TWM331759U - Structure of all directional type light emitting diode - Google Patents

Structure of all directional type light emitting diode Download PDF

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Publication number
TWM331759U
TWM331759U TW96219057U TW96219057U TWM331759U TW M331759 U TWM331759 U TW M331759U TW 96219057 U TW96219057 U TW 96219057U TW 96219057 U TW96219057 U TW 96219057U TW M331759 U TWM331759 U TW M331759U
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TW
Taiwan
Prior art keywords
light
omnidirectional
emitting diode
conductive
emitting chip
Prior art date
Application number
TW96219057U
Other languages
Chinese (zh)
Inventor
qing-hui Wu
qing-mo Wu
zhi-xian Wu
Original Assignee
Unity Opto Technology Co Ltd
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Publication date
Application filed by Unity Opto Technology Co Ltd filed Critical Unity Opto Technology Co Ltd
Priority to TW96219057U priority Critical patent/TWM331759U/en
Priority to JP2008000033U priority patent/JP3140311U/en
Priority to DE200820000421 priority patent/DE202008000421U1/en
Publication of TWM331759U publication Critical patent/TWM331759U/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Description

M331759 、八、新型說明: ^ 【新型所屬之技術領域】 本創作係有關一種全向式發光二極體結構,尤指一種藉由至少二導電支架 及至少一發光晶片之組合設計,使具有3 6 0度全向發光及穩固定位,而適用 • 於發光二極體或類似結構者。 • 【先前技術】 • 按,現今傳統照明燈具仍存在許多問題,如白熾燈泡雖然便宜但發光效率 鲁低、表面具有高溫、容易碎裂及壽命短。由於發光二極體具有耗電量低、低發 熱量、安全不易碎、壽命長等優點,故發光二極體目前多半用於電子產品指示 用途或照明者。 一般而言,習用發光二極體結構,主要係設有一具凹槽之基座,該凹槽内 結合有一發光晶片,該發光晶片再透過一連結導線與另一支架連結,最後再藉 由封膠’將基座、發光晶片、連結線及另—支架結合為—體,完成發光二極體 的製作。 m *然,上述傳、统之發光二極體接通電源時,由於發光晶片被結合於基座的凹 杯中,該晶片周緣及底面所發射之光均被凹杯阻擋、反射,故該發光晶片僅發 •出正向光’於該發光二極體之侧係無法看到其所發出之光,雖藉表面黏著技 -術(細咖M贿t,SMT)細㈣電性連接於㈣舰板上,該電路板通電 後’該晶片雖可達五面(前、後、左、右、上)發光,但其底面仍無法透光,無 法如白熾燈泡可朗36Q度全向發光效果。 有4a於此,本創作人期能提供一種全向式發光二極體結構,令發光二極體 所發出之級各個角度均可視,乃潛心研思、設計組製,以提供消費大眾使用, 5 M331759 為本創作所欲研創之創作動機者。 _ 【新型内容】 本創作之主要目的,在提供一種全向式發光二極體結構,藉由至少二導電 支架及至少一發光晶片之組合設計,該各導電支架之結合部係呈匸字型,而使 .發光晶片係呈懸空狀,令發光晶片周緣無阻播物阻播,故不會限制其發光範圍, •可360度均勻全向發光,增加本創作之實用性者。 本創作之次-目的,在提供—種全向式發光二極體結構,藉由至少二導電 參支架及至少-發光晶片之組合設計,各導電支架之結合部係呈〔字型,該各結 之支撐&位部係可穩m定位該發光晶片,增加本創作之實用性者。 為達上述目的,本創作係、包括有至少三導電支架及至少H日日片。各導 電支架上端係形成一結合部;該發光晶片係設於至少二導電支架之結合部,而 該發光晶片健至少二導電支架之結合部電性連接,使該發光晶片呈懸空狀; 藉此,使整體具有3 6 Q度全向發光及_定位之全向式發光二極體結構者。 本創作之其他特點及具體實補可独下配合_之詳細說财 •瞭解。 【實施方式】 \閱第1〜3圖,本創作係—種全向式發光二極體結構,係包括 ^電支* 1 ◦’各導電支架1 Q上端係、形成-結合部1 1,名 ,===1紙字型,騰部11增嫌連接部1 —牙讀部i 12,且該至少二導電支架10為呈相對設置。 部i』Γ發棚2 Q,峨㈣⑽紗至少:導電支架1 0之 而.光晶片2 〇係與該結合部工工之電性連接部⑴焊接, M331759 接,猶部11之峨晰1嶋翻光晶片2 ο 使該發光晶片20呈懸空狀。 使用時,係將本創作至少二導電支 丄υ側逑接正極,另一侧連接負極, “至。、二導電支架;[〇之各結合部丄 ,a 1 电性連接口P1 1 1與該發光晶片2 〇 -(亦可為複數發光晶片2 0)之正極、負極悝技而女从 員柽焊接’而各結合部11之支撐定位 •部112係穩固定位該發光晶片2 〇,由於該發光晶片2 0呈懸空狀,其周圍 未叹有阻擋發光晶片2 〇光線的阻擋物,故該發光晶片2 〇所發出之光線们 • 6 0度發射,請同時參閲第3圖,因此,該發光二鋪無論由何種角度觀之, 其所發射之光均可清楚視之者。 請參閱第4〜5圖,係、為本創作之第二實施例,至少二導電支架工〇與該 發光晶片2 〇 (亦可為複數發光晶片2 〇)係進一步以-透光膠3 0包覆(該 透光膠3 〇内係可摻設有營光粉3 1 ),而該透光膠3 ◦包覆時,係將發光晶片 2 0完全包覆,而導電支架丄⑽為局部包覆,個時,至少二導電支架工〇 • -侧連接正極,另-侧連接負極,該至少二導電支架i 〇之各結合部^之電 Φ性連接部i i i與該發光晶片2 〇之正極、負極焊接,而各結合部1 1之支撑 疋位部1 1 2係穩固定位該發光晶片2 〇,由於該發光晶片2 〇呈敎狀,立 •周圍未設有阻擒發光晶片2 〇光線的阻擋物,故該發光晶片2 〇所發出之光線 -可3 6 Q度發射’賴時參閱第5圖,因此,該發光二極體無論由何種角度觀 之’其所發射之光均可清楚視之。 請參閱第1〜5圖所示,本創作全向式發光二極體結構之特點係在於藉由 至少二導電支架10及至少-發光晶片2 〇之組合設計,該各導電支架丄〇之 結合部11係呈-c字型,且至少二導電支架丨㈣呈相對設置,該至少二導 7 M331759 -電支架10之各結合部11之電性連接部111與該發光晶片2 〇之正極、負 極焊接’而各結合部11之支撐定位部112係穩固定位該發光晶片2 〇,而 發光晶片2 0係呈懸空狀,使發光晶片周緣無阻擋物阻擋,故不會限制其發光 細,因此,該發光二極體無論由何種角度觀之,其所發射之光均可清楚視之,M331759, VIII, new description: ^ [New technical field] This creation is related to an omnidirectional LED structure, especially a combination of at least two conductive supports and at least one illuminating chip, so that it has 3 60 degree omnidirectional illumination and stable fixed position, suitable for light-emitting diodes or similar structures. • [Prior Art] • Press, today's traditional lighting fixtures still have many problems. For example, incandescent bulbs are cheap but have low luminous efficiency, high surface temperature, easy chipping and short life. Since the light-emitting diode has the advantages of low power consumption, low heat generation, safety and non-breaking, and long life, the light-emitting diode is currently mostly used for electronic product indication purposes or lighting. In general, a conventional light-emitting diode structure is mainly provided with a recessed base, and a light-emitting chip is coupled to the recess, and the light-emitting chip is further connected to another bracket through a connecting wire, and finally by a sealing The glue' combines the pedestal, the illuminating wafer, the connecting wire and the other bracket into a body to complete the fabrication of the illuminating diode. m * However, when the above-mentioned light-emitting diode is turned on, since the light-emitting chip is bonded to the concave cup of the susceptor, the light emitted from the periphery and the bottom surface of the wafer is blocked and reflected by the concave cup, so The illuminating chip emits only the positive light. The side of the illuminating diode cannot see the light emitted by it, although it is electrically connected to the surface by means of surface adhesion technology (SMT). (4) On the shipboard, after the circuit board is energized, the wafer can reach five sides (front, back, left, right, and upper), but the bottom surface is still unable to transmit light, and it cannot be illuminate as an incandescent bulb. effect. There are 4a here, this creator can provide an omnidirectional LED structure, which makes the angles of the level emitted by the LEDs visible. It is a