TWI661170B - A cycle structure for dissipating heat - Google Patents
A cycle structure for dissipating heat Download PDFInfo
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Abstract
一種散熱循環結構，係包括一本體、至少一熱交換單元、至少一水排及至少一泵浦，該本體具有一容置空間容置至少一發熱元件，該熱交換單元設置於該容置空間內並與所述發熱元件對應相接觸貼設，該水排設置於該本體外部並透過至少一管體組與該熱交換單元相連接，該泵浦可被設置於該本體內部或外部其中任一並與所述熱交換單元及水排連接，透過本發明的結構設計，可大幅提高熱交換效率及散熱效能，並具有模組化的效果。 A heat dissipation circulation structure includes a body, at least one heat exchange unit, at least one water drain, and at least one pump. The body has an accommodation space to accommodate at least one heating element, and the heat exchange unit is disposed in the accommodation space. The water drain is arranged inside and corresponding to the heating element. The water drain is arranged outside the body and is connected to the heat exchange unit through at least one tube body group. The pump can be arranged inside or outside the body. Any one is connected to the heat exchange unit and the water drain, and through the structural design of the present invention, the heat exchange efficiency and heat dissipation efficiency can be greatly improved, and it has a modular effect.
Description
本發明是有關於一種散熱循環結構，尤指一種可大幅提升散熱效率之散熱循環結構。 The present invention relates to a heat radiation circulation structure, and more particularly to a heat radiation circulation structure that can greatly improve heat radiation efficiency.
科技的進步，可提昇人類生活上的便利性，尤其是目前各種資料處理及網際網路的運用，皆需依賴電子設備的運作，因此，具高速處理效能及大儲存能量之電子設備乃被廣泛應用於各企業中。 Advances in science and technology can improve the convenience of human life, especially the current use of various data processing and the Internet depends on the operation of electronic equipment. Therefore, electronic equipment with high-speed processing performance and large storage energy is widely Used in various enterprises.
以傳統習見可容納各種發熱元件之IT、通訊、工業、交通、運輸等之機箱(櫃)結構來作說明，該機箱(櫃)的內部係為一封閉式的容置空間，該容置空間係可供容納複數發熱元件(可為中央處理器(CPU)、微處理器或晶片或單晶片或其他因電力驅動而產生熱源的單元或裝置等)，且於該容置空間中設有複數水冷頭與各發熱元件相貼設，並藉由一管體組及一泵浦將內部的一工作流體帶至水排處，並透過設置於內部的風扇驅動機箱(櫃)之容置空間內的氣體，以令水排內吸收熱量的工作流體與機箱(櫃)內部的氣體進行熱交換作用，藉以達到散熱作用，降低各發熱元件溫度之目的。 It is described in the conventional structure of an enclosure (cabinet) that can accommodate various heating elements in IT, communications, industry, transportation, and transportation. The interior of the enclosure (cabinet) is a closed accommodation space. The accommodation space It can accommodate a plurality of heating elements (which can be a central processing unit (CPU), a microprocessor or a chip or a single chip or other units or devices that generate heat due to electric drive, etc.), and a plurality of The water-cooling head is attached to each heating element, and a working fluid is brought to the water drain through a tube group and a pump, and is driven in the accommodation space of the chassis (cabinet) through the fan installed inside. The gas is used to make the working fluid that absorbs heat in the water row exchange heat with the gas inside the cabinet (cabinet), so as to achieve the purpose of heat dissipation and reduce the temperature of each heating element.
