12985i^Stwf.d〇c/g 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種光源模組，且特別是有關於一種 利用發光二極體（Light Emitting Diode，LED )的光源模組。 【先前技術】 發光二極體是一種半導體元件，其主要是由ΙΠ-ν族 元素化合物半導體材料所構成。這種半導體材料具有將4 能轉換為光的特性。詳細地說，對這種半導體材料施加電 流時，半導體材料内部之電子會與電洞結合，並且將過^ 的能量以光的形式釋出，而達成發光的效果。 由於發光二極體的發光現象不屬於熱發光或放電發 光，而是屬於冷性發光，所以發光二極體裝置在散熱良4 的情況下，壽命可長達十萬小時以上，且無須暖燈時間 (idling time )。此外，發光二極體裝置具有反應速度快（約 為10 9秒）、體積小、用電省、污染低（不含水銀）、高 可靠度、適合量產等優點，因此其應用的領域十分廣泛。 因此，發光二極體被視為21世紀最重要的光源。但為了達 到照明的目的，習知的技術是不斷加大發光二極體晶片的 面積，使之能通過更多電流，因此單顆發光二極體便能夠 發出更咼凴度的光。然而這衍生出幾個問題： 一、發光二極體為一非常集中的點光源，雖然持續加 大發光二極體晶片埤積的結果可以使得亮度（大於1〇燭光 (cd)以上）不斷上升，而這已經超過日光燈管的亮度，因 此當使用者直視此種發光二極體時容易感到不舒服。為了 12985^3twf.d〇c/g 改善此項缺點，採用發光二極體的燈具通常必須藉由一光 學系統才能提供均勻的平面光源或是其他型態的光源分 >二、由^發光二極體運作時會產生大量的熱能，且發 光二極體的亮度及壽命都會受到溫度的影響，因此當發光 二，體的功率增加時，散熱的需求也就逐漸增加。習知技 術疋使用複雜的散熱系統，然而複雜的散熱系統也會造成 燈具的體積過大以及成本增加等問題。 三、由於發光二極體為一低壓元件，而家用的電源通 常是110或220伏特，因此採用發光二極體的燈具通常需 要搭配-P条電壓電路才能直接使用家用I源。此外，此種 採用低電壓高電流的燈具的能源利用率通常不佳。 【發明内容】 本發明之目的是提供一種光源模組，以提供較大功 的照明。 為達上述或是其他目的，本發明提出一種光源模組， 其包括一基座、一線路載板、多個表面黏著型發光二極體 (surface mount device light emitting diode, SMD LED ) 多數個透鏡及至少-電容關元件。線_板配置於基座 上，且此線路載板具有一第一表面與一第二表面。多個表 面黏著型發光二極體配置於第一表面上。此外，這些表面 黏著型發光二極體為串聯，且這些表面黏著型發 的功率介於（U瓦至〇·5瓦之間。多_透鏡分職置於 這些表面黏著型發光二極體上。電容降壓元件則配置於該 doc/g I2985iS3twf. 基座内，且電容降壓元件、家用電源與這些表面黏著型發 光二極體為串聯。 在本發明之一實施例中，線路載板更具有多個導熱貫 孔。 在本發明之一實施例中，光源模組更包括至少一導熱 金屬線，用以連接基座與線路載板的第二表面之間。 在本發明之一實施例中，線路載板的第二表面亦可為 金屬表面。 在本發明之一實施例中，基座材質包括金屬。 在本發明之一實施例中，基座具有多個散熱葉片。 在本發明之一實施例中，光源模組更包括一散熱絕緣 層’配置於基座與線路載板的第二表面之間。 本發明在線路載板上配置多數個小晶片的表面黏著 型發光二極體，因此本發明之光源模組能提供高功率的照 明。此外，相較於習知技術中高功率大晶片的發光二極體 所產生的熱能會集中於一點上，由於本發明採用陣列排列 的表面黏著型發光二極體，因此本發明之光源模組已具備 較佳的散熱能力。此外，相較於習知技術採用高功率大晶 片需要一複雜的降壓電路以供給小電壓與大電流而達到較 大的亮度，本發明因具有電容降壓元件，故可以透過它來 連接家用電源而無須搭配複雜的降壓電路。 為讓本發明之Jl述和其他目的、特徵和優點能更明顯 易懂，下文特舉較佳實施例，並配合所附圖式，作詳細說 明如下。 12 9 S 5 iS^twf.doc/g 【實施方式】 【第一實施例】 士圖it至圖是本發明第—實施例之一種光源模组的 構不思圖、先茶考圖ία與圖m，本實施例之12985i^Stwf.d〇c/g IX. Description of the Invention: [Technical Field] The present invention relates to a light source module, and more particularly to a light emitting diode (LED) Light source module. [Prior Art] A light-emitting diode is a semiconductor element mainly composed of a ΙΠ-ν element compound semiconductor material. This semiconductor material has the property of converting 4 energy into light. In detail, when a current is applied to such a semiconductor material, electrons inside the semiconductor material are combined with the holes, and the energy of the light is released in the form of light to achieve the effect of light emission. Since the illuminating phenomenon of the illuminating diode is not a thermal luminescence or a discharge luminescence, but a cold luminescence, the illuminating diode device can last for more than 100,000 hours in the case of good heat dissipation, and does not require a warm lamp. Time (idling time). In addition, the light-emitting diode device has the advantages of fast reaction speed (about 109 sec), small volume, low power consumption, low pollution (no mercury), high reliability, and suitable mass production, so the application field is very widely. Therefore, the light-emitting diode is regarded as the most important light source in the 21st century. However, in order to achieve the purpose of illumination, the conventional technique is to continuously increase the area of the light-emitting diode wafer so that it can pass more current, so that a single light-emitting diode can emit more intense light. However, this has led to several problems: 1. The light-emitting diode is a very concentrated point