TW584799B - Flat-board loop type micro heat pipe - Google Patents
Flat-board loop type micro heat pipe Download PDFInfo
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M4799 五、發明說明(l) 【發明的應用範圍 本發明 型化發熱裝 過集合了環 之散熱效果 【發明背景 近年來 的躍進導致 效的散逸至 運轉。較傳 附加於發熱 或附加風扇 元件發熱量 來越高,因 輸熱量至遠 而,這種目 在呂塊與發熱 阻,再加上 相接觸之散 成的散熱模 擠壓,因此 現行之 在的熱阻即 與金屬塊1 2M4799 5. Description of the invention (l) [Scope of application of the invention The present invention has a heat-dissipating effect of a ring-shaped heat-generating device. [Background of the invention The recent leap forward has led to the dissipation of efficiency to operation. It is said that the amount of heat added to the heating or additional fan components is higher. Because the heat is transmitted far, this kind of object is in the Lu block and the heating resistance, plus the extruded heat dissipation die that is in contact with it, so the current Thermal resistance is related to metal block 1 2
:有關,二種散熱元件,特別是一種適用於薄 ,如筆記型電腦的平板式環路型微 路型熱管與平板型微熱管之優點,以提供更J ] ,子產業迅速發展,各種電子產品因功能大幅 :位面積發熱量越來越高,為了將這些埶 糸統外之環境,維持元件於許可的操作溫产 統的作法不外乎以大面積之埶、又 電子元件上增加直整體散埶 = 3以政熱片 ^ ^ /、正篮政熱面積,以自铁斟、、六 之強制對流方式行之。铁% π t + …對/;,L . _ 忍而,近年來由於雷; 越來越大,尺寸卻越形變、 此,即蕤臥盾士 A 導致表面溫度越 猎助原本使用於太空中 端的埶交拖掇鈿从 r u τ〜&水補助傳 义:乂換杈組件,如散熱片、風扇缺 刖主流之傳熱.模式卻有复 …、 元件表面及教管間存在’因為導熱 般金屬傳熱特性並非特 ^綱熟 熱片無法有效發揮。此外,各個^埶一S…、兀件 組成本結構在低價電子產 2疋件所組 興起本發明構想。冤子產°口推波助爛之下將受 散熱模組即如r笙n — 有電子元件 回」所示,在加熱端處存 午1 0外表面與接觸全屬 與熱管11間埶阻,卜“:丞屬塊12間熱阻’ ”、、阻除此之外,影響加熱區域熱 584799 五、發明說明(2) 阻值還包3發熱電子^件1 Q與接觸金如^ ^ ^ ^ ^ 散熱阻(SPreadering resistanc〇, 熱阻值相對較高。 i體所存在的 13以:力:i c〇: n j增加而必須採用較大散熱片 曰刀政熟柃,為彌補散熱片丨3分散埶阻拇 由理論可知必須設法降低散埶 :加的問嘁’ 課題。透過本發明將可去除掉習知的不容緩的 阻,與降低發熱電子元们。外表面與金= 叙熱電子元件1〇與散熱片13間之分散熱阻。、-屬鬼12及 【發明之目的及概述】 f創作的目的在揭露一種對平板型微埶 局(thermal layout )的技術, 二二進仃熱傳佈 熱管與平板型微熱管之特性的心元件:、纟具環路型 本創作主要是利用微熱管的原理,一 ;型密閉容器中依據熱源的分佈狀態及形狀平 =旋端以及連接前述二區之單向熱 、 透過這種積集化的手段,創的規剎與佈局, 平板型微熱管之優點的散数‘件,環路型熱管與 的熱源提供散熱的作用,並且====對—個以上 大的散熱平面,更可以視迅速地平均分散至較 又』以視而要決定冷凝端的大小,使得整: Related, two kinds of heat-dissipating components, especially one suitable for thin, such as flat-panel loop-type micro-circuit heat pipes and flat-type micro-heat pipes, such as notebook computers, to provide more J], the rapid development of sub-industries, various electronics Due to the large function of the product: the heat generation of the bit area is getting higher and higher. In order to keep the environment outside these systems, the method of maintaining the components in the permitted operating temperature is to increase the size of the area and increase the electronic components. The overall dispersal = 3 to the political heat film ^ ^ /, the area of the political heat of the basket, by the iron convection, the forced convection method of six. Iron% π t +… yes ;;, L. _ Forbearance, in recent years, due to the increasing thunder; the size has become more and more deformed. This, that is, the surface temperature caused by the lying shield A hunting aid originally used in space End-to-end communication from ru τ ~ & water subsidy: the exchange of components, such as heat sinks, fans lacking the mainstream heat transfer. Modes have complex ..., the surface of the component and the duct exists' because of heat conduction The general metal heat transfer characteristic is not a special hot-melt sheet that cannot be effectively used. In addition, the cost structure of each unit, unit, unit, unit, and unit is based on the concept of the present invention. The product produced by the wrong person will be cooled by the push wave of the mouth. The module will be subject to heat dissipation, such as rsheng n—with electronic components. "Bull :: Thermal resistance between 12 genus blocks", In addition to the resistance, it affects the heating area heat 584799 V. Description of the invention (2) The resistance value also includes 3 heating electrons ^ 1 Q and contact gold such as ^ ^ ^ ^ ^ Thermal resistance (SPreadering resistanc〇, thermal resistance value is relatively high. The existence of 13 in the body: the force: ic〇: nj increases and must use a larger heat sink, known as a knife, to make up for the heat sink 丨3 Dispersion of resistance thumb It is known from the theory that it is necessary to try to reduce the dispersion: the problem of addition. Through the present invention, the conventional inconvenient resistance can be removed, and the heating electrons can be reduced. The outer surface and gold = heat dissipation Dispersed thermal resistance between the electronic component 10 and the heat sink 13. The ghost 12 and the purpose and summary of the invention f The purpose of the creation is to reveal a technology for the flat-type thermal layout.心 Heart elements of the characteristics of heat transfer heat pipes and flat micro heat pipes: It is mainly based on the principle of micro heat pipes. According to the distribution state and shape of the heat source in the sealed container, the flat ends and the one-way heat that connects the two zones mentioned above are created by this integrated means. , The advantages of the flat-type micro-heat pipe are scattered pieces, the loop-type heat pipe and the heat source provide the role of heat dissipation, and ==== for more than one large heat-dissipating plane, it can be quickly dispersed evenly as much as possible. Depending on the size of the condensing end,
