ivuyt)454Ivuyt)454
五、新型說明： 【新型所屬之技術領域】 & 本新型與一種具有感應線圈的薄型電路板有關。具體 二之，其係關於一種考量吸波特性之感應線圈設計的薄型 電路板。 【先前技術】 射頻辨識技術(radio frequency identification technology， RFID)，是一種透過電磁波訊號辨識特定目標並讀寫相關資 料的通k技術。射頻辨識元件的運作原理係利用一外部的 ^頻辨識讀取器（RFID reader)發射電磁波觸動處於感應範 圍内的射頻辨識元件(如射頻辨識標籤RFIDtag)，該射頻辨 識π件會因電磁感應產生電流來供應其上的射頻辨識晶片 運作，繼而發出電磁波回應該感應器達成射頻辨識之效 由於是透過電磁感應方式來進行辨識，射頻辨識系統(如 嶠取器reader)與辨識目標（如射頻辨識標籤）之間無須建立 任何機械性或光學性的接觸。射頻辨識具有許多優點，諸 如有效的辨識距離較長、可儲存傳送大量的資訊、辨識速 度快、可重複改寫標籤中的資料、安全性較佳等，故已廣 為業界用來取代傳統的辨識條碼(bar c〇de)。現今射頻辨^ 元件的應用擴及零售物流供應、資產追蹤、及等 多個領域。 〜哥 如第-圖所π ’其為習知技術中一典型具有感應線圈 的射頻辨識元件組成結構截面圖。如圖所示，典型的 射頻辨識元件⑽主要係由-軟性基板⑻、感應線圈 103、金屬佈線層105、及一射頻辨識晶片1〇7等四個部件 3 M396454 所構成’其中習知軟性基板1〇1不具吸收電磁波之特性， 所以感應線圈103之設計無須考量軟性基板101的磁通特 性。該軟性基板101係作為射頻辨識元件100各部件設置 之結構基材，其多使用 PET(polyethylene terephthalate，聚 對苯二甲二乙酯）等軟性材質形成，而具有質輕、可撓、易 於攜帶等優點。軟性基板101的上表面的感應線圈，用 來接收由外部射頻辨識讀取器所發出的電磁波，以藉由電 磁感應方式產生電流。軟性基板1〇1的下表面形成有一金 屬佈線層105’其會透過互連結構1〇4與感應線圈1〇3電性 連接。該金屬佈線層1〇5亦含有射頻辨識元件1〇〇的電路 佈線區域’使射頻辨識晶片1〇7電性連接感應線圈103。 依先前技術，軟性基板101中形成有數個連通上下 面的通孔109來讓軟性基板1〇1下表面的金屬佈線層 與軟性基板101上表面的射頻辨識晶片107產生電性 匕，感應線圈103因電磁感應生成的電流會經由金 屬佈線層105傳遞到射頻辨識晶片1〇7供其運作， 山 應等的射頻辨識讀取器，完成射頻辨識或資料1 因使用電磁波感應機制，射頻辨識元件 =:_用環境相當敏感，尤其是貼; 金屬或液體干擾，導致感應訊號讀 =射頻辨識元件方面特別嚴重。i = 被動式射頻辨識標籤的應用方面，如第一圖所示， 4 M396454 射頻辨識元件100與金属衣 _e s一或稱ΐ屬為==會二:感應, 反射波、或/及電磁生成表面波、空腔共振波、 然，-般業界象，避免感應訊號讀取不良。 識元件製作成本:加應广片會，不少的射頻辨 射頻辨識元件的薄型化變^ =片具有一疋的厚度’會使 件的不同感應線圈再者，因應射頻辨識元 響其作用效果。於此，本片必選用以免影 #之際，其感應線圈設計即考量板製 貼片之困擾，俾對於選用磁感應 設計中，辨r件能應用到薄型化 構。 種/、有吸波作用的薄型電路板結 【新型内容】 於上述習知技術之缺點，本新型揭露了—種新穎的 薄^電路板。本新型薄型電路板的基板係以混有吸波粉 :又η才質製成’使基板具有吸收電磁波之特性，同 =兼具-般軟性電路板之特性，可在_電路板 出射頻辨識元件所需之增層與電路構造。 搞型一態樣中’一種薄型電路板包含磁感應基 及金屬佈線層等組成部件。該感應線圈形成 磁之其中一側表面。金屬佈線層則形成在該 射側表面並與該感應線圈電性連接。-射頻辨識w職置找_縣板之其中 5 該金屬佈線層電性連接。該感應線圈的設計係考量該磁感 應基板通特性以設置在該磁感應基板的表面，俾使感 應線圈能藉由電磁感應產生電流以供應射頻辨識晶片運作 並發出電磁波回應外部的感應器（reader)。 在本新型另一態樣中，該感應線圈係為多層匝圈的層-疊設置於該磁感應基板之其中一側表面，且各層感應線圈 間夾置有一磁感應層，以增強磁感應性並加強吸波效果。· 該磁感應層材質與磁感應基板之材質相同。 . 本新型之目的在於提供一種新穎的薄型電路板結構’鲁 其採用之結構支撐性基板具有電磁波吸收功能’使該薄型 電路板無需配置額外的磁感應貼片或吸波貼片即可達到優 良的射頻辨識效果。 本新型之另一目的在於提供一種新穎的薄型電路板結 構，其透過感應線圈與磁感應層的交疊設置來實現多層感 應線圈設計’增加了該感應線圈的有效感應距離。 在參閱下述詳細的實施方式及相關的圖示與申請專利 範圍後，閱者將更能了解本新型其他的目的、特徵、及優 點。 — 【實施方式】 現在請參照第二圖，其為根據本新型實施例一射頻辨 識元件200之截面圖。在本新型的實施例中，將射頻辨識 晶片207設置於具有感應線圈之薄型電路板以做為射頻辨 識元件200之例示。射頻辨識元件200下方並繪有一金屬 表面202用來表示其使用設置之關係。如圖所示，本新型 之射頻辨識元件200主要係由磁感應基板201、感應線圈 M396454 % 203、金屬佈線層205、及射頻辨識晶片2〇7等四個部件所 構成，其中磁感應基板201、感應線圈2〇3與金屬佈線層 205組成一薄型電路板。在本新型中，磁感應基板2〇1是為 一具有良好吸波特性的板材，其不僅作為射頻辨識元件2〇〇 各部件設置之結構基材，且可有效抑制射頻辨識元件2〇〇 在高頻(如13·56ΜΗζ)或超高頻(如9〇〇MHz)環境下靠近金屬 或液體表面時生成表面波、空腔共振波、反射波、或/及電 磁干擾等現象，避免衍生感應訊號讀取不良的問題。本新 型磁感應基板201固有的電磁波吸收功能使得本新型之射 頻辨識元件200可輕易適用在一般習知射頻辨識元件（如 RFID)無法使用的環境中’如黏貼在罐頭等金屬表面或裝有 液體的藥瓶上、或是置於手機等行動裝置的電池或金屬載 體中，不需再額外搭配習知昂貴的吸波貼片，得以省下可 觀的標籤製作成本。 本新型之磁感應基板201係以有機樹脂與無機粉體兩 種材質混合而成，其中該有機樹脂係賦予磁感應基板201 機械特性及製程上的可行性，而該無機粉體則使磁感應基 板201有吸收電磁波的功能。在一實施例中，磁感應基板 2〇1中的有機樹脂為一般軟性印刷電路板常用的PI (polyimide，聚亞醯胺）材質。以此材質形成的基板具有質 輕、可撓、易於攜帶、製程簡易、可適用於捲轴式連續製 程(roll-to-roll)、及可大面積製作等優點，使得後續製作出 的射頻辨識標籤成品可適用性較佳。須注意在其他實施例 中’磁感應基板201的有機樹脂亦可為其他具有相同特性 的合適材質，其包含但不限定於下列材質及其組合：聚對 7 M396454 苯二甲二乙酯（polyethylene terephthalate，PET)、聚對萘二 甲酸乙二酿（polyethylene naphthalate，PEN)、聚丙浠 (polypropylene，PP)、聚謎石風(Polyether sulfone，PES)、 聚次苯基醚砜(Polyphenylene Sulfone，PPSU)、聚苯噁唑共 聚合物(Poly-p- phenylenebenzobisoxazole，PBO)、液晶聚合 物（Liquid Crystal Polymer，LCP)、丙烯酸樹脂（Acrylate)、 聚氨脂(Polyurethane，PU)、或環氧樹脂(Epoxy)等。 · 另一方面’磁感應基板201的無機粉體材料是為具有， 良好吸波特性之材質，其可有效使電磁波的訊號衰減，避鲁 免射頻辨識元件200在金屬體或液體表面受到逆向的電磁 波干擾。本新型實施例中無機粉體之材質可如軟性鐵氧 體，其包含但不限定於锰鋅鐵氧體、鎳鋅鐵氧體、鎳鋼鋅 鐵氧體、鏟鎮鋅鐵氧體、猛鎮紹鐵氡體、猛銅鋅鐵氧體、 始鐵氧體或是其混合物；合金材料，其包含但不限定於錄 鐵合金、鐵矽合金、及鐵鋁合金；金屬材料，其包含但不 限定於銅、銘、鐵、及錄等合金等。在本新型中，有機樹 脂與無機粉體混合的比例分別約在15%〜35%與85%〜65% 之間，兩者混合後可形成具有吸波特性的漿料或塗料，其馨 可再進一步固化成具有結構支撐性的固體，如膠片、薄膜， 板狀、塊狀基材等。上述比例混合調配而成的磁感應基板 201可完全適用於傳統的PI軟板製程，如在磁感應基板2〇1 上進行鍍膜、蝕洗、雕銑、及鑽孔等動作，亦可適用於射 頻辨識晶片所需的高溫製程’如表面黏著技術中的覆晶製 程(flip chip)。 於本新型中’磁感應基板201係同時作為射頻辨識元 8 M396454 件200的結構支撐件及吸波件，其上可透過軟板製程形成 射頻辨識元件所需的通孔(throughh〇le)、電路佈線(trace)、 及互連接點（interconnect)等電路結構。