TWM460203U - Light emitting element - Google Patents
Light emitting element Download PDFInfo
- Publication number
- TWM460203U TWM460203U TW101219800U TW101219800U TWM460203U TW M460203 U TWM460203 U TW M460203U TW 101219800 U TW101219800 U TW 101219800U TW 101219800 U TW101219800 U TW 101219800U TW M460203 U TWM460203 U TW M460203U
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- main surface
- transparent substrate
- emitting
- emitting diode
- Prior art date
Links
Landscapes
- Led Device Packages (AREA)
Description
本創作係一種發光元件，尤指一種運用具多方向出光發光二極體晶片之透明基板而形成的發光板/發光片，並透過立設的方式，以黏接或插接而耦接於承載機構，將本創作之發光元件應用於各種發光裝置。 The present invention relates to a light-emitting component, in particular to a light-emitting panel/light-emitting panel formed by using a transparent substrate having a multi-directional light-emitting diode chip, and is coupled to the carrier by means of erecting by bonding or plugging. The mechanism applies the light-emitting element of the present invention to various light-emitting devices.
在照明技術的領域中，近代對於光源多以兼顧成本、環保以及節電等方向進行發展，以訴求在耗費較少能源的條件下獲得較佳的照明效益，這使得發光二極體在此發展歷程中扮演著重要的角色。 In the field of lighting technology, modern light sources have developed in the direction of cost, environmental protection and power saving, in order to obtain better lighting benefits under the condition of less energy, which makes the development of light-emitting diodes. Play an important role.
發光二極體除了耗電低、不含汞、壽命長以及二氧化碳排放量低等優勢外，其已普遍應用於3C產品指示器與顯示裝置之上；而再隨著發光二極體生產良率的提高，單位製造成本也已大幅降低，因此發光二極體的需求持續增加。 In addition to low power consumption, mercury-free, long life and low carbon dioxide emissions, the LEDs have been widely used in 3C product indicators and display devices, and with the production yield of LEDs. The increase in unit manufacturing costs has also been greatly reduced, so the demand for light-emitting diodes continues to increase.
而若要將發光二極體或類似的發光單元實際應用於照明燈具，則仍有許多發展的空間。過去在利用發光二極體做為光源時，大多為將數個發光二極體晶片或是發光二極體排列佈置於一平面且為單方向出光，或是更進一步在晶片底部設 置光學反射層，以提高單個發光二極體本身的出光效率。 However, if a light-emitting diode or a similar light-emitting unit is actually applied to a lighting fixture, there is still much room for development. In the past, when a light-emitting diode was used as a light source, a plurality of light-emitting diode chips or light-emitting diodes were arranged in a plane and unidirectionally emitted, or further disposed at the bottom of the wafer. An optical reflective layer is placed to increase the light extraction efficiency of the individual light-emitting diodes themselves.
然而，這種佈置方式對於製作大照明角度的燈具並不是很有利，因為發光二極體本身所產生的光當中，僅有部份得以往照明的方向行進，另一部份的光能則被吸收於燈具底座或是在反射的過程中損失，因此需要設置更多的發光二極體來做彌補。 However, this arrangement is not very advantageous for making lamps with large illumination angles, because only part of the light generated by the light-emitting diode itself travels in the direction of the previous illumination, and the other part of the light energy is Absorbed in the base of the lamp or lost during the reflection process, so more LEDs need to be set to make up.
再者，過往的發光二極體燈具多是以平面的基板作為承載發光二極體的底座，因此侷限了在佈置發光二極體於其上的靈活性。若其將基板製作非為平面時，平躺於基板表面的發光二極體所產生的光將會因基板不平整的結構而受到些許遮蔽或是阻礙，這對於減少耗能和降低成本都有不利的影響。因此，發光二極體在做為照明燈具的應用上，仍然有改進的空間存在。 Moreover, the conventional light-emitting diode lamps mostly use a flat substrate as a base for carrying the light-emitting diodes, thus limiting the flexibility in arranging the light-emitting diodes thereon. If the substrate is made non-planar, the light generated by the light-emitting diode lying on the surface of the substrate will be slightly obscured or hindered by the uneven structure of the substrate, which has the advantages of reducing energy consumption and reducing cost. negative effect. Therefore, there is still room for improvement in the application of the light-emitting diode as a lighting fixture.
本創作之主要目的，係提供一種高可靠度之發光元件，其係將承載有多方向出光之發光二極體晶片的透明基板做為發光板，並將之立設於底座之上，以做為一種具照明功能的裝置。 The main purpose of the present invention is to provide a high-reliability light-emitting element which uses a transparent substrate carrying a multi-directional light-emitting diode chip as a light-emitting board and stands on the base to make It is a device with illumination function.
本創作之次要目的，係提供一種發光裝置，其可將多個發光板做對稱性或非對稱性的排列，可增加發光裝置的發光強度，同時也兼顧到各個方向的出光均勻性與應用時所需光形。 The second objective of the present invention is to provide a illuminating device which can align a plurality of illuminating plates symmetrically or asymmetrically, thereby increasing the illuminating intensity of the illuminating device, and also taking into account the uniformity of light emission and application in all directions. The light shape required.
