M366177 五、新型說明： 【新型所屬之技術領域】 本新型是有關於一種封裝結構以及發光二極體封裝結 構，特別是指一種可供設置發光晶粒並且打線連接以製成 發光二極體封裝結構的封装結構以及該發光二極體封裝結 構。 【先前技術】 參閱圖1，為美國專利US6〇66,861所揭露的一種發光 一極體封裝結構9，其發光晶粒91是設置在一座體Μ的凹 穴921内，而金屬導線93係一端固定在發光晶片μ，另一 端則彎曲固^定在伸入凹穴921的端子94上，雖然這樣的設 置:式可得到較佳的打線弧度，但為了讓打線機能夠伸入 進行打線，凹穴921必須有較大的空間可供打線 =磁嘴伸入，而加大凹穴921的空間卻容易增加座體％的 2度’進而増加整個發光二極體封裝結構9的尺寸，且凹 921的空間加大也會增加封裝膠體％的厚度，影響發光 曰日粒91出光的均句性。 二極2 ’為美國專利US7，129,638所揭露的—種發光 導電線路置8’此㈣將座體81以陶諸料製成並且佈設 上#使金屬導線82的另—端得以被拉至座體81的 空固定，使得打線機在進行打線時可不受凹穴811 的製程較繁複，且_材料成本；it;堆疊線路之座體 除此之外，在此亦將美國專利⑽,4i7，㈣、 M366177 US6,576,488 -併列為本案之參考前 【新型内容】 ' 因此，本新型的目的，在於提供 覆並且設置發光晶粒以形成發光二極體的導材料包 本新型的另-目的，在於提供一種前述導線架愈 絕緣材料結合的封裝結構，該封裝結構不需因 ^ 而增加凹穴空間，且發光曰 ‘、、線而求 均勾性。 發^m具有較佳的出光 ，本新型料—目的，在於提供-種u前述封裝結構 所製成的發光二極體封裝結構。 =新型的又-目的，在於提供—種製程較簡單且材料 成本較低廉的發光二極體封裝結構。 於是’本新型封裝結構可供設置―發光晶粒並打接金 屬導線，㈣裝結構包含—座體、—第—導電支架及一第 二導電支架。該座體頂面凹陷形成有一凹穴。該第一導電 支架受該座體包覆並且具有一外露於該凹穴而可供設置， 發光晶粒的晶粒設置區。該第二導電支架受該座體包覆， 該第二導電支架具有-外露於該座體頂面而可供該金屬導 線一端固定的導接面。 本新型發光二極體封裝結構包含一座體、一第一導電 支架、-發光晶粒、一第二導電支架、至少一金屬導線以 及一封裝膠體。該座體頂面凹陷形成有一凹穴。該第一導 電支架受該座體包覆並且具有一外露於該凹穴的晶粒設置 區該發光日日粒a又置於該晶粒設置區。該第二導電支架受 M366177 該座體包覆’該第二導電支架具有—高於該發光晶粒並且 外露的導接面。該金屬導線一端伸入該凹穴並且固定於該 發光晶粒，另-端固定於該導接面。該封歸體填充於該 凹穴而封裝該發光晶粒。 本新型導線架料片包含複數相連接的導電支架料片， 每一導電支架料片包括一料邊以及連接該料邊的一第一導 電支架及一第二導電支架。該第一導電支架具有一可供設 置一發光晶粒的晶粒設置區。該第二導電支架具有一高於 本身其他部位並可供金屬導線一端固定的導接面。本新型 藉由使第二導電支架的局部外露出座體頂面以供金屬導線 打接，不僅可在不增加凹穴的空間下獲得較佳的打線弧度 ，且亦可獲得較薄的封裴膠體’使發光晶粒能在短時間内 與封裝膠體的螢光粉體接觸並且轉換，以提昇出光的均勻 性，此外，本新型的座體不論在製程或材料成本上，也都 比較簡單、低廉。 【實施方式】 有關本新型之前述及其他技術内容、特點與功效，在 以下配合參考圖式之一個較佳實施例的詳細說明中，將可 清楚的呈現。 參閱圖3，本新型導線架料片的一個較佳實施例。 導線架料片200包含複數個排列連接的導電支架料片2 ，每一導電支架料片2包括一料邊20、一包含一第—導電 支架21及一第二導電支架22之導電架組合，其中，導電 架組合之第一導電支架21與第二導電支架22透過複數連 .M366177 接段23與料邊20連接，並且兩導電支架2丨、22相間隔， 實際上，導線架料片2〇〇是一金屬料片沖切而成，該等導 電支架料片2是藉其料邊20相連接而呈陣列式排列連接， 也可以說，環繞該導電架組合之該料邊2〇用以提供固定元 件的功能。第一導電支架21具有一晶粒設置區211，第二 導電支架22具有-導接部221及—導接面222。在本實施 例中’第二導電支架22的導接面222即為其導接部221的 頂面’且第二導電支架22的導接部221係被局部往上彎折 ，使得導接面222之頂面的位置高於第一導電支架21以及 第二導電支架22的其餘部位。 本新1封K構包合-座體及一導電架組合。參閱圖3 、圖4,在本實施例中，座體1是以模***出成型方式結合 在前述的導電支架料片2並且包覆該導電架組合，也就是 包覆該第-導電支架21及該第二導電支架22, ^而在製造 上，係導線架料片·整體沖切完成並且成型座體丄於每 -導電支架料片2之後，再—併進行固晶及打線的作業。 座體1的材質可以是環氧樹脂或石夕膠，且座體1成型 時，其頂面11凹陷形成有一使第一導電支架21的晶粒設置 區211外露的凹穴12。當座體！包覆該導線架組合時，第 二導電支架22的導接面222則外露，在本實施例中，座體 1頂面11的高度是視第二導電支架22被往上彎折之導接部 221導接面222的高度而定’使得當座體i成型包覆於第二 導電支架22時，第二導電支架22的導接面222實質盥座 W的頂面u切齊或者高於座體】的頂面u而外露於座體 M366177 31連接（見圖5)， 均局部外露於座體 且第一導電支 1外而可供連 1頂面11而可供金屬導線 架21與第二導電支架22 接外部電源。 座體1頂面11位於凹穴12 该粗輪表面111可以是座體 ’至於粗糙表面111的作用 除此之外，在本實施例中， 周圍的區域係為粗糙表面1U， 1頂面111形成多數凸粒而構成 稍後說明。 又适一步的說 結構包含-座體、—導電架組合、—發光晶粒、至少一金 屬導線及一封裝膠體。 參閱圖4、圖5、圖8，在本實施例中，座體【及導電 架組合係為前述的封裝結構，且當座體丨結合於導電支架 料片2後，便可將連接導電架組合之第一、第二導電支架 21、22與料邊20的連接段23切除，由於對應於座體！兩 側的料邊20仍有部分嵌入座體丄内，使得座體“乃可維持 於料邊20上’換言之’該料邊2〇提供固定座體】之功用 以利後續的製程。發光晶粒3〇可為發出uv (紫外光） 〜IR (紅外光）的光波段，發光晶粒3〇設置於第一導電戈 架21的晶粒設置區211而位於凹穴12内，且此時，第二導 电支架22的導接面222仍是高於發光晶粒3〇，在本實施你 中，凹穴12是凹陷成矩形空間，且凹穴12的内壁面12丨 實質呈直立狀態，發光晶粒30亦呈矩形，當發光晶粒3( "又置在凹穴12内時，發光晶粒30的每一側邊緣至其所顯 近的凹穴12内壁面120距離均小於〇.6mm。 M366177 接著，便可進行打線作業，使金屬導線31 -端伸入凹 穴12内而固定在發光晶粒3〇的電極接點（圖未示）上， 另一端則㈣於第二導電支帛22㈣接φ如。而值得注 意的是，由於供金屬導線31連接的第二導電支架22導接 部221係外露於座體"貝面u，且在高度位置上高於發光 晶粒30，因此，當打線機在將金屬導線31打接在第二導電 支架22時，便較不會受到凹穴12的空間限制因此凹 12便不必配合打線萬求而加大空間，進而，便可讓座體 1的厚度維持在較低的尺寸，且金屬導線31亦同樣具有較 佳的彎曲弧度，此外，由於座體丨係塑料射出成型，因此 ，相較於美國案1187^29,638，不僅製程較簡單，材料成本 也比較低廉。 