TWI829723B - Use of resin compositions for heat storage materials, heat storage materials and articles including heat storage materials - Google Patents
Use of resin compositions for heat storage materials, heat storage materials and articles including heat storage materials Download PDFInfo
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- TWI829723B TWI829723B TW108125134A TW108125134A TWI829723B TW I829723 B TWI829723 B TW I829723B TW 108125134 A TW108125134 A TW 108125134A TW 108125134 A TW108125134 A TW 108125134A TW I829723 B TWI829723 B TW I829723B
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- Prior art keywords
- group
- monomer
- heat storage
- resin composition
- mass
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- 239000011342 resin composition Substances 0.000 title claims abstract description 83
- 238000005338 heat storage Methods 0.000 title claims description 109
- 239000011232 storage material Substances 0.000 title claims description 93
- 239000000178 monomer Substances 0.000 claims abstract description 125
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 71
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 71
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 43
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 19
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 18
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 15
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 31
- 125000005370 alkoxysilyl group Chemical group 0.000 claims description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 19
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 17
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 12
- 229910052799 carbon Inorganic materials 0.000 claims description 12
- 125000004185 ester group Chemical group 0.000 claims description 11
- 230000000379 polymerizing effect Effects 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims 1
- 238000000034 method Methods 0.000 description 22
- -1 trimethoxysilyl group Chemical group 0.000 description 21
- 239000000463 material Substances 0.000 description 18
- 239000000203 mixture Substances 0.000 description 16
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 15
- 238000002844 melting Methods 0.000 description 15
- 230000008018 melting Effects 0.000 description 15
- 125000003545 alkoxy group Chemical group 0.000 description 14
- 239000003795 chemical substances by application Substances 0.000 description 14
- 239000000126 substance Substances 0.000 description 13
- 125000002947 alkylene group Chemical group 0.000 description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 239000003054 catalyst Substances 0.000 description 9
- 239000007788 liquid Substances 0.000 description 9
- 239000004848 polyfunctional curative Substances 0.000 description 9
- 238000006116 polymerization reaction Methods 0.000 description 9
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- 229920003986 novolac Polymers 0.000 description 8
- 125000000962 organic group Chemical group 0.000 description 8
- 238000003756 stirring Methods 0.000 description 8
- 238000003786 synthesis reaction Methods 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- 230000008859 change Effects 0.000 description 7
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 7
- 125000002511 behenyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 239000012188 paraffin wax Substances 0.000 description 6
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 5
- 239000012948 isocyanate Substances 0.000 description 5
- 239000003505 polymerization initiator Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 4
- 239000004372 Polyvinyl alcohol Substances 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 4
- UGAPHEBNTGUMBB-UHFFFAOYSA-N acetic acid;ethyl acetate Chemical compound CC(O)=O.CCOC(C)=O UGAPHEBNTGUMBB-UHFFFAOYSA-N 0.000 description 4
- 238000004378 air conditioning Methods 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 4
- 239000012975 dibutyltin dilaurate Substances 0.000 description 4
- 229910001873 dinitrogen Inorganic materials 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 229920002451 polyvinyl alcohol Polymers 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- 239000000375 suspending agent Substances 0.000 description 4
- 238000010558 suspension polymerization method Methods 0.000 description 4
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 4
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 3
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 239000005058 Isophorone diisocyanate Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 3
- 125000000753 cycloalkyl group Chemical group 0.000 description 3
- KQWGXHWJMSMDJJ-UHFFFAOYSA-N cyclohexyl isocyanate Chemical compound O=C=NC1CCCCC1 KQWGXHWJMSMDJJ-UHFFFAOYSA-N 0.000 description 3
- 125000005442 diisocyanate group Chemical group 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- 150000002513 isocyanates Chemical class 0.000 description 3
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- XZHNPVKXBNDGJD-UHFFFAOYSA-N tetradecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCOC(=O)C=C XZHNPVKXBNDGJD-UHFFFAOYSA-N 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 3
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 2
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 2
- LGJCFVYMIJLQJO-UHFFFAOYSA-N 1-dodecylperoxydodecane Chemical compound CCCCCCCCCCCCOOCCCCCCCCCCCC LGJCFVYMIJLQJO-UHFFFAOYSA-N 0.000 description 2
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 2
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 2
- DPNXHTDWGGVXID-UHFFFAOYSA-N 2-isocyanatoethyl prop-2-enoate Chemical compound C=CC(=O)OCCN=C=O DPNXHTDWGGVXID-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- JTHZUSWLNCPZLX-UHFFFAOYSA-N 6-fluoro-3-methyl-2h-indazole Chemical compound FC1=CC=C2C(C)=NNC2=C1 JTHZUSWLNCPZLX-UHFFFAOYSA-N 0.000 description 2
- GAYWTJPBIQKDRC-UHFFFAOYSA-N 8-trimethoxysilyloctyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCCCCCCOC(=O)C(C)=C GAYWTJPBIQKDRC-UHFFFAOYSA-N 0.000 description 2
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 239000003463 adsorbent Substances 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- JGCWKVKYRNXTMD-UHFFFAOYSA-N bicyclo[2.2.1]heptane;isocyanic acid Chemical compound N=C=O.N=C=O.C1CC2CCC1C2 JGCWKVKYRNXTMD-UHFFFAOYSA-N 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 239000002775 capsule Substances 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 239000012986 chain transfer agent Substances 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- TVIDDXQYHWJXFK-UHFFFAOYSA-N dodecanedioic acid Chemical compound OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 2
- 230000001050 lubricating effect Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- NUKZAGXMHTUAFE-UHFFFAOYSA-N methyl hexanoate Chemical compound CCCCCC(=O)OC NUKZAGXMHTUAFE-UHFFFAOYSA-N 0.000 description 2
- HAMGRBXTJNITHG-UHFFFAOYSA-N methyl isocyanate Chemical compound CN=C=O HAMGRBXTJNITHG-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 239000007870 radical polymerization initiator Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000002040 relaxant effect Effects 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 2
- 229920003169 water-soluble polymer Polymers 0.000 description 2
- 230000004580 weight loss Effects 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- KDGNCLDCOVTOCS-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy propan-2-yl carbonate Chemical compound CC(C)OC(=O)OOC(C)(C)C KDGNCLDCOVTOCS-UHFFFAOYSA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- MTZUIIAIAKMWLI-UHFFFAOYSA-N 1,2-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC=C1N=C=O MTZUIIAIAKMWLI-UHFFFAOYSA-N 0.000 description 1
- WVWYODXLKONLEM-UHFFFAOYSA-N 1,2-diisocyanatobutane Chemical compound O=C=NC(CC)CN=C=O WVWYODXLKONLEM-UHFFFAOYSA-N 0.000 description 1
- ZGDSDWSIFQBAJS-UHFFFAOYSA-N 1,2-diisocyanatopropane Chemical compound O=C=NC(C)CN=C=O ZGDSDWSIFQBAJS-UHFFFAOYSA-N 0.000 description 1
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- AZYRZNIYJDKRHO-UHFFFAOYSA-N 1,3-bis(2-isocyanatopropan-2-yl)benzene Chemical compound O=C=NC(C)(C)C1=CC=CC(C(C)(C)N=C=O)=C1 AZYRZNIYJDKRHO-UHFFFAOYSA-N 0.000 description 1
- VGHSXKTVMPXHNG-UHFFFAOYSA-N 1,3-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC(N=C=O)=C1 VGHSXKTVMPXHNG-UHFFFAOYSA-N 0.000 description 1
- UFXYYTWJETZVHG-UHFFFAOYSA-N 1,3-diisocyanatobutane Chemical compound O=C=NC(C)CCN=C=O UFXYYTWJETZVHG-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- OHLKMGYGBHFODF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=C(CN=C=O)C=C1 OHLKMGYGBHFODF-UHFFFAOYSA-N 0.000 description 1
- ROHUXHMNZLHBSF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)cyclohexane Chemical compound O=C=NCC1CCC(CN=C=O)CC1 ROHUXHMNZLHBSF-UHFFFAOYSA-N 0.000 description 1
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
- CDMDQYCEEKCBGR-UHFFFAOYSA-N 1,4-diisocyanatocyclohexane Chemical compound O=C=NC1CCC(N=C=O)CC1 CDMDQYCEEKCBGR-UHFFFAOYSA-N 0.000 description 1
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- 238000012360 testing method Methods 0.000 description 1
- 239000003017 thermal stabilizer Substances 0.000 description 1
- 239000012974 tin catalyst Substances 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000006839 xylylene group Chemical group 0.000 description 1
- DGVVWUTYPXICAM-UHFFFAOYSA-N β‐Mercaptoethanol Chemical compound OCCS DGVVWUTYPXICAM-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/02—Materials undergoing a change of physical state when used
- C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
本發明的一方面提供一種樹脂組成物,其含有丙烯酸樹脂,所述丙烯酸樹脂是使包含下述式(1)所表示的第1單體、與可和第1單體共聚且具有可與水反應的反應性基的第2單體的單體成分聚合而成。式中,R1表示氫原子或甲基,R2表示碳數12~30的烷基。 One aspect of the present invention provides a resin composition containing an acrylic resin containing a first monomer represented by the following formula (1), copolymerizable with a first monomer and having water-combinable properties. The monomer component of the second monomer of the reacted reactive group is polymerized. In the formula, R 1 represents a hydrogen atom or a methyl group, and R 2 represents an alkyl group having 12 to 30 carbon atoms.
Description
本發明是有關於一種樹脂組成物、儲熱材料及包括儲熱材料的物品。 The present invention relates to a resin composition, heat storage material and articles including the heat storage material.
儲熱材料是可將所儲存的能量視需要以熱的形式取出的材料。所述儲熱材料可在空調設備、樓板供暖設備、冰箱、積體電路(Integrated Circuit,IC)晶片等電子零件、汽車內外裝飾材料、碳罐等汽車零件、保溫容器等的用途中利用。 Thermal storage materials are materials that can extract stored energy in the form of heat as needed. The heat storage material can be used in air conditioning equipment, floor heating equipment, refrigerators, electronic components such as integrated circuit (IC) wafers, automobile interior and exterior decorative materials, automobile parts such as carbon canisters, and thermal insulation containers.
作為儲熱的方式,就熱量的大小方面而言,廣泛利用使用物質的相變化的潛熱儲熱。作為潛熱儲熱物質,廣為人知的是水-冰。水-冰是熱量大的物質,但相變化溫度於大氣下被限定為0℃,因此應用範圍亦受到限定。因此,作為具有高於0℃且為100℃以下的相變化溫度的潛熱儲熱物質,利用石蠟(paraffin)。但是,若石蠟藉由加熱而產生相變化,則變為液體,有引火及起火的危險性。因此,為了將石蠟用於儲熱材料,必須收納於袋等密閉容器中等來防止石蠟自儲熱材料中洩漏,而受到應用領域的限制。 As a method of storing heat, latent heat storage using phase changes of substances is widely used in terms of the magnitude of heat. As a latent heat storage material, water-ice is widely known. Water-ice is a substance with a large amount of heat, but its phase change temperature is limited to 0°C in the atmosphere, so its application range is also limited. Therefore, paraffin is used as a latent heat storage material having a phase change temperature higher than 0° C. and 100° C. or lower. However, if paraffin wax undergoes a phase change by heating, it becomes liquid, which may cause fire or ignition. Therefore, in order to use paraffin as a heat storage material, it must be stored in a sealed container such as a bag to prevent the paraffin from leaking from the heat storage material, and the application field is limited.
作為改良包含石蠟的儲熱材料的方法,例如於專利文獻1中揭示了使用膠化劑的方法。由所述方法製作的凝膠於石蠟的相變化後亦可保持凝膠狀的成形體。但是,所述方法中,於用作儲 熱材料時,有引起漏液、儲熱材料的揮發等的可能性。 As a method of improving a heat storage material containing paraffin, for example, Patent Document 1 discloses a method of using a gelling agent. The gel produced by the above method can maintain a gel-like molded body even after the phase change of paraffin wax. However, in the method described, it is used as a storage When using hot materials, it may cause liquid leakage or volatilization of heat storage materials.
另外,作為另一改良方法,例如於專利文獻2中揭示了使用氫化共軛二烯共聚物的方法。所述方法中,於烴化合物的融解或凝固溫度附近可保持形狀,但若變為更高的溫度,則相容性低,因此產生相分離,從而產生烴化合物的漏液。 In addition, as another improvement method, for example, Patent Document 2 discloses a method using a hydrogenated conjugated diene copolymer. In this method, the shape can be maintained near the melting or solidification temperature of the hydrocarbon compound. However, if the temperature is increased to a higher temperature, the compatibility is low, causing phase separation, resulting in leakage of the hydrocarbon compound.
