TWI826610B - laminated body - Google Patents

laminated body Download PDF

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TWI826610B
TWI826610B TW108145073A TW108145073A TWI826610B TW I826610 B TWI826610 B TW I826610B TW 108145073 A TW108145073 A TW 108145073A TW 108145073 A TW108145073 A TW 108145073A TW I826610 B TWI826610 B TW I826610B
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acid
meth
adhesive layer
resin film
cation
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TW108145073A
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TW202031483A (en
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越智元気
仲野武史
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日商日東電工股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)

Abstract

本發明提供一種使表面保護膜或補強用膜積層於載體片材而成之積層體，於將該積層體以卷對卷方式連續地向構件進行貼附時，表面保護膜或補強用膜之基材面不易自載體片材所具有之黏著劑層浮起。 本發明之積層體係依序具有樹脂膜(1)、黏著劑層(1)、樹脂膜(2)、黏著劑層(2)、樹脂膜(3)之5層以上之積層體，且該樹脂膜(2)與該黏著劑層(2)直接積層，於溫度23℃、濕度50%RH之環境下以剝離角度180度、剝離速度30 mm/分鐘將該黏著劑層(2)自該樹脂膜(2)剝離時之黏著力為1 gf/25 mm以上。The present invention provides a laminated body in which a surface protective film or a reinforcing film is laminated on a carrier sheet. When the laminated body is continuously attached to a member in a roll-to-roll manner, the surface protective film or the reinforcing film is The base material surface is not easily lifted from the adhesive layer of the carrier sheet. The laminate system of the present invention has a laminate of five or more layers including a resin film (1), an adhesive layer (1), a resin film (2), an adhesive layer (2), and a resin film (3) in this order, and the resin The film (2) and the adhesive layer (2) are directly laminated, and the adhesive layer (2) is removed from the resin at a peeling angle of 180 degrees and a peeling speed of 30 mm/min in an environment with a temperature of 23°C and a humidity of 50% RH. The adhesive force when the film (2) is peeled off is 1 gf/25 mm or more.

Description

積層體laminated body

本發明係關於一種積層體。較佳為本發明關於一種於光學構件或電子構件之製造步驟中能夠良好地使用之積層體。The present invention relates to a laminated body. Preferably, the present invention relates to a laminated body that can be used well in the manufacturing process of optical components or electronic components.

於光學構件或電子構件之製造步驟中，存在為了防止在加工、組裝、檢查、運輸等時對構件之表面造成損傷而貼附表面保護膜(SPV)，或為了對較薄脆弱之構件加以補強而貼附補強用膜(RF)的情況(例如專利文獻1等)。In the manufacturing steps of optical components or electronic components, surface protection films (SPV) are attached to prevent damage to the surface of the components during processing, assembly, inspection, transportation, etc., or to reinforce thin and fragile components. In the case of attaching a reinforcing film (RF) (for example, Patent Document 1, etc.).

為了提昇如上所述之貼附步驟中之效率，相較於逐片地貼附表面保護膜或補強用膜之步驟，卷對卷(Roll-to-Roll)方式之連續步驟更為有效。In order to improve the efficiency in the above-mentioned attachment step, compared with the step of attaching surface protection film or reinforcing film piece by piece, the continuous step of roll-to-roll method is more effective.

若將表面保護膜或補強用膜之基材面貼附於具有基材與輕剝離黏著劑層之載體片材之該輕剝離黏著劑層面而製成積層體，則能夠以卷對卷之方式連續地向構件貼附該表面保護膜或該補強用膜。於該情形時，貼附後將載體片材剝離。If the base material side of the surface protection film or reinforcing film is attached to the light peeling adhesive layer of a carrier sheet having a base material and a light peeling adhesive layer to make a laminate, it can be done in a roll-to-roll manner. The surface protection film or the reinforcing film is continuously attached to the member. In this case, peel off the carrier sheet after attaching.

然而，使用如上所述之積層體連續地進行向構件之貼附步驟時，存在出現表面保護膜或補強用膜之基材面(尤其是端部)自載體片材之輕剝離黏著劑層浮起之現象的情況。此種現象尤其於將如上所述之積層體捲出時、或通過輥時、或將表面保護膜或補強用膜之隔離件剝離時經常見到。However, when the laminate as described above is used to continuously perform the step of attaching to a member, the base surface (especially the end portion) of the surface protective film or reinforcing film may be lightly peeled off from the carrier sheet and the adhesive layer may float. the occurrence of the phenomenon. This phenomenon is often seen especially when the above-mentioned laminate is rolled out, when it passes through a roller, or when the separator of the surface protective film or the reinforcing film is peeled off.

若出現如上所述之現象，則表面保護膜或補強用膜向構件上之貼附位置之對準精度降低，產生偏移錯位之問題。又，若出現如上所述之現象，則會產生表面保護膜或補強用膜以浮起部位為起點，於向構件貼附前自載體片材之輕剝離黏著劑層剝離之問題。 [先前技術文獻] [專利文獻]If the above phenomenon occurs, the alignment accuracy of the attachment position of the surface protective film or the reinforcing film to the component will be reduced, causing the problem of offset and misalignment. In addition, if the above phenomenon occurs, there will be a problem that the surface protective film or the reinforcing film is peeled off from the light peeling adhesive layer of the carrier sheet before being attached to the component, starting from the floating area. [Prior technical literature] [Patent Document]

專利文獻1：日本專利特開2016-17109號公報Patent Document 1: Japanese Patent Application Publication No. 2016-17109

[發明所欲解決之問題][Problem to be solved by the invention]

本發明之課題在於提供一種使表面保護膜或補強用膜積層於載體片材而成之積層體，於將該積層體以卷對卷方式連續地向構件進行貼附時，表面保護膜或補強用膜之基材面不易自載體片材所具有之黏著劑層浮起。 [解決問題之技術手段]An object of the present invention is to provide a laminated body in which a surface protective film or a reinforcing film is laminated on a carrier sheet. When the laminated body is continuously attached to a component in a roll-to-roll manner, the surface protective film or reinforcing film The substrate surface of the film is not easily lifted from the adhesive layer of the carrier sheet. [Technical means to solve problems]

本發明之積層體係依序具有樹脂膜(1)、黏著劑層(1)、樹脂膜(2)、黏著劑層(2)、樹脂膜(3)之5層以上之積層體，且 該樹脂膜(2)與該黏著劑層(2)直接積層， 於溫度23℃、濕度50%RH之環境下以剝離角度180度、剝離速度30 mm/分鐘將該黏著劑層(2)自該樹脂膜(2)剝離時之黏著力為1 gf/25 mm以上。The laminate system of the present invention has a laminate of five or more layers including a resin film (1), an adhesive layer (1), a resin film (2), an adhesive layer (2), and a resin film (3) in this order, and The resin film (2) and the adhesive layer (2) are directly laminated, When the adhesive layer (2) is peeled off from the resin film (2) at a peeling angle of 180 degrees and a peeling speed of 30 mm/minute in an environment with a temperature of 23°C and a humidity of 50% RH, the adhesive force is 1 gf/25 mm. above.

