TWM245463U - Improved riveting structure of heat dissipating body - Google Patents
Improved riveting structure of heat dissipating body Download PDFInfo
- Publication number
- TWM245463U TWM245463U TW091201434U TW91201434U TWM245463U TW M245463 U TWM245463 U TW M245463U TW 091201434 U TW091201434 U TW 091201434U TW 91201434 U TW91201434 U TW 91201434U TW M245463 U TWM245463 U TW M245463U
- Authority
- TW
- Taiwan
- Prior art keywords
- riveting
- riveted
- base
- side plate
- protrusions
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
M245463 SS 91201434M245463 SS 91201434
9、創作說明(1) 創作領域 構 快 的 〇 體 固 鉚 鉚 孔 時 熱 鉚 , 均 間 ,尤ί S ί ί關於一種電腦中央處理器散熱體鉚合結 尤其疋邊鉚合結構之改良。 創作背景 電腦中央處理器(CPU )是電腦中極為重要的邱分 更由於電腦科技不斷的提升,其執行速度與效 ^兪 ,相對地,其所產生的熱量也愈來愈高,因此,if 上方通常都放置有一散熱趙,藉以達到降溫 本創作係提供一種散熱體鉚合結構之改良,可= 較佳的鉚合結構,使得CPU可以有更穩定的執行環境。”·、 請參考圖一A之傳統散熱體結構,包含有一散轨體i 一底座11 ,以及兩片側板12。其中該底座丨丨與側板·12之 定係藉鉚合突部H1與鉚合孔洞121之鉚合。然而,由於 合技術的限制,鉚合時(請參圖一B的鉚合圖式),該 合突部111無法均勻受力,而導致該鉚合突部丨丨】與鉚合 洞121之間產生間隱:,如圖一B之局部圖式。因此,製作 ,很容ίίΪίΐ座與側板之鬆脫,因而增加製造成本 π η一部除有方形之外(如圖—Α的鉚合突苟 於4士进,复广r 9 1形狀。請參圖二A,係為另一種傳統散 人Irmi、1二人與側板22之固定係藉鉚合突部211與 鉚合時⑽圖二B :鉚而合圖同么地 勻受力’而導致該鉚合突邻2】"你二P 大部2 1 1無法 r。大部2 1 1與鉚合孔洞2 2 1之間產生 M245463 ____案號 91201434 和年ml 修正_____ 四、創作說明(2) 隙,如圖二B之局部圖式。因此,製作時,同樣地很容易 ,就造成底座與側板之鬆脫,因而增加製造成本。 此外還有一種類似W形的鉚合突部,如圖三A所示,該 鉚合突部31 1具有兩個壓固件31 ia、31 lb ,然而,該些壓 固件311a、311b之頂點a、a’ 、b、以及b,並不在同一直線 上,而形成一厚度D於頂點a、b與a,、b,之間。由於製造 該鉚合突部的技術有限,常常造成厚度D的誤差,當厚度D 太大時’藉外力鉚合之後(如圖三B所示),容易造成底 座3 1與側板3 2之鬆脫,因而增加製造成本。 創作目的 本創作之主要目的是在創作出一種鉚合力較強的散熱 體柳合結構之改良,尤其是該散熱體之底座與側板鉚合結 構之改善。 、“因此,本創作之另一目的係提供一種製作簡單、不易 脫落的散熱體鉚合結構之改良。 創作概述 良,本創作提供一種電腦中央處理器散熱體鉚合結構之改 ^ i 用底座之1卵合突部與側板之鉚合孔洞,藉由外力將 該5 2!! Γ平於該側板外,以固定該底座與側板。尤其是 =了卩3突部具有兩個相同的v形壓固件,且該些v形壓固件 洞=點,位於同一直線上,該些鉚合突部穿過該些鉚合孔 '、’藉由外力將該些V形壓固件分別地向兩側鉚平,以9. Creation instructions (1) Creation of fast solid rivets in the field of creation. Hot rivets when hot rivets, evenly spaced, especially S ί ί about a computer central processor heat sink riveting joint, especially the improvement of the edge riveting structure. Creative background The computer central processing unit (CPU) is a very important element in computers. Due to the continuous improvement of computer technology, its execution speed and efficiency are relatively high. In contrast, the heat it generates is getting higher and higher. Therefore, if A cooling fan is usually placed on the top to reduce the temperature. This creative system provides an improvement of the riveting structure of the heat sink, which can = better riveting structure, so that the CPU can have a more stable execution environment. Please refer to the traditional heat sink structure in Figure 1A, which includes a loose rail body i, a base 11, and two side plates 12. The base and the side plate · 12 are fixed by riveting protrusions H1 and riveting. The riveting of the hole 121 is closed. However, due to the limitation of the riveting technology (see the riveting pattern in Figure 1B), the engaging protrusion 111 cannot be uniformly stressed, which causes the riveting protrusion 丨 丨] There is a gap between the riveting hole 121, as shown in the partial diagram of Figure 1B. Therefore, the production is very tolerant of the detachment of the base and the side plate, thereby