體的空間利用率更佳。 本發明主要的足 ,9 與大型板片,以、疋 k供一種整合環路型熱管 〃有更佳之散熱效果;5处P弓、富田承把彳 %路型微熱管。 、双禾及空間運用的干扳式 目的所 工作流 板片組 冷凝端 置不同 個凸出 形成數 板片, 端區 作為辅 後再將 於板形 。其整 ,吸枚 管流至 構的冷 ,便能 了具有 之特性 相互接 揭露之平 體與一毛 成内部具 、蒸汽輸 而有不同 之區域與 個凹槽用 且板片形 域’上板 助液態之 一遇熱能 容器内, 體過程乃 熱源元件 冷凝端, 凝液輸送 達到熱源 環路型熱 外,且蒸 觸,因此 板形容器、一 各器之上、下 域:蒸發端、 據熱源區域位 片表面形成多 上板片表面則 構緊密接觸下 募打樣。在冷 上板片外,也 細結構内。最 工作流體填充 性來傳送熱能 液態工作流體 經由蒸汽輸送 由内含毛細結 復始循環不斷 本發明除 )傳熱距離長 作中彼此並不 板式環路型微熱管,係由一 細結構所構成,其中,板形 有真空性質的密閉空間區 送管及冷凝液輸送管,其依 形狀。在蒸發端區域,下板 熱源元件接觸,藉以傳熱; 以支撐上板片及輔助毛細結 狀可依據熱源形狀及數目多 片表面之凹槽除了用以支撐 工作流體流至相鄰底端的毛 產生相變化之熱傳媒介,即 利用此流體產生相變化之特 藉由存在於毛細結構孔隙之 所散出的熱量後,液體汽化 在冷凝端的壁面凝結,再經 《回流至条發端,如此週而 元件散熱的目的。Better space utilization. The main foot of the present invention is an integrated loop-type heat pipe with 管 k and 疋 k for better heat dissipation effect; 5 P-bows and Tomita Cheng handle 彳% road-type micro heat pipes. , Shuanghe, and the space-operated dry-pull type of work. The plate group has different condensing ends, which form a number of plates. The end area is used as a supplement and then the plate shape. In other words, the suction tube flows to the cold of the structure, and it can have the characteristics of the flat body and the hair with the inner part exposed, the steam transported with different areas and grooves, and the plate-shaped domain. One of the plate-assisted liquids meets the thermal energy container. The bulk process is the condensation end of the heat source element. The condensate is transported to the heat source loop-type heat and vaporized. Therefore, the plate-shaped container, the upper and lower areas of each container: the evaporation end, According to the heat source area, the surface of the chip is formed on the surface of the upper plate, and the sample is proofed in close contact. Outside the cold upper plate, and inside the fine structure. The working fluid is filled to transfer thermal energy. The liquid working fluid is continuously transported by capillary loops and recirculated by the present invention. The heat transfer distance is long and the plates are not plate loop type micro heat pipes. They are composed of a fine structure. Among them, the plate-shaped closed space area delivery pipe and the condensate delivery pipe having vacuum properties are shaped according to the shape. In the area of the evaporation end, the heat source element of the lower plate contacts to transfer heat; to support the upper plate and the auxiliary capillary knot can be based on the shape of the heat source and a number of surface grooves, in addition to supporting the working fluid to the adjacent bottom end of the wool The heat transfer medium that generates phase change, that is, the heat generated by this fluid that changes phase through the pores existing in the capillary structure, the liquid vaporizes on the wall of the condensing end to condense, and then flows back to the hair end. And the purpose of component heat dissipation.
管(Loop Heat Pipe ;LHP 汽態與冷凝液態工作流體運 有較南傳熱量;而本發明之Pipe (Loop Heat Pipe; LHP vapor and condensed liquid working fluids have a higher heat transfer capacity than the South;
五、發明說明(4) 源的多寡而增加,而冷 與傳統比較之較大差別 整體空間的利用則更具 ^ 特色在於蒸發端的數目可依熱 疑Μ則可依需求而變大或縮小,此 在於將其全部整合至板形容器中, 優勢。 更進 后: 為使責審查委員對於本發明之詳 一步的瞭解與認同,茲就配合圖式 細内容及技術能有 作一詳細說明如 【發明之實施 本創作主 在一起的金屬 例說明】 要是利用 平板構成 閉容器中 以及連接 的蒸發端 板型密閉 金屬平板 並且在適 的區域, 條件配置 屬千板區 效率亦會 在此平 發端、 佈局。 的總合 域則為 決定蒸 屬於金 安裝處 下,單 地愈大 後0 板型密 冷凝端 而以上 即為平 單純的 發端, 屬平板 之空間 純之金 ,散熱 微熱管 一種大 依據熱 前述二 、冷凝 容器的 區域, 當之位 以及單 即可, 域的面 更佳。 