TWI844223B - Touch data detection system and touch chip with digital audio signal transmission function - Google Patents

Abstract

本發明揭示一種觸控數據檢測系統，用以透過觸控數據檢測及分析的方式對具有一數位音頻信號轉換電路的一TDDI晶片進行功能驗證。該觸控數據檢測系統包括：一探測針、一電光轉換單元、一數位音頻數據採集單元、以及一信號處理與分析單元。執行觸控數據檢測時，該探測針僅需連接TDDI晶片的一個腳位，即可將該數位音頻信號轉換電路的一第一數位音頻信號傳送到一電光轉換單元，且該電光轉換單元對應地輸出一光信號。接著，該數位音頻數據採集單元依一採樣頻率對該光信號進行數據採集，使該信號處理與分析單元能夠自該數位音頻數據採集單元接收一第二數位音頻信號，從而對該第二數位音頻信號執行一觸控數據分析以實現對於該TDDI晶片的功能驗證。The present invention discloses a touch data detection system for performing functional verification on a TDDI chip having a digital audio signal conversion circuit by means of touch data detection and analysis. The touch data detection system comprises: a probe, an electro-optical conversion unit, a digital audio data acquisition unit, and a signal processing and analysis unit. When performing touch data detection, the probe only needs to be connected to a pin of the TDDI chip to transmit a first digital audio signal of the digital audio signal conversion circuit to an electro-optical conversion unit, and the electro-optical conversion unit outputs an optical signal accordingly. Then, the digital audio data acquisition unit performs data acquisition on the optical signal at a sampling frequency, so that the signal processing and analysis unit can receive a second digital audio signal from the digital audio data acquisition unit, thereby performing a touch data analysis on the second digital audio signal to achieve functional verification of the TDDI chip.

Description

觸控數據檢測系統及具有數位音頻信號發送功能的觸控晶片Touch data detection system and touch chip with digital audio signal transmission function

本發明為觸控晶片之驗證檢測的有關領域，尤指一種用於檢測觸控顯示整合晶片之觸控數據檢測系統。The present invention relates to the field of touch chip verification and testing, and more particularly to a touch data testing system for testing a touch display integrated chip.

圖1顯示利用COG封裝技術進行整合之觸控顯示面板模組以及TDDI(touch and display driver integration；觸控顯示整合)晶片的上視圖，且圖2顯示利用COF封裝技術進行整合之觸控顯示面板模組以及TDDI晶片的上視圖。如圖1與圖2所示，目前，智慧型手機的顯示螢幕已朝向全屏設計發展，故而必須利用COF(或COG)封裝技術將至少一個TDDI晶片12a和一觸控顯示面板模組11a進行整合，而後透過至少一柔性電路板(Flexible Printed Circuit , PFC)14a與設有一主機處理器(即，應用處理器)的一主板耦接。進一步地說明，TDDI為觸控與顯示驅動整合(Touch and display driver integration)之英文縮寫，COF為薄膜覆晶封裝(Chip On Film)之英文縮寫，且COG為玻璃覆晶(Chip on glass, COG)封裝之英文縮寫。更詳細地說明，TDDI晶片12a包含一顯示驅動電路、一觸控檢測電路以及一數位電路，為一種於數位類比混合晶片，因此其具有數量眾多的晶片腳位(即，Pin腳)，故而具有狹長的晶片外觀。FIG1 shows a top view of a touch display panel module and a TDDI (touch and display driver integration) chip integrated using COG packaging technology, and FIG2 shows a top view of a touch display panel module and a TDDI chip integrated using COF packaging technology. As shown in FIG1 and FIG2, currently, the display screen of a smart phone has developed toward a full-screen design, so it is necessary to use COF (or COG) packaging technology to integrate at least one TDDI chip 12a and a touch display panel module 11a, and then couple them to a mainboard having a host processor (i.e., application processor) through at least one flexible printed circuit (PFC) 14a. To further explain, TDDI is the abbreviation of Touch and Display Driver Integration, COF is the abbreviation of Chip On Film, and COG is the abbreviation of Chip on Glass (COG). To explain in more detail, the TDDI chip 12a includes a display driver circuit, a touch detection circuit, and a digital circuit, and is a digital-analog hybrid chip, so it has a large number of chip pins (i.e., pins), and thus has a narrow chip appearance.

圖3顯示習知的用於檢測TDDI晶片的觸控檢測數據之系統的架構圖。正常工作時，TDDI晶片12a以其觸控檢測電路自觸控面板的接收觸控感測信號(即，類比信號)，接著以其數位電路將類比形式的觸控感測信號轉換成一數位信號。因此，在TDDI晶片12a的開發測試階段，為了驗證數位電路的功能是否符合需求，必須將所述數位信號經由多工器(或稱，多路複用器)傳送到TDDI晶片12a的GPIO腳位，然後利用邏輯分析儀(Logic analyzer)2a或示波器來觀測這些信號的高低電平變化。因此，需要觀測的數位信號有幾個，TDDI晶片12a就必須撘載對應數量的GPIO腳位，最終導致TDDI晶片12a的封裝Pin腳不夠用。FIG3 shows a schematic diagram of a known system for detecting touch detection data of a TDDI chip. In normal operation, the TDDI chip 12a receives a touch sensing signal (i.e., an analog signal) from a touch panel using its touch detection circuit, and then converts the analog touch sensing signal into a digital signal using its digital circuit. Therefore, during the development and testing phase of the TDDI chip 12a, in order to verify whether the function of the digital circuit meets the requirements, the digital signal must be transmitted to the GPIO pin of the TDDI chip 12a via a multiplexer (or multiplexer), and then the high and low level changes of these signals are observed using a logic analyzer 2a or an oscilloscope. Therefore, if there are several digital signals that need to be observed, the TDDI chip 12a must carry a corresponding number of GPIO pins, which ultimately results in insufficient package pins of the TDDI chip 12a.

此外，如圖3所示，使用邏輯分析儀2a對TDDI晶片12a之數位電路進行邏輯功能之驗證分析時，通常必須將探測針3a扎在柔性電路板14a之上，原因在於無法在採用COF封裝或COG封裝的TDDI晶片12a找到適合位置連接其GPIO腳位。可想而知，想要同時觀測多個數位信號，就必須將多個探測針3a同時扎在柔性電路板14a之上，這對於實現TDDI晶片12a之邏輯功能驗證而言，顯然並不方便。In addition, as shown in FIG3 , when using a logic analyzer 2a to verify the logic function of the digital circuit of the TDDI chip 12a, the probe needle 3a must usually be inserted on the flexible circuit board 14a because it is impossible to find a suitable position to connect the GPIO pins of the TDDI chip 12a that adopts COF packaging or COG packaging. It is conceivable that if you want to observe multiple digital signals at the same time, you must insert multiple probe needles 3a on the flexible circuit board 14a at the same time, which is obviously inconvenient for realizing the logic function verification of the TDDI chip 12a.

應知道，TDDI晶片12a係利用分時多工方式來分別進行顯示驅動和觸控檢測，即，在顯示區間進行顯示驅動，且在消隱(blanking)區間時進行觸控檢測。現有的TDDI晶片12a的觸控檢測數據之檢測流程而言，通常會使用串行編碼(SPI)介面將TDDI晶片12a之觸控檢測通道的檢測數據送到外部。執行SPI數據傳輸時，TDDI晶片12a會將觸控面板之一幀觸控檢測數據儲存到SRAM中，接著再透過SPI介面將整幀的觸控檢測數據一次傳輸至外部。然而，這種做法在實務上產生了缺陷。It should be known that the TDDI chip 12a uses time-division multiplexing to perform display driving and touch detection separately, that is, display driving is performed in the display area, and touch detection is performed in the blanking area. As for the detection process of the touch detection data of the existing TDDI chip 12a, a serial bitstream (SPI) interface is usually used to send the detection data of the touch detection channel of the TDDI chip 12a to the outside. When executing SPI data transmission, the TDDI chip 12a will store one frame of touch detection data of the touch panel into SRAM, and then transmit the entire frame of touch detection data to the outside at once through the SPI interface. However, this approach has defects in practice.