於一實施形態中，上述積層體於溫度23℃、濕度50%RH之環境下以剝離角度180度、剝離速度300 mm/分鐘將該黏著劑層(2)自該樹脂膜(2)剝離時之黏著力為2 gf/25 mm以上。In one embodiment, the above-mentioned laminate is peeled off from the resin film (2) at a peeling angle of 180 degrees and a peeling speed of 300 mm/min in an environment of 23°C and 50% RH. The adhesive force is above 2 gf/25 mm.

於一實施形態中，上述積層體於溫度23℃、濕度50%RH之環境下以剝離角度180度、剝離速度2400 mm/分鐘將該黏著劑層(2)自該樹脂膜(2)剝離時之黏著力為5 gf/25 mm以上。 [發明之效果]In one embodiment, when the above-mentioned laminate is peeled off from the resin film (2) at a peeling angle of 180 degrees and a peeling speed of 2400 mm/min in an environment with a temperature of 23°C and a humidity of 50% RH, The adhesive force is above 5 gf/25 mm. [Effects of the invention]

根據本發明，可提供一種使表面保護膜或補強用膜積層於載體片材而成之積層體，且於將該積層體以卷對卷方式連續地向構件進行貼附時，表面保護膜或補強用膜之基材面不易自載體片材所具有之黏著劑層浮起。According to the present invention, it is possible to provide a laminated body in which a surface protective film or a reinforcing film is laminated on a carrier sheet, and when the laminated body is continuously attached to a member in a roll-to-roll manner, the surface protective film or reinforcing film can be provided. The base material surface of the reinforcing film is not easily lifted from the adhesive layer of the carrier sheet.

本說明書中出現「重量」之表達之情形時，可與作為表示重量之SI系單位所慣用之「質量」相互替換。When the expression "weight" appears in this manual, it can be interchanged with "mass" which is the customary SI unit for expressing weight.

本說明書中出現「(甲基)丙烯醯基」之表達之情形時，意指「丙烯醯基及/或甲基丙烯醯基」，出現「(甲基)丙烯酸酯」之表達之情形時，意指「丙烯酸酯及/或甲基丙烯酸酯」，出現「(甲基)烯丙基」之表達之情形時，意指「烯丙基及/或甲基烯丙基」，出現「(甲基)丙烯醛」之表達之情形時，意指「丙烯醛及/或甲基丙烯醛」。When the expression "(meth)acrylyl" appears in this specification, it means "acrylyl and/or methacrylyl", and when the expression "(meth)acrylate" appears, It means "acrylate and/or methacrylate". When the expression "(meth)allyl" appears, it means "allyl and/or methacrylate". When "(meth)allyl" appears, When expressed as "base) acrolein", it means "acrolein and/or methacrolein".

≪≪1.積層體≫≫ 本發明之積層體係依序具有樹脂膜(1)、黏著劑層(1)、樹脂膜(2)、黏著劑層(2)、樹脂膜(3)之5層以上之積層體，且該樹脂膜(2)與該黏著劑層(2)直接積層。≪≪1.Laminated body≫≫ The laminate system of the present invention has a laminate of five or more layers including a resin film (1), an adhesive layer (1), a resin film (2), an adhesive layer (2), and a resin film (3) in this order, and the resin The film (2) and the adhesive layer (2) are directly laminated.

本發明之積層體只要依序具有樹脂膜(1)、黏著劑層(1)、樹脂膜(2)、黏著劑層(2)、樹脂膜(3)，且該樹脂膜(2)與該黏著劑層(2)直接積層，則亦可於並不損及本發明之效果之範圍內具有任意適宜之其他層。The laminated body of the present invention only needs to have a resin film (1), an adhesive layer (1), a resin film (2), an adhesive layer (2), and a resin film (3) in this order, and the resin film (2) and the If the adhesive layer (2) is directly laminated, any other suitable layer may be provided within the scope that does not impair the effect of the present invention.

本發明之積層體之積層數根據上述其他層之數量，較佳為5層～10層，更佳為5層～8層，進而較佳為5層～7層，尤佳為5層～6層，最佳為5層。The number of layers of the laminated body of the present invention is preferably 5 to 10 layers, more preferably 5 to 8 layers, further preferably 5 to 7 layers, and particularly preferably 5 to 6 layers, depending on the number of other layers mentioned above. layers, the best is 5 layers.

本發明之積層體之一實施形態如圖1所示，本發明之積層體100係將樹脂膜(1)10、黏著劑層(1)20、樹脂膜(2)30、黏著劑層(2)40、樹脂膜(3)50依序直接積層而成。One embodiment of the laminated body of the present invention is shown in Figure 1. The laminated body 100 of the present invention is composed of a resin film (1) 10, an adhesive layer (1) 20, a resin film (2) 30, and an adhesive layer (2). ) 40. Resin films (3) 50 are directly laminated in sequence.

於圖1所示之本發明之積層體之一實施形態中，樹脂膜(1)、黏著劑層(1)、樹脂膜(2)之積層體部分可成為表面保護膜或補強用膜。於該情形時，樹脂膜(1)可成為隔離件。In one embodiment of the laminate of the present invention shown in Figure 1, the laminate portion of the resin film (1), the adhesive layer (1), and the resin film (2) can serve as a surface protection film or a reinforcing film. In this case, the resin film (1) can serve as a spacer.

於圖1所示之本發明之積層體之一實施形態中，黏著劑層(2)、樹脂膜(3)之積層體部分可成為載體片材。載體片材亦可作為表面保護膜而使用。In one embodiment of the laminate of the present invention shown in Figure 1, the laminate portion of the adhesive layer (2) and the resin film (3) can serve as a carrier sheet. The carrier sheet can also be used as a surface protective film.

本發明之積層體於溫度23℃、濕度50%RH之環境下以剝離角度180度、剝離速度30 mm/分鐘將該黏著劑層(2)自該樹脂膜(2)剝離時之黏著力為1 gf/25 mm以上，較佳為1 gf/25 mm～10 gf/25 mm，更佳為1.2 gf/25 mm～8 gf/25 mm，進而較佳為1.4 gf/25 mm～7 gf/25 mm，尤佳為1.6 gf/25 mm～5 gf/25 mm，最佳為1.8 gf/25 mm～3 gf/25 mm。若上述黏著力處於上述範圍內，則於將本發明之積層體以卷對卷方式連續地向構件進行貼附時，能夠抑制樹脂膜(2)自黏著劑層(2)浮起。上述黏著力之測定方法記於下文。The adhesive force of the laminate of the present invention when the adhesive layer (2) is peeled off from the resin film (2) at a peeling angle of 180 degrees and a peeling speed of 30 mm/min in an environment of 23°C and 50% RH is: 1 gf/25 mm or more, preferably 1 gf/25 mm to 10 gf/25 mm, more preferably 1.2 gf/25 mm to 8 gf/25 mm, further preferably 1.4 gf/25 mm to 7 gf/ 25 mm, especially 1.6 gf/25 mm～5 gf/25 mm, the best is 1.8 gf/25 mm～3 gf/25 mm. If the adhesive force is within the above range, when the laminate of the present invention is continuously attached to a member in a roll-to-roll manner, the resin film (2) can be suppressed from lifting from the adhesive layer (2). The measurement method of the above-mentioned adhesive force is recorded below.

