TWM259146U - High-efficiency two-phase flow evaporator - Google Patents
High-efficiency two-phase flow evaporator Download PDFInfo
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- TWM259146U TWM259146U TW93210334U TW93210334U TWM259146U TW M259146 U TWM259146 U TW M259146U TW 93210334 U TW93210334 U TW 93210334U TW 93210334 U TW93210334 U TW 93210334U TW M259146 U TWM259146 U TW M259146U
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【新型所屬之技術領域】 本創作為提供一種高效 液一汽間之相變化以加速散 金屬材質所製成之座體/且 傳導材質（/C > 1 〇〇w/m · κ 間之上方為金屬材質所穿成 產生的熱源，幾乎完全向上 速蒸發而可得到更佳之傳熱 元件，而增加電子元件整體 【先前技術】 才女’隨者南科技的蓬勃 小化，而且單位面積上的密 不斷增強，在這些因素之下 乎逐年升高，倘若沒有良好 產生的熱，這些過高的溫度 與熱應力等現象造成整體的 件本身的壽命，因此如何排 過熱’ 一直是不容忽視的問 現代的社會裡，同時電腦世 器（c ρ υ )淘汰率也跟著 加、處理速度愈快，相對的 加’而在中央處理器的表面 前中央處理器的工作溫度約 情況繼續發展，發熱的瓦特 率之兩相流蒸發器，尤指利用 熱效果之散熱器，係設置有非 於容置空間之底面設置有高熱 )所製成的導熱部，而容置空 之散熱裝置’而使電子元件所 傳導至導熱部’使工作流體快 效果，以防止熱源積存於電子 的穩定性及使用壽命。 發展，電子元件的體積趨於微 集度也愈來愈南，其效能更是 ’電子元件的總發熱源，則幾 的散熱方式來排除電子元件所 將導致電子元件產生電子游離 穩定性降低，以及縮短電子元 除這些熱源以避免電子元件的 題。且由於個人電腦已普及在 代，生命週期愈短，中央處理 =面’而中央處理器的效能增 匕所排放出的熱源也不斷的增 積並沒有太大的變化之下，目 為60 — 95 t：左右，以這種 數將持續升高，若沒有完善的[Technical field to which the new type belongs] This creation is to provide a high-efficiency phase change between the liquid and the vapor to accelerate the base body made of loose metal material and conductive material (/ C > 1 〇〇w / m · κ space above The heat source generated by the metal material almost completely evaporates upward to obtain better heat transfer components, and increase the overall electronic components. [Previous technology] The talented woman 'Suinan Technology' has flourished and reduced, and the unit area is dense. Constantly increasing, these factors will increase year by year. If there is no good heat generation, these excessive temperature and thermal stress will cause the life of the whole piece, so how to dissipate the overheating is always a question that cannot be ignored. In the society, at the same time, the elimination rate of computer wares (c ρ υ) is also increasing, the faster the processing speed, the relative increase, and the CPU ’s operating temperature before the surface of the CPU continues to develop, the hot watt Rate two-phase flow evaporator, especially a heat sink using heat effect, is provided with a heat conducting portion made of non-accommodating space with a high heat) The empty heat sink is used to conduct the electronic components to the heat conduction section, so that the working fluid has a fast effect to prevent the heat source from accumulating in the stability and service life of the electrons. Development, the volume of electronic components tends to be more and more concentrated, and its efficiency is more than the total heating source of electronic components. Therefore, several methods of heat dissipation to exclude the electronic components will cause the electronic components to reduce the stability of the free electrons. And shorten the electronic components to eliminate these heat sources to avoid problems with electronic components. And since personal computers have become popular in the modern era, the shorter the life cycle, the central processing = surface, and the increase in the efficiency of the central processing unit, the heat source is also constantly increasing, and there is no significant change, the head is 60 — 95 t: around, with this number will continue to rise, if there is no perfect
