TWI827071B - Ultra thin vapor chamber element structure and manufacturing method thereof - Google Patents

Ultra thin vapor chamber element structure and manufacturing method thereof Download PDF

Info

Publication number
TWI827071B
TWI827071B TW111119679A TW111119679A TWI827071B TW I827071 B TWI827071 B TW I827071B TW 111119679 A TW111119679 A TW 111119679A TW 111119679 A TW111119679 A TW 111119679A TW I827071 B TWI827071 B TW I827071B
Authority
TW
Taiwan
Prior art keywords
sheet
capillary
capillary structure
vapor chamber
groove
Prior art date
Application number
TW111119679A
Other languages
Chinese (zh)
Other versions
TW202249219A (en
Inventor
陳振賢
黄振權
Original Assignee
大陸商廣州力及熱管理科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大陸商廣州力及熱管理科技有限公司 filed Critical 大陸商廣州力及熱管理科技有限公司
Publication of TW202249219A publication Critical patent/TW202249219A/en
Application granted granted Critical
Publication of TWI827071B publication Critical patent/TWI827071B/en

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • B22F3/11—Making porous workpieces or articles
    • B22F3/1121—Making porous workpieces or articles by using decomposable, meltable or sublimatable fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/002—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of porous nature
    • B22F7/004—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of porous nature comprising at least one non-porous part

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Composite Materials (AREA)
  • Chemical & Material Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

An ultra thin vapor chamber element structure includes a first sheet, a second sheet, a first wick structure and a second wick structure. The first sheet has a first surface, the first surface has a first groove structure and a first support structure. The second sheet has a second surface corresponding to the first surface; the edge of the second surface and the edge of the first surface are hermetically welded. The first groove structure on the first surface and the second surface form a hermetic accommodation space. The first wick structure is formed in the first groove structure. The second wick structure is formed between the first support structure and the second surface. The wick structures can be formed by printing and sintering the paste at one time, which is advantageous to the implementation of the diffusion bonding process of the device.

Description

超薄型均溫板元件結構及其製造方法 Ultra-thin vapor chamber component structure and manufacturing method thereof

本發明係關於一種均溫板元件結構及其製作方法，尤其是指一種毛細結構置於特殊位置之超薄型均溫板元件結構。 The present invention relates to a vapor chamber element structure and a manufacturing method thereof, in particular to an ultra-thin vapor chamber element structure in which a capillary structure is placed in a special position.

電子及手持通訊裝置產品的發展趨勢不斷地朝向薄型化與高功能化，人們對裝置內微處理器(Microprocessor)運算速度及功能的要求也越來越高。微處理器是電子及通訊產品的核心元件，在高速運算下容易產生熱而成為電子裝置的主要發熱元件。如果沒能即時將熱散去，將產生局部性的處理熱點(Hot Spot)。倘若沒有良好熱管理方案及散熱系統，往往造成微處理器過熱而無法發揮出應有的功能，甚至影響到整個電子裝置系統的壽命及可靠度。因此，電子產品需要優良的散熱能力，尤其像智能手機(Smartphone)及平板電腦(Tablet PC)這種超薄的電子裝置更需要有優良的散熱能力。 The development trend of electronic and handheld communication device products continues to be thinner and more functional, and people have higher and higher requirements for the computing speed and functions of the microprocessor (Microprocessor) in the device. Microprocessors are core components of electronic and communication products. They easily generate heat under high-speed operations and become the main heating element of electronic devices. If the heat cannot be dissipated immediately, local processing hot spots (Hot Spots) will occur. Without a good thermal management solution and cooling system, the microprocessor will often overheat and be unable to perform its functions, and even affect the life and reliability of the entire electronic device system. Therefore, electronic products require excellent heat dissipation capabilities, especially ultra-thin electronic devices such as smartphones and tablet PCs.

目前，電子及通訊產品處理熱點(Hot Spot)的解熱及導熱的有效方式，是將薄型均溫板(Vapor Chamber)的吸熱端(Evaporator)接觸該電子裝置之微處理器。微處理器所產生的高熱被傳導並分佈至機殼，藉此將熱輻射至空氣中。均溫板基本上是一內含工作流體之封閉腔體，藉由腔體內工作流體持續循環的液氣二相變化，及氣體及液體於吸熱端及冷凝端間 氣往液返的對流，而達到快速導熱或散熱的目的。 Currently, an effective way to resolve and conduct heat in hot spots in electronic and communication products is to contact the heat-absorbing end (Evaporator) of a thin vapor chamber (Vapor Chamber) with the microprocessor of the electronic device. The high heat generated by the microprocessor is conducted and distributed to the chassis, thereby radiating the heat into the air. The vapor chamber is basically a closed cavity containing the working fluid. Through the continuous circulation of the working fluid in the cavity, the two-phase change of liquid and gas is realized, and the gas and liquid are transferred between the heat-absorbing end and the condensing end. The convection of gas to liquid returns to achieve the purpose of rapid heat conduction or heat dissipation.

習知超薄型均溫板的製作方法係將片狀銅基板蝕刻出溝槽後，在溝槽中鋪置銅網(Copper Screen Mesh)或編織網(Copper Woven Mesh)。在實際應用時，必需先將銅網依溝槽的形狀及尺寸裁切，方能鋪置在溝槽中。銅網經石墨治具壓合並在高溫下燒結，形成毛細結構於溝槽表面。接著將片狀銅基板以溝槽在內的方式焊接，形成氣道空腔。片狀銅基板進一步封合、注水、抽真空等，製成具有毛細結構之均溫板或板型熱導管，如圖1所示。 The conventional manufacturing method of an ultra-thin vapor chamber is to etch a groove out of a sheet copper substrate and lay a copper screen mesh or a copper woven mesh in the groove. In actual application, the copper mesh must be cut according to the shape and size of the trench before it can be laid in the trench. The copper mesh is pressed by a graphite jig and sintered at high temperature to form a capillary structure on the groove surface. Then, the sheet copper substrate is welded with the groove inside to form the air channel cavity. The sheet copper substrate is further sealed, filled with water, evacuated, etc. to form a uniform temperature plate or plate-type heat pipe with a capillary structure, as shown in Figure 1.

然而，銅網(Copper Screen Mesh)僅交叉編織，毛細結構簡單。厚度小於0.3公厘(mm)的超薄均溫板元件由於氣道空間的限制，毛細結構厚度往往僅能有幾十微米(um)之空間。因此，一般銅網做為毛細結構發揮的毛細力往往不足。此外，超薄均溫板元件的形狀輕薄又不方正，不利於量產時銅網的編織、裁切、鋪置以及石墨治具的壓合等製程。整體而言，以銅網製作超薄均溫板元件毛細結構的工序較為複雜且不利於高良率量產。 However, Copper Screen Mesh is only cross-woven and has a simple capillary structure. Due to the limitation of air channel space in ultra-thin vapor chamber components with a thickness less than 0.3 millimeters (mm), the thickness of the capillary structure is often only a few tens of microns (um). Therefore, the capillary force exerted by the general copper mesh as a capillary structure is often insufficient. In addition, the shape of ultra-thin vapor chamber components is light and not square, which is not conducive to processes such as weaving, cutting, and laying of copper mesh and lamination of graphite fixtures during mass production. Overall, the process of using copper mesh to produce the capillary structure of ultra-thin vapor chamber components is complex and not conducive to high-yield mass production.

再者，當單一均溫板要處理多個熱點的解熱，或是均溫板傾斜時，液相工作流體在不同位置的流量和流速並不相同。不同型態、不同位置的複合性毛細結構將有助於兼顧液相工作流體的流量和流速，但是目前的構造和工藝尚有改善空間。 Furthermore, when a single vapor chamber has to handle the deheating of multiple hot spots, or when the vapor chamber is tilted, the flow rate and flow rate of the liquid phase working fluid at different locations are not the same. Composite capillary structures of different types and positions will help to balance the flow rate and flow rate of the liquid working fluid, but there is still room for improvement in the current structure and process.

