TWI830480B - 緩衝墊結構 - Google Patents
緩衝墊結構 Download PDFInfo
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- TWI830480B TWI830480B TW111142125A TW111142125A TWI830480B TW I830480 B TWI830480 B TW I830480B TW 111142125 A TW111142125 A TW 111142125A TW 111142125 A TW111142125 A TW 111142125A TW I830480 B TWI830480 B TW I830480B
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- Prior art keywords
- fiber cloth
- layer
- cushion structure
- layers
- composite fiber
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- 239000004744 fabric Substances 0.000 claims abstract description 181
- 239000000835 fiber Substances 0.000 claims abstract description 139
- 239000002131 composite material Substances 0.000 claims abstract description 76
- 238000005187 foaming Methods 0.000 claims abstract description 45
- 238000011084 recovery Methods 0.000 claims abstract description 15
- 230000006835 compression Effects 0.000 claims abstract description 3
- 238000007906 compression Methods 0.000 claims abstract description 3
- 239000012210 heat-resistant fiber Substances 0.000 claims description 35
- 238000007731 hot pressing Methods 0.000 claims description 33
- 230000003014 reinforcing effect Effects 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 19
- 229920001971 elastomer Polymers 0.000 claims description 12
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 12
- 239000005060 rubber Substances 0.000 claims description 12
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 11
- 229910052731 fluorine Inorganic materials 0.000 claims description 11
- 239000011737 fluorine Substances 0.000 claims description 11
- 229920002379 silicone rubber Polymers 0.000 claims description 10
- 239000004945 silicone rubber Substances 0.000 claims description 10
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 9
- 229920002530 polyetherether ketone Polymers 0.000 claims description 9
