M272237 八、新型說明： 【新型所屬之技術領域】 本創作係關於一封裝系統(Packaged system)，該封裝系統用以 封裝一發光裝置，並可進一步整合入一照明設備。特別地，本創 作係關於一封裝系統，該封裝系統用以封裝高功率發光二極體 (Light emitting diode，LED)，並提供高效率之散熱裝置，搭配整^ 的電力裝置與鏡面反射裝置，進一步使用於各式照明設備，例二 手電筒(Flashlight)或泛光燈(Floodlight)等投射型燈具。 【先前技術】 目5已有^數家製造商投入製造不同外型之高亮度發光二極體 套件，這些高亮度LED套件相較於傳統LED燈泡的差異之處在於 其使用較大的發光驅動晶片（Emitter chip”但也相應地造成較高的 電力需求。一般來說，這些套件原本是設計來作為傳統LED燈泡 的替代品。但由於它們的外型、尺寸以及電力需求，led製造商 已遭遇了未曾預期之製造上的困難。此類型的高亮度led中的一 個例子為 Luxeonm Emitter Assembly LED (Lux_ 為美商 l^imileds Lighting，LLC·的註冊商標）。雖然該套件能夠產生遠高於 2 LED燈泡亮度之輸出，但它也產生大量的熱量。若未能有效 散熱，將可能對發光驅動晶片造成損害。 通常為了克服LED套件的發熱問題，LED製造商會在lED ‘:套件内部併人-散熱通道。例如，Luxe〇nLED係併入一金屬散数 板，該金屬散熱板設置於LED套件之背部以傳導熱量。實 用、 ^中，更理想的作法是使該金屬散熱板進—步接觸—散熱表面 d^slpatlon surface)以有效冷卻LED套件。於習知技術中，已有將 ^ 進一步併入其他組件的嘗試。例如，使用L_n 勺表k商i試將其併入一電路板，該電路板 二、、且件此夠有效散熱，但其體積通常過於龐大以致於難以併入小 M272237 型的A?、明ά又備，如手電筒或泛光燈等投射型燈呈。同時，由於設 置導熱板之該電路板也包含許多其他散熱材料(Heat shk matenal) ’因此欲將導熱板有效地焊接於該電路板，而又 量的熱是非常困難的。 因此，提供一種能夠掛載咼壳度led同時包含良好散熱裝置 的組件確有其必要性。此外，此種組件也應具備能夠進一步'^入 進一照明設備的能力。 口 【新型内容】M272237 8. Description of the new type: [Technical field to which the new type belongs] This creation is about a packaged system, which is used to package a light-emitting device and can be further integrated into a lighting device. In particular, this creation is about a packaging system that is used to package high-power light emitting diodes (LEDs), and to provide high-efficiency heat sinks, with complete power devices and specular reflection devices. It is further used in various types of lighting equipment, such as second-hand flashlights or floodlights. [Previous technology] Head 5 has several manufacturers who have invested in the manufacture of high-brightness light-emitting diode kits with different shapes. The difference between these high-brightness LED kits and traditional LED bulbs is that they use larger light-emitting drivers. Chips (Emitter chip) but correspondingly cause higher power requirements. Generally speaking, these kits were originally designed as a replacement for traditional LED bulbs. However, due to their appearance, size and power requirements, led manufacturers have Encountered unexpected manufacturing difficulties. An example of this type of high-brightness LED is Luxeonm Emitter Assembly LED (Lux_ is a registered trademark of American ^ imileds Lighting, LLC.) Although this kit can produce much higher than 2 The brightness output of LED bulbs, but it also generates a lot of heat. Failure to effectively dissipate heat may cause damage to the light-emitting driver chip. In order to overcome the heating problem of LED kits, LED manufacturers usually incorporate LEDs inside the LED package: -Heat dissipation channel. For example, Luxeon LEDs are incorporated into a metal diffuser plate, which is arranged on the back of the LED kit to conduct heat. Practically, the more ideal approach is to make the metal heat sink further contact with the heat dissipation surface (d ^ slpatlon surface) to effectively cool the LED kit. In the conventional technology, there have been attempts to further integrate ^ into other components. For example, try to incorporate it into a circuit board using the L_n table, which is efficient enough to dissipate heat, but its volume is usually too large to be incorporated into a small M272237 A ?, It is also prepared, such as