如第二圖所示磁感 應基板201的上表面形成有感應線圈2〇3，該感應線圈2〇3 為一多匝迴圈设计，其係設置來接收由一外部射頻辨識讀 取器（reader)所發出在不同極化方向上的電磁波，以藉由感 應麵合（Inductive Coupling)或後向散射耦合（Back scatterV. New description: [New technology field] & The new type relates to a thin circuit board with an induction coil. Specifically, it is a thin circuit board designed with an induction coil that considers the absorbing characteristics. [Prior Art] Radio frequency identification technology (RFID) is a technology that recognizes specific targets and reads and writes related information through electromagnetic signals. The operation principle of the RFID component is to use an external RFID reader to emit electromagnetic waves to trigger an RFID component (such as an RFID tag) in the sensing range. The RF identification component will be generated by electromagnetic induction. The current is supplied to the RFID chip operation, and then the electromagnetic wave is sent back to the sensor to achieve the RF identification effect. The identification is performed by electromagnetic induction, the RFID system (such as the reader) and the identification target (such as RF identification). There is no need to establish any mechanical or optical contact between the labels). Radio frequency identification has many advantages, such as long effective identification distance, large amount of information that can be stored and transmitted, fast recognition speed, reproducible data in labels, and better security. It has been widely used in the industry to replace traditional identification. Bar code (bar c〇de). Today's RF identification components are used in retail logistics, asset tracking, and many other areas. 〜哥。 As the first figure π ′ is a typical cross-sectional view of a radio frequency identification component having an induction coil in a conventional technique. As shown in the figure, a typical radio frequency identification component (10) is mainly composed of a flexible substrate (8), an induction coil 103, a metal wiring layer 105, and a radio frequency identification chip 1〇7, which are composed of four components 3 M396454. Since 1〇1 does not have the characteristic of absorbing electromagnetic waves, the design of the induction coil 103 does not require consideration of the magnetic flux characteristics of the flexible substrate 101. The flexible substrate 101 is a structural substrate provided as a component of the radio frequency identification element 100, and is formed of a soft material such as PET (polyethylene terephthalate), which is light in weight, flexible, and easy to carry. Etc. An induction coil on the upper surface of the flexible substrate 101 is used to receive electromagnetic waves emitted by an external radio frequency identification reader to generate current by electromagnetic induction. A lower surface of the flexible substrate 1?1 is formed with a metal wiring layer 105' which is electrically connected to the induction coil 1?3 through the interconnection structure 1?4. The metal wiring layer 1〇5 also includes a circuit wiring region of the radio frequency identification element 1〇〇, so that the radio frequency identification wafer 1〇7 is electrically connected to the induction coil 103. According to the prior art, a plurality of vias 109 communicating with the upper and lower sides are formed in the flexible substrate 101 to cause the metal wiring layer on the lower surface of the flexible substrate 1〇 and the radio frequency identification wafer 107 on the upper surface of the flexible substrate 101 to generate electrical defects. The induction coil 103 The current generated by the electromagnetic induction is transmitted to the radio frequency identification chip 1〇7 through the metal wiring layer 105 for operation, and the RF identification reader of the mountain should complete the radio frequency identification or the data 1 due to the use of the electromagnetic wave sensing mechanism, the radio frequency identification component= : _ The environment is quite sensitive, especially the paste; metal or liquid interference, resulting in inductive signal reading = RF identification components are particularly serious. i = application of the passive RFID tag, as shown in the first figure, 4 M396454 RFID component 100 and metal clothing _es one or ΐ is == two: induction, reflected wave, or / and electromagnetic generated surface Waves, cavity resonance waves, and, of course, the industry, to avoid poor reading of the sensing signal. Recognizing the cost of component manufacturing: Adding a wide film meeting, many RF-recognition RF identification components are thinner and changeable. The film has a thickness of one turn. The different induction coils of the device will respond to the effect of the RF identification. Here, the film must be selected to avoid the shadow #, the induction coil design is considered to be a problem with the plate-made patch, and