然而，上述散熱循環過程皆僅係於機箱(櫃)內部進行熱交換散熱，於機箱(櫃)內部設置有複數發熱元件，且經由機箱(櫃)內部設置的水排及風扇所排出的氣體溫度也相對較高，更由於該機箱(櫃)係為一密閉式的空間，此會造成較熱的氣體滯留在機箱(櫃)內部排不出去，容易造成其整體之散熱效率持續下降的惡性循環，導致散熱效果極為不佳且熱交 換效率差。 However, the above-mentioned heat dissipation cycle processes are only performed inside the chassis (cabinet) for heat exchange and heat dissipation. A plurality of heating elements are arranged inside the chassis (cabinet), and the temperature of the gas discharged by the water exhaust fan and the fan disposed inside the chassis (cabinet). It is also relatively high, and because the cabinet (cabinet) is a closed space, this will cause hot gas to stay inside the cabinet (cabinet) and cannot be discharged, which will easily cause a vicious cycle in which the overall cooling efficiency continues to decline. , Resulting in extremely poor heat dissipation and heat transfer Change efficiency is poor.
是以，要如何解決上述習用之問題與缺失，即為本案之發明人與從事此行業之相關廠商所亟欲研究改善之方向所在者。 Therefore, how to solve the above-mentioned problems and shortcomings of the custom, that is, where the inventor of this case and the relevant manufacturers engaged in this industry are eager to study and improve.
爰此，為有效解決上述之問題，本發明之主要目的在於提供一種可大幅增進熱交換效率以提高散熱效果之散熱循環結構。 Therefore, in order to effectively solve the above problems, the main object of the present invention is to provide a heat dissipation cycle structure which can greatly improve the heat exchange efficiency and improve the heat dissipation effect.
本發明之次要目的，在於提供一種可大幅提高組裝便利性之散熱循環結構。 A secondary object of the present invention is to provide a heat radiation circulation structure that can greatly improve the convenience of assembly.
本發明之次要目的，在於提供一種具有模組化之散熱循環結構。為達上述目的，本發明係提供一種散熱循環結構，係包括一本體、至少一熱交換單元、至少一水排及至少一泵浦，該本體具有一容置空間容置至少一發熱元件，該熱交換單元設置於該容置空間內並與所述發熱元件對應相接觸貼設，該熱交換單元內填充有一工作流體，該水排設置於該本體外部並透過至少一管體組與該熱交換單元相連接，該泵浦設置於該本體內部或外部其中任一，並該泵浦與所述熱交換單元及水排連接；前述之本體可為一IT、通訊、工業、交通、運輸等之機箱(櫃)，並該本體係為一密閉式的容置空間，合先敘明；透過本發明此結構的設計，當所述熱交換單元吸收發熱元件的熱量時，透過所述工作流體將熱量帶離開該熱交換單元後再藉由該管體組流至設置於本體外部的水排並與本體外部的冷空氣進行熱交換散熱，由於該本體係長期放置於一具有較冷空氣存在的外部環境(空間)下，因此，透過該水排設置在該本體之外部態樣，以令吸收本體內部熱量的工作流體導出至具有冷空氣存在的本體外部環境並進行熱交換作用，如此可大幅改善習知水排設置於本體內部時，於進行熱交換作用時所排出之熱量在本體內部 如此不斷地循環留滯積熱增溫，導致散熱效果不佳的缺失問題，並由於外界環境溫度遠較本體內部的溫度低且不易積熱增溫的情況下，故可令設置於本體外部的水排迅速降溫，進而大幅增加散熱效果及熱交換效率。 A secondary object of the present invention is to provide a modular heat dissipation circulation structure. To achieve the above object, the present invention provides a heat dissipation circulation structure, which includes a body, at least one heat exchange unit, at least one water drain, and at least one pump. The body has an accommodation space for accommodating at least one heating element. A heat exchange unit is disposed in the accommodating space and attached in contact with the heating element. The heat exchange unit is filled with a working fluid. The water drain is disposed outside the body and passes through at least one tube group and the heat. The exchange unit is connected, and the pump is disposed inside or outside the body, and the pump is connected to the heat exchange unit and the water drain; the aforementioned body may be an IT, communication, industry, transportation, and transportation Waiting for the chassis (cabinet), and the system is a closed accommodation space, first described; through the design of this structure of the present invention, when the heat exchange unit absorbs the heat of the heating element, through the work The fluid takes the heat away from the heat exchange unit, and then flows through the tube group to the water drain provided outside the body and performs heat exchange with the cold air outside the body to dissipate heat. In an external environment (space) with the presence of cooler air, the water drain is arranged outside the body so that the working fluid that absorbs the heat inside the body is exported to the external environment of the body with the presence of cold air and The heat exchange effect is performed, which can greatly improve the heat discharged when the conventional water drain is installed inside the body. In this way, the lingering accumulated heat is continuously circulated to increase the temperature, resulting in the lack of poor heat dissipation. Because the external environment temperature is much lower than the temperature inside the body and it is not easy to accumulate heat, it can be installed outside the body. The rapid cooling of the water drain greatly increases the heat dissipation effect and heat exchange efficiency.