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作’所以如 創作說明（2) 將會嚴重影 器的散熱效 種種原因的 般的兩相流 谷器上表面 子元件表面 件的熱源會 由於金屬容 事先將容器 件的熱源由 會被傳導到 元件所接觸 部為接近真 將會引起毛 化產生氣泡 結構往上進 會碰到金屬 發生相變， 上表面，然 外界環境， 毛細結構的 的區域，以 生可逆液一 種兩相流蒸 器的正常運 要的工作。 關業者遂發 設置有一個 合而成’當 之後，由於 器底板向上 金屬以及内 成為近似真 底板往上傳 器’而剩餘 傳到金屬容 以當毛細結 工作流體發 泡内之壓力 毛細結構上 的冷卻端面 變成液體， 屬容器上表 冷凝變成液 ’將冷凝後 補充汽化所 會吸收或釋 快速、幾乎 散熱裝置， 何提高散熱 在上述 蒸發器，一 的容器以及 底板，與電 ，使電子元 容器内，且 所組成，並 以當電子元 份的熱源將 經由與電子 金屬容器内 度升高時， 液相直接汽 將穿越毛細 ，接著蒸汽 流體又再度 給金屬容器 將熱源散到 體，會經由 輸送到受熱 而因物質發 源，所以此 響中央處理 能是相當重 驅使下，相 蒸發器，為 的鱗片所組 接觸在一起 藉由金屬容 器係由表面 内空氣抽走 金屬容器下 整個金屬容 區域，向上 空狀態，所 細結構内的 ，由於此氣 入金屬容器 容器上表面 從汽體冷凝 後再透過金 且同時蒸汽 毛細力作用 源源不斷的 汽相變化時 發器，具有 展出兩相流 中空金屬製 金屬容器的 熱傳導作用 傳導到金屬 部毛細結構 空狀態，所 導時，一部 的熱源才會 器内’並因 構受熱而溫 生相變，從 較大，氣泡 方的空間内 ’於是工作 將熱源傳導 面的鰭片， 體的工作流 的工作流體 需的液體， 放大量的熱 定溫以及大As the creation description (2) will cause serious heat dissipation effects of the projector for various reasons, the heat source of the top surface of the two-phase valley device will be transmitted to the heat source of the container part due to the metal capacity in advance. If the contact part of the element is close to true, it will cause hairiness, and bubble structure will go up and it will encounter metal phase change. The upper surface, but the external environment, the area of the capillary structure, is a normal two-phase flow steamer. Wanted work. The relevant supplier then set up a composite 'afterwards, because the bottom plate of the device is upwardly metal and the inside becomes an approximate true bottom plate to the uploader', the rest is transferred to the metal container to act as a capillary pressure fluid within the capillary structure of the working fluid. The cooling end surface becomes liquid, which belongs to the condensation on the surface of the container. It will absorb or release the fast and almost heat-dissipating device after condensing and supplementing the vaporization. How to improve the heat dissipation in the evaporator, the container and the bottom plate, and the electricity, make the electronic element container When the heat source of the electronic components will pass through the electronic metal container, the liquid phase vapor will pass through the capillaries, and then the vapor fluid will once again give the metal container the heat source to the body, and will pass through Conveyed to the heat and due to the origin of the material, so the central processing energy can be quite heavily driven, the phase evaporator, the scales are in contact with each other, and the entire metal volume area under the metal container is evacuated from the surface by the metal container. , In the empty state, inside the fine structure, because this gas enters the metal container When the vapor condenses and then passes through gold and the steam capillary force acts continuously, the steam phase change time generator has the exhibited two-phase flow of the hollow metal metal container's heat conduction to the metal part capillary structure empty state. Only a heat source will be inside the device, and it will undergo a warm phase change due to structural heating. From a larger, bubble-side space, then the fins that work on the conductive surface of the heat source will work. , Put a lot of heat and temperature
