200950146 九、發明說明： 【發明所屬之技術領域】 古、、i發月以及種發光二極體用引線框架組件及其製造 p 尤其涉及一種用於製造發光二極體（LED，Light 二二二她)’並且可以提高放熱性能和設計自由度之 發光一極體用引線框架組件以及其製造方法。 【先前技術】 L常發光一極體是在正向施加電壓時發光之半導體 元於白色電燈耗電低、使用壽命長。所= j體包括：與電極（CathQde，相連接之引線框 = ead frame)、安裝於引線框架上的晶片（chip)、用於 已裹引線框架和晶片之封膠（環氧樹脂，epoxy)等。 :如第十二圖和第十四圖所示，用於製造發光二極體的 習知引線框架組件（2Q0)是通過在引線框架謝上擠壓成 型由樹脂材料形成之封裝單元203而形成的。所述引線框 架201由金屬板材組成。 e 、即，使用壓具對具有預定寬度之長條形金屬板材進行 沖孔，以此來形成所需形狀的内部引線框架單元201a、 201b和^子2〇lc。所述複數個内部引線框架單元2〇ia、 201b以及端子201e以相同的距離關設置，並且分別連 接至外部框架單元201d上。 並且’使用擠壓成型裝置在各個内部引線框架單元 201a、201b上用液態樹脂材料製造杯狀或者碗狀之封裝單 = f03。而且使用切割裝置或者壓具將端子201c從外部框 条單元201d切割後將端子2qic彎曲（banciing)，以使端 200950146 子20〗c包裹封裝單元2〇3之—部 據的發光二極體用的引線框架組件200可以根 =要f内部引線框架單元咖上安裝發光二極體晶^ achlp)，並通過引線鍵合來製造發光二極體。體曰曰片 另外’第十五圖是第十四圖之後視圖，而 说線的截面圖，顯示引線框架組件：。 引線框条組件200之封裝單元2〇3的背部上 參 槽2〇33是在成型封裝單元203的過程;= =金屬模具之槽對應單元上形成 注入展置移開時，即使有-部分樹脂殘= 收容於所述槽施的内部。由於這種結構，當所述 兀203被安裝於印刷電路板等裝置上時，即使有不必要 ，材料殘留及凝固在封裝單元2〇3内並形成突起，= 會文其干擾，並可以完好地安裝。 如上所述，由於所述封裝單元203上必須形成有柚 施’因此在減少引線框架組件綱之整體厚度方面: 述之設計具有一定的局限性。 而且，所述封裳單元203之槽203a設置在中央位署 處，因此在進行提高放熱性能之設計時，此結構會起 、力作用即’盡官爲提高發光二極體之發光效率，廯兮姆 大施加於發光二極體的電流，然而由於所述之槽2〇ϋ 能設計出能夠充分放熱之結構。因此，習知具有槽2 之封裝單tl 203的結構在提高發光二極體的發光效率上^ 200950146 有局限性。 並且，I知知子2〇lc爲向側面外側露出並向背部彎曲 之結構，因此在減小發光二極體之厚度方面具有一定的局 限性，從而這種結構在設計上亦存在局限性。 【發明内容】 本發明蓉於上述問題而作，本發明的目的在於提供一 種具有易於放熱之結構，並可以提高發光效率及使用壽命 之用於女裝I光—極體晶片之引線框架組件及其製造方 ® 法。 、 並且’本發明之另—目的在於提供—種減小端子的厚 f並以多種魏來使社發光二極體，從何以提高設計 自由度之用於安裝發光二極體晶片之引線框架組件及其製 造方法。 爲實現本發明之所述目的，本發明提供—種用於安褒 f光二極體晶片之引線框架組件’其包括：第一引線框架 =;第二引線框架單元，其與第-引線框架單元相隔預 © =距料置；以及封料元，其成型於所述第—引線框架 :7L和第二引線框架單元之間及周側’以使所述引線框架 單元上表面和下表面的一部分同時露出。 加„„優選地’ f外部框架上連續設置多個所述第一引線框 术單元、所述第一引線框架單元以及所述封裝單元。 優選地，所述第一引線框架單元或者第二 元中任一個設置在中央位置上。 早 i選地’所述封裝單元成型在所述第—引線框架單元 所述第二弓丨線框架單元之上表面及下表面。 200950146 注入單元。戶斤述外部框架上形成有用於注入樹脂的樹脂 本發明還提供m 架組件之製造方法。種用於安裝發光二極體晶片的引線框 進行沖孔來製作引績方法包括：使用壓具對金屬板材 孔之後，對所步驟:對所述金屬板材進行沖 之鍍金步驟完成之徭架進仃鍍金之步驟；所述引線框架 注入樹脂而形成封夂=:文:使用單元外側向金屬模具 通過3:框=述=”步驟中 ，所述封裝單元 ^、+、、下方向同時進行擠壓成型來製作。 述第-5ί線框竿單^線拒架包括苐一引線框架單元及與所 元，所預定距離設置之第二引線框架單 二引線框架單元之^ =所述第—引線框架單元和所述第 二引線框架單元之。所述第—引線框架單灿所述第 藉此，本發明具有如下優點： 在令央位ΐ上和第二引線框架單元中任-個 熱效率非常優秀，可以接均開放之狀態設置，因此放 長壽命:從而可以提高=:=質增大亮度’並延 框架單元二和第二引'線 過程，因m私 的同時向後曾曲仏拙心叩）的 途使用，從=:=;組:之厚度，以多種用 簡單，達到了提高生產效率並且使製造工程變爲 200950146 3、 由於本發明是通過向引線框架組件的有效使用單 π外側注入樹脂並通過擠壓成型来製造，並在後續步驟中 僅對=需之有效使用單元進行切割来使用的，因此在形成 封裝單元過程巾所生成之凝固的殘留樹脂被切除而在製造 ，光-極體之過程中不會留下不必要的殘留物，達到了提 兩產品品質之效果。 4、 本發明在製作引線框架組件時，向有效使用單元 的外側注讀㈣_向金屬模纽瑞脂，以使臨近設200950146 IX. Description of the invention: [Technical field of invention] The lead frame assembly for ancient, i-month and kind of light-emitting diodes and the manufacture thereof are particularly related to the manufacture of a light-emitting diode (LED, Light 22-2) She) 'and a lead frame assembly for a light-emitting diode that can improve heat release performance and design freedom, and a method of manufacturing the same. [Prior Art] The L-light-emitting one is a semiconductor element that emits light when a voltage is applied in the forward direction, and the white lamp consumes low power and has a long service life. The body = j body includes: an electrode (CathQde, connected lead frame = ead frame), a chip mounted on the lead frame, a package for the wrapped lead frame and the wafer (epoxy) Wait. As shown in the twelfth and fourteenth drawings, a conventional lead frame assembly (2Q0) for manufacturing a light-emitting