1320881 九、發明說明： 尤係指一種固定於一電路板並對其上 【發明所屬之技術領域】 本發明涉及一種散熱裝置， 發熱電子元件散熱之散熱裝置。 【先前技術】 電子元件運行頻率和速度不斷提升，發 ，熱量累積引起溫度升高，影響發熱電 隨著電腦產業不斷發展， 熱量越來越大，若不及時排除 子元件之正常運行。 工作聲卡等板卡上晶片容量日益增加， r越來越於此過程產生之熱量不斷增加，如何快速將這些 2 2片紐快速有效紐，也賴目前業者請決之問題了 連接 孰元耕上絲餘11獅其越，級餘器與發 ^件接㈣密牢固’需借助—扣具實現散熱器與該賴元件 …而，由於板卡上元件密布，空間小且相鄰板卡間距窄，於其上 =^裝散熱器不方便，極易因於—板卡上安裝散熱器而與其相鄰板 生干涉，操作不便。此外，傳統上螺絲與習知用於CPU上插座 之扣具H]於板卡上找不珊應配合結構穩讀用，且該结 構複雜、操作不便。 '' 【發明内容】 有鑒於此，有必要提供一種結構緊湊、組裝簡便之散熱裝置。 本發明實施例之散熱裝置固定於一電路板對其上發熱電子元件 散熱，該散熱裝置包括一散熱器及一夾持件，該散熱器包括一底板及 由底板延伸出複數散熱鰭片，該夾持件包括一抵靠部及由抵靠部彎折 延伸出之一彈性夾持部，該底板設有一_^槽，該夾持件繞過電路板一 側邊緣使夾持部抵壓於卡槽内，且該抵靠部與夾持部配合將散熱器夾 持於電路板一側；所述電路板之表面設有與其直接接觸之一基板，所 述發熱電子元件貼設於所述基板表面’所述散熱器底板之底面凸設一 對止動部夾緊所述基板相對二側，從而使所述發熱電子元件夾置於所 述電路板與所述基板之間。 該實施方式與現有技術相比較’本發明中夾持件與電路板配合將 6 1320881 散熱器夾持於電路板上，操作方便、結構緊凑。 【實施方式】 請參閱第一圖至第二圖’本發明散熱裝置i包括一電路板1〇、— 散熱盗20及將散熱器20固定於電路板1〇 一側之夾持件3〇。該電路 板1〇上表面設有-發熱電子元件40及一基板41，該基板41與電路 板ίο直接接觸，發熱電子元件40貼設於該基板41上。該散熱器如 直接貼設於發熱電子元件40上。該電路板1〇 一侧邊緣對應夾持件 設有一缺口 12。 邊散熱器20包括直接與發熱電子元件4〇接觸之底板η及由該 底板22上表面垂直延伸複數散熱鰭片24。該底板22底表面凸設有— =止動部25 ’該止動部25緊貼於基板41相對兩側邊，使底板22與 土板41配合穩固。該底板22—側邊緣對應夾持件3〇、缺口 12設 :開口 26。該底板22上表面設有橫切各散熱鰭片24之卡槽28。該 卡槽28 s史置於底板22中部，將每一散熱鰭片24從中間一分爲二。 垃从該鱗件3G A概呈㈣，其爲—雜金屬線材彎折域。該夹 、30包括一抵罪部32，由抵靠部32 -端弯折延伸之彎曲部34 相對於抵靠部32稍微向浦斜且同向延伸之雜綠部 部32及夹持部36末端分別向外彎折形成引導部幻、37，便於夹持 3〇與散熱器2〇及電路板10組裝配合。該f曲部％ I設於電路板 =^缺口 12、底板22 -側之開σ 26處，並緊挨該側電路板1〇、 =22。該抵靠部％抵靠於電路板1〇下表面，幻寺部％卡持於卡 =28内’將散熱n 2G緊貼於電路板1G上表面 二 ;抵靠部32外表面設有由一種絕熱材料製叙=件;〇 免政熱益20上吸收之熱量通過抵靠部32傳到電 請參閱第三圖，夾持部36由於自身彈力作用 内’膏曲部34 _路板1G之缺σ 12、底板22 =10 -側’使央持件30與電路板10及散熱器2〇緊凑配^；，簡便 本發明散熱裝置中，夹持件30繞過電路板1G—側 益20與該電路板10 ’操作方便，結構緊湊。 ^政… &，上所述’本㈣確已符合發明專利之要件，遂依法提出專 。月。惟，社所述者僅為本發明之雛實補，自不駄此限制本= 1320881 之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之 等效修飾或變化，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 第一圖係本發明散熱裝置之立體組合圖。 第二圖係第一圖之立體分解圖。 第三圖係第一圖之倒置圖。 【主要元件符號說明】 電路板 10 缺口 12 散熱器 20 底板 22 散熱鰭片 24 止動部 25 卡槽 28 扣具 30 抵靠部 32 彎曲部 34 爽持部 36 引導部 33、37 套體 35 開口 26 發熱電子元件40 基板 41 81320881 IX. Description of the invention: In particular, it is fixed on a circuit board and is attached thereto. [Technical Field] The present invention relates to a heat dissipating device and a heat dissipating device for dissipating heat of electronic components. [Prior Art] The operating frequency and speed of electronic components are constantly increasing, and the accumulation of heat and heat causes temperature rise, which affects the heating power. With the continuous development of the computer industry, the heat is getting larger and larger, and the normal operation of the sub-components is not eliminated in time. The capacity of the chip on the working sound card and other cards is increasing. r is getting more and more heat generated in this process. How to quickly and effectively make these 2 2 pieces of fast and effective new ones depends on the problem of the current industry. Silk Yu 11 lions, the level of the residual device and the hair piece connected (four) tight and firm 'need to use - the buckle to achieve the heat sink and the components ... and, because the components on the board are dense, the space is small and the adjacent card spacing is narrow It is inconvenient to mount the heat sink on it. It is easy to interfere with the adjacent board due to the installation of the heat sink on the board, which is inconvenient to operate. In addition, the conventional screw and the conventional fastener H used for the CPU socket can be used for stable reading on the board, and the structure is complicated and inconvenient to operate. In view of the above, it is necessary to provide a heat dissipating device that is compact in structure and easy to assemble. The heat dissipating device of the embodiment of the present invention is fixed to a circuit board for dissipating heat from the heat-generating electronic component. The heat dissipating device includes a heat sink and a clamping member. The heat sink includes a bottom plate and a plurality of heat dissipating fins extending from the bottom plate. The clamping member comprises an abutting portion and an elastic clamping portion extending from the abutting portion, the bottom plate is provided with a slot, the clamping member is wound around the side edge of the circuit board to press the clamping portion In the card slot, the abutting portion cooperates with the clamping portion to clamp the heat sink on one side of the circuit board; the surface of the circuit board is provided with a substrate directly in contact with the substrate, and the heat-generating electronic component is attached