in the selection of the magnetic induction design, the identification of the r can be applied to the thin structure. Type /, thin circuit board with absorbing effect [New content] In the above-mentioned shortcomings of the prior art, the present invention discloses a novel thin circuit board. The substrate of the novel thin circuit board is mixed with absorbing powder: η is made to make the substrate have the characteristics of absorbing electromagnetic waves, and the same characteristic of the same soft circuit board can be used for RF identification on the circuit board. The buildup and circuit construction required for the component. In the case of a shape, a thin circuit board includes components such as a magnetic induction base and a metal wiring layer. The induction coil forms one side surface of the magnetic body. A metal wiring layer is formed on the surface of the incident side and electrically connected to the induction coil. - RF identification w position to find _ county board of which 5 The metal wiring layer is electrically connected. The induction coil is designed to take into account the characteristics of the magnetic induction substrate to be disposed on the surface of the magnetic induction substrate, so that the induction coil can generate current by electromagnetic induction to supply the RFID chip operation and emit electromagnetic waves in response to an external reader. In another aspect of the present invention, the induction coil is a layer-layer stack of a plurality of coils disposed on one side surface of the magnetic induction substrate, and a magnetic induction layer is interposed between the layers of the induction coils to enhance magnetic induction and enhance suction. Wave effect. · The material of the magnetic induction layer is the same as that of the magnetic induction substrate. The purpose of the present invention is to provide a novel thin circuit board structure 'the structural support substrate used by Lu has an electromagnetic wave absorbing function', so that the thin circuit board can achieve excellent performance without providing an additional magnetic induction patch or absorbing patch. Radio frequency identification effect. Another object of the present invention is to provide a novel thin circuit board structure that achieves a multi-layered inductive coil design by overlapping the inductive coils with the magnetic sensing layer to increase the effective sensing distance of the inductive coil. The reader will be better able to understand the other objects, features, and advantages of the present invention after referring to the detailed description of the embodiments and the accompanying drawings and claims. - Embodiments Referring now to the second diagram, which is a cross-sectional view of a radio frequency identification component 200 in accordance with an embodiment of the present invention. In the presently preferred embodiment, the radio frequency identification chip 207 is disposed on a thin circuit board having an inductive coil as an example of the radio frequency identification component 200. A metal surface 202 is shown beneath the RFID component 200 to indicate its use setting relationship. As shown in the figure, the radio frequency identification component 200 of the present invention is mainly composed of a magnetic induction substrate 201, an induction coil M396454% 203, a metal wiring layer 205, and a radio frequency identification chip 2〇7, wherein the magnetic induction substrate 201, the sensing The coil 2〇3 and the metal wiring layer 205 constitute a thin circuit board. In the present invention, the magnetic induction substrate 2〇1 is a plate material having good absorbing properties, which not only serves as a structural substrate provided for each component of the radio frequency identification component 2, but also effectively suppresses the presence of the radio frequency identification component 2 Surface wave, cavity resonance wave, reflected wave, or / and electromagnetic interference are generated when high frequency (such as 13.56 ΜΗζ) or ultra high frequency (such as 9 〇〇MHz) is close to the surface of metal or liquid to avoid derivative induction. Bad signal reading. The electromagnetic wave absorbing function inherent in the novel magnetic induction substrate 201 enables the radio frequency