有鑑於此，本發明提供一種超薄型均溫板元件結構及其製作方法，以提升液相工作流體的流量和流速，也有利於漿料印刷燒結毛細結 構工藝及擴散焊封合工藝。 In view of this, the present invention provides an ultra-thin vapor chamber element structure and a manufacturing method thereof to increase the flow rate and flow rate of the liquid phase working fluid, and is also beneficial to slurry printing and sintering capillary junctions. Structure process and diffusion welding sealing process.

本發明提供之超薄型均溫板元件結構包含有第一片材、第二片材、第一毛細結構和第二毛細結構。第一片材具有第一表面，第一表面具有第一溝槽結構，第一溝槽結構中具有第一支撐結構。第二片材具有相對應第一表面之第二表面，第二表面之邊緣與第一表面之邊緣氣密焊合，第一表面之第一溝槽結構與第二表面之間形成密閉容置空間。第一毛細結構，形成於第一溝槽結構內。第二毛細結構形成於第一支撐結構與第二表面之間。 The ultra-thin vapor chamber element structure provided by the invention includes a first sheet, a second sheet, a first capillary structure and a second capillary structure. The first sheet has a first surface, the first surface has a first groove structure, and the first groove structure has a first support structure. The second sheet has a second surface corresponding to the first surface. The edge of the second surface is airtightly welded to the edge of the first surface. A sealed accommodation is formed between the first groove structure of the first surface and the second surface. space. The first capillary structure is formed in the first groove structure. The second capillary structure is formed between the first support structure and the second surface.

其中，第二表面進一步具有第二溝槽結構，第二溝槽結構中具有第二支撐結構，第二毛細結構形成於第一支撐結構與第二支撐結構之間。 Wherein, the second surface further has a second groove structure, the second groove structure has a second support structure, and the second capillary structure is formed between the first support structure and the second support structure.

其中，第一毛細結構與第二毛細結構係由一漿料經一烘乾、裂解、燒結過程而形成，第一毛細結構與第二毛細結構之平均孔隙尺寸小於10um，超薄型均溫板元件結構之厚度不大於1.0mm，並進一步具有一工作流體(Working Fluid)置於密閉容置空間，且密閉容置空間為真空負壓狀態。 Among them, the first capillary structure and the second capillary structure are formed by a slurry through a drying, cracking, and sintering process. The average pore size of the first capillary structure and the second capillary structure is less than 10um, and the ultra-thin vapor chamber is The thickness of the component structure is not greater than 1.0mm, and further has a working fluid (Working Fluid) placed in a sealed accommodation space, and the sealed accommodation space is in a vacuum and negative pressure state.

其中，該第一毛細結構係為船型多孔隙毛細結構，第一溝槽結構具有溝槽側壁，第一毛細結構和該第一溝槽結構間具有一側壁間隙，或稱船型多孔隙毛細結構和溝槽側壁之間具有側壁間隙，第一毛細結構之上表面之寬度大於第一毛細結構之下表面之寬度。 Wherein, the first capillary structure is a boat-shaped porous capillary structure, the first groove structure has a groove side wall, and there is a side wall gap between the first capillary structure and the first groove structure, or it is called a boat-shaped porous capillary structure and There is a sidewall gap between the side walls of the groove, and the width of the upper surface of the first capillary structure is greater than the width of the lower surface of the first capillary structure.

於一具體實施例中，第一支撐結構之高度小於第一表面之邊緣高度；或於另一具體實施例中，第二支撐結構之高度小於第二表面之邊 緣高度；或於再一具體實施例中，第一支撐結構之高度小於第一表面之邊緣高度，同時第二支撐結構之高度小於第二表面之邊緣高度。 In a specific embodiment, the height of the first support structure is less than the edge height of the first surface; or in another specific embodiment, the height of the second support structure is less than the edge height of the second surface. The edge height; or in another specific embodiment, the height of the first support structure is less than the edge height of the first surface, and the height of the second support structure is less than the edge height of the second surface.

本發明提供之超薄型均溫板元件結構之製造方法包含有：S1，提供具有第一表面之第一片材，第一表面具有第一溝槽結構，第一溝槽結構內具有第一支撐結構；S2，鋪置漿料於第一溝槽結構並且覆蓋過第一支撐結構，漿料包含有金屬粉末；S3，加熱漿料以燒結金屬粉末，而產生第一毛細結構形成於第一溝槽結構之內和第二毛細結構形成於第一支撐結構之上；S4，蓋合一第二片材於第一片材上，第二片材具有相對應第一表面之第二表面；S5，加熱第一片材和第二片材的邊緣而密封第一片材和第二片材。 The manufacturing method of an ultra-thin vapor chamber component structure provided by the present invention includes: S1, providing a first sheet with a first surface, the first surface having a first groove structure, and the first groove structure having a first Support structure; S2, lay slurry on the first trench structure and cover the first support structure, the slurry contains metal powder; S3, heat the slurry to sinter the metal powder to generate a first capillary structure formed on the first The second capillary structure is formed within the groove structure and on the first support structure; S4, cover a second sheet on the first sheet, and the second sheet has a second surface corresponding to the first surface; S5, heat the edges of the first sheet and the second sheet to seal the first sheet and the second sheet.

其中，金屬粉末包含有複數個銅(Cu)顆粒及複數個氧化亞銅(Cu2O)顆粒，且加熱漿料以燒結該金屬粉末之步驟S3進一步係為於含氫氣氛下加熱以燒結金屬粉末，使氧化亞銅顆粒還原並彼此連結形成複數個鏈狀銅構件，且鏈狀銅構件彼此耦接，而銅顆粒形成類球狀銅構件，散佈於鏈狀銅構件之間，進而產生第一毛細結構形成於第一溝槽結構之內和第二毛細結構形成於第一支撐結構之上。 Wherein, the metal powder includes a plurality of copper (Cu) particles and a plurality of cuprous oxide (Cu 2 O) particles, and step S3 of heating the slurry to sinter the metal powder further involves heating in a hydrogen-containing atmosphere to sinter the metal. powder, the cuprous oxide particles are reduced and connected to each other to form a plurality of chain-like copper components, and the chain-like copper components are coupled to each other, and the copper particles form spherical-like copper components, which are dispersed between the chain-like copper components, thereby producing a third A capillary structure is formed within the first groove structure and a second capillary structure is formed on the first support structure.

其中，漿料進一步包含有複數個銅顆粒、一有機溶劑及一聚合物，且加熱漿料以燒結該金屬粉末之步驟S3進一步係為加熱漿料以去除有機溶劑、裂解聚合物並燒結金屬粉末，而產生一第一毛細結構形成於第一溝槽結構之內和一第二毛細結構形成於第一支撐結構之上，第一毛細結構係為船型多孔隙毛細結構，第一毛細結構和第一溝槽結構間具有一側壁間隙。 Wherein, the slurry further includes a plurality of copper particles, an organic solvent and a polymer, and step S3 of heating the slurry to sinter the metal powder further includes heating the slurry to remove the organic solvent, cracking the polymer and sintering the metal powder. , and a first capillary structure is formed within the first groove structure and a second capillary structure is formed on the first support structure. The first capillary structure is a boat-shaped porous capillary structure, and the first capillary structure and the third capillary structure are formed on the first support structure. There is a side wall gap between the groove structures.

其中，第一支撐結構之高度小於第一表面之邊緣高度。 Wherein, the height of the first supporting structure is less than the edge height of the first surface.

綜上所述，本發明藉由薄型均溫板元件第一溝槽結構之內的第一毛細結構和第一支撐結構上之第二毛細結構，構成均溫板中的複合式毛細結構。介於支撐結構及第二片材之間被擠壓的第二毛細結構，可增加第一毛細結構中液相工作流體流速，亦可作為多個溝槽內液相工作流體流量的調控，還能當做支撐結構之一部份。此外，本發明超薄型均溫板元件之第一毛細結構與第二毛細結構可透過漿料一次性印刷及燒結形成，有利於元件擴散焊封合工藝的實施。 To sum up, the present invention uses the first capillary structure in the first groove structure of the thin vapor chamber element and the second capillary structure on the first support structure to form a composite capillary structure in the vapor chamber. The second capillary structure squeezed between the support structure and the second sheet can increase the flow rate of the liquid working fluid in the first capillary structure, and can also be used to regulate the flow rate of the liquid working fluid in multiple grooves. Can be used as part of the support structure. In addition, the first capillary structure and the second capillary structure of the ultra-thin vapor chamber component of the present invention can be formed through one-time printing and sintering of the slurry, which is beneficial to the implementation of the component diffusion welding sealing process.

