M323977 八、新型說明： 【新型所屬之技術領域】 更洋而言之，特 孔，藉此所產生 及有效降低成本 具。 本創作係關於一種晶片紙帶打孔機， 別是指一種可連續及快速地將晶片紙帶打 出來的孔洞大小一致’進而提南生產效率 等功能之晶片紙帶打孔機之沖孔模座及模 【先前技術】 按，習知的晶片紙帶打孔機之沖孔模座及模具，無法連 績及快速地將晶片紙帶貫穿使用者所需要的孔洞尺寸、大 小，又因為在貫穿孔洞的過程中晶片紙帶無法被沖孔模座及 模具定位，所以常常造成晶片紙帶上之孔洞間的距離無法一 致，造成使用者在使用上不便，且在無形之中成本大幅度的 魯增加。 、 本案創作人從事晶片紙帶打孔機之開發與研究多年，且 對於各種器具構造上的優缺點有相當程度的熟悉了解，由前 述的分析得知習知的晶片紙帶在打孔的過程中無法連續性 及快速地將孔洞打好，且打好出來的孔洞會產生多餘的毛邊 等缺點’有鑑於此’本案創作人遂針對以上之缺失，而進行 研究改良，希望能夠創作出具有連續及快速地將晶片紙帶打 5 M323977 孔，藉此所產生出爽的3、、 ;的孔洞大小一致，進而提高生產效率及 有效降低成本等功能之曰 之日日片紙f打孔機之沖孔模座及模 具，本案創作人本著精益炎 頂皿來精的精神，不斷研究思考歷經多 次測試，終於研究完成本創作之設計。 【新型内容】 P本創作之主要目的，在於提供一種具有連續性及 陕速地將晶片紙帶打孔，藉此所產生出來的孔洞大小一 致’進而提高生產效率及有效降低成本等功能之晶片紙帶 打孔機之沖孔模座及模具。 依據上述之目的，本創作所述之晶片紙帶打孔機之沖 孔模座及模具主要係包含有捲輪裝置、沖孔模座、燒毛邊 裝置及檢測裝置等構件組合而成的。 捲輪裝置，係設置定位於晶片紙帶打孔機之左右兩側 端，該捲輪裝置可供給晶片紙帶放置，並藉由捲輪裝置來 V動推送晶片紙帶前進至其他裝置。 沖孔模座，主要包含有上模、下模、導引銷及沖孔方 針所構成的，其中該導引銷及沖孔方針係設置定位於上模 中間適當處，而在下模中間則形成與上模之導引銷及沖孔 方針相互對稱之孔洞，並藉由導引銷及沖孔方針上下往復 6 M323977 作動，進而使得晶片紙帶之表面上形成產生孔洞。 燒毛邊裝置，係設置定位於沖孔模座及模具之後側 端，該燒毛邊裝置之功用可將經沖孔模座及模具打孔好的 晶片紙帶，進行孔洞毛邊的修飾將多餘的毛邊去除。 檢測裝置，係設置定位於燒毛邊裝置之後側端，可藉 由檢測裝置檢測出晶片紙帶上之孔洞是否還有殘餘的毛邊 未去除掉。 【實施方式】 為期許本創作之目的功效構造及特徵，有更詳盡明確 的瞭解’兹舉出如下較佳之實施例並配合圖式說明如下·· 明參閱第一圖係為本創作之立體組合示意圖，由圖可 本創作之晶片紙帶打孔機之沖孔模座及模具主要係包 1含有捲輪裝置1、沖孔模座及模具2、燒毛邊裝置3及檢測 -裝置4等構件組合而成的。 捲輪裝置1’係設置定位於晶片紙帶打孔機之兩側端 該捲輪裝置1 來帶動推送晶 可供給晶片紙帶5放置，並藉由捲輪裝置 片紙5帶前進至其他裝置。 1 沖孔模座2’主要包含有上模21、下模22、導引鎖213 々針214所構成的，其中該導引銷213及沖孔方針 7 M323977 2i4係設置定位於上模21中間適當處，而在下模22中間則 形成與上模21之導引銷213及沖孔方針214相互對稱之孔 洞，並藉由導引銷213及沖孔方針214上下往復作動，進 而使得晶片紙帶5之表面上形成產生孔洞。 燒毛邊裝置3，係設置定位於沖孔模座及模具2之後側 端，該燒毛邊裝置3之功用可將經沖孔模座及模具2打孔 好的晶片紙帶5,進行孔洞毛邊的修飾將多餘的毛邊去除。 檢測裝置4，係設置定位於燒毛邊裝置3之後侧端可 藉由檢測裝置4檢測出晶片紙帶5上之孔洞是否還有殘餘 的毛邊未去除掉。 續參閱第二圖及第三圖，其分別係為本創作之沖孔模 座及模具分解示意圖及本創作之作動示意圖由圖可知， 本創作之沖孔模座及模* 2’主要係包含有上模21、下模 22、導引銷213及沖孔方針214等元件所組合而成的，該 上模21巾間適當處係形成有凸伸冑212，“凸伸體⑴ 頂部表面分別形成有圓形凹槽2ι〇及矩形凹槽Η〗，其可供 給導引銷2 13及沖丨太必l 〇 1 4 ^ 及沖孔方針2M放置定位，並利用導引銷213 中方針214之沖孔動作可將晶片紙帶$上貫穿所需之 5 ^中該冲孔方針214係可為一體成型或單獨個別製 M323977 下模22中間適當處係形成與導引銷21 3及沖孔方針 214相互對稱的圓形孔洞220及矩形孔洞221，藉由圓形孔 洞220及矩形孔洞221可使放置定位於上模21之導引銷213 及沖孔方針2 14在作上下往復運動時，能使得導引銷2 J 3 及沖孔方針214貫穿於圓形孔洞220及矩形孔洞221内， 進而使得晶片紙帶5之表面上形成產生圓形孔及矩形孔。 導引銷213,係形成為圓形體之態樣，該導引銷213被 設置定位於上模21之圓形凹槽210内，其導引銷213之功 用可將晶片紙帶5表面上進行沖孔之作動進而產生圓形孔 洞，該導引銷213端面係可形成圓形錐狀體之態樣，而圓 幵> 錐狀體可使得晶片紙帶5在輸送的過程中，能使晶片紙 常疋位，且導引銷2 13係可為一體成形或者可為單獨個別 製成的。 冲孔方針214，係設置定位於上模21之矩形凹槽211 内，而沖孔方針214之功用與導引銷213 一樣，亦是將晶 片、、氏T 5之表面上進行沖孔之作動而形成矩形孔洞，且沖 孔方針214係可為一體成形或者可為單獨個別製成的。 而導引銷213與沖孔方針2 14每根與每根之間的距離 P疋相同距離，其中導引銷213端面係可形成圓形錐狀之 L樣，可使晶片紙帶5在高速的輸送當中，藉由導引銷2 1 3 9 M323977 之圓形錐狀體將晶片紙帶5定位，以#、、φ a + 文/T礼方針214及導 引銷213對晶片紙帶5作沖孔之動作，如此一 不^ Β日紙帶$ 經定位後，確保每一次沖孔之動作能使沖孔出來的孔洞大 小一致，進而提高生產效率及有效降低成本之功能。 綜合上述可知，本創作在同類產品中實具有極佳之進 步實用性，同時遍查國内外關於此類結構之技術資料文獻 中，未發現有相同近似之構造存在在先，應符合『創作性』、 『合於產業利用性』以及『進步性』的專利要件，爰依法 提出申請。 10 M323977 【圖式簡單說明】 第一圖為本創作之立體組合示意圖。 第二圖為本創作之沖孔模座及模具分解示意圖。 第三圖為本創作之作動示意圖。