M350206 八、新型說明： 【新型所屬之技術領域】 本創作係有關一種金屬核心印刷電路板（MCPCB)，旨 在提供一種具有較佳適用性及實用性，以及大幅提升其 所裝載的元件廢熱傳導效率的金屬核心印刷電路板 (MCPCB)結構改良。 ' 【先前技術】 •發光二極體（LED)挾其高效率、節能與可調光性之優 勢在照明市場已逐漸形成風潮，其在路燈、車燈、戶外 照明、情境照明等應用已是全球矚目的焦點，採用發光 二極體所面臨的挑戰包括溫度管理與較高組裝成本的問 題；此外，該市場也要求在單位光源下具有較高的光度 輸出。 傳統的方法是將發光二極體晶片安裝在基體上使構 成離散式的發光二極體元件，接著再將這些發光二極體 • 元件配置在印刷電路板（PCB)上，形成多重發光二極體光 ' 源組合，藉以提升照明度。再者，為了因應不同電氣裝 -置内部的空間配置，習用多重發光二極體光源組合多如 第一圖所示，選擇以軟性電路板l(FPC)裝載發光二極體 2(或其他電子元件），主要利用軟性電路板l(FPC)可供彎 折的特性，讓所裝載的發光二極體2(或其他電子元件） 得以順著電氣裝置内部的彎弧或轉折配置。 然而，利用軟性電路板裝載發光二極體或其他電子元 5 M350206 件的缺點在於軟性電路板的成本太高’加上軟性電路板 的散熱效率較羞。整體而言，利用軟性電路板裝載發光 -極體或其他電子元件，僅能夠配合裝設在電氣裝置的 =他機械主體上，無法直接成為機械主體的一部分，相 #適用性及實用性較低。 尤其，軟性電路板所裝載的發光二極體或其他電子元 牛所產生的廢熱，必須先傳導至其他機械主體之後，再 ^其他機械主艏向外釋放，進而影響其所裝載之發光二 糨艏或其他電孑元件的散熱效率。 [新蜇内容】 有鑑於此，本創作之主要目的即在提供一種具有較佳 適用性及實用性，以及大幅提升其所裝載的元件廢熱傳導 妹率的金屬核心印刷電路板（MCPCB)結構改良。 為達上揭目的，本創作之金屬核心印刷電路板（MCPCB) 德以一具有特定厚度的金屬基板層做為主要機械結構 雜，男外在一銅箔線路層建構有依照其所裝載元件而佈設 的電氣走線，以及在金屬基板層與銅箔線路層之間設有一 絕緣薄層加以隔離；其中，金屬基板層係在其板面設有若 子乎行配置的溝槽，使金屬基板層具有可以沿著溝槽彎 折、定型之特性’並且保持應有的支撐作用。 本創作之功效之一，在於可直接做為電氣裝置的支撐 結構體或殼體，藉以增加金屬核心印刷電路板之適用性及 實用性。 M350206 本創作之功效之二，在於金屬基板層具有較佳的散熱 作用，使所裝載的發光二極體或其他電子元件獲致較佳的 .效能。 • ，， 本創作之功效之三，在於絕緣薄層可將熱阻降到最 低，同時提供良好的黏合效果，以增加整體金屬核心印刷 電路板可靠度。 * 本創作之功效之四，在於可直接做為電氣裝置的支撐 - 結構體或殼體，亦即當金屬核心印刷電路板係供裴载發光 • 二極體使用時，可配合將金屬核心印刷電路板彎折成為照 明設備之殼座或燈架，大幅提升發光二極體之廢熱傳導效 率，以符合高亮度發光二極體照明設備之設計需求。 【實施方式】 本創作之特點，可參閱本案圖式及實施例之洋細說明 而獲得清楚地瞭解。 如第二圖本創作金屬核心印刷電路板外觀立體圖，及 φ 第三圖本創作金屬核心印刷電路板結構剖視圖所示，本創 作之金屬核心印刷電路板1 〇係包括有.一金屬基板層 11、一銅箔線路層12，以及一絕緣薄層13 ;其中： 金屬基板層11係由特定厚度的金屬板片所構成，主 要做為金屬核心印刷電路板之機械結構體，其可以為 具有特定厚度的鋁板、鋁合金金屬板，或具有特定厚度的 銅板、銅合金金屬板’並且在其板面設有若干平行配置的 溝槽111，各溝槽111的斷面係以特定開口角度的V型斷 7 M350206 =佳使金屬基板層u具有可以沿著溝槽Hi彎折、 疋里之特性’並且保持應有的支揮作用，而溝槽ill的斷 面也可以為微型S型斷面（如第六圖所示）。 銅笛線路層12係供裝載電子元件（如圖所示之發光 二極體2或其他電子元件），因此建構有依照所裝載電子 元件而佈設的電歧線；至於，轉薄層13係設於該金 屬基板層11與_線路層12之間，主要將金屬基板層 11與銅箔線路層12加以隔離，使能夠避免短路，而且不 致於犧牲太多的散熱速率，以便將熱阻降到最低，同時對 金屬基板層11與銅鎘線路層12提供良好的黏合效果，增 加整體金屬核心印刷電路板10的可靠度。 由於，本創作之金屬核心印刷電路板1〇係以特定厚度 的金屬基板層11做為機械結構體，而且金屬基板層11係在 其板面設有若干平行配置的溝槽ill，如第四圖所示，使 整體金屬核心印刷電路板1 〇具有可配合電氣裝置彎折、定 型的特性，可直接做為電氣裝置的支撐結構體或殼體。 請同時配合參照第二圖及第五圖所示，當本創作之金 屬核心印刷電路板係供裝载發光二極體2使用時，可配 合將金屬核心印刷電路板10彎折成為照明設備20之燈架 21或殼座；或者，如第七圖所示，金屬核心印刷電路板10 可設計為不同形狀’並且在金屬基板層11板面設有若干交 錯配置的溝槽111，即可如第八圖所示，彎折為不同形式 的殼座；再者，由於金屬基板層11具有較佳的散熱作用， 加上絕緣薄層13可將熱阻降到最低，使發光二極體2之廢 8 M350206 熱得以快速經由絕緣薄層13傳導至合 '放’大幅提升發光二極體2之廢熱傳；”向外釋 度發先二極體照明設備之設計導政率’以符合高亮 綜上所述，本創作提供一較佳可 呈新型專利之申請=;= 仍可能基於本創作之揭示而作各 人士 之替換及修飾。因从 ㈣本案創作精神 ^43^^ 本創作之保護範圍應不限於實施例 :揭不者’而應包括各種不背離本 :施： 為以下之切專利所涵蓋。 ㈣及修飾’並 【圖式簡單說明】 第一圖係為一種習用多重發光二極體光源組合之結構示 意圖。 第二圖係為本創作之第一實施例金屬核心印刷電路板外 觀結構圖。 φ第二圖係為本創作之第一實施例金屬核心印刷電路板結 • 構剖視圖。 第四圖係為本創作之第一實施例金屬核心印刷電路板使 用狀態示意圖。 第五圖係為本創作之第二實施例金屬核心印刷電路板使 用狀態示意圖。 第六圖係為本創作之第三實施例金屬核心印刷電路板結 構剖視圖。 9M350206 VIII. New Description: [New Technology Field] This creation is about a metal core printed circuit board (MCPCB) designed to provide a better applicability and practicality, as well as greatly improve the waste heat conduction of the components it loads. Improved metal core printed circuit board (MCPCB) structure. [Prior Art] • The advantages of high efficiency, energy saving and dimming of light-emitting diodes (LEDs) have gradually formed a trend in the lighting market. Their applications in streetlights, headlights, outdoor lighting, and situational lighting are already The focus of global attention, the challenges of using LEDs include temperature management and higher assembly costs; in addition, the market also requires higher photometric output under unit light sources. The conventional method is to mount a light-emitting diode chip on a substrate to form a discrete light-emitting diode component, and then arrange the light-emitting diode components on a printed circuit board (PCB) to form multiple light-emitting diodes. The combination of body light's source to enhance illumination. Furthermore, in order to respond to the internal space configuration of different electrical installations, the conventional multiple-emitting diode source combination is as shown in the first figure, and the light-emitting diode 2 (or other electronic device) is selected to be mounted on a flexible