1:第一片材 1: First sheet

10:第一表面 10: First surface

100:第一溝槽結構 100: First trench structure

101:第一支撐結構 101:First support structure

104:溝槽側壁 104:Trench side wall

106:側壁間隙 106:Sidewall clearance

2:第二片材 2:Second sheet

20:第二表面 20: Second surface

200:第二溝槽結構 200: Second trench structure

201:第二支撐結構 201: Second support structure

3:液相工作流體 3: Liquid phase working fluid

40:漿料 40:Slurry

41:第一毛細結構 41: First capillary structure

42:第二毛細結構 42: Second capillary structure

411:上表面 411: Upper surface

412:下表面 412: Lower surface

414:側表面 414:Side surface

415:中間凹陷區 415:Middle depression area

417:邊緣突起區 417: Edge protruding area

5:真空氣道空間 5: Vacuum duct space

70:網版 70:Screen version

71:刮板 71:Scraper

D10、D20、D101、D201:厚度 D10, D20, D101, D201: Thickness

S1~S5:步驟 S1~S5: steps

V:超薄型均溫板元件結構 V: Ultra-thin vapor chamber element structure

圖1繪示習知技術中利用銅網作為毛細結構製成之均溫板； Figure 1 shows a vapor chamber made of copper mesh as a capillary structure in the conventional technology;

圖2係繪示本發明一具體實施例中超薄型均溫板元件結構之剖面示意圖； Figure 2 is a schematic cross-sectional view showing the structure of an ultra-thin vapor chamber element in a specific embodiment of the present invention;

圖3A、3B、3C是繪示本發明不同具體實施例中超薄型均溫板元件結構之剖面示意圖； 3A, 3B, and 3C are schematic cross-sectional views illustrating the structures of ultra-thin vapor chamber components in different embodiments of the present invention;

圖4A繪示一實施例中具有船型多孔隙毛細結構之薄型均溫板之示意圖； Figure 4A is a schematic diagram of a thin vapor chamber with a boat-shaped porous capillary structure in one embodiment;

圖4B繪示圖4A實施例中船型多孔隙毛細結構之示意圖； Figure 4B is a schematic diagram of the boat-shaped porous capillary structure in the embodiment of Figure 4A;

圖5繪示圖4A具體實施例中液相工作流體流向之示意圖； Figure 5 is a schematic diagram illustrating the flow direction of the liquid phase working fluid in the specific embodiment of Figure 4A;

圖6係繪示本發明之一具體實施例之超薄型均溫板元件結構之製作方法之步驟流程圖； Figure 6 is a flow chart illustrating a method for manufacturing an ultra-thin vapor chamber element structure according to a specific embodiment of the present invention;

圖7係本發明超薄型均溫板元件結構之製作方法之示意圖。 Figure 7 is a schematic diagram of the manufacturing method of the ultra-thin vapor chamber component structure of the present invention.

為了讓本發明的優點，精神與特徵可以更容易且明確地了 解，後續將以具體實施例並參照所附圖式進行詳述與討論。需注意的是，這些具體實施例僅為本發明代表性的具體實施例，其中所舉例的特定方法、裝置、條件、材質等並非用以限定本發明或對應的具體實施例。又，圖中各元件僅係用於表達其相對位置且未按其實際比例繪述，本發明之步驟編號僅為區隔不同步驟，並非代表其步驟順序，合先敘明。 In order that the advantages, spirit and characteristics of the present invention may be more easily and clearly explained solution, and will be described and discussed in detail later with specific examples and with reference to the attached drawings. It should be noted that these specific embodiments are only representative specific embodiments of the present invention, and the specific methods, devices, conditions, materials, etc. exemplified therein are not intended to limit the present invention or the corresponding specific embodiments. In addition, each element in the figure is only used to express its relative position and is not drawn according to its actual proportion. The step numbers of the present invention are only to distinguish different steps, and do not represent the sequence of the steps, which will be explained first.

請參閱圖2。圖2是繪示本發明一具體實施例中超薄型均溫板元件結構之剖面示意圖。本具體實施例之超薄型均溫板元件結構V包含有第一片材1、第二片材2、第一毛細結構41和第二毛細結構42。第一片材1具有第一表面10，第一表面10具有第一溝槽結構100，第一溝槽結構中具有第一支撐結構101。第二片材2具有相對應第一表面10之第二表面20，第二表面20之邊緣與第一表面10之邊緣氣密焊合，第一表面10之第一溝槽結構100與第二表面20之間形成密閉容置空間。第一毛細結構41形成於第一溝槽結構100內。第二毛細結構42形成於第一支撐結構101與第二表面20之間。第一毛細結構41與第二表面20間形成真空之一真空氣道空間5。 See Figure 2. FIG. 2 is a schematic cross-sectional view illustrating the structure of an ultra-thin vapor chamber element in a specific embodiment of the present invention. The ultra-thin vapor chamber element structure V of this specific embodiment includes a first sheet 1 , a second sheet 2 , a first capillary structure 41 and a second capillary structure 42 . The first sheet 1 has a first surface 10, the first surface 10 has a first groove structure 100, and a first support structure 101 is provided in the first groove structure. The second sheet 2 has a second surface 20 corresponding to the first surface 10. The edge of the second surface 20 is airtightly welded to the edge of the first surface 10. The first groove structure 100 of the first surface 10 and the second A closed accommodation space is formed between the surfaces 20 . The first capillary structure 41 is formed in the first trench structure 100 . The second capillary structure 42 is formed between the first support structure 101 and the second surface 20 . A vacuum channel space 5 is formed between the first capillary structure 41 and the second surface 20 .

第一溝槽結構100是第一片材1經由蝕刻後產生。第一溝槽結構100之內的第一毛細結構41和第一支撐結構101上之第二毛細結構42，構成均溫板中的複合式毛細結構。第一毛細結構41和第二毛細結構42可以同時用漿料印刷並燒結形成。利用網版印刷或網版印刷，將超薄型均溫版元件第一片材1周邊擴散焊封合處遮蔽，而將漿料印刷鋪置在第一溝槽結構100及第一支撐結構101上。 The first trench structure 100 is produced by etching the first sheet 1 . The first capillary structure 41 within the first groove structure 100 and the second capillary structure 42 on the first support structure 101 constitute a composite capillary structure in the vapor chamber. The first capillary structure 41 and the second capillary structure 42 can be formed by printing and sintering with slurry at the same time. Use screen printing or screen printing to cover the diffusion welding seal around the first sheet 1 of the ultra-thin uniform temperature plate component, and lay the slurry printing on the first trench structure 100 and the first support structure 101 superior.

介於第一支撐結構101及第二片材2之間被擠壓的第二毛細結構42，可增加第一毛細結構中液相工作流體流速。當第一表面10上有多 個被間隔開的溝槽結構時，不同溝槽結構中的液相工作流體流速可能不相同，而第二毛細結構42亦可調控不同溝槽結構之間液相工作流體的流量，使液相工作流體分佈均衡並維持解熱效率。 The second capillary structure 42 squeezed between the first support structure 101 and the second sheet 2 can increase the flow rate of the liquid phase working fluid in the first capillary structure. When there are many on the first surface 10 When there are two spaced groove structures, the flow rate of the liquid phase working fluid in different groove structures may be different, and the second capillary structure 42 can also regulate the flow rate of the liquid phase working fluid between different groove structures, so that the liquid phase The working fluid is distributed evenly and maintains heat removal efficiency.