當金屬導線31被打接於發光晶粒3〇與第二導電支架 22的導接面222之後，接著便可將封裝膠體32填充於座體 1的凹穴12内而封裝發光晶粒3〇,該封裝膠體32係混有 螢光粉體，且再補充說明的是，由於座體丨的凹穴12不必 梵限於打線作業而增加空間，因此，當封装膠體32填充於 座體1的凹穴12内時，便可形成一包覆發光晶粒3〇的薄 層，使發光晶粒30所發出的光線可在短時間内與封裝膠體 32内含的螢光粉體接觸並且轉換，以提昇出光的均勻性。 請參閱圖6、圖8，再將光學鏡片33設置於座體}頂 面11，覆蓋於封裝膠體32上方並且涵蓋凹穴12周圍的頂 面11 ’此處，本實施例在凹穴12周圍的頂面U形成粗縫 表面111係可加強光學鏡片33與座體1的結合強度，避免 M366177 光學鏡片33輕易脫離座體】 厘體1。附帶說明的 與光學鏡片33可以是相同材質。 封裝膠體32 m对衣、结構300由料邊 便可形成-顆如圖7所示獨立的發光 移出’ 而該發光二極體封裝結肖_係可供再…構3〇〇。 面光源方式而做更進—步的應用。’、1成陣列方式或 个宋 —r切形成的導電支架料片 以本實施例所揭露的為限，其主要是在於使1中^不 架的局部位置移出凹穴12内並且高於發光晶粒3。= ’以便同時可具有較佳的打線弧度以及不 、= 空間。 口八12的 如上所述，本新型將座體以模***出方式包覆導線架 、且口，並且使第二導電支架的局部外露出座體頂面以供金 屬導線打接，不僅可在不增加凹穴的空間下獲得較佳的打 線弧度’且亦可獲得較薄的封裝膠體，使發光晶粒能在短 時間内與封裝膠體的螢光粉體接觸並且轉換，以提昇出光 的均勻性’此外’本新型的座體相較於陶竟座體不論在製 程或材料成本上，也都比較簡單、低廉，且模内成型的座 體也較不會有如陶瓷座體容易漏光以及高熱阻等問題，故 確實能達成本新型之目的。 惟以上所述者，僅為本新型之較佳實施例而已，當不 能以此限定本新型實施之範圍，即大凡依本新型申請專利 範圍及新型說明内容所作之簡單的等效變化與修飾，皆仍 屬本新型專利涵蓋之範圍内。 10 M366177 【主要元件符號說明】 1 ....... …·座體 11…… •…頂面 111… —粗糖表面 12…… ····凹穴 120 ... •…内壁面 200… …·導線架料片 2 ....... …·導電支架料片 20…… …·料邊 21…… …·第一導電支架 211 ···. 日日粒5又置£ 22 .........第二導電支架 221 .......導接部 222 .......導接面 23 .........連接段 3 0.........發光晶粒 300 .......發光二極體封裝 結構 31 .........金屬導線 32 .........封裝膠體 33 .........光學鏡片 12M366177 V. New description: [New technical field] The present invention relates to a package structure and a light-emitting diode package structure, in particular to a light-emitting die and a wire connection for making a light-emitting diode package. The package structure of the structure and the LED package structure. [Prior Art] Referring to Fig. 1, a light-emitting diode package structure 9 disclosed in U.S. Patent No. 6,66,861, the light-emitting die 91 is disposed in a recess 921 of a body, and the metal wire 93 is fixed at one end. In the light-emitting wafer μ, the other end is bent and fixed on the terminal 94 extending into the recess 921. Although such a setting can obtain a better arcing degree, in order to allow the wire-punching machine to extend into the wire, the cavity is formed. 921 must have a large space for the wire to be drilled = the mouth of the magnetic mouth is extended, and the space for increasing the recess 921 is easy to increase the 2% of the seat body', thereby increasing the size of the entire light-emitting diode package structure 9, and the recess 921 The increase of the space will also increase the thickness of the encapsulation colloid, which affects the uniformity of the luminescence of the luminescent particles 91. The two-pole 2' is an illuminating conductive line 8' disclosed in US Pat. No. 7,129,638. (4) The base 81 is made of ceramic material and laid up # so that the other end of the metal wire 82 can be pulled to the seat. The empty fixing of the body 81 makes the wire-punching machine more complicated than the process of the cavity 811 when the wire is being threaded, and the material cost; it; the seat of the stacking line, in addition to the US patent (10), 4i7, (4), M366177 US6,576,488 - juxtaposed as a reference for this case [new content] ' Therefore, the purpose of the present invention is to provide a new type of guide material for covering and arranging the light-emitting diode to form a light-emitting diode. The invention provides a package structure in which the above-mentioned lead frame is combined