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量傳熱的特性。 以往此 雨個開口金 焊接而成， ，藉由固相 蒸發器，重 製造成本向 _曲作用產 以致減低傳 熱端，因而 是郄份電子 >剎用相變 幅降低。 裡兩相流蒸 屬盒對焊， 傳統在焊接 燒結形成毛 量較為笨重 ’同時在與 生變形而使 熱效率，嚴 引起燒乾（ 元件的熱源 傳遞的熱源 發器， 或由上 與抽真 細結構 ，毛細 電子元 得毛細 重時將 dry 會被傳 減少， 其金屬 下金屬 空之前 ，通常 結構均 件組合 結構受 使得工 〇 U 導到整 而使兩 容器通 板與中 ，會先 此種全 勻性製 時’會 損成為 作流體 t )現 個金屬 相流蒸 常是藉 間柱狀 使用金 金屬之 作不易 因組裝 不連續 無法回 象，更 容器， 發器的 由上下 金屬等 屬粉末 兩相流 ，而且 扣具的 結構， 流到受 重要的 使得真 效率大Heat transfer characteristics. In the past, this open metal was welded. With solid-phase evaporators, the heavy manufacturing cost was reduced to -18%, so that the heat transfer end was reduced. Therefore, the amount of phase change of the brake electrons was reduced. The two-phase flow steaming is a box butt welding. Traditionally, the gross mass during welding and sintering is relatively bulky. At the same time, it deforms and causes thermal efficiency, which causes severe dry-out (the heat source of the component's heat source transfer, or from the top to the bottom). Structure, the capillary electron element will reduce dry when the capillary is heavy. Before the metal is empty, the structure is usually a uniform structure. The structure will be adjusted to make the two containers pass through the center. In the case of full homogeneity, it will be damaged and become a fluid t) The current metal phase flow steaming is often made by using a column of gold metal. It is not easy to return due to discontinuous assembly, and it is a container. Two-phase flow, and the structure of the buckle, is important to make it really efficient
//疋以，要如何解決上述習用之問題與缺失，即為從事 此行業之相關廠商所亟欲研究改善之方向所在者。 【新型内容】// In a word, how to solve the above-mentioned problems and shortcomings is the direction that the relevant manufacturers engaged in this industry are eager to study and improve. [New content]
故，創作人有鑑於上述之問題與缺失，乃搜集相關資 科，經由多方評估及考量，並以從事於此行業累積之多年 鎳驗’經由不斷試作及修改，始設計出此種高效率之兩相 流療發器之新型專利誕生者。 本創作之主要目的乃在於，利用非金屬材質所製成之 庫體，並於座體底面設置有高熱傳導材質（Λ · K)所製成之所製成的導熱部，而座體上方為具有金屬材 質戶斤裝成之散熱裝置，而使電子元件所產生的熱源，幾乎Therefore, in view of the above-mentioned problems and deficiencies, the creators have collected relevant resources, evaluated and considered from various parties, and based on the years of nickel testing accumulated in this industry, through trial and error, they began to design such high-efficiency Birth of a new patent for a two-phase fluid therapy device. The main purpose of this creation is to use a non-metallic library body, and set the heat conduction part made of high thermal conductivity material (Λ · K) on the bottom surface of the base body, and above the base body is It has a heat dissipating device made of metal materials, so that the heat source generated by the electronic components is almost
M259146 四、創作說明（4) 都能有效、集中 作流體快速蒸發 變後放熱冷凝成 導熱部，如此持 地傳導開來，且 防止熱源積存於 使用壽命。 本創作之次 座體’而使散熱 因散熱器重量過 以經由塑膠包覆 型，再與鋁擠型 因此得以大量、 【實施方式】 為達成上述 其構造，茲繪圖 功能如下，俾利 請同時參閱 圖、分解圖及使 看出’本創作係 ，其中； 該座體1為 有可各置工作流 1 1内之大氣壓 向上傳導至兩相流蒸發器之導熱部，使工 並流向上方而釋放出熱源，因汽體分子相 液體沿著容器邊緣或因重力作用而聚集於 續液一汽間之相變化使熱源4以源源不斷 因蒸發快速而可得到更佳之散熱效果，以 電子元件，增加電子元件整體的穩定性及 要目的乃在於，利用非金屬材質所製成之 器之整體重量大為減輕，可防止電子元件 重而產生破裂或損壞，同時因為此座體可 高熱傳導材質（/c > 1〇〇w/in.K)射出成 或不同製程所製造之散熱裝置組合而成， 快速的製造，並可以降低製造成本。 目的及功效，本創作所採用之技術手段及 就本創作之較佳實施例詳加說明其 完全瞭解。 