於一具體實施例中，第一片材1及第二片材2之材質為銅、銅合金、鈦或鈦合金。銅和銅合金為極佳的導熱材質，且生產成本低。鈦和鈦合金具有高強度、低重量的特性，以及優良的抗腐蝕、抗疲乏、抗裂痕性。因此銅、銅合金、鈦和鈦合金為本發明之優選。 In a specific embodiment, the material of the first sheet 1 and the second sheet 2 is copper, copper alloy, titanium or titanium alloy. Copper and copper alloys are excellent thermal conductors and are low-cost to produce. Titanium and titanium alloys have high strength, low weight, and excellent corrosion resistance, fatigue resistance, and crack resistance. Therefore copper, copper alloys, titanium and titanium alloys are preferred in the present invention.

於另一具體實施例中，第一片材1及第二片材2之材質為不鏽鋼，不鏽鋼相較於銅有較高的硬度。而第一表面及第二表面分別電鍍有一銅薄層，片材表面之銅薄層有助於擴散焊接合，有效增加其導熱效率。 In another specific embodiment, the first sheet 1 and the second sheet 2 are made of stainless steel, and stainless steel has higher hardness than copper. The first surface and the second surface are each electroplated with a thin layer of copper. The thin layer of copper on the surface of the sheet contributes to diffusion welding and effectively increases its thermal conductivity efficiency.

將第二毛細結構42設置於第一支撐結構101上時，會增加該處的垂直高度。舉例來說，加工封合第一片材1和第二片材2形成薄型均溫板元件時，第一片材1、第一支撐結構101、第二片材2及第二毛細結構42處的總厚度大於第一片材1和第二片材2的邊緣處的總厚度，將影響平整度及封合良率。因此，第一支撐結構101處和對應結構必須適當地再加工。 When the second capillary structure 42 is disposed on the first support structure 101, the vertical height there will be increased. For example, when processing and sealing the first sheet 1 and the second sheet 2 to form a thin vapor chamber element, the first sheet 1 , the first support structure 101 , the second sheet 2 and the second capillary structure 42 The total thickness is greater than the total thickness at the edges of the first sheet 1 and the second sheet 2, which will affect the flatness and sealing yield. Therefore, the first support structure 101 and corresponding structures must be appropriately reworked.

請參閱圖2、圖3A、3B、3C。圖3A、3B、3C是繪示本發明不同具體實施例中超薄型均溫板元件結構之剖面示意圖。如圖3A所示，於一具體實施例中，第二片材2的第二表面20對應第一支撐結構101處進行蝕刻加工，蝕刻的深度恰等於第二毛細結構42的高度。藉此，加工封合第一片材1和第二片材2形成薄型均溫板元件時，第一支撐結構101處的厚度會相同於邊緣處的厚度。 Please refer to Figure 2, Figure 3A, 3B, and 3C. 3A, 3B, and 3C are schematic cross-sectional views illustrating the structures of ultra-thin vapor chamber components in different embodiments of the present invention. As shown in FIG. 3A , in a specific embodiment, the second surface 20 of the second sheet 2 is etched corresponding to the first support structure 101 , and the etching depth is exactly equal to the height of the second capillary structure 42 . Thereby, when the first sheet 1 and the second sheet 2 are processed and sealed to form a thin vapor chamber element, the thickness at the first support structure 101 will be the same as the thickness at the edge.

在圖3B的實施例中，為了避免第二毛細結構42的高度影響 平整度及封合良率，第二支撐結構201經過了二次蝕刻而進一步減低了第二支撐結構201的高度。換言之，第二片材2於第二支撐結構201處之厚度D201小於其邊緣之厚度D20。 In the embodiment of FIG. 3B , in order to avoid the high influence of the second capillary structure 42 In order to improve the flatness and sealing yield, the second support structure 201 has been etched twice to further reduce the height of the second support structure 201 . In other words, the thickness D201 of the second sheet 2 at the second support structure 201 is smaller than the thickness D20 of its edge.

第二表面20進一步具有第二溝槽結構200，第二溝槽結構200是第二片材2經由蝕刻後產生。第二溝槽結構200中具有第二支撐結構201，第二毛細結構42形成於第一支撐結構101與第二支撐結構201之間。第二溝槽結構200可以擴大第一毛細結構41與第二表面20間的真空氣道空間5。 The second surface 20 further has a second groove structure 200 , and the second groove structure 200 is produced by etching the second sheet 2 . The second groove structure 200 has a second support structure 201, and the second capillary structure 42 is formed between the first support structure 101 and the second support structure 201. The second groove structure 200 can expand the vacuum channel space 5 between the first capillary structure 41 and the second surface 20 .

在圖3C的實施例中，為了避免第二毛細結構42的高度影響平整度及封合良率，也可對第一支撐結構101進行二次蝕刻減低了其高度，再設置第二毛細結構42於其上。亦即，第一片材1於第一支撐結構101之厚度D101小於其邊緣之厚度D10。 In the embodiment of FIG. 3C , in order to prevent the height of the second capillary structure 42 from affecting the flatness and sealing yield, the first support structure 101 can also be etched twice to reduce its height, and then the second capillary structure 42 is provided. on it. That is, the thickness D101 of the first sheet 1 on the first support structure 101 is smaller than the thickness D10 of its edge.

當然，第一支撐結構101和第二支撐結構201可以同時做二次蝕刻，使兩者高度皆減低，以配合第二毛細結構42的高度。實務上，第二毛細結構42的高度要穩定或是可以調控，才能準確配合封合後的高度。 Of course, the first support structure 101 and the second support structure 201 can be etched twice at the same time to reduce the height of both to match the height of the second capillary structure 42 . In practice, the height of the second capillary structure 42 must be stable or controllable in order to accurately match the height after sealing.

例如，第一毛細結構41與第二毛細結構42由一漿料經一燒結過程而同時形成。調整漿料的成分比例，可以獲得預設的第二毛細結構42高度。再根據預設的第二毛細結構42高度，來對第一片材或第二片材進行蝕刻。 For example, the first capillary structure 41 and the second capillary structure 42 are formed simultaneously from a slurry through a sintering process. By adjusting the component ratio of the slurry, a preset height of the second capillary structure 42 can be obtained. Then, the first sheet or the second sheet is etched according to the preset height of the second capillary structure 42 .

第一毛細結構41與第二毛細結構42皆是金屬粉末燒結形成的多孔隙毛細結構，且平均孔隙尺寸小於10um。此孔隙尺寸等級之毛細結構具有較佳之毛細力。 The first capillary structure 41 and the second capillary structure 42 are both porous capillary structures formed by sintering metal powder, and the average pore size is less than 10um. The capillary structure of this pore size class has better capillary force.

本發明之超薄型均溫板元件結構V之厚度不大於1.0mm，能 有效適用於移動通訊設備，例如5G智慧型手機、平板電腦或各種講求輕薄化的電子產品中。在元件結構限制為如此扁薄的情況下，均溫板元件內部及外部的壓力差所造成的元件周圍與中間區域厚度不一，將嚴重影響元件外觀平整度、良率及耐用度。是以，本發明設計利用第二毛細結構42做為第一支撐結構101高度之延伸，而使均溫板元件整體厚度更加均勻平整益加重要。在一具體實施例中，本發明之第二毛細結構42是經燒結形成一多孔隙毛細結構後，被第二片材2擠壓而形成結構強度較佳之毛細結構。第二毛細結構42功能亦可做為該均溫板之輔助毛細結構，提升薄型均溫板的導熱功能。 The thickness of the ultra-thin vapor chamber element structure V of the present invention is not greater than 1.0mm, and can Effectively applied to mobile communication devices, such as 5G smartphones, tablets or various electronic products that require thinness and lightness. When the component structure is limited to be so thin, the difference in thickness between the surrounding and middle areas of the component caused by the pressure difference between the inside and outside of the vapor chamber component will seriously affect the smoothness, yield, and durability of the component. Therefore, the present invention is designed to use the second capillary structure 42 as an extension of the height of the first support structure 101, so that it is more important to make the overall thickness of the vapor chamber element more uniform and smooth. In a specific embodiment, the second capillary structure 42 of the present invention is sintered to form a porous capillary structure and then extruded by the second sheet 2 to form a capillary structure with better structural strength. The second capillary structure 42 can also function as an auxiliary capillary structure of the vapor chamber to enhance the thermal conductivity of the thin vapor chamber.