research and design system to provide consumer use. 5 M331759 is the creative motive for the creative research. _ [New content] The main purpose of the present invention is to provide an omnidirectional light-emitting diode structure, which is designed by a combination of at least two conductive supports and at least one light-emitting chip. The light-emitting chip is suspended, so that the periphery of the light-emitting chip is blocked from being blocked, so that the light-emitting range is not limited, and the 360-degree uniform omnidirectional illumination can be added to increase the practicality of the creation. The second purpose of the present invention is to provide an omnidirectional light-emitting diode structure, which is designed by a combination of at least two conductive support brackets and at least a light-emitting chip, and the joint portions of the conductive supports are [shaped, each of which The support & position of the junction can stabilize the positioning of the illuminating wafer, increasing the practicality of the creation. To achieve the above objectives, the creation department includes at least three conductive supports and at least H-day films. Each of the conductive supports is formed with a joint portion; the light-emitting chip is disposed at a joint portion of the at least two conductive supports, and the light-emitting chip is electrically connected to the joint portion of the at least two conductive supports, so that the light-emitting chip is suspended; The omnidirectional light-emitting diode structure having an overall omnidirectional illumination of 3 6 Q degrees and _ positioning. The other characteristics of this creation and the specific practical supplements can be combined with the _ detailed financial accounting. [Embodiment] \Reading Figures 1 to 3, the author is an omnidirectional LED structure, including ^ electric branch * 1 ◦ 'each conductive bracket 1 Q upper end system, forming - joint portion 1 1, Name, ===1 paper type, the tread portion 11 is augmented with the connection portion 1 - the tooth reading portion i 12, and the at least two conductive brackets 10 are disposed opposite each other. Part i Γ Γ shed 2 Q, 峨 (4) (10) Yarn at least: Conductive bracket 10 0. Optical wafer 2 〇 is welded to the electrical connection of the joint part (1), M331759 is connected, and the Judah 11 is clear 1嶋Flip the wafer 2 ο The luminescent wafer 20 is suspended. When in use, the at least two conductive support sides of the present invention are connected to the positive pole, and the other side is connected to the negative pole, "to., two conductive supports; [the joints of the crucibles, a 1 electrical connection port P1 1 1 and The illuminating wafer 2 (- (may also be a plurality of illuminating wafers 20) of the positive and negative electrodes and the female yoke is soldered' while the supporting and positioning portions 112 of the respective bonding portions 11 are firmly fixed to the luminescent wafer 2 〇 The illuminating wafer 20 is suspended, and there is no barrier around the ray of the illuminating wafer 2, so that the light emitted by the illuminating chip 2 发射 emits 60 degrees, please refer to FIG. 3 at the same time. The light-emitting two-station can be clearly seen from any angle. Please refer to Figures 4~5, which is the second embodiment of the creation, at least two conductive support processes. The light-emitting chip 2 (which may also be a plurality of light-emitting chips 2) is further coated with a light-transmissive glue 30 (the light-transmissive glue 3 may be doped with camping powder 3 1 ) When the photo-adhesive 3 ◦ is coated, the luminescent wafer 20 is completely covered, and the conductive support 丄 (10) is partially covered. The at least two conductive support members are connected to the positive electrode on the other side, and the negative electrode is connected on the other side. The electrical Φ connection portion iii of each of the at least two conductive supports 焊接 is soldered to the positive and negative electrodes of the luminescent wafer 2 The supporting clip portion 1 1 2 of each joint portion 1 1 is stably fixed to the light-emitting chip 2 , and since the light-emitting chip 2 is in a meandering shape, there is no barrier around the light-emitting substrate 2 . Therefore, the light emitted by the light-emitting chip 2 can be emitted at a rate of 3 6 Q degrees. Therefore, the light-emitting diode can be clearly seen regardless of the angle of view. Referring to Figures 1 to 5, the omnidirectional light-emitting diode structure of the present invention is characterized by a combination of at least two conductive supports 10 and at least a light-emitting chip 2, which are respectively arranged. The bonding portion 11 is in the shape of a -c, and at least two conductive brackets (4) are oppositely disposed. The electrical connection portion 111 of each of the bonding portions 11 of the at least two wires 7 M331759 - the electrical carrier 10 and the positive electrode of the light emitting chip 2 , the negative electrode is welded 'and the support positioning portion 112 of each joint portion 11 is The light-emitting chip 20 is fixed, and the light-emitting chip 20 is suspended, so that the periphery of the light-emitting chip is blocked by the barrier, so that the light-emitting thinness is not limited, and therefore, the light-emitting diode is viewed from any angle. The light it emits can be clearly seen.