的原理 面積的 源的分 區之單 端以及 内容積 因此只 置規劃 向熱傳 當然若 積愈大 其具體 ’使用 扁平板 佈狀態 向熱傳 單向熱 ’除此 要依熱 出冷凝 迴路, 是在空 則其散 的實施 二片彼 型密閉 及形狀 迴路的 傳迴路 之外的 源之分 端,其 則可以 間條件 熱面積 例構造 此密合 容器, 進行蒸 規劃與 之容積 其餘區 佈位置 餘單純 視實際 許可之 將相對 吕兄明如 根據本發明所揭露的平板式 於熱源元件之散熱,如電路板上 等散熱情形,首先,如「第2圖 環路型微熱管20,係應用 的高功率密度之電子元件 」所示為本發明具有單—V. Description of the invention (4) The number of sources increases, while the difference between cold and traditional comparisons is that the use of the overall space is more ^ The feature is that the number of evaporation ends can be increased or reduced according to demand, This is the advantage of integrating it all into a plate-shaped container. Further progress: In order to make the review committee understand and approve the present invention in detail, we will make a detailed explanation in accordance with the detailed content and technology of the drawings, such as [the metal example of the implementation of the invention by the creator] If the flat plate is used to form a closed metal plate in the closed container and the connected evaporation end plate type closed metal flat plate, and in a suitable area, the conditional configuration is in the thousand plate area. The efficiency will also be flat here. In order to determine the steaming area, it belongs to the gold installation. The larger the single land is, the closer the plate is, the denser the end is, and the above is the simple origin. It belongs to the space of pure gold. Second, the area of the condensing container can be as simple as it is, and the area of the area is better. The principle area of the source area is the single-ended and inner volume of the source area. Therefore, only the heat transfer is planned. Of course, if the volume becomes larger, the specific 'use of flat sheet cloth to the heat leaflet to heat'. In addition to this, the condensation circuit is based on the heat. The air is scattered to implement the two ends of the source other than the closed circuit of the closed loop and the shape of the loop. The close container can be constructed with an example of the thermal area, and the steam planning and layout of the remaining area of the volume Simply depending on the actual permission, it will be relatively cool for Lu Xiongming to dissipate heat from the flat-plate type heat source components, such as circuit boards, according to the present invention. First, as shown in the "loop-type micro heat pipe 20 in Figure 2", "High power density electronic components" shows that the present invention has a single-
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環路之實 中未示) 板形 片23彼此 如··銅、 5 0、冷凝 之電子元 熱,且蒸 外,蒸汽 體蒸發後 發端3 0與 流道;而 散熱之功 和百小’或 將熱量帶 施例,其 與毛細結 容器2 1係 密合而組 或铭等金 端40與冷 件係放置 發端3 0之 輸送管50 通至冷凝 冷凝端40 冷凝端4 0 效,且冷 是將冷凝 走。 包含有 構34、 由兩片 成,其 屬材, 凝液輸 於蒸發 數目可 連通蒸 端40之 ,作為 則可依 凝端4 0 端40置 一板形容器2 1 「第 44 (參考 薄金屬板 中又以熱 其中,蒸 送管6 0形 端3 0之外 依據熱源 發端3 0與 流道,冷 工作流體 需求置放 之面積則 於有風扇 一工作 、4圖 ,一上板片22 傳係數較高者 發端3 0、蒸汽 成一環路。其 表面處與其相 元件之數目而 冷凝端4 0,作 凝液輸送管6 0 冷凝後流至蒸 複數個散熱片 可依散熱需求 處,以強制熱 流體(圖 J ) ° 與一下板 為佳,例 輸送管 中,發熱 接觸以傳 定;另 為工作流 亦連通蒸 發端3 0之 用以增加 而變大或 對流方式 々 另外’當本發明平板式環路型微熱管2 0 a被應用於如 筆。己型電腦之散熱用途時,將可根據已有之電路板線路 (Circuit Layout)來決定熱管之流路(Thermal Uy〇ut ’例如有多數個產生熱源之電子元件的情況,如「第7 ^」所不為具有兩個熱源之情況,此時則必須包含有兩個 ,其中,蒸發端3〇a、蒸汽輸送管5〇a、冷凝端4〇a與 冷减液輸送管6〇a形成一環路,而蒸發端3〇b、蒸汽輸送管 f b、冷凝端40a與冷凝液輸送管6〇b則形成另一環路,此 ^則可藉由此兩個環路來將不同熱源所產生之熱帶走,達Not shown in the loop) The plate-shaped pieces 23 are like copper, 50, condensed electrons, and after steaming, the steam evaporates and starts at 30 and the flow channel; Or, an example of a heat band, which is in close contact with the capillary tube container 21, and the gold end 40 of the group or inscription and the cold part are placed at the end 30, and the delivery pipe 50 is opened to the condensation end 40, and the condensation end 40 is effective, and Cold is condensing away. Contains structure 34, composed of two pieces, the material of which belongs to the condensate. The condensate is transported to the evaporation end 40, which can be connected to the steam end 40. As a condensed end, 40 end 40 can be placed in a plate-shaped container. The metal plate is heated in addition to the 60-shaped end 30 of the steam delivery tube, which is based on the heat source originating end 30 and the flow channel. The area where the cold working fluid needs to be placed is when the fan works, Figure 4, and the upper plate. 22 The higher the transmission coefficient is, the end is 30, and the steam forms a loop. The surface is condensed at 40 with the number of phase components, and it is used as a condensate delivery pipe. 60 After the condensation, it flows to a number of fins, which can be cooled according to the heat dissipation requirements. It is better to force the hot fluid (Figure J) ° with the lower plate. For example, in the conveying pipe, the heating contact is passed; the work flow is also connected to the evaporation end 30, which is used to increase and become larger or convection. When the flat loop micro-heat pipe 20 a of the present invention is used as a pen. The heat dissipation of a personal computer, the flow path of the heat pipe (Thermal Uy) can be determined according to the existing circuit board layout (Circuit Layout). ut 'for example, there are many electrons that generate heat In the case of "7th ^", it is not the case with two heat sources. At this time, it must include two. Among them, the evaporation end 30a, the steam delivery pipe 50a, the condensation end 40a and the cold The reduced-pressure conveying pipe 60a forms a loop, and the evaporation end 30b, the steam conveying pipe fb, the condensing end 40a, and the condensate conveying pipe 60b form another loop. Road to the tropical heat generated by different heat sources, reaching