with a more insulating material, and the package structure does not need to increase the cavity space due to the light, and the light-emitting 、' and the line are uniform. The light source has a better light output, and the present invention is intended to provide a light emitting diode package structure made of the above package structure. = The new and purpose-oriented is to provide a light-emitting diode package structure with a simple process and a low material cost. Thus, the novel package structure can be provided with a light-emitting die and a metal wire, and the (four) mounting structure comprises a body, a first conductive bracket and a second conductive bracket. The top surface of the seat body is recessed to form a recess. The first conductive support is covered by the base and has a die-arranged area in which the light-emitting die is disposed to be exposed to the recess. The second conductive support is covered by the base, and the second conductive support has a guiding surface exposed to a top surface of the base for fixing one end of the metal wire. The novel LED package structure comprises a body, a first conductive support, a light-emitting die, a second conductive support, at least one metal wire, and an encapsulant. The top surface of the seat body is recessed to form a recess. The first conductive bracket is covered by the base and has a die arrangement area exposed to the recess. The luminescent day a is placed in the die setting area. The second conductive support is covered by the M366177. The second conductive support has a leading surface that is higher than the illuminating die and exposed. One end of the metal wire extends into the recess and is fixed to the light-emitting die, and the other end is fixed to the guiding surface. The seal is filled in the recess to encapsulate the luminescent crystal grains. The lead frame of the present invention comprises a plurality of electrically conductive support strips connected to each other. Each of the conductive support sheets comprises a bead and a first electrically conductive support and a second electrically conductive support connected to the bead. The first conductive support has a die arrangement area for arranging a light-emitting die. The second conductive support has a guide surface that is higher than the other parts of the body and is fixable at one end of the metal wire. By partially exposing the top surface of the second conductive support to the top surface of the base for the metal wire to be connected, the present invention can obtain better wire arcing without increasing the space of the cavity, and can also obtain a thinner seal. The colloid 'allows the luminescent crystal grains to contact and convert with the phosphor powder of the encapsulant in a short time to enhance the uniformity of the light. In addition, the novel body is relatively simple in terms of process or material cost. low. The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments. Referring to Figure 3, a preferred embodiment of the present leadframe web. The lead frame web 200 includes a plurality of electrically conductive carrier webs 2 arranged in a row. Each of the conductive support webs 2 