increasing the manufacturing cost π η except for the square ( As shown in Figure A, the riveting protrusions are in the shape of 4 shijin, Fuguang r 9 1. Please refer to Figure 2A, which is another traditional loose person Irmi, 1 two people and the side plate 22 is fixed by the riveting protrusion 211 When riveting, Figure 2B: The riveted and combined image is equally stressed, which causes the riveting protuberance 2] " You two P large part 2 1 1 cannot r. Large part 2 1 1 and riveting M245463 between hole 2 2 1 ____ case number 91201434 and year ml correction _____ Fourth, the creation description (2) gap, as shown in the partial diagram of Figure 2B. Therefore, when making, the same It is very easy to cause the base and the side plate to loosen, thereby increasing the manufacturing cost. In addition, there is a riveting protrusion similar to a W-shape. As shown in FIG. 3A, the riveting protrusion 31 1 has two pressing members 31. ia, 31 lb, however, the vertices a, a ', b, and b of these fasteners 311a, 311b are not on the same straight line, but form a thickness D between the vertices a, b and a, b. Due to the limited technology of manufacturing the riveted protrusions, errors in thickness D are often caused. When the thickness D is too large, 'after riveting by external force (as shown in Figure 3B), it is easy to cause the base 31 and side plates 32 to Looseness, thus increasing manufacturing costs. The purpose of the creation The main purpose of this creation is to create an improvement of the riveting structure of the heat sink with a strong riveting force, especially the improvement of the riveting structure of the base and side plates of the heat sink. Therefore, another purpose of this creation is to provide an improvement of the riveting structure of the heat sink that is simple to make and not easy to fall off. The creation is well-defined, and this creation provides a modification of the riveting structure of the heat sink of a computer central processor. Riveting of zygote and side plate The hole is closed, and the 5 2 !! Γ is flattened out of the side plate by external force to fix the base and the side plate. In particular, the 卩 3 protrusion has two identical v-shaped pressing members, and the v-shaped pressings Fastener holes = points, located on the same straight line, the riveting protrusions pass through the riveting holes ',' and the V-shaped fasteners are riveted to both sides by external force to
第6頁 四、創作說明(3) 固定該底座與側板。 詳細說明與較佳實施例 :創作為達成上述之㈣,所採用之技術、手段 及八體,,·。構特冑,茲舉一較佳可行之實 說明而更進一步揭示明瞭,詳如下述。 稽圃不 本創作提供一種電腦中央處理器散熱體鉚合結構之改 良,請參圖四A ’至少包含一底座41,以及至少一侧板42, 該底座41具有至少-娜合突部411,且該些側板42具有盘 該些鉚合突部411相對應之鉚合孔洞421 ,該些鉚合突部 4 11穿過該些鉚合孔洞4 2 1 ,並藉由外力將該些鉚合突部 4 1 1鉚平於該側板4 2外,以固定該底座4 1與側板4 2。尤其 是,請參圖四B,該鉚合突部411具有兩個相同的¥形壓固 件411A與411B,且該些V形壓固件411A與411B之頂點a、 A ’ 、B、B ’係位於同一直線上,該些鉚合突部4丨j穿過該些 鉚合孔洞4 2 1 .時,藉由外力將V形壓固件4 1 1 A與4 1 1 B分別地 向兩側鉚平,以固定該底座4 1與側板4 2。在一較佳實施例 中,請參圖五,本創作之鉚合結構係搭配一散熱體5 ,經 組合之後,置於一電腦CPU之上,藉以達到降溫散熱之功 能,並使得CPU可以有更穩定之執行環境。雖然目前製造 鉚合突部4 11之技術有限,可能會造成頂點A、B與A,' B, 之間有一些微之誤差厚度產生,然而,該誤差係遠小於該 側板4 2的厚度,因此並不會造成鉚合之鬆脫。 