第8頁 584799 五、發明說明(6) :J熱:目的,當然亦可另外設置有一 ' -壞路’藉由兩個獨二獨之冷凝端而形 所述的-對-之關係之關係可以為如前 一個冷凝端之多對—的關係,或—二述之多個蒸發端對 以是多對多的關係,而不僅限端與冷凝端之間也可 視所需的電路板設計與實際 ^早一環路之中,而可以 大的彈性。 一 、π…、狀况需求而定,具有相當 另外’當電路板上具有較突 形成如缺口 2 5,以避π过*如 I之兀件需避開時,則可 器2la之中央區域 幵〇犬起之元件,或是當整片板形容 減輕整體之重旦—…任何管路時,則可另開有一槽24以 的效果iL二:達到板形容器2ia之空間上靈活運用 途,使散敎更為的無官路空間亦可做為散熱之用 會預熱其:電ί元:之:而不形成如習知的散熱裝置 所以:之f管已整合至上、下板片22、23内部, 與金屬祕!〇 4之散熱模組,減少在「第1圖」中熱管11 之特性。▲此t間的接觸熱阻,並具有組裝容易,結構單一 性,即复::枯本發明中整體效能仍具有現行熱管之特 率,因j 性相當於一般金屬链材質數十倍高的熱傳 管5〇值子70件所產生的熱量能夠迅速的透過蒸汽輸送 吕50傳遞至冷凝端4〇排放。 疋 另外,工作流體係為填充於板形客哭21内部之熱傳媒 ” ’且藉由壓力差在板形容器21内=;,Η流體係為Page 8 584799 V. Description of the invention (6): J heat: of course, of course, there can also be set up a '-bad road' with two unique and condensing ends-the relationship of the-pair-relationship It can be the many-to-many relationship of the previous condensing end, or the many-to-many relationship of the two evaporation end pairs mentioned above, and it is not limited to the circuit board design and the required between the terminal and the condensing end. Actually ^ as early as a loop, but can have great flexibility. First, π ..., depending on the needs of the situation, there is quite another 'When the circuit board has a protrusion such as a gap 2 5 to avoid π too much * If the I components need to be avoided, the central area of 2la幵 〇 Dog-like components, or when the whole plate is described to reduce the weight of the whole-... any pipeline, you can open a slot 24 to the effect of iL II: to achieve the flexible container 2ia space The unofficial road space that makes the diffuser can also be used for heat dissipation. It will preheat it: Electricity: Yuan: It does not form a conventional heat sink. So: The f tube has been integrated into the upper and lower plates. 22, 23 inside, with metal secrets! 〇 4 heat dissipation module, reduce the characteristics of the heat pipe 11 in the "Figure 1". ▲ The contact thermal resistance between t has the advantages of easy assembly and single structure, that is, the overall efficiency in the present invention still has the current rate of the heat pipe, because the j property is equivalent to dozens of times higher than that of the general metal chain material. The heat generated by 70 pieces of 50 heat transfer tubes can be quickly transmitted to the condensing end and discharged through the steam conveying tube 50.疋 In addition, the workflow system is a thermal medium filled inside the plate-shaped passenger cry 21 "'and the pressure difference in the plate-shaped container 21 = ;, the flow system is
584799 五、發明說明(7) 經溫度變化時易產生相變化之材併 態,冷凝後則形成液態,如純水貝甲^熱時形成蒸汽 材質之選擇取決於工作流體太甲醇或丙嗣等材質,其 吸收之潛熱大Λί、,以及與其相液相轉變成汽相時所能 44間的相容度(即不起化學變之::與毛細結構34、 填量需依板形容器21内填滿毛i構;流,充 態工作流體,蒸發端30與心气輪:;二4所有孔隙之液 冷凝端4G與冷凝液輸送㈣内壁冷凝液。二”體及 斤構3:、“係置於蒸發端3〇、冷凝端40及冷凝 液輸达官60内,其一側盥下柘μ 士 w /、卜敬片23之内表面接觸,以傳輸 液態之工作流體。一般而言,毛鈿紝^ 寻铷 取叩。毛細結構34、44大致上可以 選用如銅製金屬網、複數個溝槽或燒結金屬粉末所形成之 多孔性材料結構。 -本$明之平板式環路型微熱管2〇的蒸發端3〇之剖面結 構如「第3圖」所示,蒸發端3 0之結構係由兩片經由沖壓 成型之金屬銅板,上、下板片32、33與金屬網毛細結構34 所組成之板形容器31。其中上板片32具有一外表面向下内 凹之凹槽320設計,其功用在於與毛細結構34相接觸並、做 為結構支撐以增加上板片32之機械強度,與毛細結構34形 成蒸汽的流動通道。下板片3 3則沖壓成數條溝槽,做為輔 助流道3 3 0,用以輔助液態之工作流體流動,且下板片3 3 表面形成多個凸出之區域與熱源元件接觸,藉以傳熱。而 在兩上、下板片32、33内壁鋪有一層毛細結構34,而毛細 結構34表層剛好可與上板片32之凹槽32 0端面及下板片33 第10頁 584799 五、發明說明(8) 間緊密接觸。上板片3 2 流體汽化時蒸汽之出口 冷凝端4 0回流之工作流 上端處留有一開孔,用以傳輸工作 ’而下板片3 3則留有一孔道,作為 體的進口 (參閱「第5 、6圖」 而 結構如 大的差 溫蒸汽 端的毛 時兩板 之液態 液態工 不變。 另 面結構 產生的 至冷凝 43流回 6 0中為 出口處 還有一 本發明中平板式 「第4圖」所示 別在於上板片4 2 冷凝後所形成之 細結構44,及增 片4 2、4 3間可適 工作流體流向冷 作流體進出口處 外’蒸汽態與冷 分別如「第5圖 南溫汽化工作流 端4 0,冷凝後藉 蒸發端3 0,如此 了防止蒸汽態之 與蒸發端30進口 播塊6 1,係為毛 組成,但其餘地 管口所 流阻。 板形容器2 1内部形 微熱管20其冷凝端4〇之剖面 型構造與蒸發端30相似,較 凹槽420,此時則可作為高 態工作流體流向下板片4 3底 日守上板片4 2之傳熱面積。