寸d、 第一、二、三圖所示，係A4丨& 用時之側視剖面圖（一）、、 之外觀 設置有座體1 、工你、ώ 由圖中可清楚 座體1 I作流體2及電子元件3 使用非金屬材質所製成， 體2之密閉式容置空間 ^體1内為具 力為低於外界，為接 ：士容置空間 具王狀態，並於容 M259146 四、創作說明（5)M259146 Fourth, the creation instructions (4) can be effective and concentrated to quickly evaporate the fluid and change the heat to condense into a heat conduction part, so that it is conducted continuously and prevents heat sources from accumulating in the service life. The sub-body of this creation allows the heat dissipation due to the weight of the heat sink to pass through the plastic-clad type, and then the aluminum extrusion type. Therefore, in order to achieve the above structure, the drawing function is as follows. Refer to the figure, the exploded view, and make it clear that 'this creative department, of which; the base body 1 is a heat conducting part that can be transmitted upwardly to the two-phase flow evaporator by the atmospheric pressure in each of the work flows 11 to make the work flow upward The heat source is released, and the phase change of the vapor molecular phase liquid gathered along the edge of the container or due to the effect of gravity on the liquid-vapor phase makes the heat source 4 to obtain a better heat dissipation effect due to the continuous rapid evaporation. With electronic components, increase The overall stability and main purpose of electronic components is to greatly reduce the overall weight of devices made of non-metal materials, which can prevent the electronic components from being heavy and cracked or damaged. At the same time, the base body can be made of high thermal conductivity material (/ c > 100w / in.K) injection molding or a combination of heat sinks manufactured by different processes, fast manufacturing, and can reduce manufacturing costs. The purpose and effect, the technical means used in this creation and the full understanding of the preferred embodiment of this creation are explained in detail. Inch d, first, second, and third, as shown in the figure A4 丨 & side sectional view (a), when used, the base is equipped with a base 1, you can see the base 1 I as the fluid 2 and the electronic component 3 are made of non-metallic materials. The enclosed accommodation space of the body 2 is lower than the outside in the body 1, for the connection: the accommodation space has a king state, and M259146 Fourth, creation instructions (5)
置空間1 1之底面設置有高熱傳導材質（/c > 100W/m · K )所製成之導熱部1 2 ，而該導熱部1 2之底面為設置有 可接觸電子元件3之接觸面1 2 1 ，且導熱部1 2之表面 為設置有可接觸工作流體2的加熱面1 2 2 ，而該容置空 間1 1之上方為具有金屬材質所製成之散熱裝置1 3 ，且 散熱裝置1 3為設置有上蓋1 3 1 ，並於上蓋1 3 1之表 面為設置有複數間隔排列之鰭片1 3 2。 該工作流體2為設置於座體1之容置空間1 1内，且 工作流體2可為水、酒精、丙酮或其相互混合成之液體。 該電子元件3為接觸於導熱部1 2所設置之接觸面1 # 2 1° 請同時參閱第三、四圖所示，係為本創作較佳實施例 於使用時之側視剖面圖（一）及側視剖面圖（二），由圖 中可清楚看出，當電子元件3於發熱時，該導熱部1 2為 會將熱源快速吸收並傳導至工作流體2，且因座體1為使 用非金屬材質所製成而導熱部1 2使用高熱傳導材質（/c > 100W/m · K )所製成，因此熱源不至擴散開來，進而可 將熱源集中的傳導至加熱面1 2 2並對工作流體2快速加 熱，且藉由控制容置空間1 1内之壓力，使其接近真空狀 0 態，而讓工作流體2之沸點降低，而因工作流體2受到加 熱面1 2 2之加熱產生蒸發情形，且蒸汽在微小的壓力差 下流向散熱裝置1 3 (如第三圖之中空箭號所示），並且 釋放出熱源，而釋放出的熱源為會被散熱裝置1 3所設置 之上蓋1 3 1所吸收，並傳導至鰭片1 3 2並與空氣接觸The bottom surface of the installation space 1 1 is provided with a thermally conductive portion 1 2 made of a high thermal conductive material (/ c > 100W / m · K), and the bottom surface of the thermally conductive portion 12 is a contact surface provided with a contactable electronic component 3 1 2 1, and the surface of the