本創作之另一目的，係提供一種發光裝置，係以燈殼做包覆，應用為燈具或廣告看板，不但發光效果佳，低耗電量、不需變壓器等優點也可取代傳統之日光燈管。 Another purpose of the present invention is to provide a light-emitting device which is covered by a lamp shell and used as a lamp or an advertising board. It not only has good luminous effect, but also has the advantages of low power consumption and no transformer, and can replace the traditional fluorescent tube. .
因此，為了達到上述之目的，本創作揭示了一種發光元件，其係包含：一透明基板，具有一承載面；以及至少一發光二極體晶片，設置於該透明基板之該承載面上，而形成可發光之一第一主表面；其中，該發光二極體晶片之一出光角度大於180°，且該透明基板容許該發光二極體晶片所發出之一光線穿透至該透明基板上相對應該第一主表面之一第二主表面。如此架構之下，本創作揭示之發光元件即可提供充足的照明強度、均勻的出光效果，以及在針對不同場合時，可藉由改變透明基板的數量和排列方式而調整亮度之運用靈活性。 Therefore, in order to achieve the above object, the present invention discloses a light-emitting element comprising: a transparent substrate having a bearing surface; and at least one light-emitting diode wafer disposed on the bearing surface of the transparent substrate, and Forming a first main surface that can emit light; wherein, one of the light emitting diode chips has a light exit angle greater than 180°, and the transparent substrate allows one of the light emitted by the light emitting diode chip to penetrate to the transparent substrate One of the first major surfaces should be the second major surface. Under such a framework, the light-emitting elements disclosed in the present invention can provide sufficient illumination intensity, uniform light-emitting effect, and flexibility in adjusting brightness by changing the number and arrangement of transparent substrates for different occasions.
1‧‧‧發光元件 1‧‧‧Lighting elements
11‧‧‧發光裝置 11‧‧‧Lighting device
2‧‧‧透明基板 2‧‧‧Transparent substrate
21‧‧‧第一主表面 21‧‧‧ first major surface
210‧‧‧承載面 210‧‧‧ bearing surface
22‧‧‧第二主表面 22‧‧‧Second major surface
23‧‧‧第一連接導線 23‧‧‧First connecting wire
24‧‧‧第二連接導線 24‧‧‧Second connecting wire
3‧‧‧發光二極體晶片 3‧‧‧Lighting diode chip
31‧‧‧第一電極 31‧‧‧First electrode
32‧‧‧第二電極 32‧‧‧second electrode
33‧‧‧磊晶層 33‧‧‧ epitaxial layer
34‧‧‧發光面 34‧‧‧Lighting surface
4‧‧‧能量轉換層 4‧‧‧ energy conversion layer
5‧‧‧承載座 5‧‧‧ bearing seat
50‧‧‧承載機構 50‧‧‧Loading mechanism
51‧‧‧插槽 51‧‧‧ slots
52‧‧‧翹曲體 52‧‧‧ warped body
53‧‧‧黏接物 53‧‧‧Binders
54‧‧‧底座 54‧‧‧Base
6‧‧‧電路基板 6‧‧‧ circuit board
7‧‧‧燈殼 7‧‧‧Light shell
71‧‧‧罩面 71‧‧‧ Cover
8‧‧‧反射鏡 8‧‧‧Mirror
9‧‧‧類鑽碳膜 9‧‧‧Drilling carbon film
θ1‧‧‧第一夾角 θ 1 ‧‧‧first angle
D‧‧‧距離 D‧‧‧Distance
第一A~B圖：其係為本創作之結構示意圖；第二A~C圖：其係為本創作之不同形式的發光二極體晶片耦接於導線之示意圖；第三A~B圖：其係為本創作之能量轉換層之示意圖；第四圖：其係為本創作之承載座之示意圖；第五A~D圖：其係為本創作之以點對稱或線對稱排列透明基板於承載機構上之俯視示意圖；第六圖：其係為本創作之發光面之示意圖；第七圖：其係為本創作之電路基板之示意圖； 第八A~B圖：其係為本創作之燈殼之示意圖；第九圖：其係為本創作之廣告看板式燈殼之俯視剖面示意圖；第十圖：其係為本創作之反射鏡之示意圖；第十一圖：其係為本創作之類鑽碳膜之示意圖；第十二A~C圖：其係為本創作之透明基板插接或黏接於承載座之示意圖；第十三A~B圖：其係為本創作之透明基板黏接於具翹曲體之承載座之示意圖；以及第十四A~D圖：其係為本創作之球泡燈式之實施示意圖。 The first A~B diagram: it is a schematic diagram of the structure of the creation; the second A~C diagram: it is a schematic diagram of the different forms of the light-emitting diode chip coupled to the wire; the third A~B diagram : It is a schematic diagram of the energy conversion layer of the creation; the fourth picture: it is a schematic diagram of the bearing seat of the creation; the fifth A~D diagram: the system is a point symmetric or line symmetrically arranged transparent substrate A schematic view of the top surface of the supporting mechanism; the sixth drawing: a schematic view of the luminous surface of the creation; the seventh drawing: a schematic diagram of the circuit substrate of the creation; Figure 8A~B: It is a schematic diagram of the lamp shell of the creation; the ninth diagram: it is a schematic sectional view of the advertising kanban lamp shell of the creation; the tenth figure: it is the mirror of the creation Schematic diagram of the eleventh figure: it is a schematic diagram of the carbon film for the creation of the creation; the twelfth A to C: the schematic diagram of the transparent substrate of the creation or the bonding to the carrier; 3A~BFig.: It is a schematic diagram of the transparent substrate adhered to the bearing body with warping body; and the fourteenth A~D diagram: it is a schematic diagram of the implementation of the bulb type of the creation.