source, although the result of continuous increase in the accumulation of the light-emitting diode chip can cause the brightness (greater than 1 〇 candle (cd) or more) to rise. This already exceeds the brightness of the fluorescent tube, so it is easy for the user to feel uncomfortable when looking directly at the light-emitting diode. In order to improve this shortcoming, 12985^3twf.d〇c/g, lamps using LEDs usually have to provide a uniform planar light source or other types of light sources by an optical system. When the diode operates, a large amount of thermal energy is generated, and the brightness and life of the LED are affected by the temperature. Therefore, when the power of the light is increased, the heat dissipation requirement is gradually increased. Conventional techniques use complex heat dissipation systems, but complex heat dissipation systems can also cause problems such as oversized lamps and increased costs. Third, since the light-emitting diode is a low-voltage component, and the power supply for the home is usually 110 or 220 volts, the light-emitting diodes usually need to be equipped with a -P voltage circuit to directly use the home I source. In addition, such low-voltage, high-current luminaires typically have poor energy efficiency. SUMMARY OF THE INVENTION It is an object of the present invention to provide a light source module to provide greater power illumination. To achieve the above or other objects, the present invention provides a light source module including a pedestal, a line carrier, and a plurality of surface mount device light emitting diodes (SMD LEDs). And at least - the capacitor off component. The line_board is disposed on the base, and the line carrier has a first surface and a second surface. A plurality of surface-adhesive light-emitting diodes are disposed on the first surface. In addition, these surface-adhesive light-emitting diodes are connected in series, and the power of these surface-adhesive hair types is between (U watts to 〇·5 watts). Multiple _ lenses are placed on these surface-adhesive light-emitting diodes. The capacitor step-down element is disposed in the doc/g I2985iS3twf. pedestal, and the capacitor step-down element and the household power source are connected in series with the surface-adhesive light-emitting diodes. In one embodiment of the invention, the line carrier board In one embodiment of the invention, the light source module further includes at least one heat conducting metal wire for connecting between the base and the second surface of the circuit carrier. In one embodiment, the second surface of the line carrier may also be a metal surface. In one embodiment of the invention, the base material comprises a metal. In one embodiment of the invention, the base has a plurality of heat dissipating blades. In an embodiment of the invention, the light source module further includes a heat dissipating insulating layer disposed between the pedestal and the second surface of the circuit carrier. The invention has a surface mount type illuminating light on the line carrier. Polar body, The light source module of the present invention can provide high-power illumination. In addition, the thermal energy generated by the light-emitting diodes of the high-power large wafer in the prior art can be concentrated on one point, because the surface adhesion of the array arrangement of the present invention is adopted. The light-emitting diode of the present invention has