diode is formed by extrusion molding a package unit 203 formed of a resin material on a lead frame. of. The lead frame 201 is composed of a metal plate. e, that is, an elongated metal plate having a predetermined width is punched using a presser to form inner lead frame units 201a, 201b and 2c. The plurality of inner lead frame units 2A, 201b and the terminal 201e are disposed at the same distance and are respectively connected to the outer frame unit 201d. And a cup-shaped or bowl-shaped package list = f03 is made of a liquid resin material on each of the inner lead frame units 201a, 201b using an extrusion molding apparatus. Moreover, the terminal 201c is bent from the outer frame unit 201d by using a cutting device or a presser, and the terminal 2qic is bent (banciing) so that the terminal 200950146 is wrapped with the package unit 2〇3. The lead frame assembly 200 can be used to manufacture a light-emitting diode by wire bonding, and the light-emitting diode can be fabricated by wire bonding. Body 另外 The other 'fifth picture is the rear view of the fourteenth figure, and the cross-sectional view of the line shows the lead frame assembly:. The back upper slot 2〇33 of the package unit 2〇3 of the lead frame strip assembly 200 is a process of molding the package unit 203; == when the injection of the metal mold is formed on the corresponding unit of the slot, even if there is a part of the resin Residual = contained inside the groove. Due to such a structure, when the crucible 203 is mounted on a device such as a printed circuit board, even if it is unnecessary, the material remains and solidifies in the package unit 2〇3 and forms a protrusion, which is disturbed and can be intact. Ground installation. As described above, since the pouch portion must be formed on the package unit 203, the design has a certain limitation in terms of reducing the overall thickness of the lead frame assembly. Moreover, the groove 203a of the sealing unit 203 is disposed at the central office. Therefore, when the design for improving the heat release performance is performed, the structure acts as a force, that is, to improve the luminous efficiency of the light-emitting diode. The current applied to the light-emitting diode by 兮m is large, but since the groove 2 所述 can design a structure capable of sufficiently radiating heat. Therefore, it is known that the structure of the package unit 203 203 having the trench 2 has limitations in improving the luminous efficiency of the light-emitting diode. Further, I know that the sub-structure 2 lc is a structure which is exposed to the outside of the side surface and curved toward the back side, and thus has a certain limitation in reducing the thickness of the light-emitting diode, and this structure is also limited in design. SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide a lead frame assembly for a women's I optical-polar body wafer having a structure that is easy to radiate heat and can improve luminous efficiency and service life. Its manufacturer's method. And 'another aspect of the present invention' is to provide a lead frame assembly for mounting a light-emitting diode chip by reducing the thickness f of the terminal and using a plurality of Wei to make