includes a bead 20 and a conductive frame assembly including a first conductive support 21 and a second conductive support 22. Wherein, the first conductive support 21 and the second conductive support 22 of the conductive frame combination are connected to the material edge 20 through the plurality of M366177 connecting portions 23, and the two conductive supports 2丨, 22 are spaced apart, in fact, the lead frame material 2 The crucible is formed by punching a metal material piece, and the conductive support webs 2 are connected in an array by the connection of the material edges 20, and it can be said that the material side of the conductive frame assembly is used. To provide the function of a fixed component. The first conductive support 21 has a die placement area 211, and the second conductive support 22 has a conductive portion 221 and a conductive surface 222. In the present embodiment, the guiding surface 222 of the second conductive bracket 22 is the top surface of the guiding portion 221 and the guiding portion 221 of the second conductive bracket 22 is partially bent upward, so that the guiding surface The top surface of the 222 is positioned higher than the first conductive support 21 and the remaining portion of the second conductive support 22. The new 1 K-combination-seat body and a conductive frame combination. Referring to FIG. 3 and FIG. 4, in the embodiment, the base body 1 is combined with the conductive support material piece 2 in an in-mold injection molding manner and covers the conductive frame assembly, that is, the first conductive support 21 is covered. And the second conductive support 22, and in manufacturing, the lead frame material is integrally punched and the molded body is placed behind each of the conductive support sheets 2, and then the work of solid crystal bonding and wire bonding is performed. The material of the seat body 1 may be epoxy resin or stone enamel. When the seat body 1 is formed, the top surface 11 is recessed to form a recess 12 for exposing the die placement region 211 of the first conductive support 21. As a seat! When the lead frame assembly is covered, the guiding surface 222 of the second conductive bracket 22 is exposed. In this embodiment, the height of the top surface 11 of the base 1 is the guiding of the second conductive bracket 22 being bent upward. The height of the guiding surface 222 of the portion 221 is determined such that when the seat body i is molded and coated on the second conductive bracket 22, the guiding surface 222 of the second conductive bracket 22 is substantially aligned or higher than the top surface u of the seat W The top surface of the base body is exposed to the base body M366177 31 (see FIG. 5), and is partially exposed to the seat body and the first conductive branch 1 is externally connected to the top surface 11 for the metal lead frame 21 and The second conductive support 22 is connected to an external power source. The top surface 11 of the seat body 1 is located at the pocket 12. The rough wheel surface 111 may be the role of the seat body 'as for the rough surface 111. In addition, in the present embodiment, the surrounding area is a rough surface 1U, 1 top surface 