另外,作為又一改良方法,例如於專利文獻3中揭示了對儲熱材料進行微膠囊化的方法。所述方法中,儲熱材料經膠囊化,因此不論相變化如何,操作性都良好,但於高溫區域中,有自膠囊滲出儲熱材料之虞。 In addition, as another improvement method, for example, Patent Document 3 discloses a method of microencapsulating a heat storage material. In this method, the heat storage material is encapsulated, so the operability is good regardless of the phase change. However, in high temperature areas, there is a risk that the heat storage material may ooze out of the capsule.
[現有技術文獻] [Prior art documents]
[專利文獻] [Patent Document]
[專利文獻1]日本專利特開2000-109787號公報 [Patent Document 1] Japanese Patent Application Laid-Open No. 2000-109787
[專利文獻2]日本專利特開2014-95023號公報 [Patent Document 2] Japanese Patent Application Publication No. 2014-95023
[專利文獻3]日本專利特開2005-23229號公報 [Patent Document 3] Japanese Patent Application Publication No. 2005-23229
於一方面中,本發明的目的在於提供一種可較佳地用於儲熱材料的樹脂組成物。於另一方面中,本發明的目的在於提供一種儲熱量優異的儲熱材料。 In one aspect, the object of the present invention is to provide a resin composition that can be preferably used as a thermal storage material. In another aspect, an object of the present invention is to provide a heat storage material excellent in heat storage.
本發明者等人進行了努力研究,結果發現含有特定成分的樹脂組成物可較佳地用於儲熱材料、即由該樹脂組成物形成的 儲熱材料的儲熱量優異,從而完成了本發明。於若干個側面中,本發明提供下述[1]~[11]。 The inventors of the present invention conducted diligent research and found that a resin composition containing a specific component can be suitably used as a heat storage material, that is, a heat storage material formed of the resin composition. The heat storage material has excellent heat storage capacity, and the present invention was completed. Among several aspects, the present invention provides the following [1] to [11].
[1]一種樹脂組成物,含有丙烯酸樹脂,所述丙烯酸樹脂是使包含下述式(1)所表示的第1單體、與可和第1單體共聚且具有可與水反應的反應性基的第2單體的單體成分聚合而成。 [1] A resin composition containing an acrylic resin containing a first monomer represented by the following formula (1), copolymerizable with a first monomer and having reactivity with water. The monomer component of the second monomer of the base is polymerized.
[式中,R1表示氫原子或甲基,R2表示碳數12~30的烷基] [In the formula, R 1 represents a hydrogen atom or a methyl group, and R 2 represents an alkyl group with 12 to 30 carbon atoms]
[2]一種樹脂組成物,含有丙烯酸樹脂,所述丙烯酸樹脂包含下述式(2)所表示的第1結構單元與具有可與水反應的反應性基的第2結構單元。 [2] A resin composition containing an acrylic resin containing a first structural unit represented by the following formula (2) and a second structural unit having a reactive group that can react with water.
[化2]
[式中,R3表示氫原子或甲基,R4表示碳數12~30的烷基] [In the formula, R 3 represents a hydrogen atom or a methyl group, and R 4 represents an alkyl group with 12 to 30 carbon atoms]
[3]如[1]或[2]所述的樹脂組成物,其中反應性基為烷氧基矽烷基或異氰酸酯基。 [3] The resin composition according to [1] or [2], wherein the reactive group is an alkoxysilyl group or an isocyanate group.
[4]如[1]所述的樹脂組成物,其中相對於單體成分100質量份,第1單體的含量為60質量份以上。 [4] The resin composition according to [1], wherein the content of the first monomer is 60 parts by mass or more based on 100 parts by mass of the monomer component.
[5]如[1]或[4]所述的樹脂組成物,其中相對於單體成分100質量份,第2單體的含量為25質量份以下。 [5] The resin composition according to [1] or [4], wherein the content of the second monomer is 25 parts by mass or less based on 100 parts by mass of the monomer component.
[6]如[2]所述的樹脂組成物,其中相對於構成丙烯酸樹脂的所有結構單元100質量份,第1結構單元的含量為60質量份以上。 [6] The resin composition according to [2], wherein the content of the first structural unit is 60 parts by mass or more based on 100 parts by mass of all structural units constituting the acrylic resin.
[7]如[2]或[6]所述的樹脂組成物,其中相對於構成丙烯酸樹脂的所有結構單元100質量份,第2結構單元的含量為25質量份以下。 [7] The resin composition according to [2] or [6], wherein the content of the second structural unit is 25 parts by mass or less based on 100 parts by mass of all structural units constituting the acrylic resin.
[8]如[1]至[7]中任一項所述的樹脂組成物,其中相對於樹脂組成物100質量份,丙烯酸樹脂的含量為50質量份以上。 [8] The resin composition according to any one of [1] to [7], wherein the content of the acrylic resin is 50 parts by mass or more with respect to 100 parts by mass of the resin composition.
[9]如[1]至[8]中任一項所述的樹脂組成物,其用於形成儲熱材料。 [9] The resin composition according to any one of [1] to [8], which is used to form a heat storage material.
[10]一種儲熱材料,包含如[1]至[9]中任一項所述的樹脂組成物的硬化物。 [10] A heat storage material including a cured product of the resin composition according to any one of [1] to [9].
[11]一種物品,包括:熱源;及以與熱源熱接觸的方式設置的如[1]至[9]中任一項所述的樹脂組成物的硬化物。 [11] An article including: a heat source; and a cured product of the resin composition according to any one of [1] to [9] provided in thermal contact with the heat source.
根據本發明的一方面,可提供一種可較佳地用於儲熱材料的樹脂組成物。此外,關於本發明的一方面的樹脂組成物,即便不使用硬化劑,亦可於室溫(例如25℃)下容易獲得樹脂組成物的硬化物。根據本發明的另一方面,可提供一種儲熱量優異的儲熱材料。此外,本發明的一方面的儲熱材料於儲熱材料的相變化溫度以上可抑制漏液,耐熱性亦優異。 According to one aspect of the present invention, a resin composition that can be preferably used as a heat storage material can be provided. Furthermore, regarding the resin composition according to one aspect of the present invention, a cured product of the resin composition can be easily obtained at room temperature (for example, 25°C) without using a curing agent. According to another aspect of the present invention, a heat storage material excellent in heat storage can be provided. In addition, the heat storage material according to one aspect of the present invention can suppress liquid leakage above the phase change temperature of the heat storage material and has excellent heat resistance.
1:物品 1: Items
2:熱源 2:Heat source
3:儲熱材料 3: Heat storage material
圖1是表示包括儲熱材料的物品的一實施方式的示意剖面圖。 FIG. 1 is a schematic cross-sectional view showing one embodiment of an article including a heat storage material.
以下,一面適宜參照圖式一面對本發明的實施方式進行詳細說明。再者,本發明並不限定於以下的實施方式。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as appropriate. In addition, this invention is not limited to the following embodiment.
所謂本說明書中的「(甲基)丙烯酸酯」是指「丙烯酸酯」及與其對應的「甲基丙烯酸酯」,所謂「(甲基)丙烯醯基」是指「丙烯醯基」及與其對應的「甲基丙烯醯基」。 The so-called "(meth)acrylate" in this specification refers to "acrylate" and its corresponding "methacrylate", and the so-called "(meth)acrylyl" refers to "acrylyl" and its corresponding of "methacrylyl".
本說明書中的重量平均分子量(Mw)及數量平均分子 量(Mn)是指使用凝膠滲透層析法(Gel Permeation Chromatography,GPC)在以下條件下測定,且將聚苯乙烯作為標準物質而決定的值。 The weight average molecular weight (Mw) and number average molecules in this specification The amount (Mn) refers to a value determined using gel permeation chromatography (Gel Permeation Chromatography, GPC) under the following conditions and using polystyrene as a standard substance.
.測定機器:HLC-8320GPC(製品名、東曹(股)製造) . Measuring machine: HLC-8320GPC (product name, manufactured by Tosoh Corporation)
.分析管柱:TSKgel SuperMultipore HZ-H(3根連接)(製品名、東曹(股)製造) . Analysis column: TSKgel SuperMultipore HZ-H (3 connections) (product name, manufactured by Tosoh Corporation)
.保護管柱:TSKguardcolumn SuperMP(HZ)-H(製品名、東曹(股)製造) . Guard column: TSKguardcolumn SuperMP(HZ)-H (product name, manufactured by Tosoh Corporation)
.溶離液:四氫呋喃(Tetrahydrofuran,THF) . Eluent: Tetrahydrofuran (THF)
.測定溫度:25℃ . Measuring temperature: 25℃
於本說明書中,所謂「耐熱性優異」是指熱重分析-示差熱分析法(Thermogravimetric Analysis-Differential Thermal Analysis,TG-DTA)測定中的1%重量減少溫度為280℃以上。 In this specification, "excellent heat resistance" means that the 1% weight loss temperature measured by thermogravimetric analysis-differential thermal analysis (TG-DTA) is 280°C or higher.
一實施方式的樹脂組成物含有丙烯酸樹脂。丙烯酸樹脂為使包含第1單體及第2單體的單體成分聚合而成的聚合物。 The resin composition of one embodiment contains an acrylic resin. Acrylic resin is a polymer obtained by polymerizing monomer components including a first monomer and a second monomer.
第1單體由下述式(1)表示。 The first monomer is represented by the following formula (1).
式中,R1表示氫原子或甲基,R2表示碳數12~30的烷基。 In the formula, R 1 represents a hydrogen atom or a methyl group, and R 2 represents an alkyl group having 12 to 30 carbon atoms.
R2所表示的烷基可為直鏈狀,亦可為分支狀。R2所表示的烷基的碳數較佳為12~28,更佳為12~26,進而佳為12~24,尤佳為12~22。 The alkyl group represented by R 2 may be linear or branched. The number of carbon atoms of the alkyl group represented by R 2 is preferably 12 to 28, more preferably 12 to 26, further preferably 12 to 24, particularly preferably 12 to 22.
換言之,第1單體為於酯基的末端具有碳數12~30的直鏈狀或分支狀的烷基的(甲基)丙烯酸烷基酯。作為第1單體,例如可列舉:(甲基)丙烯酸十二烷基酯((甲基)丙烯酸月桂酯)、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸十六烷基酯、(甲基)丙烯酸十八烷基酯((甲基)丙烯酸硬脂酯)、(甲基)丙烯酸二十二酯((甲基)丙烯酸山萮酯)、(甲基)丙烯酸二十四酯、(甲基)丙烯酸二十六酯、(甲基)丙烯酸二十八酯等。該些第1單體可單獨使用一種或將兩種以上組合使用。第1單體較佳為選自由(甲基)丙烯酸十二烷基酯((甲基)丙烯酸月桂酯)、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸十八烷基酯((甲基)丙烯酸硬脂酯)及(甲基)丙烯酸二十二酯((甲基)丙烯酸山萮酯)所組成的群組中的至少一種。 In other words, the first monomer is an alkyl (meth)acrylate having a linear or branched alkyl group having 12 to 30 carbon atoms at the end of the ester group. Examples of the first monomer include: (meth)lauryl acrylate (lauryl (meth)acrylate), myristyl (meth)acrylate, and cetyl (meth)acrylate. Ester, stearyl (meth)acrylate (stearyl (meth)acrylate), behenyl (meth)acrylate (behenyl (meth)acrylate), behenyl (meth)acrylate Tetraester, hexadecyl (meth)acrylate, octadecyl(meth)acrylate, etc. These first monomers may be used alone or in combination of two or more. The first monomer is preferably selected from the group consisting of dodecyl (meth)acrylate (lauryl (meth)acrylate), myristyl (meth)acrylate, and stearyl (meth)acrylate. At least one of the group consisting of (stearyl (meth)acrylate) and behenyl (meth)acrylate (behenyl (meth)acrylate).
就於形成儲熱材料時可獲得充分的儲熱量的觀點而言,相對於單體成分100質量份,第1單體的含量較佳為60質量份以上,更佳為80質量份以上,例如可為98質量份以下。 From the viewpoint of obtaining sufficient heat storage when forming a heat storage material, the content of the first monomer is preferably 60 parts by mass or more, more preferably 80 parts by mass or more, based on 100 parts by mass of the monomer component. For example, The amount may be 98 parts by mass or less.
