TWM335921U - Heat sink - Google Patents

Heat sink Download PDF

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Publication number
TWM335921U
TWM335921U TW096218935U TW96218935U TWM335921U TW M335921 U TWM335921 U TW M335921U TW 096218935 U TW096218935 U TW 096218935U TW 96218935 U TW96218935 U TW 96218935U TW M335921 U TWM335921 U TW M335921U
Authority
TW
Taiwan
Prior art keywords
heat
heat sink
patent application
scope
item
Prior art date
Application number
TW096218935U
Other languages
Chinese (zh)
Inventor
Chih-Ming Chen
Yu-Hung Huang
Alex Hsia
Shu-Hui Chan
Original Assignee
Delta Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Electronics Inc filed Critical Delta Electronics Inc
Priority to TW096218935U priority Critical patent/TWM335921U/en
Priority to JP2008000218U priority patent/JP3140542U/en
Priority to US12/098,634 priority patent/US20090120613A1/en
Publication of TWM335921U publication Critical patent/TWM335921U/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093Snap-on arrangements, e.g. clips
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00Fins
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat sink includes a heat conductive portion, a plurality of fins and at least one connecting portion. The fins and the connecting portion are disposed around the heat conductive portion, and the connecting portion is disposed between the fins and has a fixed part. The fixed part is disposed at one side of the connecting portion and is used for connecting with a fastener.

Description

M335921 八、新型說明: 【新型所屬之技術領域】 本創作屬於種政熱為,尤其是指一種能夠減少零件 數量來節省材料、並達到簡化生產製程,降低成本之散熱器。 【先前技術】 P通著科技技術的日新月異,隨著電子產品之效能日益 Φ牦強以及電子元件的密集化,然而電子產品運作時,其每單 位面積產生的熱能也日益增加,而這些熱能如果不加以適當 地散逸,會導致電子產品效能降低,更甚者可能會造成電子 ’產品燒毁’因此散熱II已成為現今電子產品中不可或缺的配 備之一。M335921 VIII. New Description: [New Technology Field] This creation belongs to the politics of the politics, especially a radiator that can reduce the number of parts to save materials and simplify the production process and reduce the cost. [Prior Art] With the rapid development of technology through technology, with the increasing efficiency of electronic products and the intensification of electronic components, the thermal energy generated per unit area of electronic products is increasing, and if these thermal energy is increased, Failure to properly dissipate will result in lower performance of electronic products, and even more may cause electronic 'product burnout'. Therefore, heat dissipation II has become one of the indispensable equipments in today's electronic products.