a better heat dissipation capability. In addition, the use of a high-power large-chip chip requires a complicated step-down circuit to supply a small voltage and a large current compared to the prior art. With a large brightness, the present invention has a capacitor step-down element, so that it can be connected to a household power source without a complicated step-down circuit. To make the Jl and other objects, features and advantages of the present invention more obvious and understandable DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the preferred embodiment will be described in detail with reference to the accompanying drawings. 12 9 S 5 iS^twf.doc/g [Embodiment] [First Embodiment] The present diagram is the present invention. The structure of a light source module of the first embodiment, the first tea test diagram ία and the figure m, the embodiment
組100包括-基座110、一線路载板12〇、多個點著型 發光二極體130。其中，基座no可以是玻璃、金屬;i 他材質。線路載板120酉己置於基座丄1〇上，而線路戴板 例如是印，電路板。再者，線路載板12〇具有一第—表面 122及-第二表面124’而這些表面黏著型發光; 配^線路載板12G之第—表面m上。此外，這些表面 黏著型發光-極體13G為φ聯，且這絲碌著型二 極體130的功率介於(U瓦至〇 5瓦之間。 "一 光源模組loo更包括多個電子零件14〇與至少一 源引線15G，其中這些電子零件_配置於第二表面124 而電子令件140可以疋用來控制這些表面黏著型發光 ^極體130的運作。電源引線15〇則是提供電子零件14〇 與表面黏著型發光二極體13〇所需的電能。 △圖1C為本實施例之一種光源模組的内部電路圖。請 =考圖1C’上述這些電子零件刚至少包括一電容降壓元 142及-整流$ 144 〇此外’電源引線15()、電容降壓元 件142、整流器144及所有表面黏著型發光二極體13〇之 ”的方式作電性連接。其中，電容降壓元件142 =以了㈣的電轉壓原理’賴消耗大量電能便能將家 電壓降至表面黏著型發光二極體所需的電壓。整流器 doc/g 1298編· ^於習知技術採用高功率發光二極體需搭配散熱設 明將多個表面黏著型發光二極體i3Q串聯，以提 U的照明。此外，由於各個表面黏著型發光二極體 曰的f更容易傳導至外界’因此本發明無須採用 二貝^的散齡統’崎低成本與縮小模組體積。另 I相較於習知技術採用高功率大晶片需要—複雜的降壓 給小電壓與大電流而達馳大的亮度，本發明因 二有電容降壓元件’故可以透過它來連接家用電源而無須 ^己複雜的降壓電路。電容降壓電路並不會像習知複雜的 ㈣電路那樣雜衫的電能，故本發明之統模組比習 t光源模組的電源利用效率更高。再者，由於表面黏著型 ί先一極體130採用陣列方式排列，因此本發明無須搭配 複雜的透鏡組便能提供較為均勻的光源。 請參考_ 1D，為了提高散熱效率，線路載板12〇也 可以具有多個導，貫孔126，而表面黏著型發光二極體13〇 所產生的熱能便經由這些導熱貫孔126導入第二表面 124此外，此光源模組1〇〇更包括至少—導熱金屬線則， /、連接基座110與線路載板12〇的第二表面124之間，因 此表面黏著型發光二極體13Q所產生的熱能便依序經由線 路載板120與導熱金屬線160傳遞至基座110而最終由基 座no表面散逸至空氣中。糾，線路載板12〇的第二表 面124亦可為—金屬表面，以提高熱傳導效率。 doc/g 1298551 請參考圖IE，光源模組1〇〇更可包括一第一透鏡 170a，其配置於基座11G上，並位於這些表_著型發光 二極體130上方。舉例而言，第一透鏡170a可以是平板玻 璃或是透明塑膠，用以保護表面黏著型發光二極體13〇免 於直接接觸外界的污染。 請參考圖1F，第一透鏡17〇1)也可以是一球面透鏡或 非球面透鏡，用以改變光線的角度。 請參考圖1G，光源模組1〇〇更可包括多個第二透鏡 180,分別配置於這些表面黏著型發光二極體13〇上，而這 些第二透鏡180用以改變表面黏著型發光二極體13〇所發 出的光線的角度。根據光源的使用時機，光源模組1〇〇可 以只具有第一透鏡170a或170b。或者，光源模組1〇〇只 具有第二透鏡180。或者，光源模組1〇〇也可以同時具有 第一透鏡170a與第二透鏡·180。或者，光源模組100也可 以同時具有第一透鏡170b與第二透鏡180。 【弟二實施例】 圖2A至圖2F為本發明第二實施例之一種光源模組的 結構示意圖。請參考圖2A與2B，本實施例之光源模組200 與上述實施例之光源模組100相似，其不同之處在於··本 實施例之基座210乃是金屬材質，因此本實施例之光源模 組200具有較佳的散熱能力。此外，基座21〇也可以具有 多個散熱葉片212，以提高散熱效率。 請參考圖2C，線路載板120亦具有多個導熱貫孔 126，其作用與第一實施例中所述相似。此外，由於使用金 1298553s twf.doc/g 屬材質的基座210，因此光源模組200更包括一散熱絕緣 層220,其配置於基座210與線路載板12〇之第二表面124 之間。另外，此散熱絕緣層220例如是散熱膠，因此此散 熱絕緣層220不僅能夠將線路載板12〇固定於基座210 上’且表面黏者型發光二極體130所產生的熱能也可以經 由此散熱絕緣層220傳導至基座210。 請參考圖2D，本實施例之光源模組2〇〇更可包括一第 一透鏡170a。此外，第一透鏡i70b也可以是一球面透鏡 或非球面透鏡’如圖2E所示。 請參考圖2D，本實施例之光源模組2〇〇更可包括多個 第二透鏡180,其分別配置於這些表面黏著型發光二極體 130上，而這些第二透鏡18〇用以改變表面黏著型發光二 極體130所發出的光線的角度。如同上述實施例，光源模 組200也可以只具有第一透鏡17如或17%。或者，光源 模組200只具有第二透鏡18〇。或者，光源模組2〇〇也可 以同時具有第一透鏡17〇a與第二透鏡180。或者，光源模 組200也可以同時具有第一透鏡170b與第二透鏡18〇。 知;上所述，本發明之光源模組至少具有下列優點： 一、本發明在線路載板上配置多數個串聯的表面黏著 型發光一極體，因此本發明之光源模組能夠提供高功率的 照明。 一、由於表面辨著型發光二極體採陣列方式排列，因 此相較於習知技術採用高功率大晶片的發光二極體，本發 明之光源模組已具備較佳的散熱能力。換言之，相較於習 12 12985^3twf.d〇c/g 知技術採肖高功率發光二極體祕料貴 ^本發日狀絲池具有降贼本、料無體^等^ •二、相較於習知技術採用高功率大晶片需要—複雜 降壓電路以供給小電壓與Af流❿❹mA的亮度 明因具有電料壓元件，故可⑽過絲連接_電源^ 無須搭配複_降㈣路。f料壓f職不 雜的降壓電_樣雜過多的電能，故本 = 比習知光源模組的電源利用效率更高。 先原杈、、且 四、由於表面黏著型發光二極體採用陣列方式排列， =此本發明無祕配漏的透敎便能提供較為均句的光 产五、本發明之光源模組可以應用在如路燈之更高功率 等級的照明。此外，錢光源馳也相整合且， 以提供更高功率的照明。 