- -1 polytetrafluoroethylene Polymers 0.000 claims description 9
- 230000002787 reinforcement Effects 0.000 claims description 9
- 238000005096 rolling process Methods 0.000 claims description 9
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 8
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 8
- 239000002033 PVDF binder Substances 0.000 claims description 6
- 230000003139 buffering effect Effects 0.000 claims description 5
- 239000003365 glass fiber Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 10
- 239000000758 substrate Substances 0.000 description 24
- 230000000052 comparative effect Effects 0.000 description 22
- 230000000694 effects Effects 0.000 description 15
- 238000010438 heat treatment Methods 0.000 description 15
- 239000000203 mixture Substances 0.000 description 13
- 239000004088 foaming agent Substances 0.000 description 9
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 8
- 239000011152 fibreglass Substances 0.000 description 8
- 239000008096 xylene Substances 0.000 description 8
- 229920001973 fluoroelastomer Polymers 0.000 description 6
- 238000004364 calculation method Methods 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 229920000784 Nomex Polymers 0.000 description 4
- 239000006260 foam Substances 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 239000004763 nomex Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
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- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- ICGLPKIVTVWCFT-UHFFFAOYSA-N 4-methylbenzenesulfonohydrazide Chemical compound CC1=CC=C(S(=O)(=O)NN)C=C1 ICGLPKIVTVWCFT-UHFFFAOYSA-N 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
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- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 2
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- 238000001035 drying Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