為使 貴審查委員對本創作之特徵及所達成之功效有更進一步之瞭解與認識，謹佐以較佳之實施例及配合詳細之說明，說明如後：首先，請參考第一A~B圖，此圖是本創作之發光元件或發光板的結構示意；如圖所示，發光元件1係包含：一透明基板2；一承載面210；一第一主表面21；一第二主表面22以及至少一多方向出光發光二極體晶片3。 In order to give your reviewers a better understanding and understanding of the characteristics of the creation and the efficacies achieved, please refer to the preferred examples and detailed explanations for the following: First, please refer to the first A~B diagram. The figure is a schematic diagram of the light-emitting element or the illuminating panel of the present invention; as shown, the illuminating element 1 comprises: a transparent substrate 2; a bearing surface 210; a first major surface 21; a second major surface 22; The light emitting diode chip 3 is emitted in at least one direction.
其中，為平板薄片狀的透明基板2本身具有兩個主要面體，其中之任一主要面體係為承載面210，具有發光功能的發光二極體晶片3即是設置於此承載面210之上，而形成可發光的第一主表面21。透明基板2未設有發光二極體晶片3的另一主要面體則為第二主表面22。前述佈置方式反之亦可，且 亦可於基板兩個面均佈置發光二極體晶片。 The transparent substrate 2 in the form of a flat sheet has two main faces, and any one of the main surface systems is a bearing surface 210. The light emitting diode chip 3 having a light emitting function is disposed on the bearing surface 210. And forming a first main surface 21 that can emit light. The other main surface of the transparent substrate 2 on which the light-emitting diode wafer 3 is not provided is the second main surface 22. The foregoing arrangement is vice versa, and A light-emitting diode wafer may also be disposed on both sides of the substrate.
透明基板2的材質可為氧化鋁、含有氧化鋁的藍寶石、玻璃、塑膠或是橡膠，其中，本創作較佳實施例之一係採用藍寶石基板，因為此材料大體上為單晶結構，不但具有較好的透光率，且散熱能力佳，可延長發光元件1的壽命，但使用傳統藍寶石基板於本創作中會有易碎裂的問題，因此為克服此可靠度問題，該透明基板2的厚度經實驗驗證要大於或等於200微米，如此方能實際應用做為承載以及透光之基板。而由於發光二極體晶片3本身的出光角度大於180°，並非僅能單向出光，因此當該發光二極體晶片3設置於透明基板2的承載面210上，形成第一主表面21時，發光二極體晶片3所發出之光線至少部分會穿透透明基板2而透明基板2上相對應第一主表面21的第二主表面22出光。 The material of the transparent substrate 2 may be alumina, sapphire containing alumina, glass, plastic or rubber. One of the preferred embodiments of the present invention uses a sapphire substrate because the material is substantially monocrystalline and has not only The light transmittance is good, and the heat dissipation capability is good, and the life of the light-emitting element 1 can be prolonged. However, the use of the conventional sapphire substrate may cause fragility in the present invention. Therefore, in order to overcome the reliability problem, the transparent substrate 2 The thickness has been experimentally verified to be greater than or equal to 200 microns, so that it can be practically used as a substrate for carrying and transmitting light. Since the light-emitting diode 3 itself has a light-emitting angle of more than 180°, it is not only unidirectionally emitted. Therefore, when the light-emitting diode chip 3 is disposed on the bearing surface 210 of the transparent substrate 2, the first main surface 21 is formed. The light emitted by the LED chip 3 at least partially penetrates the transparent substrate 2 and the second main surface 22 of the transparent substrate 2 corresponding to the first main surface 21 is emitted.
另外，本創作進一步設計是使發光元件1之第一主表面21與第二主表面22發出之色溫差異等於或小於1500K，使發光元件1有更全面一致之發光效果。而於透明基板2的透光特性上，當光線之波長範圍大於或等於420奈米，或是當該光線之波長範圍小於或等於470奈米時，在前述透明基板2厚度設計條件下，透明基板2之光穿透率係大於或等於70%。 In addition, the present invention is further designed such that the difference in color temperature between the first major surface 21 and the second major surface 22 of the light-emitting element 1 is equal to or less than 1500 K, so that the light-emitting element 1 has a more uniform illumination effect. On the transparent substrate 2, when the wavelength of the light is greater than or equal to 420 nm, or when the wavelength of the light is less than or equal to 470 nm, the thickness of the transparent substrate 2 is transparent. The light transmittance of the substrate 2 is greater than or equal to 70%.