請參閱圖4A和圖4B。圖4A繪示根據本發明之另一具體實施實施例之之薄型均溫板1之示意圖；圖4B繪示圖4A中薄型均溫板1之第一毛細結構41之示意圖。如圖4A及圖4B所示，本具體實施例之第一毛細結構41係為船型多孔隙毛細結構，第一毛細結構41和第一溝槽結構100間具有一側壁間隙106。第一溝槽結構100具有溝槽側壁104，側壁間隙106形成於第一毛細結構41和溝槽側壁104之間。 See Figure 4A and Figure 4B. Figure 4A is a schematic diagram of a thin vapor chamber 1 according to another specific embodiment of the present invention; Figure 4B is a schematic diagram of the first capillary structure 41 of the thin vapor chamber 1 in Figure 4A. As shown in FIGS. 4A and 4B , the first capillary structure 41 of this specific embodiment is a boat-shaped porous capillary structure, and there is a sidewall gap 106 between the first capillary structure 41 and the first groove structure 100 . The first trench structure 100 has trench sidewalls 104, and a sidewall gap 106 is formed between the first capillary structure 41 and the trench sidewalls 104.

第一毛細結構41具有上表面411、下表面412、側表面414。上表面21具有一中間凹陷區415和一邊緣突起區417，因而呈現船型。第一毛細結構41之上表面411之寬度大於第一毛細結構41之下表面412之寬度。下表面412貼附於溝槽底面。側表面414自上表面411向下表面412逐漸內縮。船型多孔隙毛細結構能提供多重的毛細效果，使液相工作流體速度提升。 The first capillary structure 41 has an upper surface 411 , a lower surface 412 , and side surfaces 414 . The upper surface 21 has a central recessed area 415 and an edge protruding area 417, thus exhibiting a boat shape. The width of the upper surface 411 of the first capillary structure 41 is greater than the width of the lower surface 412 of the first capillary structure 41 . The lower surface 412 is attached to the bottom of the trench. The side surface 414 gradually shrinks from the upper surface 411 to the lower surface 412 . The boat-shaped porous capillary structure can provide multiple capillary effects to increase the speed of the liquid phase working fluid.

請參閱圖5。圖5繪示圖4A具體實施例中液相工作流體流向 之示意圖。圖5中僅表現單一溝槽結構的工作流體流向。超薄型均溫板元件結構V進一步具有一液相工作流體3(Working Fluid)置於密閉容置空間的第一毛細結構41或第二毛細結構42中，且密閉容置空間為真空負壓狀態。工作流體以液相及氣相的形式在毛細結構及真空氣道空間中流動及循環以發揮快速導熱之功能。 See Figure 5. Figure 5 illustrates the flow direction of the liquid phase working fluid in the specific embodiment of Figure 4A. schematic diagram. Figure 5 only shows the working fluid flow direction of a single groove structure. The ultra-thin vapor chamber element structure V further has a liquid phase working fluid 3 (Working Fluid) placed in the first capillary structure 41 or the second capillary structure 42 in the closed accommodation space, and the closed accommodation space is a vacuum negative pressure. condition. The working fluid flows and circulates in the capillary structure and vacuum channel space in the form of liquid and gas phases to perform the function of rapid heat conduction.

上述具體實施例所述之複合式毛細結構可由第一毛細結構41、第二毛細結構42、第一溝槽結構100以及側壁間隙106所構成。由於側壁間隙106是一長條微細溝槽形狀，具有良好的液相工作流體滲透率，加上第一毛細結構41和第二毛細結構42具良好的毛細壓差，合力將液相工作流體快速輸送。側壁間隙106的通道與多孔隙毛細結構具有互補作用，兩者共同做為均溫板內液相工作流體3的輸送渠道。第二毛細結構42則扮演調整液相工作流體3跨溝槽流量之角色。 The composite capillary structure described in the above specific embodiments can be composed of a first capillary structure 41 , a second capillary structure 42 , a first groove structure 100 and a sidewall gap 106 . Since the side wall gap 106 is in the shape of a long fine groove and has a good permeability of the liquid working fluid, and the first capillary structure 41 and the second capillary structure 42 have a good capillary pressure difference, the combined force can quickly transport the liquid working fluid. convey. The channel of the side wall gap 106 has a complementary effect with the porous capillary structure, and both serve as a transport channel for the liquid phase working fluid 3 in the vapor chamber. The second capillary structure 42 plays the role of adjusting the flow rate of the liquid phase working fluid 3 across the groove.

灌注液相工作流體3至均溫板元件內。液相工作流體3會吸附於第一毛細結構41和第二毛細結構42之內及側壁間隙106之中。側壁間隙106中液相工作流體3的水量可能會高於第一毛細結構41和第二毛細結構42之內液相工作流體3的平均水量。具有此結構之均溫板元件於實際運作時，側壁間隙106中的液相工作流體3、第一毛細結構41和第二毛細結構42之內的液相工作流體3朝向相同方向前進(箭頭方向)。但是側壁間隙106中的流體阻力較小，液相工作流體3流動速度較快；第一毛細結構41和第二毛細結構42之內的流體阻力較大，液相工作流體3流動速度較慢，卻是液體流動的動力來源。側壁間隙中的液相工作流體3也可以補充至第一毛細結構41和第二毛細結構42內。 Pour liquid phase working fluid 3 into the vapor chamber element. The liquid working fluid 3 will be adsorbed in the first capillary structure 41 and the second capillary structure 42 and in the side wall gap 106 . The amount of water of the liquid phase working fluid 3 in the side wall gap 106 may be higher than the average amount of water of the liquid phase working fluid 3 in the first capillary structure 41 and the second capillary structure 42 . When the vapor chamber element with this structure is actually operated, the liquid working fluid 3 in the side wall gap 106 and the liquid working fluid 3 in the first capillary structure 41 and the second capillary structure 42 advance in the same direction (the direction of the arrow). ). However, the fluid resistance in the side wall gap 106 is small, and the liquid phase working fluid 3 flows faster; the fluid resistance within the first capillary structure 41 and the second capillary structure 42 is large, and the liquid phase working fluid 3 flows slowly. But it is the source of power for liquid flow. The liquid working fluid 3 in the side wall gap can also be replenished into the first capillary structure 41 and the second capillary structure 42 .

上述具體實施例所描述之製作方法所形成之複合式毛細結構在反重力垂直吸水測試中，對於純水的輸送速度可達35mm/sec以上，遠比銅網毛細結構的純水輸送速度快兩倍以上。對於均溫板元件的毛細力而言，具有顯著的效益。 In the anti-gravity vertical water absorption test, the composite capillary structure formed by the manufacturing method described in the above specific embodiments can transport pure water at a speed of more than 35 mm/sec, which is two times faster than the pure water transport speed of the copper mesh capillary structure. More than times. There are significant benefits for the capillary forces of the vapor chamber elements.