M323977 VIII. New description: [New technical field] In the other way, special holes are used to generate and effectively reduce costs. The present invention relates to a wafer paper tape punching machine, which is a punching die for a wafer paper tape punching machine which can continuously and quickly punch the wafer paper tape into a uniform size. Seat and die [Prior Art] According to the conventional punching die holder and die of the wafer paper tape punching machine, it is impossible to continuously and smoothly transfer the wafer paper tape through the size and size of the hole required by the user. In the process of penetrating the hole, the wafer paper tape cannot be positioned by the punching die holder and the mold, so the distance between the holes on the wafer paper tape is often not consistent, which is inconvenient for the user to use, and the cost is invisible. Lu increased. The creator of this case has been engaged in the development and research of wafer paper tape punching machines for many years, and has a considerable degree of familiarity with the advantages and disadvantages of various instrument constructions. From the above analysis, the known wafer paper tape is in the process of punching. It is impossible to make the holes in a continuous and rapid manner, and the holes that are made out will produce unnecessary burrs. In view of this, the creators of this case have made research and improvement in response to the above-mentioned deficiencies, hoping to create continuous And quickly transfer the wafer paper tape to 5 M323977 holes, thereby producing a smooth 3, and the hole size is the same, thereby improving the production efficiency and effectively reducing the cost, etc. Punching mold base and mold, the creator of this case in the spirit of lean and sturdy dish, continue to study and think through many tests, and finally completed the design of this creation. [New Content] P The main purpose of this creation is to provide a wafer that has the continuity and the ability to punch the wafer paper tape in a timely manner, thereby achieving the same hole size, thereby improving production efficiency and effectively reducing costs. The punching die holder and the die of the tape punching machine. According to the above object, the punching die holder and the die of the wafer paper tape punching machine of the present invention mainly comprise a combination of a reel device, a punching die holder, a singeing device and a detecting device. The reel device is disposed at the left and right sides of the wafer tape puncher. The reel device can be placed on the wafer tape and the wafer carrier is pushed by the reel device to advance to the other device. The punching die holder mainly comprises an upper die, a lower die, a guiding pin and a punching policy, wherein the guiding pin and the punching policy are disposed at an appropriate position in the middle of the upper die, and are formed in the middle of the lower die. The hole which is symmetrical with the guide pin and the punching guide of the upper die is operated by the guide pin and the punching policy 6 M323977, thereby forming a hole in the surface of the wafer paper tape. The burring device is arranged to be positioned at the side end of the punching die holder and the mold, and the function of the squeezing device can punch the wafer paper tape punched through the punching die holder and the mold, and the burr of the hole is modified to remove