111 Most of the bumps are formed to constitute a later description. Still further, the structure comprises a body, a conductive frame combination, an illuminating die, at least one metal wire, and an encapsulant. Referring to FIG. 4, FIG. 5, and FIG. 8, in the embodiment, the base body and the conductive frame combination are the foregoing package structure, and when the base body is coupled to the conductive support material piece 2, the conductive frame can be connected. The combined first and second conductive supports 21, 22 and the connecting section 23 of the bead 20 are cut off, since they correspond to the seat body! The sides 20 of the sides are still partially embedded in the seat body, so that the seat body can be maintained on the material side 20, in other words, the material side of the material side provides a fixed seat body for the subsequent process. The particle 3 〇 may be an optical band emitting uv (ultraviolet light) ~ IR (infrared light), and the light emitting die 3 is disposed in the die setting region 211 of the first conductive gondola 21 and located in the recess 12, and at this time The guiding surface 222 of the second conductive support 22 is still higher than the light-emitting die 3〇. In the present embodiment, the recess 12 is recessed into a rectangular space, and the inner wall surface 12 of the recess 12 is substantially erect. The illuminating crystal grain 30 is also rectangular. When the illuminating crystal grain 3 is placed in the cavity 12, the distance from each side edge of the illuminating crystal grain 30 to the inner wall surface 120 of the recess 12 which is adjacent thereto is smaller than 〇.6mm. M366177 Next, the wire bonding operation can be performed so that the metal wire 31-end protrudes into the cavity 12 and is fixed on the electrode contact (not shown) of the light-emitting die 3〇, and the other end is (four) The second conductive support 22 (four) is connected to φ, and it is worth noting that the second conductive support 22 is connected to the second conductive bracket 22 by the metal wire 31. The 1 series is exposed to the body "bei surface u, and is higher than the light-emitting die 30 in the height position. Therefore, when the wire bonding machine hits the metal wire 31 to the second conductive support 22, it is less concave. The space limitation of the hole 12 is such that the recess 12 does not have to be increased in space in accordance with the wire drawing. Further, the thickness of the seat body 1 can be maintained at a lower size, and the metal wire 31 also has a better bending curvature. Since the base body is plastic injection molding, compared with the US case 1187^29,638, not only the process is simple, but also the material cost is relatively low. When the metal wire 31 is connected to the light-emitting die 3〇 and the second conductive support 22 After the guiding surface 222, the encapsulant 32 can be filled in the recess 12 of the base 1 to encapsulate the illuminating crystal 3〇, and the encapsulating colloid 32 is mixed with the fluorescent powder, and the supplementary description is Since the pocket 12 of the seat body does not need to be limited to the wire-drawing operation