請參閱圖6和圖7。圖6係繪示根據本發明之另一具體實施例之超薄型均溫板元件結構之製作方法的步驟流程圖；圖7係繪示圖6之超薄型均溫板元件結構之製作方法的示意圖。如圖6及圖7所示，本具體實施例之超薄型均溫板元件結構之製造方法包含有以下步驟：步驟S1，提供具有第一表面之第一片材，第一表面具有第一溝槽結構，第一溝槽結構內具有第一支撐結構；步驟S2，鋪置漿料於第一溝槽結構並且覆蓋過第一支撐結構，漿料包含有金屬粉末；步驟S3，加熱漿料以燒結金屬粉末，而產生第一毛細結構形成於第一溝槽結構之內和第二毛細結構形成於第一支撐結構之上；步驟S4，蓋合一第二片材於第一片材上，第二片材具有相對應第一表面之第二表面；步驟S5，加熱第一片材和第二片材的邊緣而密封形成超薄型均溫板元件結構。 See Figure 6 and Figure 7. Figure 6 is a step flow chart illustrating a method for manufacturing an ultra-thin vapor chamber element structure according to another specific embodiment of the present invention; Figure 7 is a flow chart illustrating a method for manufacturing the ultra-thin vapor chamber element structure of Figure 6 schematic diagram. As shown in Figures 6 and 7, the manufacturing method of the ultra-thin vapor chamber element structure of this specific embodiment includes the following steps: Step S1, providing a first sheet with a first surface, and the first surface has a first The trench structure has a first support structure in the first trench structure; Step S2, lay the slurry on the first trench structure and cover the first support structure, the slurry contains metal powder; Step S3, heat the slurry The metal powder is sintered to produce a first capillary structure formed in the first groove structure and a second capillary structure formed on the first support structure; step S4, cover a second sheet on the first sheet , the second sheet has a second surface corresponding to the first surface; step S5, heat the edges of the first sheet and the second sheet to seal to form an ultra-thin vapor chamber element structure.

對照圖7來看，步驟S1是提供具有一第一表面10之一第一片材1。第一表面10具有一第一溝槽結構100。溝槽結構100具有一第一支撐結構101。 Referring to FIG. 7 , step S1 is to provide a first sheet 1 having a first surface 10 . The first surface 10 has a first groove structure 100 . The trench structure 100 has a first support structure 101 .

步驟S2是鋪置一漿料40覆蓋滿過第一溝槽結構100並且覆蓋滿過第一支撐結構101。漿料40包含有一金屬粉末、一溶劑及一聚合物。具體來說，S2的步驟中可以利用一網版70覆蓋於第一片材1之上，尤其是遮蔽了第一片材1的邊緣，網版70上的絲網孔洞對應第一片材1之第一溝槽結 構100。漿料40放置於網版70上之一端。接著利用一刮板71將漿料40刮過孔洞至網版70之另一端。部分漿料40落至第一溝槽結構100中並填滿覆蓋過第一溝槽結構100和第一支撐結構101。 Step S2 is to lay a slurry 40 to cover the first trench structure 100 and cover the first support structure 101 . The slurry 40 includes a metal powder, a solvent and a polymer. Specifically, in step S2, a screen plate 70 can be used to cover the first sheet 1 , especially to cover the edge of the first sheet 1 , and the screen holes on the screen plate 70 correspond to the first sheet 1 The first trench junction Construct 100. The slurry 40 is placed on one end of the screen plate 70 . Then a scraper 71 is used to scrape the slurry 40 through the holes to the other end of the screen plate 70 . Part of the slurry 40 falls into the first trench structure 100 and fills and covers the first trench structure 100 and the first support structure 101 .

所述的鋪置可以是網版印刷製程(Screen Printing Process)、鋼版印刷製程(Stencil Printing Process)或點膠製程(Dispensing Process)。 The laying may be a screen printing process, a stencil printing process, or a dispensing process.

步驟S3是加熱漿料40以揮發溶劑、裂解與去除聚合物，及還原並燒結金屬粉末，而同時形成一第一毛細結構41於第一溝槽結構100之內和形成一第二毛細結構42於第一支撐結構101之上。 Step S3 is to heat the slurry 40 to volatilize the solvent, crack and remove the polymer, and reduce and sinter the metal powder, while simultaneously forming a first capillary structure 41 within the first trench structure 100 and forming a second capillary structure 42 on the first support structure 101.

具體來說，首先低溫加熱以揮發掉溶劑，漿料40體積縮小且被收斂成固化複合材料。接著提高溫度加熱以裂解與去除聚合物，均勻散布於金屬粉末之間的聚合物被裂解燒除。最後提高溫度至金屬粉末燒結溫度而同時形成多孔隙之第一毛細結構41及第二毛細結構42。 Specifically, it is first heated at low temperature to evaporate the solvent, and the slurry 40 is reduced in volume and converged into a solidified composite material. Then the temperature is increased and heated to crack and remove the polymer. The polymer evenly distributed between the metal powders is cracked and burned. Finally, the temperature is raised to the metal powder sintering temperature to simultaneously form the porous first capillary structure 41 and the second capillary structure 42 .

其中，金屬粉末包含有複數個銅(Cu)顆粒及複數個氧化亞銅(Cu2O)顆粒，且加熱漿料以燒結該金屬粉末之步驟S3進一步係為於含氫氣氛下加熱漿料以燒結金屬粉末，使氧化亞銅顆粒還原並彼此連結形成複數個鏈狀銅構件，且鏈狀銅構件彼此耦接，而銅顆粒形成類球狀銅構件，散佈於鏈狀銅構件之間，進而產生第一毛細結構41形成於第一溝槽結構100之內和第二毛細結構42形成於第一支撐結構101之上，兩者同時形成。 Wherein, the metal powder includes a plurality of copper (Cu) particles and a plurality of cuprous oxide (Cu 2 O) particles, and step S3 of heating the slurry to sinter the metal powder further includes heating the slurry in a hydrogen-containing atmosphere to sinter the metal powder. The metal powder is sintered, so that the cuprous oxide particles are reduced and connected to each other to form a plurality of chain-like copper components, and the chain-like copper components are coupled to each other, and the copper particles form spherical-like copper components, dispersed between the chain-like copper components, and then The first capillary structure 41 is formed within the first groove structure 100 and the second capillary structure 42 is formed on the first support structure 101, both of which are formed simultaneously.

氧化亞銅顆粒粒徑小於銅顆粒粒徑，氧化亞銅顆粒平均粒徑小於5um，銅顆粒平均粒徑大於10um。氧化亞銅的晶體特性為六面體八角菱型，在高溫下會沿著最遠兩端延長成鏈型；氧化亞銅在含氫氣氛下會逐漸還原成銅，但還原成銅後就失去了沿著最遠兩端延長成鏈型的動能。因 此含氫氣氛和溫度需要精確的調控，使氧化亞銅還原並燒結形成鏈狀銅。 The particle size of cuprous oxide particles is smaller than the particle size of copper particles, the average particle size of cuprous oxide particles is less than 5um, and the average particle size of copper particles is greater than 10um. The crystal characteristics of cuprous oxide are hexahedral and octagonal rhombus, which will extend along the farthest ends into a chain type at high temperatures; cuprous oxide will gradually reduce to copper in a hydrogen-containing atmosphere, but it will be lost after being reduced to copper. The kinetic energy extending into a chain along the farthest two ends. because This hydrogen-containing atmosphere and temperature require precise control to reduce and sinter the cuprous oxide to form chain-like copper.

加熱漿料以燒結該金屬粉末之步驟S3中，第一毛細結構41係為船型多孔隙毛細結構，第一毛細結構41和第一溝槽結構100間具有一側壁間隙106。 In step S3 of heating the slurry to sinter the metal powder, the first capillary structure 41 is a boat-shaped porous capillary structure, and there is a sidewall gap 106 between the first capillary structure 41 and the first trench structure 100 .

步驟S4是先提供一第二片材2，具有對應第一表面10之一第二表面20、對應第一溝槽結構100的第二溝槽結構200、對應第一支撐結構101的第二支撐結構201。第一片材1和第二片材2原則上長寬形狀相同，但厚度可能不同。接著對應溝槽結構和支撐結構地蓋合第一片材1和第二片材2，使第二毛細結構42被夾在第一支撐結構101與第二支撐結構201之間。若第二片材2沒有第二溝槽結構200和第二支撐結構201，則第二毛細結構42被夾在第一支撐結構101與第二表面20之間。 Step S4 is to first provide a second sheet 2 having a second surface 20 corresponding to the first surface 10 , a second groove structure 200 corresponding to the first groove structure 100 , and a second support corresponding to the first support structure 101 Structure 201. In principle, the first sheet 1 and the second sheet 2 have the same length and width, but may have different thicknesses. Then, the first sheet 1 and the second sheet 2 are covered correspondingly to the groove structure and the support structure, so that the second capillary structure 42 is sandwiched between the first support structure 101 and the second support structure 201 . If the second sheet 2 does not have the second groove structure 200 and the second support structure 201 , the second capillary structure 42 is sandwiched between the first support structure 101 and the second surface 20 .