identification component 200 of the present invention to be easily applied in an environment where conventional radio frequency identification components (such as RFID) cannot be used, such as sticking to a metal surface such as can or liquid. In the medicine bottle or in the battery or metal carrier of the mobile device such as a mobile phone, it is not necessary to additionally use the conventional expensive absorbing patch, thereby saving considerable label manufacturing cost. The magnetic induction substrate 201 of the present invention is formed by mixing an organic resin and an inorganic powder, wherein the organic resin imparts mechanical properties and process feasibility to the magnetic induction substrate 201, and the inorganic powder causes the magnetic induction substrate 201 to have The function of absorbing electromagnetic waves. In one embodiment, the organic resin in the magnetic induction substrate 2〇1 is a PI (polyimide) material commonly used for general flexible printed circuit boards. The substrate formed by the material has the advantages of light weight, flexibility, easy carrying, simple process, suitable for roll-to-roll, and large-area production, so that the subsequent radio frequency identification is made. The finished label has good applicability. It should be noted that in other embodiments, the organic resin of the magnetic induction substrate 201 may also be other suitable materials having the same characteristics, including but not limited to the following materials and combinations thereof: poly pair 7 M396454 polyethylene terephthalate , PET), polyethylene naphthalate (PEN), polypropylene (PP), Polyether sulfone (PES), Polyphenylene Sulfone (PPSU) , Poly-p-phenylenebenzobisoxazole (PBO), Liquid Crystal Polymer (LCP), Acrylate, Polyurethane (PU), or Epoxy (Epoxy) )Wait. On the other hand, the inorganic powder material of the magnetic induction substrate 201 is a material having a good absorbing property, which can effectively attenuate the signal of the electromagnetic wave, and avoids the RF identification component 200 from being reversed on the surface of the metal body or the liquid. Electromagnetic interference. In the present embodiment, the material of the inorganic powder may be a soft ferrite, which includes, but is not limited to, MnZn ferrite, nickel zinc ferrite, nickel steel zinc ferrite, shovel zinc ferrite, and fierce An iron alloy body, a copper silicate ferrite, a ferrite or a mixture thereof; an alloy material, including but not limited to a ferrous alloy, a stellite alloy, and an iron-aluminum alloy; a metal material, including but not Limited to copper, Ming, iron, and other alloys. In the present invention, the ratio of the organic resin to the inorganic powder is about 15% to 35% and 85% to 65%, respectively, and the two can be mixed to form a slurry or coating having a absorbing property. It can be further cured into a structurally supported solid such as a film, a film, a plate, a bulk substrate or the like. The magnetic induction substrate 201 prepared by mixing the above ratios can be completely applied to a conventional PI soft board process, such as coating, etching, engraving, and drilling on the magnetic induction substrate 2〇1, and can also be applied to radio frequency identification. The high temperature process required for wafers is like a flip chip in surface mount technology. In the present invention, the magnetic induction substrate 201 is simultaneously used as a structural support member and a absorbing member for the radio frequency identification element 8 M396454 member 200, and a through hole (circuit) and a circuit required for forming the radio frequency identification component through the flexible board process. Circuit structures such as traces and interconnections. As shown in the second figure, the upper surface of the magnetic induction substrate 201 is formed with an induction coil 2〇3, which is a multi-turn loop design, which is arranged to receive an external radio frequency reader (reader). Electromagnetic waves emitted in different polarization directions to be coupled by Inductive Coupling or Backscattering