此 些許毛細結構44,幫助冷凝 送管60,而高溫蒸汽與冷凝 保持與蒸發端30同樣的結構 環路型 ,其外 表面的 冷凝液 加冷凝 時添加 凝液輸 之設計 凝液態 」與「 體透過 著冷凝 週而復 工作流 處之冷 細結構 方則只 工作流 第6圖 内面平 液輸送 始運作 體回流 凝液輸 整個填 鋪一層 體的輸 」所示 滑的蒸 管60内 著,在 ,故在 送管60 滿冷凝 毛細結 送管道 ’蒸發 汽輸送 部之毛 冷凝液 接近冷 内部, 液輸送 構4 3, 部份剖 端3 0所 管50流 細結構 輪送管 凝端4 0 則分別 管60之 以減低 成之蒸發端30、蒸汽輸送管5〇、冷584799 V. Description of the invention (7) The material is easy to produce phase change when the temperature changes, and condensed to form a liquid state, such as pure water shells. ^ The choice of the material that forms steam when heated depends on the working fluid being too methanol or propane. Material, its latent heat absorption is large, and its compatibility with the phase and liquid phase into a vapor phase 44 (that is, can not afford chemical change :: with capillary structure 34, the filling amount depends on the plate-shaped container 21 The inside is filled with wool structure; flow, filled working fluid, evaporation end 30 and heart gas wheel :; 2 4G liquid condensing end of all pores and condensate transport condensate on the inner wall of the ㈣. 2 "body and pound structure 3 :," It is placed in the evaporation end 30, the condensing end 40 and the condensate delivery officer 60, and the inner surface of one side of the 柘 μ w / bu Jing tablet 23 is in contact with each other to transfer the liquid working fluid. Generally speaking, Wool 钿 纴 铷 search for 铷. The capillary structures 34 and 44 can be roughly selected from porous material structures such as copper metal mesh, a plurality of grooves or sintered metal powder.-This flat plate type loop micro heat pipe The cross-sectional structure of the evaporation end 3 of 20 is as shown in "Figure 3". The structure of the hair end 30 is a plate-shaped container 31 composed of two metal copper plates stamped and formed, upper and lower plates 32, 33 and a metal mesh capillary structure 34. The upper plate 32 has an outer surface that is concave downward. The design of the groove 320 is to contact the capillary structure 34 as a structural support to increase the mechanical strength of the upper plate 32 and form a steam flow channel with the capillary structure 34. The lower plate 33 is stamped into several pieces The groove is used as an auxiliary flow channel 3 3 0 to assist the liquid working fluid to flow, and a plurality of protruding areas are formed on the surface of the lower plate 3 3 to contact the heat source element to transfer heat. The inner wall of the plates 32, 33 is covered with a layer of capillary structure 34, and the surface of the capillary structure 34 can just be in close contact with the end face of the groove 32 0 of the upper plate 32 and the lower plate 33 page 10 584799 5. Description of the invention (8) The upper plate 3 2 has a condensing end at the outlet of the steam during the vaporization of the fluid 40. There is an opening at the upper end of the working flow for returning flow, and the lower plate 3 3 has a hole for the inlet of the body (see " Figures 5 and 6 "and the structure is very different At the warm steam end, the liquid state of the two plates remains unchanged. On the other side, the condensate produced by the structure 43 flows back to 60, and there is an outlet. There is also a flat plate in the present invention. 2 The fine structure 44 formed after the condensation, and the additional pieces 4 2, 4 and 3 are suitable for the working fluid to flow out of the cold working fluid inlet and outlet. The steam state and the cold are respectively shown in "Figure 5 South temperature vaporization working stream end 4 0 After condensing, the evaporation end 30 is used to prevent the vapor state and the evaporation end 30 from entering the seeding block 61, which is composed of wool, but the flow resistance of the remaining nozzles. Plate-shaped container 2 1 Internal-shaped micro heat pipe 20 It The cross-sectional structure of the condensing end 40 is similar to that of the evaporating end 30. Compared with the groove 420, it can be used as a high-level working fluid to flow to the lower plate 43 and the heat transfer area of the upper plate 42 at the bottom. These capillary structures 44 help to condense the delivery pipe 60, while the high-temperature steam and condensation maintain the same structural loop type as the evaporation end 30. The condensate on the outer surface is added to the condensate during the condensation. The cold fine structure at the working stream passes through the condensing cycle, but only the flat surface of the inner surface of the working fluid is conveyed. The returning condensate is conveyed to the entire layer. The slippery steam tube 60 is shown in the figure. Therefore, the capillary condensate in the delivery pipe 60 is full of condensate capillary delivery pipe, and the capillary condensate in the evaporation vapor conveying section is close to the cold interior. Then, the evaporation end 30, the steam conveying pipe 50, and the cooling pipe 60 are reduced respectively.