to the A surface of the substrate surface of the heat sink base plate protrudes from a pair of stoppers to clamp opposite sides of the substrate, so that the heat-generating electronic component is sandwiched between the circuit board and the substrate. This embodiment is compared with the prior art. In the present invention, the clamping member and the circuit board cooperate to clamp the 6 1320881 heat sink on the circuit board, and the operation is convenient and the structure is compact. [Embodiment] Referring to the first to second figures, the heat sink i of the present invention includes a circuit board 1A, a heat sink 20, and a holder 3 for fixing the heat sink 20 to the side of the circuit board 1〇. The upper surface of the circuit board 1 is provided with a heat-generating electronic component 40 and a substrate 41. The substrate 41 is in direct contact with the circuit board ί, and the heat-generating electronic component 40 is attached to the substrate 41. The heat sink is directly attached to the heat-generating electronic component 40. One side edge of the circuit board 1 设有 is provided with a notch 12 corresponding to the clamping member. The edge heat sink 20 includes a bottom plate η that is in direct contact with the heat-generating electronic component 4A and a plurality of heat-dissipating fins 24 extending perpendicularly from the upper surface of the bottom plate 22. The bottom surface of the bottom plate 22 is convexly provided with a ==stop portion 25'. The stopper portion 25 is in close contact with the opposite side edges of the substrate 41, so that the bottom plate 22 and the earth plate 41 are fitted together. The bottom plate 22 has a side edge corresponding to the holding member 3〇 and the notch 12: an opening 26. The upper surface of the bottom plate 22 is provided with a card slot 28 transverse to each of the heat dissipation fins 24. The card slot 28 s is placed in the middle of the bottom plate 22, dividing each heat sink fin 24 into two from the center. From the scale 3G A (4), it is - the metal wire bending field. The clip 30 includes a sinus portion 32. The curved portion 34 bent by the abutting portion 32-end is slightly inclined toward the slanting portion and the opposite end of the green portion 32 and the end of the nip portion 36 with respect to the abutting portion 32. The guiding portion is respectively bent outward to form a guiding portion, 37, which is convenient for clamping and clamping assembly of the heat sink 2 and the circuit board 10. The f-curve % I is placed at the opening σ 26 of the circuit board = ^ notch 12, the side of the bottom plate 22 - and is close to the side circuit board 1 〇, = 22. The abutting portion % is abutted against the lower surface of the circuit board 1 , and the phantom portion is held in the card=28. The heat dissipation n 2G is closely attached to the upper surface 2 of the circuit board 1G; the outer surface of the abutting portion 32 is provided by A heat-insulating material is described as a piece of material; the heat absorbed by the heat-eliminating heat 20 is transmitted to the electricity through the abutting portion 32. Referring to the third figure, the clamping portion 36 acts as a paste portion 34 _ road plate 1G due to its own elastic force. The lack of σ 12, the bottom plate 22 = 10 - the side 'to make the holding member 30 and the circuit board 10 and the heat sink 2 〇 compact; ^, in the heat sink of the present invention, the clamping member 30 bypasses the circuit board 1G - side Benefit 20 and the board 10 'easy operation and compact structure. ^Government... &, the above mentioned (4) has indeed met the requirements of the invention patent, and has been specifically proposed according to law. month. However, the only ones mentioned in the article are the supplements of the present invention, and this does not limit the scope of the patent application of this = 1320881. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a three-dimensional combination diagram of the heat sink of the present invention. The second figure is an exploded perspective view of the first figure. The third figure is an inverted view of the first figure. [Description of main component symbols] Circuit board 10 Notch 12 Heat sink 20 Base plate 22 Heat sink fin 24 Stop portion 25 Card slot 28 Buckle 30 Abutment portion 32 Bending portion 34 Cooling portion 36 Guide portion 33, 37 Case 35 Opening 26 Heated electronic components 40 Substrate 41 8