Coupling)等電磁感應方式產生電流。在本新型中，該感應 線圈203可採用蝕刻（如銅蝕刻及鋁蝕刻）、銀膠印刷（包含 網版印刷、凸版印刷、凹版印刷、或喷墨方式等）、化學沉 積銅、及電鍍銅等方式形成。感應線圈2〇3的材質、厚度、 匝數、Q值(quality factor)、及設置等會對應所使用之^感 應基板201的吸波性質來進行設計或微調以達成所需的阻 抗匹配(Impedance Matching)，並維持在電磁感應上線性極 化之要求本新型之感應線圈203的工作頻率會視其應用 的環境而定，其包含但不限定於125/134KHz(低頻）、丨3 56 MHz(高頻）等運作頻段。 _ 另一方面，磁感應基板201的下表面形成有一金屬佈 線層205，是為射頻辨識元件2〇〇之線圈模組的一部份。金 屬佈線層205會透過通孔或互連結構2〇4a，2〇4b分別與兩 端的感應線圈203耦接，以傳導電性訊號。在本新型其他 實施例中，金屬佈線層205亦可作為感應線圈2〇3的接地 平面（gnnmd plane)’以將感應線圈203因電磁感應所生成 過多的渦電流導引出射頻辨識元件2〇〇外避免產生電磁干 擾。在本新型中，金屬佈線層2〇5可同時作為射頻辨識元 9 M396454 的訊號傳遞層或電路佈線層。如 應=2〇1上形成有數個連通上下表面的通孔2〇此^ == 填=材質以與磁感應基板201下表；的 -—-- 藉由該導電膠211將線圈接“射巧：):接之後 產生電性連結以傳遞感應電流。至此 j作即元成了本新型射頻辨識元件2⑼的内部嵌片⑽Jj 射頻辨識讀取器，完成射頻元件部的 ΐ二，4種功能性電路之':合= 路，將外部讀取器送過來的 ^堂'、’穩壓電路’提供射頻辨識晶片207穩定的電源.， ，把載波去除以取出真正的調變訊號。d 级外=取騎送錢的錢料，並依其要切送資料 ϊ料=器及=作為射頻辨識元件2。0存敌‘ 變後載到感應線圈送出給讀H迷微處理器送出的資訊調 在完成射頻辨識晶片2〇7的黏合後，本新型射頻辨識 10Coupling) and other electromagnetic induction methods generate current. In the present invention, the induction coil 203 can be etched (such as copper etching and aluminum etching), silver offset printing (including screen printing, letterpress printing, gravure printing, or inkjet method, etc.), chemical deposition of copper, and electroplating copper. Formed by other means. The material, thickness, number of turns, quality factor, and setting of the induction coil 2〇3 are designed or fine-tuned according to the absorbing properties of the sensing substrate 201 used to achieve the desired impedance matching (Impedance). Matching) and maintaining the requirement for linear polarization on electromagnetic induction The operating frequency of the novel induction coil 203 depends on the environment in which it is applied, including but not limited to 125/134 KHz (low frequency), 丨3 56 MHz ( High frequency) and other operating frequency bands. On the other hand, the lower surface of the magnetic induction substrate 201 is formed with a metal wiring layer 205 which is a part of the coil module of the radio frequency identification element 2 . The metal wiring layer 205 is coupled to the inductive coils 203 of the two ends through via holes or interconnect structures 2〇4a, 2〇4b to conduct electrical signals. In other embodiments of the present invention, the metal wiring layer 205 can also serve as a ground plane (gnnmd plane) of the induction coil 2〇3 to guide the eddy current generated by the induction coil 203 due to electromagnetic induction to the radio frequency identification component 2〇. Avoid electromagnetic interference outside the raft. In the present invention, the metal wiring layer 2〇5 can simultaneously serve as a signal transmission layer or a circuit wiring layer of the radio frequency identification element 9 M396454. If there is a plurality of through holes 2 connecting the upper and lower surfaces, the ^== fill = material to the bottom of the magnetic induction substrate 201; ----the coil is connected by the conductive adhesive 211 :): After the connection, an electrical connection is generated to transmit the induced current. At this point, the internal panel (10) Jj RF identification reader of the novel RFID component 2 (9) is completed, and the second component of the RF component is completed. The ''================================================================================================= = Take the money to send the money, and according to the data to be sent to the device = = and = as the RFID component 2. 0 save the enemy's change to the induction coil sent to the reader to read the information sent by the microprocessor After completing the bonding of the radio frequency identification chip 2〇7, the new radio frequency identification 10
兀件200之製作即告一段落。鈇 ，型之射頻辨識元件係可作 ^實施例中，本 包含感應線圈、磁感應基板、盘'、月識標籤的内部嵌 =，壓合步雜-i成t’其可再進 將。標籤壓合步驟是標籤生產的最炊i射頻辨識標 2頻辨識標籤的内部嵌片***自黏性貼，程’該製程係 Κα ’1使f、本裸露在外部環境中的感Λ 卡中進行 、與射頻辨識晶片2〇7等部位被封二，磁感應基 f客戶可以使用的標籤產品。依業者二占片包裝中，成 出^射頻辨識標籤型態亦有所不同，如自，同’所製作 標籤、三層軟卡式的射頻辨識標籤、 j性的射頻辨識 辨識標籤等。該些型態之最終產品可應用=卡式的射頻 禁卡、標籤貼紙、防盜晶片等應用中。 電子錢包、門 j二圖所示’於設置中’射頻辨識 ，/、金屬佈線層朝向金屬表面2。2,感應線心。。會設置 邛。在實際應用中，該金屬表面2〇2可能分則朝向外 電路板、電池、金屬載體或罐頭的金屬殼=機内部的1C 應基板201阻隔在感應線圈2〇3與金屬表=。由於磁感 此設置方式可使感應線圈2〇3接收或放出02之間，故 到該金屬表面202的影響。然，上述設晉士二礤波不會受 的實施例之-’於其他實施例中，本新型射頻 的感應線圈203與金屬佈線層205亦可能設置在磁感應基 板201的同一^側上。 上述本新型實施例之射頻辨識元件設計係將吸波材與 基材整合在一起，不需如習知技術般設置額外的磁感應貼 11 M396454 片或吸波貼片才能達到吾人所欲的射頻感應 了省去-筆吸波貼片的成本外，由於本新型之^頻辨識二 Γ:出二原先預留來設置磁感應貼片#空間3(約 150μιη〜200μηι的厚度），故元件中可提供更多的容置* :第J圖所示’其為根據本新型另一實施例一射頻“元 件之截面圖。該實施例中射頻辨識元件與第二圖中射頻辨 識元件之設計大同小異，惟其利用了射頻辨識元件中騰出 來的高度空間將感應線圈203設計成複數層層疊設置的線 圈結構。在本實施例中，該各層的感應線圈2〇3間更設置 有磁感應層213來作為層與層之間的隔離層並強化射^辨 識元件内部的整體吸波效果。