第2單體為可與第1單體共聚且具有可與水反應的反應性基的單體(反應性單體)。為了可與第1單體共聚,第2單體包含具有乙烯性不飽和鍵的基(乙烯性不飽和基)。作為乙烯性不飽 和基,例如可列舉(甲基)丙烯醯基、乙烯基、烯丙基等。第2單體較佳為具有可與水反應的反應性基及(甲基)丙烯醯基的單體。 The second monomer is a monomer that is copolymerizable with the first monomer and has a reactive group that can react with water (reactive monomer). In order to be copolymerizable with the first monomer, the second monomer contains a group having an ethylenically unsaturated bond (ethylenically unsaturated group). as ethylenically unsaturated Examples of the radical include (meth)acrylyl, vinyl, and allyl. The second monomer is preferably a monomer having a reactive group capable of reacting with water and a (meth)acrylyl group.
第2單體中的反應性基可於室溫(例如25℃)下與水反應。水例如可為空氣中所含的濕氣。第2單體中的反應性基例如為烷氧基矽烷基或異氰酸酯基。即,第2單體例如為含烷氧基矽烷基的單體或含異氰酸酯基的單體。第2單體包含具有所述性質的反應性基,因此亦可稱為濕氣硬化型或室溫硬化型的單體。第2單體中的反應性基亦可為亦可與後述的硬化劑反應的單體。 The reactive group in the second monomer can react with water at room temperature (for example, 25°C). Water can be, for example, moisture contained in the air. The reactive group in the second monomer is, for example, an alkoxysilyl group or an isocyanate group. That is, the second monomer is, for example, an alkoxysilyl group-containing monomer or an isocyanate group-containing monomer. Since the second monomer contains a reactive group having the above-mentioned properties, it may also be called a moisture-curable or room-temperature curable monomer. The reactive group in the second monomer may be a monomer that can react with a curing agent described below.
第2單體較佳為下述式(3)所表示的單體。 The second monomer is preferably a monomer represented by the following formula (3).
式中,R5表示氫原子或甲基,R6表示具有所述可與水反應的反應性基的一價有機基,較佳為表示具有烷氧基矽烷基或異氰酸酯基的一價有機基。 In the formula, R 5 represents a hydrogen atom or a methyl group, and R 6 represents a monovalent organic group having the reactive group capable of reacting with water, preferably a monovalent organic group having an alkoxysilyl group or an isocyanate group. .
於R6為具有烷氧基矽烷基的一價有機基的情況下,R6例如由下述式(4)表示。 When R 6 is a monovalent organic group having an alkoxysilyl group, R 6 is represented by the following formula (4), for example.
[化5]
式中,R7表示伸烷基,R8、R9及R10分別獨立地表示烷氧基或烷基,*表示鍵結鍵。R8、R9及R10中的至少一個為烷氧基。可為:R8、R9及R10全部為烷氧基;亦可為:R8、R9及R10中的一個為烷基,其餘兩個為烷氧基。 In the formula, R 7 represents an alkylene group, R 8 , R 9 and R 10 each independently represent an alkoxy group or an alkyl group, and * represents a bond. At least one of R 8 , R 9 and R 10 is an alkoxy group. It can be: R 8 , R 9 and R 10 are all alkoxy groups; it can also be: one of R 8 , R 9 and R 10 is an alkyl group, and the other two are alkoxy groups.
R7所表示的伸烷基可為直鏈狀,亦可為分支狀。R7所表示的伸烷基的碳數例如可為1~10、1~8、1~6或1~4。 The alkylene group represented by R 7 may be linear or branched. The carbon number of the alkylene group represented by R 7 may be, for example, 1 to 10, 1 to 8, 1 to 6, or 1 to 4.
R8、R9或R10所表示的烷氧基分別獨立地可為直鏈狀,亦可為分支狀。烷氧基的碳數分別獨立地例如可為1~10、1~8、1~6、1~4或1~2。烷氧基較佳為甲氧基。 The alkoxy group represented by R 8 , R 9 or R 10 may independently be linear or branched. The number of carbon atoms in the alkoxy group may be independently, for example, 1 to 10, 1 to 8, 1 to 6, 1 to 4, or 1 to 2. The alkoxy group is preferably a methoxy group.
於R8、R9或R10的任一者為烷基的情況下,該烷基分別獨立地可為直鏈狀,亦可為分支狀。烷基的碳數分別獨立地例如可為1~10、1~8、1~6、1~4或1~2。烷基較佳為甲基。 When any one of R 8 , R 9 or R 10 is an alkyl group, the alkyl group may be independently linear or branched. The number of carbon atoms in the alkyl group may be independently, for example, 1 to 10, 1 to 8, 1 to 6, 1 to 4, or 1 to 2. The alkyl group is preferably methyl.
關於含烷氧基矽烷基的單體中的烷氧基矽烷基,更具體而言,可為三甲氧基矽烷基、三乙氧基矽烷基、甲基二甲氧基矽烷基、甲基二乙氧基矽烷基等。 Regarding the alkoxysilyl group in the alkoxysilyl group-containing monomer, more specifically, it may be trimethoxysilyl group, triethoxysilyl group, methyldimethoxysilyl group, methyldimethoxysilyl group, etc. Ethoxysilyl, etc.
作為式(3)所表示的含烷氧基矽烷基的單體,可列舉:3-甲基丙烯醯氧基丙基三甲氧基矽烷、8-甲基丙烯醯氧基辛基三甲 氧基矽烷、3-甲基丙烯醯氧基丙基甲基二甲氧基矽烷、3-甲基丙烯醯氧基丙基甲基二乙氧基矽烷、3-丙烯醯氧基丙基三甲氧基矽烷等。 Examples of the alkoxysilyl group-containing monomer represented by formula (3) include: 3-methacryloxypropyltrimethoxysilane, 8-methacryloxyoctyltrimethyl Oxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-acryloxypropyltrimethoxysilane Silane etc.
於R6為具有異氰酸酯基的一價有機基的情況下,R6例如由下述式(5)表示。 When R 6 is a monovalent organic group having an isocyanate group, R 6 is represented by the following formula (5), for example.
[化6]*-R11-N=C=O (5) [Chemical 6]*-R 11 -N=C=O (5)
式中,R11表示伸烷基,*表示鍵結鍵。 In the formula, R 11 represents an alkylene group, and * represents a bond.
R11所表示的伸烷基可與所述R7所表示的伸烷基相同。 The alkylene group represented by R 11 may be the same as the alkylene group represented by R 7 .
作為式(3)所表示的含異氰酸酯基的單體,可列舉2-甲基丙烯醯氧基乙基異氰酸酯、2-丙烯醯氧基乙基異氰酸酯等。 Examples of the isocyanate group-containing monomer represented by formula (3) include 2-methacryloxyethyl isocyanate, 2-acrylyloxyethyl isocyanate, and the like.
該些第2單體可單獨使用一種或將兩種以上組合使用。就容易進行室溫下的硬化的觀點而言,第2單體較佳為具有烷氧基矽烷基作為反應性基的含烷氧基矽烷基的單體,更佳為含三甲氧基矽烷基的單體,進而佳為含三甲氧基矽烷基的(甲基)丙烯酸單體。亦可以說第2單體為具有(甲基)丙烯醯基的矽烷化合物。 These second monomers may be used alone or in combination of two or more. From the viewpoint of easy hardening at room temperature, the second monomer is preferably an alkoxysilyl group-containing monomer having an alkoxysilyl group as a reactive group, and more preferably a trimethoxysilyl group-containing monomer. The monomer is preferably a trimethoxysilyl group-containing (meth)acrylic acid monomer. It can also be said that the second monomer is a silane compound having a (meth)acrylyl group.
就儲熱材料的儲熱量優異的觀點而言,相對於單體成分100質量份,第2單體的含量可為2質量份以上、3質量份以上、5質量份以上、7質量份以上或8質量份以上,可為25質量份以 下,較佳為20質量份以下,更佳為15質量份以下,進而佳為13質量份以下,尤佳為10質量份以下。 From the viewpoint that the heat storage material has excellent heat storage capacity, the content of the second monomer may be 2 parts by mass or more, 3 parts by mass or more, 5 parts by mass or more, 7 parts by mass or more, based on 100 parts by mass of the monomer component. 8 parts by mass or more, can be 25 parts by mass or more below, preferably 20 parts by mass or less, more preferably 15 parts by mass or less, further preferably 13 parts by mass or less, particularly preferably 10 parts by mass or less.
單體成分除了第1單體及第2單體以外,亦可視需要進而含有其他單體。其他單體例如可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸丁酯等於酯基的末端具有碳數未滿12(碳數1~11)的烷基的(甲基)丙烯酸烷基酯;(甲基)丙烯酸異冰片酯、(甲基)丙烯酸二環戊酯等於酯基的末端具有環狀烴基的(甲基)丙烯酸環烷基酯等。其他單體可單獨使用一種或將兩種以上組合使用。 In addition to the first monomer and the second monomer, the monomer component may further contain other monomers if necessary. Examples of other monomers include: (methyl)acrylate, ethyl(meth)acrylate, propyl(meth)acrylate, butyl(meth)acrylate, etc. The terminal of the ester group has a carbon number of less than 12 ( Alkyl (meth)acrylate with an alkyl group having 1 to 11 carbon atoms; isobornyl (meth)acrylate and dicyclopentyl (meth)acrylate are equal to (methyl) having a cyclic hydrocarbon group at the end of the ester group ) cycloalkyl acrylate, etc. Other monomers can be used individually by 1 type or in combination of 2 or more types.
於一實施方式中,單體成分僅含有第1單體、第2單體、以及視需要的第3單體,所述第3單體為選自由於酯基的末端具有碳數1~11的烷基的(甲基)丙烯酸烷基酯以及於酯基的末端具有環狀烴基的(甲基)丙烯酸環烷基酯所組成的群組中的至少一種。換言之,於一實施方式中,單體成分不含第1單體、第2單體及第3單體以外的單體(例如具有矽氧烷骨架的(甲基)丙烯酸單體)。關於單體成分,於一實施方式中,可僅含有第1單體與第2單體,於另一實施方式中,可僅含有第1單體、第2單體及第3單體。 In one embodiment, the monomer component only contains a first monomer, a second monomer, and an optional third monomer, where the third monomer is selected from the group consisting of ester groups having carbon numbers 1 to 11 at the end thereof. At least one of the group consisting of alkyl (meth)acrylic acid alkyl esters and (meth)acrylic acid cycloalkyl esters having a cyclic hydrocarbon group at the end of the ester group. In other words, in one embodiment, the monomer component does not contain monomers other than the first monomer, the second monomer, and the third monomer (for example, a (meth)acrylic monomer having a siloxane skeleton). Regarding the monomer components, in one embodiment, only the first monomer and the second monomer may be included, and in another embodiment, only the first monomer, the second monomer, and the third monomer may be included.
丙烯酸樹脂可藉由使包含第1單體、第2單體及視需要所使用的其他單體的單體成分聚合而獲得。聚合方法可自各種自由基聚合等公知的聚合方法中適宜選擇,例如亦可為懸浮聚合法、溶液聚合法、塊狀聚合法等。作為聚合方法,於使丙烯酸樹 脂的重量平均分子量變大(例如200000以上)的情況下,較佳為使用懸浮聚合法,於使丙烯酸樹脂的重量平均分子量變小(例如100000以下)的情況下,較佳為使用溶液聚合法。 Acrylic resin can be obtained by polymerizing a monomer component including a first monomer, a second monomer, and other monomers used if necessary. The polymerization method can be appropriately selected from known polymerization methods such as various radical polymerizations, and examples thereof include suspension polymerization, solution polymerization, block polymerization, and the like. As a polymerization method, acrylic resin When the weight average molecular weight of the fat becomes large (for example, 200,000 or more), it is preferable to use the suspension polymerization method. When the weight average molecular weight of the acrylic resin becomes small (for example, 100,000 or less), it is preferable to use the solution polymerization method. .
於使用懸浮聚合法的情況下,將作為原料的單體成分、聚合起始劑、視需要所添加的鏈轉移劑、水、懸浮劑及還原劑混合而製備分散液。 When the suspension polymerization method is used, a dispersion liquid is prepared by mixing monomer components as raw materials, a polymerization initiator, an optional chain transfer agent, water, a suspending agent, and a reducing agent.
作為懸浮劑,例如可列舉:聚乙烯醇、甲基纖維素、聚丙烯醯胺等水溶性高分子,磷酸鈣、焦磷酸鎂等難溶性無機物質等。該些中,可較佳地使用聚乙烯醇等水溶性高分子。 Examples of the suspending agent include water-soluble polymers such as polyvinyl alcohol, methylcellulose, and polyacrylamide, and poorly soluble inorganic substances such as calcium phosphate and magnesium pyrophosphate. Among these, water-soluble polymers such as polyvinyl alcohol are preferably used.