the light-emitting diode. And its manufacturing method. To achieve the object of the present invention, the present invention provides a lead frame assembly for an ampoule f-diode wafer, which includes: a first lead frame = a second lead frame unit, and a first lead frame unit Separating the pre-© = distance material; and a sealing element formed on the first lead frame: between the 7L and the second lead frame unit and on the circumferential side to make a part of the upper surface and the lower surface of the lead frame unit At the same time exposed. A plurality of the first lead frame unit, the first lead frame unit, and the package unit are continuously disposed on the outer frame. Preferably, either of the first lead frame unit or the second element is disposed at a central position. The package unit is formed on the upper surface and the lower surface of the second bow frame unit of the first lead frame unit. 200950146 Injection unit. A resin for injecting a resin is formed on the outer frame. The present invention also provides a method of manufacturing an m-frame assembly. A lead frame for mounting a light-emitting diode wafer for punching to produce a lead-in method includes: after using a press to a metal plate hole, the step of: performing a gilding step on the metal plate a step of gilding gold plating; the lead frame is injected with a resin to form a seal =: text: using the outer side of the unit to the metal mold through the 3: frame = description = step, the package unit ^, +, and the lower direction simultaneously squeeze Pressing and molding to produce. The -5th wire frame 竿 single wire reject frame includes a lead frame unit and a second lead frame of the second lead frame unit set at a predetermined distance ^ = the first lead The frame unit and the second lead frame unit. The first lead frame is single. The present invention has the following advantages: Any one of the central lead frame and the second lead frame unit is very thermally efficient. Excellent, can be connected to the state of open, so long life: so you can improve =: = quality increase brightness 'and extend the frame unit two and the second lead 'line process, because m private and backwards叩) With the thickness of =:=; group: a variety of simple, to achieve increased production efficiency and make the manufacturing process into 200950146 3, because the present invention is through the effective use of the lead frame assembly into the outer side of the single π resin and through Extrusion is used for manufacturing, and is used only in the subsequent step for cutting the effective use unit, so that the solidified residual resin generated in the process unit forming the package unit is cut off and manufactured, and the photo-polar body is No unnecessary residue is left in the process, and the effect of improving the quality of the two products is achieved. 4. In the production of the lead frame assembly, the present invention reads (4) the metal mold neoprene to the outside of the effective use unit. Make adjacent