該磁感應層213之材質與磁 感應基板201之材質相同，具有良好的電磁波吸收特性。 在本新型實施例中’磁感應層203可先採用塗膜增層法形 成在底層的感應線圈203上，再於其上繼續形成它層的感 應線圈203。最上層的感應線圈203會再透過一通孔或互連 結構215與磁感應基板201下的金屬佈線層205產生電性 連結。本實施例中的多層感應線圈設計之優點在於可利用 原本預留給磁感應或吸波貼片的空間來設置複數層感應線® 圈，在不變的單位面積增加線圈的臣數’進而顯著增加本. 新型射頻辨識元件的感測距離。須注意第三圖中的雙層感 應線圈僅為一範例性實施例，在其他實施例中，該感應線 圈203可往上形成更多層的線圈結構進一步增加射頻辨識 元件的可感應距離。 综上述本新型兩實施例所述，本新型設計之特點在於 提供一具有吸波性質又同時能夠進行元整軟板製程的基材 12 ινυ%454 « ”，辨識s件件中不需要配置韻 波貼 icr新型中感應線圈與磁感應層 離。W層設計’以進-步增加射頻辨識元件的可感應距 ^說明係關於本^具有感應線__電路板之 2的薄型電路板之製造方法。在本方法中，首： Ο Ί、基板，該磁感應基板由有機樹脂與無機粉體所製 ^其中該有機樹脂係賦予該磁感應基板機械特性及製程 =可行性，而該無機粉㈣使該喊應基板有吸收電磁 j功能；接著’於該磁感應基板之其中—側表面上形成 ^〆應線圈，该感應線圈係參考該磁感應基板的磁通特性 設置在該磁感應基板的表面，其可用來接收由外部射頻辨 ^讀取器所發出的電磁波，以藉由電磁感應方式產生電 ”L，之後，再於该磁感應基板之其中一側表面上形成一金 屬佈線層，該金屬佈線層與該感應線圈電性連接以傳遞電 f況號，或疋可將感應線圈因電磁感應所生成過多的涡電 流導引出薄型電路板外以避免產生電磁干擾。 本方法可進一步附著一積體電路於該磁感應基板之其 中一側表面，並使該積體電路經由該金屬佈線層電性連接 该感應線圈。而在另一方法實施例中，磁感應基板上會形 成一層以上的感應線圈’其各層感應線圈之間更形成有一 磁感應層來作為層與層之間的隔離層並強化射頻辨識元件 内部的整體吸波效果。 在上述方法實施例中，該磁感應基板或磁感應層中係 13 M396454 由有機樹脂與無機粉體構成，其有機樹脂與無機粉體分別 佔磁感應基板與磁感應層約15〜35%與85〜65%的重量百分 比。該有機樹脂選自以下材質或其組合：聚亞醯胺 (polyimide，PI)、聚對苯二曱二乙酯（polyethylene terephthalate ’ PET)、聚對萘二甲酸乙二酯（polyethylene naphthalate，PEN)、聚丙稀（polypropylene，PP)、聚謎石風 (Polyethersulfone，PES)、聚次苯基醚砜（p〇iyphenylene · Sulfone ， PPSU)、聚苯噁唑共聚合物· (Poly-p-phenylenebenzobisoxazole，PBO)、液晶聚合物籲 (Liquid Crystal Polymer，LCP)、丙烯酸樹脂(Acrylate)、聚 氨脂(Polyurethane ’ PU)、或環氧樹脂(Ep〇Xy”而該無機粉 體選自以下材質或其組合：錳鋅鐵氧體、鎳鋅鐵氧體、錄 銅鋅鐵氧體、錳鎂鋅鐵氧體、錳鎂鋁鐵氧體、錳銅鋅鐵氧 體、鈷鐵氧體、鎳鐵合金、鐵矽合金、鐵鋁合金、銅、銘、 鐵、或錄。 文中所述之實施例與圖說係供予閱者，俾其對於本新 型各不同實施例結構有通盤性的瞭解。該些圖示與說明並 非意欲對利用此處所述結構或方法之裝置與系統中的所有p 元件及特徵作完整性的描述。於參閱本新型揭露書中，本-新型領域之熟習技藝者將更能明白本新型許多其他的實施 例，其得以採由或得自本新型之揭露。在不悖離本新型範 疇的情況下，新型中可以進行結構與邏輯的置換與改變。' 例如：於本新型中，射頻辨識元件的感應線圈與金屬佈線 層可以設置在磁感應基板的同一側；射頻辨識元件的磁感 應基板亦可能採行多層軟性電路板之設計；射頰辨識元件 M396454 ' . 所採用或所耦接的射頻辨識晶片可能行使射頻辨識以外的 其他功能，如穩壓、整流、訊號轉換等；射頻辨識元件製 作完成後可進一步進行其他製程步驟，如標籤壓合、印上 標示等。此外，說明書中所示圖式僅用於呈具而非按比例 所繪製。圖式中的某些部分可能會被放大強調，而其他部 分可能被簡略。據此，本新型之揭露與圖式理視為描述而 非限制性質，並將由下文中的申請專利範圍來限制。 【圖式簡單說明】 參閱後續的圖式與描述將可更了解本新型的系統及方 法。文中未詳列暨非限制性之實施例則請參考該後續圖式 之描述。圖式中的組成元件並不一定符合比例，而係以強 調的方式描繪出本新型的原理。在圖式中，相同的元件係 於不同圖示中標出相同對應之部分。 第一圖為習知技術中一典型的射頻辨識標籤之截面 圖， 第二圖為根據本新型實施例一射頻辨識標籤之截面 圖；及 第三圖為根據本新型實施例另一射頻辨識標籤之截面 圖。 【主要元件符號說明】 100 射頻辨識元件 101 軟性基板 102 金屬表面 103 感應線圈 15 M396454 104 105 106 107 109 200 201 202 203 204a 204b 205 207 209 211 213 215 互連結構 金屬佈線層 吸波貼片 射頻辨識晶片 通孔 射頻辨識元件 磁感應基板 金屬表面 感應線圈 互連結構 互連結構 金屬佈線層 射頻辨識晶片 通孔 導電膠 磁感應層 互連結構The production of the element 200 is coming to an end.鈇, the type of radio frequency identification component can be used as an embodiment, the present invention includes an induction coil, a magnetic induction substrate, a disk, and an internal embedded tag of the monthly identification tag, and the pressing step-i is t', which can be further advanced. The label pressing step is the most intrusive label production. The internal panel of the 2 frequency identification label is inserted into the self-adhesive label. The process system Κα '1 makes f, the bare sensor in the external environment. It is carried out, and the RFID chip 2〇7 and other parts are sealed, and the magnetic sensing base f can be used by the customer. In the two-package package, the RFID tag type is different, such as the label produced by the same, the three-layer soft card type RFID tag, and the j-type RFID tag. The final products of these types can be applied in applications such as card-type RF cards, label stickers, and security chips. The electronic wallet and the door j are shown in the figure 'in the setting' radio frequency identification, /, the metal wiring layer faces the metal surface 2. 2, the sensing core. . Will set 邛. In practical applications, the metal surface 2〇2 may be divided toward the outer circuit board, the battery, the metal carrier or the metal shell of the can. The 1C substrate 201 inside the machine is blocked in the induction coil 2〇3 and the metal table=. Due to the magnetic inductance, the arrangement can cause the induction coil 2〇3 to receive or discharge between 02, so that the influence of the metal surface 202 is reached. However, in the other embodiments, the induction coil 203 and the metal wiring layer 205 of the present invention may also be disposed on the same side of the magnetic induction substrate 201. The radio frequency identification component design of the above-mentioned novel embodiment integrates the absorbing material and the substrate, and does not need to set an