相對於作為原料的單體成分的總量100質量份,懸浮劑的調配量較佳為0.005質量份~1質量份,更佳為0.01質量份~0.07質量份。於使用懸浮聚合法的情況下,亦可視需要進而添加硫醇系化合物、硫甘醇、四氯化碳、α-甲基苯乙烯二聚物等分子量調整劑。聚合溫度較佳為0℃~200℃,更佳為40℃~120℃,進而佳為50℃~110℃。 The blending amount of the suspending agent is preferably 0.005 to 1 part by mass, more preferably 0.01 to 0.07 parts by mass relative to 100 parts by mass of the total amount of monomer components as raw materials. When the suspension polymerization method is used, molecular weight regulators such as thiol compounds, thioglycol, carbon tetrachloride, and α-methylstyrene dimer may also be added if necessary. The polymerization temperature is preferably 0°C to 200°C, more preferably 40°C to 120°C, and even more preferably 50°C to 110°C.
於使用溶液聚合法的情況下,作為所使用的溶媒,例如可列舉:甲苯、二甲苯等芳香族系溶劑,甲基乙基酮、甲基異丁基酮等酮系溶劑,乙酸乙酯、乙酸丁酯等酯系溶劑,四氯化碳等氯系溶劑,2-丙醇、2-丁醇等醇系溶媒等。就所獲得的丙烯酸樹脂的聚合性的觀點而言,溶液聚合開始時的溶液中的固體成分濃度較佳為40質量%~70質量%,更佳為50質量%~60質量%。聚合溫度較佳為0℃~200℃,更佳為40℃~120℃,進而佳為50℃~ 110℃。 When a solution polymerization method is used, examples of the solvent used include aromatic solvents such as toluene and xylene, ketone solvents such as methyl ethyl ketone and methyl isobutyl ketone, ethyl acetate, Ester solvents such as butyl acetate, chlorine solvents such as carbon tetrachloride, alcohol solvents such as 2-propanol and 2-butanol, etc. From the viewpoint of the polymerizability of the obtained acrylic resin, the solid content concentration in the solution at the start of solution polymerization is preferably 40 mass% to 70 mass%, more preferably 50 mass% to 60 mass%. The polymerization temperature is preferably 0°C~200°C, more preferably 40°C~120°C, and even more preferably 50°C~ 110℃.
各聚合法中所使用的聚合起始劑只要為自由基聚合起始劑,則可無特別限制地使用。作為自由基聚合起始劑,例如可列舉:過氧化苯甲醯、過氧化月桂醯、二-第三丁基過氧化六氫對苯二甲酸酯、第三丁基過氧化-2-乙基己酸酯、1,1-第三丁基過氧化-3,3,5-三甲基環己烷、第三丁基過氧化異丙基碳酸酯等有機過氧化物,偶氮雙異丁腈、偶氮雙-4-甲氧基-2,4-二甲基戊腈、偶氮雙環己酮-1-甲腈、偶氮二苯甲醯等偶氮化合物等。 The polymerization initiator used in each polymerization method can be used without particular limitation as long as it is a radical polymerization initiator. Examples of the radical polymerization initiator include benzoyl peroxide, lauryl peroxide, di-tert-butylperoxyhexahydroterephthalate, and tert-butylperoxy-2-ethyl. Organic peroxides such as 1,1-tert-butylperoxy-3,3,5-trimethylcyclohexane, tert-butylperoxyisopropyl carbonate, azobisisopropyl carbonate, etc. Azo compounds such as butyronitrile, azobis-4-methoxy-2,4-dimethylvaleronitrile, azobicyclohexanone-1-carbonitrile, azodibenzylcarbonitrile, etc.
就使單體充分聚合的觀點而言,相對於單體的總量100質量份,聚合起始劑的調配量較佳為0.01質量份以上,更佳為0.05質量份以上,進而佳為0.1質量份以上。就丙烯酸樹脂的分子量成為較佳的範圍且抑制分解產物,以及於用作儲熱材料時可獲得較佳的接著強度的觀點而言,相對於單體的總量100質量份,聚合起始劑的調配量較佳為10質量份以下,更佳為5質量份以下,進而佳為3質量份以下。 From the viewpoint of fully polymerizing the monomers, the amount of the polymerization initiator is preferably 0.01 parts by mass or more, more preferably 0.05 parts by mass or more, and still more preferably 0.1 parts by mass, based on 100 parts by mass of the total amount of the monomers. More than one serving. From the viewpoint that the molecular weight of the acrylic resin is in a preferable range, decomposition products are suppressed, and preferable bonding strength is obtained when used as a heat storage material, the polymerization initiator is The blending amount of is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and still more preferably 3 parts by mass or less.
以所述方式獲得的丙烯酸樹脂具有源自第1單體的結構單元與源自第2單體的結構單元。即,一實施方式的樹脂組成物含有包含第1結構單元(源自第1單體的結構單元)與第2結構單元(源自第2單體的結構單元)的丙烯酸樹脂。 The acrylic resin obtained in this manner has a structural unit derived from the first monomer and a structural unit derived from the second monomer. That is, the resin composition of one embodiment contains an acrylic resin containing a first structural unit (structural unit derived from the first monomer) and a second structural unit (structural unit derived from the second monomer).
第1結構單元由下述式(2)表示。 The first structural unit is represented by the following formula (2).
[化7]
式中,R3表示氫原子或甲基,R4表示碳數12~30的烷基。 In the formula, R 3 represents a hydrogen atom or a methyl group, and R 4 represents an alkyl group having 12 to 30 carbon atoms.
R4所表示的烷基可為直鏈狀,亦可為分支狀。R4所表示的烷基的碳數較佳為12~28,更佳為12~26,進而佳為12~24,尤佳為12~22。作為R4所表示的烷基,例如可列舉:十二烷基(月桂基)、十四烷基、十六烷基、十八烷基(硬脂基)、二十二基(山萮基)、二十四基、二十六基、二十八基等。R4所表示的烷基較佳為選自由十二烷基(月桂基)、十四烷基、十八烷基(硬脂基)及二十二基(山萮基)所組成的群組中的至少一種。丙烯酸樹脂包含該些的第1結構單元的一種或兩種以上。 The alkyl group represented by R 4 may be linear or branched. The carbon number of the alkyl group represented by R 4 is preferably 12 to 28, more preferably 12 to 26, further preferably 12 to 24, particularly preferably 12 to 22. Examples of the alkyl group represented by R 4 include dodecyl (lauryl), tetradecyl, hexadecyl, octadecyl (stearyl), behenyl ), twenty-four bases, twenty-six bases, twenty-eight bases, etc. The alkyl group represented by R 4 is preferably selected from the group consisting of dodecyl (lauryl), tetradecyl, octadecyl (stearyl) and behenyl (behenyl) at least one of them. The acrylic resin contains one or more types of these first structural units.
就儲熱材料的儲熱量優異的觀點而言,相對於構成丙烯酸樹脂的所有結構單元100質量份,第1結構單元的含量較佳為60質量份以上,更佳為80質量份以上,例如可為98質量份以下。 From the viewpoint that the heat storage material has excellent heat storage capacity, the content of the first structural unit is preferably 60 parts by mass or more, more preferably 80 parts by mass or more, based on 100 parts by mass of all the structural units constituting the acrylic resin. For example, It is 98 parts by mass or less.
第2結構單元具有可與水反應的反應性基。反應性基例如為選自由烷氧基矽烷基或異氰酸酯基所組成的群組中的至少一種基。第2結構單元例如為源自所述含烷氧基矽烷基的單體或含異氰酸酯基的單體的結構單元。丙烯酸樹脂包含該些的第2結構 單元的一種或兩種以上。 The second structural unit has a reactive group capable of reacting with water. The reactive group is, for example, at least one group selected from the group consisting of an alkoxysilyl group and an isocyanate group. The second structural unit is, for example, a structural unit derived from the alkoxysilyl group-containing monomer or isocyanate group-containing monomer. Acrylic resin contains the second structure of these One or more than two types of units.
第2結構單元較佳為下述式(6)所表示的結構單元。 The second structural unit is preferably a structural unit represented by the following formula (6).
式中,R12表示氫原子或甲基,R13表示具有所述可與水反應的反應性基的一價有機基。R13所表示的有機基中所含的反應性基可為所述反應性基,較佳為烷氧基矽烷基或異氰酸酯基,更佳為烷氧基矽烷基。 In the formula, R 12 represents a hydrogen atom or a methyl group, and R 13 represents a monovalent organic group having the reactive group capable of reacting with water. The reactive group contained in the organic group represented by R 13 may be the reactive group, preferably an alkoxysilyl group or an isocyanate group, more preferably an alkoxysilyl group.
於R13所表示的有機基中所含的反應性基為烷氧基矽烷基的情況下,第2結構單元較佳為由下述式(7)表示。 When the reactive group contained in the organic group represented by R 13 is an alkoxysilyl group, the second structural unit is preferably represented by the following formula (7).
[化9]
式中,R12表示氫原子或甲基,R14表示伸烷基,R15、R16及R17分別獨立地表示烷氧基或烷基。R15、R16及R17中的至少一個為烷氧基。可為:R15、R16及R17全部為烷氧基;亦可為:R15、R16及R17中的一個為烷基,其餘兩個為烷氧基。 In the formula, R 12 represents a hydrogen atom or a methyl group, R 14 represents an alkylene group, and R 15 , R 16 and R 17 each independently represent an alkoxy group or an alkyl group. At least one of R 15 , R 16 and R 17 is an alkoxy group. It can be: R 15 , R 16 and R 17 are all alkoxy groups; it can also be: one of R 15 , R 16 and R 17 is an alkyl group, and the other two are alkoxy groups.
R14所表示的伸烷基可為直鏈狀,亦可為分支狀。R14所表示的伸烷基的碳數例如可為1~10、1~8、1~6或1~4。 The alkylene group represented by R 14 may be linear or branched. The carbon number of the alkylene group represented by R 14 may be, for example, 1 to 10, 1 to 8, 1 to 6, or 1 to 4.
R15、R16及R17所表示的烷氧基分別獨立地可為直鏈狀,亦可為分支狀。烷氧基的碳數分別獨立地例如可為1~10、1~8、1~6、1~4或1~2。烷氧基較佳為甲氧基。 The alkoxy groups represented by R 15 , R 16 and R 17 may each independently be linear or branched. The number of carbon atoms in the alkoxy group may be independently, for example, 1 to 10, 1 to 8, 1 to 6, 1 to 4, or 1 to 2. The alkoxy group is preferably a methoxy group.
於R15、R16及R17的任一者為烷基的情況下,該烷基分別獨立地可為直鏈狀,亦可為分支狀。烷基的碳數分別獨立地例如可為1~10、1~8、1~6、1~4或1~2。烷基較佳為甲基。 When any one of R 15 , R 16 and R 17 is an alkyl group, the alkyl group may be independently linear or branched. The number of carbon atoms in the alkyl group may be independently, for example, 1 to 10, 1 to 8, 1 to 6, 1 to 4, or 1 to 2. The alkyl group is preferably methyl.
於R13所表示的有機基中所含的反應性基為異氰酸酯基 的情況下,第2結構單元較佳為由下述式(8)表示。 When the reactive group contained in the organic group represented by R 13 is an isocyanate group, the second structural unit is preferably represented by the following formula (8).
式中,R12表示氫原子或甲基,R18表示伸烷基。 In the formula, R 12 represents a hydrogen atom or a methyl group, and R 18 represents an alkylene group.
R18所表示的伸烷基可與所述R14所表示的伸烷基相同。 The alkylene group represented by R 18 may be the same as the alkylene group represented by R 14 .
就於形成儲熱材料時可獲得充分的儲熱量的觀點而言,相對於構成丙烯酸樹脂的所有結構單元100質量份,第2結構單元的含量可為2質量份以上、3質量份以上、5質量份以上、7質量份以上或8質量份以上,可為25質量份以下,較佳為20質量份以下,更佳為15質量份以下,進而佳為13質量份以下,尤佳為10質量份以下。 From the viewpoint of obtaining sufficient heat storage when forming a heat storage material, the content of the second structural unit may be 2 parts by mass or more, 3 parts by mass or more, or 5 parts by mass with respect to 100 parts by mass of all structural units constituting the acrylic resin. More than 7 parts by mass or more than 8 parts by mass, it can be 25 parts by mass or less, preferably 20 parts by mass or less, more preferably 15 parts by mass or less, more preferably 13 parts by mass or less, especially 10 parts by mass portion or less.
丙烯酸樹脂除了第1結構單元及第2結構單元以外,亦可視需要進而含有其他結構單元。其他結構單元可為源自所述其他單體的結構單元。 In addition to the first structural unit and the second structural unit, the acrylic resin may further contain other structural units if necessary. The other structural units may be structural units derived from said other monomers.