人 綜上所述’本創作「散熱體鉚合結構之改良」為一合Page 6 4. Creation instructions (3) Fix the base and the side plate. Detailed description and preferred embodiments: The techniques, methods and eight bodies used in the creation to achieve the above-mentioned concept, ... To construct a special feature, I will give you a better and more practical explanation, which will be further disclosed, as detailed below. Ji Pu does not provide an improvement of the riveting structure of the computer CPU heat sink. Please refer to FIG. 4A ′, which includes at least a base 41 and at least one side plate 42. The base 41 has at least a nasal protrusion 411, And the side plates 42 have riveting holes 421 corresponding to the riveting protrusions 411, the riveting protrusions 4 11 pass through the riveting holes 4 2 1, and the riveting is performed by external force. The protrusion 4 1 1 is riveted to the outside of the side plate 4 2 to fix the base 41 and the side plate 42. In particular, please refer to FIG. 4B, the riveting protrusion 411 has two identical ¥ -shaped fasteners 411A and 411B, and the vertices a, A ', B, B' of the V-shaped fasteners 411A and 411B are Located on the same straight line, when the riveting protrusions 4 丨 j pass through the riveting holes 4 2 1., The V-shaped pressing members 4 1 1 A and 4 1 1 B are riveted to both sides by external force. Flat to fix the base 41 and the side plate 42. In a preferred embodiment, please refer to FIG. 5. The riveting structure of this creation is equipped with a heat sink 5. After being combined, it is placed on a computer CPU to achieve the function of cooling and cooling, and the CPU can have More stable execution environment. Although the current technology for manufacturing the riveted protrusion 4 11 is limited, it may cause some slight error thickness between the vertices A, B and A, 'B, but the error is much smaller than the thickness of the side plate 42. Therefore, it does not cause loosening of the riveting. In summary, the "Improvement of the heat sink's riveting structure" is a combination
4f ill4f ill
WmWm
M245463 〜室號91201434 Y七年广月,7曰 修止 四、創作說明(4) 理完^之創作,不僅具備優良之實用性,而且在結構設計 上f ^ 2未有的創新,容許製造公差有較寬之範圍,並同 時能提高製造良率,亦屬突破習知技術窠臼的高度創作, 並非易於思及之單純應用,具進步性;尤其是大量生產時 丄不會因良率的問題而造成成本負擔,因此, ::型專利之各項申請要件,懇,㊣局 :業】: 予應得之新型專利,實為感禱。 〇並賜 限定= = = ;如上,然其並非用以 ;神和範圍内,當;:些;:二’二不:離本創作之 保護範圍當視後附之申請專利範者=本創作之 M245463 案號 91201434 修正 圖式簡單說明 圖一A 圖一B 圖四A 圖四B 圖五M245463 ~ Room No. 91201434 Y Seven Years Wide Moon, 7th Revision Fourth, Creation Instructions (4) Finished ^ creation not only has excellent practicability, but also has no innovation in structural design f ^ 2, allowing manufacturing The tolerance has a wide range, and at the same time, it can improve the manufacturing yield. It is also a highly creative breakthrough of the conventional technology. It is not a simple application that is easy to think about and is progressive. Especially in mass production, it will not be affected by the yield. The cost burden is caused by the problem. Therefore, the various application requirements for ::-patent, sincerely, the bureau: industry]: It is really a prayer to give the new patent due. 〇And given the limit = = =; as above, but it is not used; God and the scope, when; some ;: two 'two no: leave the scope of protection of this creation as the patent applicant attached to this creation = this creation No. M245463 Case No. 91201434 Revised diagram Brief description Figure 1A Figure 1B Figure 4A Figure 4B Figure 5