additional magnetic induction sticker 11 M396454 or absorbing patch as in the prior art to achieve the desired RF induction. In addition to the cost of the slap-and-suck wave patch, due to the novel frequency identification of the present invention: the original two reserved to set the magnetic induction patch # space 3 (about 150μιη~200μηι thickness), so the components can provide More accommodating*: FIG. J is a cross-sectional view of a radio frequency component according to another embodiment of the present invention. In this embodiment, the design of the radio frequency identification component is similar to that of the radio frequency identification component in the second figure, but The induction coil 203 is designed as a coil structure in which a plurality of layers are stacked by using the height space vacated in the radio frequency identification component. In this embodiment, the magnetic induction layer 213 is further disposed between the induction coils 2〇3 of the layers as a layer and The isolation layer between the layers enhances the overall absorbing effect inside the imaging element. The material of the magnetic sensing layer 213 is the same as that of the magnetic sensing substrate 201, and has good electromagnetic wave absorption characteristics. In the present embodiment, the magnetic induction layer 203 can be formed on the underlying induction coil 203 by a coating film build-up method, and then the layer of the induction coil 203 is continuously formed thereon. The uppermost induction coil 203 is re-transmitted. A via or interconnect structure 215 is electrically connected to the metal wiring layer 205 under the magnetic induction substrate 201. The multi-layer induction coil design in this embodiment has the advantage that it can be set by using a space originally reserved for the magnetic induction or the absorbing patch. The multi-layer induction line® ring increases the number of coils in a constant unit area' and thus significantly increases the sensing distance of the new RF identification component. It should be noted that the double-layer induction coil in the third figure is only an exemplary implementation. For example, in other embodiments, the induction coil 203 can form a coil structure of more layers to further increase the sensible distance of the RFID component. According to the above two embodiments of the present invention, the novel design is characterized by providing a The substrate 12 ινυ% 454 « ” which has the absorbing property and can carry out the process of the soft board process at the same time, and it is not necessary to configure the rhyme paste icr in the s piece. And the magnetic induction coil to be delaminated. The W layer design 'increases the inductive distance of the radio frequency identification component by further step-by-step description of the manufacturing method of the thin circuit board having the sensing line __ board. In the method, the first: Ο Ί, the substrate, the magnetic induction substrate is made of an organic resin and an inorganic powder, wherein the organic resin imparts mechanical properties and process=feasibility to the magnetic induction substrate, and the inorganic powder (four) makes the shout The substrate has a function of absorbing electromagnetic j; then forming a coil on the side surface of the magnetic induction substrate, the induction coil is disposed on the surface of the magnetic induction substrate with reference to the magnetic flux characteristic of the magnetic induction substrate, which can be used for receiving The electromagnetic wave emitted by the external radio frequency identification device generates an electric "L" by electromagnetic induction, and then forms a metal wiring layer on one side surface of the magnetic induction substrate, the metal wiring layer and the sensing The coil is electrically connected to transmit an electrical f-state number, or 疋 can guide excessive eddy current generated by the induction coil due to electromagnetic induction out of the thin circuit board to avoid electromagnetic interference. The method can further attach an integrated circuit to the Magnetically sensing one side surface of the substrate, and electrically connecting the integrated circuit to the induction coil via the metal wiring layer. In the example, more than one