❹ 置的兩個或者四個封裝單元同時進行成型，從而可以減少 樹脂注入裝置之_注人喷嘴的使用健。因此，本發明 可以使用簡單製造之樹脂注人裝置，並可以使注入樹脂後 産生的樹脂廢處理量達到最小化，從而具有降低製造 之效果。 【實施方式】 々 3 _八珂不赞吶之較佳實施例進行詳細描述, ^第一圖疋用於說明本發明實施例之俯視圖，第二圖是 第圖中要部之放大圖，第三圖是第二圖之後視圖， 沿第二圖IV_IV線之截面圖。所述圖式顯示用於令 凌毛光一極體晶片之引線框架組件j。 用於安農發光二極體晶片之引線框架組件1包括弓u, 和，引線框架3上將樹脂材料擠壓成型而構成之 ^早TC5。5丨線㈣3可分爲使賴具對 =成之第-引她、第二引線框架9二; 距離= — 弗1綠框条7上可安裝有發光二極體 200950146The two or four package units of the package are simultaneously molded, thereby reducing the use of the injection nozzle of the resin injection device. Therefore, the present invention can use a resin injection device which is simply manufactured, and can minimize the amount of resin waste generated after the resin is injected, thereby having a effect of reducing the manufacturing. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The preferred embodiment of the present invention is described in detail, and the first figure is used to illustrate the top view of the embodiment of the present invention, and the second figure is an enlarged view of the main part of the figure. The three figures are a rear view of the second figure, and a cross-sectional view taken along line IV-IV of the second figure. The figure shows a lead frame assembly j for a monolithic wafer. The lead frame assembly 1 for the Annon LED chip includes a bow u, and the lead frame 3 is formed by extruding a resin material to form an early TC5. The 5 丨 line (4) 3 can be divided into The first - lead her, the second lead frame 9 two; distance = - E1 green frame strip 7 can be installed with a light-emitting diode 200950146
晶片c。安裝於第一引線框架7上之發光二極體晶片匸可 與第二引線框架9引線鍵合連接。 aBWafer c. The light-emitting diode wafer package mounted on the first lead frame 7 can be wire-bonded to the second lead frame 9. aB
❹ 該些第一引線框架7與第二引線框架9製作成上表面 7a、9a和下表面7b、9b分別向外部露出之狀態（在第三圖 中示出），並且第一引線樞架7設置於中央位置上。如此 将第一引線框架7與第二弓丨線框架9之下表面7卜肋露出 之結構可以使放熱性能達到最大化。即，可以把第一引線 框架7设计成其下表面7b、9b上設置有放熱板（省略圖式） 的結構，從而使放熱性能最大化。 所述結構可以提高放熱性能，從而使施加電流增大， 最可以使亮度制提高，並且當施加相同麵時，可以 使哥命得到延長，從而可以提高發光二極體之品質。 本發明實施例中例舉了由兩個引線框架，即第一引線 框架7和第二引線框架9組成之結構進行了說明。但是本 發明並不局限於此，只要是安裝發光二極體晶片之引線框 架之T表面中央開放之結構’由多個引線框架的亦可 以梭細。 亚且，向第 十 5丨綠框架7和第二引線框架9之間以万 ϋ1線框架7與第二引線框架9之周側注人樹脂材料^ 成封裝單元5。封裝單元5是以引線框架ί It: i下方向上設置金屬模具並使其緊貼，然_ 將樹月旨注人到金屬模具來《的。如第五圖 不、:早=5可以是杯（c叩〕狀或者碗狀。 個筮：安裝發光二極體晶片之引線框架組件具有多 -H匡架7、多個第二引線框架9以及多個封襞單 兀5在外部鱗11上連輕置之域。這種減可以大量 11 200950146 製造用於安裝發央 以下，對用ί 晶片之引線框架組件。 製造方法詳細^安裝發光二極體晶片之引線框架組件之 首先，使用厭θ # 一引線框架7、敏:、專工具對金屬板材進行沖孔來形成第 當然，第一引綠〜引線框架9(S1，在第十一圖中示出）。 與外部框架11俾^架7雖與第二引線框架9隔開設置，但 ^ 保持連接狀態。The first lead frame 7 and the second lead frame 9 are formed in a state in which the upper surfaces 7a, 9a and the lower surfaces 7b, 9b are respectively exposed to the outside (shown in the third figure), and the first lead frame 7 Set in the center position. Thus, the structure in which the first lead frame 7 and the lower surface 7 of the second bow frame 9 are exposed can maximize the heat release performance. Namely, the first lead frame 7 can be designed such that the lower surface 7b, 9b is provided with a heat releasing plate (omitted from the drawing), thereby maximizing the heat releasing performance. The structure can improve the heat release performance, thereby increasing the applied current, and the brightness can be improved most, and when the same surface is applied, the life can be prolonged, so that the quality of the light-emitting diode can be improved. The structure of the two lead frames, i.e., the first lead frame 7 and the second lead frame 9, is exemplified