heat conducting portion 12 is provided with a heating surface 1 2 2 that can contact the working fluid 2, and a heat dissipation device 1 3 made of a metal material is disposed above the accommodating space 1 1 and dissipates heat The device 13 is provided with an upper cover 1 3 1, and a plurality of spaced-apart fins 1 3 2 are provided on the surface of the upper cover 1 3 1. The working fluid 2 is disposed in the accommodating space 11 of the base 1, and the working fluid 2 may be water, alcohol, acetone, or a liquid mixed with each other. The electronic component 3 is in contact with the contact surface 1 provided in the heat conducting portion 12 # 2 1 ° Please refer to the third and fourth figures at the same time, which is a side cross-sectional view of the preferred embodiment of the creative during use (a ) And a side sectional view (2), it can be clearly seen from the figure that when the electronic component 3 is heating, the heat conducting portion 12 is to quickly absorb and conduct the heat source to the working fluid 2, and because the base 1 is Made of non-metal material and the heat conducting part 1 2 is made of high thermal conductivity material (/ c > 100W / m · K), so the heat source will not spread out, and the heat source can be concentratedly conducted to the heating surface 1 2 2 and quickly heat the working fluid 2, and by controlling the pressure in the accommodating space 1 1 to make it close to the vacuum state 0, the boiling point of the working fluid 2 is reduced, and the working fluid 2 is heated by the heating surface 1 2 The heating of 2 causes evaporation, and the steam flows to the heat sink 1 3 (as shown by the empty arrow in the third figure) under a slight pressure difference, and releases the heat source, and the released heat source is to be cooled by the heat sink 1 3 The provided upper cover 1 3 1 absorbs and conducts to the fins 1 3 2 and communicates with the air contact
第9頁 M259146 四、創作說明（6) ，而將熱源散去，且蒗a 會重新凝結成工作流體=之熱源被散熱裝置i 3吸收後為 力或毛細作用而回至容，而凝結後之工作流體2便因重 箭號所示），且工作流5間11底面（如第四圖之中空 並產生蒸發情形，如此掊接再次吸收加熱面1 2 2之熱源 源可以源源不斷地傳導=了形成液—汽間之相變，而使熱 請參閱第五圖所示:\來： 視剖面圖，由圖中可清=為本創作再一較佳實施例之側 上蓋1 3 1表面為設置 出，该散熱裝置1 3所設置之 所接觸之散熱面積，而，細結構1 4，以增加熱交換時 ，且複數鳍片丄3 2 阿液—間之相變化的進行速度 的使鰭片1 3 2上之熱、爲2設置之風扇4，為可更加快速 發後之工作流體2凝結的$二強：：二散去’ $而加快蒸 置導引裝置1 1 1來引i ΐ 且谷置空間1 1内為可設 請參閱第六圖所-4汽順利的流向上蓋。 用時之侧視剖㊉= m ^#再—較佳實施例於使 可與座體1形成一缺摊曰可清楚看出，該導熱部1 2為 而穩固的固定，雷^ ’使電子元件3可直接嵌入缺槽内 再者，win元件3可為中央處理器。 做成波浪狀或：齒m3所設置之上蓋131表面為可 冷凝蒸汽成為液體八他形狀，以增加熱傳面積，加速 、銘質材料‘等Π Γ:〉rw/m.K)可為銅質材料 硼等陶究材料以及銘—碳化…紹、氮化 M259146 3、創作說明（7) 合材料，且座體i為可以經由Page 9 M259146 Fourth, the creation description (6), and dissipate the heat source, and 蒗 a will re-condensate into a working fluid = the heat source is absorbed by the heat sink i 3 and returns to the capacity for force or capillary action, and after condensation The working fluid 2 is shown by the heavy arrow), and the bottom surface of the working room 5 is 11 (as in the fourth picture, it is hollow and evaporates, so the heat source that continuously absorbs the heating surface 1 2 2 can be continuously conducted. = The phase transition between the liquid and the vapor is formed, and the heat is shown in the fifth figure: \ Lay: A cross-sectional view, which can be cleared from the picture = a side cover of a further preferred embodiment