於一實施方式中,丙烯酸樹脂僅含有第1結構單元、第2結構單元以及視需要的第3結構單元,所述第3結構單元源自選 自由於酯基的末端具有碳數1~11的烷基的(甲基)丙烯酸烷基酯及於酯基的末端具有環狀烴基的(甲基)丙烯酸環烷基酯所組成的群組中的至少一種單體。換言之,於一實施方式中,丙烯酸樹脂不含第1結構單元、第2結構單元及第3結構單元以外的結構單元(例如源自具有矽氧烷骨架的(甲基)丙烯酸單體的結構單元)。關於丙烯酸樹脂,於一實施方式中,可僅含有第1結構單元與第2結構單元,於另一實施方式中,可僅含有第1結構單元、第2結構單元及第3結構單元。 In one embodiment, the acrylic resin only contains a first structural unit, a second structural unit and an optional third structural unit, and the third structural unit is selected from From the group consisting of (meth)acrylic acid alkyl esters having an alkyl group with 1 to 11 carbon atoms at the end of the ester group and (meth)acrylic acid cycloalkyl esters having a cyclic hydrocarbon group at the end of the ester group of at least one monomer. In other words, in one embodiment, the acrylic resin does not contain structural units other than the first structural unit, the second structural unit, and the third structural unit (for example, structural units derived from (meth)acrylic monomers having a siloxane skeleton. ). The acrylic resin may contain only the first structural unit and the second structural unit in one embodiment, and may contain only the first structural unit, the second structural unit and the third structural unit in another embodiment.
丙烯酸樹脂可為無規共聚物、嵌段共聚物或接枝共聚物中的任一種。 The acrylic resin may be any of a random copolymer, a block copolymer, or a graft copolymer.
就儲熱材料的儲熱量優異的觀點而言,相對於樹脂組成物100質量份,丙烯酸樹脂的含量較佳為50質量份以上,更佳為70質量份以上,進而佳為80質量份以上。相對於樹脂組成物100質量份,丙烯酸樹脂的含量可為100質量份以下、99.5質量份以下或99.3質量份以下。 From the viewpoint that the heat storage material has excellent heat storage capacity, the content of the acrylic resin is preferably 50 parts by mass or more, more preferably 70 parts by mass or more, and still more preferably 80 parts by mass or more based on 100 parts by mass of the resin composition. The content of the acrylic resin may be 100 parts by mass or less, 99.5 parts by mass or less, or 99.3 parts by mass or less relative to 100 parts by mass of the resin composition.
就容易進行室溫下的硬化(由濕氣引起的硬化)的觀點而言,樹脂組成物亦可進而含有觸媒。作為觸媒,例如可列舉含有鋁或錫的觸媒。作為含有鋁的觸媒,例如可列舉雙(乙醯乙酸乙酯)(2,4-戊二酮酸)鋁等鋁錯合物。作為含有錫的觸媒,可列舉二月桂酸二丁基錫等。作為觸媒,於所述反應性基為烷氧基矽烷基的情況下,可較佳地使用雙(乙醯乙酸乙酯)(2,4-戊二酮酸)鋁,於反應性基為異氰酸酯基的情況下,可較佳地使用二月桂酸二丁基錫。 From the viewpoint of easy hardening at room temperature (hardening by moisture), the resin composition may further contain a catalyst. Examples of the catalyst include catalysts containing aluminum or tin. Examples of the catalyst containing aluminum include aluminum complexes such as aluminum bis(ethyl acetate acetate)(2,4-pentanedioneate). Examples of the tin-containing catalyst include dibutyltin dilaurate. As a catalyst, when the reactive group is an alkoxysilyl group, aluminum bis(ethyl acetate acetate)(2,4-pentanedioate) can be preferably used. When the reactive group is In the case of an isocyanate group, dibutyltin dilaurate is preferably used.
關於樹脂組成物,於用於形成儲熱材料的情況下,就進一步抑制儲熱材料的漏液及揮發且進一步提高耐熱性的觀點而言,亦可進而含有硬化劑。硬化劑為可與第2單體(第2結構單元)中所含的反應性基反應的硬化劑。作為硬化劑,例如可列舉:異氰酸酯系硬化劑、酚系硬化劑、胺系硬化劑、咪唑系硬化劑、酸酐系硬化劑、羧酸系硬化劑等。該些硬化劑可單獨使用一種或將兩種以上組合使用。 When the resin composition is used to form a heat storage material, the resin composition may further contain a curing agent from the viewpoint of further suppressing leakage and volatilization of the heat storage material and further improving heat resistance. The curing agent is one that can react with the reactive group contained in the second monomer (second structural unit). Examples of the curing agent include isocyanate curing agents, phenol curing agents, amine curing agents, imidazole curing agents, acid anhydride curing agents, carboxylic acid curing agents, and the like. These hardeners can be used individually by 1 type or in combination of 2 or more types.
作為異氰酸酯系硬化劑,例如可列舉:甲苯二異氰酸酯(2,4-甲苯二異氰酸酯或2,6-甲苯二異氰酸酯或其混合物)(toluene diisocyanate,TDI)、伸苯基二異氰酸酯(間伸苯基二異氰酸酯或對伸苯基二異氰酸酯或其混合物)、4,4'-二苯基二異氰酸酯、1,5-萘二異氰酸酯(naphthalene diisocyanate,NDI)、二苯基甲烷二異氰酸酯(4,4'-二苯基甲烷二異氰酸酯、2,4'-二苯基甲烷二異氰酸酯或2,2'-二苯基甲烷二異氰酸酯或其混合物)(diphenylmethane diisocyanate,MDI)、4,4'-甲苯胺二異氰酸酯(toluidine diisocyanate,TODI)、4,4'-二苯醚二異氰酸酯等芳香族二異氰酸酯,伸二甲苯基二異氰酸酯(1,3-伸二甲苯基二異氰酸酯或1,4-伸二甲苯基二異氰酸酯或其混合物)(xylylene diisocyanate,XDI)、四甲基伸二甲苯基二異氰酸酯(1,3-四甲基伸二甲苯基二異氰酸酯或1,4-四甲基伸二甲苯基二異氰酸酯或其混合物)(tetramethyl xylylene diisocyanate,TMXDI)、ω,ω'-二異氰酸酯-1,4-二乙基苯等。作為異氰酸酯系硬化劑,亦可列舉:三 亞甲基二異氰酸酯、1,2-伸丙基二異氰酸酯、伸丁基二異氰酸酯(四亞甲基二異氰酸酯、1,2-伸丁基二異氰酸酯、2,3-伸丁基二異氰酸酯、1,3-伸丁基二異氰酸酯)、1,5-五亞甲基二異氰酸酯(pentamethylene diisocyanate,PDI)、1,6-六亞甲基二異氰酸酯(hexamethylene diisocyanate,HDI)、2,4,4-三甲基六亞甲基二異氰酸酯或2,2,4-三甲基六亞甲基二異氰酸酯、2,6-二異氰酸酯己酸甲酯等脂肪族二異氰酸酯,1,3-環戊烷二異氰酸酯、1,3-環戊烯二異氰酸酯、環己烷二異氰酸酯(1,4-環己烷二異氰酸酯、1,3-環己烷二異氰酸酯)、3-異氰酸甲基-3,5,5-三甲基環己基異氰酸酯(異佛爾酮二異氰酸酯)(isophorone diisocyanate,IPDI)、亞甲基雙(環己基異氰酸酯)(4,4'-亞甲基雙(環己基異氰酸酯)、2,4'-亞甲基雙(環己基異氰酸酯)或2,2'-亞甲基雙(環己基異氰酸酯)、它們的反式,反式體(trans,trans)、反式,順式體(trans,cis)、順式,順式體、或其混合物)(H12MDI)、甲基環己烷二異氰酸酯(甲基-2,4-環己烷二異氰酸酯、甲基-2,6-環己烷二異氰酸酯)、降冰片烷二異氰酸酯(各種異構體或其混合物)(norbornane diisocyanate,NBDI)、雙(異氰酸甲基)環己烷(1,3-雙(異氰酸甲基)環己烷或1,4-雙(異氰酸甲基)環己烷或其混合物)(H6XDI)等脂環族二異氰酸酯等。 Examples of the isocyanate-based hardener include toluene diisocyanate (TDI) (2,4-toluene diisocyanate or 2,6-toluene diisocyanate or mixtures thereof), phenylene diisocyanate (m-phenylene diisocyanate) diisocyanate or p-phenylene diisocyanate or mixtures thereof), 4,4'-diphenyl diisocyanate, 1,5-naphthalene diisocyanate (NDI), diphenylmethane diisocyanate (4,4' -Diphenylmethane diisocyanate, 2,4'-diphenylmethane diisocyanate or 2,2'-diphenylmethane diisocyanate or mixtures thereof) (diphenylmethane diisocyanate, MDI), 4,4'-toluidine diisocyanate Aromatic diisocyanates such as toluidine diisocyanate (TODI), 4,4'-diphenyl ether diisocyanate, 1,3-xylylene diisocyanate or 1,4-xylylene diisocyanate or Its mixture) (xylylene diisocyanate, xylylene diisocyanate (TMXDI), ω,ω'-diisocyanate-1,4-diethylbenzene, etc. As isocyanate hardeners, there are also: three Methylene diisocyanate, 1,2-propylene diisocyanate, butylene diisocyanate (tetramethylene diisocyanate, 1,2-butylene diisocyanate, 2,3-butylene diisocyanate, 1 ,3-butylene diisocyanate), 1,5-pentamethylene diisocyanate (PDI), 1,6-hexamethylene diisocyanate (HDI), 2,4,4- Aliphatic diisocyanates such as trimethylhexamethylene diisocyanate or 2,2,4-trimethylhexamethylene diisocyanate, 2,6-diisocyanate methyl hexanoate, 1,3-cyclopentane diisocyanate Isocyanate, 1,3-cyclopentene diisocyanate, cyclohexane diisocyanate (1,4-cyclohexane diisocyanate, 1,3-cyclohexane diisocyanate), 3-methyl isocyanate-3,5 ,5-Trimethylcyclohexyl isocyanate (isophorone diisocyanate) (isophorone diisocyanate, IPDI), methylene bis (cyclohexyl isocyanate) (4,4'-methylene bis (cyclohexyl isocyanate), 2 , 4'-methylene bis (cyclohexyl isocyanate) or 2,2'-methylene bis (cyclohexyl isocyanate), their trans, trans isomers (trans, trans), trans, cis isomers ( trans, cis), cis, cis isomer, or mixture thereof) (H12MDI), methylcyclohexane diisocyanate (methyl-2,4-cyclohexane diisocyanate, methyl-2,6-cyclohexane Alkane diisocyanate), norbornane diisocyanate (various isomers or mixtures thereof) (norbornane diisocyanate, NBDI), bis(methyl isocyanate) cyclohexane (1,3-bis(methyl isocyanate) Alicyclic diisocyanates such as cyclohexane or 1,4-bis(isocyanatomethyl)cyclohexane or its mixture) (H6XDI), etc.
作為酚系硬化劑,例如可列舉:雙酚A、雙酚F、雙酚S、4,4'-聯苯基苯酚、四甲基雙酚A、二甲基雙酚A、四甲基雙酚F、二甲基雙酚F、四甲基雙酚S、二甲基雙酚S、四甲基-4,4'-聯苯酚、二甲基-4,4'-聯苯基苯酚、1-(4-羥基苯基)-2-[4-(1,1-雙-(4- 羥基苯基)乙基)苯基]丙烷、2,2'-亞甲基-雙(4-甲基-6-第三丁基苯酚)、4,4'-亞丁基-雙(3-甲基-6-第三丁基苯酚)、三羥基苯基甲烷、間苯二酚、對苯二酚、鄰苯三酚(pyrogallol)、具有二亞異丙基骨架的苯酚類;1,1-二-4-羥基苯基茀等具有茀骨架的苯酚類;甲酚類;乙基苯酚類;丁基苯酚類;辛基苯酚類;以雙酚A、雙酚F、雙酚S、萘酚類等各種苯酚為原料的酚醛清漆樹脂、含伸二甲苯基骨架的苯酚酚醛清漆樹脂、含二環戊二烯骨架的苯酚酚醛清漆樹脂、含聯苯基骨架的苯酚酚醛清漆樹脂、含茀骨架的苯酚酚醛清漆樹脂、含呋喃骨架的苯酚酚醛清漆樹脂等各種酚醛清漆樹脂等。 Examples of the phenolic hardener include bisphenol A, bisphenol F, bisphenol S, 4,4'-biphenylphenol, tetramethylbisphenol A, dimethylbisphenol A, and tetramethylbisphenol. Phenol F, dimethylbisphenol F, tetramethylbisphenol S, dimethylbisphenol S, tetramethyl-4,4'-biphenol, dimethyl-4,4'-biphenylphenol, 1-(4-Hydroxyphenyl)-2-[4-(1,1-bis-(4- Hydroxyphenyl)ethyl)phenyl]propane, 2,2'-methylene-bis(4-methyl-6-tert-butylphenol), 4,4'-butylene-bis(3-methyl 6-tert-butylphenol), trihydroxyphenylmethane, resorcinol, hydroquinone, pyrogallol, phenols with diisopropylidene skeleton; 1,1- Di-4-hydroxyphenyl fluoride and other phenols with fluorine skeleton; cresols; ethylphenols; butylphenols; octylphenols; bisphenol A, bisphenol F, bisphenol S, naphthol Various phenol-based novolak resins, phenol novolak resins containing xylylene skeleton, phenol novolak resins containing dicyclopentadiene skeleton, phenol novolak resins containing biphenyl skeleton, phenol novolac resins containing fluorine skeleton Various novolac resins such as phenol novolac resin and furan skeleton-containing phenol novolac resin.