in the embodiment of the present invention. However, the present invention is not limited thereto, and the structure in which the center of the T surface of the lead frame on which the light-emitting diode chip is mounted is open may be thinned by a plurality of lead frames. Further, a resin material is injected into the peripheral side of the ninth-line frame 7 and the second lead frame 9 between the ninth green frame 7 and the second lead frame 9 to form a package unit 5. The package unit 5 is a lead frame ί It: i is placed upside down and placed in close proximity to the metal mold, and then the tree is intended to be attached to the metal mold. As shown in the fifth figure, the early = 5 may be a cup or a bowl. The lead frame assembly for mounting the LED chip has a multi-H truss 7 and a plurality of second lead frames 9 And a plurality of sealing sheets 5 are connected to the light scale on the outer scales 11. This kind of reduction can be used for a large number of 11 200950146 manufacturing for the lead frame assembly of the wafer, and the manufacturing method is detailed ^ First, the lead frame assembly of the polar body wafer first uses an anti-θ #一 lead frame 7, a sensitive: special tool for punching a metal plate to form a first, first green to lead frame 9 (S1, in the eleventh Although the outer frame 11 is spaced apart from the second lead frame 9, it is kept in a connected state.
51線ΪΪ 3 ^形ί有第一引線框架7和第二引線框架9之 樹脂材料組成框架3上成型由 過程中，在引線框架3之兩側設置上部金屬 ri斜。金屬模具23,並由樹脂注入裝置25注入樹 :一广 夺，本發明爲了便於描述，將樹脂注入裝置25 :不於上部金屬模具21侧，但是本發明並不局限於此，樹 二注入裝置25可以設置於上部金屬模具21側，亦可以設 置於下部金屬模具23側。 * 一另外1如第二圖所示，在安裝有發光二極體晶片c(在 第二圖中示出）之狀態製造發光二極體封裝時，用於安裝發 光一極體晶片之引線框架組件1僅將有效使用單元27進行 切斷就可使用（S7)。 因此，樹脂注入裝置25上的樹脂注入喷嘴25a將設置 在有效使用單元27之外側，以此來向金屬模具内部進行注 入。在這種情況下，使用樹脂注入喷嘴25a向金屬模具注 入樹脂之工序完成之後’將樹脂注入喷嘴25a從金屬模且 移開時，仍會産生突出並凝固之突起5a。但是這種突起5a 形成在有效使用單元27之外侧，因此在進行實際安裝發光 12 200950146 二極體晶片之工程時所述突起單元5a已經被切除。 因此’本發明不需要在樹脂注入部分形成習知技術中 存在的槽，從而可以提高産品品質。並且，這種結構可以 設計成第一引線框架7之中央位置上之背面開放，從而可 以進一步提高放熱性能。而且，所述之結構與習知技術相 比可以減小引線框架組件的厚度，從而可以應用於多種產 品中。 第六圖是用於說明本發明另一實施例之俯視圖，第七 ❹The 51 wire ΪΪ 3 ^ ί has a first lead frame 7 and a second lead frame 9 made of a resin material formed on the frame 3 by the process, and the upper metal ri is provided on both sides of the lead frame 3. The metal mold 23 is injected into the tree by the resin injection device 25: the present invention is for the convenience of description, and the resin injection device 25 is not on the side of the upper metal mold 21, but the present invention is not limited thereto, and the tree two injection device 25 may be provided on the side of the upper metal mold 21 or on the side of the lower metal mold 23 . * Another 1 as shown in the second figure, a lead frame for mounting a light-emitting diode chip when manufacturing a light-emitting diode package in a state in which a light-emitting diode wafer c (shown in the second figure) is mounted The component 1 can be used only by cutting off the effective use unit 27 (S7). Therefore, the resin injection nozzle 25a on the resin injection device 25 is disposed on the outer side of the effective use unit 27, thereby injecting into the inside of the mold. In this case, after the process of injecting the resin into the mold using the resin