flashlights or floodlights, etc. At the same time, because the circuit board is provided with a lot of other heat dissipation materials (Heat shk matenal), so it is necessary to effectively solder the heat conduction board to the circuit Board, and the amount of heat is very difficult. Therefore, it is really necessary to provide a component that can mount a shell-shaped LED and contain a good heat dissipation device. In addition, such a component should also have the ability to further The ability of lighting equipment. [New content]
本創作之一目的在於提供一種具有高散熱效率之高功率發光 二極體照明設備，以防止高功率發光二極體因高溫而降低其發光 本創作之另-目的在於提供-種封㈣統，該封裝系統用以 封裝高功率發光二極體，並提供高效率之散熱裝置。該封裝系統 適a女衣於座體内，再格配整合的電力裝置斑光學 :即可講成各式照明設備。換言之，該封裝系統具功 根據本創作之一較佳具體例之照明設備，該，昭明設備包含一 座體(Housing)、一反射面鏡(Reflect〇r)、一封裝One of the purposes of this creation is to provide a high-power light-emitting diode lighting device with high heat dissipation efficiency to prevent high-power light-emitting diodes from reducing their light emission due to high temperatures. Another purpose of this creation is to provide a kind of sealing system, The packaging system is used to package a high-power light-emitting diode and provide a high-efficiency heat sink. The packaging system is suitable for women's clothing in the seat, and then equipped with integrated power device spot optics: it can be described as a variety of lighting equipment. In other words, the packaging system has a lighting device according to a preferred embodiment of the present invention. The Zhaoming device includes a housing, a reflecting mirror, and a package.
Sys_以及-電力裝置(Power su_。該座體上定義有(一頭端' 該反射面鏡設置於該座體内且近該頭端處，該反射面鏡並且且有 一孔洞(Aperture)。該封裝系統係設置於該座體内，並包含一g體 (Casmg)、-導熱裝置(Heat-conducting device)、至少一散熱鰭片 (Heat-dissipating fm)以及一發光裝置(Light_emi麻g apparatosf ^ 導熱裝置係安置於該殼體内，該導熱裝置之一端具有一平坦部。 該至少一散熱鰭片設置於該殼體内，且位於該導埶裝置之。 該發光裝置係平整地接合於該導滅置之該平坦部，並通過該孔 洞延伸至該反射面鏡之-光學中心處，該發綠置以—點光源形 式發射一光線，其中於該發光裝置運作過程中所產生之熱係由該 M272237 導熱裝置自該平坦部導引 散熱韓技熱。該電力裝置係與該發光裝該至少一 t該ί光裝置發㈣雜所S之電力。f力#用以提 體，也可以設置於該座體内。 衣置了外接於該座 照明熱獲得大幅提升。即使 熱量，亦可經由ίί心;光過程中所產生的大量 發光二極體之發光。仃有效散熱，從而維持 統，該封裝系明if乍^二隨插即用的封裝系 裝與汰換此封裳系^。' &又備’使用者並且能夠簡易地安 所附圖 式得點與精神可以藉由以下的創作詳述及 【實施方式】 本創作之目的在於提供一封裝系 發光裝置，並可進一步整人入一日4日<你κίΤ衣糸統用以封裹一 備搭=的電：置與置並= 將：二:數 請爹閱圖- A。圖- a為根據本創作之第 該照明設備包含-座體1G: 一 i射面 !兄11、封衣糸、、先I2以及一電力裝置Μ。該 1110内且近該頭端處’該反射 並ί含〆殼體⑽、—W裝統：係設置於該座體10内’ 發ϋ置126。 至少一散熱縛片124以及一 如圖一 A所示，該導熱裝詈1 122 。於一具體實施例中，該導熱 M272237 裝置122係一熱導管(Heatpipe)或熱導柱(Heatc〇][umn)，而該平坦 部係f此類熱導體製作過程中額外加工處理。該至少一散熱鰭片 lj4設置於該殼體uo内，且位於該導熱裝置122之周圍，用以提 间散熱效率。該發光裝置126係平整地接合於該導熱裝置m2之 該平坦部，並通過該孔洞延伸至該反射面鏡n之一光學中心處， 该發光裝置126以一點光源形式發射一光線，其中於該發光裝置 126運作過程中所產生之熱係由該導熱裝置122自該平坦部導引至 該至少一散熱鰭片124,進而由該至少一散熱鰭片124散逸。在座 體ίο内位於該導熱裝置122之另一端設有一電路板(Circuit b〇ard)16，該電路板16用以電連接該發光裝置126以及該電力裝 置Μ，該電路板16並用以控制該發光裝置126發射該光線。該^ 力裝置14係設置於該座體10内，並透過一電線(圖中未示)盘該電 路板16形成電連接，用以提供該發光裝置126發出該光線^斤需之 電力。於一具體實施例中，該反射鏡面η反射該光線，進而將該 光線射出該座體10。該電力裝置14係包含至少一電池。 " 圖Β為根據本創作之苐一較佳具體實施例之照明設備1的 刳面視圖。如圖一Β所示，在圖一Β中描述與圖一a具有相同號 碼標記之單元，同樣執行與圖一 A中相對應單元所具有之功能广 於此不再贅述。於此較佳具體實施例中，在該座體1〇之上緣^置 有一把手(Handle)100，而該該座體1〇之下方係配置較大内部& 以設置該電力裝置14。為提供照明設備丨較高之電力輸入ς: 力裝置14可以包含較多電池或其它充電裝置。 Λ电 請參閱圖二Α。圖二Α為根據本創作之第三較佳具體杏 之照明設備1的外觀視圖。圖二Β為圖二Α所示之照^月設& f延 P-P線之剖面視圖。圖二C為圖二B所示之照明設備1之 體實施例。如圖二B所示，在圖二B中描述與圖一八具 ^ 碼標記之單元，同樣執行與圖一 A中相對應單元所具^之:〜 於此不再贅述。如圖二B與圖二C所示，該電力裝^可 座體10，也可以設置於該座體10内。於一具體實施例中，节電g M272237 裝置14可為一交流轉直流之電源供應器。 1^三與_為根據本創作之_較佳具體實施例之該導熱裝置 I22與該至^-散熱鰭片m的立體視圖與側視圖。