更詳細地說明，相對於時序控制晶片(Tcon)與應用處理器晶片屬於上位機(Master device)，TDDI晶片12a是一種從設備(Slave device)。因此，TDDI晶片12a必須接收由上位機所發起的命令，才可以利用其SPI介面向上位機傳送數據(如：一幀觸控檢測數據)。換句話說，作為從設備的TDDI晶片12a，發送數據的時候，需要上位機的參與。目前，手機屏幕的顯示幀率除了常見的60Hz，還有高速模式到120Hz的需求，而TDDI晶片12a係利用分時多工方式來分別進行顯示驅動和觸控檢測，即在顯示區間進行顯示驅動，且在消隱(blanking)區間時進行觸控檢測。故而，為了在高顯示幀率下不影響正常觸控掃描，實務上係有必要在TDDI晶片12a規劃一個特定電路，用於顯示驅動的時間段內對RawData(即，觸控檢測數據)和觸控掃描狀態進行合理編碼，然後上傳給上位機。To explain in more detail, compared to the timing control chip (Tcon) and the application processor chip which belong to the host computer (Master device), the TDDI chip 12a is a slave device (Slave device). Therefore, the TDDI chip 12a must receive commands initiated by the host computer before it can use its SPI interface to transmit data (such as: a frame of touch detection data) to the host computer. In other words, as a slave device, the TDDI chip 12a requires the participation of the host computer when sending data. At present, in addition to the common 60Hz display frame rate of mobile phone screens, there is also a demand for high-speed mode up to 120Hz, and the TDDI chip 12a uses time-division multiplexing to perform display drive and touch detection separately, that is, display drive is performed in the display area, and touch detection is performed in the blanking area. Therefore, in order not to affect the normal touch scanning at a high display frame rate, it is necessary to plan a specific circuit in the TDDI chip 12a to reasonably encode the RawData (i.e., touch detection data) and touch scanning status during the display drive time period, and then upload them to the host computer.

由上述說明可知，本領域亟需一種新式的觸控數據檢測系統。From the above description, it can be seen that a new touch data detection system is urgently needed in this field.

本發明之主要目的在於提供一種觸控數據檢測系統，用以透過觸控數據檢測及分析的方式對具有一數位音頻信號轉換電路的一TDDI晶片進行功能驗證。該觸控數據檢測系統包括：一探測針、一電光轉換單元、一數位音頻數據採集單元、以及一信號處理與分析單元。執行觸控數據檢測時，該探測針僅需連接TDDI晶片的一個腳位，即可將該數位音頻信號轉換電路的一第一數位音頻信號傳送到一電光轉換單元，且該電光轉換單元對應地輸出一光信號。接著，該數位音頻數據採集單元依一採樣頻率對該光信號進行數據採集，使該信號處理與分析單元能夠自該數位音頻數據採集單元接收一第二數位音頻信號，從而對該第二數位音頻信號執行一觸控數據分析以實現對於該TDDI晶片的功能驗證。The main purpose of the present invention is to provide a touch data detection system for functional verification of a TDDI chip having a digital audio signal conversion circuit by means of touch data detection and analysis. The touch data detection system includes: a probe, an electro-optical conversion unit, a digital audio data acquisition unit, and a signal processing and analysis unit. When performing touch data detection, the probe only needs to be connected to a pin of the TDDI chip to transmit a first digital audio signal of the digital audio signal conversion circuit to an electro-optical conversion unit, and the electro-optical conversion unit outputs an optical signal accordingly. Then, the digital audio data acquisition unit acquires data of the optical signal at a sampling frequency, so that the signal processing and analysis unit can receive a second digital audio signal from the digital audio data acquisition unit, thereby performing a touch data analysis on the second digital audio signal to achieve functional verification of the TDDI chip.

值得說明的是，前述之數位音頻信號為SPDIF信號，因此其最大信號長度可達32bits，使得觸控數據檢測系統能夠一次性地將觸控面板之一幀觸控檢測數據自SRAM讀出，而能夠有效降低MCU占用率。值得說明的是，習知技術利用邏輯分析儀(Logic analyzer)2a或示波器連接TDDI晶片的多個GPIO腳位，導致TDDI晶片的封裝腳位不夠用。本發明之觸控數據檢測系統的設計使信號處理與分析單元易於進行數據紀錄及抓錯(debug)，同時，在整個觸控數據檢測分析過程中，探測針也僅需連接TDDI晶片的一個腳位，不僅極小化了TDDI晶片的封裝腳位數目，也使檢測工序大幅簡化。It is worth noting that the aforementioned digital audio signal is an SPDIF signal, so its maximum signal length can reach 32 bits, so that the touch data detection system can read one frame of touch detection data of the touch panel from the SRAM at one time, which can effectively reduce the MCU occupancy rate. It is worth noting that the prior art uses a logic analyzer (Logic analyzer)2a or an oscilloscope to connect multiple GPIO pins of the TDDI chip, resulting in insufficient package pins of the TDDI chip. The design of the touch data detection system of the present invention makes it easy for the signal processing and analysis unit to record data and debug. At the same time, during the entire touch data detection and analysis process, the probe needle only needs to connect to one pin of the TDDI chip, which not only minimizes the number of package pins of the TDDI chip, but also greatly simplifies the detection process.

為達成上述目的，本發明提出用於對TDDI晶片進行觸控數據檢測的一種觸控數據檢測系統之一實施例；其中，該TDDI晶片自一觸控顯示面板模組接收一觸控感測信號從而將該觸控感測信號轉換為一數位信號，且具有一數位音頻信號轉換電路用以依一目標工作頻率將該數位信號轉換為一第一數位音頻信號；所述觸控數據檢測系統包括：To achieve the above object, the present invention proposes an embodiment of a touch data detection system for performing touch data detection on a TDDI chip; wherein the TDDI chip receives a touch sensing signal from a touch display panel module and converts the touch sensing signal into a digital signal, and has a digital audio signal conversion circuit for converting the digital signal into a first digital audio signal according to a target operating frequency; the touch data detection system includes:

一探測針，耦接至該TDDI晶片的一測試腳位；A probe needle coupled to a test pin of the TDDI chip;

一電光轉換單元，係透過一傳輸單元而耦接該探測針，從而透過該探測針自該測試腳位接收所述第一數位音頻信號，且進一步地將該第一數位音頻信號轉換為一光信號；an electro-optical conversion unit coupled to the probe needle through a transmission unit, thereby receiving the first digital audio signal from the test pin through the probe needle, and further converting the first digital audio signal into an optical signal;

一數位音頻數據採集單元，耦接該傳輸單元，用以依一採樣頻率對該光信號進行數據採集，從而對應地輸出一第二數位音頻信號；其中，該目標工作頻率為該採樣頻率的複數倍；以及a digital audio data acquisition unit, coupled to the transmission unit, for acquiring data from the optical signal at a sampling frequency, thereby correspondingly outputting a second digital audio signal; wherein the target operating frequency is a multiple of the sampling frequency; and

一信號處理與分析單元，耦接該數位音頻數據採集單元，用以接收由該數位音頻數據採集單元所傳送的該第二數位音頻信號，從而對該第二數位音頻信號執行一觸控數據分析以實現對於該TDDI晶片的功能驗證。A signal processing and analysis unit is coupled to the digital audio data acquisition unit and is used to receive the second digital audio signal transmitted by the digital audio data acquisition unit, thereby performing a touch data analysis on the second digital audio signal to achieve functional verification of the TDDI chip.