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- ICXAPFWGVRTEKV-UHFFFAOYSA-N 2-[4-(1,3-benzoxazol-2-yl)phenyl]-1,3-benzoxazole Chemical compound C1=CC=C2OC(C3=CC=C(C=C3)C=3OC4=CC=CC=C4N=3)=NC2=C1 ICXAPFWGVRTEKV-UHFFFAOYSA-N 0.000 description 1
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 description 1
- 229910000013 Ammonium bicarbonate Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000012538 ammonium bicarbonate Nutrition 0.000 description 1
- 239000001099 ammonium carbonate Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
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- 230000007613 environmental effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
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- OAKJQQAXSVQMHS-UHFFFAOYSA-N hydrazine Substances NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000002832 nitroso derivatives Chemical class 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
本發明公開一種緩衝墊結構,緩衝墊結構包括:發泡中間層以及兩個複合纖維布層。發泡中間層設置於兩個複合纖維布層之間,每一複合纖維布層是由耐熱纖維布以及蓬鬆紗纖維布所製成,耐熱纖維布通過針軋方式與蓬鬆紗纖維布結合。緩衝墊結構於190°C的溫度下熱壓的緩衝率大於30%,緩衝墊結構於190°C的溫度下熱壓的復原率大於95%。
Description
本發明涉及一種緩衝墊結構,特別是涉及一種可多次使用的緩衝墊結構。
製造銅箔基板(copper clad laminate,CCL)或印刷多層板的過程中,一般會使用熱壓機進行成型作業,並於機台與基板之間設置熱壓緩衝墊,做為緩衝,以達到保護基板的效果。
隨著基板薄型化的趨勢,對基板表面的平整均勻性的要求也逐漸提高,熱壓緩衝墊需具有更佳的緩衝特性及耐熱效果,才可保有競爭性。另外,為了因應環保需求,相關技術領域也期望熱壓緩衝墊的熱壓使用次數可以提升,以避免浪費。
現有的熱壓緩衝墊,一般是使用牛皮紙,或使用膠合劑(例如:橡膠)接合有機纖維或無機纖維(例如:不織布)而製成。然而,現有的熱壓緩衝墊的緩衝效果有限,且可承受的熱壓次數較低(約200至300次)。因此,市面上期許提供一種熱壓緩衝墊,具有良好的耐熱性與緩衝效果,且可重複使用多次。
本發明所要解決的技術問題在於,針對現有技術的不足提供一種緩衝墊結構。
為了解決上述的技術問題,本發明所採用的其中一技術方案是提供一種緩衝墊結構。緩衝墊結構包括發泡中間層與兩個複合纖維布層。發泡中間層設置於兩個複合纖維布層之間,每一複合纖維布層是由耐熱纖維布及蓬鬆紗纖維布所製成,耐熱纖維布通過針軋方式與蓬鬆紗纖維布結合。緩衝墊結構於190°C的溫度下熱壓的緩衝率大於30%,緩衝墊結構於190°C的溫度下熱壓的復原率大於95%。
於一些實施例中,蓬鬆紗纖維布中的蓬鬆紗集中設置於耐熱纖維布的多個節點上,蓬鬆紗纖維布是玻璃纖維蓬鬆紗纖維布。
於一些實施例中,兩層蓬鬆紗纖維布與一層耐熱纖維布構成一個疊層單位,耐熱纖維布設置於兩層蓬鬆紗纖維布之間。
於一些實施例中,複合纖維布層與發泡中間層的厚度比值為0.5至0.9。
於一些實施例中,發泡中間層是以熱壓合的方式設置於複合纖維布層上。
於一些實施例中,發泡中間層的發泡倍率為0.6至3.0。
於一些實施例中,發泡中間層的材料是選自於由下列所構成的群組:矽橡膠、氟橡膠、聚偏二氟乙烯及聚醚醚酮。
