M280094 八、新型說明： 【新型所屬之技術領域】 本新養«於喊設有液冷式散歸置之電腦主機 相:尤指-種於電腦主機箱之箱體前端，與所樞之門扇間，形成 有今置空間’以_門扇鎖接液置所需之部份元件者。 【先前技術】 機二T個人電腦或伺服器，於主機箱中，係猶^ Γ、硬碟、電源細、介面卡......等等的電子裝置，由於當 姆咐w咖盪而產生 ^皿躲，如無適當的散熱，極易因高溫而造成損毁的現象，緣 於電·機箱中，皆會裝置適t的散熱裝置，以提高晶 片專熱源的散熱效率，以轉正常的工作溫产。 一液冷孟’緊貼電齡機箱的熱源中；—液壓 讀液管連接至該液冷盒之入口端者；—散熱排，含有一熱= ==管上嵌置有多數散熱鰭片，並令該熱交換管的入 接==與液冷盒之出口端相連接者；一水箱，以輸液管串 =夜嗎浦〜關，使冷卻液可以循 二：冷盒、散熱排、水箱中者;以及風扇鎖接於該 ’如是藉由冷卻液於上述元件中之循環，而將熱源 生之…此’峨交換，傳遞至散熱排散熱者。 M280094 上述之液冷式散熱裝置，由於 於新-代的個人電腦t，然上述液佳’己被普遍應用 件’皆必須安裝於電腦域箱内，所需要之各元 如主機板、硬碟、電祕廊哭、於電如主機箱中，必須安裝 間上已軸 '〜、'^、主機板......等等的多數元件，空 使電魏冷散_置的多項元件於内，將 的安穿外Γ H更顯雜，除了不利日後其它周邊設備 而顯而降低散熱效率， 卜有本2⑽舰，伽，術出-種前面 又口又有液冷式散熱裝置之電腦主機箱。 【新型内容】 腦主之目的曰在提供一種前面裝設有液冷式散熱裝置之電 栈相，係包括：-箱體及至少—⑽，其中該門扇之一侧， 樞接於箱體之前端，以撥轉地遮阻於該箱體之前方者；1 Z當朗綱輯陶碰蝴，彻颇箱體之前 =’她有-㈣，界概㈣，略_之裡 ft錄置，如散熱排、風扇..··..等，並使該液冷散熱I置 可隱藏於該容置空間中者。 晰之本新型之可取實體，可由以下酬及所附各圖式，而得以明 【實施方式】 請參閱第-至六晒示，本新型係有關於一種前面裂設有液 M280094 、月欠…衣置之電腦主機箱，係包括··一箱體（2〇)及至少一門扇 (30) ，其中該門扇⑽)之一側，柩接於箱體⑽）之前端，可撥轉 地遮畴該·⑽前方；其特徵在於：當門扇⑽撥轉地雜 ;箱體(20)别方時，於該門扇（3〇)與箱體⑽)之前端⑵）間， 田有&間’界疋為谷置空間⑽），以於該門扇⑽）之裡側， 口衣液冷散熱裝置⑽)所需之元件，並使其隱藏於該容置空間（⑻ 中者。 • 如第三、五圖所示，本新型所應用之液冷散熱裝置（40)，係 有液冷益(41)，緊貼於電腦主機箱内之熱源(22，如中央處理 者，/夜壓幫浦(42)，其出口端係以輸液管〔圖中虛線所示〕 連酿練冷盒⑷）之人σ端者；_散熱排⑽，含有—熱交換 官(431)，於該熱交換管(431)讀置有多數散熱則（432)，並令 忒熱父換管(431)的入口端以輸液管與液冷盒⑷）之出口端相連 接者，水箱（44) ’以輸液管串接於熱交換管之出口端與液壓幫 • 浦（42)之入口端間，使冷卻液可以循環於液壓幫浦（42)、液冷盒 ⑷）、散熱排(43)、水箱（44)中者；以及風扇（45)鎖接於該散熱 排(43)之一側者。上述之液冷散熱裝置(4〇)之各元件，係已普遍 應用於一般之電腦液冷散熱裝置中，由於並非本新型之專利申过 標的，故不贅述，另外本新型猶可應用於其它習知液冷散熱裴置 之安裝上者。 & 如第一至五圖所示，其中該門扇（30)上，係設有多數進氣孔 (31) 及排氣孔(32)，並使各進氣孔(31)投影對正於風扇（45)之進 7 M280094 氣端，以於啟動該液冷散熱裝置（40)之風扇（45)時，可將外界之 冷空氣由進氣孔(31)吸入後，吹向散熱排（43)，並將散熱排(43) 所夾帶之熱能，由位於門扇（30)外圍之各排氣孔(32)向外吹出。 本新型所揭示之門扇（30)，於該進氣孔（31)與排氣孔（32) +，猶可裝置-網層㈤、321)，哺阻外界異物進人電腦主機 •箱中，或避免使用者因不小心觸碰風扇(；45)，而造成意外傷害。 本新型所揭示前面裝設有液冷式散熱裝置之電腦主機箱，於 φ 應用上’係可如第三、五圖所示，於該電腦主機箱之門扇（30)裡 側’依序鎖接液冷散熱裝置之風扇（45)及散熱排⑽等元件，使 »亥風扇(45)及政熱排(43) ’可以如第四圖所示，隨門扇（3〇)掀轉、 位移，當然’本新型並不自限雜於該門扇⑽)之液冷散熱裝置 (40)的元件數目或種類，例如可以將風扇（45)、散熱排⑽、液 壓幫浦(42)及水箱（44)一併鎖接於該門扇（3〇)上。 如第六圖所示，本新型所揭示前面裝設有液冷式散熱裝置之 • €腦主機箱，其中於該箱體⑽之前端兩側，分別樞裝有一門扇 (30)，且令兩門扇⑽)撥轉地遮阻於該箱體⑽前方時，於兩門 扇（30)間’係相隔有一空間，界定型成第二容置空間（i〇a)，以供 裝置液冷散熱敦置⑽所需之元件；如第六圖所示，於最外層之 門扇⑽裡侧’係可鎖接風扇（45)，而裡層之⑽⑽裡侧，則 可鎖接政熱排(43)，當在關兩門扇（3Q)時，可使風扇⑹被隱 藏於兩門扇（30)間之第二容置空間⑽）中，而散熱排⑽則被隱 藏於内層Η扇（3〇)與箱體(2〇)前端⑵)所構成之容置空間〇〇)中 8 M280094 者0 本新型所揭示前©裝設核冷式散絲置之f齡機箱，其 主要結構特徵在於，該f腦主顧之箱體(2G)前方義接之門扇 (30)，令該Η扇⑽於關Η狀態時，門扇⑽與箱體間，至少形 成有-容置空miG或IGa) ’使門扇⑽可以在鎖接有液冷散熱 裝置⑽之元件下，依然:可以正常的開啟、_，藉此，將原本 必須裝置在電駐鋪之箱體(2G)_部份齡散熱裝置(4〇)元 件，移至賴⑽外絲’即安裝於⑽⑽上，如此以增加電 腦主機箱箱體⑽内之空間，便·它硬體裝置於該電腦主機箱 體⑽中，*優異於—般僅能將液冷散熱裝置之元件裝置在 相體内之習知f齡鋪，峨本_之新酿用 〜本新型所揭示之結構、元件形狀，可於不違本新型之精神及 範疇下予以修飾應用，本新型並不自限。 【圖式簡單說明】 第一圖.係本新型之立體分解圖。 第二圖··係本新型於組合後之立體圖。 第二圖：係本新型之俯視結構示意圖。 第四圖·係本新型於敞開門扇時之立體圖。 第五圖·係本新型於敞開門扇之俯視示意圖。 第六圖：係本新型另一實施例示意圖。 