在一實施例中，該第一數位音頻信號為一SPDIF信號，且該測試腳位為選自於由通用型輸入輸出(GPIO)腳位和快閃記憶體(flash)存取腳位所組成群組之中的一種晶片腳位。In one embodiment, the first digital audio signal is a SPDIF signal, and the test pin is a chip pin selected from the group consisting of a general purpose input and output (GPIO) pin and a flash memory access pin.

在一實施例中，對應於所述數位信號的一信號長度，該第一數位音頻信號具有選自於由8bits、12bits、和16bits所組成群組之中的一信號長度。In one embodiment, corresponding to a signal length of the digital signal, the first digital audio signal has a signal length selected from the group consisting of 8 bits, 12 bits, and 16 bits.

在一實施例中，對應該第一數位音頻信號之該信號長度，該第二數位音頻信號具有選自於由16bits、24bits、和32bits所組成群組之中的一信號長度。In one embodiment, corresponding to the signal length of the first digital audio signal, the second digital audio signal has a signal length selected from the group consisting of 16 bits, 24 bits, and 32 bits.

在一實施例中， 該採樣頻率為192KHz，且該傳輸單元為選自於由RCA數位同軸線、BNC數位同軸線或光纖纜線所組成群組之中的一種信號傳輸線。In one embodiment, the sampling frequency is 192KHz, and the transmission unit is a signal transmission line selected from the group consisting of RCA digital coaxial cable, BNC digital coaxial cable or optical fiber cable.

在一實施例中，該信號處理與分析單元為一電腦主機，且該數位音頻數據採集單元係以一內插卡或一外接裝置的形式耦接該信號處理與分析單元。In one embodiment, the signal processing and analysis unit is a computer host, and the digital audio data acquisition unit is coupled to the signal processing and analysis unit in the form of an add-in card or an external device.

為達成上述目的，本發明進一步提出一種觸控數據檢測系統，其係用以對一TDDI晶片進行觸控數據檢測，該觸控數據檢測系統包括：To achieve the above object, the present invention further provides a touch data detection system for performing touch data detection on a TDDI chip. The touch data detection system includes:

一電光轉換單元，用以透過該TDDI晶之一測試腳位接收一第一數位音頻信號，並將該第一數位音頻信號轉換為一光信號，其中該第一數位音頻信號係依一觸控感測信號產生；an electro-optical conversion unit, for receiving a first digital audio signal through a test pin of the TDDI crystal and converting the first digital audio signal into an optical signal, wherein the first digital audio signal is generated according to a touch sensing signal;

一數位音頻數據採集單元，用以依一採樣頻率對該光信號進行數據採集以產生一第二數位音頻信號；以及a digital audio data acquisition unit for acquiring data from the optical signal at a sampling frequency to generate a second digital audio signal; and

一信號處理與分析單元，用以對該第二數位音頻信號進行一觸控數據分析程序以實現對該TDDI晶片的觸控功能驗證。A signal processing and analysis unit is used to perform a touch data analysis procedure on the second digital audio signal to realize touch function verification of the TDDI chip.

本發明同時揭示一種觸控晶片，其係由如前述之TDDI晶片實現以利用該觸控數據檢測系統進行所述的觸控數據檢測，且其包含一顯示驅動電路、一觸控檢測電路與一數位電路；其特徵在於，所述TDDI晶片進一步包含一數位音頻信號轉換單元，其包括：The present invention also discloses a touch chip, which is implemented by the aforementioned TDDI chip to perform the touch data detection using the touch data detection system, and includes a display drive circuit, a touch detection circuit and a digital circuit; the feature of the touch chip is that the TDDI chip further includes a digital audio signal conversion unit, which includes:

一多路複用器，耦接該數位電路的一類比數位轉換單元、一數位濾波器和一隨機存取記憶體；a multiplexer coupled to an analog-to-digital conversion unit, a digital filter and a random access memory of the digital circuit;

一非同步FIFO暫存器，耦接該多路複用器；an asynchronous FIFO register coupled to the multiplexer;

一工作頻率調整單元，耦接一系統時鐘信號，用以依一小數分頻比對該系統時鐘信號執行一小數分頻處理，從而產生具有一目標工作頻率的一時鐘信號；以及an operating frequency adjustment unit coupled to a system clock signal for performing a fractional frequency division process on the system clock signal according to a fractional frequency division ratio, thereby generating a clock signal having a target operating frequency; and

一數據編碼器，耦接該時鐘信號與該非同步FIFO暫存器；a data encoder coupled to the clock signal and the asynchronous FIFO register;

其中，該類比數位轉換單元將由該觸控檢測電路所傳送的一觸控感測信號轉換成一第一數位信號，且該第一數位信號由該數位濾波器濾波處理成一第二數位信號以儲存在該隨機存取記憶體之中。The analog-to-digital conversion unit converts a touch sensing signal transmitted by the touch detection circuit into a first digital signal, and the first digital signal is filtered by the digital filter to be a second digital signal to be stored in the random access memory.

在一實施例中，該第一數位音頻信號為一SPDIF信號，且該測試腳位為選自於由通用型輸入輸出腳位和快閃記憶體存取腳位所組成群組之中的一種晶片腳位。In one embodiment, the first digital audio signal is an SPDIF signal, and the test pin is a chip pin selected from the group consisting of a general-purpose input and output pin and a flash memory access pin.

在一實施例中， 該小數分頻比為該系統時鐘信號的一系統工作頻率與該目標工作頻率的比值。In one embodiment, the fractional frequency ratio is a ratio of a system operating frequency of the system clock signal to the target operating frequency.

在一實施例中， 該多路複用器還耦接該觸控檢測電路和一控制狀態信號。In one embodiment, the multiplexer is also coupled to the touch detection circuit and a control status signal.

為使  貴審查委員能進一步瞭解本發明之結構、特徵、目的、與其優點，茲附以圖式及較佳具體實施例之詳細說明如後。In order to enable the Review Committee to further understand the structure, features, purpose, and advantages of the present invention, the following are attached with drawings and detailed descriptions of preferred specific embodiments.

本發明主要揭示一種用於檢測觸控晶片之觸控數據檢測系統，特別是一種用於檢測一TDDI晶片之觸控數據檢測系統。特別地，該TDDI晶片具有一數位音頻信號轉換電路可以將接收自一觸控顯示模組的一觸控感測信號轉換成一SPDIF信號。在此情況下，本發明之觸控數據檢測系統只需要以一個探測針連接該TDDI晶片的一測試腳位(如GPIO pin或flash pin)，就可以將該SPDIF信號取出後傳送至後端的信號處理與分析單元(如PC)。由於SPDIF信號的最大信號長度可達32bits，使得本發明之觸控數據檢測系統能夠一次性地將一幀觸控檢測數據自TDDI晶片的SRAM之中讀出，因而能夠有效降低MCU占用率。再者，本發明之觸控數據檢測系統的設計使信號處理與分析單元易於進行數據紀錄及抓錯(debug)。The present invention mainly discloses a touch data detection system for detecting a touch chip, and in particular, a touch data detection system for detecting a TDDI chip. In particular, the TDDI chip has a digital audio signal conversion circuit that can convert a touch sensing signal received from a touch display module into an SPDIF signal. In this case, the touch data detection system of the present invention only needs to connect a test pin (such as a GPIO pin or a flash pin) of the TDDI chip with a probe needle, and then the SPDIF signal can be taken out and transmitted to a back-end signal processing and analysis unit (such as a PC). Since the maximum signal length of the SPDIF signal can reach 32 bits, the touch data detection system of the present invention can read a frame of touch detection data from the SRAM of the TDDI chip at one time, thereby effectively reducing the MCU occupancy rate. Furthermore, the design of the touch data detection system of the present invention makes it easy for the signal processing and analysis unit to perform data recording and debugging.