於一些實施例中,緩衝墊結構進一步包括:兩個表面補強層,兩個表面補強層分別設置於兩個複合纖維布層上,使得發泡中間層與兩個複合纖維布層設置於兩個表面補強層之間。
於一些實施例中,表面補強層的材料是選自於由下列所構成的群組:聚四氟乙烯、聚偏二氟乙烯、氟橡膠及聚醚醚酮。
本發明的其中一有益效果在於,本發明所提供的緩衝墊結構,其能通過“緩衝墊結構具有發泡中間層”以及“複合纖維布層是由耐熱纖維布及蓬鬆紗纖維布所製成”的技術方案,以提升緩衝墊結構的緩衝及熱壓使用次數效果。
為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本發明加以限制。
以下是通過特定的具體實施例來說明本發明所公開有關“緩衝墊結構”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。
[第一實施例]
請參閱圖1所示,本發明第一實施例提供一種用於銅箔基板或印刷多層板熱壓成型的緩衝墊結構,其為三層結構。本發明的緩衝墊結構具有良好的緩衝性,可承受的熱壓次數大於300次(甚至可達400次至600次),且特別適用於250°C以下的熱壓製程。
如圖1所示,緩衝墊結構包括發泡中間層10以及兩個複合纖維布層20。發泡中間層10與兩個複合纖維布層20可通過熱壓合的方式,形成一體化的結構。發泡中間層10具有相對的第一表面11以及第二表面12,且兩個複合纖維布層20分別設置於第一表面11以及第二表面12上。
於一示範實施例中,發泡中間層10是由一發泡組成物,經發泡製程而形成。發泡組成物中包括:100重量份至80重量份的樹脂材料、10重量份至5重量份的溶劑、0.1重量份至1重量份的發泡劑與0.1重量份至3重量份的導熱粒子。溶劑可以是甲苯、二甲苯或小分子矽油。發泡劑可以是偶氮化合物(例如:偶氮二異丁腈)、醯肼合物(例如:對甲苯磺醯肼(p-toluenesulfonyl hydrazide,TSH))、亞硝基化合物或胺基化合物(例如:尿素或碳酸氫銨)。或者,也可導入壓縮氣體或是可溶性氣體,以物理性方式進行發泡。導熱粒子可以是導熱碳黑、導熱石墨、奈米氮化矽鎂、奈米碳化矽、奈米氮化鋁、奈米氮化硼、高純度球形氧化鋁、奈米氮化矽或其組合,但本發明不以此為限。
發泡中間層10的樹脂材料為是選自於由下列所構成的群組:矽橡膠、氟橡膠、聚偏二氟乙烯(polyvinylidene difluoride,PVDF)及聚醚醚酮(polyetheretherketone,PEEK)。詳細來說,樹脂材料的分子量可以為30000 g/mol至100000 g/mol。
通過調整發泡組成物的成分含量以及發泡製程中的參數,發泡中間層10的發泡倍率可以控制為0.6至3.0,例如0.7、0.9、1.1、1.3、1.5、1.7、1.9、2.1、2.3、2.5、2.7或2.9。若發泡倍率過高,過多的空氣層會使緩衝墊結構的導熱效果降低,且緩衝墊結構的緩衝率會有結構強度不足的問題。若發泡倍率過低,又無法有效提升緩衝墊結構的緩衝率。
於一示範實施例中,發泡中間層10的厚度為1.2毫米至5毫米,例如1.5毫米、2.0毫米、2.5毫米、3.0毫米、3.5毫米、4.0毫米或4.5毫米。若發泡中間層10的厚度太薄,則緩衝墊結構的緩衝效果不佳,若發泡中間層10的厚度太厚,則會導致熱壓效果不佳。
本發明的複合纖維布層20是由耐熱纖維布與蓬鬆紗纖維布(或稱為膨體紗纖維布,bulky fiber cloth)所製成。耐熱纖維布可提升複合纖維布層20的耐熱性,進而增加緩衝墊結構的熱壓使用次數。耐熱纖維布可通過針軋方式與蓬鬆紗纖維布結合,構成一體成型的複合纖維布層20,使複合纖維布層20兼具耐熱、高緩衝以及耐用的特性。
詳細來說,將一層耐熱纖維布設置於兩層蓬鬆紗纖維布之間,以蓬鬆紗纖維布作為夾網,堆疊形成一個疊層單位。另可根據耐熱纖維布的厚度或是產品需求,選擇要將幾個疊層單位,堆疊針軋製成複合纖維布層20。也就是說,複合纖維布層20可包括一個或多個疊層單位。
微觀複合纖維布層20的結構,蓬鬆紗纖維布的蓬鬆紗集中設置於耐熱纖維布的多個節點上(請參閱圖2所示),此為使用平織纖維布無法形成的結構。因此,相較於平織纖維布,本發明的複合纖維布層20更具有良好的耐用性與緩衝性。
詳細來說,每一複合纖維布層20可以包括不只一層蓬鬆紗纖維布。通過針軋的方式,可將多層蓬鬆紗纖維布與耐熱纖維布結合,形成一體成型的結構,達到更佳的緩衝效果。具體來說,蓬鬆紗纖維布可以是玻璃纖維蓬鬆紗纖維布(bulk yarn fiberglass cloth),但本發明不以此為限。