【元件符號簡單說明】 (10)谷置空間 （l〇a)第二容置空間（20)箱體 M280094 (21)前端 (32)排氣孔 (40)液冷散熱裝置 (42)液壓幫浦 (432)散熱鰭片 (30)門扇 (311)網層 (41)液冷盒 (43) 散熱排 (44) 水箱 (31)進氣孔 (321)網層 (22)熱源 (431)熱交換管 (45)風扇M280094 8. Description of the new model: [Technical field to which the new model belongs] The new camera «Yuyong computer host with liquid-cooled scattered placement: especially-the front of the box of the computer main box, and the door of the hinge In the meantime, there is a space where the home is placed, and the door lock is used to connect some components required for liquid placement. [Previous technology] Machine 2T personal computer or server, in the main box, is still an electronic device ^ Γ, hard disk, power supply, interface card ... etc. However, if there is no proper heat dissipation, it is easy to cause damage due to high temperature. Due to the electrical and chassis, suitable heat dissipation devices will be installed to improve the heat dissipation efficiency of the chip's dedicated heat source to turn to normal. Work in warm production. A liquid cold Meng 'is close to the heat source of the electrical age chassis;-the hydraulic liquid reading tube is connected to the inlet end of the liquid cooling box;-the heat radiation bar contains a heat = == the tube has most of the heat dissipation fins embedded in it, And make the heat exchange tube access == connected with the outlet end of the liquid cooling box; a water tank, with the infusion tube string = Yema Pu ~ off, so that the cooling liquid can follow two: cold box, heat sink, water tank And the fan is locked to the 'if the heat source is circulated through the circulation of the cooling liquid in the above-mentioned components ... this' e is exchanged and passed to the radiator. M280094 The above-mentioned liquid-cooled heat-dissipating device, because of the new-generation personal computer t, but the above-mentioned liquid good 'has been widely used parts' must be installed in the computer domain box, the required elements such as the motherboard, hard disk , Electric arcade crying, in the electricity such as the main box, you must install the majority of the components of the room '~,' ^, the main board ... etc. In the inside, the safety of the outer Γ H is more complicated. In addition to the disadvantages of other peripheral equipment in the future, it will reduce the heat dissipation efficiency. There are Ben 2 ⑽ships, Gamma, and other types of liquid-cooled heat dissipation devices. Computer main box. [New content] The purpose of the brain master is to provide an electric stack phase equipped with a liquid-cooled heat dissipation device in the front, which includes:-a cabinet and at least-⑽, wherein one side of the door leaf is pivotally connected to the cabinet The front end is blocked in front of the box by turning; 1 Z when Lang outline Tao Tao butterfly, before the front of the box = 'She has -㈣, ㈣ 界 ㈣, slightly _ 之 里 ft recording, Such as heat sinks, fans, etc., and the liquid-cooled heat sink can be hidden in the accommodation space. A clear and desirable entity of the new model can be clarified by the following remuneration and accompanying drawings. [Embodiment] Please refer to the first to sixth illustrations. The new model is related to a front cracked liquid M280094, monthly debt ... The main computer case of the garment includes a box body (20) and at least one door leaf (30), wherein one side of the door leaf ⑽) is connected to the front end of the box ⑽) and can be turned to cover The front of the door; it is characterized