injection nozzle 25a is completed, when the resin injection nozzle 25a is removed from the mold, the protrusions 5a which protrude and solidify are still generated. However, such a projection 5a is formed on the outer side of the effective use unit 27, so that the projection unit 5a has been cut off when the work of actually mounting the light-emitting 12 200950146 diode wafer is performed. Therefore, the present invention does not require formation of a groove existing in the conventional technique in the resin injection portion, so that product quality can be improved. Also, such a structure can be designed such that the back surface at the center of the first lead frame 7 is open, so that the heat radiation performance can be further improved. Moreover, the described structure can reduce the thickness of the lead frame assembly as compared with the prior art, and thus can be applied to a variety of products. Figure 6 is a plan view for explaining another embodiment of the present invention, a seventh
圖是第六圖要部之放大圖，第八圖是第七圖之後視圖，第 九圖疋沿第七圖IX-IX線之截面圖，第十圖是第七圖之立 體圖。所述圖式顯示用於安裝發光二極體晶片之引線框架 組件之另一實施例。 以下僅對本發明另一實施例區別於上面所述實施例之 部分進行描述，冑兩者之間的共同部分由上述說明來代 替。 =述實施例中’對通過樹脂注人裝置注人樹脂之方法 2# 了在有效使用單元之外側向金之方 ^入^Μ本發明的另—實施例並不僅局限於此，將樹脂 1單元模具對封裝單元5G騎成型之步射，樹脂注 f的封裝於通過—個樹月旨注人單元51對相鄰設 可以同時進行成型之位置上。所述技術可 到最小A裝置25上的樹脂注人噴嘴25a的使用個數達 晋因Λ:脂注广裝置之結卿 理’上述4構’需要對其進行廢處 低製造t 少__之廢處理量，從而可以降 200950146 另外’本發明另一實施例包括中央位置上設置之第一 引線框架101、與第一引線框架101相隔預定距離之第二 引線樞架103、105、107、109、111、113。所述第一引線 框架 101 和第二引線框架 103、105、107、109、111、113 具有不同的個數，並且所述引線框架之上表面和下表面開 放於所述封裝單元之外部。即，本發明實施例亦以第一引 線框架101和第二引線框架1〇3、105、107、109、m、 113之下表面開放的狀態設置，因此具有上述實施例中所 ® 描述之優點。即，可以使放熱性能最大化，從而可以使亮 度與哥命得到提高，並使引線框架組件厚度減小，可以在 夕種産品中所使用。 【圖式簡單說明】 第一圖是用於說明本發明實施例之俯視圖。 第二圖是第一圖中要部之放大圖。 第三圖是第二圖之後視圖。 第四圖是沿第二圖IV-IV線之截面圖。 ❹ 第五圖是第二圖之立體圖。 第六圖是用於說明本發明另一實施例之俯視圖。 第七圖是第六圖中要部之放大圖。 第八圖是第七圖之後視圖。 第九圖是沿第七圖IX-IX線之截面圖。 第十圖是第七圖之立體圖。 第十一圖是用於說明本發明用於安裝發光二極體晶片之引 線框架組件之製造方法的流程圖。 第十二較躲說明本發明縣單元之製造方法的示意 14 200950146 圖。 第十三圖是用於說明習知技術之用於安裝發光二極體晶片 之引線框架組件的俯視圖。 第十四圖是第十三圖之要部之放大圖。 第十五圖是第十四圖之後視圖。 第十六圖是沿第十四圖XVI-XVI線之截面圖。 【主要元件符號說明】 1 用於安裝發光二極體晶片之引線框架組件 ® 3引線框架 5 封裝單元 5a 突起 7、101 第一引線框架 7a 上表面 7b 下表面 ❿ 9a 9b 11 21 23 25 25a 27 50 9、103、105、107、109、m、113 第二引線框架 上表面 下表面 外部框架 上部金屬模具 下部金屬模具 樹脂注入裝置 樹脂注入喷嘴 有效使用單元 封裝單元 15 200950146 51 樹脂注入單元 200 引線框架組件 201 引線框架 201a、201b 内部引線框架 201c 端子 201d 外部框架 203 封裝單元 203a 槽The figure is an enlarged view of the essential part of the sixth drawing, the eighth drawing is a rear view of the seventh drawing, the ninth drawing is a sectional view taken along line IX-IX of the seventh drawing, and the tenth drawing is a vertical drawing of the seventh drawing. The figure shows another embodiment of a leadframe assembly for mounting a light emitting diode chip. In the following, only another embodiment of the present invention is described differently from the above-described embodiments, and the common portion between the two is replaced by the above description. In the embodiment, the method of injecting the resin into the resin injection device 2# is performed on the lateral side of the effective use unit. The other embodiment of the present invention is not limited thereto, and the resin 1 is used. The unit mold is mounted on the package unit 5G, and the resin package f is packaged at a position