使得本創作具有大幅㈣發級纽3 6 Q度均狄轉功效,增加本 實用性去。 惟以上所述者, 之範圍,凡習於本業 實質内容。 僅為本創叙較佳實_,#不能用嫌定本創作可施 之人士所_可作變化與修飾,皆應視為不雜本創作之 综上所述, 提出專利申請。 本創作確可達到創作之 預期目的,財實用價值無疑 ,爰依法 M331759 【圖式簡單說明】 第1圖係為本創作晶片之立體外觀圖。 第2圖係為本創作實施例之元件分解圖。 第3圖係為本創作實施例之使用示意圖。 - 第4圖係為本創作第二實施例之立體外觀圖。 • 第5圖係為本創作第二實施例之使用示意圖。 ,【主要元件符號說明】 § 1◦、導電支架 11、結合部 111、 電性連接部 112、 支撐定位部 20、發光晶片 3 0、透光膠 31、螢光粉This makes the creation of a large (four) level of the new 3 6 Q degree average turn effect, increase the practicality. However, the scope of the above, the scope of the matter, is the essence of the business. For the purpose of this creation, it is better to use _, # can not be used by people who are suspected of being able to apply this change. It can be regarded as a change and a modification. This creation can indeed achieve the intended purpose of creation, the practical value of money is undoubted, 爰 law M331759 [Simple description of the diagram] The first picture is the three-dimensional appearance of the creation of the wafer. Fig. 2 is an exploded view of the present embodiment. Figure 3 is a schematic view showing the use of the present embodiment. - Figure 4 is a perspective view of the second embodiment of the present creation. • Fig. 5 is a schematic view showing the use of the second embodiment of the present creation. [Description of main component symbols] § 1◦, conductive bracket 11, joint portion 111, electrical connection portion 112, support positioning portion 20, light-emitting chip 30, light-transmitting glue 31, phosphor powder

