M337849 八、新型說明： 【新型所屬之技術領域】 、本創作是有關於一種發光二極體’且特別是有關於 種適用於發光二極體的引線框架。 【先前技術】M337849 VIII. New description: [New technical field] The present invention relates to a light-emitting diode and in particular to a lead frame suitable for a light-emitting diode. [Prior Art]
現今而言，在半導體電子元件的封裝製程中，大多是 在引線框架(lead frame)上形成—絕緣基座以承載晶粒 ㈣’再經由锌線（wire b〇nding)步驟，利用導電性佳的金 屬鮮線，將晶粒與導線架上的鏤空接腳區（iead)互相連结， 使得電路訊號能傳送至外界，然⑽進行封膠（mGiding)。 習知引線框架含有導體片、鏤空 座。製作習知引線框架時，需將絕緣基座模具插= 片之鏤空區中’以供後續灌入塑膠料而得到絕緣基座。 然而’在上述處理中，為了達到良好的阻隔效果，必 須將絕緣基座模具緊密且精確地***導體片之鏤空區 中’由於插人之絕緣基座模具會對導體片產生—應力，該 應力往往會壓壞導體片而減低產品壽命及產量。另一方 面，當絕緣基座模具並未緊密接合時，在灌注塑膠料的過 程中’塑㈣會由絕緣基座模具的合模面溢出而使得所形 成的絕緣基座產生毛邊，造成產品良率不佳。 基於上述問題，需要一種新的引線框架，以降低製 造過程中壓壞導體片以及形成毛邊之可能性。 5 M337849 【新型内容】 本創作一方面就是在提供一種引線框架，其可降 低製造過程中壓壞導體片以及形成毛邊之可能性。 根據本創作一實施例，一種引線框架包含一導體片、 一鏤空承載區、一絕緣基座、複數個鏤空接腳區以及複數 個隔板。其中，鏤空承載區位於導體片中。絕緣基座覆蓋 鏤空承載區。鏤空接腳區分佈於鏤空承載區的周圍。隔板 則區隔鎮空承載區與鏤空接腳區。 根據本創作另一實施例，一種引線框架包含一導體 片、一鏤空區、一絕緣基座以及複數個隔板。其中，導體 片具有功能區，以及圍繞功能區之周邊區。鏤空區位於導 體片中。絕緣基座位於導體片之功能區上，並覆蓋至少部 分之鏤空區。隔板與絕緣基座相献鄰，並將鏤空區區隔為 位於功能區之一鏤空承載區，以及位於周邊區之一鏤空接 腳區。 【實施方式】 以下將參照圖示詳細說明本創作之精神，如熟悉此技 術之人貝在瞭解本創作之實施例後’當可由本創作所教示 之技術，加以改變及修飾，而不致悖離本創作之精神與範 圍。 第1圖繪示依照本創作一實施例之引線框架1 〇 〇的上 視圖。弟2圖繪示第1圖之導體片102的上視圖^同時 參照第1及2圖，引線框架100包含導體片1〇2、鎮空承 6 M337849 載區104、複數個鏤空接腳區1〇6、複數個隔板1〇8以及絕 緣基座110。其中，鏤空承載區1〇4位於導體片1〇2中。鏤 空接腳區106分佈於鏤空承載區1〇4周圍。隔板1〇8則區 隔鏤空承載區104和鏤空接腳區106。 從另一個角度來看，上述之鏤空承載區1〇4與鏤空接 .腳區1〇6,可以合起來看做位於導體片1〇2中的鏤空區，而 導體片102本身則區分為功能區12〇與周邊區13〇，其中周 φ 邊區13〇圍繞功能區12〇的外圍。絕緣基座11 〇位於導體 片102之功能區120上，並覆蓋至少部分之鏤空區（亦即覆 蓋鏤空承載區104)。此外，隔板108與絕緣基座11〇相毗 鄰，並將鏤空區區隔為位於功能區丨2〇之鏤空承載區ι〇4, 以及位於周邊區130之鏤空接腳區1〇6。 在本實施例中，導體片102與隔板108係可一體成形。 亦即，導體片102與隔板1〇8可具有相同的材料，且相互 連接。具體而言，導體片102與隔板1〇8的材質可為金屬 φ 或其它撓性材料，以便以沖壓的方式製作。此外，在上述 之沖壓步驟中，鏤空承載區104與鏤空接腳區1〇6也可以 ， 一併成型，而不需另外鑽孔。 • 第2圖之鏤空承載區104的外形可以是η型，以利於 其上形成絕緣基座110。本說明書所稱2「Η型」應解釋為： 「一種形狀，具有三線段，其中兩線段近乎平行，而另一 線段則以幾近垂直的角度，連接該兩近乎平行之線段。」 然而，習知技藝人士當可理解，此種rH型」僅為一例示， 可對此一外型以及相對方位加以更動，仍不致悖離本創作 M337849 之範圍。 在本實施例中，鏤空接腳區1〇6的數量為四，且上述 四個鏤空接腳區106分別比鄰鏤空承載區1〇4的四個角落。 由上文說明並參照附隨圖式，可以發現，根據本創作 只施例在導體片102上形成絕緣基座11 〇時，僅需將一絕 -緣基座之模具放置於本創作之導體片之鏤空承載區1〇4上 _方’接著將塑膠料灌入該絕緣基座之模具中，待塑膠料 φ 成形後移除該模具，即可形成如第1圖所示之引線框架 100。在本實施例中，絕緣基座110之材料可包含環氧樹脂 或其他適當材料。 應特別指出’根據本創作實施例之引線框架，利用了 位於鏤空承載區104以及鏤空接腳區106之間的隔板1〇8 將上述一種鏤空區塊區隔開來，使得灌入之塑膠料不會直 接由鏤空承載區104流入鏤空接腳區106中。因此運用本 創作實施例，便不需如先前技術一般，將絕緣基座之模具 馨緊密且精確地***導體片之鏤空區中，本創作實施例僅 需利用生產機具中原有的定位銷，即可達到定位絕緣 • 基座模具之需求。藉此，在形成絕緣基座110時所用之 •模具不僅不會壓壞導體片102,而且不易有多餘膠體黏 著鏤空接腳區106而形成毛邊。 雖然本創作已以實施例揭露如上，然其並非用以阳^ 本創作，任何熟習此技藝者，在不脫離本創作之精神和範 圍内，當可作各種之更動與潤飾，因此本創作之保護範= 當視後附之申請專利範圍所界定者為準。 M337849 【圖式簡單說明】 為讓本創作之上述和其他目的、特徵、優點與實施例 能更明顯易懂，所附圖式之詳細說明如下·· 第1圖繪示依照本創作一實施例之引線框架的上視 圖。 第2圖繪示第1圖之導體片的上視圖。 :導體片 106 :鏤空接腳區 110 :絕緣基座 130 :周邊區 【主要元件符號說明】 1〇〇 :引線框架 104 :鏤空承載區 10 8 ·隔板 120 :功能區Nowadays, in the packaging process of semiconductor electronic components, the insulating substrate is formed on the lead frame to carry the die (four) and then through the wire b〇nding step, and the conductivity is good. The metal fresh wire connects the die to the hollow pin area (iead) on the lead frame, so that the circuit signal can be transmitted to the outside, and (10) is sealed (mGiding). Conventional lead frames contain a conductor piece and a hollow seat. When fabricating a conventional lead frame, the insulating base mold is inserted into the hollowed-out area of the sheet for subsequent filling of the plastic material to obtain an insulating base. However, in the above treatment, in order to achieve a good barrier effect, the insulating base mold must be tightly and accurately inserted into the hollowed-out region of the conductor piece. The stress is generated by the inserted insulating base mold. It often crushes the conductor pieces and reduces product life and output. On the other hand, when the insulating base mold is not tightly joined, the plastic (four) will overflow from the mold clamping surface of the insulating base mold during the process of pouring the plastic material, so that the formed insulating base is burred, resulting in good product. The rate is not good. Based on the above problems, a new lead frame is required to reduce the possibility of crushing the conductor pieces and forming burrs during the manufacturing process. 