作為胺系硬化劑,例如可列舉:二胺基二苯基甲烷、二胺基二苯基碸、二胺基二苯基醚、對苯二胺、間苯二胺、鄰苯二胺、1,5-二胺基萘、間伸二甲苯基二胺等芳香族胺、乙二胺、二乙二胺、異佛爾酮二胺、雙(4-胺基-3-甲基二環己基)甲烷、聚醚二胺等脂肪族胺;二氰二胺、1-(鄰甲苯基)雙胍等胍類等。 Examples of the amine-based curing agent include: diaminodiphenylmethane, diaminodiphenyltriane, diaminodiphenyl ether, p-phenylenediamine, m-phenylenediamine, o-phenylenediamine, 1 , 5-diaminonaphthalene, metaxylylenediamine and other aromatic amines, ethylenediamine, diethylenediamine, isophoronediamine, bis(4-amino-3-methyldicyclohexyl) Methane, polyetherdiamine and other aliphatic amines; dicyandiamine, 1-(o-tolyl)biguanide and other guanidines, etc.
作為咪唑系硬化劑,例如可列舉:2-甲基咪唑、2-乙基-4-甲基咪唑、2-苯基咪唑、2-十一烷基咪唑、2-十七烷基咪唑、2-苯基-4-甲基咪唑、1-苄基-2-苯基咪唑、1-苄基-2-甲基咪唑、1-氰基乙基-2-甲基咪唑、1-氰基乙基-2-苯基咪唑、1-氰基乙基-2-十一烷基咪唑、2,3-二氫-1H-吡咯-[1,2-a]苯並咪唑、2,4-二胺基-6(2'-甲基咪唑(1'))乙基-均三嗪、2,4-二胺基-6(2'-十一烷基咪唑(1'))乙基-均三嗪、2,4-二胺基-6(2'-乙基-4-甲基咪唑(1'))乙基-均三嗪、2,4-二胺基-6(2'-甲基咪唑(1'))乙基-均三嗪.異三聚氰酸加成物、2-甲基 咪唑異三聚氰酸加成物、2-苯基咪唑異三聚氰酸加成物、2-苯基-3,5-二羥基甲基咪唑、2-苯基-4-甲基-5-羥基甲基咪唑、1-氰基乙基-2-苯基-3,5-二氰基乙氧基甲基咪唑等。 Examples of the imidazole-based hardener include 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2 -Phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl -2-Phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 2,3-dihydro-1H-pyrrole-[1,2-a]benzimidazole, 2,4-bis Amino-6(2'-methylimidazole(1'))ethyl-s-triazine, 2,4-diamino-6(2'-undecylimidazole(1'))ethyl-s-triazine Triazine, 2,4-diamino-6(2'-ethyl-4-methylimidazole(1'))ethyl-s-triazine, 2,4-diamino-6(2'-methyl Imidazole(1'))ethyl-s-triazine. Isocyanuric acid adduct, 2-methyl Imidazole isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-3,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5 -Hydroxymethylimidazole, 1-cyanoethyl-2-phenyl-3,5-dicyanoethoxymethylimidazole, etc.
作為酸酐系硬化劑,例如可列舉:鄰苯二甲酸酐、偏苯三甲酸酐、均苯四甲酸二酐、二苯甲酮四羧酸酐、乙二醇偏苯三甲酸酐、聯苯基四羧酸酐等芳香族羧酸酐;壬二酸、癸二酸、十二烷二酸等脂肪族羧酸酐、四氫鄰苯二甲酸酐、六氫鄰苯二甲酸酐、耐地酸酐、氯橋酸酐、雙環庚烯二甲酸酐等脂環式羧酸酐等。 Examples of acid anhydride-based hardeners include phthalic anhydride, trimellitic anhydride, pyromellitic dianhydride, benzophenone tetracarboxylic anhydride, ethylene glycol trimellitic anhydride, and biphenyl tetracarboxylic anhydride. and other aromatic carboxylic acid anhydrides; azelaic acid, sebacic acid, dodecanedioic acid and other aliphatic carboxylic acid anhydrides, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, resistant anhydride, chloro-bridged anhydride, bicyclic Alicyclic carboxylic acid anhydrides such as heptenedicarboxylic anhydride, etc.
作為羧酸系硬化劑,例如可列舉:丁二酸、戊二酸、己二酸、癸二酸、鄰苯二甲酸、間苯二甲酸、對苯二甲酸等。 Examples of carboxylic acid-based hardeners include succinic acid, glutaric acid, adipic acid, sebacic acid, phthalic acid, isophthalic acid, terephthalic acid, and the like.
相對於樹脂組成物100質量份,硬化劑的含量可為0.01質量份以上,可為10質量份以下。 The content of the hardener may be 0.01 parts by mass or more and may be 10 parts by mass or less based on 100 parts by mass of the resin composition.
樹脂組成物亦可不含硬化劑。即便於所述情況下,由於丙烯酸樹脂中的第2結構單元具有可與水反應的反應性基,因此丙烯酸樹脂亦可與例如空氣中所含的濕氣反應而硬化。即,亦可以說樹脂組成物為具有濕氣硬化性的(濕氣硬化型的)樹脂組成物。 The resin composition may also contain no hardener. Even in this case, since the second structural unit in the acrylic resin has a reactive group that can react with water, the acrylic resin can react with, for example, moisture contained in the air to be hardened. That is, the resin composition can also be said to be a moisture-curable (moisture-curable) resin composition.
樹脂組成物亦可視需要進而含有其他添加劑。作為其他添加劑,例如可列舉:硬化促進劑、抗氧化劑、著色劑、填料、結晶核劑、熱穩定劑、熱傳導材料、塑化劑、發泡劑、阻燃劑、制振劑等。其他添加劑可單獨使用一種或將兩種以上組合使用。 The resin composition may also contain other additives if necessary. Examples of other additives include hardening accelerators, antioxidants, colorants, fillers, crystal nucleating agents, thermal stabilizers, thermal conductive materials, plasticizers, foaming agents, flame retardants, vibration damping agents, and the like. Other additives can be used individually by 1 type or in combination of 2 or more types.
樹脂組成物於90℃下可為固體狀,亦可為液體狀。 The resin composition may be solid or liquid at 90°C.
於樹脂組成物為液狀的情況下,就流動性及操作性優異的觀點而言,樹脂組成物於90℃下的黏度較佳為100Pa.s以下,更佳為50Pa.s以下,進而佳為20Pa.s以下,尤佳為10Pa.s以下。就相同的觀點而言,樹脂組成物於丙烯酸樹脂的熔點+20℃下,黏度較佳為100Pa.s以下,更佳為50Pa.s以下,進而佳為20Pa.s以下,尤佳為具有10Pa.s以下的黏度。樹脂組成物於90℃下的黏度或於丙烯酸樹脂的熔點+20℃下的黏度例如可為0.5Pa.s以上。 When the resin composition is in liquid form, from the viewpoint of excellent fluidity and workability, the viscosity of the resin composition at 90°C is preferably 100 Pa. s or less, preferably 50Pa. s or less, preferably 20Pa. s or less, preferably 10Pa. s or less. From the same point of view, the viscosity of the resin composition is preferably 100 Pa at the melting point of the acrylic resin + 20°C. s or less, preferably 50Pa. s or less, preferably 20Pa. s or less, preferably 10 Pa. viscosity below s. The viscosity of the resin composition at 90°C or the viscosity at the melting point of the acrylic resin + 20°C may be, for example, 0.5 Pa. s or above.
樹脂組成物的黏度是指基於日本工業標準(Japanese Industrial Standards,JIS)Z 8803而測定的值,具體而言是指藉由E型黏度計(東機產業(股)製造、PE-80L)測定而得的值。再者,黏度計的校正可基於JIS Z 8809-JS14000來進行。另外,丙烯酸樹脂的熔點是指利用實施例中記載的方法測定而得的值。 The viscosity of the resin composition is a value measured based on Japanese Industrial Standards (JIS) Z 8803, specifically measured with an E-type viscometer (PE-80L manufactured by Toki Sangyo Co., Ltd.) And the value obtained. Furthermore, the viscometer can be calibrated based on JIS Z 8809-JS14000. In addition, the melting point of the acrylic resin refers to a value measured by the method described in the Examples.
關於以上所說明的樹脂組成物,藉由使該樹脂組成物硬化,可較佳地用作儲熱材料(較佳用作儲熱材料用樹脂組成物)。樹脂組成物可於室溫(例如25℃)下硬化。即,一實施方式的儲熱材料包含所述樹脂組成物的硬化物。所述儲熱材料中,丙烯酸樹脂的硬化物作為具有儲熱性的成分而發揮功能,因此,於一實施方式中,儲熱材料(樹脂組成物)例如可不包含先前的儲熱材料中所使用的內含潛熱儲熱材料的儲熱膠囊,即便於所述情況下,亦可獲得優異的儲熱量。 The resin composition described above can be preferably used as a heat storage material (preferably as a resin composition for heat storage materials) by hardening the resin composition. The resin composition can be hardened at room temperature (for example, 25°C). That is, a heat storage material according to one embodiment includes a cured product of the resin composition. In the heat storage material, the cured product of acrylic resin functions as a component with heat storage properties. Therefore, in one embodiment, the heat storage material (resin composition) may not include, for example, the heat storage material used in the previous heat storage material. Heat storage capsules containing latent heat storage materials can achieve excellent heat storage even under the above circumstances.
儲熱材料(所述樹脂組成物的硬化物)可靈活運用於各種領域。儲熱材料例如可用於汽車、建築物、公共設施、地下街 等的空調設備(空調設備的效率提高)、工場等中的配管(配管的儲熱)、汽車的引擎(該引擎周圍的保溫)、電子零件(防止電子零件的升溫)、內衣纖維等。 The heat storage material (hardened product of the resin composition) can be flexibly used in various fields. Thermal storage materials can be used in cars, buildings, public facilities, underground streets, etc. Air-conditioning equipment (increasing the efficiency of air-conditioning equipment), piping in factories (heat storage in piping), automobile engines (insulation around the engine), electronic parts (preventing temperature rise of electronic parts), underwear fibers, etc.
於該些各用途中,關於儲熱材料(所述樹脂組成物的硬化物),藉由在各用途中以與產生熱的熱源熱接觸的方式配置,可儲存該熱源的熱。即,本發明的一實施方式為一種物品,其包括:熱源;及以與熱源熱接觸的方式設置的儲熱材料(所述樹脂組成物的硬化物)。 In each of these uses, the heat storage material (hardened material of the resin composition) can be placed in thermal contact with a heat source that generates heat in each use, so that the heat of the heat source can be stored. That is, one embodiment of the present invention is an article including: a heat source; and a heat storage material (hardened product of the resin composition) provided in thermal contact with the heat source.
圖1是表示包括儲熱材料的物品的一實施方式的示意剖面圖。如圖1所示,物品1包括:熱源2;及以與熱源2熱接觸的方式設置的儲熱材料3。儲熱材料3只要以與熱源2的至少一部分熱接觸的方式配置即可,如圖1所示,熱源2的一部分可露出,亦可以覆蓋熱源2的整個表面的方式配置。只要儲熱材料3與熱源2熱接觸,則熱源2與儲熱材料3可直接接觸,亦可於熱源2與儲熱材料3之間配置其他構件(例如具有熱傳導性的構件)。 FIG. 1 is a schematic cross-sectional view showing one embodiment of an article including a heat storage material. As shown in FIG. 1 , the article 1 includes: a heat source 2 ; and a heat storage material 3 arranged in thermal contact with the heat source 2 . The heat storage material 3 only needs to be arranged in thermal contact with at least a part of the heat source 2. As shown in FIG. 1, a part of the heat source 2 may be exposed, or it may be arranged to cover the entire surface of the heat source 2. As long as the heat storage material 3 is in thermal contact with the heat source 2, the heat source 2 and the heat storage material 3 may be in direct contact, or other components (such as thermally conductive components) may be disposed between the heat source 2 and the heat storage material 3.