圖4顯示本發明之一種觸控數據檢測系統的架構圖。如圖4所示，智慧型手機的顯示螢幕已朝向全屏設計發展，故而必須利用COF(或COG)封裝技術將至少一個TDDI晶片22和一觸控顯示面板模組21進行整合，而後透過至少一柔性電路板24與設有一主機處理器(即，應用處理器)的一主板耦接。FIG4 shows a structure diagram of a touch data detection system of the present invention. As shown in FIG4, the display screen of a smart phone has developed towards a full-screen design, so it is necessary to use COF (or COG) packaging technology to integrate at least one TDDI chip 22 and a touch display panel module 21, and then couple them with a mainboard having a host processor (i.e., application processor) through at least one flexible circuit board 24.

本發明之觸控數據檢測系統1用於對一TDDI晶片22進行觸控數據檢測，其中該TDDI晶片22自一觸控顯示面板模組21接收一觸控感測信號從而將該觸控感測信號轉換為一數位信號，且具有一數位音頻信號轉換電路用以依一目標工作頻率(例如：24.576MHz)將該數位信號轉換為一第一數位音頻信號(即，SPDIF信號)。如圖4所示，本發明之觸控數據檢測系統1包括：耦接至該TDDI晶片22的一測試腳位的一探測針11、一電光轉換單元12、一數位音頻數據採集單元13、以及一信號處理與分析單元14。該電光轉換單元12，例如為光纖晶片(Digital audio interfaces including fiber optic inter-connections)，其係透過一傳輸單元而耦接該探測針11，從而透過該探測針11自該測試腳位接收所述第一數位音頻信號，且進一步地將該第一數位音頻信號轉換為一光信號。應可理解，由於所述第一數位音頻信號為一SPDIF信號，因此，用於傳送SPDIF信號之傳輸單元可以是RCA數位同軸線、BNC數位同軸線或光纖纜線。The touch data detection system 1 of the present invention is used to perform touch data detection on a TDDI chip 22, wherein the TDDI chip 22 receives a touch sensing signal from a touch display panel module 21 to convert the touch sensing signal into a digital signal, and has a digital audio signal conversion circuit to convert the digital signal into a first digital audio signal (i.e., SPDIF signal) according to a target operating frequency (e.g., 24.576MHz). As shown in FIG4 , the touch data detection system 1 of the present invention includes: a probe 11 coupled to a test pin of the TDDI chip 22, an electro-optical conversion unit 12, a digital audio data acquisition unit 13, and a signal processing and analysis unit 14. The electro-optical conversion unit 12, such as a fiber optic chip (Digital audio interfaces including fiber optic inter-connections), is coupled to the probe 11 through a transmission unit, thereby receiving the first digital audio signal from the test pin through the probe 11, and further converting the first digital audio signal into an optical signal. It should be understood that since the first digital audio signal is an SPDIF signal, the transmission unit used to transmit the SPDIF signal can be an RCA digital coaxial cable, a BNC digital coaxial cable, or an optical cable.

如圖4所示，該數位音頻數據採集單元13耦接該傳輸單元，用以依一採樣頻率(Sampling rate)對該光信號進行數據採集，從而對應地輸出一第二數位音頻信號。其中，該目標工作頻率為該採樣頻率的X倍。例如，採樣頻率為192KHz且X=128，則目標工作頻率為192*128=24.576MHz。更詳細地說明，該信號處理與分析單元14耦接該數位音頻數據採集單元13，用以接收由該數位音頻數據採集單元13所傳送的該第二數位音頻信號，從而對該第二數位音頻信號執行一觸控數據分析以實現對於該TDDI晶片22的功能驗證。在一實施例中，該信號處理與分析單元14為一電腦主機，且該數位音頻數據採集單元13可以內插卡(如PCI卡)或外接裝置(如透過USB外接裝置)之形式耦接該信號處理與分析單元14。並且，該信號處理與分析單元14安裝有一自行設計的軟體，用以進行收集、記錄並且圖形化顯示數位音頻數據採集單元13收集到的數據(即，第二數位音頻信號)。進行數據收集與紀錄時，軟體可將第二數位音頻信號之左聲道與右聲道數據分開交叉存放。As shown in FIG4 , the digital audio data acquisition unit 13 is coupled to the transmission unit to acquire data from the optical signal at a sampling rate, thereby outputting a second digital audio signal accordingly. The target operating frequency is X times the sampling frequency. For example, if the sampling frequency is 192KHz and X=128, the target operating frequency is 192*128=24.576MHz. To explain in more detail, the signal processing and analysis unit 14 is coupled to the digital audio data acquisition unit 13 to receive the second digital audio signal transmitted by the digital audio data acquisition unit 13, thereby performing a touch data analysis on the second digital audio signal to achieve functional verification of the TDDI chip 22. In one embodiment, the signal processing and analysis unit 14 is a computer host, and the digital audio data acquisition unit 13 can be coupled to the signal processing and analysis unit 14 in the form of an internal card (such as a PCI card) or an external device (such as through a USB external device). Furthermore, the signal processing and analysis unit 14 is equipped with a self-designed software for collecting, recording and graphically displaying the data (i.e., the second digital audio signal) collected by the digital audio data acquisition unit 13. When collecting and recording data, the software can store the left channel and right channel data of the second digital audio signal separately and crosswise.

應可理解，TDDI晶片22所能夠處理的觸控感測信號之信號長度會因為應用產品的而有所不同，例如：小尺寸屏幕的智慧型手機和大尺寸屏幕的智慧型手機。因此，在TDDI晶片22內部的數位電路將所述觸控感測信號轉換成一數位信號之後，對應於所述數位信號的信號長度，該第一數位音頻信號(即，SPDIF信號)之信號長度可以為8bits、12bits、或16bits。在此情況下，為了讓所述第二數位音頻信號能夠以其左聲道數據區間與右聲數據區間交叉裝載由觸控感測信號轉換而成數位信號，因此，對應該第一數位音頻信號之信號長度，該第二數位音頻信號之信號長度可以為16bits、24bits、或32bits。It should be understood that the signal length of the touch sensing signal that the TDDI chip 22 can process will vary depending on the application product, such as a small-screen smartphone and a large-screen smartphone. Therefore, after the digital circuit inside the TDDI chip 22 converts the touch sensing signal into a digital signal, the signal length of the first digital audio signal (i.e., SPDIF signal) can be 8 bits, 12 bits, or 16 bits, corresponding to the signal length of the digital signal. In this case, in order to allow the second digital audio signal to be cross-loaded with its left channel data interval and right channel data interval converted from the touch sensing signal into a digital signal, the signal length of the second digital audio signal can be 16 bits, 24 bits, or 32 bits corresponding to the signal length of the first digital audio signal.

為了詳加解釋接收自觸控顯示模組的觸控感測如何被轉換成SPDIF信號，下文將繼續說明該TDDI晶片22內部的數位音頻信號轉換電路。圖5顯示TDDI晶片22內部的一觸控檢測電路、一數位電路與一數位音頻信號轉換電路的方塊圖。如圖4與圖5所示，包含於TDDI晶片22內部的數位音頻信號轉換單元221包括：一多路複用器2211、一非同步FIFO暫存器2212、一工作頻率調整單元2213、以及一數據編碼器2214。其中，該多路複用器2211耦接該觸控檢測電路222與該TDDI晶片22內部的一控制狀態信號，其中該控制狀態信號用以傳送一當前觸控掃描順序、當前觸控掃描幀數、當前顯示行數等信息至該多路複用器2211。並且，如圖5所示，該多路複用器2211還同時耦接該數位電路220的一類比數位轉換單元2201、一數位濾波器2202和一隨機存取記憶體2203。In order to explain in detail how the touch sensing received from the touch display module is converted into an SPDIF signal, the digital audio signal conversion circuit inside the TDDI chip 22 will be described below. FIG5 shows a block diagram of a touch detection circuit, a digital circuit, and a digital audio signal conversion circuit inside the TDDI chip 22. As shown in FIG4 and FIG5, the digital audio signal conversion unit 221 included in the TDDI chip 22 includes: a multiplexer 2211, an asynchronous FIFO register 2212, an operating frequency adjustment unit 2213, and a data encoder 2214. The multiplexer 2211 couples the touch detection circuit 222 and a control state signal inside the TDDI chip 22, wherein the control state signal is used to transmit information such as a current touch scan sequence, a current touch scan frame number, and a current display line number to the multiplexer 2211. Moreover, as shown in FIG5 , the multiplexer 2211 is also coupled to an analog-to-digital conversion unit 2201, a digital filter 2202, and a random access memory 2203 of the digital circuit 220.