circuit board (FPC). The component) mainly utilizes the flexible circuit board 1 (FPC) to be bent, so that the mounted light-emitting diode 2 (or other electronic components) can be arranged along the arcing or turning of the inside of the electrical device. However, the disadvantage of using a flexible circuit board to mount a light-emitting diode or other electronic component 5 M350206 is that the cost of the flexible circuit board is too high, and the heat dissipation efficiency of the flexible circuit board is rather shy. In general, the use of a flexible circuit board to mount a light-emitting body or other electronic component can only be fitted to the mechanical body of the electrical device, and cannot directly become a part of the mechanical body. Phase # is less suitable and practical. . In particular, the waste heat generated by the light-emitting diodes or other electronic bulls loaded on the flexible circuit board must be transmitted to other mechanical bodies first, and then released by other mechanical mains, thereby affecting the light-emitting diodes loaded thereon. Heat dissipation efficiency of 艏 or other electrical components. [New Content] In view of this, the main purpose of this creation is to provide a metal core printed circuit board (MCPCB) structure with better applicability and practicality, as well as a significant increase in the component's waste heat conduction ratio. . In order to achieve the goal, the metal core printed circuit board (MCPCB) of this creation is made of a metal substrate layer with a certain thickness as the main mechanical structure, and the male outside of a copper foil circuit layer is constructed according to the components loaded thereon. The electrical wiring is arranged, and an insulating thin layer is disposed between the metal substrate layer and the copper foil circuit layer for isolation; wherein the metal substrate layer is provided with a groove arranged on the surface of the board to make the metal substrate layer It has the property of being able to bend and shape along the groove and maintain its proper support. One of the effects of this creation is that it can be directly used as a support structure or housing for an electrical device, thereby increasing the applicability and practicability of the metal core printed circuit board. M350206 The second effect of this creation is that the metal substrate layer has a better heat dissipation effect, so that the loaded light-emitting diode or other electronic components can achieve better performance. • , , The third of the benefits of this creation is that the insulating thin layer minimizes thermal resistance while providing good adhesion to increase overall metal core printed circuit board reliability. * The fourth effect of this creation is that it can be directly used as a support for the electrical device - structure or housing, that is, when the metal core printed circuit board is used for the light-emitting illumination. • When the diode is used, the metal core can be printed. The circuit board is bent into a housing or a lamp holder of the lighting device, which greatly improves the waste heat conduction efficiency of the light-emitting diode to meet the design requirements of the high-brightness light-emitting diode lighting device. [Embodiment] The characteristics of this creation can be clearly understood by referring to the drawings and the detailed description of the embodiments. As shown in the second figure, the appearance of the metal core printed circuit board, and the third view of the metal core printed circuit board, the metal core printed circuit board 1 includes a metal substrate layer 11 a copper foil circuit layer 12, and an insulating thin layer 13; wherein: the metal substrate layer 11 is composed of a metal plate of a specific thickness, mainly as a mechanical structure of a metal core printed circuit board, which may be specific a thickness of aluminum plate, aluminum alloy metal plate, or copper plate