請參考第二A~C圖，本創作為了獲得供電以進行發光，發光二極體晶片3本身包含第一電極31與第二電極32，此第一電極31與第二電極32則分別與位於透明基板2上之第一連接導線23以及第二連接導線24電性連接。其中，第二A~C圖分 別揭示了不同形式的發光二極體晶片3是透過何種方式與耦接於導線。第二A圖係為橫式發光二極體；第二B圖係為覆晶式發光二極體；第二C圖則是於發光二極體晶片3的磊晶層33之兩端設置第一電極31與第二電極32，以直立設置的方式而與第一連接導線23以及第二連接導線24相連接。 Referring to the second A-C diagram, in order to obtain power supply for illumination, the LED body 3 itself includes a first electrode 31 and a second electrode 32, and the first electrode 31 and the second electrode 32 are respectively located The first connecting wire 23 and the second connecting wire 24 on the transparent substrate 2 are electrically connected. Among them, the second A~C map points It is not disclosed how the different forms of the LEDs 3 are coupled to the wires. The second A picture is a horizontal light emitting diode; the second B picture is a flip chip type light emitting diode; the second C picture is set at the two ends of the epitaxial layer 33 of the light emitting diode chip 3 An electrode 31 and a second electrode 32 are connected to the first connecting wire 23 and the second connecting wire 24 in an upright manner.
由於發光二極體晶片3是設置於承載面210，因此與其第一電極31與第二電極32相連接之第一連接導線23以及第二連接導線24也是同時位於承載面210。 Since the light-emitting diode chip 3 is disposed on the carrying surface 210, the first connecting wire 23 and the second connecting wire 24 connected to the first electrode 31 and the second electrode 32 are also located on the bearing surface 210 at the same time.
請參考第三A~B圖，本創作之發光元件更包含一能量轉換層4，其係設置於第一主表面21或/與第二主表面22之上，或是直接設置於發光二極體晶片上(圖未示)，此能量轉換層4係接收並轉換至少部分發光二極體晶片3所發出色光之波長。能量轉換層4係含有至少一種螢光粉，其可直接接觸於發光二極體晶片3或是與發光二極體晶片3相鄰一段距離而不直接接觸，以接收並至少部分轉換發光二極體晶片3所發出光線為另一種波長範圍的光線。例如，當發光二極體晶片3發出藍光，能量轉換層4就會轉換部分藍光為黃光，而使發光元件1在藍光與黃光混合之下最後發出白光。 Referring to the third A to B, the light-emitting element of the present invention further includes an energy conversion layer 4 disposed on the first main surface 21 or/and the second main surface 22, or directly disposed on the light-emitting diode On the bulk wafer (not shown), the energy conversion layer 4 receives and converts the wavelength of the color light emitted by at least a portion of the LED chip 3. The energy conversion layer 4 contains at least one kind of phosphor powder, which can directly contact the light emitting diode chip 3 or be adjacent to the light emitting diode chip 3 without being in direct contact to receive and at least partially convert the light emitting diode The light emitted by the bulk wafer 3 is light of another wavelength range. For example, when the light-emitting diode chip 3 emits blue light, the energy conversion layer 4 converts part of the blue light to yellow light, and causes the light-emitting element 1 to finally emit white light under the mixture of blue light and yellow light.
而由於第一主表面21與第二主表面22發出之光線強度略有不同，前者主要藉由發光二極體晶片3直接發光，後者則藉由發光二極體晶片3的光線穿透透明基板2而出光，且如前述本創作進一步設計是使發光元件1之第一主表面21與第二主表面22發出之色溫差異等於或小於1500K，因此本創作之 發光元件1較佳設計係可相應調整位於第一主表面21與第二主表面22的能量轉換層4為具不同之螢光粉含量，較佳的實施例可從1比0.5至1比3或其他比例，以提升發光元件1之波長轉換效率與發光效果。 Since the light intensity of the first main surface 21 and the second main surface 22 is slightly different, the former is mainly directly illuminated by the LED chip 3, and the latter is transparent to the transparent substrate by the light of the LED chip 3. 2, and the light is further designed such that the difference in color temperature between the first major surface 21 and the second major surface 22 of the light-emitting element 1 is equal to or less than 1500K, thus the present creation The light-emitting element 1 is preferably designed to adjust the energy conversion layer 4 on the first main surface 21 and the second main surface 22 to have different phosphor content. The preferred embodiment can be from 1 to 0.5 to 1 to 3. Or other ratios to improve the wavelength conversion efficiency and the illuminating effect of the light-emitting element 1.
為求在應用上的便利，請參考第四圖，本創作更包含一承載座5，使透明基板2可以立設於其上並耦接於此承載座5，形成一發光裝置11；另外，透明基板2與承載座5之間具有一第一夾角θ1，且該第一夾角θ1角度可為固定或根據發光裝置光形需要調動，其中較佳實施例的第一夾角θ1角度範圍係介於30°~150°。 For the convenience of application, please refer to the fourth figure. The present invention further includes a carrier 5, such that the transparent substrate 2 can be erected thereon and coupled to the carrier 5 to form a light-emitting device 11; The transparent substrate 2 and the carrier 5 have a first angle θ 1 , and the angle of the first angle θ 1 can be fixed or mobilized according to the light shape of the light-emitting device, wherein the first angle θ 1 of the preferred embodiment ranges The system is between 30° and 150°.
