M361018 五、新型說明： 【新型所屬之技術領域】 特別是指一種用以測試— 本新型是有關於一種探針 印刷電路板的探針。 【先前技術】 為了對電子產品之品質進行控管，一般需要藉由對電 子產品内之印刷電路板進M361018 V. New description: [New technology field] Especially for testing - this is a probe for a probe printed circuit board. [Prior Art] In order to control the quality of electronic products, it is generally required to enter the printed circuit board in the electronic product.
试，來加以判斷印刷電 路板上k件之紐參數是否合乎品質標準。 常^的測試方式是在印刷電路板的線路上設置測試點 透過白點之表面分別以錫f形成球狀凸起結構， 1過自動化賴設備式的探針直 :之:求狀凸起結構，來加以量取相關之電性參數(例如電: 值、電容值或電感值等）。 =著加卫精度的提相及因應電子產品微小化f求， 刷電路板亦朝向小魏时向發展，職點的尺寸也因 湏縮h 疋，因為自動化測試設備難免發生定位誤 馬塑在測试過程令經常會發生探針扎偏測試點的現象，而 如a 了測試的品質。因此匕’如何根據測試 合的探針料為-待解決的問題。 出適 【新型内容】 口此’本新型之目# ’即在提供—種在測試點尺寸逐 漸縮小下仍不會扎偏測試點的探針。 於是，本新型探針用以測試一印刷電路板上的測試點 ，該探針包含-探針頭部及多數個尖端部。該探針頭部為 M361018 圓柱型’且該探針頭部之直徑相對於該測試點之直徑的比 例介於1.42倍至2.15倍。該等尖端部呈矩陣式排列地 於該探針頭部末端，各該尖端部為倒錐型且具有-端點。接 該探針頭部之直徑相對於該測試點之直徑的比例較佳 地為介於丨.8倍至2倍，而最佳地為丨騎。㈣例較佳 =點至該探針頭部的高度至少為。14_，較佳地為 4_至〇.2mm，而最佳地為(U9mm。 二相：：針包含九個尖端部，且該探針頭部之直徑相對於 ::、點之間距的比例介於2_78倍至317倍 施例中，該探針頭部之直徑為。·64 之間距為0.22 mm。 作㈣嗬點 較佳地，各該尖端部為倒四角錐型。 =型之功效：藉由該探針頭部之直㈣目㈣ ^直㈣比㈣於⑽倍至2_15倍的料，使該探針於 點尺寸逐漸縮小下仍不會扎偏該測試點。 【實施方式】 有關本新型之前述及其他技術内容、特點與功效，在 清楚:::考圖式之—個較佳實施例的詳細說明中，將可 用以=圖/圖2與圖3,本新型探針1之較佳實施例， 測試路板2上的職點21，在本實施例中， h ‘，、、錫膏製成的球狀凸起物且其直徑為D卜 部13探t、1包含—供連結於自動化測試設備（圖未示）的本體 連接於本體部13的末端的探針頭部11，及多數個 M361018 呈矩陣式排列地連接於探針頭部u末端的尖端部i2。各尖 端部12為倒錐型且具有一端點121。於本實施例中，本= 部13的直徑小於探針頭部u的直徑，且本體部u、探針 頭部11與該等尖端部12為一體成型。 為方便之後的說明，定義探針頭部U的直徑為⑴、端 點121至探針頭部u的高度$ H、二相鄰端點ΐ2ι之間距 為S。Try to determine whether the parameters of the k-piece on the printed circuit board meet the quality standards. The usual test method is to set the test point on the printed circuit board line through the surface of the white point to form a spherical convex structure with tin f, respectively. 1 The probe of the automatic device type is straight: the convex structure , to measure the relevant electrical parameters (such as electricity: value, capacitance value or inductance value, etc.). = With the emphasis on the accuracy of the edifice and the miniaturization of the electronic products, the brush circuit board is also developing towards the small Wei, and the size of the job position is also due to the h湏, because the automated test equipment is inevitably misplaced. The test process often causes the probe to be skewed to the test point, such as the quality of the test. Therefore, how to make a problem based on the test probe material is to be solved. Appropriate [New Content] This is a new type of target that provides a probe that will not pinpoint the test point as the size of the test point is gradually reduced. Thus, the novel probe is used to test a test point on a printed circuit board that includes a probe head and a plurality of tips. The probe head is M361018 cylindrical type and the ratio of the diameter of the probe head to the diameter of the test point is between 1.42 and 2.15 times. The tip portions are arranged in a matrix at the end of the probe head, each of the tip portions being of an inverted cone type and having an end point. The ratio of the diameter of the probe head to the diameter of the test point is preferably between 8 and 2 times, and most preferably the ride. (4) Example is better = the height of the head to the probe is at least. 14_, preferably 4_ to 〇.2mm, and most preferably (U9mm. Two-phase:: the needle contains nine tip portions, and the diameter of the probe head is relative to::, the ratio between the points In the case of 2_78 times to 317 times, the diameter of the probe head is 0.22 mm between the distances of 64. For the (4) 嗬 point, preferably, the tip portion is an inverted quadrangular pyramid type. : By the straight (four) mesh (four) ^ straight (four) ratio (four) of the probe head (4) to (2) times to 2 - 15 times, the probe will not be biased to the test point when the spot size is gradually reduced. The foregoing and other technical contents, features and effects of the present invention will be described in the following detailed description of a preferred embodiment of the present invention: FIG. 2 and FIG. A preferred embodiment of the first embodiment, test the job site 21 on the road board 2, in this embodiment, h ',,, the spherical protrusion made of solder paste and the diameter of the D portion 13 probe t, 1 contains - a probe head 11 connected to the end of the body portion 13 to which the body connected to the automated test equipment (not shown) is connected, and a plurality of M361018 are connected in a matrix arrangement The tip end portion i2 of the head end u. Each tip end portion 12 is of an inverted cone type and has an end point 121. In this embodiment, the diameter of the body portion 13 is smaller than the diameter of the probe head u, and the body portion u, The needle head 11 is integrally formed with the tip portions 12. For convenience of explanation, the diameter of the probe head U is defined as (1), the height of the end point 121 to the probe head u is $ H, and two adjacent ends The distance between ΐ2ι is S.