此外，該散熱循環結構更具有一載體，該載體對應外掛設置於所述本體上或直接與本體一體建置而成，而所述水排(及散熱單元)係對應設置於該載體上，藉由所述水排(及散熱單元)設置在該載體上，當水排或散熱單元故障或損毀時，僅須直接拆換該櫃門而達到組裝便利性並具有模組化之效果。 In addition, the heat dissipation circulation structure further has a carrier, which is correspondingly externally mounted on the body or directly integrated with the body, and the water drain (and heat dissipation unit) is correspondingly provided on the carrier. The water drain (and the heat dissipation unit) is arranged on the carrier. When the water drain or the heat dissipation unit is faulty or damaged, it is only necessary to directly replace the cabinet door to achieve assembly convenience and have a modular effect.
1‧‧‧本體 1‧‧‧ Ontology
10‧‧‧容置空間 10‧‧‧accommodation space
2‧‧‧發熱元件 2‧‧‧ heating element
3‧‧‧熱交換單元 3‧‧‧ heat exchange unit
31‧‧‧進水口 31‧‧‧ water inlet
32‧‧‧出水口 32‧‧‧outlet
33‧‧‧容水空間 33‧‧‧ Water holding space
4‧‧‧工作流體 4‧‧‧working fluid
5‧‧‧水排 5‧‧‧ water drain
51‧‧‧入水孔 51‧‧‧inlet
52‧‧‧出水孔 52‧‧‧outlet
53‧‧‧儲液空間 53‧‧‧Liquid storage space
6‧‧‧管體組 6‧‧‧Tube body group
61‧‧‧第一管體 61‧‧‧First tube
62‧‧‧第二管體 62‧‧‧Second tube body
7‧‧‧泵浦 7‧‧‧Pump
81‧‧‧散熱單元 81‧‧‧Cooling unit
82‧‧‧供液單元 82‧‧‧ Liquid supply unit
9‧‧‧載體 9‧‧‧ carrier
第1圖係為本發明散熱循環結構之第一實施例之方塊示意圖；第2圖係為本發明散熱循環結構之第一實施例之立體組合圖；第3圖係為本發明散熱循環結構之第一實施例之立體剖視圖；第4圖係為本發明散熱循環結構之第二實施例之立體圖；第5圖係為本發明散熱循環結構之第三實施例之立體組合圖；第6圖係為本發明散熱循環結構之第四實施例之立體圖。 Figure 1 is a block diagram of the first embodiment of the heat dissipation circulation structure of the present invention; Figure 2 is a three-dimensional combined view of the first embodiment of the heat dissipation circulation structure of the present invention; and Figure 3 is a view of the heat dissipation circulation structure of the present invention. A perspective sectional view of the first embodiment; FIG. 4 is a perspective view of the second embodiment of the heat dissipation circulation structure of the present invention; FIG. 5 is a perspective combination view of the third embodiment of the heat dissipation circulation structure of the present invention; This is a perspective view of a fourth embodiment of the heat dissipation circulation structure of the present invention.
本發明之上述目的及其結構與功能上的特性，將依據所附圖式之較佳實施例予以說明。 The above-mentioned object of the present invention and its structural and functional characteristics will be described based on the preferred embodiments of the drawings.