第11頁 584799 發明說明(9) 减端4 0與冷凝液輸送管6 〇經組裝完成後再過焊接方式接 合’即形成平板式環路型微熱管2 〇之雛形構造。但為了確 保加熱初期瘵發端3 〇不因工作流體的缺乏而造成乾化 (Dry out )情形,因此將填充孔(圖中未示)置於蒸發 端3 0附近,且經抽真空及灌入適量的工作流體後,再予以 焊接密封即可製成平板式環路型微熱管2〇。 =上=述之平板式環路型微熱管2〇,此種架構之好處 於瘵=恶工作流體與液態工作流體之間並無相互間之 用,可獲得較大熱傳輪能力。 為了能更清楚明勝^: 1 本發明之工作原理,4 :月…因此,我們更進-步闊述 發額之下板片33局;式環路型微熱管20於蒸 卫作流體;:及:而 :板壓會循著蒸汽輸送管50流 蒸汽態卫作流體接觸後壓力較小的冷凝端4〇,當 為液態工作流體,冷内壁板片時,因放熱而冷凝 助,由冷凝端40内壁助毛細壓力以及重力的幫 細結構44孔隙内的液^工^420流至底端處,匯集至毛 異,循著冷凝液輸送$6〇 ^體會因為區域毛細壓力差 30'因此工作流體可二内毛細壓力較=發端 的。 个斷的循裱不已,達到傳遞熱量的目Page 11 584799 Description of the invention (9) The minus end 40 and the condensate delivery pipe 60 are assembled and then welded together to form a prototype structure of a flat loop type micro-heat pipe 200. However, in order to ensure that the bursting end 30 during the initial heating period does not cause dry out due to the lack of working fluid, the filling hole (not shown) is placed near the evaporation end 30, and is evacuated and filled. After an appropriate amount of working fluid is welded and sealed, a flat plate loop type micro heat pipe 20 can be manufactured. The above-mentioned flat-plate loop-type micro heat pipe 20 has the advantages of = there is no mutual use between the evil working fluid and the liquid working fluid, and a large heat transfer wheel capacity can be obtained. In order to be able to understand more clearly ^: 1 The working principle of the present invention, 4: month ... Therefore, we go further-extensively describe the 33 plates under the amount of hair; type loop type micro heat pipe 20 in the steamer as the fluid; : And: And: the plate pressure will follow the steam conveying pipe 50 flow of the steam state of the working fluid, the pressure will be lower than the condensing end 40. When it is a liquid working fluid and the inner wall plate is cold, it will be condensed due to heat release. The capillary pressure on the inner wall of the condensing end 40 and the gravity structure 44 on the inner wall of the condensed liquid 44 flow to the bottom end, collect to the capillary, and transport $ 6 through the condensate. You will realize that the regional capillary pressure difference is 30 '. The working fluid may have a lower internal capillary pressure than the starting end. Endless cycle to achieve the purpose of transferring heat
依據熱管理論,丰“ W (2 σ/〇,σ為工作流體:f所能提供的最大毛細壓力為 體的表面張力,rc為毛細結構的有According to thermal management theory, Feng "W (2 σ / 〇, σ is the working fluid: the maximum capillary pressure provided by f is the surface tension of the body, rc is the capillary structure of the
第12頁 ^84799 、發明說明(10) j半徑,以金屬網毛細結構為例,rc等於金屬網線徑與線 —t之半’所以只要最大毛細壓力差大於工作流體循環時 =况流動壓損,液體流動壓損及重力的壓損總和(即 =ΔΡΐ+ ΔΡι+ APg),熱管即可在任何角度運作,且由於 形谷态2 1内工作流體的注入是在真空情況下並予以密 壯因此板形容器2 1内之工作流體皆處於汽液平衡的飽和 狀恕。 =發a月巾蒸發端3〇處之毛細結構最上層恰好與向下 = 320端一面接觸’當熱管運作時,液態工作流體係在 孔二3晨層相通之孔道内流動’且在毛細結構34表層 夺二3 = ★。毛細壓力大小是由毛細結構34表層孔隙尺寸 =疋而因此毛細結構34表層孔隙較小時,則增加毛細壓 流動結構34孔隙較大時,將減少液態工作流體 分門不Γ堅扣,此外,再加上蒸汽與液體間的流動彼此 :::互接觸,@此蒸汽與冷凝之工作流體 低的"“且’如此則可提高傳熱能力。 ’半又 凝端二:熱里在此平板式環路型微熱管20之蒸發端30與冷 1如40的吸收與釋放是以二維 ^ ^ 近似等溫之模:,可;:或冷凝端4°均是處於 均能發揮最大功效,而此η::或政熱片 潛熱方式進行,故其熱傳導俜數冷凝時是以 中常用較高熱傳導率之輕;屬==,目前電子設傷 、离板片作為增強散熱的機構, 584799Page 12 ^ 84799, description of the invention (10) j radius, taking the metal mesh capillary structure as an example, rc is equal to the metal mesh wire diameter and line-half of t ', so long as the maximum capillary pressure difference is greater than when the working fluid is circulated = the flow pressure Loss, liquid flow pressure loss and gravity pressure loss (ie = ΔΡ 即 + ΔΡι + APg), the heat pipe can operate at any angle, and because the working fluid injection in the valley shape 2 1 is under vacuum and is dense Therefore, the working fluid in the plate-shaped container 21 is in a saturated state of vapor-liquid equilibrium. = The uppermost layer of the capillary structure at 30 ° at the evaporation end of the moon towel is just down. = The 320 side is in contact with the side. 'When the heat pipe is operating, the liquid workflow system flows in the channels that communicate with the morning layer of hole 2' and in the capillary structure. 34 surface wins 2 3 = ★. The capillary pressure is determined by the pore size of the surface layer of the capillary structure 34 = 疋. Therefore, when the surface pores of the capillary structure 34 are small, increasing the capillary pressure flow structure 34 will increase the pore size of the liquid working fluid. Coupled with the flow of steam and liquid each other ::: mutual contact, @this steam and the condensing working fluid are low " "and 'this can improve the heat transfer capacity.' The absorption and release of the evaporation end 30 and the cold end 1 of 40 of the flat-type loop type micro heat pipe 20 are in a two-dimensional ^ ^ approximate isothermal mode :, may ;: or the condensation end 4 ° is at the maximum effect. , And this η :: or latent heat film is used, so its heat conduction coefficient is lighter than the commonly used high thermal conductivity when condensing; belong to ==, the current electronic damage, off the plate as a mechanism to enhance heat dissipation, 584799