例如,關於儲熱材料3,於與作為熱源2的空調設備(或其零件)、配管或汽車的引擎一起使用的情況下,藉由儲熱材料3與該些熱源2熱接觸,儲熱材料3儲存自熱源2產生的熱,從而容易將熱源2保持為一定以上的溫度(保溫)。於將儲熱材料3用作內衣纖維的情況下,儲熱材料3儲存自作為熱源2的人體產生的熱,因此可長時間感受到溫暖。 For example, when the heat storage material 3 is used with air conditioning equipment (or parts thereof), piping, or an engine of a car as the heat source 2, the heat storage material 3 is in thermal contact with the heat source 2. 3 stores the heat generated from the heat source 2, making it easy to maintain the heat source 2 at a temperature above a certain level (heat preservation). When the heat storage material 3 is used as an underwear fiber, the heat storage material 3 stores heat generated from the human body as the heat source 2, so that warmth can be felt for a long time.
例如,關於儲熱材料3,於與作為熱源2的電子零件一 起使用的情況下,藉由以與電子零件熱接觸的方式配置,可儲存電子零件中所產生的熱。所述情況下,例如若以與放熱構件進一步熱接觸的方式配置儲熱材料,則可將儲存於儲熱材料中的熱緩緩釋放出,可抑制電子零件中所產生的熱急劇地釋放出至外部(電子零件附近局部成為高溫)。 For example, regarding the heat storage material 3, it is the same as the electronic component as the heat source 2. When used, the heat generated in the electronic components can be stored by being arranged in thermal contact with the electronic components. In this case, for example, if the heat storage material is placed in further thermal contact with the heat radiating member, the heat stored in the heat storage material can be gradually released, and the heat generated in the electronic component can be suppressed from being released suddenly. to the outside (partially high temperature near electronic parts).
關於儲熱材料3,可將硬化物形成為片狀(膜狀)後配置於熱源2。於樹脂組成物於90℃下為固體狀的情況下,片狀的儲熱材料3例如可藉由將樹脂組成物加熱熔融並加以成形而獲得。即,於一實施方式中,儲熱材料3的製造方法包括將樹脂組成物加熱熔融並加以成形的步驟(成形步驟)。成形步驟中的成形可為射出成形、壓縮成形或轉移成形。所述情況下,儲熱材料3可不需要外殼而將儲熱材料3單獨於所安裝的對象物上貼附、或者捲繞、或者以各種狀態安裝。 The heat storage material 3 can be formed into a sheet-like (film-like) hardened material and placed in the heat source 2 . When the resin composition is solid at 90° C., the sheet-shaped heat storage material 3 can be obtained, for example, by heating, melting, and molding the resin composition. That is, in one embodiment, the manufacturing method of the heat storage material 3 includes the step of heating and melting the resin composition and shaping it (shaping step). The forming in the forming step may be injection molding, compression molding or transfer molding. In this case, the heat storage material 3 does not need a casing, and the heat storage material 3 can be attached to the object to be installed alone, or rolled, or installed in various states.
於另一實施方式中,所述樹脂組成物的硬化物亦可用於儲熱材料用途以外的用途。硬化物例如可較佳地用於形成防水材料、防霜材料、折射率調整材料、潤滑材料、吸附材料、熱硬化應力緩和材料或低介電材料。防水材料、防霜材料、折射率調整材料、潤滑材料、吸附材料、熱硬化應力緩和材料及低介電材料分別亦可包含例如所述樹脂組成物的硬化物。 In another embodiment, the cured product of the resin composition can also be used for purposes other than heat storage materials. The hardened material can be preferably used to form, for example, a waterproof material, a frost-proof material, a refractive index adjusting material, a lubricating material, an adsorbent material, a thermosetting stress relaxing material, or a low dielectric material. The waterproof material, anti-frost material, refractive index adjusting material, lubricating material, adsorbent material, thermosetting stress relaxing material and low dielectric material may each include, for example, a hardened product of the resin composition.
[實施例] [Example]
以下,藉由實施例而更具體地說明本發明,但本發明並不限定於以下實施例。 Hereinafter, the present invention will be described in more detail using examples, but the present invention is not limited to the following examples.
[丙烯酸樹脂的合成] [Synthesis of acrylic resin]
實施例1-1~實施例1-6中所使用的丙烯酸樹脂1A~丙烯酸樹脂1F如以下般藉由公知的懸浮聚合方法來合成。 Acrylic resin 1A to acrylic resin 1F used in Examples 1-1 to 1-6 were synthesized by a known suspension polymerization method as follows.
(丙烯酸樹脂1A的合成例) (Synthesis example of acrylic resin 1A)
將包括攪拌機、溫度計、氮氣導入管、排出管及加熱套的500mL燒瓶作為反應器,以100mL/分鐘於燒瓶內流通氮氣。 A 500 mL flask including a stirrer, a thermometer, a nitrogen gas inlet pipe, a discharge pipe, and a heating mantle was used as a reactor, and nitrogen gas was circulated in the flask at 100 mL/min.
繼而,將作為單體的丙烯酸十四烷基酯80g、丙烯酸丁酯10g、3-甲基丙烯醯氧基丙基三甲氧基矽烷10g混合,進而添加作為聚合起始劑的過氧化月桂醯0.41g、作為鏈轉移劑的正辛基硫醇0.12g,進行溶解而獲得混合物。然後,向該混合物中加入水201.3g(相對於混合物100質量份而為200質量份)、作為懸浮劑的聚乙烯醇(Polyvinyl Alcohol,PVA)0.2g(相對於混合物100質量份而為0.02質量份)、作為還原劑的抗壞血酸0.1g,從而製備分散液。 Next, 80 g of myristyl acrylate, 10 g of butyl acrylate, and 10 g of 3-methacryloxypropyltrimethoxysilane were mixed as monomers, and 0.41 lauryl peroxide as a polymerization initiator was added. g. 0.12g of n-octylmercaptan as a chain transfer agent was dissolved to obtain a mixture. Then, 201.3 g of water (200 parts by mass with respect to 100 parts by mass of the mixture) and 0.2 g of polyvinyl alcohol (PVA) as a suspending agent (0.02 parts by mass with respect to 100 parts by mass of the mixture) were added to the mixture. part) and 0.1 g of ascorbic acid as a reducing agent to prepare a dispersion.
繼而,向流通氮氣且溶存氧為1ppm以下的燒瓶(反應器)內供給該分散液,一面於反應器內溫度50℃下以攪拌轉速250次/分鐘進行攪拌,一面進行加熱,並進行4小時反應。一面於反應過程中取樣,一面根據所生成的樹脂的比重來算出聚合率,於確認到聚合率為80%以上後,升溫至70℃,進而反應2小時。其後,將反應器內的產物冷卻,取出該產物,並進行水洗、脫水、乾燥,從而獲得丙烯酸樹脂1A。 Then, the dispersion liquid was supplied into a flask (reactor) in which nitrogen gas was circulated and the dissolved oxygen was 1 ppm or less, and the dispersion was heated while stirring at a stirring speed of 250 times/min at an internal temperature of 50° C. in the reactor for 4 hours. reaction. While taking samples during the reaction, the polymerization rate was calculated based on the specific gravity of the produced resin. After confirming that the polymerization rate was 80% or more, the temperature was raised to 70°C and the reaction was continued for 2 hours. Thereafter, the product in the reactor is cooled, and the product is taken out, washed with water, dehydrated, and dried to obtain acrylic resin 1A.
關於丙烯酸樹脂1B~丙烯酸樹脂1F,除了將單體成分 變更為表1所示的單體成分以外,利用與丙烯酸樹脂1A的合成例相同的方法來合成。 Regarding acrylic resin 1B ~ acrylic resin 1F, except for the monomer components Except for changing the monomer components shown in Table 1, it was synthesized by the same method as the synthesis example of acrylic resin 1A.
[丙烯酸樹脂的合成] [Synthesis of acrylic resin]
如以下般,藉由公知的溶液聚合方法來合成實施例2-1~實施例2-6中所使用的丙烯酸樹脂2A~丙烯酸樹脂2F。 The acrylic resins 2A to 2F used in Examples 2-1 to 2-6 were synthesized by a known solution polymerization method as follows.
(丙烯酸樹脂2A的合成例) (Synthesis example of acrylic resin 2A)
將包括攪拌機、溫度計、氮氣導入管、排出管及加熱套的500mL燒瓶作為反應器,將作為單體的丙烯酸十四烷基酯80g、丙烯酸丁酯10g、3-甲基丙烯醯氧基丙基三甲氧基矽烷10g、作為溶媒的2-丙醇81.8g混合,並加入至反應器中,於室溫(25℃)下以攪拌轉速250次/分鐘進行攪拌,以100mL/分鐘流通氮氣1小時。其後,歷時30分鐘升溫至70℃,於升溫結束後,將使偶氮雙異丁腈0.28g溶解於甲基乙基酮2ml中而得的溶液添加於反應器中,開始反應。其後,於反應器內溫度70℃下進行攪拌,並進行5小時反應。其後,將使偶氮雙異丁腈0.05g溶解於甲基乙基酮2 mL中而得的溶液添加於反應器中,歷時15分鐘升溫至90℃,進而反應2小時。其後,將溶媒去除並加以乾燥,從而獲得丙烯酸樹脂2A。 A 500 mL flask including a stirrer, a thermometer, a nitrogen gas inlet pipe, a discharge pipe and a heating mantle was used as a reactor, and 80 g of myristyl acrylate, 10 g of butyl acrylate, and 3-methacryloxypropyl were used as monomers. 10g of trimethoxysilane and 81.8g of 2-propanol as a solvent were mixed and added to the reactor, stirred at room temperature (25°C) at a stirring speed of 250 times/min, and nitrogen was circulated at 100mL/min for 1 hour. . Thereafter, the temperature was increased to 70° C. over 30 minutes. After the temperature increase was completed, a solution in which 0.28 g of azobisisobutyronitrile was dissolved in 2 ml of methyl ethyl ketone was added to the reactor to start the reaction. Thereafter, the reaction was carried out for 5 hours with stirring at an internal temperature of 70°C in the reactor. Thereafter, 0.05 g of azobisisobutyronitrile was dissolved in methyl ethyl ketone 2 The solution obtained in mL was added to the reactor, the temperature was raised to 90°C over 15 minutes, and the reaction was continued for 2 hours. Thereafter, the solvent is removed and dried to obtain acrylic resin 2A.
關於丙烯酸樹脂2B~丙烯酸樹脂2F,除了將單體成分變更為表2所示的單體成分以外,利用與丙烯酸樹脂2A的合成例相同的方法來合成。將所獲得的各丙烯酸樹脂的熔點示於表2中。 Acrylic resin 2B to acrylic resin 2F were synthesized by the same method as the synthesis example of acrylic resin 2A, except that the monomer components were changed to those shown in Table 2. Table 2 shows the melting point of each acrylic resin obtained.
(丙烯酸樹脂2G的合成例) (Synthesis example of acrylic resin 2G)
將包括攪拌機、溫度計、氮氣導入管、排出管及加熱套的500mL燒瓶作為反應器,向反應器中加入作為溶媒的甲苯117.4g,於室溫(25℃)下以攪拌轉速200次/分鐘進行攪拌,以100mL/分鐘流通氮氣30分鐘。其後,歷時30分鐘升溫至110℃,於升溫結束後,歷時2小時30分鐘滴加預先混合的作為單體的丙烯酸硬脂酯170g、丙烯酸丁酯20g、甲基丙烯酸2-異氰酸基乙酯10g、作為起始劑的偶氮雙異丁腈2g的混合液。其後,於反應器內溫度110℃下進行攪拌,並進行1小時反應。其後,將使偶氮雙異丁腈0.05g溶解於甲苯2mL中而得的溶液添加於反應器中,進而反應2小時。其後,將溶媒去除並加以乾燥,從而獲得丙烯酸樹脂2G。 Use a 500mL flask including a stirrer, thermometer, nitrogen inlet pipe, discharge pipe and heating jacket as a reactor. Add 117.4g of toluene as a solvent into the reactor and stir at room temperature (25°C) at a stirring speed of 200 times/minute. Stir and circulate nitrogen at 100 mL/min for 30 minutes. Thereafter, the temperature was raised to 110° C. over 30 minutes. After the temperature rise was completed, 170 g of stearyl acrylate, 20 g of butyl acrylate, and 2-isocyanate methacrylate as monomers were added dropwise over 2 hours and 30 minutes. A mixture of 10 g of ethyl ester and 2 g of azobisisobutyronitrile as a starting agent. Thereafter, the reaction was carried out for 1 hour while stirring at an internal temperature of 110°C in the reactor. Thereafter, a solution obtained by dissolving 0.05 g of azobisisobutyronitrile in 2 mL of toluene was added to the reactor, and the reaction was continued for 2 hours. Thereafter, the solvent is removed and dried to obtain acrylic resin 2G.