根據本創作之 一較佳具體貫施例之導轨裝置^ ^ ^ . 彳，係抓用一瘵氣循環式散熱方 式，其工作原理揭不如下。該導熱裝置122係一中 質為銅’在該中空腔體122内容置— 體、才 内部係呈真空狀態，並設置有一革士姓㈤士 + ^ 199 ^ \ /毛、、、田、、、口構(圖中未不）。當該中空腔 作流體吸收熱量並蒸發為氣體，該氣體 Ι^ΐ^ΐ中^腔體122之散熱鰭片124，該散 Λ、、‘，、省片進一步將熱量散逸至該封裝系統12外。該氣熊之工作 越經散熱凝結為液態，再由毛細結構吸回中空賴之^ 1而24 。如上㈣，根縣創作之搭配散熱鰭片 勺Vt衣置122係為一具有高散熱效率之導熱裝置丨22。 ’目五為根據本創作之—較佳具體實施例 〜=¾光衣置126的俯視圖。該發光裝置126包含一基材 二Stmte)1260、至少一半導體發光元件（Semic〇nduct〇r hght-emittmg deViCe)1262以及兩電極1264，該至少一半導體發光 :件:262以及該兩電極1264係分別設置於該基材126〇上，該至 二私體發光凡件1262中之每一半導體發光元件1262係用以 电射該光線，且該兩電極1264分別與該至少一半導體發光元件 中之每-半導體發光元件1262相連接。於一具體實施例中， =材126Q可以由—㈣料或—金屬材料所製成，而該至少一半 j發光元件1262中之每-半導體發光元件1262係一發光二極 ΐ或一雷射二極體。特別地，該等發光二極體係為高功率、高亮 二之务光：極體。需注意的是，根據本創作之發光裝置126係將 少—半導體發光元件1262封裝於單—封裝體内，故該發光裝 6乃一近似點光源之發光裝置126。如圖六所示，該發光裝置 1^6 平整地接合於於該中空腔體122之該平坦部上。於實際應用 ’该發光裝置124可以利用打線(Wire bonding)或覆晶晶片（Filp 9 M272237 ihi=S該中空腔體122之該平坦部上。如圖七所示，該至少 nUr片124中之每一散熱鰭片124上皆具有至少一孔、、同 ’使得至少一電線可穿過該等 _ 16以及該發光裝置126。 电逆接心路板 w丨^閱圖八至圖十，該散熱鰭片124具有多種不同之具體實 =0 " 2根據本創作之—較佳具體實施例之該封裝系統12的 所示’該散熱續片124可以實施為一圓盤狀，並 蛊；月:⑯122的周圍。如圖八所示，該散熱鰭片124也可 A It- 甘^二匕置5玄双體120為原則。散熱鰭片124内可開設導氣 孔’其材貝則可採_、紹、馳合金或其他類似材料。- ，圖十—所示’為進—步提高散熱效率，可於該封 於該等散熱轉片124周圍處開設多個孔洞，以 、替=i、,二政熱鰭片124丨之熱所引發的熱空氣散逸之通 二進，增加對於該發光裝置126運作_ 效率。為達到相同目的，如圖十二Α至圖十二c所示，該座^ 上也開設有乡個孔洞搬。為使熱錢散逸之通道暢 :二上之該等孔洞中的每—孔洞相對於該座體！。上之 土02且^至照明設備1的外部。圖十二D為根據本創作之 佳具體貫把例之照明設備i的外觀視圖與局部放大圖，如圖十二〇 所不’於接近該座體10上之該等孔洞1〇2處設置有一導氣板1〇4, 致使熱空氣沿著該導氣板104之表面流動。 如圖十三A與計三B所示，為進—步提高散熱效率，可於 該座體ίο内位於該電路板16之一端設置一風扇18，該風扇18係 與該電路板16連接，喊該電路板枷—控網路(Q)n姻㈤ clrcmt)控制該風扇之開關。該控制電路(圖中未示)係由該電路板π 所操作’用以偵測該發光裝置126周圍之一溫度，當該倍測到之 溫度超過一預定值時，該控制電路即啟動該風扇18以進—步冷卻 10 M272237 該發光裝置120。需注意的是，圖十三A與圖十三B僅示出根據 本創作之第一與第二較佳具體實施例。 請芩閱圖十四A以及圖十四b，圖十四a為根據本創作之第 四較佳具體實施例之照明設備丨的外觀視圖。圖十四B為圖十四 A中所示之照明設備1之***視圖。如圖十四a所示，照明設備 1之座體10包含一套殼(Shell)106以及一嵌合構件(Embedding m⑽ber)108。該封裝系統12係以其之一端設置於座體1〇之套殼 106内。嵌合構件1〇8係套設於套殼1〇6上，且其上具有兩彈性^ (Resilient body)1080 ’用以組裝燈具組1。舉例來說，當使用者欲 將:k具組1組裝於一牆壁上或一天花板上之一孔洞時，使用者可 先將兩彈性體1080分別彎曲成與封裝系統12之殼體12〇平行， 再將,¾明a又備1嵌進牆壁上或天花板上之孔洞。當照明設備丨後 進孔洞時，兩彈性體1〇8〇會因彈力而回復原來狀態，使得照明設 備1可以與孔洞互相嵌合。 本創作提供了一具高散熱效率之封裝系統，該封裝系統用以 高功率發光二極體，並利用導熱裝置與散熱鰭片有效排除高 光一極體所產生之大量熱量。該封裝系統搭配整合的電力 牧與叙面反射裝置，進一步應用於各式照明設備。 藉由=上較佳具體實施例之詳述，係希望能更加清楚描述本 H乍之特，5精神，而並非以上述所揭露的較佳具體實施例來對 =作之範疇加以限制。相反地，其目的是希望能涵蓋各種改變 /、相等性的安排於本創作所欲申請之專利範圍的範疇内。 【圖式簡單說明】 立|| A圖A為根據本創作之第一較佳具體實施例之照明設備1的 σ J由視圖。 立t二圖B為根據本創作之第二較佳具體實施例之照明設備1的 面視圖。 11 M272237 圖一 A為根據本創作之第 體實施例之照明設備！的 外觀視圖。 圖二B為圖二A所示之照明設備丨延^?線之剖面視圖。 圖一 C為圖二B所示之照明設備丨之另一具體實施例。 圖二為根據本創作之一具體實施例之該導熱裝置122與該至 少一散熱鰭片124的立體視圖。、 小圖四為根據本創作之一具體實施例之該導熱裝置122與該至 ^一散熱鰭片124的侧視圖。 圖五為根據本創作之_較佳具體實施例之該發光裝置126的 術硯圖。 井狀圖六所示為根據本創作之一具體實施例之發光裝置126，該發 衣置124係平整地接合於該中空腔體122之該平坦部上。 鼓圖七揭不根據本創作之散熱鰭片124之一具體實施例，該散 “〜、省片124上係開設至少一孔洞使一電線通過。 埶#圖八揭示根據本創作之散熱鰭片124之一具體實施例，該散 …、、片124上係實施為一圓盤狀。 1 執&圖九揭不根據本創作之散熱鰭片124之一具體實施例，該散 …、“、、曰片124上係實施為一不規則狀。 圖十揭示根據本創作之散熱鰭片124 該散 4轉片124上係實施為一放射狀。 ϋ十-係揭示為提高根據本創作之封褒系統12的散熱效率， 在该殼體120上開設多個孔洞。 日召日5圖十一 Α係揭不為提高根據本創作之第一較佳具體實施例之 …、月設備1的散熱效率，可在該座體1〇上開設多個孔洞102。 圖十一 B係揭示為提南根據本創作之第二較佳具體實施例之 12 M272237 照明設備1的散熱效率，可在該座體10上開設多個孔洞102。 圖十二C係揭示為提高根據本創作之第三較佳具體實施例之 照明設備1的散熱效率，可在該座體10上開設多個孔洞102。 圖十二D為根據本創作之第二較佳具體實施例之照明設備1 的外觀視圖與局部放大圖，該座體1〇上開設多個孔洞丨〇2，並於 接近該等孔洞102處設置有一導氣板1〇4。 圖十三A係揭示為提高根據本創作之第一較佳具體實施例之 照明設備1的散熱效率，可在該座體10内設置一風扇。 > 圖十二B係揭示為提高根據本創作之第二較佳具體實施例之 照明設備1的散紐率，可在該賴1Q内設置一風扇。 外觀3四A根據本創作之第四較佳具體實施例之照明設備1的 圖十四β為圖十四A中所示之照明設備1之***視圖。. 【主要元件符號說明】 1 :照明設備 10 :座體 100 :把手 102 .