五、發明說明(π) 惟其與熱管相較仍屬遜色’再加上本發明之模式可降低現 行熱管散熱片散熱模組之熱阻,此將可極為有效的提昇其 散熱能力。 與傳統解決高溫熱點之方 明不僅擁有環路型熱管高傳熱 屬塊12與熱管11接觸面之熱阻 發熱量的電子元件10熱量迅速 外,它能夠將吸收或釋放的熱 熱晶片功率密度降低,且降低 熱作用,並且能依據整體熱量 sink),而周遭無打樣之廣大 夠在空間上進行多樣的變化。 式不同的地方在於透過本發 里之優點,且能夠將傳導金 降低,而同樣具有將局部高 ^導引至遠端之作用。此 量予以橫向迅速分散,使發 對其餘零組件可能造成的預 之多寡適時添加熱沈(Heat 板片面積亦可辅助散熱,能 本發明的另一特 若將整片板片製作成 熱片相接觸時,板片 的電子元件原本可能 熱片均溫結果造成對 造成元件溫度上升, 需與板片中蒸發端接 透過散熱裝置予以散 剪裁成大小適中的板 除了具有均溫且溫度 因此,本發明相當於 大型散熱板與熱管結 點在於應用 熱管均熱片 整體溫度即 並不是在如 這些零組件 採用本發明 觸,熱量會 熱,且沒有 形容器來增 不致像平板 整合現行散 合成一體, 時’當發熱 提昇至某一 此的溫度等 周遭環境形 之設計時, 迅速的傳導 打樣之平板 加散熱,使 式均熱片預 熱模組與環 且蒸發端與 元件與 溫度,級,卻 成部份 元件發 至冷凝 區域可得上、 熱整體 路型熱 冷凝端 熱管均 惟些許 因為均 預熱, 熱源只 端,再 依需求 下板片 環境。 管,將 處擁有V. Description of the invention (π) However, it is still inferior to the heat pipe. In addition, the mode of the present invention can reduce the thermal resistance of the existing heat pipe heat sink heat dissipation module, which can effectively improve its heat dissipation capacity. Fang Ming, the traditional solution to high-temperature hot spots, not only possesses the electronic components 10 of the thermal resistance and heat generation of the contact surface between the loop type heat pipe high heat transfer block 12 and the heat pipe 11, but also can absorb or release the heat and power of the wafer. Reduce, and reduce the thermal effect, and can be based on the overall heat sink), and the vast surroundings without proofing is enough to make various changes in space. The difference between the formulas is that through the advantages of the present invention, and can reduce the conductive gold, it also has the effect of guiding the local height to the far end. This amount is dispersed quickly in the horizontal direction, so that heat sinks can be added to the remaining components in a timely manner (the area of the heat plate can also assist heat dissipation, which can make the whole plate into a heat plate according to another aspect of the present invention). When in contact, the electronic components of the plate may originally cause the temperature of the hot plate to rise, which will cause the component temperature to rise. It needs to be evaporated and terminated with the heat dissipation device to be cut into a moderately sized board in addition to having a uniform temperature and temperature. The present invention is equivalent to the junction of a large-scale heat sink and a heat pipe. The application of the overall temperature of the heat pipe soaking sheet does not mean that if these components are touched by the present invention, the heat will be heated, and there is no shaped container to increase the current integration of the flat plate. When the heat rises to a certain temperature and other surrounding environmental design, the rapid conductive proofing plate adds heat to make the type heat sink preheat the module and the ring and the evaporation end and the component and temperature, level, However, some components can be sent to the condensing area. The overall heat-condensing end heat pipe is only a little because of the preheating and heat. Only the end, and then by plates environment needs tube, will have at
584799 五、發明說明(12) 均熱板(Spreader)之效用,具降低熱源 與提高熱量輸出端散熱片的效能,達^降' 散熱阻,而形成更佳的散熱效果,故麦请 利。 【發明之效果】 、根據本發明所揭露之平板式環路型微 為· 1 ·能降低接觸熱阻與分散熱阻,且蒗产 體於運作中彼此並不相互接觸,S 特性; ^同時接受多個熱源,且板形容器的 散熱用途,而不需增加散熱元件成本 根據已有之電路板線路決定埶管之心 -L^youU ,且蒸發端的數g可依孰二 之面積則可依需求而變大或縮 k活應用的效果;以及 藉由結合為一體之平々 处 之十板式裱路型微熱 勿 、、、吉構單一之特性。 用前述,較佳實施例揭露 精神和〃二Α任何熟習此技藝者,在 保護範2 Α έ畜可作些許之更動與潤飾 圍§㈣附之巾請專利範圍所界定 輪入端功率密度 低接觸熱阻與分 鈞局准予該專 2 3 4 熱管,其效果 態與液態JL作流^ 具有較咼傳熱的 其餘部份可做為 路(Thermal 的數目決定,而 小,達到空間可 管,具有組裝容 如上,然其並非 不脫離本發明之 ,因此本發明之 者為準。584799 V. Description of the invention (12) The effect of the heat spreader (Spreader) can reduce the heat source and increase the efficiency of the heat sink at the heat output end, and achieve a better heat dissipation effect, so please make a profit. [Effects of the invention] The flat-type loop type micro-type disclosed in the present invention is · 1 · It can reduce contact thermal resistance and dispersion thermal resistance, and the production bodies do not contact each other during operation, S characteristics; ^ Simultaneously It accepts multiple heat sources and uses the heat dissipation of the plate-shaped container without increasing the cost of the heat-dissipating components. The core of the tube -L ^ youU is determined according to the existing circuit board circuit, and the number of g of the evaporation end can be based on the area of the second. The effect of increasing or shrinking the application according to the needs; and the ten-plate type road-type micro-heating unit that is integrated into the flat place, and has a single structure. With the foregoing, the preferred embodiment reveals the spirit and the second person. Any person who is familiar with this skill can protect the animal 2 and make some changes and retouching. § The attached towel, as defined by the patent scope, has low power density at the wheel-in end. The contact thermal resistance and sub-junction bureau granted the special 2 3 4 heat pipe, and its effect state is in flow with the liquid JL. ^ The rest of the heat transfer can be used as a path (the number of Thermal is determined, and small, the space can be managed. It has the assembly content as above, but it is not inseparable from the present invention, so the person of the present invention shall prevail.
