CN212013417U

CN212013417U - Ultrathin uniform temperature plate

Info

Publication number: CN212013417U
Application number: CN202021027800.XU
Authority: CN
Inventors: 沈喜源; 陶滔; 梁昌盛
Original assignee: Kunshan Shengxiangyuan Electronic Technology Co ltd
Current assignee: Kunshan Shengxiangyuan Electronic Technology Co ltd
Priority date: 2020-06-08
Filing date: 2020-06-08
Publication date: 2020-11-24
Anticipated expiration: 2030-06-08

Abstract

The utility model relates to an ultra-thin temperature-uniforming plate, including bottom plate and apron the bottom plate with be formed with the cavity between the apron, be equipped with a plurality of bearing structure in the cavity, except in the cavity regional steam channel that forms beyond the bearing structure, the cavity intussuseption is filled with the coolant liquid, the coolant liquid is in circulate in the steam channel, bearing structure's upper surface is equipped with a plurality of capillary structure. The utility model discloses on integrating bearing structure with capillary structure, optimize the area that has increased capillary structure and steam channel, improved the utilization ratio of the area in the cavity greatly to reduce the thickness of samming board to 50% of ordinary samming board thickness, be fit for making 0.15mm ~ 0.2 mm's samming board.

Description

Ultrathin uniform temperature plate

Technical Field

The utility model relates to a heat abstractor field especially relates to an ultra-thin temperature-uniforming plate.

Background

At present, electronic products mostly adopt a temperature equalizing plate for heat dissipation. The structure of the existing temperature equalization plate is shown in fig. 1 and 2, and is used for transferring heat of a heat source 1 (evaporation end) to a heat dissipation surface 2 (condensation end), and the structure comprises a bottom plate 3 and a cover plate 4, wherein a cavity is formed between the bottom plate 3 and the cover plate 4, a plurality of supporting structures 5 used for supporting the lower bottom plate 3 and the upper cover plate 4 are arranged in the cavity, a steam channel 6 is formed in the cavity except for the supporting structures 5, the structure further comprises a capillary structure 7 at the edge of the cavity, cooling liquid 8 is filled in the cavity, and the cooling liquid 8 circulates in the steam channel 6. The working principle of the temperature equalizing plate is as follows: the cooling liquid 8 is evaporated and condensed in the cavity, and self-circulation is achieved through the capillary force action of the capillary structure 7, so that heat is continuously transferred from the heat source 1 to the heat dissipation surface 2; the cooling liquid 8 is heated and evaporated into steam in the heat source 1, the pressure is increased, the steam pushes the operation radiating surface 2 in the steam channel 6 through the pressure, then the temperature is reduced on the radiating surface 2 and the steam is condensed into liquid, and the liquid is transmitted back to the heat source 1 through the capillary force action of the capillary structure 7.

However, due to the influence of the thickness of each structure of the temperature equalizing plate, the thickness of most temperature equalizing plates can only reach more than 0.30 mm. With the requirement for thinning of electronic products becoming higher and higher, the thickness of the required temperature equalizing plate becomes thinner and thinner, so that the existing temperature equalizing plate is difficult to meet the requirement.

SUMMERY OF THE UTILITY MODEL

The utility model provides an ultra-thin temperature-uniforming plate, which solves the technical problem.

In order to solve the technical problem, the utility model provides an ultra-thin temperature-uniforming plate, including bottom plate and apron the bottom plate with be formed with the cavity between the apron, be equipped with a plurality of bearing structure in the cavity, except in the cavity regional steam channel that forms beyond the bearing structure, the cavity intussuseption is filled with the coolant liquid, the coolant liquid is in circulate in the steam channel, bearing structure's upper surface is equipped with a plurality of capillary structure.

Preferably, the capillary structure is a strip-shaped groove, and the strip-shaped groove penetrates through the upper surface of the support structure along the horizontal direction.

Preferably, the support structures are evenly spaced within the cavity.

Preferably, the ratio of the cross-sectional areas of the steam channel and the capillary structure is 0.5-0.75.

Preferably, the supporting structure is made of a metal material, and the height of the supporting structure is 0.06 mm-0.08 mm.

Preferably, a nanopore is formed on an inner wall of the cavity.

Preferably, a vacuum environment is arranged in the cavity.

Preferably, the bottom plate and the cover plate are made of metal materials.

Preferably, the base plate and the cover plate are both made of copper or stainless steel.