且’、 雖然本發明已以較佳實施例揭露如上，然其並 =本發明，任何熟習此技藝者，在不脫離本發明之精神 =乾圍内，當可作些許之更動與潤飾，因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。 ϋ 【圖式簡單說明】 圖ΙΑ、IB、ID、IE、1F及1G是本發明第一實施例 之一種光源模組的結構示意圖。 圖ic疋弟一貫施例之一種光源模組的内部電路圖。 圖2Α至圖2F為本發明第二實施例之一種光源模j且的 13 doc/g 結構示意圖。 【主要元件符號說明】 100 :光源模組 110、210 ··基座 120 :線路載板 122 ··第一表面 124 ··第二表面 126 ··導熱貫孔 130 :表面黏著型發光二極體 140 :電子零件 142 :電容降壓元件 144 :整流器 150 :電源引線 160 :導熱金屬線 170a :第一透鏡 170b :第一透鏡 180 第二透鏡 200 光源模組 212 散熱葉片 220 散熱絕緣層 14The group 100 includes a susceptor 110, a line carrier 12 〇, and a plurality of spot-type LEDs 130. Among them, the base no can be glass, metal; i other material. The line carrier 120 is placed on the base 丄1, and the circuit board is, for example, printed, circuit board. Furthermore, the line carrier 12 has a first surface 122 and a second surface 124' which are adhered to the surface; the first surface m of the line carrier 12G. In addition, these surface-adhesive light-emitting bodies 13G are φ-linked, and the power of the wire-type diode 130 is between (U watts to 〇 5 watts.) "One light source module loo includes more than one The electronic component 14A and the at least one source lead 15G, wherein the electronic component_is disposed on the second surface 124 and the electronic component 140 can be used to control the operation of the surface-adhesive light-emitting body 130. The power lead 15〇 is The electrical energy required for the electronic component 14 〇 and the surface-adhesive LED 13 提供 is provided. Δ FIG. 1C is an internal circuit diagram of a light source module of the embodiment. Please refer to FIG. 1C 'The above electronic components just include at least one Capacitor buck element 142 and - rectification $ 144 〇 In addition, 'power lead 15 (), capacitor step-down element 142, rectifier 144 and all surface-adhesive light-emitting diodes 13" are electrically connected. The step-down element 142 = with the principle of electric rotation of (4) 'reliable to consume a large amount of electric energy can reduce the voltage of the home to the voltage required for the surface-adhesive light-emitting diode. Rectifier doc / g 1298 · High in the conventional technology Power LEDs are required The heat setting means that a plurality of surface-adhesive light-emitting diodes i3Q are connected in series to improve the illumination of the U. In addition, since the f of each surface-adhesive light-emitting diode is more easily transmitted to the outside, the present invention does not need to use two shells. The age of the system is 'smoker's low cost and shrinks the module volume. Another I need to use high-power large wafers compared to the conventional technology—complex step-down to give small voltages and large currents to achieve large brightness, the present invention There is a capacitor step-down element, so it can be connected to the household power supply without the need for a complicated step-down circuit. The capacitor step-down circuit does not have the power of a complicated shirt like the conventional (four) circuit, so the module of the present invention The power utilization efficiency of the group is higher than that of the t-light source module. Furthermore, since the surface-adhesive type first-pole body 130 is arranged in an array manner, the present invention can provide a relatively uniform light source without a complicated lens group. Referring to _1D, in order to improve the heat dissipation efficiency, the line carrier 12A may also have a plurality of conductive