5 M337849 [New content] On the one hand, this creation provides a lead frame that reduces the possibility of crushing conductor pieces and forming burrs during manufacturing. According to an embodiment of the present invention, a lead frame includes a conductor piece, a hollow load bearing area, an insulating base, a plurality of hollow pin areas, and a plurality of partitions. Wherein, the hollow bearing area is located in the conductor piece. The insulating base covers the hollow load-bearing area. The hollow pin area is distributed around the hollow bearing area. The partition is separated from the empty bearing area and the hollowing foot area. According to another embodiment of the present invention, a lead frame includes a conductor piece, a hollowed out region, an insulating base, and a plurality of spacers. Among them, the conductor piece has a functional area and a peripheral area surrounding the functional area. The cutout is located in the guide piece. The insulating base is located on the functional area of the conductor piece and covers at least a portion of the hollowed out area. The partition is adjacent to the insulating base, and the hollowed out area is partitioned into a hollow carrying area located in one of the functional areas, and a hollowed out area located in one of the surrounding areas. [Embodiment] Hereinafter, the spirit of the present invention will be described in detail with reference to the drawings, and those skilled in the art, after understanding the embodiments of the present invention, may be modified and modified by the techniques taught by the present invention without departing from the invention. The spirit and scope of this creation. 1 is a top view of a lead frame 1 〇 依照 according to an embodiment of the present invention. 2 shows a top view of the conductor piece 102 of FIG. 1 . Referring to FIGS. 1 and 2 simultaneously, the lead frame 100 includes a conductor piece 1 2 , an air bearing 6 M337849 carrying area 104 , and a plurality of hollow pin areas 1 〇6, a plurality of spacers 1〇8 and an insulating base 110. The hollow bearing area 1〇4 is located in the conductor piece 1〇2. The 镂 empty pin area 106 is distributed around the hollow carrying area 1〇4. The partitions 1〇8 partition the hollow load bearing area 104 and the hollowing foot area 106. From another point of view, the above-mentioned hollow bearing area 1〇4 and the hollowing area. The foot area 1〇6 can be taken together as a hollowed out area in the conductor piece 1〇2, and the conductor piece 102 itself is distinguished as a function. The area 12〇 and the peripheral area 13〇, wherein the circumference φ side area 13〇 surrounds the periphery of the functional area 12〇. The insulating base 11 is located on the functional area 120 of the conductor piece 102 and covers at least a portion of the hollowed out area (i.e., the hollowed-out load bearing area 104). Further, the partition 108 is adjacent to the insulating base 11 ,, and the hollowed out area is partitioned into a hollow bearing area ι 4 located in the functional area , 2 , and a hollow pin area 1 〇 6 located in the peripheral area 130 . In the present embodiment, the conductor piece 102 and the spacer 108 are integrally formed. That