為了要將習知的散熱器1固定裝設在熱源之上,常採 用的固定方式有兩種,請參閱第1A圖與第18圖,其為習知 籲二種散熱鰭片與扣件組合示意圖,第—種是將金屬材質的x 型夹(x-ciiP)n ’以熱塞製程裝人散熱器1之—側面之後, 再以頂推銷(PUshPins)13a置入x型夹⑽圍的固定座⑴ .中,來將散熱.鰭片10固定於熱源上,如第1A圖所示。另一 種則是以塑膠扣件12用卡扣的方式固定於散熱器!之散孰 鰭片10上’之後在將塑谬扣件12周遭的固定座121以彈簧 «(Spring S⑽)13b將散熱鰭片1{)鎖·熱源之上, 而完成組立°然而,以上的作法均需要使賴外的零件如X M335921 I或塑膠扣件’才能夠將散熱鰭片ig鎖固於熱源上,並 且—產工薇必須要花費額外的時㈣χ型失U或塑膠扣件 12女t至散熱鰭片1〇之上,導致生產費用上的增加,降低 產口口 =肌f力。亚且,如X型夹u必須要以熱塞製程加工, 廠還必須另外擔負因熱加工所導致廢品的可能性,而有產 品風險提高的隱憂。 有基於此,如何提供一種可以減少材料成本、減少工 廠加工次數,並提高產品可靠性之散熱器卜實為重要課題 ~ 0 【新型内容】 為了解決上述問題,本創作係提出一種散熱器,可以 免去因增加額外扣具而導致的成本浪費,進而提高市場上的 競爭力。 為達到上述的目的,提出一種散熱器,包括複數個散 熱片與至少一連接件,連接件設置於散熱片之間,且連接件 係具有一固定部,其係設置於連接件之旁側,且用以與一鎖 固件結合。 如上述之散熱裔,散熱器更具有一導熱部,其係與散 熱片及連接件相連,並且散熱片與連接件係環設於導熱部周 圍而政熱片係以放射狀分佈或其他方式分佈。導熱部係具 有一通孔用以容納一導熱件,此導熱件係為一熱管或一實體 M335921 金屬塊’導熱件係以―熱塞製程安置於通孔之中。 ""鎖固件係為一頂推銷或一彈簧螺絲,連接件與固 =部:為-體成型,且固定件與連接件之接合方式係為焊 、、敗合、卡固或黏著。並且,散熱片之間係具有至少一剖 -溝而剖溝係用以調整鎖固件裝設於散熱片之高度,散熱^ .=以_、扣接、沖壓成型或其他加I方式製作而成,散: 與-風扇搭配使用’且用以與一熱源直接接觸。而此熱 ,一巾央處理裔、電晶體、飼服器、高p皆繪圖卡、硬碟、 =供應器、行車控制系統、多媒體電子機構、無線通信基 地口或高階遊戲機等。 .2 讓本創作之上述和其他目的、特徵、和優點能更明 說明如下下文特舉—較佳實施例,並配合所附圖式,作詳細 【實施方式】 佳實:ΓΓ㈣/ μ與第3圖’第2圖為依照本創作較 “ 1種散熱器示意圖’第3圖為依照第2圖散 盘連接件202比連接件2〇2與一導熱部&,散熱片201 、接件2G2自核設於導熱部25周圍且相互連接 2〇1係以放射狀分佈或其它方式分佈。 … 另外’導熱部25具有一通孔,因此導熱部25可透過 7 M335921 -熱塞製程的方式將一導熱件24 一 屬塊容置〜’並藉由導熱件24與=二 中央處理②、電晶體、飼服器、高階繪圖卡、硬碟、電源供 應器、行車控制系統、多媒體電子機構、無線通信基地台或 高階遊戲機等的直接接觸,將熱源的熱量快速導離。 承上’為了免去額外扣具,例如是X型夾或塑膠扣件 、=用本創作之散熱益2在設計之初,會先以鋁擠、扣接、 沖壓成型等方式,在散熱器上直接形成固^部與連接件。以 第3圖為例,連接件202則設置於散熱片201之間,而連接 件2〇2係具有一固定部21,其係設置於連接件202之旁側, 用以與—鎖固件23結合。然其製作方法並不限於此,除了 =連接部202與固定部21 一體成型之外,更可採用焊接、 敢合、卡固或黏著的方式來連結連接部2()2與固定部^。 如此一來’當散熱器2與熱源直接接觸時,可不必另外使用 其它的額外扣具,只要將鎖固件23,例如頂推銷或彈箬螺 絲’置於固定部21上後,再行鎖上即可完成組裝。相較於 =的產品,必須另外絲額外扣具的步驟,大為降低了安 1上的複雜度。 另外,如有扣接力道上的考量,還可在散熱片2〇1之 一剖溝’因此可藉由剖溝來調整裝配的高度,提 升產σ口的使用性。 然,在結構強度允許的條件下,本創作之散熱 器2更 M335921 ==2〇2設計成與散熱請-樣的大小,再依實 際產印需要來配置固定冑21。如此,不僅可簡化製程,還 可在有效的單位體積内增設更多的散熱片2gi,進而加 ^的效果。此外,如在散熱器2上安裝一風扇,藉由風^ 動所產生的氣流,更能強化散熱器2散熱的效果。 综上所述,本創作之散熱器,不僅在製作上彈性範圍 大,而且固定部與連接件的相結合設計,免去了額外扣且应 力Γ的需求’節省了材料成本,提高了產品的可靠度,讓產 口口更具有市場上的競爭力。 以上所述僅為舉例性,而料限制性者。任何未脫離 毛明之精神與犯’’而對其進行之等效修改或變更,均應 包含於後附之申請專利範圍中。 , 【圖式簡單說明】 第1A、1B圖為習知二種散熱鰭片與扣件之組合示意圖。 U圖為依照本創作較佳實施例之—種散熱器示意圖。 第3圖為依照第2圖之散熱器之示意圖。 【主要元件符號說明】 卜2 :散熱器 11 : X型夾 12 ·塑膠扣件 13a :頂推銷 1 〇 :散熱鰭片 111、121 :固定座 121 ·固定座 13b :彈簧螺絲 M335921 201 :散熱片 202 21 ·· 固定部 23 ·· 24 ·· 導熱件 25 ·· :連接件 鎖固件 導熱部In order to fix the conventional heat sink 1 on the heat source, there are two commonly used fixing methods. Please refer to FIGS. 1A and 18, which are two types of heat sink fins and fastener combinations. Schematic, the first type is to insert the metal x-clip (x-ciiP)n ' into the side of the radiator 1 by the hot plug process, and then put the PUshPins 13a into the x-clip (10). In the fixing seat (1), the heat dissipation fins 10 are fixed on the heat source as shown in Fig. 1A. The other is to fix the plastic fastener 12 to the radiator with a snap! On the side of the diverging fins 10, the fixing seat 121 around the plastic fastener 12 is placed on the heat sink fin 1{) lock heat source by the spring «(Spring S(10)) 13b, and the assembly is completed. However, the above All the methods need to make the parts such as X M335921 I or plastic fasteners to lock the heat sink fins ig to the heat source, and the production must have extra time (4) 失 type lost U or plastic fasteners 12 The female t to the heat sink fins above 1〇, resulting in an increase in production costs, reducing the mouth of the mouth = muscle f force. Yahe, if the X-clip u must be processed by a hot plug process, the plant must also bear the possibility of waste caused by thermal processing, and there is a concern about the risk of product increase. Based on this, how to provide a radiator that can reduce material cost, reduce the number of factory processing, and improve product reliability is an important issue. 