耐熱纖維布可以是由芳香族聚醯胺纖維、聚對苯撐苯並二噁唑纖維(poly-p-phenylene benzobisoxazole,PBO)纖維、聚四氟乙烯纖維、聚醯亞胺纖維、金屬纖維、氮化硼纖維、陶瓷纖維等或石墨纖維所製成。
於一示範實施例中,複合纖維布層20的基重為300 g/cm
3至900 g/cm
3。複合纖維布層20的厚度為0.5毫米至1.5毫米,例如0.6毫米、0.8毫米、1.0毫米、1.2毫米或1.4毫米。若複合纖維布層20的厚度太薄,則緩衝墊結構的緩衝效果不佳,若發泡中間層10的厚度太厚,則會導致熱壓效果不佳。
值得說明的是,本發明特別選用發泡中間層10及含有蓬鬆紗纖維布的複合纖維布層20,可提升緩衝墊結構的耐用性。相較於以往只使用發泡材料的緩衝墊結構而言,本發明設置複合纖維布層20,並搭配特定厚度比例的發泡中間層10,可進一步提升緩衝墊結構的緩衝率與復原率,即便經多次熱壓使用之後,緩衝墊結構仍可具有良好的復原率。
具體來說,本發明調整複合纖維布層20相對於發泡中間層10的厚度比值為0.5至0.9,較佳為0.6至0.8。在此厚度比例下,複合纖維布層20可進一步提升緩衝墊結構的復原率,並可提升緩衝墊結構的耐用性。
當複合纖維布層20相對於發泡中間層10的厚度比值低於0.5時,複合纖維布層20無法對緩衝墊結構提供顯著的改善。當複合纖維布層20相對於發泡中間層10的厚度比值高於0.9時,緩衝墊結構的結構強度會過低,而無法作為緩衝墊結構。
[第二實施例]
請參閱圖3所示,本發明第二實施例提供一種用於銅箔基板或印刷多層板熱壓成型的緩衝墊結構,其為五層結構。第二實施例的緩衝墊結構與第一實施例的緩衝墊結構相似,其差異在於:緩衝墊結構進一步包括兩個表面補強層30。
如圖3所示,發泡中間層10設置於兩個複合纖維布層20之間。兩個表面補強層30可通過熱貼合的方式,分別設置於兩個複合纖維布層20上,形成一體化的結構。也就是說,兩個表面補強層30為緩衝墊結構的最外層,發泡中間層10與兩個複合纖維布層20夾設於兩個表面補強層30之間。
表面補強層30的設置,可提升緩衝墊結構的耐熱效果,還可提升緩衝墊結構表面的平坦性。當本發明的緩衝墊結構用於熱壓基板時,可維持基板熱壓表面的平整性。詳細來說,基板經熱壓後表面的平坦性大於90%(較佳為91%至97%),具體測量方式將於後敘述。
表面補強層30的材料是選自於由下列所構成的群組:聚四氟乙烯、聚偏二氟乙烯、氟橡膠及聚醚醚酮。
於一些實施例中,表面補強層30可以是使用一樹脂組成物經由塗佈、再烘乾的方式形成。當表面補強層30是以塗佈的方式形成時,一部分的樹脂組成物會滲入複合纖維布層20內。因此,當形成表面補強層30之後,緩衝墊結構可具有較佳的耐用性。
於另一些實施例中,表面補強層30也可以是將事先成型的薄膜,熱貼合於複合纖維布層20上而形成。在熱貼合的過程中,一部分的表面補強層30會滲入複合纖維布層20內。因此,當形成表面補強層30之後,緩衝墊結構可具有較佳的耐用性。
舉例來說,表面補強層30可以是將氟橡膠塗佈於複合纖維布層20上,經乾燥後形成。或者,表面補強層30也可以是將聚四氟乙烯玻璃纖維布或聚偏二氟乙烯含浸布,貼合於複合纖維布層20上而形成。
於一示範實施例中,表面補強層30的厚度為0.05毫米至0.2毫米,例如0.06毫米、0.08毫米、0.10毫米、0.12毫米、0.14毫米、0.16毫米或0.18毫米。若表面補強層30的厚度太薄,則難以達到提升緩衝墊結構的表面平坦性的效果,若表面補強層30的厚度太厚,則會導致熱壓效果降低。
為了證實本發明緩衝墊結構的優勢,本發明分別製造了實驗例1至3以及比較例1至3的緩衝墊結構。在實驗例1至3以及比較例1至3中,先根據表1中的成分及條件,分別製備發泡中間層、複合纖維布層以及表面補強層,再以230°C的溫度、30 kg/m
2的壓力進行熱壓合,以製得實驗例1至3與比較例1至3的緩衝墊結構。
[實驗例1]
配製發泡組成物,發泡組成物包含100重量份的矽橡膠、5重量份的二甲苯以及0.1重量份的發泡劑。使用發泡組成物進行發泡,製得發泡倍率為2、厚度為1.6毫米的發泡中間層。
將一層耐熱纖維布置於兩層蓬鬆紗纖維布之間(以蓬鬆紗纖維布作為夾網),作為一個疊層單位。疊層的基重為800克/平方公分、疊層的厚度為1.2毫米。以針軋的方式,結合一個疊層單位的耐熱纖維布與蓬鬆紗纖維布,製得複合纖維布層。