請參閱第1、2、3圖，係為本發明散熱循環結構之第一實施例之方塊示意圖及立體組合圖及立體剖視圖，如圖所示，一種散熱循環結構，係包括一本體1、至少一熱交換單元3、至少一水排5及至少一泵浦7，該本體1具有一密閉式的容置空間10容置至少一發熱元件2，於本實施例中，該本體1係以一IT、通訊、工業、交通、運輸等之機箱或機櫃(如伺服器機櫃、電腦機箱(如第4圖所示)等)做說明，但並不引以為限，即凡是具有一密閉式容置空間 10的本體1並其內部容設有產生熱源的發熱元件2(如中央處理器(CPU)、微處理器或晶片或單晶片或其他因電力驅動而產生熱源的單元或裝置等)之結構態樣，皆包含於本發明之範圍內，合先敘明；所述熱交換單元3於本實施例係為一水冷頭，該熱交換單元3設置在該容置空間10內並與所述發熱元件2相對應接觸貼附設置以吸收發熱元件2的熱量，且該熱交換單元3具有一進水口31及一出水口32及一容水空間33，該容水空間33與所述進、出水口31、32相連通，並該容水空間33內填充有一工作流體4，以令該發熱元件2產生的熱量被該熱交換單元3吸收後並透過其內部的工作流體4藉由該出水口32將熱量帶離該熱交換單元3；所述水排5係設置於本體1外部，該水排5具有一入水孔51及一出水孔52及一儲液空間53與所述入、出水孔51、52相連通，該水排5與該熱交換單元3係透過至少一管體組6相連接，該管體組6具有一第一管體61及一第二管體62，該第一管體61兩端分別連接所述熱交換單元3的出水口32及水排5的入水孔51，該第二管體62兩端分別連接所述熱交換單元3的進水口31及水排5的出水孔52，特別須說明的是，其中所述水排5的結構可以是一般傳統透過焊接將各部件相互密封接合的水排5結構，也可以是由複數薄片狀的片體堆疊而成的超薄型水排5結構；本實施例中，所述泵浦7係設置於該本體1內部，但並不引以為限，於實際實施時，可依照不同的需求進行調配設置，該泵浦7也可以設置在該本體1外部(圖中未示)，並不影響本發明所達成之功效，所述泵浦7係藉由與所述第一管體61相串接後與該熱交換單元3及水排5形成相連接的結構，進以驅動由該熱交換單元3流出之工作流體4進入該水排5內；於本散熱循環結構中，更具有一供液單元82，該供液單元82係設置於該本體1內部，但並不引以為限，實際實施時，可依照不同的需求進行調配設 置，該供液單元82同前述之泵浦7，也可以設置在該本體1外部(圖中未示)，以可令使用者由所述本體1外部補充所述工作流體4，進以避免於進行散熱循環時該工作流體4的蒸發與散失，並增加該泵浦7的穩定性及壽命，達到大幅增加散熱效能；此外，還可防止所述本體1在進行散熱循環時所產生的水泡，改善因水泡而產生噪音或降低散熱效能等問題；透過本發明此結構的設計，首先所述發熱元件2產生的熱量會被熱交換單元3所吸收，並透過所述容水空間33內的工作流體4經由該出水口32將熱量帶離開該熱交換單元3並流入該第一管體61內，接著經過所述泵浦7驅動該工作流體4進入該入水孔51再流入該水排5的儲液空間53，由於該本體1係長期放置於一具有冷空氣(冷空氣係由冷氣空調或風扇所產生的)的外部環境(空間)下，因此，將所述工作流體4所吸收的熱量透過熱交換單元3經管體組6再藉由本體1外部之水排5與外部環境的冷空氣進行熱交換作用，由於該本體1內部的溫度與本體1外部(即，外部環境)的溫度差異甚大，故將吸收熱量後的工作流體4導出至該本體1外部並藉由水排5與外部環境的冷空氣做熱交換可得以大幅降低工作流體4之溫度，最後降溫後的工作液體再透過水排5的出水孔52經由該第二管體62流至該熱交換單元3的進水口31後流回該容水空間33完成散熱之目的，從而達到一熱交換循環，因此，本案之技術係藉由該水排5設置在本體1的外部，透過外部環境的氣體溫度遠低於本體1內部氣體溫度的特性，將該水排5設置在本體1外部進行熱交換作用時可迅速地達到降溫效果，使本體1內部所容置的各發熱元件2所產生之熱量得以被有效散熱，進而確保各發熱元件2維持於正常之工作溫度，故具有絕佳之散熱效果及較高的熱交換效率，換言之，本發明可大幅改善習知水排5設置在本體1內部時，於進行熱交換作用時所排出之熱量仍留滯在該本體1內部，導致散熱效果不佳且無法進行熱交換作用的缺失。 Please refer to Figs. 1, 2, and 3, which are schematic block diagrams, three-dimensional assembly diagrams, and three-dimensional sectional views of the first embodiment of the heat dissipation circulation structure of the present invention. As shown in the figure, a heat dissipation circulation structure includes a body 1, at least A heat exchange unit 3, at least one water row 5 and at least one pump 7. The body 1 has a closed accommodation space 10 for accommodating at least one heating element 2. In this embodiment, the body 1 is IT, communications, industry, transportation, transportation, etc. chassis or cabinets (such as server cabinets, computer cabinets (as shown in Figure 4), etc.) for illustration, but not limited to, that is, all have a closed capacity Space The structure of the body 1 of 10 and the heat-generating component 2 (such as a central processing unit (CPU), a microprocessor or a chip or a single chip or other units or devices that generate a heat source due to electric power) are contained in the interior of the body 1 The heat exchange unit 3 is a water-cooled head in this embodiment. The heat exchange unit 3 is disposed in the accommodation space 10 and generates heat with the heat exchange unit 3. The element 2 is correspondingly attached and attached to absorb the heat of the heating element 2, and the heat exchange unit 3 has a water inlet 31, a water outlet 32, and a water holding space 33. The water holding space 33 is connected to the inlet and outlet. The water outlets 31 and 32 communicate with each other, and a working fluid 4 is filled in the water holding space 33 so that the heat generated by the heating element 2 is absorbed by the heat exchange unit 3 and passes through the working fluid 4 inside the water outlet through the water outlet. 