third figure and the tablet computer of the twenty-fourth figure. The various electronic components 14 are disposed on the self-adhesive substrate 13 and the self-adhesive substrate 13 is directly adhered to the back shell of the electronic device 1 so that the heat generated by the electronic components 14 can directly pass through the self-adhesive. The substrate 13 is conducted to the back shell, and then the heat is directly dissipated into the atmosphere by the back shell.
如此，上述係已完整且清楚地說明本發明之自黏基板之貼裝方法，並且，經由上述，吾人可以得知本發明係具有下列之優點： Thus, the above-described system has completely and clearly explained the mounting method of the self-adhesive substrate of the present invention, and, through the above, we can know that the present invention has the following advantages:
1.相較於傳統的LED燈具的製造方法，本發明係藉由一自黏基板聯板2之製作以及一貼裝制具3之輔助使用，達到可以快速地將焊接有複數個電子元件14之自黏基板13貼裝至任一種電子裝置1之電子線路承載體11的設置部111之上，其製作過程不需要使用任何螺絲鎖付工具，因此能夠達到製造程序單一化、快速量產化之目的。 1. Compared with the conventional manufacturing method of the LED lamp, the present invention can quickly weld a plurality of electronic components 14 by the manufacture of a self-adhesive substrate board 2 and the auxiliary use of a mounting tool 3. The self-adhesive substrate 13 is mounted on the mounting portion 111 of the electronic circuit carrier 11 of any of the electronic devices 1. The manufacturing process does not require any screw-locking tool, so that the manufacturing process can be simplified and mass-produced. The purpose.
2.承上述第1點，此外，透過本發明之貼裝方法所製得的具有自黏基板之電子裝置1，其因為不具有任何電路基板，因此其搭載的複數個電子元件14工作時所產生的熱，係能夠藉由自黏基板底部的絕緣導熱黏著層131而有效地傳導至電子線路承載體11的設置部111，最後經由電子線路承載體11而將熱散逸至空氣中，達到有效散熱之目的。 2. According to the first point described above, the electronic device 1 having the self-adhesive substrate produced by the mounting method of the present invention does not have any circuit substrate, so that the plurality of electronic components 14 mounted thereon are operated. The generated heat can be effectively conducted to the installation portion 111 of the electronic circuit carrier 11 by the insulating and thermally conductive adhesive layer 131 at the bottom of the self-adhesive substrate, and finally the heat is dissipated into the air via the electronic circuit carrier 11 to be effective. The purpose of heat dissipation.
必須加以強調的是，上述之詳細說明係針對本發明可行實施例之具體說明，惟該實施例並非用以限制本發明之專利範圍，凡未脫離本發明技藝精神所為之等效實施或變更，均應包含於本案之專利範圍中。 It is to be understood that the foregoing detailed description of the embodiments of the present invention is not intended to Both should be included in the scope of the patent in this case.
S01~S05‧‧‧方法步驟 S01~S05‧‧‧ method steps
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