excess burrs. Remove. The detecting device is positioned to be positioned at the rear side of the burr device, and the detecting device detects whether the hole in the wafer tape has residual burrs and is not removed. [Embodiment] For a more detailed and clear understanding of the functional structure and characteristics of the purpose of this creation, the following preferred embodiments are described below with reference to the following description. Schematic diagram, the punching die holder and the die main package 1 of the wafer paper tape punching machine created by the drawing can include a reel device 1, a punching die holder and a die 2, a burr device 3, and a detecting device 4 Combined. The reel device 1' is disposed at both side ends of the wafer tape puncher. The reel device 1 drives the push crystal to be placed on the wafer paper tape 5, and is advanced to the other device by the reel device. . 1 The punching die holder 2' mainly comprises an upper die 21, a lower die 22, and a guiding lock 213 pin 214, wherein the guiding pin 213 and the punching guide 7 M323977 2i4 are disposed in the middle of the upper die 21 Where appropriate, a hole symmetrical with the guide pin 213 and the punching guide 214 of the upper mold 21 is formed in the middle of the lower mold 22, and is reciprocated by the guide pin 213 and the punching guide 214, thereby making the wafer tape Holes are formed on the surface of 5. The burr device 3 is disposed at the side end of the punching die holder and the die 2, and the function of the squeezing device 3 can punch the wafer paper tape 5 punched by the punching die holder and the die 2 to perform the hole burr The modification removes excess burrs. The detecting device 4 is disposed at the rear end of the burr device 3 to detect whether the hole in the wafer strip 5 has residual burrs which have not been removed by the detecting device 4. Continued to refer to the second and third figures, which are respectively the schematic diagram of the punching die holder and the mold decomposition of the creation and the actuation diagram of the creation. It can be seen from the figure that the punching die holder and the mold * 2' of the creation mainly include The upper mold 21, the lower mold 22, the guide pin 213 and the punching guide 214 are combined, and the upper mold 21 is formed with a convex protrusion 212 at an appropriate position, and the top surface of the convex body (1) is respectively Formed with a circular groove 2 〇 and a rectangular groove ,, which can be supplied to the guide pin 2 13 and the punching 丨 1 ^ 1 4 ^ and the punching policy 2M placed and positioned, and utilize the guide pin 213 in the guide 214 The punching action can penetrate the wafer paper tape $ through the required 5^. The punching policy 214 can be integrally formed or separately formed in the middle of the M323977 lower mold 22, and the guide pin 21 3 and punched. The circular hole 220 and the rectangular hole 221 which are mutually symmetrical with respect to the guide 214, and the circular pin 220 and the