32 takes the heat away from the heat exchange unit 3; the water drain 5 is arranged outside the body 1, the water drain 5 has a water inlet 51 and a water outlet 52 and a liquid storage space 53 and the water inlet and outlet 51, 52 are connected, the water row 5 and the heat exchange unit 3 pass through at least one pipe Group 6 is connected to each other. The pipe group 6 has a first pipe body 61 and a second pipe body 62. The two ends of the first pipe body 61 are respectively connected to the water outlet 32 and the water drain 5 of the heat exchange unit 3. Water inlet 51, two ends of the second pipe body 62 are respectively connected to the water inlet 31 of the heat exchange unit 3 and the water outlet 52 of the water row 5. In particular, it should be noted that the structure of the water row 5 may be general The conventional water drain 5 structure in which the components are sealed and joined to each other by welding can also be an ultra-thin water drain 5 structure formed by stacking a plurality of sheet-like sheets. In this embodiment, the pump 7 is provided in The body 1 is internal, but not limited to it. In actual implementation, it can be adjusted and set according to different needs. The pump 7 can also be installed outside the body 1 (not shown), which does not affect this. According to the effect achieved by the invention, the pump 7 is connected to the heat exchange unit 3 and the water row 5 after being connected in series with the first pipe body 61 to drive the heat exchange unit. 3 The working fluid 4 flowing out enters the water row 5. In the heat dissipation circulation structure, there is a liquid supply unit 82, which The liquid unit 82 is arranged inside the body 1, but it is not limited to it. In actual implementation, it can be deployed according to different needs. The liquid supply unit 82 is the same as the pump 7 described above, and may also be provided outside the body 1 (not shown) so that the user can supplement the working fluid 4 from the outside of the body 1 to avoid The evaporation and loss of the working fluid 4 during the heat dissipation cycle, and the stability and life of the pump 7 are increased, so that the heat dissipation efficiency is greatly increased; in addition, the water bubble generated during the heat dissipation cycle of the body 1 can be prevented To improve the problems such as noise caused by water bubbles or to reduce heat dissipation efficiency; through the design of the structure of the present invention, first, the heat generated by the heating element 2 will be absorbed by the heat exchange unit 3 and pass through the water holding space 33 The working fluid 4 takes the heat out of the heat exchange unit 3 through the water outlet 32 and flows into the first pipe body 61, and then drives the working fluid 4 into the water inlet 51 and then flows into the water drain 5 through the pump 7. Because the main body 1 is placed in an external environment (space) with cold air (the cold air is generated by an air-conditioning or a fan) for a long time, the body 1 absorbs the working fluid 4 Heat through