子匕洞 104 :導氣板 106 ··套殼 108 :嵌合構件 1080 ··彈性體 11 :反射鏡面 12 :封裝系統 120 :殼體 122 :導熱裝置 124 :散熱魚耆片 126 :發光裝置 1260 :基材 1262 ·半導體發光元件 14 :電力裝置 16 :電路板 13 M272237 18 :風扇Sys_ and -Power device (Power su_. The base body defines (a head end ') the reflecting mirror is disposed in the base body near the head end, the reflecting mirror has an aperture (Aperture). The The packaging system is disposed in the body, and includes a g body (Casmg), a heat-conducting device, at least one heat-dissipating fm, and a light-emitting device (Light_emi 麻 apparatosf ^ The heat-conducting device is disposed in the housing, and one end of the heat-conducting device has a flat portion. The at least one heat-dissipating fin is disposed in the housing and is located in the guide device. The light-emitting device is flatly connected to the housing. The flat portion is dissipated and extends through the hole to the -optical center of the reflecting mirror. The green light emitting device emits a light in the form of a point light source, and the heat generated during the operation of the light-emitting device is The M272237 heat-conducting device guides and dissipates Korean technical heat from the flat portion. The electric device is connected with the light emitting device and the at least one light emitting device is mixed with electricity. The force # is used to lift the body, or it can be Set inside the seat. The lighting heat connected to this seat has been greatly improved. Even the heat can be passed through the heart; a large number of light-emitting diodes generated in the light process emit light. 仃 Effective heat dissipation to maintain uniformity. The plug-and-play packaging system installs and replaces this seal system ^. "&Amp; also prepared" users and can easily install the points and spirit of the drawings can be detailed by the following creative and [implementation] The purpose of this creation is to provide a package-based light-emitting device, which can be further integrated into the 4th day of the day < your κίΤ clothing system is used to encapsulate a ready-to-wear = electricity: put and put together = will: two: number Please read Figure-A. Figure-a is the first lighting device according to this creation. The base contains 1G: an i-radiating surface! Brother 11, Fengyi, I2, and an electrical device M. The 1110 and Near the head end, the 'reflection and shell-containing housing' is mounted on the base body 10 ', and at least one heat sink 124 and one as shown in FIG. 1A, The heat conducting device 1 122. In a specific embodiment, the heat conducting M272237 device 122 is a heat pipe or a heat conducting post (Heatc〇] [umn), and the flat part is additionally processed during the manufacturing process of such thermal conductors. The at least one heat dissipation fin lj4 is disposed in the housing uo and is located around the heat conducting device 122, and In order to improve the heat dissipation efficiency, the light-emitting device 126 is flatly joined to the flat portion of the heat-conducting device m2 and extends through the hole to an optical center of the reflecting mirror n. The light-emitting device 126 emits in the form of a point light source A light beam, in which the heat generated during the operation of the light-emitting device 126 is guided by the heat-conducting device 122 from the flat portion to the