本發明之積層體於溫度23℃、濕度50%RH之環境下以剝離角度180度、剝離速度300 mm/分鐘將該黏著劑層(2)自該樹脂膜(2)剝離時之黏著力為2 gf/25 mm以上，較佳為2 gf/25 mm～20 gf/25 mm，更佳為2.5 gf/25 mm～10 gf/25 mm，進而較佳為3 gf/25 mm～9 gf/25 mm，尤佳為3 gf/25 mm～8 gf/25 mm，最佳為3.5 gf/25 mm～7 gf/25 mm。若上述黏著力處於上述範圍內，則於將本發明之積層體以卷對卷方式連續地向構件進行貼附時，更能夠抑制樹脂膜(2)自黏著劑層(2)浮起。上述黏著力之測定方法記於下文。The adhesive force of the laminate of the present invention when the adhesive layer (2) is peeled off from the resin film (2) at a peeling angle of 180 degrees and a peeling speed of 300 mm/min in an environment with a temperature of 23°C and a humidity of 50% RH is: 2 gf/25 mm or more, preferably 2 gf/25 mm to 20 gf/25 mm, more preferably 2.5 gf/25 mm to 10 gf/25 mm, further preferably 3 gf/25 mm to 9 gf/ 25 mm, especially 3 gf/25 mm～8 gf/25 mm, the best is 3.5 gf/25 mm～7 gf/25 mm. If the above-mentioned adhesive force is within the above-mentioned range, when the laminate of the present invention is continuously attached to a component in a roll-to-roll manner, the resin film (2) can be further suppressed from lifting from the adhesive layer (2). The measurement method of the above-mentioned adhesion force is recorded below.

本發明之積層體於溫度23℃、濕度50%RH之環境下以剝離角度180度、剝離速度2400 mm/分鐘將該黏著劑層(2)自該樹脂膜(2)剝離時之黏著力為5 gf/25 mm以上，較佳為5 gf/25 mm～100 gf/25 mm，更佳為7 gf/25 mm～60 gf/25 mm，進而較佳為8 gf/25 mm～40 gf/25 mm，尤佳為9 gf/25 mm～30 gf/25 mm，最佳為10 gf/25 mm～25 gf/25 mm。若上述黏著力處於上述範圍內，則於將本發明之積層體以卷對卷方式連續地向構件進行貼附時，能夠更進一步抑制樹脂膜(2)自黏著劑層(2)浮起。上述黏著力之測定方法記於下文。The adhesive force of the laminate of the present invention when the adhesive layer (2) is peeled off from the resin film (2) at a peeling angle of 180 degrees and a peeling speed of 2400 mm/min in an environment with a temperature of 23°C and a humidity of 50% RH is: 5 gf/25 mm or more, preferably 5 gf/25 mm to 100 gf/25 mm, more preferably 7 gf/25 mm to 60 gf/25 mm, further preferably 8 gf/25 mm to 40 gf/ 25 mm, especially 9 gf/25 mm～30 gf/25 mm, the best is 10 gf/25 mm～25 gf/25 mm. If the adhesive force is within the above range, when the laminate of the present invention is continuously attached to a component in a roll-to-roll manner, the resin film (2) can be further suppressed from lifting from the adhesive layer (2). The measurement method of the above-mentioned adhesion force is recorded below.

本發明之積層體較佳為黏著劑層(1)之於溫度23℃、濕度50%RH之環境下以剝離角度180度、剝離速度300 mm/分鐘將該黏著劑層(1)自玻璃剝離時之黏著力(1)與黏著劑層(2)之於溫度23℃、濕度50%RH之環境下以剝離角度180度、剝離速度300 mm/分鐘將該黏著劑層(2)自玻璃剝離時之黏著力(2)係黏著力(1)＞黏著力(2)。藉由黏著力(1)＞黏著力(2)，更能夠表現出本發明之效果。上述黏著力之測定方法記於下文。The laminate of the present invention is preferably an adhesive layer (1) that is peeled off from glass at a peeling angle of 180 degrees and a peeling speed of 300 mm/min in an environment with a temperature of 23°C and a humidity of 50% RH. The adhesive force (1) and the adhesive layer (2) are peeled off from the glass at a peeling angle of 180 degrees and a peeling speed of 300 mm/min in an environment with a temperature of 23°C and a humidity of 50% RH. At this time, the adhesion force (2) is the adhesion force (1) > the adhesion force (2). By adhesion (1)>adhesion (2), the effect of the present invention can be further expressed. The measurement method of the above-mentioned adhesion force is recorded below.

本發明之積層體之全光線透過率較佳為60%以上，更佳為70%～100%，進而較佳為80%～100%，尤佳為83%～100%，最佳為85%～100%。上述全光線透過率之測定方法記於下文。The total light transmittance of the laminated body of the present invention is preferably 60% or more, more preferably 70% to 100%, further preferably 80% to 100%, particularly preferably 83% to 100%, most preferably 85% ~100%. The method for measuring the above-mentioned total light transmittance is described below.

本發明之積層體之霧度較佳為15%以下，更佳為0%～10%，進而較佳為0%～8%，尤佳為0%～7%，最佳為0%～6%。上述霧度之測定方法記於下文。The haze of the laminated body of the present invention is preferably 15% or less, more preferably 0% to 10%, further preferably 0% to 8%, even more preferably 0% to 7%, most preferably 0% to 6% %. The method for measuring the above-mentioned haze is described below.

≪1-1.樹脂膜(1)≫ 關於樹脂膜(1)之厚度，就更能夠表現出本發明之效果之方面而言，較佳為1 μm～300 μm，更佳為10 μm～200 μm，進而較佳為30 μm～150 μm，尤佳為40 μm～100 μm，最佳為50 μm～80 μm。≪1-1. Resin film (1)≫ The thickness of the resin film (1) is preferably 1 μm to 300 μm, more preferably 10 μm to 200 μm, and further preferably 30 μm to 150 μm in order to better express the effects of the present invention. , especially preferably 40 μm ~ 100 μm, and optimally 50 μm ~ 80 μm.

樹脂膜(1)包含樹脂基材膜(1a)。The resin film (1) includes a resin base film (1a).