by: when the door leaf ⑽ is turned around; when the box (20) is elsewhere, between the door leaf (3〇) and the front end of the box ⑽), Tian You & 'The boundary is the space for the valley ⑽), so that the inner part of the door leaf ⑽), the liquid-cooled heat dissipation device 口) is required to be hidden in the storage space (the one in ⑻. As shown in Figures 3 and 5, the liquid-cooled heat sink (40) used in the new model is liquid-cooled (41), which is located close to the heat source (22, such as the central processor, night pressure helper) in the main computer case. Pu (42), whose exit end is the infusion tube (shown in the dotted line in the figure) and the person σ end of the cold box ⑷); _ heat radiation ⑽, containing-heat exchange officer (431), The heat exchange tube (431) reads most of the heat radiation rules (432), and the inlet end of the heat exchange tube (431) is connected with the infusion tube and the outlet of the liquid cooling box (⑷). The water tank (44) 'The infusion tube is connected in series between the outlet end of the heat exchange tube and the inlet end of the hydraulic pump (42), so that the coolant can be circulated between the hydraulic pump (42), the liquid cooling box (⑷), and the radiator (43) One of the water tank (44); and one of the fans (45) locked to one side of the heat sink (43). The components of the above-mentioned liquid-cooled heat-dissipating device (40) have been widely used in general computer liquid-cooled heat-dissipating devices. Since this type of patent has not been applied for, it will not be described in detail, and the new type can still be applied to other Know the installation of liquid-cooled heat sinks. & As shown in the first to fifth figures, the door leaf (30) is provided with a plurality of air inlet holes (31) and exhaust holes (32), and the projections of each air inlet hole (31) are aligned with The inlet of the fan (45) 7 M280094 air end, so that when the fan (45) of the liquid-cooled heat dissipation device (40) is started, the cold air from the outside can be sucked in through the air inlet (31) and blown to the heat sink ( 43), and the thermal energy carried by the heat radiation bar (43) is blown out from the exhaust holes (32) located on the periphery of the door leaf (30). The door leaf (30) disclosed in the new model, in the air inlet hole (31) and the exhaust hole (32) +, is still a device-mesh layer, 321), which prevents foreign objects from entering the computer host box. Or avoid accidental injury caused by the user accidentally touching the fan (; 45). The computer mainframe with a liquid-cooled heat dissipation device disclosed in the front of the new model can be sequentially locked on the inside of the door (30) of the mainframe of the computer mainframe as shown in Figures 3 and 5 in φ application. The liquid-cooled radiator (45) and the heat sink (45) and other components make the »Hai fan (45) and the political heat sink (43) 'can be turned and displaced with the door fan (30) as shown in the fourth figure. Of course, 'the new model is not