第15頁 584799 圖式簡單說明 【圖式簡單說明】 第1圖,係為習知一種以散熱模組提供電子元件散熱 之不意圖, 第2圖,係為本發明之平板式環路型微熱管之示意 圖; 第3圖,係為「第2圖」之平板式環路型微熱管的蒸 發端之I I I - I I I剖視圖; 第4圖,係為「第2圖」之平板式環路型微熱管的冷 凝端之I V - I V剖視圖; 第5圖,係為本發明之平板式環路型微熱管的蒸發端 蒸汽出口之剖視圖; 第6圖,係為本發明之平板式環路型微熱管的冷凝端 冷凝液體出口之剖視圖;以及 _第7圖,係為本發明之平板式環路型微熱管應用於多 個熱源之示意圖。 【圖示符號說明】 10 .....電子元件 11 .....熱管 12 .....金屬塊 13 .....散熱片 20、20a.....平板式環路型微熱管 2 1、2 1 a.....板形容器 22、 22a.....上板片 23、 23a.....下板片Page 15 584799 Brief description of the drawings [Simplified description of the drawings] Fig. 1 is for the purpose of knowing a kind of heat dissipating module to provide electronic components to dissipate heat. Fig. 2 is a flat loop micro-heat of the present invention. Schematic diagram of the tube; Fig. 3 is a sectional view taken along the line III-III of the evaporation end of the flat-type loop-type micro-heat pipe of "Fig. 2"; Fig. 4 is a flat-type loop-type micro heat of "Fig. 2" Section IV-IV sectional view of the condensing end of the tube; Figure 5 is a sectional view of the steam outlet of the evaporation end of the flat loop microheat pipe of the present invention; Figure 6 is a flat loop microheat pipe of the present invention A cross-sectional view of the condensed liquid outlet at the condensing end; and FIG. 7 is a schematic view of the application of the flat loop microheat pipe of the present invention to multiple heat sources. [Illustration of symbols] 10 ..... electronic components 11 ..... heat pipe 12 ..... metal block 13 ..... heat sink 20, 20a ..... flat loop type Micro heat pipe 2 1, 2 1 a ..... plate-shaped container 22, 22a ..... upper plate 23, 23a ...
584799584799
第17頁 圖式簡單說明 24 · • · • •槽 25 · • · • •缺口 30 ^ 30a 、30b..... 蒸發端 31 · ••板形容器 32 · ••上板片 320 • ••凹槽 33 · • · ••下板片 330 • · •輔助流道 34 · • · ••毛細結構 40、 40a .....冷凝端 41 · ••板形容器 42 · ••上板片 420 • ••凹槽 43 · • · ••下板片 430 • · •輔助流道 44 · ••毛細結構 50 ^ 5 0a 、50b..... 蒸汽輸送管 60 > 6 0a 、60b..... 冷凝液輸送管 61 · • •擋塊Simple illustration on page 17 24 • • • • Slot 25 • • • • • Notch 30 ^ 30a, 30b ..... Evaporating end 31 • • • Plate container 32 • • • Upper plate 320 • • • Groove 33 • • • • • Lower plate 330 • • • Auxiliary runner 34 • • • • Capillary structure 40, 40a ..... Condensing end 41 • • • Plate-shaped container 42 • • • Upper plate Sheet 420 • • • Groove 43 • • • • • Lower plate 430 • • • Auxiliary runner 44 • • • Capillary structure 50 ^ 5 0a, 50b ..... Steam duct 60 > 6 0a, 60b ..... Condensate delivery pipe 61 · • • Stop
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TW89110007A TW584799B (en) | 2000-05-24 | 2000-05-24 | Flat-board loop type micro heat pipe |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN109287109A (en) * | 2018-11-27 | 2019-01-29 | 上海交通大学 | A kind of dry method phase change heat-exchange apparatus based on capillary water conservancy diversion |
CN109588015A (en) * | 2018-12-21 | 2019-04-05 | 中国航空工业集团公司西安航空计算技术研究所 | A kind of distribution heat reservoir |
CN109729701A (en) * | 2019-01-25 | 2019-05-07 | 岩熔之光智能科技(上海)有限公司 | A kind of dedicated pulsating heat pipe radiator of high power density servo-driver |
WO2022082352A1 (en) * | 2020-10-19 | 2022-04-28 | 欧菲光集团股份有限公司 | Vapor chamber and heat dissipation device |
CN115568160A (en) * | 2022-04-02 | 2023-01-03 | 荣耀终端有限公司 | Heat radiation structure and electronic equipment |
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2000
- 2000-05-24 TW TW89110007A patent/TW584799B/en not_active IP Right Cessation
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109287109A (en) * | 2018-11-27 | 2019-01-29 | 上海交通大学 | A kind of dry method phase change heat-exchange apparatus based on capillary water conservancy diversion |
CN109287109B (en) * | 2018-11-27 | 2020-07-10 | 上海交通大学 | Dry phase-change heat exchange equipment based on capillary diversion |
CN109588015A (en) * | 2018-12-21 | 2019-04-05 | 中国航空工业集团公司西安航空计算技术研究所 | A kind of distribution heat reservoir |
CN109729701A (en) * | 2019-01-25 | 2019-05-07 | 岩熔之光智能科技(上海)有限公司 | A kind of dedicated pulsating heat pipe radiator of high power density servo-driver |
WO2022082352A1 (en) * | 2020-10-19 | 2022-04-28 | 欧菲光集团股份有限公司 | Vapor chamber and heat dissipation device |
CN115568160A (en) * | 2022-04-02 | 2023-01-03 | 荣耀终端有限公司 | Heat radiation structure and electronic equipment |
CN115568160B (en) * | 2022-04-02 | 2023-08-18 | 荣耀终端有限公司 | Heat radiation structure and electronic equipment |
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