作為樹脂基材膜(1a)，例如可例舉：包含聚對苯二甲酸乙二酯(PET)、聚萘二甲酸乙二酯(PEN)、聚對苯二甲酸丁二酯(PBT)等聚酯系樹脂之塑膠膜；包含以聚乙烯(PE)、聚丙烯(PP)、聚甲基戊烯(PMP)、乙烯-丙烯共聚物、乙烯-乙酸乙烯酯共聚物(EVA)等α-烯烴作為單體成分之烯烴系樹脂之塑膠膜；包含聚氯乙烯(PVC)之塑膠膜；包含乙酸乙烯酯系樹脂之塑膠膜；包含聚碳酸酯(PC)之塑膠膜；包含聚苯硫醚(PPS)之塑膠膜；包含聚醯胺(尼龍)、全芳香族聚醯胺(aramid)等醯胺系樹脂之塑膠膜；包含聚醯亞胺系樹脂之塑膠膜；包含聚醚醚酮(PEEK)之塑膠膜；包含聚乙烯(PE)、聚丙烯(PP)等烯烴系樹脂之塑膠膜；包含聚四氟乙烯、聚氯三氟乙烯、聚氟乙烯、聚偏二氟乙烯、四氟乙烯-六氟丙烯共聚物、氯氟乙烯-偏二氟乙烯共聚物等氟系樹脂等之塑膠膜等。Examples of the resin base film (1a) include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), and the like. Plastic films made of polyester resins; including polyethylene (PE), polypropylene (PP), polymethylpentene (PMP), ethylene-propylene copolymer, ethylene-vinyl acetate copolymer (EVA) and other α- Plastic films of olefin-based resins with olefin as a monomer component; plastic films containing polyvinyl chloride (PVC); plastic films containing vinyl acetate-based resins; plastic films containing polycarbonate (PC); containing polyphenylene sulfide (PPS) plastic film; plastic film containing polyamide (nylon), fully aromatic polyamide (aramid) and other amide resins; plastic film containing polyimide resin; including polyether ether ketone ( PEEK) plastic film; plastic film containing polyethylene (PE), polypropylene (PP) and other olefin resins; including polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene Plastic films of fluorine-based resins such as ethylene-hexafluoropropylene copolymer, chlorofluoroethylene-vinylidene fluoride copolymer, etc.

樹脂基材膜(1a)可僅為1層，亦可為2層以上。樹脂基材膜(1a)亦可為經延伸者。The resin base film (1a) may be only one layer, or may be two or more layers. The resin base film (1a) may be stretched.

亦可對樹脂基材膜(1a)實施表面處理。作為表面處理，例如可例舉：電暈處理、電漿處理、鉻酸處理、臭氧暴露、火焰暴露、高壓電擊暴露、離子化放射線處理、底塗劑塗覆處理等。The resin base film (1a) may also be subjected to surface treatment. Examples of surface treatment include corona treatment, plasma treatment, chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, ionizing radiation treatment, primer coating treatment, and the like.

樹脂基材膜(1a)亦於並不損及本發明之效果之範圍內包含任意適宜之添加劑。The resin base film (1a) also contains any appropriate additive within the range that does not impair the effects of the present invention.

為了提高自黏著劑層(1)之剝離性，樹脂膜(1)亦可具有離型層(1b)。於樹脂膜(1)具有離型層(1b)之情形時，將離型層(1b)之側直接積層於黏著劑層(1)而成。In order to improve the peelability of the self-adhesive layer (1), the resin film (1) may also have a release layer (1b). When the resin film (1) has a release layer (1b), the side of the release layer (1b) is directly laminated on the adhesive layer (1).

關於離型層(1b)之形成材料，可於並不損及本發明之效果之範圍內採用任意適宜之形成材料。作為此種形成材料，例如可例舉：聚矽氧系離型劑、氟系離型劑、長鏈烷基系離型劑、脂肪酸醯胺系離型劑等。該等之中，較佳為聚矽氧系離型劑。離型層(1b)可以塗佈層之方式來形成。Regarding the forming material of the release layer (1b), any suitable forming material can be used within the scope that does not impair the effect of the present invention. Examples of such forming materials include polysiloxane-based release agents, fluorine-based release agents, long-chain alkyl-based release agents, fatty acid amide-based release agents, and the like. Among these, polysiloxane-based release agents are preferred. The release layer (1b) can be formed by a coating layer.

關於離型層(1b)之厚度，可於並不損及本發明之效果之範圍內，根據目的而採用任意適宜之厚度。作為此種厚度，較佳為10 nm～2000 nm，更佳為10 nm～1500 nm，進而較佳為10 nm～1000 nm，尤佳為10 nm～500 nm。Regarding the thickness of the release layer (1b), any suitable thickness can be adopted according to the purpose within the range that does not impair the effect of the present invention. Such a thickness is preferably 10 nm to 2000 nm, more preferably 10 nm to 1500 nm, further preferably 10 nm to 1000 nm, and particularly preferably 10 nm to 500 nm.

離型層(1b)可僅為1層，亦可為2層以上。The release layer (1b) may be only one layer, or may be two or more layers.

作為聚矽氧系離型層，例如可例舉加成反應型聚矽氧樹脂。作為加成反應型聚矽氧樹脂，具體而言，例如可例舉：信越化學工業製造之KS-774、KS-775、KS-778、KS-779H、KS-847H、KS-847T；Toshiba Silicone製造之TPR-6700、TPR-6710、TPR-6721；Dow Corning Toray製造之SD7220、SD7226等。聚矽氧系離型層之塗佈量(乾燥後)較佳為0.01 g/m2 ～2 g/m2 ，更佳為0.01 g/m2 ～1 g/m2 ，進而較佳為0.01 g/m2 ～0.5 g/m2 。Examples of the polysilicone-based release layer include addition reaction type polysilicone resin. Specific examples of the addition reaction type polysiloxy resin include: KS-774, KS-775, KS-778, KS-779H, KS-847H, and KS-847T manufactured by Shin-Etsu Chemical Industry; Toshiba Silicone TPR-6700, TPR-6710, TPR-6721 manufactured by Dow Corning Toray; SD7220, SD7226, etc. manufactured by Dow Corning Toray. The coating amount of the polysiloxane release layer (after drying) is preferably 0.01 g/m 2 to 2 g/m 2 , more preferably 0.01 g/m 2 to 1 g/m 2 , and even more preferably 0.01 g/m 2 ~0.5 g/m 2 .

離型層(1b)之形成例如可藉由如下方式進行：採用反向凹版塗佈、棒式塗佈、模嘴塗佈等先前公知之塗佈方式於任意適宜之層上塗佈上述形成材料後，於通常120～200℃左右之溫度下實施熱處理，藉此使之硬化。又，視需要亦可併用熱處理與紫外線照射等活性能量線照射。The release layer (1b) can be formed, for example, by using previously known coating methods such as reverse gravure coating, rod coating, die coating, etc. to coat the above-mentioned forming material on any suitable layer. After that, heat treatment is performed at a temperature of usually about 120 to 200°C to harden it. Furthermore, if necessary, heat treatment and active energy ray irradiation such as ultraviolet irradiation may be used in combination.

樹脂膜(1)亦可具有抗靜電層(1c)。The resin film (1) may have an antistatic layer (1c).