rectangular hole 221 allow the guide pin 213 and the punching guide 2 14 positioned to be positioned on the upper die 21 to reciprocate up and down. The guide pin 2 J 3 and the punching policy 214 can be made to penetrate through the circular hole 220 and the rectangular hole 221 Further, a circular hole and a rectangular hole are formed on the surface of the wafer paper tape 5. The guide pin 213 is formed into a circular body, and the guide pin 213 is disposed to be positioned in the circular concave shape of the upper mold 21. In the slot 210, the function of the guiding pin 213 can punch the surface of the wafer paper strip 5 to generate a circular hole, and the end surface of the guiding pin 213 can form a circular cone shape, and the circle幵> The tapered body enables the wafer paper strip 5 to be frequently held during the transport process, and the guide pins 213 can be integrally formed or can be individually formed. Punching Policy 214 The positioning is located in the rectangular recess 211 of the upper mold 21, and the function of the punching guide 214 is the same as that of the guiding pin 213, and the punching of the surface of the wafer and the T5 is performed to form a rectangular hole. And the punching policy 214 may be integrally formed or may be separately formed. The guiding pin 213 and the punching policy 2 14 are at the same distance from each other, and the guiding pin 213 The end face can form a circular cone-shaped L-like shape, which enables the wafer paper tape 5 to be transported at a high speed. The wafer paper tape 5 is positioned by the circular cone of the guide pin 2 1 3 9 M323977, and the wafer paper tape 5 is punched by the #, φ a + text/T policy 214 and the guide pin 213. After the positioning of the paper tape, it is ensured that each punching action can make the holes out of the punching holes the same size, thereby improving the production efficiency and effectively reducing the cost. The product has excellent progress and practicality. At the same time, it has not found that the structure with the same approximation exists in the technical literature literature on such structures at home and abroad. It should be consistent with the "creative" and "combined with industrial utilization." And the "progressive" patent requirements, 提出 apply in accordance with the law. 10 M323977 [Simple description of the diagram] The first picture is a three-dimensional combination diagram of the creation. The second picture is a schematic view of the punching die holder and the mold of the creation. The third picture is a schematic diagram of the creation of the creation.
11 M323977 【主要元件符號說明】 1 捲 輪 裝置 2 沖 孔 模座 21 上 模 210 圓 形 凹槽 211 矩 形 凹槽 212 凸 伸 體 213 導 引 銷 214 沖 孔 方針 22 下 模 220 圓 形 孔洞 221 矩 形 孔洞 3 燒毛邊裝置 • 4 檢測裝置 5 晶片紙帶 1211 M323977 [Description of main components] 1 Reel device 2 Punching die holder 21 Upper die 210 Circular groove 211 Rectangular groove 212 Projection 213 Guide pin 214 Punching guide 22 Lower die 220 Round hole 221 Rectangular Hole 3 Burning Edge Device • 4 Detection Device 5 Wafer Tape 12