of this creation 1 3 1 The surface is provided, and the heat-dissipating area contacted by the heat-dissipating device 13 is set, and the fine structure 14 is used to increase the heat exchange rate and the speed of the phase change of the plurality of fins 3 2 A liquid-to-phase. The fan 4 which makes the heat on the fins 1 3 2 set to 2 is a second force that can condense the working fluid 2 after the hair is sent faster: the two are dissipated and the steaming guide device 1 1 1 is accelerated.引 i ΐ and the space inside the valley 1 1 can be set, please refer to the sixth figure-4 steam smoothly flow to the upper cover. Section ㊉ = m ^ # 再 — The preferred embodiment makes it clear that the heat conducting part 12 is firmly fixed, and the electronic component 3 can be directly embedded. In addition, the win element 3 can be a central processing unit. It is made into a wave shape or: the surface of the upper cover 131 provided by the tooth m3 is a condensable vapor into a liquid shape to increase the heat transfer area and accelerate the quality of the material. '等 Π Γ:> rw / mK) can be ceramic materials such as copper and boron, as well as inscriptions—carbonization ... Shao, nitride M259146 3. Creative instructions (7) composite materials, and the seat body i can pass
K > 100W/m ·Κ)所製成之導熱部勝包覆高熱傳導材質 型或不同製程所製造之散熱襄置 射出成型，再與銘擠 大量、快速的製造，並可以^低^ ^組合而成，因此得以 又，該容置空間！ i内為可、、：f成本。 比工作流體2高的球或粉末、以2 〇金屬或非金屬等密度 品，以增加傳熱速率，或使用在陶瓷粉末、陶瓷球等物 昇流體2之水位，讓導熱部1 2 ^ $平方向時’有助於提 濕，而不會影響散熱器的效率。 個被工作流體2所潤 是以，本創作高效率之兩相流蒗 技術關鍵在於； “、、赞15為可改善習用之 為利用非金屬材質所製成之 體1底面設置由高熱傳導材 體1並於座 所製成的導熱部丄2，而座 質所製成之散熱裝置"，而 為：：金屬材 的熱源’幾乎都經由導熱部工2向上 提昇傳熱效率及液一汽相變反應速率，夕 作流體2快速在高熱傳導材質所製成之導熱；^ =J面1 2 2汽化’而蒸汽會因微小的;^ ;差流 向上方，且釋放出的熱源會被散熱裝置1 3所吸收 ^使蒸氣重新冷凝成液體，如此持續液—汽間^目 蝥化使熱源可以源源不斷地傳導開來，且因1發快 速而可得到更佳之散熱效果，以防止熱源積電 子元件3，以增加電子元件3整體的使用穩定性及K > 100W / m · K) is made of heat-conducting parts that are coated with high-heat-conducting materials or manufactured by different processes. They can be injected and molded in large quantities and quickly. Combined, so it can be, this accommodation space! Within i is the cost of f, f :. Balls or powders higher than the working fluid 2 with a density of 20 metal or non-metal to increase the heat transfer rate, or use in the water level of the fluid 2 in the ceramic powder, ceramic ball and other materials, so that the heat conduction part 1 2 ^ $ In the horizontal direction, it helps to dehumidify without affecting the efficiency of the radiator. The key to the high-efficiency two-phase flow technology of this creation lies in the fact that the working fluid 2 is used; The body 1 is combined with the heat conduction part 丄 2 made of the seat, and the heat dissipation device made by the seat is ", and the heat source of the metal material is almost all raised by the heat conduction part 2 to improve the heat transfer efficiency and the liquid FAW. Phase change reaction rate, Xi Zuo fluid 2 quickly heat conduction made of high thermal conductivity material; ^ = J surface 1 2 2 vaporization 'and the steam will be small; ^; the difference flows upward, and the released heat source will be radiated The vapor absorbed by the device 13 causes the vapor to condense again into a liquid, so that the continuous liquid-vapor vaporization allows the heat source to be continuously conducted, and it can obtain better heat dissipation effect due to a fast round of heat to prevent heat source accumulation. Electronic component 3 to increase the overall use stability of electronic component 3 and