heat transfer The replacement unit 3 performs heat exchange with the cold air of the external environment through the water drain 5 on the outside of the body 1 through the pipe body group 6, because the temperature inside the body 1 is very different from the temperature outside the body 1 (that is, the external environment). Therefore, the heat-absorbing working fluid 4 is discharged to the outside of the main body 1 and the heat exchange between the water exhaust 5 and the cold air in the external environment can greatly reduce the temperature of the working fluid 4. Finally, the cooled working fluid passes through the water exhaust. The water outlet hole 5 of 5 flows to the water inlet 31 of the heat exchange unit 3 through the second pipe body 62, and then flows back to the water holding space 33 to complete the purpose of heat dissipation, thereby achieving a heat exchange cycle. Therefore, the technology in this case is borrowed The water drain 5 is arranged outside the main body 1 and the temperature of the gas passing through the external environment is far lower than the temperature of the internal gas of the main body 1. When the water drain 5 is set outside the main body 1 for heat exchange, the cooling effect can be quickly achieved. , So that the heat generated by each heating element 2 contained in the body 1 can be effectively dissipated, thereby ensuring that each heating element 2 is maintained at a normal operating temperature, so it has excellent heat dissipation effect and higher heat In terms of efficiency, in other words, the present invention can greatly improve that when the conventional water drain 5 is disposed inside the body 1, the heat discharged during the heat exchange action remains inside the body 1, resulting in poor heat dissipation effect and inability to perform heat Lack of exchange.
請參閱第5圖，係為本發明散熱循環結構第三實施例之立體組合圖，所述之散熱循環結構部份元件及元件間之相對應之關係與前述之散熱循環結構相同，故在此不再贅述，惟本散熱循環結構與前述最主要之差異為，所述水排5更裝設一散熱單元81，亦所述散熱單元81與該水排5相對接設置，於本實施例中，該散熱單元81係為一風扇，但並不引以為限，實際時實施，也可以是一鼓風機等具有強制散熱作用的單元，該散熱單元81係抽吸該水排5之熱量並將熱量排出至外部周圍環境與其產生熱交換作用，形成對水排5強制散熱作用，從而有效地將本體1內部的熱量轉移到外部周圍環境去，具有更加之散熱效果及較高的熱交換效率。 Please refer to FIG. 5, which is a three-dimensional assembly diagram of the third embodiment of the heat dissipation circulation structure of the present invention. The components of the heat dissipation circulation structure and the corresponding relationships between the components are the same as the aforementioned heat dissipation circulation structure. No more details, but the main difference between the heat dissipation circulation structure and the foregoing is that the water row 5 is further equipped with a heat dissipation unit 81, and the heat dissipation unit 81 is arranged opposite to the water row 5, and in this embodiment The heat-dissipating unit 81 is a fan, but it is not limited to this. In practice, it can also be a unit with a forced cooling effect such as a blower. The heat-dissipating unit 81 sucks the heat from the water row 5 and The heat is discharged to the external surrounding environment and generates a heat exchange effect to form a forced heat dissipation effect on the water drain 5, thereby effectively transferring the heat inside the body 1 to the external surrounding environment, which has a more heat dissipation effect and a higher heat exchange efficiency.