為了提高發光裝置的亮度，使用者也可將複數個透明基板2所形成的發光元件同時佈置於諸如承載座等之承載機構50之上，此時係可採對稱或非對稱排列的形式做佈置，較佳的對稱佈置方式也就是將多個透明基板2所形成的發光元件以點對稱或線對稱的形式設置於承載機構50之上。請參考第五A~D圖，其係在各種不同形狀的承載機構50上設置透明基板2，並且以點對稱或線對稱的形式讓整體發光裝置11的出光能夠均勻(發光二極體晶片3省略示意)，此些發光裝置11的出光效果還可藉由改變第一夾角θ1的大小而再做進一步的調整與改善。另一實施例則以非對稱佈置方式將多個發光元件至少部分集中或分散設置，以達成發光裝置於不同應用時的光形需要(圖未示)。 In order to increase the brightness of the light-emitting device, the user can also arrange the light-emitting elements formed by the plurality of transparent substrates 2 on the bearing mechanism 50 such as the carrier, etc., and the arrangement can be arranged in a symmetric or asymmetric arrangement. Preferably, the symmetric arrangement is such that the light-emitting elements formed by the plurality of transparent substrates 2 are disposed on the support mechanism 50 in a point symmetrical or line symmetrical manner. Please refer to the fifth A to D drawings, which are provided with transparent substrates 2 on various different shapes of the supporting mechanism 50, and can make the light output of the whole light-emitting device 11 uniform in point symmetry or line symmetry (light emitting diode chip 3) The light-emitting effect of the light-emitting devices 11 can be further adjusted and improved by changing the size of the first angle θ 1 . In another embodiment, the plurality of light emitting elements are at least partially concentrated or dispersed in an asymmetric arrangement to achieve a light shape requirement (not shown) of the light emitting device in different applications.
於本創作中，承載座5是用以兼具承載、供電、連結以 及散熱等功能的基座，其材質可如一般市售之球泡燈的底座而以金屬打造，其中，較佳實施例之一係採用一複合式可彎折金屬基板作為承載基座，而外形也不限定為矩形，其亦可為圓形、多邊形，甚至為具有中空之圓形、多邊形等，只要能讓透明基板2立於其上即可。 In the present creation, the carrier 5 is used for carrying, powering, and connecting. And a base of the function of dissipating heat and the like, the material of which can be made of metal as the base of a commercially available bulb lamp, wherein one of the preferred embodiments uses a composite bendable metal substrate as the carrier base, and The shape is not limited to a rectangle, and may be a circle, a polygon, or even a hollow circle, a polygon, or the like as long as the transparent substrate 2 can be placed thereon.
另外，請參考第六圖，位於透明基板2上的多個發光二極體晶片3分別具有一發光面34，此些發光面34係指在發光二極體晶片3的結構中，與透明基板2的承載面210大體上呈平行且暴露出的一面。於本創作中，第一主表面21或第二主表面22之面積係為該些發光面34之總和面積的五倍以上，此係兼顧到發光效率以及散熱等條件而為較佳的配置比例。 In addition, referring to the sixth embodiment, the plurality of light emitting diode chips 3 on the transparent substrate 2 respectively have a light emitting surface 34, and the light emitting surfaces 34 are in the structure of the light emitting diode wafer 3, and the transparent substrate. The bearing surface 210 of 2 is generally parallel and exposed. In the present creation, the area of the first major surface 21 or the second major surface 22 is more than five times the total area of the light-emitting surfaces 34, which is a preferred arrangement ratio considering both luminous efficiency and heat dissipation. .
請參考第七圖，本創作還可更包含一電路基板6與外部電源耦接，其係設置於透明基板2與承載座5之間，並電性耦接於透明基板2上的第一連接導線23以及第二連接導線24(圖未示)，而與發光二極體晶片3電性連接，並供應發光所需電源；若無設置此電路基板6，發光二極體晶片3亦可直接透過第一連接導線23以及第二連接導線24(圖未示)而電性連接於承載座5，使外部電源可經由承載座5對該發光二極體晶片3供電。 Referring to FIG. 7 , the present invention further includes a circuit board 6 coupled to an external power source, which is disposed between the transparent substrate 2 and the carrier 5 and electrically coupled to the first connection on the transparent substrate 2 . The wire 23 and the second connecting wire 24 (not shown) are electrically connected to the LED 3 and supply the power required for illumination; if the circuit substrate 6 is not provided, the LED 3 can also be directly The first connecting wire 23 and the second connecting wire 24 (not shown) are electrically connected to the carrier 5 so that the external power source can supply power to the LED chip 3 via the carrier 5 .
本創作在進一步的實際應用上，為了防止灰塵、水氣等外界環境粒子汙染、腐蝕或磨損透明基板2以及發光二極體晶片3等元件，因此可設置燈殼以保護及隔絕外部之環境汙染物，此燈殼係與承載座5耦接，且透明基板2至少部分置於 該燈殼所形成之空間內。燈殼材質則無特殊的限制，只要能夠透光即可，外觀則可為燈管或是燈箱之形式。前述之能量轉換層4也可選擇塗佈於此燈殼之上，亦能發揮波長轉換的效果。 In further practical application, in order to prevent particles such as dust, moisture and other external environment from polluting, corroding or abrading the transparent substrate 2 and the light-emitting diode chip 3, the lamp housing can be provided to protect and isolate the external environmental pollution. The lamp housing is coupled to the carrier 5, and the transparent substrate 2 is at least partially placed The space formed by the lamp housing. There is no special restriction on the material of the lamp housing. As long as it can transmit light, the appearance can be in the form of a lamp or a light box. The energy conversion layer 4 described above can also be selectively applied to the lamp housing, and can also exert the effect of wavelength conversion.