可以理解，如圖5所示，依據所述控制狀態信號，該多路複用器2211選擇性地將由該觸控檢測電路222所傳送的觸控感測信號、由該類比數位轉換單元2201所傳送的第一數位信號、由該數位濾波器2202所傳送的第二數位信號、或存取自該隨即存取記憶體(SRAM)2203的第三數位信號輸出至該非同步FIFO暫存器2212。換句話說，利用探測針11連接該TDDI晶片22的測試腳位22P可以選擇檢測所述第一數位信號從而驗證類比數位轉換單元2201之電路功能是否正常。另一方面，如圖5所示，在所述控制狀態信號的控制下，該多路複用器2211可選擇所述第二數位信號輸出至該非同步FIFO暫存器2212，最終透過檢測第一數位音頻信號可以驗證所述第二數位信號(即，濾波過後的第一數位信號)的雜訊是否降到可容忍的範圍內，若有必要則可以調整數位濾波器2202之濾波器參數，使所述第二數位信號符合規範。It can be understood that, as shown in FIG5 , according to the control state signal, the multiplexer 2211 selectively outputs the touch sensing signal transmitted by the touch detection circuit 222, the first digital signal transmitted by the analog-to-digital conversion unit 2201, the second digital signal transmitted by the digital filter 2202, or the third digital signal accessed from the random access memory (SRAM) 2203 to the asynchronous FIFO register 2212. In other words, the test pin 22P of the TDDI chip 22 connected to the probe needle 11 can selectively detect the first digital signal to verify whether the circuit function of the analog-to-digital conversion unit 2201 is normal. On the other hand, as shown in FIG5 , under the control of the control status signal, the multiplexer 2211 can select the second digital signal to be output to the asynchronous FIFO register 2212. Ultimately, by detecting the first digital audio signal, it can be verified whether the noise of the second digital signal (i.e., the first digital signal after filtering) is reduced to a tolerable range. If necessary, the filter parameters of the digital filter 2202 can be adjusted to make the second digital signal meet the specifications.

如圖5所示，該非同步FIFO暫存器2212耦接該多路複用器2211和該數據編碼器2214，且該工作頻率調整單元2213耦接該TDDI晶片22內部的一系統時鐘信號，用以依一小數分頻比對該系統時鐘信號執行一小數分頻處理，從而產生具有一目標工作頻率的一時鐘信號。舉例而言，目標工作頻率為192*128=24.576MHz且該系統時鐘信號的一系統工作頻率為96MHz，則所述小數分頻比為96/24.576=3.90625。亦即，對原系統時鐘信號(system clock)進行3.9分頻(或稱39/10分頻)，以產生供後端的數據編碼器2214執行編碼轉換時可作為基準的一時鐘信號，該時鐘信號具有所述目標工作頻率。As shown in FIG5 , the asynchronous FIFO register 2212 is coupled to the multiplexer 2211 and the data encoder 2214, and the operating frequency adjustment unit 2213 is coupled to a system clock signal inside the TDDI chip 22, for performing a fractional frequency division process on the system clock signal according to a fractional frequency division ratio, thereby generating a clock signal with a target operating frequency. For example, if the target operating frequency is 192*128=24.576MHz and a system operating frequency of the system clock signal is 96MHz, then the fractional frequency division ratio is 96/24.576=3.90625. That is, the original system clock signal is divided by 3.9 (or 39/10) to generate a clock signal that can be used as a reference when the back-end data encoder 2214 performs coding conversion, and the clock signal has the target operating frequency.

更詳細地說明，該數據編碼器2214耦接該時鐘信號與該非同步FIFO暫存器2212。由圖5可知，該類比數位轉換單元2201將由該觸控檢測電路所傳送的一觸控感測信號轉換成一第一數位信號，且該第一數位信號由該數位濾波器2202濾波處理成一第二數位信號以儲存在該隨機存取記憶體2203之中。因此，在使用多路複用器2211的情況下，可以選擇讓由該觸控檢測電路222所傳送的觸控感測信號、由該類比數位轉換單元2201所傳送的第一數位信號、由該數位濾波器2202所傳送的第二數位信號、或存取自該隨即存取記憶體(SRAM)2203的第三數位信號經由非同步FIFO暫存器2212傳送至該數據編碼器2214。舉例而言，該數據編碼器2214透過該多路複用器2211和該非同步FIFO暫存器2212接收所述第二數位信號，從而依所述目標工作頻率將該第二數位信號轉換為一第一數位音頻信號(即，SPIDF信號)，而後透過該TDDI晶片22的一測試腳位22P輸出所述第一數位音頻信號。 In more detail, the data encoder 2214 is coupled to the clock signal and the asynchronous FIFO register 2212. As shown in FIG5 , the analog-to-digital conversion unit 2201 converts a touch sensing signal transmitted by the touch detection circuit into a first digital signal, and the first digital signal is filtered by the digital filter 2202 to be a second digital signal to be stored in the random access memory 2203. Therefore, when using the multiplexer 2211, the touch sensing signal transmitted by the touch detection circuit 222, the first digital signal transmitted by the analog-to-digital conversion unit 2201, the second digital signal transmitted by the digital filter 2202, or the third digital signal accessed from the random access memory (SRAM) 2203 can be selected to be transmitted to the data encoder 2214 via the asynchronous FIFO register 2212. For example, the data encoder 2214 receives the second digital signal through the multiplexer 2211 and the asynchronous FIFO register 2212, thereby converting the second digital signal into a first digital audio signal (i.e., SPIDF signal) according to the target operating frequency, and then outputs the first digital audio signal through a test pin 22P of the TDDI chip 22.

補充說明的是，SPDIF全名為Sony/Philips Digital Interconnect Format，是Sony和Philips所定制出來的一種數位信號傳輸介面，其基於IEC 60958標準來規範信號編碼與傳輸形式。其中，IEC 60958 TYPE 2 Unbalanced使用RCA數位同軸線進行信號傳輸，而IEC 60958 TYPE 2 Optical使用光纖纜線進行信號傳輸。更進一步地說明，基於IEC 60958標準的SPDIF數位信號傳輸介面在在傳輸資料時使用雙向雙相符號編碼(Biphase Mark Code)，簡稱BMC，屬於一種相位調制(phase modulation)的編碼方法，是將時鐘信號和資料信號混合在一起傳輸的編碼方法。圖6即顯示時鐘信號、資料信號(即，第二數位信號)和經過BMC編碼的第一數位音頻信號的工作時序圖。 It should be noted that the full name of SPDIF is Sony/Philips Digital Interconnect Format, which is a digital signal transmission interface customized by Sony and Philips. It is based on the IEC 60958 standard to regulate signal encoding and transmission form. Among them, IEC 60958 TYPE 2 Unbalanced uses RCA digital coaxial cable for signal transmission, while IEC 60958 TYPE 2 Optical uses optical fiber cable for signal transmission. To further explain, the SPDIF digital signal transmission interface based on the IEC 60958 standard uses bidirectional biphase mark coding (Biphase Mark Code), abbreviated as BMC, when transmitting data. It is a phase modulation coding method, which is a coding method that mixes clock signals and data signals together for transmission. Figure 6 shows the working timing diagram of the clock signal, the data signal (i.e., the second digital signal) and the first digital audio signal encoded by BMC.