to increase the space, when the encapsulant 32 is filled in the cavity 12 of the seat body 1, a thin layer covering the light-emitting die 3〇 can be formed. So that the light emitted by the illuminating crystal grains 30 can be short-lived The phosphor powder contained in the encapsulant 32 is contacted and converted to enhance the uniformity of the light. Referring to FIG. 6 and FIG. 8, the optical lens 33 is disposed on the top surface 11 of the housing, covering the encapsulant. 32 above and covering the top surface 11 ' around the pocket 12 ' Here, the top surface U around the pocket 12 in this embodiment forms a rough surface 111 to strengthen the bonding strength of the optical lens 33 and the seat 1 to avoid the M366177 optical The lens 33 is easily detached from the seat body. The lentic body 1 can be the same material as the optical lens 33. The encapsulant 32 m pair of clothes and the structure 300 can be formed by the edge of the material - the individual illuminating and removing as shown in Fig. 7 The light-emitting diode package can be used for further construction. The surface light source method is used to make more advanced steps. The conductive stent web formed by the array pattern or the song-r-cut is limited to the one disclosed in the embodiment, and the main purpose is to remove the local position of the frame from the pocket 12 and above the light emission. Grain 3. = ' so that it can have better line arc and no, = space at the same time. As described above, the present invention covers the lead frame and the mouth in an in-mold injection manner, and exposes a part of the second conductive support to the top surface of the base for the metal wire to be connected, not only in the mouth. A better arcing degree can be obtained without increasing the space of the recesses, and a thinner encapsulant can also be obtained, so that the illuminating crystal grains can be contacted and converted with the phosphor powder of the encapsulant in a short time to improve the uniformity of the light. The 'other' body of this new type is simpler and cheaper than the ceramic body, regardless of the process or material cost, and the molded body is less likely to leak light and heat like the ceramic seat. Resisting the problem, it is indeed the purpose of this new type. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention cannot be limited thereto, that is, the simple equivalent change and modification made by the novel patent application scope and the novel description content, All remain within the scope of this new patent. 10 M366177 [Explanation of main component symbols] 1 ....... .... Seat 11... • Top surface 111... - Raw sugar surface 12... ···· Pocket 120 ... •... Inner wall surface 200 ...· Conductor frame material 2..................Conducting bracket material 20...... ...·Material edge 21...... ...·First conductive support 211 ···. Day grain 5 is set to £22 .........the second conductive support 221.......the guiding portion 222.......the guiding surface 23 ....the connecting portion 3 0. ........Light-emitting die 300.......Light-emitting diode package structure 31 .........metal wire 32 ......... package colloid 33 .........Optical lens 12