vias 126, and the thermal energy generated by the surface-adhesive LEDs 13 is introduced through the thermally conductive through holes 126. In addition, the light source module 1 further includes at least a heat conductive metal wire, and a connection between the base 110 and the second surface 124 of the line carrier 12A. Therefore, the surface adhesion type LED 13Q The generated thermal energy is sequentially transmitted to the susceptor 110 via the line carrier 120 and the heat conducting metal wire 160 and finally dissipated into the air by the surface of the pedestal no. The second surface 124 of the line carrier 12 亦可 can also be - The surface of the metal is used to improve the heat transfer efficiency. doc/g 1298551 Referring to FIG. IE, the light source module 1 can further include a first lens 170a disposed on the base 11G and located on the surface of the light-emitting diode Above the body 130. For example, the first lens 170a may be a flat glass or a transparent plastic to protect the surface-adhesive LED 13 from direct contact with the outside. Referring to FIG. 1F, the first lens 17〇1) may also be a spherical lens or an aspheric lens for changing the angle of the light. Referring to FIG. 1G, the light source module 1 further includes a plurality of second lenses 180 disposed on the surface-adhesive LEDs 13 , and the second lenses 180 are used to change the surface-adhesive light-emitting diodes. The angle of the light emitted by the polar body 13〇. The light source module 1 can have only the first lens 170a or 170b depending on the timing of use of the light source. Alternatively, the light source module 1 〇〇 has only the second lens 180. Alternatively, the light source module 1A may have both the first lens 170a and the second lens 180. Alternatively, the light source module 100 may have the first lens 170b and the second lens 180 at the same time. [Second Embodiment] Figs. 2A to 2F are views showing the structure of a light source module according to a second embodiment of the present invention. 2A and 2B, the light source module 200 of the present embodiment is similar to the light source module 100 of the above embodiment, and the difference is that the susceptor 210 of the embodiment is made of a metal material, so the embodiment is The light source module 200 has better heat dissipation capability. In addition, the pedestal 21A may also have a plurality of heat dissipating blades 212 to improve heat dissipation efficiency. Referring to Figure 2C, the line carrier 120 also has a plurality of thermally conductive through holes 126 that function similarly as described in the first embodiment. In addition, the light source module 200 further includes a heat dissipation insulating layer 220 disposed between the base 210 and the second surface 124 of the line carrier 12〇, because the susceptor 210 of the material 1829553s twf.doc/g is used. . In addition, the heat dissipation insulating layer 220 is, for example, a heat dissipating adhesive. Therefore, the heat dissipation insulating layer 220 can not only fix the line carrier 12 〇 on the susceptor 210 but also generate thermal energy generated by the surface viscous LEDs 130. This heat dissipation insulating layer 220 is conducted to the susceptor 210. Referring to FIG. 2D, the light source module 2 of the embodiment may further include a first lens 170a. Further, the first lens i70b may also be a spherical lens or an aspherical lens as shown in Fig. 2E. Referring