另一方面，圖7顯示圖5之TDDI晶片內部的工作頻率調整單元2213的電路架構圖。由前述說明可知，若目標工作頻率為192*128=24.576MHz且系統時鐘信號的系統工作頻率為96MHz，則所述小數分頻比為96/24.576=3.90625。亦即，對原系統時鐘信號(system clock)進行39/10分頻，以產生供後端的數據編碼器2214執行編碼轉換時可作為基準的一時鐘信號(具有所述目標工作頻率)。如圖7所示，工作頻率調整單元2213包括一第一多路復用器22M1、一第二多路復用器22M2、一小數計數器22D1、一第三多路復用器22M3、一整數計數器22D2、一加法器22A1、一減法器22S1、一檢測器22B1，一門控時鐘單元(clock gating)22P1、以及一時鐘信號源221S。 On the other hand, FIG7 shows the circuit architecture of the operating frequency adjustment unit 2213 inside the TDDI chip of FIG5. As can be seen from the above description, if the target operating frequency is 192*128=24.576MHz and the system operating frequency of the system clock signal is 96MHz, then the fractional frequency division ratio is 96/24.576=3.90625. That is, the original system clock signal (system clock) is divided by 39/10 to generate a clock signal (having the target operating frequency) that can be used as a reference when the back-end data encoder 2214 performs coding conversion. As shown in FIG. 7 , the operating frequency adjustment unit 2213 includes a first multiplexer 22M1, a second multiplexer 22M2, a fractional counter 22D1, a third multiplexer 22M3, an integer counter 22D2, an adder 22A1, a subtractor 22S1, a detector 22B1, a clock gating unit 22P1, and a clock signal source 221S.

請同時參閱圖8，其顯示小數分頻處理之整數部分和小數部分的累加計數器的寄存數據(裝載值)的工作時序圖。在小數分頻處理中，3為整數(integer)，9為小數(fraction)亦為分子(numerator)，且10為分母(Denominator)。工作頻率調整單元2213正常工作時，加法器22A1對一寄存器執行條件碼(Cond)和整數部分的值進行加法運算。其中，若該小數計數器22D1的輸出值(frac_cnt)與小數部分的值之和大於分母的值，則Cond=1；反之，則Cond=0。 Please refer to Figure 8, which shows the operation timing diagram of the register data (load value) of the cumulative counter of the integer part and the fractional part of the fractional frequency division processing. In the fractional frequency division processing, 3 is an integer, 9 is a fraction (fraction) and also a numerator, and 10 is a denominator. When the operating frequency adjustment unit 2213 works normally, the adder 22A1 performs an addition operation on a register execution condition code (Cond) and the value of the integer part. Among them, if the sum of the output value (frac_cnt) of the fractional counter 22D1 and the value of the fractional part is greater than the value of the denominator, then Cond=1; otherwise, Cond=0.

如圖7與圖8所示，在執行小數分頻處理的過程中，該整數計數器22D2對整數部分由3→2→1→0逐一倒數，到0之後再重新裝載所述整數部分，然後再對整數部分由3→2→1→0逐一倒數，依此不斷重複前述動作。並且，在執行小數分頻處理的過程中，減法器22S1對該整數計數器22D2的輸出值與一輸出碼0x1進行減法運算。應可理解，輸出碼0x1表示十六進制數值1。另一方面，在執行小數分頻處理的過程中，加法器22A1對Cond和整數(值)-1進行加法運算。值得說明的是，當該整數計數器22D2對整數部分由3倒數到0的時候，該整數計數器22D2的輸出值為0，此時檢測器22B1的檢測結果為“真”，從而該門控單元22P1作動以將該時鐘信號源221S的一系統時鐘信號輸出為一時鐘信號(具有目標工作頻率24.576MH)。 As shown in FIG. 7 and FIG. 8 , in the process of executing the fractional frequency division processing, the integer counter 22D2 counts down the integer part from 3→2→1→0 one by one, and reloads the integer part after reaching 0, and then counts down the integer part from 3→2→1→0 one by one, and repeats the above-mentioned actions continuously. In addition, in the process of executing the fractional frequency division processing, the subtractor 22S1 performs a subtraction operation on the output value of the integer counter 22D2 and an output code 0x1. It should be understood that the output code 0x1 represents a hexadecimal value 1. On the other hand, in the process of executing the fractional frequency division processing, the adder 22A1 performs an addition operation on Cond and the integer (value) -1. It is worth noting that when the integer counter 22D2 counts down from 3 to 0 for the integer part, the output value of the integer counter 22D2 is 0, and the detection result of the detector 22B1 is "true", so the gating unit 22P1 is activated to output the system clock signal of the clock signal source 221S as a clock signal (with a target operating frequency of 24.576MH).

如圖7與圖8所示，在每一次該檢測器22B1的檢測結果為真的時候，該小數計數器22D1對分子部分減1，如9-1=8。並且，當小數計數器的輸出值(如，8)與小數部分(或稱分子部分)的值的一加和值大於分母的值時，則必須自該加和值之中減掉分母的值，如8+9-10。相反地，當加和值不大於分母的值時，則鎖存目前的加和值。為了實現前述工作內容，該第一多路復用器22M1耦接該檢測器的輸出端、所述加和值、所述加和值和分母的值之間的一減差值、以及所述寄存器執行條件碼(Cond)。並且，該第二多路復用器22M2耦接該第一多路復用器22M1的輸出值以及該小數計數器22D1的輸出值。 As shown in FIG. 7 and FIG. 8 , each time the detection result of the detector 22B1 is true, the decimal counter 22D1 subtracts 1 from the numerator, such as 9-1=8. Furthermore, when the sum of the output value of the decimal counter (e.g., 8) and the value of the decimal part (or numerator) is greater than the value of the denominator, the value of the denominator must be subtracted from the sum, such as 8+9-10. On the contrary, when the sum is not greater than the value of the denominator, the current sum is latched. In order to implement the aforementioned working content, the first multiplexer 22M1 couples the output terminal of the detector, the sum, a subtraction difference between the sum and the value of the denominator, and the register execution condition code (Cond). Furthermore, the second multiplexer 22M2 is coupled to the output value of the first multiplexer 22M1 and the output value of the fractional counter 22D1.

換句話說，圖7與圖8所示，減法器22S1、加法器22A1以及第三多路復用器22M3用以在執行小數分頻處理的過程中實現對於整數部分的值的規律性調整(即，3→2→1→0)。另一方面，第一多路復用器22M1和第二多路復用器22M2以及小數計數器22D1則用以在所述加和值不大於分母的值之時，鎖存所述加和值。如此，如圖7與圖8所示，所述工作頻率調整單元2213會依據系統時鐘信號(具有系統工作頻率96MHz)而產生時鐘信號(具有目標工作頻率24.576MHz)。 In other words, as shown in FIG7 and FIG8, the subtractor 22S1, the adder 22A1 and the third multiplexer 22M3 are used to implement regular adjustment of the value of the integer part (i.e., 3→2→1→0) during the fractional frequency division process. On the other hand, the first multiplexer 22M1 and the second multiplexer 22M2 and the fractional counter 22D1 are used to latch the sum value when the sum value is not greater than the value of the denominator. Thus, as shown in FIG7 and FIG8, the operating frequency adjustment unit 2213 generates a clock signal (having a target operating frequency of 24.576MHz) according to the system clock signal (having a system operating frequency of 96MHz).