Compared with the prior art, the utility model provides an ultra-thin temperature-uniforming plate has following advantage: the utility model discloses on integrating bearing structure with capillary structure, optimize the area that has increased capillary structure and steam channel, improved the utilization ratio of the area in the cavity greatly to reduce the thickness of samming board to 50% of ordinary samming board thickness, be fit for making 0.15mm ~ 0.2 mm's samming board.

Drawings

FIG. 1 is a side sectional view of a conventional vapor chamber;

FIG. 2 is a top sectional view of a conventional vapor chamber;

FIG. 3 is a side sectional view of an ultra-thin vapor chamber in accordance with an embodiment of the present invention;

fig. 4 is a top sectional view of the ultra-thin vapor chamber according to an embodiment of the present invention.

In FIGS. 1-2: 1-heat source, 2-heat dissipation surface, 3-bottom plate, 4-cover plate, 5-support structure, 6-steam channel, 7-capillary structure and 8-cooling liquid;

in FIGS. 3-4: 10-bottom plate, 20-cover plate, 30-support structure, 40-steam channel, 50-cooling liquid, 60-capillary structure.

Detailed Description

In order to describe the technical solution of the above utility model in more detail, the following specific examples are given to demonstrate the technical effects; it should be emphasized that these examples are for illustrative purposes only and are not limiting to the scope of the present invention.

The utility model provides an ultra-thin temperature equalization plate, as shown in fig. 3 and 4, comprises a bottom plate 10 and a cover plate 20, a cavity is formed between the bottom plate 10 and the cover plate 20, a plurality of supporting structures 30 are arranged in the cavity, the bottom of the supporting structure 30 is contacted with the bottom plate 10, the top of the supporting structure 30 is contacted with the cover plate 20, and the deformation of the cavity is avoided; a steam channel 40 is formed in the cavity except for the support structure 30, the cavity is filled with cooling liquid 50, the cooling liquid 50 circulates in the steam channel 40, and a plurality of capillary structures 60 are arranged on the upper surface of the support structure 30. The utility model discloses an on integrating bearing structure 30 with capillary structure 60, optimize the area that has increased capillary structure 60 and steam channel 40, improved the utilization ratio of the area in the cavity greatly to obtain the thinner samming board of thickness.

Referring now more particularly to fig. 3, in the present invention, the bottom plate 10 includes a heat source contact surface (evaporation end), a welding surface, and an intermediate layer (including the support structure 30, the steam channel 40, and the capillary structure 60); the cover plate 20 is divided into an upper surface and a lower surface, the lower surface is a welding surface, and the upper surface is a radiator contact surface (condensation end), wherein the heat source contact surface of the base plate 10 and the radiator contact surface of the cover plate 20 need to be smooth and flat. Two welding surfaces of the bottom plate 10 and the cover plate 20 are attached to each other, and are connected and sealed through a welding process to form a sealed cavity, and cooling liquid 50 is injected into the cavity. Preferably, the base plate 10 and the cover plate 20 are made of a high thermal conductive metal material, such as copper or stainless steel, to improve heat dissipation performance.

Preferably, the inner wall of the cavity is formed with a nano-hole to increase the surface area and further improve the heat dissipation efficiency; preferably, a vacuum environment is provided in the cavity, so as to lower the boiling point of the cooling liquid 50, thereby facilitating the evaporation operation of the cooling liquid 50.

Preferably, with continued reference to fig. 3 and 4, the supporting structure 30 is made of a metal material, and the height of the supporting structure 30 is 0.06mm to 0.08 mm; preferably, the supporting structures 30 are uniformly distributed in the cavity at intervals, and the formed steam channels 40 are also in a uniformly spaced form, so that heat concentration is avoided, and uniform heat dissipation is realized.

Preferably, with continued reference to fig. 3 and 4, the capillary structure 60 is a strip-shaped groove, and the strip-shaped groove penetrates the upper surface of the supporting structure 30 along the horizontal direction, in other words, the capillary structure 60 is continuous in the direction of the evaporation end and the condensation end, so as to facilitate the backflow of the cooling liquid 50.

Preferably, the ratio of the cross-sectional areas of the steam channel 40 and the capillary structure 60 can be distributed according to the power and thickness ratio, which is 0.5-0.75 in the embodiment, so that the rapid heat dissipation can be realized, and the thickness of the whole temperature equalization plate is reduced.

Specifically, the utility model provides a manufacturing process of ultra-thin temperature-uniforming plate can refer to following two kinds of schemes.