關於抗靜電層(1c)之厚度，可於並不損及本發明之效果之範圍內採用任意適宜之厚度。作為此種厚度，較佳為1 nm～1000 nm，更佳為5 nm～900 nm，進而較佳為7.5 nm～800 nm，尤佳為10 nm～700 nm。As for the thickness of the antistatic layer (1c), any appropriate thickness can be used within the range that does not impair the effect of the present invention. Such a thickness is preferably 1 nm to 1000 nm, more preferably 5 nm to 900 nm, further preferably 7.5 nm to 800 nm, and particularly preferably 10 nm to 700 nm.

抗靜電層(1c)可僅為1層，亦可為2層以上。The antistatic layer (1c) may be only one layer or may be two or more layers.

作為抗靜電層(1c)，只要為能夠發揮抗靜電效果之層，則可於並不損及本發明之效果之範圍內採用任意適宜之抗靜電層。作為此種抗靜電層，較佳為於任意適宜之基材層上塗佈包含導電性聚合物之導電塗佈液所形成之抗靜電層。具體而言，例如於樹脂基材膜(1a)上塗佈包含導電性聚合物之導電塗佈液所形成之抗靜電層。作為具體之塗佈方法，可例舉：輥式塗佈法、棒式塗佈法、凹版塗佈法等。As the antistatic layer (1c), as long as it is a layer that can exert an antistatic effect, any suitable antistatic layer can be used within the range that does not impair the effect of the present invention. As such an antistatic layer, an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on any suitable base material layer is preferred. Specifically, for example, an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on the resin base film (1a). Specific coating methods include roll coating, rod coating, gravure coating, and the like.

關於導電性聚合物，可於並不損及本發明之效果之範圍內採用任意適宜之導電性聚合物。作為此種導電性聚合物，例如可例舉：於π共軛系導電性聚合物中摻雜有聚陰離子之導電性聚合物等。作為π共軛系導電性聚合物，可例舉：聚噻吩、聚吡咯、聚苯胺、聚乙炔等鏈狀導電性聚合物。作為聚陰離子，可例舉：聚苯乙烯磺酸、聚異戊二烯磺酸、聚乙烯基磺酸、聚烯丙基磺酸、聚丙烯酸乙酯磺酸、聚甲基丙烯醯羧酸等。導電性聚合物可僅為1種，亦可為2種以上。Regarding the conductive polymer, any appropriate conductive polymer can be used within the scope that does not impair the effects of the present invention. Examples of such a conductive polymer include a conductive polymer in which a π-conjugated conductive polymer is doped with polyanions. Examples of the π-conjugated conductive polymer include chain conductive polymers such as polythiophene, polypyrrole, polyaniline, and polyacetylene. Examples of the polyanion include polystyrene sulfonic acid, polyisoprene sulfonic acid, polyvinyl sulfonic acid, polyallylsulfonic acid, polyethyl acrylate sulfonic acid, polymethacryl carboxylic acid, etc. . Only one type of conductive polymer may be used, or two or more types may be used.

樹脂膜(1)之一實施形態依序包含樹脂基材膜(1a)、抗靜電層(1c)及離型層(1b)。代表性而言，該實施形態包含樹脂基材膜(1a)、抗靜電層(1c)及離型層(1b)。One embodiment of the resin film (1) includes a resin base film (1a), an antistatic layer (1c) and a release layer (1b) in sequence. Typically, this embodiment includes a resin base film (1a), an antistatic layer (1c), and a release layer (1b).

樹脂膜(1)之另一實施形態依序包含抗靜電層(1c)、樹脂基材膜(1a)、抗靜電層(1c)及離型層(1b)。代表性而言，該實施形態包含抗靜電層(1c)、樹脂基材膜(1a)、抗靜電層(1c)及離型層(1b)。Another embodiment of the resin film (1) includes an antistatic layer (1c), a resin base film (1a), an antistatic layer (1c) and a release layer (1b) in sequence. Representatively, this embodiment includes an antistatic layer (1c), a resin base film (1a), an antistatic layer (1c), and a release layer (1b).

≪1-2.黏著劑層(1)≫ 黏著劑層(1)可於並不損及本發明之效果之範圍內採用任意適宜之黏著劑層。黏著劑層(1)可僅為1層，亦可為2層以上。≪1-2. Adhesive layer (1)≫ The adhesive layer (1) may be any suitable adhesive layer within the scope that does not impair the effect of the present invention. The adhesive layer (1) may be only one layer, or may be two or more layers.

關於黏著劑層(1)之厚度，就更能夠表現出本發明之效果之方面而言，較佳為0.5 μm～150 μm，更佳為1 μm～100 μm，進而較佳為3 μm～80 μm，尤佳為5 μm～50 μm，最佳為5 μm～30 μm。The thickness of the adhesive layer (1) is preferably 0.5 μm to 150 μm, more preferably 1 μm to 100 μm, and further preferably 3 μm to 80 μm in order to better express the effects of the present invention. μm, preferably 5 μm～50 μm, most preferably 5 μm～30 μm.

黏著劑層(1)較佳為包含選自由丙烯酸系黏著劑、胺基甲酸酯系黏著劑、橡膠系黏著劑、聚矽氧系黏著劑所組成之群中之至少1種。The adhesive layer (1) preferably contains at least one selected from the group consisting of acrylic adhesives, urethane adhesives, rubber adhesives, and silicone adhesives.

黏著劑層(1)可藉由任意適宜之方法形成。作為此種方法，例如可例舉如下方法：於任意適宜之基材(例如，樹脂膜(2))上塗佈黏著劑組合物(選自由丙烯酸系黏著劑組合物、胺基甲酸酯系黏著劑組合物、橡膠系黏著劑組合物、聚矽氧系黏著劑組合物所組成之群中之至少1種)，視需要進行加熱、乾燥後，視需要使之硬化，而於該基材上形成黏著劑層。作為此種塗佈之方法，例如可例舉：凹版輥式塗佈機、逆輥塗佈機、接觸輥塗佈機、浸漬輥塗機、棒式塗佈機、刮刀塗佈機、氣刀塗佈機、噴霧塗佈機、缺角輪塗佈機、直接塗佈機、輥刷塗佈機等方法。The adhesive layer (1) can be formed by any suitable method. As such a method, for example, the following method can be cited: Coating an adhesive composition (selected from an acrylic adhesive composition, a urethane adhesive composition) on any suitable base material (for example, the resin film (2)) At least one of the group consisting of an adhesive composition, a rubber-based adhesive composition, and a polysiloxane-based adhesive composition), after heating and drying as necessary, hardening it as necessary, and applying it to the base material An adhesive layer is formed on it. Examples of such coating methods include gravure roll coaters, reverse roll coaters, contact roll coaters, dip roll coaters, rod coaters, blade coaters, and air knives. Coating machine, spray coating machine, notch wheel coating machine, direct coating machine, roller brush coating machine and other methods.

黏著劑層(1)亦可包含導電成分。導電成分可僅為1種，亦可為2種以上。The adhesive layer (1) may also contain conductive components. There may be only one type of conductive component, or two or more types of conductive components.