0 [New content] In order to solve the above problems, the author proposes a radiator, which can Eliminate the waste of costs caused by the addition of additional fasteners, thereby increasing the competitiveness of the market. In order to achieve the above object, a heat sink is provided, including a plurality of heat sinks and at least one connecting member, the connecting member is disposed between the heat sinks, and the connecting member has a fixing portion disposed on a side of the connecting member. And used to combine with a lock firmware. The heat sink has a heat conducting portion, which is connected to the heat sink and the connecting member, and the heat sink and the connecting member are arranged around the heat conducting portion and the heat film is radially distributed or otherwise distributed. . The heat conducting portion has a through hole for accommodating a heat conducting member, and the heat conducting member is a heat pipe or a solid M335921 metal block. The heat conducting member is disposed in the through hole by a "hot plug process". The "" lock is a push pin or a spring screw, the connector and the solid part: the body is formed, and the joint of the fixing member and the connecting piece is welded, defeated, stuck or adhered. Moreover, the fins have at least one cross-groove between the fins for adjusting the height of the fasteners mounted on the fins, and the heat dissipation is made by _, fastening, stamping or other addition. , Scatter: Used in conjunction with the -fan and used to make direct contact with a heat source. This heat, a towel, a transistor, a feeding device, a high-p graphics card, hard disk, = supply, driving control system, multimedia electronic institutions, wireless communication base or high-end game consoles. .2 The above and other objects, features, and advantages of the present invention will become more apparent from the following detailed description of the preferred embodiments and the accompanying drawings. 3 Figure 'Fig. 2 is a schematic diagram of a type of heat sink according to the present invention. FIG. 3 is a view of the second embodiment of the disk connector 202 in comparison with the connector 2〇2 and a heat conducting portion & heat sink 201 and connector. The 2G2 self-nuclear is disposed around the heat conducting portion 25 and is connected to each other in a radial distribution or other manner. Further, the heat conducting portion 25 has a through hole, so that the heat conducting portion 25 can pass through the 7 M335921-heat plug process. A heat conducting member 24 is housed in a block-' and by means of a heat conducting member 24 and a second central processing 2, a transistor, a feeder, a high-order graphics card, a hard disk, a power supply, a driving control system, a multimedia electronic device, The direct contact of the wireless communication base station or the high-end