at least one heat-dissipating fin 124, and is then dissipated by the at least one heat-dissipating fin 124. A circuit board 16 is disposed on the other end of the heat conducting device 122 in the seat body ο. The circuit board 16 is used to electrically connect the light-emitting device 126 and the power device M. The circuit board 16 is used to control the circuit board 16 The light emitting device 126 emits the light. The power device 14 is disposed in the base body 10 and is electrically connected to the circuit board 16 through a wire (not shown) to provide the power required by the light emitting device 126 to emit the light. In a specific embodiment, the reflecting mirror surface n reflects the light, and then the light exits the base 10. The power device 14 includes at least one battery. " Figure B is a front view of the lighting device 1 according to a preferred embodiment of the present invention. As shown in FIG. 1B, in FIG. 1B, the unit having the same code mark as that in FIG. 1a is described, and the functions performed by the corresponding unit in FIG. 1A are also widely described here. In this preferred embodiment, a handle 100 is disposed on the upper edge of the base body 10, and a large interior & is disposed below the base body 10 to set the power device 14. To provide higher power input for lighting equipment: The power device 14 may include more batteries or other charging devices. Λ 电 Please refer to Figure 2A. Fig. 2A is an external view of a lighting device 1 according to a third preferred embodiment of the present invention. Fig. 2B is a cross-sectional view taken along the line P-P of the photo-month set & f shown in Fig. 2A. Fig. 2C shows an embodiment of the lighting device 1 shown in Fig. 2B. As shown in FIG. 2B, the unit marked with the ^ code in FIG. 18 is described in FIG. 2B, and the same as that of the corresponding unit in FIG. 1A is also executed: ~ will not be repeated here. As shown in FIG. 2B and FIG. 2C, the power device may be installed in the base 10 or may be disposed in the base 10. In a specific embodiment, the power saving device M272237 can be an AC-to-DC power supply. 1 ^ 三 and _ are a perspective view and a side view of the heat conducting device I22 and the ^ -radiating fin m according to the preferred embodiment of the present invention. According to the guide rail device ^ ^ ^. 较佳, which is a preferred embodiment of the present invention, a krypton cycle heat dissipation method is used, and its working principle is not described below. The heat-conducting device 122 is a medium-quality copper. Inside the hollow cavity 122, the body is placed in a vacuum state, and is provided with a leather surname + ^ 199 ^ \ / Mao, ,, Tian ,, , Mouth structure (not shown in the figure). When the hollow cavity is used as a fluid to absorb heat and evaporate into a gas, the heat dissipation fins 124 of the cavity 122 in the gas ^ ^ ^ 进一步, the fins Λ, ′, and slabs further dissipate the heat to the packaging system 12 outer. The work of the air bear is condensed into a liquid after dissipating heat, and then sucked back by the capillary structure to the hollow ^ 1 and 24. As mentioned above, Genxian's matching Vt clothing set 122 is a thermally conductive device with high heat dissipation efficiency.