如此，上述已完整且清楚地說明本發明之一種觸控數據檢測系統；並且，經由上述可得知本發明具有下列優點：Thus, the above has completely and clearly described a touch data detection system of the present invention; and, from the above, it can be known that the present invention has the following advantages:

(1)本發明主要揭示一種觸控數據檢測系統，用以透過觸控數據檢測及分析的方式對具有一數位音頻信號轉換電路的一TDDI晶片進行功能驗證。本發明之觸控數據檢測系統包括：一探測針、一電光轉換單元、一數位音頻數據採集單元、以及一信號處理與分析單元。執行觸控數據檢測時，該數位音頻信號轉換電路將一觸控感測信號轉換成一第一數位音頻信號，且該電光轉換單元透過該探測針自該TDDI晶片的一腳位接收所述第一數位音頻信號，並對應地輸出一光信號。接著，該數位音頻數據採集單元依一採樣頻率對該光信號進行數據採集，使該信號處理與分析單元14能夠自該數位音頻數據採集單元接收一第二數位音頻信號，從而對該第二數位音頻信號執行一觸控數據分析以實現對於該TDDI晶片的功能驗證。(1) The present invention mainly discloses a touch data detection system for performing functional verification on a TDDI chip having a digital audio signal conversion circuit by means of touch data detection and analysis. The touch data detection system of the present invention comprises: a probe, an electro-optical conversion unit, a digital audio data acquisition unit, and a signal processing and analysis unit. When performing touch data detection, the digital audio signal conversion circuit converts a touch sensing signal into a first digital audio signal, and the electro-optical conversion unit receives the first digital audio signal from a pin of the TDDI chip through the probe, and outputs an optical signal accordingly. Next, the digital audio data acquisition unit acquires data from the optical signal at a sampling frequency, so that the signal processing and analysis unit 14 can receive a second digital audio signal from the digital audio data acquisition unit, thereby performing a touch data analysis on the second digital audio signal to achieve functional verification of the TDDI chip.

(2)值得說明的是，前述之數位音頻信號為SPDIF信號，因此其最大信號長度可達32bits，使得觸控數據檢測系統能夠一次性地將觸控面板之一幀觸控檢測數據自SRAM讀出，而能夠有效降低MCU占用率。再者，本發明之觸控數據檢測系統的設計使信號處理與分析單元易於進行數據紀錄及抓錯(debug)，同時，在整個觸控數據檢測分析過程中，探測針也僅需連接TDDI晶片的一個腳位。(2) It is worth noting that the aforementioned digital audio signal is an SPDIF signal, so its maximum signal length can reach 32 bits, so that the touch data detection system can read one frame of touch detection data of the touch panel from the SRAM at one time, which can effectively reduce the MCU occupancy rate. Furthermore, the design of the touch data detection system of the present invention makes it easy for the signal processing and analysis unit to record data and debug. At the same time, during the entire touch data detection and analysis process, the probe only needs to connect to one pin of the TDDI chip.

(3)TDDI晶片內部的數位電路至少包含類比數位轉換單元以及數位濾波器，利用本發明之觸控數據檢測系統可以在僅使用一根探測針的情況下，檢測該類比數位轉換單元所輸出的第一數位信號及/或該數位濾波器所輸出的第二數位信號，藉此方式驗證、調整該類比數位轉換單元和該數位濾波器。(3) The digital circuit inside the TDDI chip at least includes an analog-to-digital conversion unit and a digital filter. The touch data detection system of the present invention can detect the first digital signal output by the analog-to-digital conversion unit and/or the second digital signal output by the digital filter using only one probe needle, thereby verifying and adjusting the analog-to-digital conversion unit and the digital filter.

必須加以強調的是，前述本案所揭示者乃為較佳實施例，舉凡局部之變更或修飾而源於本案之技術思想而為熟習該項技藝之人所易於推知者，俱不脫本案之專利權範疇。It must be emphasized that what is disclosed in the above-mentioned case is a preferred embodiment. Any partial changes or modifications that are derived from the technical ideas of this case and are easily inferred by people familiar with the art do not deviate from the scope of the patent rights of this case.

綜上所陳，本案無論目的、手段與功效，皆顯示其迥異於習知技術，且其首先發明合於實用，確實符合發明之專利要件，懇請  貴審查委員明察，並早日賜予專利俾嘉惠社會，是為至禱。In summary, this case shows that its purpose, means and effects are very different from the known technology, and it is the first invention that is practical and indeed meets the patent requirements for invention. We sincerely request the review committee to examine this carefully and grant a patent as soon as possible to benefit the society. This is our utmost prayer.

11a:觸控顯示面板模組 12a:TDDI晶片 14a:柔性電路板 2a:邏輯分析儀 3a:探測針 1:觸控數據檢測系統 11:探測針 12:電光轉換單元 13:數位音頻數據採集單元 14:信號處理與分析單元 21:觸控顯示面板模組 22:TDDI晶片 220:數位電路 2201:類比數位轉換單元 2202:數位濾波器 2203:隨機存取記憶體 221:數位音頻信號轉換單元 2211:多路複用器 2212:非同步FIFO暫存器 2213:工作頻率調整單元 2214:數據編碼器 222:觸控檢測電路 22P:測試腳位 24:柔性電路板 22M1:第一多路復用器 22M2:第二多路復用器 22M3:第三多路復用器 22D1:小數計數器 22D2:整數計數器 22A1:加法器 22S1:減法器 22B1:檢測器 22P1:門控時鐘單元 221S:時鐘信號源 11a: Touch display panel module 12a: TDDI chip 14a: Flexible circuit board 2a: Logic analyzer 3a: Probe 1: Touch data detection system 11: Probe 12: Electro-optical conversion unit 13: Digital audio data acquisition unit 14: Signal processing and analysis unit 21: Touch display panel module 22: TDDI chip 220: Digital circuit 2201: Analog-to-digital conversion unit 2202: Digital filter 2203: Random access memory 221: Digital audio signal conversion unit 2211: Multiplexer 2212: Asynchronous FIFO register 2213: Operating frequency adjustment unit 2214: Data encoder 222: Touch detection circuit 22P: Test pin 24: Flexible circuit board 22M1: First multiplexer 22M2: Second multiplexer 22M3: Third multiplexer 22D1: Fractional counter 22D2: Integer counter 22A1: Adder 22S1: Subtractor 22B1: Detector 22P1: Gated clock unit 221S: Clock signal source

圖1為習知的利用COG封裝技術進行整合之一觸控顯示面板模組及一TDDI晶片的上視圖； 圖2為習知的利用COF封裝技術進行整合之一觸控顯示面板模組及一TDDI晶片的上視圖； 圖3為習知的用於檢測TDDI晶片的觸控檢測數據之系統的架構圖； 圖4為本發明之一種觸控數據檢測系統的架構圖； 圖5為本發明之一TDDI晶片內部的一觸控檢測電路、一數位電路與一數位音頻信號轉換電路的方塊圖； 圖6為時鐘信號、第二數位信號)和經過BMC編碼的第一數位音頻信號的工作時序圖； 圖7為圖5之TDDI晶片內部的工作頻率調整單元的電路架構圖；以及 圖8為小數分頻處理之整數部分和小數部分的累加計數器的寄存數據(裝載值)的工作時序圖。 FIG. 1 is a top view of a touch display panel module and a TDDI chip integrated by using COG packaging technology; FIG. 2 is a top view of a touch display panel module and a TDDI chip integrated by using COF packaging technology; FIG. 3 is a structural diagram of a system for detecting touch detection data of a TDDI chip; FIG. 4 is a structural diagram of a touch data detection system of the present invention; FIG. 5 is a block diagram of a touch detection circuit, a digital circuit and a digital audio signal conversion circuit inside a TDDI chip of the present invention; FIG. 6 is a working timing diagram of a clock signal, a second digital signal) and a first digital audio signal encoded by BMC; FIG7 is a circuit diagram of the operating frequency adjustment unit inside the TDDI chip of FIG5; and FIG8 is a working timing diagram of the register data (load value) of the cumulative counter of the integer part and the fractional part of the fractional frequency division processing.