請參考第八A圖，為本創作具體實施例之一的發光裝置，該發光裝置為長形燈管，也就是將燈殼7設計為透光的管狀結構，然後將發光元件1以及其承載機構50設置於其中，此圖乃為放置單一個發光元件1之狀態；又請參考第八B圖，當兩個以上發光元件1設置於燈殼7之內時，此些發光元件1的第一主表面21之間是以不互相平行的方式做排列。另外，發光元件1至少部分置於燈殼7所形成之空間內，且不緊貼燈殼7的內壁，較佳的實施例為發光元件1與燈殼7之間有一大於500微米(μm)的距離D；但亦可設計以灌膠方式形成燈殼7，並使該燈殼7至少部分包覆並直接接觸於該發光元件1。 Please refer to FIG. 8A, which is a light-emitting device according to one embodiment of the present invention. The light-emitting device is an elongated tube, that is, a tubular structure in which the lamp housing 7 is designed to transmit light, and then the light-emitting element 1 and the bearing thereof are carried. The mechanism 50 is disposed therein, and the figure is a state in which a single light-emitting element 1 is placed; and referring to FIG. 8B, when two or more light-emitting elements 1 are disposed in the lamp housing 7, the light-emitting elements 1 are A main surface 21 is arranged in such a manner that they are not parallel to each other. In addition, the light-emitting element 1 is at least partially disposed in the space formed by the lamp housing 7 and does not abut against the inner wall of the lamp housing 7. In a preferred embodiment, the light-emitting element 1 and the lamp housing 7 are larger than 500 micrometers (μm). The distance D; however, it is also possible to form the lamp envelope 7 by means of potting, and to at least partially cover the lamp envelope 7 and directly contact the light-emitting element 1.
本創作之另一具體實施例的發光裝置為一雙面需要光線的廣告看板，請參考第九圖，此時用以當作廣告看板的燈殼7具有至少一個罩面71，此為主要印刷有廣告的版面，再藉由本創作的發光元件1的第一主表面21和第二主表面22所提供的光照形成罩面71的背光，其中，發光元件1與罩面71之間形成之第二夾角θ2的角度範圍係介於0°~45°(θ2於圖中係為0°，故未示)；也就是在設置上，發光元件1的第一主表面21和第二主表面22基本上是面向罩面71。而為了確保透明基板2以及多方向出光之發光二極體晶片3所組合成的發光元 件1或發光板/發光片所產生的光能夠較均勻的穿透燈殼7，發光元件1至少部分置於燈殼7所形成之空間內，且基本上不緊貼燈殼7的內壁，較佳的實施例為發光元件1與燈殼7之間有一大於500微米的距離D；但另亦可設計以灌膠方式形成燈殼7，並使燈殼7至少部分包覆並直接接觸於透明基板2。 The illuminating device of another embodiment of the present invention is a double-sided advertising illuminating board. Please refer to the ninth drawing. At this time, the lamp housing 7 used as an advertising kanban has at least one covering surface 71, which is the main printing. The advertised layout forms a backlight of the cover 71 by the illumination provided by the first main surface 21 and the second main surface 22 of the light-emitting element 1 of the present invention, wherein the light-emitting element 1 and the cover 71 are formed. The angle range of the two angles θ 2 is between 0° and 45° (θ 2 is 0° in the figure, so it is not shown); that is, in the arrangement, the first main surface 21 and the second main body of the light-emitting element 1 The surface 22 is substantially facing the cover 71. In order to ensure that the light generated by the light-emitting element 1 or the light-emitting plate/light-emitting sheet of the transparent substrate 2 and the multi-directional light-emitting diode chip 3 can penetrate the lamp housing 7 more uniformly, the light-emitting element 1 is at least partially disposed. In the space formed by the lamp housing 7, and substantially not in close contact with the inner wall of the lamp housing 7, a preferred embodiment has a distance D between the light-emitting element 1 and the lamp housing 7 of more than 500 micrometers; The lamp housing 7 is designed to be potting, and the lamp housing 7 is at least partially covered and directly in contact with the transparent substrate 2.
本創作之另一實施例如第十圖所示，係設置一反射鏡8於第二主表面22上，此反射鏡8可反射該發光二極體晶片3所發出至少部分穿透該透明基板2之該光線，而使該光線至少部分改由該第一主表面21射出。此反射鏡8可包括至少一金屬層或一布拉格反射鏡(Bragg reflector)，但不以此為限。舉例而言，布拉格反射鏡可由多層具有不同折射率的介電薄膜所堆疊而構成，或是由多層具有不同折射率的介電薄膜與多層金屬氧化物所堆疊而構成。此反射鏡8可提高發光效率並可改善發光二極體之光型不佳的問題。 Another embodiment of the present invention, as shown in FIG. 10, is a mirror 8 disposed on the second major surface 22, the mirror 8 reflecting the at least partial penetration of the LED substrate 3 through the transparent substrate 2 The light is caused to be at least partially deflected by the first major surface 21. The mirror 8 may include at least one metal layer or a Bragg reflector, but is not limited thereto. For example, the Bragg mirror may be formed by stacking a plurality of dielectric films having different refractive indices, or may be composed of a plurality of dielectric films having different refractive indices stacked with a plurality of metal oxides. This mirror 8 can improve the luminous efficiency and can improve the problem of poor light type of the light-emitting diode.
請參考第十一圖，承載面210以及第二主表面22上可選擇性地設置有一類鑽碳(diamond-like carbon,DLC)膜9，用以增加導熱及散熱效果。 Referring to FIG. 11, the bearing surface 210 and the second main surface 22 are selectively provided with a diamond-like carbon (DLC) film 9 for increasing heat conduction and heat dissipation.