Claims (1)

M331759 :九、申請專利範園: .1、 一種全向式發光二極體結構,係包括: 至少一導電支架,各導電支架上端係形成一結合部;以及 至4 -發光晶片,該航晶片係設於至少二導電支架之結合部,而該發 - 光晶片係與至少二導電支架之結合部電性連接,使該發光晶片呈懸空狀; •藉此’以形成360度全向發光之全向式發光二極體結構者。 • 2、如申請專利n圍第!項所述之全向式發光二極體結構,其中各導電支架之 •結合部係呈c字型,且該至少二導電支架為呈相對設置者。 3、 如申凊專利範圍第2項所述之全向式發光二極體結構,其中該匸字型結合 部上端係為電性連接部,該電性連接部係焊接於該發光晶片,下端係為支 撐定位部,該支撐定位部係為穩固定位該發光晶片者。 4、 如申請專利範圍第jl項所述之全向式發光二極體結構,其中該各導電支架 之結合部係焊接於該發光晶片,以形成電性連接者。 5、 如申請專利範圍第i項所述之全向式發光二極體結構,其中至少二導電支 ⑩ 架與撕光晶片係進-步以-透光膠包覆,該透光膠包覆時,係將發光晶 片完全包覆’而導電支架則為局部包覆者。 • 6、如申請專利範圍第5項所述之全向式發光二極體結構,其中透光膠内係摻 . 設有螢光粉者。M331759: Nine, application for patent garden: .1, an omnidirectional light-emitting diode structure, comprising: at least one conductive support, the upper end of each conductive support forms a joint; and to the 4-light emitting chip, the aerial wafer The light-emitting chip is electrically connected to the junction of the at least two conductive supports, so that the light-emitting chip is suspended; and thereby forming a 360-degree omnidirectional illumination. Omnidirectional light-emitting diode structure. • 2, such as applying for a patent n circumference! The omnidirectional LED structure of the present invention, wherein the bonding portion of each of the conductive supports is c-shaped, and the at least two conductive supports are oppositely disposed. 3. The omnidirectional LED structure according to claim 2, wherein the upper end of the U-shaped joint is an electrical connection, and the electrical connection is soldered to the illuminating chip, the lower end The support positioning portion is a holder for stably fixing the light-emitting chip. 4. The omnidirectional light emitting diode structure of claim j1, wherein the bonding portions of the conductive supports are soldered to the light emitting chip to form an electrical connector. 5. The omnidirectional light-emitting diode structure as claimed in claim i, wherein at least two of the conductive strips and the tear-off wafer are coated with a light-transmissive glue, and the light-transmitting adhesive is coated. At the time, the luminescent wafer is completely covered, and the conductive support is a partial cladding. • 6. The omnidirectional light-emitting diode structure described in claim 5, wherein the light-transmitting glue is doped with a phosphor powder.
TW96219057U 2007-11-12 2007-11-12 Structure of all directional type light emitting diode TWM331759U (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW96219057U TWM331759U (en) 2007-11-12 2007-11-12 Structure of all directional type light emitting diode
JP2008000033U JP3140311U (en) 2007-11-12 2008-01-08 Omni-directional light emitting diode structure
DE200820000421 DE202008000421U1 (en) 2007-11-12 2008-01-10 Omnidirectional light-emitting diode structure

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Application Number Priority Date Filing Date Title
TW96219057U TWM331759U (en) 2007-11-12 2007-11-12 Structure of all directional type light emitting diode

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DE (1) DE202008000421U1 (en)
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Publication number Priority date Publication date Assignee Title
JP5749599B2 (en) * 2011-08-08 2015-07-15 シチズンホールディングス株式会社 Light emitting device
WO2013071510A1 (en) * 2011-11-18 2013-05-23 Liang Qinghui Horizontal omnidirectional light-emitting led
DE102016117107A1 (en) 2016-09-12 2018-03-15 Ledvance Gmbh Compact LED lighting device and method for its manufacture

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DE202008000421U1 (en) 2008-04-10

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