第11頁 M259146 、創作說明（8) 哥命。 (一）本創作為利八 埶器之整至材貝所製成之座體1 ，而使散 熱器重可防止電子元請散 以經由塑損壞’因為此座體1可 射出成型二ΓΓ傳導材質所製成之導熱部12 置1 3 %人而呂擠型或不同製程所製造之散熱裝 置1 ύ、、且合而成，因此曰 r; ^ P ^ ^ ^ 侍U大I、快速的製造且可 以低/狐I%製造以降低製造成本。 上述詳細說明為針對本創作一 0〇 . ρ ,, ^ ^ 乍種幸父佳之可行實施例說 明而已，惟瀛貝施例並非用以限定本 ，凡其它未脫離本創作所揭示之技蓺 叫f】犯圍 變化與修飾’均應包含於本創作所涵蓋之專利範圍$ 〇 綜上所述：i創作之高效率之兩相流蒸發器於使用時 具有顯著之功减乓進，誠符合新穎性、創作性、 專利要件，爰依$提出申請，盼•委早曰賜；'之 保障創作人之辛苦創作，倘若鈞局有任何稽疑，:不^ 來函指示，劍作人定當竭力配合，實感德;㈣4不吝Page 11 M259146, Creation Instructions (8) Brother Life. (1) This creation is a base body 1 made of a whole of the eight-barrel ware, and the weight of the radiator can prevent the electronic elements from being scattered to be damaged by plastic. 'Because this base body 1 can be injection-molded, two ΓΓ conductive materials The heat-conducting part is made up of 12% and 13% people, and the heat dissipation device manufactured by Lü extruded or different processes is combined, so it is called r; ^ P ^ ^ ^ 服 U 大 I 、 Quick manufacturing And can be manufactured at low / fox I% to reduce manufacturing costs. The above detailed description is only a description of the feasible embodiment of this creation, namely, 〇, ρ ,, ^ ^, but it is not intended to limit the edition, and any other techniques that do not depart from the disclosure of this creation f] The changes and modifications of crimes should be included in the scope of patents covered by this creation. In summary, the high-efficiency two-phase flow evaporator created by i has significant power reduction when used, which is in line with Novelty, creativeness, patent requirements, apply for conversion, and hope that it will be bestowed; 'Protect the hard work of the creator, if there is any suspicion in the Bureau, please do not send the letter instructions, Jian Zuoren will do his best Cooperation, real sense of morality; ㈣4 不吝
第12頁 M259146 圖式簡單說明 【圖式簡單說明】 圖 面 剖 視 側 之 時 用 使 於 。。例 圖圖施 觀解實 外分佳 之之較 作作作 tMUJ. tnj. rnj. 本本本 為為為 係係 係 圖圖圖 一 二三 第第 圖 面 剖 視 側 之 時 用 使 於 例 施 實 佳 較 45— 作 創 本 為 係 圖 四 第 面 剖 。視 圖側 面之 剖時 視用 側使 之於 ΪΠΊ YHMJ. 施施 實實 佳佳 較較 JE一·Jui\—一 一 • Γτκ 3^f 3^· 作作 本本 為為。 係係圖 圖圖 五六 第第 1 明 說 號 符 件 元 ΊΧ 間置 體件 空裝部面面 流 元 體置引熱觸熱 作 子 座容導導接加 工 電Page 12 M259146 Simple illustration of the drawing [Simplified illustration of the drawing] It is used when the drawing is viewed from the side. . Illustrated illustrations and illustrations are better compared to tMUJ. Tnj. Rnj. This book is intended to be used as an example when used as a system diagram. Better than 45 — The original version is the fourth section of Figure 4. When viewing the side section of the view, the side of the view is used for ΪΠΊ YHMJ. Shi Shi Shijia is better than JE 一 · Jui \ — 一一 • Γτκ 3 ^ f 3 ^ · This is the original book. Series diagram Figure 56 Fifth Sixth first instruction symbol element Ί × Intermediate body parts Empty surface surface flow element Body heat and touch operation
置 構 裝 結 熱蓋片細 散上鰭毛 Λ X > % 3 12 4 13 3 1 1± IXSet up the structure and cover the hot fins with fine fin hairs Λ X >% 3 12 4 13 3 1 1 ± IX
第13頁 M259146Page 13 M259146
第14頁Page 14
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