請參考第十二A~C圖，當本創作中的透明基板2設置於承載座5之上時，較佳實施例之一係可透過插接或是黏接的方式來達成兩者的接合。 Referring to Figures 12A to C, when the transparent substrate 2 of the present invention is disposed on the carrier 5, one of the preferred embodiments can be joined by plugging or bonding. .
如第十二A圖所示，當透明基板2佈置於承載座5之上時，其係單孔式插接於承載座5的插槽51，而此插槽51具有與 發光二極體晶片3透過前述之第一連接導線以及一第二連接導線電性連接而對之供電的功能。此時透明基板2上的發光二極體晶片3為了要與承載座5的電源供應相耦接，因此將第一連接導線以及一第二連接導線沿著透明基板2的表面而集中至其邊緣並整合為具有複數個導電觸片的金手指結構，也就是電性連接埠。而插槽51則可讓透明基板2***，使得發光二極體晶片3在獲得承載座5供電的同時，透明基板2也被固定於承載座5的插槽51。 As shown in FIG. 12A, when the transparent substrate 2 is disposed on the carrier 5, it is single-holely inserted into the slot 51 of the carrier 5, and the slot 51 has The light-emitting diode chip 3 is electrically connected to the first connecting wire and the second connecting wire to electrically supply the same. At this time, the light-emitting diode chip 3 on the transparent substrate 2 is coupled to the power supply of the carrier 5, thereby concentrating the first connecting wire and the second connecting wire along the surface of the transparent substrate 2 to the edge thereof. And integrated into a gold finger structure with a plurality of conductive contacts, that is, an electrical connection. The slot 51 allows the transparent substrate 2 to be inserted, so that the light-emitting diode chip 3 is also fixed to the slot 51 of the carrier 5 while the power supply of the carrier 5 is obtained.
接著，請參考第十二B圖，其係為透過多孔式插接透明基板2於承載座5上之結構示意圖。此時透明基板2匯集有連接發光二極體晶片3之線路之一端具有至少一雙插腳結構，其中一個插腳為正極，另一個則為負極，兩處皆為具有導電觸片作為連接埠。而相對應地，在承載座5則具有至少兩個與插腳大小相等的插槽51，使得透明基板2可以順利接合於承載座5之上，並讓發光二極體晶片3獲得供電。 Next, please refer to FIG. 12B, which is a schematic structural view of the transparent substrate 2 on the carrier 5 through the porous insertion. At this time, the transparent substrate 2 has one end of the line connecting the LEDs 3 having at least one double pin structure, one of which is a positive electrode and the other is a negative electrode, and both of them have a conductive contact as a connection port. Correspondingly, the carrier 5 has at least two slots 51 equal in size to the pins, so that the transparent substrate 2 can be smoothly bonded to the carrier 5 and the LEDs 3 can be powered.
請參考第十二C圖，其係改以黏接的方式將透明基板2接合於承載座5。在黏接的過程中，可以透過金、錫、銦、鉍、銀等金屬做焊接輔助而接合，或是使用具導電性的矽膠或是環氧樹脂輔助固定透明基板2。此種以黏接的方式接合透明基板2接合於承載座5可獲致較佳的散熱效果，優於其他各種插接的形式。 Please refer to the twelfth Cth, which is to bond the transparent substrate 2 to the carrier 5 in an adhesive manner. In the process of bonding, it can be joined by soldering with gold, tin, indium, antimony, silver or the like, or the conductive transparent substrate 2 can be fixed by using conductive silicone or epoxy resin. The bonding of the transparent substrate 2 to the carrier 5 in a bonding manner can achieve a better heat dissipation effect, and is superior to other various plugging forms.
請參考第十三A~B圖，本創作中的承載座5為一複合式可彎折金屬基板所構成之非平面結構，其可具有至少一翹曲體 52，係位於承載座5的表面或是側邊，可為與承載座分離或一體化之機構件。此翹曲體52為一可彎折之鋁質基板。由於承載座5具有翹曲體52，因此增加了在應用時的靈活性，有利於針對不同場合的需求而推出具有變化性的發光裝置11。當承載座5具有翹曲體52時，透明基板2係可透過黏接的方式與翹曲體52相耦接，也就是藉由黏接物53的輔助而將透明基板2固定於承載座5，並與承載座5非翹曲的部分的表面維持具有第一夾角θ1；另外，透明基板2亦可透過插接(圖未示)的方式與翹曲體52相連接，也就是藉由連接器的輔助而將透明基板2固定於承載座5，而與承載座5非翹曲的部分的表面維持具有第一夾角θ1。 Referring to the thirteenth A-B, the carrier 5 in the present invention is a non-planar structure composed of a composite bendable metal substrate, which may have at least one warp body 52, which is located on the surface of the carrier 5. Or the side, which can be a separate or integrated machine member from the carrier. The warp body 52 is a bendable aluminum substrate. Since the carrier 5 has the warp body 52, the flexibility in application is increased, and it is advantageous to introduce the illuminating device 11 having variability for the needs of different occasions. When the carrier 5 has the warp body 52, the transparent substrate 2 can be coupled to the warp body 52 by means of bonding, that is, the transparent substrate 2 is fixed to the carrier 5 by the aid of the adhesive 53. And maintaining a first angle θ 1 with the surface of the non-warped portion of the carrier 5; in addition, the transparent substrate 2 can also be connected to the warp body 52 by means of plugging (not shown), that is, by The transparent substrate 2 is fixed to the carrier 5 with the aid of the connector, while the surface of the portion of the carrier 5 that is not warped maintains a first angle θ 1 .