＜1-2-1.丙烯酸系黏著劑＞ 丙烯酸系黏著劑係由丙烯酸系黏著劑組合物形成。＜1-2-1. Acrylic adhesive＞ The acrylic adhesive is formed from an acrylic adhesive composition.

就更能夠表現出本發明之效果之方面而言，丙烯酸系黏著劑組合物較佳為包含丙烯酸系聚合物與交聯劑。In order to better express the effects of the present invention, the acrylic adhesive composition preferably contains an acrylic polymer and a cross-linking agent.

丙烯酸系聚合物於丙烯酸系黏著劑之領域中可被稱作所謂之基礎聚合物。丙烯酸系聚合物可僅為1種，亦可為2種以上。Acrylic polymers may be referred to as so-called base polymers in the field of acrylic adhesives. Only one type of acrylic polymer may be used, or two or more types may be used.

丙烯酸系黏著劑組合物中之丙烯酸系聚合物之含有比率以固形物成分換算計，較佳為60重量%～99.9重量%，更佳為65重量%～99.9重量%，進而較佳為70重量%～99.9重量%，尤佳為75重量%～99.9重量%，最佳為80重量%～99.9重量%。The content ratio of the acrylic polymer in the acrylic adhesive composition is preferably 60% to 99.9% by weight, more preferably 65% to 99.9% by weight, and still more preferably 70% by weight in terms of solid content. % to 99.9% by weight, particularly preferably 75% to 99.9% by weight, most preferably 80% to 99.9% by weight.

作為丙烯酸系聚合物，可於並不損及本發明之效果之範圍內採用任意適宜之丙烯酸系聚合物。As the acrylic polymer, any suitable acrylic polymer can be used within the range that does not impair the effects of the present invention.

就更能夠表現出本發明之效果之方面而言，丙烯酸系聚合物之重量平均分子量較佳為30萬～250萬，更佳為35萬～200萬，進而較佳為40萬～180萬，尤佳為50萬～150萬。In order to better express the effects of the present invention, the weight average molecular weight of the acrylic polymer is preferably 300,000 to 2,500,000, more preferably 350,000 to 2,000,000, and still more preferably 400,000 to 1,800,000. Especially preferably, it is 500,000 to 1.5 million.

作為丙烯酸系聚合物，就更能夠表現出本發明之效果之方面而言，較佳為由組合物(A)藉由聚合所形成之丙烯酸系聚合物，上述組合物(A)包含(a成分)烷基酯部分之烷基之碳數為4～12之(甲基)丙烯酸烷基酯、(b成分)選自由具有OH基之(甲基)丙烯酸酯及(甲基)丙烯酸所組成之群中之至少1種。The acrylic polymer is preferably an acrylic polymer formed by polymerization of the composition (A) containing the component (a) in order to better express the effects of the present invention. ) (meth)acrylic acid alkyl ester in which the alkyl group of the alkyl ester part has a carbon number of 4 to 12, (b component) is selected from the group consisting of (meth)acrylate and (meth)acrylic acid having an OH group At least 1 species in the group.

作為丙烯酸系聚合物，就更能夠表現出本發明之效果之方面而言，較佳為由包含烷基酯部分之烷基之碳數為4～12之(甲基)丙烯酸烷基酯作為(a成分)、且並不包含具有OH基之(甲基)丙烯酸酯而是包含(甲基)丙烯酸作為(b成分)的組合物(A)藉由聚合所形成之丙烯酸系聚合物，更佳為由包含烷基酯部分之烷基之碳數為4～8之(甲基)丙烯酸烷基酯作為(a成分)、且並不包含具有OH基之丙烯酸酯而是包含(甲基)丙烯酸作為(b成分)的組合物(A)藉由聚合所形成之丙烯酸系聚合物。The acrylic polymer is preferably a (meth)acrylic acid alkyl ester having an alkyl group containing an alkyl ester moiety and having a carbon number of 4 to 12 in order to better express the effects of the present invention. acrylic polymer formed by polymerization of the composition (A) which does not contain a (meth)acrylate having an OH group but contains (meth)acrylic acid as (b) The alkyl (meth)acrylate containing the alkyl group of the alkyl ester part having a carbon number of 4 to 8 is used as (a component), and it does not contain an acrylate having an OH group but contains (meth)acrylic acid. The composition (A) as (b component) is an acrylic polymer formed by polymerization.

(a成分)、(b成分)分別獨立地可僅為1種，亦可為2種以上。Each of (a component) and (b component) may be independently one type, or two or more types.

作為烷基酯部分之烷基之碳數為4～12之(甲基)丙烯酸烷基酯(a成分)，例如可例舉：(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸十二烷基酯等。該等之中，就更能夠表現出本發明之效果之方面而言，較佳為(甲基)丙烯酸正丁酯、(甲基)丙烯酸2-乙基己酯，更佳為丙烯酸正丁酯、丙烯酸2-乙基己酯。Examples of (meth)acrylic acid alkyl esters (component a) in which the alkyl group of the alkyl ester part has 4 to 12 carbon atoms include (meth)n-butyl acrylate and (meth)isobutyl acrylate. Ester, 2nd butyl (meth)acrylate, 3rd butyl (meth)acrylate, amyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, (methyl) Octyl acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, Isodecyl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate, etc. Among these, n-butyl (meth)acrylate and 2-ethylhexyl (meth)acrylate are preferred, and n-butyl acrylate is more preferred in terms of being able to exhibit the effects of the present invention more effectively. , 2-ethylhexyl acrylate.

作為選自由具有OH基之(甲基)丙烯酸酯及(甲基)丙烯酸所組成之群中之至少1種(b成分)，例如可例舉：(甲基)丙烯酸羥基乙酯、(甲基)丙烯酸羥基丙酯、(甲基)丙烯酸羥基丁酯等具有OH基之(甲基)丙烯酸酯、(甲基)丙烯酸等。該等之中，就更能夠表現出本發明之效果之方面而言，較佳為(甲基)丙烯酸羥基乙酯、(甲基)丙烯酸，更佳為丙烯酸羥基乙酯、丙烯酸。Examples of at least one type (b component) selected from the group consisting of (meth)acrylate and (meth)acrylic acid having an OH group include: (meth)hydroxyethyl acrylate, (meth)acrylate )Hydroxypropyl acrylate, hydroxybutyl (meth)acrylate and other (meth)acrylate and (meth)acrylic acid esters having OH groups. Among these, hydroxyethyl (meth)acrylate and (meth)acrylic acid are preferable, and hydroxyethyl acrylate and acrylic acid are more preferable in terms of being able to express the effects of the present invention more effectively.