game machine, etc., quickly guides away the heat of the heat source. In order to avoid the extra buckle, for example, X-shaped clip or plastic fastener, = use the heat dissipation of the creation 2 At the beginning of the design, it will be extruded, buckled, and In the manner of stamping or the like, the fixing portion and the connecting member are directly formed on the heat sink. Taking the third drawing as an example, the connecting member 202 is disposed between the heat radiating fins 201, and the connecting member 2〇2 has a fixing portion 21, It is disposed on the side of the connecting member 202 for engaging with the locking member 23. However, the manufacturing method is not limited thereto, except that the connecting portion 202 and the fixing portion 21 are integrally formed, and welding and cohesion can be adopted. Attaching the connecting portion 2 () 2 and the fixing portion ^ in such a manner as to be stuck or adhered. Thus, when the heat sink 2 is in direct contact with the heat source, it is not necessary to additionally use other additional fasteners, as long as the locking member 23 is For example, the top push pin or the magazine screw 'is placed on the fixing portion 21, and then the lock can be completed to complete the assembly. Compared with the product of the =, the extra wire must be additionally fastened, which greatly reduces the complexity of the safety. In addition, if there is consideration on the fastening force, it can also be used to cut the groove in one of the fins 2〇1 so that the height of the assembly can be adjusted by the groove to improve the usability of the σ port. Under the conditions allowed, the radiator 2 of this creation is more M335921 ==2〇2 Designed to meet the size of the heat dissipation, and then the fixed 胄21 according to the actual production needs. This not only simplifies the process, but also adds more heat sinks 2gi in the effective unit volume, and then adds the effect of ^ In addition, if a fan is mounted on the heat sink 2, the airflow generated by the wind force can enhance the heat dissipation effect of the heat sink 2. In summary, the heat sink of the present invention not only has a flexible range in production. Large, and the combination of the fixed part and the connecting piece eliminates the need for extra buckles and stresses, which saves the material cost, improves the reliability of the product, and makes the mouth of the mouth more competitive in the market. The descriptions are for illustrative purposes only and are not intended to be exhaustive. Any equivalent modifications or alterations to the spirit of the invention may be included in the scope of the appended claims. [Simplified description of the drawings] Figures 1A and 1B are schematic diagrams showing the combination of two kinds of heat dissipation fins and fasteners. U is a schematic view of a heat sink in accordance with a preferred embodiment of the present invention. Figure 3 is a schematic view of the heat sink according to Figure 2. [Main component symbol description] Bu 2: Heatsink 11 : X-clamp 12 · Plastic fastener 13a : Push pin 1 〇: Heat sink fins 111, 121 : Mounting seat 121 · Mounting seat 13b : Spring screw M335921 201 : Heat sink 202 21 ·· Fixing part 23 ·· 24 ·· Heat conducting part 25 ·· : Connector lock heat transfer part