1:觸控數據檢測系統 1: Touch data detection system

11:探測針 11: Probe needle

12:電光轉換單元 12: Electro-optical conversion unit

13:數位音頻數據採集單元 13: Digital audio data acquisition unit

14:信號處理與分析單元 14: Signal processing and analysis unit

21:觸控顯示面板模組 21: Touch display panel module

22:TDDI晶片 22: TDDI chip

22P:測試腳位 22P: Test foot position

24:柔性電路板 24: Flexible circuit board

Claims (11)

一種觸控數據檢測系統，用以對包含一顯示驅動電路、一觸控檢測電路、一數位電路及一數位音頻信號轉換單元的一TDDI晶片進行一觸控數據檢測操作，且其包括：一探測針，耦接至該TDDI晶片的一測試腳位；一電光轉換單元，係透過一傳輸單元而耦接該探測針，從而透過該探測針自該測試腳位接收一第一數位音頻信號，且進一步地將該第一數位音頻信號轉換為一光信號；一數位音頻數據採集單元，耦接該傳輸單元，用以依一採樣頻率對該光信號進行數據採集，從而對應地輸出一第二數位音頻信號；以及一信號處理與分析單元，耦接該數位音頻數據採集單元，用以接收由該數位音頻數據採集單元所傳送的該第二數位音頻信號，從而對該第二數位音頻信號執行一觸控數據分析以實現對於該TDDI晶片的觸控功能驗證。 A touch data detection system is used to perform a touch data detection operation on a TDDI chip including a display drive circuit, a touch detection circuit, a digital circuit and a digital audio signal conversion unit, and comprises: a probe needle coupled to a test pin of the TDDI chip; an electro-optical conversion unit coupled to the probe needle through a transmission unit, thereby receiving a first digital audio signal from the test pin through the probe needle, and further converting the first digital audio signal into an optical signal. a digital audio data acquisition unit coupled to the transmission unit for collecting data on the optical signal at a sampling frequency, thereby correspondingly outputting a second digital audio signal; and a signal processing and analysis unit coupled to the digital audio data acquisition unit for receiving the second digital audio signal transmitted by the digital audio data acquisition unit, thereby performing a touch data analysis on the second digital audio signal to implement touch function verification of the TDDI chip. 如請求項1所述之觸控數據檢測系統，其中，該第一數位音頻信號為一SPDIF信號，且該測試腳位為選自於由通用型輸入輸出腳位和快閃記憶體存取腳位所組成群組之中的一種晶片腳位。 A touch data detection system as described in claim 1, wherein the first digital audio signal is an SPDIF signal, and the test pin is a chip pin selected from a group consisting of a general-purpose input/output pin and a flash memory access pin. 如請求項1所述之觸控數據檢測系統，其中，該第一數位音頻信號具有選自於由8bits、12bits、和16bits所組成群組之中的一信號長度。 A touch data detection system as described in claim 1, wherein the first digital audio signal has a signal length selected from the group consisting of 8 bits, 12 bits, and 16 bits. 如請求項3所述之觸控數據檢測系統，其中，對應該第一數位音頻信號之該信號長度，該第二數位音頻信號具有選自於由16bits、24bits、和32bits所組成群組之中的一信號長度。 A touch data detection system as described in claim 3, wherein, corresponding to the signal length of the first digital audio signal, the second digital audio signal has a signal length selected from the group consisting of 16 bits, 24 bits, and 32 bits. 如如請求項1所述之觸控數據檢測系統，其中，該採樣頻率為192KHz，且該傳輸單元為選自於由RCA數位同軸線、BNC數位同軸線或光纖纜線所組成群組之中的一種信號傳輸線。 A touch data detection system as described in claim 1, wherein the sampling frequency is 192KHz, and the transmission unit is a signal transmission line selected from the group consisting of RCA digital coaxial cable, BNC digital coaxial cable or optical fiber cable. 如請求項1所述之觸控數據檢測系統，其中，該信號處理與分析單元為一電腦主機，且該數位音頻數據採集單元係以一內插卡或一外接裝置的形式耦接該信號處理與分析單元。 A touch data detection system as described in claim 1, wherein the signal processing and analysis unit is a computer host, and the digital audio data acquisition unit is coupled to the signal processing and analysis unit in the form of an internal card or an external device. 一種觸控數據檢測系統，用於對一TDDI晶片進行觸控數據檢測，該觸控數據檢測系統包括：一電光轉換單元，用以透過該TDDI晶片之一測試腳位接收一第一數位音頻信號，並將該第一數位音頻信號轉換為一光信號，其中該第一數位音頻信號係依一觸控感測信號產生；一數位音頻數據採集單元，用以依一採樣頻率對該光信號進行數據採集以產生一第二數位音頻信號；以及一信號處理與分析單元，用以對該第二數位音頻信號進行一觸控數據分析程序以實現對該TDDI晶片的觸控功能驗證。 A touch data detection system is used to perform touch data detection on a TDDI chip. The touch data detection system includes: an electro-optical conversion unit, which is used to receive a first digital audio signal through a test pin of the TDDI chip and convert the first digital audio signal into an optical signal, wherein the first digital audio signal is generated according to a touch sensing signal; a digital audio data acquisition unit, which is used to perform data acquisition on the optical signal according to a sampling frequency to generate a second digital audio signal; and a signal processing and analysis unit, which is used to perform a touch data analysis procedure on the second digital audio signal to realize touch function verification of the TDDI chip. 一種觸控晶片，其係由如請求項1至7中任一項所述之TDDI晶片實現以利用該觸控數據檢測系統進行所述的觸控數據檢測，且其包含一顯示驅動電路、一觸控檢測電路、一數位電路及一數位音頻信號轉換單元，該數位音頻信號轉換單元包括：一多路複用器，耦接該數位電路的一類比數位轉換單元、一數位濾波器和一隨機存取記憶體；一非同步FIFO暫存器，耦接該多路複用器；一工作頻率調整單元，耦接一系統時鐘信號，用以依一小數分頻比對該系統時鐘信號執行一小數分頻處理，從而產生具有一目標工作頻率的一時鐘信號；以及一數據編碼器，耦接該時鐘信號與該非同步FIFO暫存器；其中，該類比數位轉換單元將由該觸控檢測電路所傳送的一觸控感測信號轉換成一第一數位信號，且該第一數位信號由該數位濾波器濾波處理成一第二數位信號以儲存在該隨機存取記憶體之中。 A touch chip is implemented by a TDDI chip as described in any one of claims 1 to 7 to perform the touch data detection using the touch data detection system, and includes a display drive circuit, a touch detection circuit, a digital circuit and a digital audio signal conversion unit, the digital audio signal conversion unit includes: a multiplexer, an analog-to-digital conversion unit coupled to the digital circuit, a digital filter and a random access memory; an asynchronous FIFO register coupled to the multiplexer; an operating frequency modulation The whole unit is coupled to a system clock signal to perform a fractional frequency division process on the system clock signal according to a fractional frequency division comparison, thereby generating a clock signal with a target operating frequency; and a data encoder is coupled to the clock signal and the asynchronous FIFO register; wherein the analog-to-digital conversion unit converts a touch sensing signal transmitted by the touch detection circuit into a first digital signal, and the first digital signal is filtered by the digital filter into a second digital signal to be stored in the random access memory. 如請求項8所述之觸控晶片，其中，該第一數位音頻信號為一SPDIF信號，且該測試腳位為選自於由通用型輸入輸出腳位和快閃記憶體存取腳位所組成群組之中的一種晶片腳位。 A touch chip as described in claim 8, wherein the first digital audio signal is an SPDIF signal, and the test pin is a chip pin selected from a group consisting of a general-purpose input/output pin and a flash memory access pin. 如請求項8所述之觸控晶片，其中，該小數分頻比為該系統時鐘信號的一系統工作頻率與該目標工作頻率的比值。 A touch control chip as described in claim 8, wherein the fractional frequency ratio is the ratio of a system operating frequency of the system clock signal to the target operating frequency. 如請求項8所述之觸控晶片，其中，該多路複用器還耦接該觸控檢測電路和一控制狀態信號。 A touch chip as described in claim 8, wherein the multiplexer also couples the touch detection circuit and a control status signal.

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