關於丙烯酸樹脂2H~丙烯酸樹脂2K,除了將單體成分變更為表3所示的單體成分以外,利用與丙烯酸樹脂2G的合成例相同的方法來合成。將所獲得的各丙烯酸樹脂的熔點示於表3中。 Acrylic resin 2H to acrylic resin 2K were synthesized by the same method as the synthesis example of acrylic resin 2G, except that the monomer components were changed to those shown in Table 3. Table 3 shows the melting point of each acrylic resin obtained.
丙烯酸樹脂的熔點如以下般測定。 The melting point of acrylic resin is measured as follows.
使用示差掃描熱量測定計(珀金埃爾默(PerkinElmer)公司 製造、型號DSC8500),以20℃/分鐘升溫至100℃,於100℃下保持3分鐘後,以10℃/分鐘的速度降溫至-30℃,繼而於-30℃下保持3分鐘後,以10℃/分鐘的速度再次升溫至100℃,藉此測定丙烯酸樹脂的熱行為,並算出熔解峰值作為丙烯酸樹脂的熔點。 Using a differential scanning calorimeter (PerkinElmer) Make, model DSC8500), heat up to 100℃ at 20℃/min, hold at 100℃ for 3 minutes, cool down to -30℃ at 10℃/min, then keep at -30℃ for 3 minutes, then The temperature was again raised to 100°C at a rate of 10°C/min, whereby the thermal behavior of the acrylic resin was measured, and the melting peak was calculated as the melting point of the acrylic resin.
[表2]
再者,丙烯酸月桂酯使用大阪有機化學工業(股)製造,丙烯酸十四烷基酯使用東京化成工業(股)製造,丙烯酸丁酯使用和光純藥工業(股)製造,丙烯酸硬脂酯、丙烯酸山萮酯使用日油(股)製造,3-甲基丙烯醯氧基丙基三甲氧基矽烷、8-甲基丙烯醯氧基辛基三甲氧基矽烷使用信越化學工業(股)製造,甲基丙烯酸2-異氰酸基乙酯使用昭和電工(股)製造。 In addition, lauryl acrylate is manufactured by Osaka Organic Chemical Industry Co., Ltd., myristyl acrylate is manufactured by Tokyo Chemical Industry Co., Ltd., butyl acrylate is manufactured by Wako Pure Chemical Industries, Ltd., stearyl acrylate, acrylic acid Behenate is manufactured by NOF Co., Ltd., 3-methacryloxypropyltrimethoxysilane and 8-methacryloxyoctyltrimethoxysilane are manufactured by Shin-Etsu Chemical Industry Co., Ltd. 2-Isocyanatoethyl acrylate was manufactured by Showa Denko Co., Ltd.
[儲熱材料的製作] [Production of heat storage materials]
(實施例1-1) (Example 1-1)
將丙烯酸樹脂1A 15g、作為觸媒的雙(乙醯乙酸乙酯)(2,4-戊二酮酸)鋁(濃度76%,2-丙醇溶液)0.015g、作為溶媒的甲基乙基酮20g混合而製備樹脂組成物。將樹脂組成物塗佈於聚對苯二甲酸乙二酯(Polyethylene Terephthalate,PET)膜上,於80℃下加熱乾燥30分鐘,繼而,於室溫下固化24小時,然後將PET膜去除,從而獲得厚度100μm的膜狀的儲熱材料。 Mix 15g of acrylic resin 1A, 0.015g of bis(ethyl acetyl acetate)(2,4-pentanedioate)aluminum (concentration 76%, 2-propanol solution) as a catalyst, and methylethyl as a solvent. 20 g of ketone were mixed to prepare a resin composition. The resin composition is coated on a polyethylene terephthalate (PET) film, heated and dried at 80°C for 30 minutes, and then cured at room temperature for 24 hours, and then the PET film is removed. A film-like heat storage material with a thickness of 100 μm was obtained.
(實施例1-2~實施例1-6) (Example 1-2~Example 1-6)
除了如表4所示般變更樹脂組成物的組成以外,利用與實施例1-1相同的方法來製作儲熱材料。 A heat storage material was produced in the same manner as in Example 1-1 except that the composition of the resin composition was changed as shown in Table 4.
(實施例2-1) (Example 2-1)
將丙烯酸樹脂2A 15g、作為觸媒的雙(乙醯乙酸乙酯)(2,4-戊二酮酸)鋁(濃度76%,2-丙醇溶液)0.015g混合而獲得樹脂組成物。使用E型黏度計(東機產業(股)製造、PE-80L),並基於JIS Z 8803來測定所述樹脂組成物於90℃下的黏度。將結果示於表5中。 15 g of acrylic resin 2A and 0.015 g of bis(ethyl acetate acetate)(2,4-pentanedioate)aluminum (concentration 76%, 2-propanol solution) as a catalyst were mixed to obtain a resin composition. The viscosity of the resin composition at 90°C was measured based on JIS Z 8803 using an E-type viscometer (PE-80L manufactured by Toki Sangyo Co., Ltd.). The results are shown in Table 5.
繼而,將樹脂組成物填充於10cm×10cm×1mm的模框(不鏽鋼(SUS)板)中,於室溫下固化24小時,從而獲得厚度1mm的片狀的儲熱材料。 Then, the resin composition was filled into a 10 cm×10 cm×1 mm mold frame (stainless steel (SUS) plate) and cured at room temperature for 24 hours, thereby obtaining a sheet-shaped heat storage material with a thickness of 1 mm.
(實施例2-2~實施例2-6) (Example 2-2~Example 2-6)
除了如表5所示般變更樹脂組成物的組成以外,利用與實施例2-1相同的方法來實施樹脂組成物的黏度測定及儲熱材料的製 作。將結果示於表5中。 Except for changing the composition of the resin composition as shown in Table 5, the viscosity measurement of the resin composition and the production of the heat storage material were carried out in the same manner as in Example 2-1. do. The results are shown in Table 5.
(實施例2-7) (Example 2-7)
將丙烯酸樹脂2G 15g、作為觸媒的二月桂酸二丁基錫0.015g混合而獲得樹脂組成物。使用E型黏度計(東機產業(股)製造、PE-80L),並基於JIS Z 8803來測定所述樹脂組成物於90℃下的黏度。將結果示於表6中。 15 g of acrylic resin 2G and 0.015 g of dibutyltin dilaurate as a catalyst were mixed to obtain a resin composition. The viscosity of the resin composition at 90°C was measured based on JIS Z 8803 using an E-type viscometer (PE-80L manufactured by Toki Sangyo Co., Ltd.). The results are shown in Table 6.
繼而,將樹脂組成物填充於10cm×10cm×1mm的模框(不鏽鋼(SUS)板)中,於室溫下固化24小時,從而獲得厚度1mm的片狀的儲熱材料。 Then, the resin composition was filled into a 10 cm×10 cm×1 mm mold frame (stainless steel (SUS) plate) and cured at room temperature for 24 hours, thereby obtaining a sheet-shaped heat storage material with a thickness of 1 mm.
(實施例2-8~實施例2-11) (Example 2-8~Example 2-11)
除了如表6所示般變更樹脂組成物的組成以外,利用與實施例2-7相同的方法來實施樹脂組成物的黏度測定及儲熱材料的製作。將結果示於表6中。 Except that the composition of the resin composition was changed as shown in Table 6, the viscosity measurement of the resin composition and the production of the heat storage material were carried out in the same manner as in Example 2-7. The results are shown in Table 6.
[熔點及儲熱量的評價] [Evaluation of melting point and heat storage]
使用示差掃描熱量測定計(珀金埃爾默(PerkinElmer)公司製造、型號DSC8500)測定實施例中所製作的各儲熱材料,並算出熔點與儲熱量。具體而言,以20℃/分鐘升溫至100℃,於100℃下保持3分鐘後,以10℃/分鐘的速度降溫至-30℃,繼而於-30℃下保持3分鐘後,以10℃/分鐘的速度再次升溫至100℃而測定熱行為。將熔解峰值設為儲熱材料的熔點,將面積設為儲熱量。將結果示於表4~表6中。再者,若儲熱量為30J/g以上,則可以說儲熱量優異。 Each heat storage material produced in the Example was measured using a differential scanning calorimeter (model DSC8500 manufactured by PerkinElmer), and the melting point and heat storage amount were calculated. Specifically, the temperature was raised to 100°C at a rate of 20°C/min, maintained at 100°C for 3 minutes, then cooled to -30°C at a rate of 10°C/min, and then maintained at -30°C for 3 minutes, then at 10°C. The temperature was again raised to 100°C at a rate of /min and the thermal behavior was measured. Let the melting peak be the melting point of the heat storage material and the area be the heat storage heat. The results are shown in Tables 4 to 6. Furthermore, if the heat storage amount is 30 J/g or more, it can be said that the heat storage amount is excellent.
[漏液及揮發性的評價] [Evaluation of liquid leakage and volatility]
針對實施例中所製作的各儲熱材料,測定於80℃的溫度下、大氣環境下靜置1000小時前後的重量變化,並測定重量減少率(%)。將結果示於表4~表6中。 For each heat storage material produced in the Example, the weight change before and after it was left standing for 1000 hours in an atmospheric environment at a temperature of 80° C. was measured, and the weight reduction rate (%) was measured. The results are shown in Tables 4 to 6.
[耐熱性的試驗(TG-DTA)] [Heat resistance test (TG-DTA)]
使用熱重量天平TG-DTA6300(日立高新技術科學(股)),測定實施例中所製作的各儲熱材料的重量減少。讀取自初始重量減少1%重量的溫度(℃),設為1%重量減少溫度的值。將結果示於表4~表6中。 The weight loss of each heat storage material produced in the Example was measured using a thermogravimetric balance TG-DTA6300 (Hitachi High-Tech Scientific Co., Ltd.). Read the temperature (℃) at which the weight decreases by 1% from the initial weight, and set it to the value of the temperature at which the weight decreases by 1%. The results are shown in Tables 4 to 6.
[表5]
表4~表6中,Al錯合物表示雙(乙醯乙酸乙酯)(2,4-戊二酮酸)鋁(濃度76%,2-丙醇溶液)(和光純藥(股)製造),錫觸媒表示二月桂酸二丁基錫(和光純藥(股)製造)。 In Tables 4 to 6, the Al complex represents bis(ethyl acetate acetate) (2,4-pentanedioneate) aluminum (76% concentration, 2-propanol solution) (manufactured by Wako Pure Chemical Industries, Ltd. ), and the tin catalyst represents dibutyltin dilaurate (manufactured by Wako Pure Chemical Industries, Ltd.).
實施例的儲熱材料的儲熱量優異,此外,耐熱性亦優 異,可抑制漏液及揮發。尤其,實施例2-1~實施例2-11的儲熱材料可藉由使液體狀的樹脂組成物硬化而獲得,因此在亦可應用於具有複雜的形狀的構件的方面有利。 The heat storage material of the Example has excellent heat storage capacity and excellent heat resistance. Different, can inhibit leakage and volatilization. In particular, the heat storage materials of Examples 2-1 to 2-11 can be obtained by hardening a liquid resin composition, and therefore are advantageous in that they can be applied to members having complex shapes.
1:物品 1: Items
2:熱源 2:Heat source
3:儲熱材料 3: Heat storage material
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JP2010202863A (en) * | 2009-02-04 | 2010-09-16 | Cemedine Co Ltd | Curable composition |
JP2016012484A (en) * | 2014-06-30 | 2016-01-21 | 東洋インキScホールディングス株式会社 | Resin fine particle for power storage device underlying layer, ink for underlying layer formation, underlying layer-attached collector, power storage device electrode, and power storage device |
Also Published As
Publication number | Publication date |
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JP7363787B2 (en) | 2023-10-18 |
TW202012465A (en) | 2020-04-01 |
JPWO2020022050A1 (en) | 2021-08-05 |
WO2020022050A1 (en) | 2020-01-30 |
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