最後，請參考第十四A~D圖，其係為將第十三B圖所示之發光裝置11進一步設置燈殼7以及底座54，而形成球泡燈之實施例。於第十四A圖中，發光元件1具有燈殼7，且此燈殼7與承載座5相連接，但也可將承載座5進一步設置於一般球泡燈之底座54上，再使燈殼7與燈泡球之底座54連接。底座54的形式不拘，可為平台或是另有承載突部。於第十四C圖中，燈殼7之內側塗佈有能量轉換層4，可讓發光二極體晶片3所產生的光線至少有部分在離開燈殼7之前會被轉換波長。而於第十四D圖中，則揭示了使用雙層燈殼7的設計，可在花紋和色彩上做進一步變化。 Finally, please refer to the fourteenth A-D diagram, which is an embodiment in which the light-emitting device 11 shown in FIG. 13B is further provided with the lamp housing 7 and the base 54 to form a bulb lamp. In the fourteenth A, the light-emitting element 1 has a lamp housing 7, and the lamp housing 7 is connected to the carrier 5, but the carrier 5 can be further disposed on the base 54 of the general bulb lamp, and then the lamp is The casing 7 is connected to the base 54 of the bulb ball. The base 54 is of a form that is not limited and can be a platform or another bearing projection. In Fig. 14C, the inner side of the lamp envelope 7 is coated with an energy conversion layer 4, so that at least a portion of the light generated by the light-emitting diode wafer 3 is converted to a wavelength before leaving the lamp envelope 7. In Fig. 14D, the design of the double-layered lamp envelope 7 is revealed, and further changes can be made in the pattern and color.
本創作所揭示之發光元件的結構，藉由將發光二極體晶片設置於透明基板上而形成的發光元件或發光板/發光片可 獲致有效且充分的靈活運用；並且發光元件的兩個主要面方向皆可出光，因此能在最少的供電之下獲得最大的出光效率，並有均勻之出光效果，而無論是在應用於燈泡、燈管、廣告看板等領域，皆可展現其發光效果佳、低耗電量以及出光均勻等優點，實為一具經濟和實用價值的發光元件。 The structure of the light-emitting element disclosed in the present invention, the light-emitting element or the light-emitting board/light-emitting sheet formed by disposing the light-emitting diode wafer on the transparent substrate can be Effective and sufficient flexibility; and the two main faces of the illuminating element can emit light, so that the maximum light output efficiency can be obtained with the least power supply, and the light output effect is uniform, whether it is applied to the bulb, Light bulbs, advertising billboards and other fields can show the advantages of good luminous effect, low power consumption and uniform light output. It is an economical and practical light-emitting component.
惟以上所述者，僅為本創作之較佳實施例而已，並非用來限定本創作實施之範圍，舉凡依本創作申請專利範圍所述之形狀、構造、特徵及精神所為之均等變化與修飾，均應包括於本創作之申請專利範圍內。 However, the above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and the variations, modifications, and modifications of the shapes, structures, features, and spirits described in the scope of the patent application. , should be included in the scope of the patent application of this creation.
1‧‧‧發光元件 1‧‧‧Lighting elements
2‧‧‧透明基板 2‧‧‧Transparent substrate
21‧‧‧第一主表面 21‧‧‧ first major surface
22‧‧‧第二主表面 22‧‧‧Second major surface
3‧‧‧發光二極體晶片 3‧‧‧Lighting diode chip
Claims (26)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101219800U TWM460203U (en) | 2012-10-12 | 2012-10-12 | Light emitting element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101219800U TWM460203U (en) | 2012-10-12 | 2012-10-12 | Light emitting element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM460203U true TWM460203U (en) | 2013-08-21 |
Family
ID=49481740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101219800U TWM460203U (en) | 2012-10-12 | 2012-10-12 | Light emitting element |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM460203U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI642874B (en) * | 2013-09-11 | 2018-12-01 | 晶元光電股份有限公司 | Led assembly and lighting apparatus |
-
2012
- 2012-10-12 TW TW101219800U patent/TWM460203U/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI642874B (en) * | 2013-09-11 | 2018-12-01 | 晶元光電股份有限公司 | Led assembly and lighting apparatus |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11255524B2 (en) | Light emitting device | |
| JP6367526B2 (en) | Sapphire substrate, light emitting diode chip, and light emitting device for forming a light emitting diode chip capable of emitting light in a plurality of directions | |
| TWI565043B (en) | An illumination device | |
| TWM462819U (en) | Light emitting apparatus | |
| TWI533468B (en) | Light emitting element and illumination device thereof | |
| TWM460203U (en) | Light emitting element | |
| TWI644450B (en) | Light emitting device | |
| TWI542034B (en) | Light emitting device | |
| TWI490432B (en) | Light emitting device | |
| CN106169467B (en) | Light emitting device | |
| TWI577919B (en) | Light emitting device | |
| TW201409741A (en) | Light emitting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4K | Expiration of patent term of a granted utility model |