及三AAnd three A
SB 係為傳統的散熱體鉚合前之結 構圖式; 係為傳統的散熱體鉚合後之結 構圖及其局部圖式; 係本創作的散熱體鉚合前之結 構圖及局部圖式; 係本創作的散熱體鉚合後之結 構圖及局部圖式;以及 係本創作之一實施例之結構圖 式0 主要元件符號說明 散熱體-----------------1、5 底座--------------------11 ^ 側板--------------------12、 鉚合孔洞----------------121 鉚合突部----------------111 壓固件------------------311a 壓固件之頂點------------a、a] B,SB is the structure diagram of the traditional heat sink before riveting; it is the structure diagram of the traditional heat sink after riveting and its partial diagram; is the structure diagram and partial diagram of the heat sink before riveting created by this author; It is the structure drawing and partial drawing of the radiating body created by this creation; and the structural drawing 0 of an embodiment of this creation. The main component symbols explain the radiating body -------------- --- 1, 5 base -------------------- 11 ^ side plate -------------------- 12, riveting holes ---------------- 121 riveting protrusions ---------------- 111 pressing fixture ----- ------------- 311a Vertex of firmware ------------ a, a] B,
21 '31 '41 22 '32 '42 ^221 ^321 >421 211 '311 ^411 、311b 、411A 、411B 、b、b, 、A、A, 、B21 '31 '41 22 '32 '42 ^ 221 ^ 321 > 421 211 '311 ^ 411, 311b, 411A, 411B, b, b ,, A, A ,, B
第9頁Page 9
Claims (1)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW091201434U TWM245463U (en) | 2002-02-06 | 2002-02-06 | Improved riveting structure of heat dissipating body |
US10/358,217 US20030217836A1 (en) | 2002-02-06 | 2003-02-05 | Riveted bond structure for heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW091201434U TWM245463U (en) | 2002-02-06 | 2002-02-06 | Improved riveting structure of heat dissipating body |
Publications (1)
Publication Number | Publication Date |
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TWM245463U true TWM245463U (en) | 2004-10-01 |
Family
ID=29547139
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW091201434U TWM245463U (en) | 2002-02-06 | 2002-02-06 | Improved riveting structure of heat dissipating body |
Country Status (2)
Country | Link |
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US (1) | US20030217836A1 (en) |
TW (1) | TWM245463U (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111659803B (en) * | 2019-03-08 | 2022-05-17 | 富联精密电子(天津)有限公司 | Riveting structure |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4176823A (en) * | 1977-10-07 | 1979-12-04 | Ranco Incorporated | Butterfly valve |
US5666988A (en) * | 1996-02-06 | 1997-09-16 | Siemens Electric Limited | Throttle shaft and plate construction |
US6244332B1 (en) * | 1999-12-17 | 2001-06-12 | Flextek Components, Inc. | Heat sink |
DE10012781A1 (en) * | 2000-03-16 | 2001-09-27 | Boellhoff Gmbh | Connection arrangement for attaching a fastener to a component |
-
2002
- 2002-02-06 TW TW091201434U patent/TWM245463U/en not_active IP Right Cessation
-
2003
- 2003-02-05 US US10/358,217 patent/US20030217836A1/en not_active Abandoned
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US20030217836A1 (en) | 2003-11-27 |
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