目 目 5 is a top view of the present invention—the preferred embodiment. The light-emitting device 126 includes a substrate 2 (Stmte) 1260, at least one semiconductor light-emitting element (SemicOnduct hght-emittmg deViCe) 1262, and two electrodes 1264. The at least one semiconductor light-emitting element: 262 and the two-electrode 1264 series Each of the semiconductor light-emitting elements 1262 of the first to second light-emitting elements 1262 is used to emit the light, and the two electrodes 1264 and the at least one semiconductor light-emitting element are respectively disposed on the substrate 126. The per-semiconductor light emitting element 1262 is connected. In a specific embodiment, the material 126Q may be made of a metal material or a metal material, and each of the at least half of the j light emitting elements 1262-a semiconductor light emitting element 1262 is a light emitting diode or a laser light emitting diode. Polar body. In particular, these light-emitting diode systems are high-power, high-brightness light: polar bodies. It should be noted that the light-emitting device 126 according to the present invention is a small-semiconductor light-emitting element 1262 packaged in a single-package package. Therefore, the light-emitting device 6 is a light-emitting device 126 similar to a point light source. As shown in FIG. 6, the light-emitting device 1 ^ 6 is smoothly connected to the flat portion of the hollow cavity 122. In practical applications, the light emitting device 124 may use wire bonding or a flip chip (Filp 9 M272237 ihi = S on the flat portion of the hollow cavity 122. As shown in FIG. Each heat-dissipating fin 124 has at least one hole, and at the same time, so that at least one electric wire can pass through the _16 and the light-emitting device 126. Electrically-reversed circuit board w 丨 ^ See FIG. 8 to FIG. The sheet 124 has a variety of different specific values = 0 " 2 According to the present invention—the preferred embodiment of the packaging system 12 ', the heat sink continuation sheet 124 may be implemented in a disc shape, and the following: month: ⑯122. As shown in Figure 8, the heat sink fin 124 can also be A It-gan ^ two daggers with 5 xuan double body 120 as a principle. Air holes can be opened in the heat sink fin 124, and its material can be collected_ , Shao, Chi alloy, or other similar materials.-, Figure X—shown is a step-by-step method to improve heat dissipation efficiency. Multiple holes can be opened around the heat sink 124 to replace i, i. , The hot air dissipation caused by the heat of the second political heat fin 124 丨 enters the two channels, which increases the light emitting device. 126 Operation_ Efficiency. In order to achieve the same purpose, as shown in Figure 12A to Figure 12c, there are also holes in the seat to move. To make the hot money escape channel clear: in the holes on the second Each of the holes is relative to the base body! The upper soil 02 and the outside of the lighting device 1. Figure 12D is an external view and a partial enlarged view of the lighting device i according to this creative example. As shown in Fig. 12, an air guide plate 104 is provided near the holes 102 on the base body 10, so that hot air flows along the surface of the air guide plate 104. Fig. 13 As shown