接著,根據第二實施例的結構,依序將一PTFE玻纖布、複合纖維布層、發泡中間層、複合纖維布層以及另一PTFE玻纖布堆疊形成疊層結構,並於230°C的溫度、30 kg/m
2的壓力進行熱壓合,以製得緩衝墊結構。
[實驗例2]
實驗例2的步驟與實驗例1相似,其差異在於:發泡組成物包含100重量份的氟橡膠、5重量份的二甲苯以及0.2重量份的發泡劑。發泡中間層的發泡倍率為1、厚度為2.2毫米。
將一層耐熱纖維布置於兩層蓬鬆紗纖維布之間(以蓬鬆紗纖維布作為夾網),作為一個疊層單位。疊層的基重為600克/平方公分、疊層的厚度為0.9毫米。堆疊兩個疊層單位的耐熱纖維布與蓬鬆紗纖維布,以針軋的方式結合製得複合纖維布層。
接著,依序將一PVDF含浸布、複合纖維布層、發泡中間層、複合纖維布層以及另一PVDF含浸布堆疊形成疊層結構,並於230°C的溫度、30 kg/m
2的壓力進行熱壓合,以製得緩衝墊結構。
[實驗例3]
實驗例3的步驟與實驗例1相似,其差異在於:發泡組成物包含100重量份的聚醚醚酮、5重量份的二甲苯以及0.5重量份的發泡劑。發泡中間層的發泡倍率為0.8、厚度為2.8毫米。
將一層耐熱纖維布置於兩層蓬鬆紗纖維布之間(以蓬鬆紗纖維布作為夾網),作為一個疊層單位。疊層的基重為400克/平方公分、疊層的厚度為0.6毫米。堆疊三個疊層單位的耐熱纖維布與蓬鬆紗纖維布,以針軋的方式結合製得複合纖維布層。
接著,依序將一氟橡膠層、複合纖維布層、發泡中間層、複合纖維布層以及另一氟橡膠層堆疊形成疊層結構,並於230°C的溫度、30 kg/m
2的壓力進行熱壓合,以製得緩衝墊結構。氟橡膠層是由一氟橡膠樹脂所形成,氟橡膠樹脂中包括100重量份的氟橡膠、5重量份的二甲苯及1重量份的發泡劑。
[比較例1]
比較例1的步驟與實驗例1相似,其差異在於:發泡中間層的發泡倍率與厚度不同,複合纖維布層中不包含蓬鬆紗纖維布,且使用不同材料的表面補強層。
詳細來說,比較例1中的發泡組成物包含100重量份的矽橡膠、5重量份的二甲苯以及0.1重量份的發泡劑。使用發泡組成物進行發泡,製得發泡倍率為3、厚度為1.3毫米的發泡中間層。另外,比較例1中的複合纖維布層不包含蓬鬆紗纖維布,只包含基重為1000克/平方公分、厚度為1.5毫米的耐熱纖維布。
[比較例2]
比較例2的步驟與實驗例1相似,其差異在於:發泡中間層的發泡倍率與厚度不同,複合纖維布層中不包含蓬鬆紗纖維布,且使用不同材料的表面補強層。
詳細來說,比較例2中的發泡組成物包含100重量份的矽橡膠、5重量份的二甲苯以及0.1重量份的發泡劑。使用發泡組成物進行發泡,製得發泡倍率為2.5、厚度為1.6毫米的發泡中間層。另外,比較例2中以平織纖維布作為夾網,將一層耐熱纖維布設置於兩層平織纖維布之間,作為一個疊層單位。疊層的基重為800克/平方公分、疊層的厚度為1.2毫米。以針軋的方式結合一個疊層單位的耐熱纖維布與平織纖維布,製得複合纖維布層。
接著,依序將Nomex
®紙、複合纖維布層、發泡中間層、另一複合纖維布層以及另一Nomex
®紙堆疊形成疊層結構,並於230°C的溫度、30 kg/m
2的壓力進行熱壓合,以製得緩衝墊結構。
[比較例3]
比較例3的步驟與實驗例1相似,其差異在於:發泡中間層的發泡倍率與厚度不同,且複合纖維布層中不包含蓬鬆紗纖維布。
詳細來說,比較例2中的發泡組成物包含100重量份的氟橡膠、5重量份的二甲苯以及0.1重量份的發泡劑。使用發泡組成物進行發泡,製得發泡倍率為2、厚度為2.2毫米的發泡中間層。另外,比較例3中以平織纖維布作為夾網,將一層耐熱纖維布設置於兩層平織纖維布之間,作為一個疊層單位。疊層的基重為600克/平方公分、疊層的厚度為0.9毫米。以針軋的方式結合三個疊層單位的耐熱纖維布與平織纖維布,製得複合纖維布層。
接著,依序將複合纖維布層、發泡中間層以及另一複合纖維布層堆疊形成疊層結構,並於230°C的溫度、30 kg/m
2的壓力進行熱壓合,以製得緩衝墊結構。
表1
實驗例 | 比較例 | ||||||
1 | 2 | 3 | 1 | 2 | 3 | ||
發泡中間層 | 樹脂材料 | 矽橡膠 | 氟橡膠 | 聚醚醚酮 | 矽橡膠 | 矽橡膠 | 氟橡膠 |
發泡倍率 | 2 | 1 | 0.8 | 3 | 2.5 | 2 | |
厚度(mm) | 1.6 | 2.2 | 2.8 | 1.3 | 1.6 | 2.2 | |
複合纖維布層 | 夾網材料 | 蓬鬆紗纖維布 | 蓬鬆紗纖維布 | 蓬鬆紗纖維布 | 無 | 平織纖維布 | 平織纖維布 |
基布材料 | 耐熱纖維布 | ||||||