組合物(A)亦可包含(a)成分及(b)成分以外之共聚性單體。共聚性單體可僅為1種，亦可為2種以上。作為此種共聚性單體，例如可例舉：伊康酸、順丁烯二酸、反丁烯二酸、丁烯酸、異丁烯酸、該等之酸酐(例如，順丁烯二酸酐、伊康酸酐等含酸酐基之單體)等含羧基之單體(其中不包括(甲基)丙烯酸)；(甲基)丙烯醯胺、N,N-二甲基(甲基)丙烯醯胺、N-羥甲基(甲基)丙烯醯胺、N-甲氧基甲基(甲基)丙烯醯胺、N-丁氧基甲基(甲基)丙烯醯胺、N-羥基乙基(甲基)丙烯醯胺等含醯胺基之單體；(甲基)丙烯酸胺基乙酯、(甲基)丙烯酸二甲基胺基乙酯、(甲基)丙烯酸第三丁基胺基乙酯等含胺基之單體；(甲基)丙烯酸縮水甘油酯、(甲基)丙烯酸甲基縮水甘油酯等含環氧基之單體；丙烯腈或甲基丙烯腈等含氰基之單體；N-乙烯基-2-吡咯啶酮、(甲基)丙烯醯𠰌啉、N-乙烯基哌啶酮、N-乙烯基哌𠯤、N-乙烯基吡咯、N-乙烯基咪唑、乙烯基吡啶、乙烯基嘧啶、乙烯基㗁唑等含雜環之乙烯基系單體；乙烯基磺酸鈉等含磺酸基之單體；丙烯醯磷酸2-羥基乙酯等含磷酸基之單體；環己基順丁烯二醯亞胺、異丙基順丁烯二醯亞胺等含醯亞胺基之單體；異氰酸2-甲基丙烯醯氧基乙酯等含異氰酸基之單體；(甲基)丙烯酸環戊酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸異𦯉酯等具有脂環式烴基之(甲基)丙烯酸酯；(甲基)丙烯酸苯酯、(甲基)丙烯酸苯氧基乙酯、(甲基)丙烯酸苄酯等具有芳香族烴基之(甲基)丙烯酸酯；乙酸乙烯酯、丙酸乙烯酯等乙烯酯；苯乙烯、乙烯基甲苯等芳香族乙烯基化合物；乙烯、丁二烯、異戊二烯、異丁烯等烯烴類或二烯類；乙烯基烷基醚等乙烯醚類；氯乙烯等。The composition (A) may contain copolymerizable monomers other than the component (a) and the component (b). The number of copolymerizable monomers may be only one type, or two or more types. Examples of such copolymerizable monomers include itaconic acid, maleic acid, fumaric acid, crotonic acid, methacrylic acid, and acid anhydrides thereof (for example, maleic anhydride, (Meth)acrylamide, N,N-dimethyl(meth)acrylamide, N-hydroxymethyl(meth)acrylamide, N-methoxymethyl(meth)acrylamide, N-butoxymethyl(meth)acrylamide, N-hydroxyethyl(meth)acrylamide (meth)acrylamide and other amide group-containing monomers; (meth)aminoethyl acrylate, (meth)acrylic acid dimethylaminoethyl, (meth)acrylic acid tert-butylaminoethyl and other amine group-containing monomers; (meth)acrylic acid glycidyl ester, (meth)acrylic acid methyl glycidyl ester and other epoxy group-containing monomers; acrylonitrile or methacrylonitrile and other cyano group-containing monomers ;N-vinyl-2-pyrrolidinone, (meth)acrylamide, N-vinyl piperidone, N-vinyl piperidone, N-vinylpyrrole, N-vinylimidazole, vinyl Heterocyclic ring-containing vinyl monomers such as pyridine, vinyl pyrimidine, vinyl ethazole; sulfonic acid group-containing monomers such as sodium vinyl sulfonate; phosphate group-containing monomers such as 2-hydroxyethyl acrylate phosphate ; Cyclohexylmaleimide, isopropylmaleimide and other imide-containing monomers; 2-methacrylyloxyethyl isocyanate and other isocyanate-containing monomers Monomers; (meth)acrylates with alicyclic hydrocarbon groups such as cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, isopropyl (meth)acrylate, etc.; benzene (meth)acrylate Ester, phenoxyethyl (meth)acrylate, benzyl (meth)acrylate and other (meth)acrylates with aromatic hydrocarbon groups; vinyl esters such as vinyl acetate and vinyl propionate; styrene, vinyl Aromatic vinyl compounds such as toluene; olefins or dienes such as ethylene, butadiene, isoprene, isobutylene; vinyl ethers such as vinyl alkyl ether; vinyl chloride, etc.

作為共聚性單體，亦可採用多官能性單體。所謂多官能性單體係指一分子中具有2個以上之乙烯性不飽和基之單體。關於乙烯性不飽和基，可於並不損及本發明之效果之範圍內採用任意適宜之乙烯性不飽和基。作為此種乙烯性不飽和基，例如可例舉：乙烯基、丙烯基、異丙烯基、乙烯醚基(乙烯氧基)、烯丙醚基(烯丙氧基)等自由基聚合性官能基。作為多官能性單體，例如可例舉：己二醇二(甲基)丙烯酸酯、丁二醇二(甲基)丙烯酸酯、(聚)乙二醇二(甲基)丙烯酸酯、(聚)丙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、四羥甲基甲烷三(甲基)丙烯酸酯、(甲基)丙烯酸烯丙酯、(甲基)丙烯酸乙烯酯、二乙烯苯、環氧丙烯酸酯、聚酯丙烯酸酯、丙烯酸胺基甲酸酯等。此種多官能性單體可僅為1種，亦可為2種以上。As the copolymerizable monomer, a polyfunctional monomer can also be used. The so-called multifunctional monomer refers to a monomer having more than two ethylenically unsaturated groups in one molecule. As for the ethylenically unsaturated group, any suitable ethylenically unsaturated group can be used within the range that does not impair the effects of the present invention. Examples of such ethylenically unsaturated groups include radically polymerizable functional groups such as vinyl, propenyl, isopropenyl, vinyl ether (ethyleneoxy), and allyl ether (allyloxy) groups. . Examples of the polyfunctional monomer include: hexylene glycol di(meth)acrylate, butylene glycol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, ) Propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, Trimethylolpropane tri(meth)acrylate, tetramethylolmethane tri(meth)acrylate, allyl (meth)acrylate, vinyl (meth)acrylate, divinylbenzene, epoxy acrylic acid ester, polyester acrylate, acrylic urethane, etc. Only one type of such polyfunctional monomer may be used, or two or more types may be used.

作為共聚性單體，亦可採用(甲基)丙烯酸烷氧基烷基酯。作為(甲基)丙烯酸烷氧基烷基酯，例如可例舉：(甲基)丙烯酸2-甲氧基乙酯、(甲基)丙烯酸2-乙氧基乙酯、(甲基)丙烯酸甲氧基三乙二醇酯、(甲基)丙烯酸3-甲氧基丙酯、(甲基)丙烯酸3-乙氧基丙酯、(甲基)丙烯酸4-甲氧基丁酯、(甲基)丙烯酸4-乙氧基丁酯等。(甲基)丙烯酸烷氧基烷基酯可僅為1種，亦可為2種以上。As the copolymerizable monomer, alkoxyalkyl (meth)acrylate can also be used. Examples of (meth)acrylic acid alkoxyalkyl esters include: (meth)acrylic acid 2-methoxyethyl ester, (meth)acrylic acid 2-ethoxyethyl ester, (meth)acrylic acid methyl ester Oxytriethylene glycol ester, 3-methoxypropyl (meth)acrylate, 3-ethoxypropyl (meth)acrylate, 4-methoxybutyl (meth)acrylate, (meth)acrylate ) 4-ethoxybutyl acrylate, etc. Only one type of (meth)acrylic acid alkoxyalkyl ester may be used, or two or more types may be used.