請參閱第6圖，係為本發明散熱循環結構第四實施例之立體圖，所述之散熱循環結構部份元件及元件間之相對應之關係與前述之散熱循環結構相同，故在此不再贅述，惟本散熱循環結構與前述最主要之差異為，該散熱循環結構更具有一載體9，該載體9對應外掛設置於所述本體1上或直接與本體1一體建置而成，而所述水排5(及散熱單元81)係對應設置於該載體9上，藉由所述水排5及散熱單元81設置於該載體9上，除了可保有前述較佳的散熱作用及熱交換效率外，當水排5或散熱單元81故障或損毀時，僅須直接拆換該載體9而達到組裝便利性並具有模組化之效果。以上所述，本發明相較於習知具有下列優點：1.大幅增加散熱效果；2.大幅提升熱交換效率；3.提升組裝便利性；4.具有模組化的效果。 Please refer to FIG. 6, which is a perspective view of a fourth embodiment of the heat dissipation circulation structure of the present invention. The components of the heat dissipation circulation structure and the corresponding relationships between the components are the same as the aforementioned heat dissipation circulation structure, so they are not described here. To repeat, the main difference between the heat dissipation circulation structure and the foregoing is that the heat dissipation circulation structure further has a carrier 9, which is correspondingly externally mounted on the body 1 or directly integrated with the body 1, and the The water row 5 (and the heat dissipation unit 81) is correspondingly disposed on the carrier 9, and the water row 5 and the heat dissipation unit 81 are disposed on the carrier 9, in addition to maintaining the aforementioned better heat dissipation effect and heat exchange efficiency In addition, when the water drain 5 or the heat dissipation unit 81 is faulty or damaged, it is only necessary to directly replace the carrier 9 to achieve assembly convenience and have a modular effect. As described above, the present invention has the following advantages compared with the prior art: 1. The heat dissipation effect is greatly increased; 2. The heat exchange efficiency is greatly improved; 3. The assembly convenience is improved; 4. The modularization effect is achieved.
以上已將本發明做一詳細說明，惟以上所述者，僅為本發明之一較佳 實施例而已，當不能限定本發明實施之範圍。即凡依本發明申請範圍所作之均等變化與修飾等，皆應仍屬本發明之專利涵蓋範圍。 The present invention has been described in detail above, but the above is only a preferred one of the present invention. The examples are only used to limit the scope of the present invention. That is, all equivalent changes and modifications made in accordance with the scope of the application of the present invention shall still fall within the scope of patent of the present invention.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107119140A TWI661170B (en) | 2018-06-04 | 2018-06-04 | A cycle structure for dissipating heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107119140A TWI661170B (en) | 2018-06-04 | 2018-06-04 | A cycle structure for dissipating heat |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI661170B true TWI661170B (en) | 2019-06-01 |
| TW202004113A TW202004113A (en) | 2020-01-16 |
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| TW107119140A TWI661170B (en) | 2018-06-04 | 2018-06-04 | A cycle structure for dissipating heat |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM280094U (en) * | 2005-05-24 | 2005-11-01 | Thermaltake Technology Co Ltd | Host computer unit case equipped with front liquid-cooling cooling device |
| TWM567350U (en) * | 2018-06-04 | 2018-09-21 | 奇鋐科技股份有限公司 | Heat dissipation and circulation construction |
-
2018
- 2018-06-04 TW TW107119140A patent/TWI661170B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM280094U (en) * | 2005-05-24 | 2005-11-01 | Thermaltake Technology Co Ltd | Host computer unit case equipped with front liquid-cooling cooling device |
| TWM567350U (en) * | 2018-06-04 | 2018-09-21 | 奇鋐科技股份有限公司 | Heat dissipation and circulation construction |
Also Published As
| Publication number | Publication date |
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| TW202004113A (en) | 2020-01-16 |
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