疊層厚度(mm) | 1.2 | 0.9 | 0.6 | 1.5 | 1.2 | 0.9 | |
疊層基重(克/平方公分) | 800 | 600 | 400 | 1000 | 800 | 600 | |
疊層數量 | 1 | 2 | 3 | 1 | 1 | 3 | |
複合纖維布層/發泡中間層的厚度比 | 0.75 | 0.82 | 0.64 | 1.15 | 0.75 | 1.23 | |
表面補強層 | 材料 | PTFE玻纖布 | PVDF含浸布 | 氟橡膠 | Nomex ®紙 | Nomex ®針織布 | 無 |
厚度(mm) | 0.18 | 0.35 | 0.15 | 0.35 | 0.35 | 0 | |
緩衝墊結構 | 基重(克/平方公分) | 1800 | 1400 | 1200 | 2300 | 1800 | 1400 |
厚度(mm) | 4.36 | 4.7 | 4.3 | 5 | 4.7 | 4 |
另對實驗例1至3與比較例1至3的緩衝墊結構,進行熱壓使用次數、緩衝率、復原率、升溫速率、熱壓後基板平整性的特性測試,並將結果列於表2中。
熱壓使用次數的計算,是在190°C的溫度、50 kg/m
2的壓力的條件下熱壓,當緩衝率低於30%時停止計次。
關於緩衝率與復原率的測試方式,請參閱圖4所示,先在緩衝墊結構上標記等間距的九個定位點(P1至P9),並測量九個定位點(P1至P9)的厚度,作為壓合前厚度(A)。將鉛塊置於緩衝墊結構周圍,但不與緩衝墊結構接觸。在模擬壓合過程中,將上加熱板及下加熱板的溫度升高至190°C,以25 kg/cm
3的壓力壓合30分鐘,再量測九個定位點(P1至P9)的厚度作為壓合後厚度(C)。由於鉛塊的設置,上加熱板會下壓緩衝墊結構直至抵頂到鉛塊,因此,鉛塊的厚度即為緩衝墊結構的壓合時厚度(B)。
在表2中,復原率與緩衝率的計算方式為:
復原率的計算公式 =
;
回復率的計算公式 =
緩衝率的計算公式 =
。
在測量升溫速率的實驗中,堆疊60張玻纖布(型號7628)當作模擬基板。將緩衝墊結構以及模擬基板置於上加熱板及下加熱板之間,上加熱板與緩衝墊結構接觸,下加熱板與模擬基板接觸。於緩衝墊結構與玻纖布之間設置第一料溫線,於玻纖布與下加熱板之間設置第二料溫線,以測量模擬壓合過程中,玻纖布的升溫速率。接著,將上加熱板的溫度升高至190°C,下加熱板的溫度控制為30°C,以25 kg/cm
3的壓力壓合10分鐘,紀錄第一料溫線與第二料溫線顯示的溫度(T1、T2)。
升溫速率的計算公式 =
。
關於熱壓後基板平整性的測試,是將上述實驗例1至3以及比較例1至3的緩衝墊結構,覆於基板上進行熱壓。待基板冷卻至室溫後,將基板區分為九個區域,並測量每一區域中均分後九個定點的厚度。經計算平均後,可獲得熱壓後基板平整性。
表2
實驗例 | 比較例 | |||||
1 | 2 | 3 | 1 | 2 | 3 | |
熱壓使用次數(次) | 500 | 500 | 450 | 350 | 400 | 400 |
緩衝率 | 35% | 38% | 36% | 18% | 20% | 20% |
復原率 | 97% | 99% | 98% | 94% | 92% | 93% |
升溫速率(°C/分鐘) | 12 | 11.6 | 12.3 | 11 | 11.5 | 10.8 |
熱壓後基板平整性 | 95% | 93% | 92% | 86% | 88% | 83% |
由表1及表2的內容可得知,本發明的緩衝墊結構可承受的熱壓次數較高,並具有較高的緩衝率(大於34%)與復原率(大於95%)。當使用本發明的緩衝墊結構進行熱壓時,基板的升溫速率較高(大於11.5°C/分鐘),可避免熱壓時間的延長。經熱壓後,基板的表面可具有良好的平整性(大於90%),不會因熱壓製程而受影響,故特別適用於薄型基板。
根據實施例1與比較例1、2的內容,比較同樣使用矽橡膠作為發泡材料時的情況。當複合纖維布層只具有耐熱纖維布(比較例1)時,其緩衝率及復原率分別為18%與94%,且熱壓使用次數只有350次。為了提升熱壓使用次數,使用平織纖維布夾設耐熱纖維布(比較例2)後,可使熱壓使用次數提升400次,緩衝率提升至20%,但整體緩衝墊結構的復原率卻下降為92%。相比之下,實施例1中使用膨鬆紗纖維布夾設耐熱纖維布,並搭配特定厚度的發泡中間層,可同時提升緩衝墊結構的熱壓使用次數、緩衝率及復原率。
[實施例的有益效果]
本發明的其中一有益效果在於,本發明所提供的緩衝墊結構,其能通過“緩衝墊結構具有發泡中間層”以及“複合纖維布層是由耐熱纖維布及蓬鬆紗纖維布所製成”的技術方案,以提升緩衝墊結構的緩衝效果及熱壓使用次數。