其中，第一支撐結構101之高度小於第一表面10之邊緣高度；或者，第二支撐結構201之高度小於第二表面20之邊緣高度；或者，以上兩者皆是。 The height of the first support structure 101 is less than the edge height of the first surface 10; or the height of the second support structure 201 is less than the edge height of the second surface 20; or both of the above.

步驟S5是加壓加熱第一片材1和第二片材2的邊緣而密封第一片材1和第二片材2，形成超薄型均溫板元件結構。其中，步驟S5可以藉由擴散焊來焊合，利用高溫及壓力使第一片材1或第二片材2的接觸面之間的原子互相擴散，進而使第一片材1和第二片材2的邊緣相互嵌入結合。 Step S5 is to pressurize and heat the edges of the first sheet 1 and the second sheet 2 to seal the first sheet 1 and the second sheet 2 to form an ultra-thin vapor chamber element structure. Among them, step S5 can be welded by diffusion welding, using high temperature and pressure to diffuse atoms between the contact surfaces of the first sheet 1 or the second sheet 2, thereby making the first sheet 1 and the second sheet The edges of materials 2 are embedded and combined with each other.

綜上所述，本發明藉由薄型均溫板元件第一溝槽結構之內的第一毛細結構和第一支撐結構上之第二毛細結構，構成均溫板中的複合式毛細結構。介於支撐結構及第二片材之間被擠壓的第二毛細結構，可增加第一毛細結構中液相工作流體流速，亦可作為多個溝槽內液相工作流體流 量的調控，還能當做支撐結構之一部份。此外，本發明超薄型均溫板元件之第一毛細結構與第二毛細結構可透過漿料一次性印刷及燒結形成，有利於元件擴散焊封合工藝的實施。 To sum up, the present invention uses the first capillary structure in the first groove structure of the thin vapor chamber element and the second capillary structure on the first support structure to form a composite capillary structure in the vapor chamber. The second capillary structure squeezed between the support structure and the second sheet can increase the flow rate of the liquid working fluid in the first capillary structure, and can also serve as the flow rate of the liquid working fluid in multiple grooves. Quantity control can also be used as part of the support structure. In addition, the first capillary structure and the second capillary structure of the ultra-thin vapor chamber component of the present invention can be formed through one-time printing and sintering of the slurry, which is beneficial to the implementation of the component diffusion welding sealing process.

第一毛細結構和第二毛細結構是藉由鋪設漿料並加熱處理後形成，有助於量產形成毛細結構。漿料中含有氧化亞銅，還原燒結後可以形成具適當的孔隙率的鏈狀銅結構。第一毛細結構呈現船型，加強整體的複合性作用，有利於再提升液相工作流體流速。 The first capillary structure and the second capillary structure are formed by laying slurry and heat treatment, which is helpful for mass production to form the capillary structure. The slurry contains cuprous oxide, which can form a chain-like copper structure with appropriate porosity after reduction and sintering. The first capillary structure presents a ship shape, which strengthens the overall composite effect and is conducive to further increasing the flow rate of the liquid phase working fluid.

藉由以上較佳具體實施例之詳述，係希望能更加清楚描述本發明之特徵與精神，而並非以上述所揭露的較佳具體實施例來對本發明之範疇加以限制。相反地，其目的是希望能涵蓋各種改變及具相等性的安排於本發明所欲申請之專利範圍的範疇內。因此，本發明所申請之專利範圍的範疇應該根據上述的說明作最寬廣的解釋，以致使其涵蓋所有可能的改變以及具相等性的安排。 Through the above detailed description of the preferred embodiments, it is hoped that the characteristics and spirit of the present invention can be more clearly described, but the scope of the present invention is not limited by the above disclosed preferred embodiments. On the contrary, the intention is to cover various modifications and equivalent arrangements within the scope of the patent for which the present invention is intended. Therefore, the scope of the patentable scope of the present invention should be interpreted in the broadest manner according to the above description, so as to cover all possible changes and equivalent arrangements.

1:第一片材 1: First sheet

10:第一表面 10: First surface

100:第一溝槽結構 100: First trench structure

101:第一支撐結構 101:First support structure

2:第二片材 2:Second sheet

20:第二表面 20: Second surface

41:第一毛細結構 41: First capillary structure

42:第二毛細結構 42: Second capillary structure

5:真空氣道空間 5: Vacuum duct space

Claims (9)