is, the conductor piece 102 and the spacer 1 8 may have the same material and are connected to each other. Specifically, the material of the conductor piece 102 and the spacer 1 8 may be metal φ or other flexible material so as to be formed by stamping. Further, in the above-described punching step, the hollow bearing area 104 and the hollow pin area 1〇6 may be formed together without additional drilling. • The cutout carrier area 104 of Fig. 2 may be of an n-shape to facilitate the formation of an insulating base 110 thereon. The term "Η" as used in this specification shall be interpreted as: "A shape having three segments, two of which are nearly parallel, and the other segment connects the two nearly parallel segments at nearly vertical angles." It will be understood by those skilled in the art that such an rH type is merely an example, and that the appearance and relative orientation can be modified without departing from the scope of the present M337849. In the present embodiment, the number of the hollow pin areas 1〇6 is four, and the above four hollow pin areas 106 are respectively adjacent to the four corners of the adjacent hollow carrying area 1〇4. From the above description and with reference to the accompanying drawings, it can be found that, according to the present invention, only the insulating base 11 在 is formed on the conductor piece 102, only a die of the absolute-edge pedestal is placed on the conductor of the present creation. The hollow bearing area of the sheet 1 〇 4 _ square ' is then poured into the mold of the insulating base, and after the plastic material φ is formed, the mold is removed to form the lead frame 100 as shown in FIG. 1 . . In this embodiment, the material of the insulating base 110 may comprise an epoxy resin or other suitable material. It should be particularly pointed out that the lead frame according to the present creative embodiment utilizes a partition 1 〇 8 between the hollow bearing area 104 and the hollow pin area 106 to separate the above-mentioned hollow block area, so that the poured plastic The material does not flow directly into the hollow pin area 106 from the hollow load bearing area 104. Therefore, with the present embodiment, it is not necessary to insert the mold of the insulating base into the hollow area of the conductor piece in a tight and precise manner as in the prior art. The present embodiment only needs to utilize the original positioning pin in the production machine, that is, Achieving the need for locating insulation • pedestal molds. Thereby, the mold used in forming the insulating base 110 not only does not crush the conductor piece 102, but also does not easily have excess colloid adhering to the hollow pin area 106 to form a burr. Although the present invention has been disclosed in the above embodiments, it is not intended to be used for creation. Anyone who is familiar with the art can make various changes and refinements without departing from the spirit and scope of the creation. Protection Fan = The one defined in the scope of the patent application attached is subject to change. BRIEF DESCRIPTION OF THE DRAWINGS In order to make the above and other objects, features, advantages and embodiments of the present invention more obvious, the detailed description of the drawings is as follows: FIG. 1 illustrates an embodiment according to the present invention. Upper view of the lead frame. Fig. 2 is a top view of the conductor piece of Fig. 1. : Conductor piece 106 : Hollow pin area 110 : Insulated base 130 : Peripheral area [Main component symbol description] 1〇〇 : Lead frame 104 : Hollow bearing area 10 8 · Partition 120 : Functional area