探針頭部11之直徑D2相對於測試點21之直徑D1的 比例’丨於1.42倍至2.15倍。而較佳地為介於i 8倍至2倍 ’而最佳地為1_8倍。藉由探針頭吾p 直徑的相對於測 試點211直徑D1的比例設計，使探針1於測試點21尺寸 逐漸縮小下仍不會扎偏測試點21，確保探針i與測試點Μ 接觸的準確性。 端點121至探針頭部11的高度Η至少為ο.η随’較 4也，介於0.14 mm至〇·2麵，而最佳地為〇 19酿。如 此的间度Η設计使尖端部12插於測試點21後助焊劑盘 其他異物不㈣留在尖端部12上而影響之後的測試品質。” 在本實把例+探針j包含九個呈倒四 部12,並以3乘3的太彳化土 士 -采的方式矩陣排列。其中，探針頭部U之 仏D2相對於一相鄰端點121之間距s的比例介於a】 I 7倍@才水地，藉由前述的比例得到的間距S使尖 ‘部12插於測續點9 1 Μ 、…” 後’助焊劑與其他異物不易殘留在 尖鳊部12上而影響測試品質。 1不合以上的設計參數，當探針1應用於-直徑D1為14 5 M361018 ⑽的測朗21時，於最佳設計參數下，探^部η之直 徑D2為0·64咖，二相鄰端 々问此δ為0.22 mm， 知點121至探針頭部高度Η為〇.19_。 綜上所述’藉由探針頭部u之隸叫相對於測試點 之直徑m &比例介於142倍至215倍的設計使探針 1於測試點21尺寸逐漸縮小下仍不易扎偏職點21，所以 確實能達成本新型之目的。 ▲惟以上所述者’僅為本新型之較佳實施例而已，當不 能以此限定本新型實施之範圍’即大凡依本新財請專利 範圍及新型說明内容所作之簡單的等效變化與修飾，皆仍 屬本新型專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一立體圖，說明本新型探針之較佳實施例； 圖2是該較佳實施例的仰視圖；及 圖3是一示意、圖，$明該較佳實施例與一印刷電路板 上的測試點。 M361018 【主要元件符號說明】 1…… •…探針 21 ….· •…測試點 11 ••… •…探針頭部 D1 ···· •…測試點直徑 12…… …·尖端部 D2 ··· •…探針頭部直徑 121 ... …·端點 Η…… 南度 13••… •…本體部 S…… •…間距 2…… •…電路板The ratio of the diameter D2 of the probe head 11 to the diameter D1 of the test point 21 is 1.41 to 2.15 times. Preferably, it is between 8 and 2 times and is preferably 1 to 8 times. By designing the diameter of the probe head p relative to the diameter D1 of the test point 211, the probe 1 will not be biased to the test point 21 when the size of the test point 21 is gradually reduced, ensuring that the probe i is in contact with the test point Μ. The accuracy. The height Η of the end point 121 to the probe head 11 is at least ο.η with '4', ranging from 0.14 mm to 〇·2, and most preferably 〇19. Such an intermediate design allows the tip portion 12 to be inserted into the test point 21 after the flux pad. Other foreign matter does not (4) remain on the tip end portion 12 to affect the subsequent test quality. In the present example, the probe j contains nine inverted four-parts 12, and is arranged in a matrix of 3 by 3 in the form of a Taisho-Take-in-the-Loop. Among them, the probe head U has a 仏D2 relative to one phase. The ratio of the distance s between the adjacent end points 121 is between a] I 7 times @才水地, and the pitch S obtained by the aforementioned ratio causes the tip portion 12 to be inserted at the test point 9 1 Μ , ..." after the flux It is not easy to remain on the tip portion 12 with other foreign matter, which affects the test quality. 1 does not meet the above design parameters, when the probe 1 is applied to the diameter D1 of 14 5 M361018 (10), under the optimal design parameters, the diameter D2 of the probe part η is 0·64 coffee, two adjacent The end point is δ is 0.22 mm, and the height of the point 121 to the probe head is 〇.19_. In summary, by the design of the probe head u relative to the diameter of the test point m & ratio of 142 times to 215 times, the probe 1 is still not easy to be biased when the size of the test point 21 is gradually reduced. At 21, it is indeed possible to achieve the purpose of this new model. ▲ However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention cannot be limited by this, that is, the simple equivalent change made by the scope of the new patent and the new description of the new patent is Modifications are still within the scope of this new patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a preferred embodiment of the present invention; FIG. 2 is a bottom view of the preferred embodiment; and FIG. 3 is a schematic view and a preferred embodiment. Example with a test point on a printed circuit board. M361018 [Description of main component symbols] 1...... •...Probe 21 ..... •...Test point 11 ••... •...Probe head D1 ···· •...Test point diameter 12... ...·Tip part D2 ··· •...probe head diameter 121 ... ...end point Η... South degree 13••... •...body part S... •...pitch 2... •...board