一種超薄型均溫板元件結構，其包含：一第一片材，具有一第一表面，該第一表面具有一第一溝槽結構，該第一溝槽結構中具有一第一支撐結構自該第一溝槽結構突起；一第二片材，具有相對應該第一表面之一第二表面，該第二表面之邊緣與該第一表面之邊緣氣密焊合，該第一表面之該第一溝槽結構與該第二表面之間形成一密閉容置空間；一第一毛細結構，形成於該第一溝槽結構內，該第一毛細結構係為船型多孔隙毛細結構，並且該第一毛細結構和該第一溝槽結構間具有一側壁間隙；以及一第二毛細結構，形成於該第一支撐結構與該第二表面之間。 An ultra-thin vapor chamber element structure, which includes: a first sheet having a first surface, the first surface having a first groove structure, and the first groove structure having a first support structure Protrudes from the first groove structure; a second sheet has a second surface corresponding to the first surface, the edge of the second surface is airtightly welded to the edge of the first surface, and the edge of the first surface A sealed accommodation space is formed between the first groove structure and the second surface; a first capillary structure is formed in the first groove structure, the first capillary structure is a boat-shaped porous capillary structure, and There is a sidewall gap between the first capillary structure and the first groove structure; and a second capillary structure is formed between the first support structure and the second surface. 如申請專利範圍第1項所述之超薄型均溫板元件結構，其中該第二表面進一步具有一第二溝槽結構，該第二溝槽結構中具有一第二支撐結構，該第二毛細結構形成於該第一支撐結構與該第二支撐結構之間。 As for the ultra-thin vapor chamber component structure described in item 1 of the patent application, the second surface further has a second groove structure, and the second groove structure has a second support structure, and the second A capillary structure is formed between the first support structure and the second support structure. 如申請專利範圍第2項所述之超薄型均溫板元件結構，其中該第一支撐結構之高度小於該第一表面之邊緣高度，或是該第二支撐結構之高度小於該第二表面之邊緣高度。 The ultra-thin vapor chamber element structure as described in item 2 of the patent application, wherein the height of the first support structure is less than the edge height of the first surface, or the height of the second support structure is less than the height of the second surface edge height. 如申請專利範圍第1項所述之超薄型均溫板元件結構，其中該第一毛細結構與該第二毛細結構係由一漿料經一烘乾、裂解、燒結過程而形成，該超薄型均溫板元件結構之厚度不大於1.0mm，並進一步具有一工作流體置於該密閉容置空間，且該密閉容置空間為真空負壓狀態。 As for the ultra-thin vapor chamber element structure described in item 1 of the patent application, the first capillary structure and the second capillary structure are formed by a slurry through a drying, cracking, and sintering process. The thickness of the thin vapor chamber component structure is not greater than 1.0 mm, and further has a working fluid placed in the sealed accommodation space, and the sealed accommodation space is in a vacuum and negative pressure state. 如申請專利範圍第1項所述之超薄型均溫板元件結構，其中該第一溝槽 結構具有一溝槽側壁，該船型多孔隙毛細結構和該溝槽側壁之間具有該側壁間隙，該第一毛細結構之一上表面之寬度大於該第一毛細結構之一下表面之寬度。 The ultra-thin vapor chamber component structure as described in item 1 of the patent application, wherein the first groove The structure has a groove side wall, and there is a side wall gap between the boat-shaped porous capillary structure and the groove side wall. The width of an upper surface of the first capillary structure is greater than the width of a lower surface of the first capillary structure. 一種超薄型均溫板元件結構之製造方法，其包含：提供具有一第一表面之一第一片材，該第一表面具有一第一溝槽結構，該第一溝槽結構內具有一第一支撐結構；鋪置一漿料於該第一溝槽結構並且覆蓋過該第一支撐結構，該漿料包含有一金屬粉末；加熱該漿料以燒結該金屬粉末，而產生一第一毛細結構形成於該第一溝槽結構之內和一第二毛細結構形成於該第一支撐結構之上，其中該第一毛細結構係為船型多孔隙毛細結構，該第一毛細結構和該第一溝槽結構間具有一側壁間隙；蓋合一第二片材於該第一片材上，該第二片材具有相對應該第一表面之一第二表面；以及加熱該第一片材和該第二片材的邊緣而密封該第一片材和該第二片材形成一超薄型均溫板元件結構。 A method of manufacturing an ultra-thin vapor chamber element structure, which includes: providing a first sheet with a first surface, the first surface having a first groove structure, and the first groove structure having a a first support structure; lay a slurry on the first trench structure and cover the first support structure; the slurry contains a metal powder; heat the slurry to sinter the metal powder to generate a first capillary A structure is formed within the first groove structure and a second capillary structure is formed on the first support structure, wherein the first capillary structure is a boat-shaped porous capillary structure, the first capillary structure and the first There is a sidewall gap between the groove structures; covering a second sheet on the first sheet, the second sheet having a second surface corresponding to the first surface; and heating the first sheet and the first sheet. The edge of the second sheet seals the first sheet and the second sheet to form an ultra-thin vapor chamber element structure. 如申請專利範圍第6項所述之超薄型均溫板元件結構之製造方法，其中該第一支撐結構之高度小於該第一表面之邊緣高度。 As described in item 6 of the patent application, the method for manufacturing an ultra-thin vapor chamber element structure, wherein the height of the first support structure is smaller than the edge height of the first surface. 如申請專利範圍第6項所述之超薄型均溫板元件結構之製造方法，其中該金屬粉末包含有複數個銅(Cu)顆粒及複數個氧化亞銅(Cu2O)顆粒，且加熱該漿料以燒結該金屬粉末之步驟進一步係為：於含氫氣氛下燒結該金屬粉末，使該等氧化亞銅顆粒還原並彼此連結 形成複數個鏈狀銅構件，且該等鏈狀銅構件彼此耦接，而該等銅顆粒形成類球狀銅構件，散佈於該等鏈狀銅構件之間，進而產生第一毛細結構形成於第一溝槽結構之內和第二毛細結構形成於第一支撐結構之上。 The method for manufacturing an ultra-thin vapor chamber component structure as described in item 6 of the patent application, wherein the metal powder contains a plurality of copper (Cu) particles and a plurality of cuprous oxide (Cu 2 O) particles, and is heated The step of sintering the metal powder with the slurry further includes: sintering the metal powder in a hydrogen-containing atmosphere, so that the cuprous oxide particles are reduced and connected to each other to form a plurality of chain-shaped copper components, and the chain-shaped copper components are coupled to each other, and the copper particles form spherical copper components, which are dispersed between the chain-shaped copper components, thereby generating a first capillary structure formed within the first trench structure and a second capillary structure formed within the first trench structure. on a supporting structure. 如申請專利範圍第6項所述之超薄型均溫板元件結構之製造方法，其中該漿料進一步包含有複數個銅顆粒、一有機溶劑及一聚合物，且加熱該漿料以燒結該金屬粉末之步驟進一步係為：加熱該漿料以去除該有機溶劑、裂解該聚合物並燒結該金屬粉末，而產生一第一毛細結構形成於該第一溝槽結構之內和一第二毛細結構形成於該第一支撐結構之上。 The method for manufacturing an ultra-thin vapor chamber component structure as described in item 6 of the patent application, wherein the slurry further includes a plurality of copper particles, an organic solvent and a polymer, and the slurry is heated to sinter the The step of metal powder further includes: heating the slurry to remove the organic solvent, cracking the polymer and sintering the metal powder to generate a first capillary structure formed within the first groove structure and a second capillary structure. A structure is formed on the first support structure.
TW111119679A 2021-06-10 2022-05-26 Ultra thin vapor chamber element structure and manufacturing method thereof TWI827071B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202110646505.5 2021-06-10
CN202110646505.5A CN115468445A (en) 2021-06-10 2021-06-10 Ultra-thin temperature equalization plate element structure and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TW202249219A TW202249219A (en) 2022-12-16
TWI827071B true TWI827071B (en) 2023-12-21

Family

ID=84364752

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111119679A TWI827071B (en) 2021-06-10 2022-05-26 Ultra thin vapor chamber element structure and manufacturing method thereof

Country Status (2)

Country Link
CN (1) CN115468445A (en)
TW (1) TWI827071B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM464634U (en) * 2013-05-08 2013-11-01 Tai Sol Electronics Co Ltd Vapor chamber with supporting structure
TWM603545U (en) * 2020-06-18 2020-11-01 大陸商昆山巨仲電子有限公司 Capillary structure of vapor chamber
TW202110773A (en) * 2019-09-03 2021-03-16 大陸商廣州力及熱管理科技有限公司 A metal oxide paste for making wick structure of vapor chamber device
TW202111273A (en) * 2019-09-03 2021-03-16 大陸商廣州力及熱管理科技有限公司 A chain-like copper metal wick structure and manufacturing method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM464634U (en) * 2013-05-08 2013-11-01 Tai Sol Electronics Co Ltd Vapor chamber with supporting structure
TW202110773A (en) * 2019-09-03 2021-03-16 大陸商廣州力及熱管理科技有限公司 A metal oxide paste for making wick structure of vapor chamber device
TW202111273A (en) * 2019-09-03 2021-03-16 大陸商廣州力及熱管理科技有限公司 A chain-like copper metal wick structure and manufacturing method thereof
TWM603545U (en) * 2020-06-18 2020-11-01 大陸商昆山巨仲電子有限公司 Capillary structure of vapor chamber

Also Published As

Publication number Publication date
CN115468445A (en) 2022-12-13
TW202249219A (en) 2022-12-16

Similar Documents

Publication Publication Date Title
TWI553288B (en) Vapor chamber and method for manufacturing same
CN206556484U (en) A kind of new type superthin soaking plate
WO2017124754A1 (en) Ultrathin soaking plate and manufacturing method thereof
CN111761050B (en) Method for manufacturing capillary structure by using metal slurry
TWI784248B (en) A metal paste for making wick structure of vapor chamber
CN108882644B (en) Heat radiation unit
TW201127266A (en) Vapor chamber and manufacturing method thereof
WO2021073158A1 (en) Thin capillary structure supporting vapor chamber
CN110567303A (en) Temperature-equalizing plate structure with convex part and manufacturing method thereof
TWI750769B (en) A chain-like copper metal wick structure and manufacturing method thereof
TWI827071B (en) Ultra thin vapor chamber element structure and manufacturing method thereof
TW202120881A (en) Ultra-thin vapor chamber and a manufacturing method thereof by welding and sealing the first metal plate with a thin and thermally conductive second metal plate after the sintering process, and then vacuumizing and injecting with a working fluid
TWI743945B (en) Thin vapor chamber wick structure element and manufacturing method thereof
CN113727573B (en) Thin temperature-equalizing plate element structure and manufacturing method thereof
CN113976886B (en) Porous structure, temperature equalizing plate, manufacturing method and application thereof
JP4095969B2 (en) Support structure for flat plate heat pipe
CN212013417U (en) Ultrathin uniform temperature plate
TW202229804A (en) Composite wick structure for thin vapor chamber
CN210093799U (en) Ultra-thin heat dissipation plate
CN108754422B (en) Method for realizing spreading of gallium-based liquid metal on surface of solid sheet
CN212573417U (en) Ultrathin heat conduction patch and electronic equipment
TWI823668B (en) Two-phase immersion cooling compound heat-dissipating device
WO2022161131A1 (en) Composite capillary structure applied to thin vapor chamber
CN114076533B (en) Thin type temperature-equalizing plate capillary structural element and manufacturing method thereof
TW202007922A (en) Heat dissipation unit