where the adjacent units can be simultaneously molded by the same. The technique can reach the number of the resin injection nozzles 25a on the minimum A device 25. The number of the plastic injection nozzles 25a is the same as that of the above-mentioned 4 constructions. The waste processing amount can be lowered to 200950146. In addition, another embodiment of the present invention includes a first lead frame 101 disposed at a central position, and second lead pivots 103, 105, 107 spaced apart from the first lead frame 101 by a predetermined distance, 109, 111, 113. The first lead frame 101 and the second lead frames 103, 105, 107, 109, 111, 113 have different numbers, and the upper and lower surfaces of the lead frame are opened outside the package unit. That is, the embodiment of the present invention is also provided in a state in which the lower surfaces of the first lead frame 101 and the second lead frames 1〇3, 105, 107, 109, m, 113 are open, and thus have the advantages described in the above embodiment. . That is, it is possible to maximize the heat release performance, thereby improving the brightness and the life, and reducing the thickness of the lead frame assembly, which can be used in the product of the evening. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a plan view for explaining an embodiment of the present invention. The second figure is an enlarged view of the main part in the first figure. The third figure is a rear view of the second figure. The fourth figure is a cross-sectional view taken along line IV-IV of the second drawing.第五 The fifth picture is a perspective view of the second figure. The sixth drawing is a plan view for explaining another embodiment of the present invention. The seventh figure is an enlarged view of the main part of the sixth figure. The eighth figure is a rear view of the seventh figure. The ninth drawing is a cross-sectional view taken along line IX-IX of the seventh drawing. The tenth figure is a perspective view of the seventh figure. Fig. 11 is a flow chart for explaining a manufacturing method of the lead frame assembly for mounting a light-emitting diode wafer of the present invention. Twelfth is a schematic illustration of the manufacturing method of the county unit of the present invention. Fig. 13 is a plan view showing a lead frame assembly for mounting a light-emitting diode wafer of the prior art. Figure 14 is an enlarged view of the main part of the thirteenth figure. The fifteenth figure is a rear view of the fourteenth figure. Figure 16 is a cross-sectional view taken along line XVI-XVI of Figure 14. [Main component symbol description] 1 Lead frame assembly for mounting a light-emitting diode chip® 3 lead frame 5 Package unit 5a Projection 7, 101 First lead frame 7a Upper surface 7b Lower surface ❿ 9a 9b 11 21 23 25 25a 27 50 9,103,105,107,109,m,113 second lead frame upper surface lower surface outer frame upper metal mold lower metal mold resin injection device resin injection nozzle effective use unit package unit 15 200950146 51 resin injection unit 200 lead frame Component 201 lead frame 201a, 201b inner lead frame 201c terminal 201d outer frame 203 package unit 203a slot
C 發光二極體晶片C light emitting diode chip
1616