with a specific thickness, copper alloy metal plate 'and a plurality of grooves 111 arranged in parallel on the plate surface thereof, each groove 111 having a section with a specific opening angle of V Shape 7 M350206 = good metal substrate layer u has the characteristics of being able to bend along the groove Hi, and maintain the proper support, and the section of the groove ill can also be a micro S-section (as shown in the sixth figure). The copper flute circuit layer 12 is for loading electronic components (such as the light-emitting diode 2 or other electronic components as shown), and thus is constructed with electrical lines arranged in accordance with the loaded electronic components; as for the thin layer 13 Between the metal substrate layer 11 and the _ wiring layer 12, the metal substrate layer 11 and the copper foil circuit layer 12 are mainly isolated to avoid short circuit, and the heat dissipation rate is not sacrificed, so as to reduce the thermal resistance to At the same time, the metal substrate layer 11 and the copper-cadmium wiring layer 12 are provided with a good bonding effect, and the reliability of the overall metal core printed circuit board 10 is increased. Since the metal core printed circuit board 1 of the present invention has a metal substrate layer 11 of a specific thickness as a mechanical structure, and the metal substrate layer 11 is provided with a plurality of parallelly disposed trenches ill on the surface thereof, such as the fourth As shown in the figure, the integral metal core printed circuit board 1 〇 has the characteristics of being bendable and shaped to match the electrical device, and can be directly used as a support structure or a casing of the electrical device. Please also refer to the second and fifth figures. When the metal core printed circuit board of the present invention is used for loading the light-emitting diode 2, the metal core printed circuit board 10 can be bent into the lighting device 20 The lamp holder 21 or the housing; or, as shown in the seventh figure, the metal core printed circuit board 10 can be designed in different shapes 'and a plurality of grooves 111 arranged in a staggered manner on the surface of the metal substrate layer 11 can be As shown in the eighth figure, the shell is bent into different forms; furthermore, since the metal substrate layer 11 has a better heat dissipation effect, the insulating thin layer 13 can minimize the thermal resistance, so that the light emitting diode 2 The waste 8 M350206 heat can be quickly transmitted through the insulating thin layer 13 to the 'discharge' to greatly enhance the waste heat transfer of the light-emitting diode 2; "outward release rate of the first diode lighting device design guide rate" to meet the high In summary, this creation provides a better patentable application =; = may still be replaced and modified by each person based on the disclosure of this creation. Because of the creation of the case (4) the spirit of the case ^43^^ The scope of protection should not be limited to the example: 'There should be a variety of not to deviate from this: Shi: Covered by the following patents. (d) and modification 'and [simple description of the schema] The first diagram is a schematic diagram of a conventional multi-light diode source combination. The second figure is the appearance structure diagram of the metal core printed circuit board of the first embodiment of the present invention. The second figure is the cross-sectional view of the metal core printed circuit board structure of the first embodiment of the creation. The first embodiment is a schematic diagram of the state of use of the metal core printed circuit board. The fifth figure is a schematic diagram of the state of use of the metal core printed circuit board of the second embodiment of the present invention. The sixth figure is the metal core printing of the third embodiment of the present invention. A cross-sectional view of the board structure. 9