Claims (1)

M335921 九、申請專利範圍: 1、一種散熱器,包括: 複數個散熱片;以及 接件=一連接件’其係設置於該些散熱片之間,且該連 .-二固定部’其係設置於該連接件之旁侧,用以與 更具有一導熱 其中該些散熱 其中該些散熱 其中該導熱部 其中該導熱件 其中該導熱件 其中該鎖固件 其中該鎖固件 • 2、如申請專利範圍第丨項所述之散熱器 部,且與該些散熱片及該連接件相連。 > 3^如申請專利範圍第2項所述之散熱器 片與该連接件係環設於該導熱部周圍。 ^如申睛專利範圍第3項所述之散熱器 係以放射狀分佈或其他方式分佈。 5如申請專利範圍第2項所述之散熱器 係具有一通孔用以容納一導熱件。 6如申睛專利範圍第5項所述之散熱器 係為一熱管或一實體金屬塊。 係以 如申凊專利範圍第5項所述之散熱器 熱塞製程安置於該通孔之中。 係為 如申凊專利範圍第1項所述之散熱器 一頂推銷。 9如申請專利範圍第丨項所述之散熱器 係為一彈簧螺絲。 二如申請專利範圍第1項所述之散熱器,其中該連: 件^亥固定部係為一體成型。 逆 定件▲如申。月專利範圍第1項所述之散熱器,其中該些 與忒連接件之接合方式係為焊接、嵌合、卡固或黏著 M335921 12、如申請專利範圍第丨項所述之散熱器 熱片之間係具有至少一剖溝。 ^13、如申請專利範圍第12項所述之散熱器 係用以調整該鎖固件裝設於該散熱片之高度。 14、如申請專利範圍第丨項所述之散熱器 才接冲壓成型或其他加工方式製作而成。 杖15、如申請專利範圍第1項所述之散熱器 搭配使用。 直請專利範圍第1項所述之散熱器 係為-中央處16項所述之散熱器 電源供應器、行車控::體、伺服器、高階繪 地台或高階遊戲機等糸統、多媒體電子機構 ’其中該些散 ,其中該剖溝 ’係以銘擠、 ,更與一風扇 ’係與一熱源 ,其中該熱源 圖卡、硬磲、 、無線通信基 12M335921 IX. Patent application scope: 1. A heat sink comprising: a plurality of heat sinks; and a connector = a connector member disposed between the heat sinks, and the connection is - two fixed portions The utility model is disposed on the side of the connecting member, and has a heat-conducting heat-dissipating heat-dissipating portion of the heat-conducting portion of the heat-conducting member, wherein the heat-conducting member has the lock member therein. The heat sink portion of the above item is connected to the heat sink and the connecting member. > 3^ The heat sink piece according to item 2 of the patent application and the connector ring are provided around the heat conducting portion. ^ The radiators described in item 3 of the scope of the patent application are distributed radially or otherwise. 5. The heat sink of claim 2, wherein the heat sink has a through hole for receiving a heat conducting member. 6 The heat sink of claim 5 is a heat pipe or a solid metal block. The heat sink process described in item 5 of the patent application scope is disposed in the through hole. It is a radiator as described in item 1 of the patent application scope. 9 The heat sink as described in the scope of the patent application is a spring screw. 2. The heat sink according to claim 1, wherein the connecting piece is integrally formed. Counter-measures ▲ such as Shen. The heat sink of the first aspect of the invention, wherein the joints with the 忒 joint are welded, fitted, fastened or adhered to the M335921 12, the heat sink of the heat sink as described in the scope of the patent application. There is at least one groove between the two. ^13. The heat sink of claim 12 is for adjusting the height of the fastener mounted on the heat sink. 14. The heat sink as described in the scope of the patent application is manufactured by stamping or other processing methods. The rod 15 is used in combination with the radiator described in claim 1 of the patent application. The radiator mentioned in the first paragraph of the patent scope is the radiator power supply described in the 16th central section, and the vehicle control: body, servo, high-level drawing platform or high-end game machine, etc. The electronic mechanism 'which is scattered, wherein the sulcus is squeezed, and more with a fan' and a heat source, wherein the heat source card, hard 磲, wireless communication base 12
TW096218935U 2007-11-09 2007-11-09 Heat sink TWM335921U (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW096218935U TWM335921U (en) 2007-11-09 2007-11-09 Heat sink
JP2008000218U JP3140542U (en) 2007-11-09 2008-01-18 heatsink
US12/098,634 US20090120613A1 (en) 2007-11-09 2008-04-07 Heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096218935U TWM335921U (en) 2007-11-09 2007-11-09 Heat sink

Publications (1)

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TWM335921U true TWM335921U (en) 2008-07-01

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CN102135117A (en) * 2010-01-23 2011-07-27 富准精密工业(深圳)有限公司 Centrifugal fan
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TWM465602U (en) * 2013-05-22 2013-11-11 Tai Sol Electronics Co Ltd Heat dissipating apparatus
TWI749400B (en) * 2019-11-18 2021-12-11 致茂電子股份有限公司 Electronic load device and heat-dissipating load module

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US20090120613A1 (en) 2009-05-14

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