layer of induction coils are formed on the magnetic induction substrate. A magnetic induction layer is formed between the layers of the induction coils as an isolation layer between the layers and enhances the overall absorbing effect inside the radio frequency identification component. In the embodiment, the magnetic induction substrate or the magnetic induction layer 13 M396454 is composed of an organic resin and an inorganic powder, and the organic resin and the inorganic powder respectively occupy about 15 to 35% and 85 to 65% by weight of the magnetic induction substrate and the magnetic induction layer, respectively. The organic resin is selected from the following materials or a combination thereof: polyimide (PI), polyethylene terephthalate 'PET, polyethylene naphthalate (PEN) ), polypropylene (PP), polyethersulfone (PES), polyphenylene ether sulfone (p〇iyphenylene · Sulfone, PPSU), polybenzoxazole copolymer (Poly-p-phenylenebenzobisoxazole) , PBO), Liquid Crystal Polymer (LCP), Acrylate, Polyurethane 'PU, or Epoxy y" and the inorganic powder is selected from the following materials or a combination thereof: manganese zinc ferrite, nickel zinc ferrite, copper zinc ferrite, manganese magnesium zinc ferrite, manganese magnesium aluminum ferrite, manganese copper Zinc ferrite, cobalt ferrite, nickel-iron alloy, iron-iron alloy, iron-aluminum alloy, copper, Ming, iron, or recorded. The examples and drawings described in the text are for readers, The various embodiments are well understood, and are not intended to be a complete description of all p elements and features in the devices and systems utilizing the structures or methods described herein. Many other embodiments of the present invention will be apparent to those skilled in the art of the present disclosure. Without departing from the novel domain, structural and logical replacements and changes can be made in the new type. For example, in the present invention, the induction coil and the metal wiring layer of the radio frequency identification component may be disposed on the same side of the magnetic induction substrate; the magnetic induction substrate of the radio frequency identification component may also adopt the design of the multilayer flexible circuit board; the buccal identification component M396454 ' The RFID chip used or coupled may perform functions other than RF identification, such as voltage regulation, rectification, signal conversion, etc. After the RFID component is manufactured, other process steps such as label pressing and printing may be performed. Mark and so on. In addition, the drawings shown in the specification are for the purpose Some parts of the schema may be magnified and others may be abbreviated. Accordingly, the disclosure of the present invention is intended to be illustrative and not limiting, and is limited by the scope of the claims. [Simple description of the drawings] The system and method of the present invention will be better understood by referring to the following drawings and descriptions. For a detailed and non-limiting embodiment of the text, please refer to the description of the subsequent figures. The constituent elements in the drawings are not necessarily to scale, but the principles of the present invention are depicted in a strong manner. In the drawings, the same elements are labeled in the different drawings. The first figure is a cross-sectional view of a typical radio frequency identification tag in the prior art, the second figure is a cross-sectional view of the radio frequency identification tag according to the embodiment of the present invention; and the third figure is another radio frequency identification tag according to the embodiment of the present invention. Sectional view. [Main component symbol description] 100 RF identification component 101 Flexible substrate 102 Metal surface 103 Inductive coil 15 M396454 104 105 106 107 109 200 201 202 203 204a 204b 205 207 209 211 213 215 Interconnect structure Metal wiring layer absorbing patch RF identification Wafer via RF identification component magnetic induction substrate metal surface induction coil interconnection structure interconnection structure metal wiring layer radio frequency identification wafer through hole conductive plastic magnetic induction layer interconnection structure