in A and Ji B, in order to further improve the heat dissipation efficiency, a fan 18 may be provided in the seat at one end of the circuit board 16, the fan 18 is connected to the circuit board 16, and the circuit board is called枷 —Control network (Q) n (clrcmt) controls the fan switch. The control circuit (not shown) is operated by the circuit board π to detect a temperature around the light-emitting device 126. When the measured temperature exceeds a predetermined value, the control circuit activates the The fan 18 cools the lighting device 120 further. It should be noted that Figs. 13A and 13B only show the first and second preferred embodiments according to the present invention. Please refer to Fig. 14A and Fig. 14b. Fig. 14a is an external view of a lighting device according to a fourth preferred embodiment of the present invention. Fig. 14B is an exploded view of the lighting device 1 shown in Fig. 14A. As shown in FIG. 14a, the base 10 of the lighting device 1 includes a set of shells 106 and an embedded component 108. The packaging system 12 is disposed in the casing 106 of the base 10 with one end thereof. The fitting member 108 is sleeved on the cover shell 106 and has two elastic bodies ^ (Resilient body) 1080 ′ for assembling the lamp group 1. For example, when the user wants to assemble the knives set 1 on a hole on a wall or a ceiling, the user can first bend the two elastic bodies 1080 to be parallel to the housing 12 of the packaging system 12 respectively. Then, insert ¾ 明 a and 1 into holes in the wall or ceiling. When the lighting device enters the hole backward, the two elastic bodies 1080 will return to their original state due to the elastic force, so that the lighting device 1 can fit into the hole. This creation provides a packaging system with high heat dissipation efficiency. The packaging system is used for high-power light-emitting diodes, and uses a heat-conducting device and heat-dissipating fins to effectively remove a large amount of heat generated by the high-light diodes. This packaging system is equipped with integrated power grazing and surface reflection devices, and is further applied to various lighting equipment. With the detailed description of the preferred embodiments above, it is hoped that the spirit of this book can be described more clearly, rather than limiting the scope of the operations with the preferred embodiments disclosed above. On the contrary, the intention is to cover various changes and / or equivalence arrangements within the scope of the patents for which this creation is intended. [Brief Description of the Drawings] A || A FIG. A is a σ J view of the lighting device 1 according to the first preferred embodiment of the present invention. Figure 2b is a side view of a lighting device 1 according to a second preferred embodiment of the present invention. 