The first scheme is as follows:

the first step is as follows: the bottom plate 10 is made of a high-heat-conductivity metal material plate such as copper or stainless steel, and an inner groove step (for forming a cavity later) is formed by stamping or etching;

the second step is that: the inner surface of the step of the inner groove is provided with nano holes through processes such as laser or chemical microetching, and the like, so that the surface area is increased;

the third step: metal powder is flatly paved into a powder layer with the thickness of 0.06-0.08 mm, and the powder layer is sintered to form a supporting structure 30 and a strip-shaped groove type capillary structure 60;

the fourth step: positioning the support structures 30 at regular intervals within the inner groove steps of the soleplate 10, the gaps between the support structures 30 forming steam channels 40;

the fifth step: then, the cover plate 20 is made of a metal material plate with high heat conductivity, such as copper or stainless steel, and the like, and is covered on the bottom plate 10, and a sealed cavity is formed between the cover plate 20 and the bottom plate 10 through brazing, resistance welding, laser welding and the like;

and a sixth step: the cavity is filled with a cooling fluid 50 (e.g., water) and a vacuum is applied to evaporate the cooling fluid 50.

Scheme II:

the difference between the scheme and the first scheme is as follows: the order and method of forming the support structure 30 and the capillary structure 60 are different.

The first step is as follows: the method comprises the following steps of manufacturing a bottom plate 10 by adopting a high-heat-conduction metal material plate such as copper or stainless steel, forming a strip-shaped groove type capillary structure 60 by etching the bottom plate 10, and further forming a steam channel 40 by etching a corresponding position of the bottom plate 10;

the second step is that: then, the cover plate 20 is made of a metal material plate with high heat conductivity, such as copper or stainless steel, and the like, and is covered on the bottom plate 10, and a sealed cavity is formed between the cover plate 20 and the bottom plate 10 through brazing, resistance welding, laser welding and the like;

the third step: the cavity is filled with a cooling fluid 50 (e.g., water) and a vacuum is applied to evaporate the cooling fluid 50.

To sum up, the utility model provides an ultra-thin temperature-uniforming plate, including bottom plate 10 and apron 20 bottom plate 10 with be formed with the cavity between the apron 20, be equipped with a plurality of bearing structure 30 in the cavity, except in the cavity regional steam channel 40 that forms beyond the bearing structure 30, the cavity intussuseption is filled with coolant liquid 50, coolant liquid 50 is in circulate in the steam channel 40, bearing structure 30's upper surface is equipped with a plurality of capillary structure 60. The utility model discloses on integrating bearing structure 30 with capillary structure 60, optimize the area that has increased capillary structure 60 and steam channel 40, improved the utilization ratio of the area in the cavity greatly to reduce the thickness of samming board to 50% of ordinary samming board thickness, be fit for making 0.15mm ~ 0.2 mm's samming board.

It will be apparent to those skilled in the art that various changes and modifications may be made to the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.

Claims

1. The utility model provides an ultra-thin temperature-uniforming plate, its characterized in that includes bottom plate and apron the bottom plate with be formed with the cavity between the apron, be equipped with a plurality of bearing structure in the cavity, except in the cavity regional steam channel that forms outside the bearing structure, the cavity intussuseption is filled with the coolant liquid, the coolant liquid is in circulate in the steam channel, bearing structure's upper surface is equipped with a plurality of capillary structure.

2. The ultra-thin vapor chamber of claim 1, wherein the wicking structure is a strip-shaped groove extending horizontally through the top surface of the support structure.

3. The ultra-thin vapor chamber of claim 1, wherein said support structures are evenly spaced within said cavity.

4. The ultra-thin vapor chamber of claim 1 or 3, wherein a ratio of cross-sectional areas of the vapor channel and the capillary structure is 0.5 to 0.75.

5. The ultra-thin vapor chamber of claim 1, wherein the support structure is made of a metal material, and the height of the support structure is 0.06mm to 0.08 mm.

6. The ultra-thin vapor chamber of claim 1, wherein the inner wall of the cavity is formed with nanopores.

7. The ultra-thin vapor chamber of claim 1 wherein a vacuum environment is present within the cavity.

8. The ultra-thin vapor chamber of claim 1, wherein the base plate and the cover plate are made of a metallic material.

9. The ultra-thin vapor chamber of claim 8, wherein the base plate and the cover plate are made of copper or stainless steel.