limited to the number or type of components of the liquid-cooled heat sink (40) that is mixed with the door leaf (e.g., a fan (45), a heat sink, a hydraulic pump (42), and a water tank ( 44) The door leaf (30) is locked together. As shown in Figure 6, the front of the new model is equipped with a liquid-cooled heat dissipation device. The main brain box is equipped with a door (30) on both sides of the front end of the box. When the door leaf ⑽ is turned to block in front of the box ⑽, a space is separated between the two door leaves (30), and is defined as a second accommodation space (i0a) for the device to cool the liquid. Install the required components; as shown in the sixth figure, on the inner side of the outermost door leaf, a fan (45) can be locked, and on the inner side of the inner door, it can be locked with a thermal radiator (43) When the two door fans (3Q) are closed, the fan ⑹ can be hidden in the second accommodating space 两 between the two door fans (30), and the heat dissipation ⑽ is hidden in the inner fan (3〇) and The housing space formed by the front end of the cabinet (2〇) ⑵) 8 of the M280094 is 0 0 The f-type chassis with a nuclear-cooled loose wire arrangement disclosed in the front of the new model has the main structural feature that the f The door fan (30) that is connected in front of the box (2G) of the brain, so that when the Ηfan⑽ is in the closed state, at least there is-containing empty miG or IGa between the door ⑽ and the box. The fan can be locked with the liquid-cooled heat-dissipating device⑽, and can still be turned on normally. Therefore, it must be installed in the electrical box (2G). 〇) The components are moved to the outer wire of Lai '' and installed on the ⑽⑽, so as to increase the space inside the main box ⑽ of the computer mainframe, then its hardware is installed in the main box ⑽ of the computer mainframe. Can only install the components of the liquid-cooled heat-dissipating device in the phase of the body. The new brewing of Eben _ the structure and component shape disclosed in the new model can be used without departing from the spirit and scope of the new model. To be modified and applied, the new model is not self-limiting. [Schematic description] The first figure is a three-dimensional exploded view of the new model. The second picture is a perspective view of the new model after combination. The second figure is a schematic view of the top structure of the new model. The fourth figure is a perspective view of the new model when the door is opened. The fifth figure is a schematic top view of the open door of the new model. Fig. 6 is a schematic diagram of another embodiment of the present invention. [Simple description of component symbols] (10) Valley space (10a) Second accommodation space (20) Box M280094 (21) Front end (32) Exhaust hole (40) Liquid cooling device (42) Hydraulic help Pu (432) heat sink fins (30) door leaf (311) mesh layer (41) liquid cooling box (43) heat sink (44) water tank (31) air inlet (321) mesh layer (22) heat source (431) heat Exchange tube (45) fan