更進一步來說,本發明的緩衝墊結構還包括兩個表面補強層,表面補強層的設置,可提升緩衝墊結構的耐熱效果,並可提升緩衝墊結構的平坦度。如此一來,在熱壓過程中,基板可以較快的速度達到熱壓溫度,經熱壓後,基板也可具有較高的平坦性,此為以往熱壓緩衝墊無法達到的。
以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的申請專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的申請專利範圍內。
10:發泡中間層
11:第一表面
12:第二表面
20:複合纖維布層
30:表面補強層
圖1為本發明第一實施例的緩衝墊結構的剖面示意圖。
圖2為本發明的緩衝墊結構剖面的電子顯微鏡圖。
圖3為本發明第二實施例的緩衝墊結構的剖面示意圖。
圖4為本發明的緩衝墊結構於測試時的俯視示意圖。
10:發泡中間層
11:第一表面
12:第二表面
20:複合纖維布層
Claims (9)
- 一種緩衝墊結構,其包括:一發泡中間層;以及兩個複合纖維布層,所述發泡中間層設置於兩個所述複合纖維布層之間,每一所述複合纖維布層是由耐熱纖維布及蓬鬆紗纖維布所製成,所述耐熱纖維布通過針軋方式與所述蓬鬆紗纖維布結合;其中,所述蓬鬆紗纖維布中的蓬鬆紗集中設置於所述耐熱纖維布的多個節點上;其中,所述複合纖維布層與所述發泡中間層的厚度比值為0.5至0.9;以及其中,所述緩衝墊結構於190℃的溫度下熱壓的緩衝率大於30%,所述緩衝墊結構於190℃的溫度下熱壓的復原率大於95%。
- 如請求項1所述的緩衝墊結構,其中,所述蓬鬆紗纖維布是玻璃纖維蓬鬆紗纖維布。
- 如請求項1所述的緩衝墊結構,其中,兩層所述蓬鬆紗纖維布與一層所述耐熱纖維布構成一個疊層單位,所述耐熱纖維布設置於兩層所述蓬鬆紗纖維布之間。
- 如請求項1所述的緩衝墊結構,其中,所述發泡中間層是以熱壓合的方式設置於所述複合纖維布層上。
- 如請求項1所述的緩衝墊結構,其中,所述發泡中間層的發泡倍率為0.6至3.0。
- 如請求項1所述的緩衝墊結構,其中,所述發泡中間層的材料是選自於由下列所構成的群組:矽橡膠、氟橡膠、聚偏二氟乙烯及聚醚醚酮。
- 如請求項1所述的緩衝墊結構,進一步包括:兩個表面補強 層,兩個所述表面補強層分別設置於兩個所述複合纖維布層上,使得所述發泡中間層與兩個所述複合纖維布層設置於兩個所述表面補強層之間。
- 如請求項7所述的緩衝墊結構,其中,所述表面補強層的材料是選自於由下列所構成的群組:聚四氟乙烯、聚偏二氟乙烯、氟橡膠及聚醚醚酮。
- 如請求項7所述的緩衝墊結構,其中,一部分的所述表面補強層會滲入所述複合纖維布層內。
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CN1288807A (zh) * | 1999-09-17 | 2001-03-28 | 市川毛织株式会社 | 用于成形压榨的耐热衬垫 |
US20050014437A1 (en) * | 2001-11-09 | 2005-01-20 | Akira Yoshida | Cushioning material for hot pressing and process for producing layered board |
TWM501935U (zh) * | 2015-01-13 | 2015-06-01 | Hsin Yung Chien Co Ltd | 熱壓用緩衝墊 |
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CN1288807A (zh) * | 1999-09-17 | 2001-03-28 | 市川毛织株式会社 | 用于成形压榨的耐热衬垫 |
US20050014437A1 (en) * | 2001-11-09 | 2005-01-20 | Akira Yoshida | Cushioning material for hot pressing and process for producing layered board |
TWM501935U (zh) * | 2015-01-13 | 2015-06-01 | Hsin Yung Chien Co Ltd | 熱壓用緩衝墊 |
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