to FIG. 2D, the light source module 2 of the embodiment may further include a plurality of second lenses 180 respectively disposed on the surface-adhesive LEDs 130, and the second lenses 18 are used to change The angle of the light emitted by the surface-adhesive light-emitting diode 130. As with the above embodiment, the light source module 200 may also have only the first lens 17 such as or 17%. Alternatively, the light source module 200 has only the second lens 18A. Alternatively, the light source module 2A may have both the first lens 17a and the second lens 180. Alternatively, the light source module 200 may have both the first lens 170b and the second lens 18''. As described above, the light source module of the present invention has at least the following advantages: 1. The present invention arranges a plurality of series-surface surface-adhesive light-emitting ones on a line carrier board, so that the light source module of the present invention can provide high power Lighting. 1. Since the surface-recognizing light-emitting diodes are arranged in an array manner, the light source module of the present invention has better heat dissipation capability than the light-emitting diodes of the high power and large wafers. In other words, compared to Xi 12 12985 ^ 3twf.d〇c / g know the technology mining high power LED dilute secrets expensive ^ this hair of the Japanese silk pool has a thief, the material is not ^ ^ ^ 2 Compared with the conventional technology, high-power large-chip needs to be used—complex-voltage circuit to supply small voltage and Af flow mA. The brightness of the mA has a material pressure element, so (10) wire connection _ power supply ^ no need to match complex _ drop (four) road. f material pressure is not a mixed step-down electricity _ like a lot of electrical energy, so this is higher than the power utilization efficiency of the conventional light source module. First, the original surface, and four, because the surface-adhesive light-emitting diodes are arranged in an array manner, = this invention can provide a relatively uniform light-emitting product without the secret leakage of the present invention. Applied to higher power levels such as street lights. In addition, Qianyuanchi is also integrated to provide higher power lighting. And, although the present invention has been disclosed in the above preferred embodiments, and the present invention, any skilled person skilled in the art can make some modifications and retouchings without departing from the spirit of the present invention. The scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. IB, ID, IE, 1F, and 1G are schematic diagrams showing the structure of a light source module according to a first embodiment of the present invention. Figure ic shows the internal circuit diagram of a light source module. 2A to 2F are schematic diagrams showing a 13 doc/g structure of a light source module according to a second embodiment of the present invention. [Description of main component symbols] 100: light source module 110, 210 · pedestal 120: line carrier 122 · · first surface 124 · · second surface 126 · · thermally conductive through hole 130 : surface-adhesive light-emitting diode 140: electronic component 142: capacitor step-down element 144: rectifier 150: power supply lead 160: heat conductive metal line 170a: first lens 170b: first lens 180 second lens 200 light source module 212 heat sink blade 220 heat dissipation insulation layer 14