11 M272237 Figure 1A shows the lighting equipment according to the embodiment of this creation! Appearance view. FIG. 2B is a cross-sectional view of the lighting device along the extension line shown in FIG. 2A. FIG. 1C is another specific embodiment of the lighting device shown in FIG. 2B. FIG. 2 is a perspective view of the heat conducting device 122 and the at least one heat dissipation fin 124 according to a specific embodiment of the present invention. Figure 4 is a side view of the heat-conducting device 122 and the cooling fins 124 according to a specific embodiment of the present invention. FIG. 5 is a technical diagram of the light emitting device 126 according to the preferred embodiment of the present invention. The well-shaped figure 6 shows a light emitting device 126 according to a specific embodiment of the present invention. The hair set 124 is flatly joined to the flat portion of the hollow cavity 122. Drum Figure 7 is not based on a specific embodiment of the radiating fins 124 of this creation. At least one hole is opened on the diffuser piece 124 to allow a wire to pass through. 图 # 图 八 Reveals the radiating fins of this creation. One specific embodiment of 124, the fan ... is implemented as a disc on the plate 124. Figure 9 shows a specific embodiment of the heat dissipation fin 124 that is not based on this creation. The fan ..., " The film 124 is implemented as an irregular shape. FIG. 10 reveals that the heat dissipation fins 124 according to the present invention are implemented as a radial shape on the rotating fins 124. Twenty-one is to reveal that in order to improve the heat dissipation efficiency of the enclosure system 12 according to the present invention, a plurality of holes are opened in the casing 120. Fig. 11 of the day of the call 5 The A series is not to improve the heat dissipation efficiency of the moon device 1 according to the first preferred embodiment of the present invention. A plurality of holes 102 can be opened in the base body 10. FIG. 11B shows that the heat dissipation efficiency of the lighting device 1 according to the second preferred embodiment of the present invention by Tinan 12 is M272237. A plurality of holes 102 can be opened in the base 10. FIG. 12C shows that in order to improve the heat dissipation efficiency of the lighting device 1 according to the third preferred embodiment of the present invention, a plurality of holes 102 can be opened in the base 10. FIG. 12D is an external view and a partially enlarged view of the lighting device 1 according to the second preferred embodiment of the present creation. A plurality of holes 丨 02 are opened on the base body 10, and close to the holes 102. An air guide plate 104 is provided. FIG. 13A shows that in order to improve the heat dissipation efficiency of the lighting device 1 according to the first preferred embodiment of the present invention, a fan may be provided in the base 10. > FIG. 12B shows that in order to increase the dispersive rate of the lighting device 1 according to the second preferred embodiment of the present invention, a fan may be provided in the 1Q. Appearance 34A of the lighting device 1 according to the fourth preferred embodiment of the present invention Fig. 14β is an exploded view of the lighting device 1 shown in Fig. 14A. [Description of Symbols of Main Components] 1: Lighting equipment 10: Base body 100: Handle 102. Dagger hole 104: Air guide plate 106 ·· Case 108: Fitting member 1080 · · Elastic body 11: Mirror surface 12: Package System 120: housing 122: heat transfer device 124: heat sink fish plate 126: light emitting device 1260: base material 1262 · semiconductor light emitting element 14: power device 16: circuit board 13 M272237 18: fan