關於烷基酯部分之烷基之碳數為4～12之(甲基)丙烯酸烷基酯(a成分)之含量，就更能夠表現出本發明之效果之方面而言，相對於構成丙烯酸系聚合物之單體成分總量(100重量%)，較佳為30重量%以上，更佳為35重量%～99重量%，進而較佳為40重量%～98重量%，尤佳為50重量%～95重量%。The content of the (meth)acrylic acid alkyl ester (component a) whose alkyl group in the alkyl ester part has a carbon number of 4 to 12 is more effective in expressing the effects of the present invention than in the acrylic system. The total amount of monomer components of the polymer (100% by weight) is preferably 30% by weight or more, more preferably 35% by weight to 99% by weight, further preferably 40% by weight to 98% by weight, and particularly preferably 50% by weight. %~95% by weight.

關於選自由具有OH基之(甲基)丙烯酸酯及(甲基)丙烯酸所組成之群中之至少1種(b成分)之含量，就更能夠表現出本發明之效果之方面而言，相對於構成丙烯酸系聚合物之單體成分總量(100重量%)，較佳為1重量%以上，更佳為1重量%～30重量%，進而較佳為2重量%～20重量%，尤佳為3重量%～10重量%。The content of at least one (b component) selected from the group consisting of (meth)acrylate and (meth)acrylic acid having an OH group is relatively high in terms of being able to better express the effects of the present invention. The total amount of monomer components constituting the acrylic polymer (100% by weight) is preferably 1% by weight or more, more preferably 1% by weight to 30% by weight, further preferably 2% by weight to 20% by weight, especially Preferably, it is 3% by weight to 10% by weight.

組合物(A)可於並不損及本發明之效果之範圍內含有任意適宜之其他成分。作為此種其他成分，例如可例舉：聚合起始劑、鏈轉移劑、溶劑等。該等其他成分之含量可於並不損及本發明之效果之範圍內採用任意適宜之含量。The composition (A) may contain any appropriate other ingredients within the scope that does not impair the effects of the present invention. Examples of such other components include polymerization initiators, chain transfer agents, solvents, and the like. The content of these other components can be any appropriate content within the range that does not impair the effects of the present invention.

聚合起始劑可根據聚合反應之種類而採用熱聚合起始劑或光聚合起始劑(光起始劑)等。聚合起始劑可僅為1種，亦可為2種以上。As the polymerization initiator, a thermal polymerization initiator, a photopolymerization initiator (photoinitiator), etc. can be used depending on the type of polymerization reaction. The polymerization initiator may be only one type or two or more types.

較佳為於藉由溶液聚合獲得丙烯酸系聚合物時可採用熱聚合起始劑。作為此種熱聚合起始劑，例如可例舉：偶氮系聚合起始劑、過氧化物系聚合起始劑(例如，過氧化二苯甲醯、過氧化順丁烯二酸第三丁酯等)、氧化還原系聚合起始劑等。該等熱聚合起始劑之中，尤佳為日本專利特開2002-69411號公報中揭示之偶氮系起始劑。此種偶氮系聚合起始劑就聚合起始劑之分解物不易作為成為加熱產生氣體(釋氣)之產生原因之部分而殘留於丙烯酸系聚合物中的方面而言較佳。作為偶氮系聚合起始劑，可例舉：2,2'-偶氮二異丁腈(以下有時稱為AIBN)、2,2'-偶氮雙-2-甲基丁腈(以下有時稱為AMBN)、2,2'-偶氮雙(2-甲基丙酸)二甲酯、4,4'-偶氮雙-4-氰基戊酸等。It is preferable to use a thermal polymerization initiator when obtaining an acrylic polymer by solution polymerization. Examples of such thermal polymerization initiators include azo-based polymerization initiators and peroxide-based polymerization initiators (for example, dibenzoyl peroxide, butyl peroxymaleic acid). ester, etc.), redox polymerization initiator, etc. Among these thermal polymerization initiators, the azo initiator disclosed in Japanese Patent Application Laid-Open No. 2002-69411 is particularly preferred. Such an azo polymerization initiator is preferable in that decomposition products of the polymerization initiator are less likely to remain in the acrylic polymer as a cause of gas (outgassing) generated by heating. Examples of the azo polymerization initiator include: 2,2'-azobisisobutyronitrile (hereinafter sometimes referred to as AIBN), 2,2'-azobis-2-methylbutyronitrile (hereinafter sometimes referred to as AIBN) Sometimes called AMBN), 2,2'-azobis(2-methylpropionate)dimethyl ester, 4,4'-azobis-4-cyanovaleric acid, etc.

較佳為於藉由活性能量線聚合獲得丙烯酸系聚合物時可採用光聚合起始劑。作為光聚合起始劑，例如可例舉：安息香醚系光聚合起始劑、苯乙酮系光聚合起始劑、α-酮醇系光聚合起始劑、芳香族磺醯氯系光聚合起始劑、光活性肟系光聚合起始劑、安息香系光聚合起始劑、苯偶醯系光聚合起始劑、二苯甲酮系光聚合起始劑、縮酮系光聚合起始劑、9-氧硫𠮿系光聚合起始劑等。It is preferable to use a photopolymerization initiator when obtaining an acrylic polymer by active energy ray polymerization. Examples of the photopolymerization initiator include: benzoin ether-based photopolymerization initiator, acetophenone-based photopolymerization initiator, α-ketool-based photopolymerization initiator, and aromatic sulfonyl chloride-based photopolymerization initiator. Initiator, photoactive oxime-based photopolymerization initiator, benzoin-based photopolymerization initiator, benzil-based photopolymerization initiator, benzophenone-based photopolymerization initiator, ketal-based photopolymerization initiator Agent, 9-oxosulfide𠮿 It is a photopolymerization initiator, etc.

作為安息香醚系光聚合起始劑，例如可例舉：安息香甲醚、安息香***、安息香丙醚、安息香異丙醚、安息香異丁醚、2,2-二甲氧基-1,2-二苯基乙烷-1-酮、甲氧苯甲醚等。作為苯乙酮系光聚合起始劑，例如可例舉：2,2-二乙氧基苯乙酮、2,2-二甲氧基-2-苯基苯乙酮、1-羥基環己基苯基酮、4-苯氧基二氯苯乙酮、4-(第三丁基)二氯苯乙酮等。作為α-酮醇系光聚合起始劑，例如可例舉：2-甲基-2-羥基苯丙酮、1-[4-(2-羥基乙基)苯基]-2-甲基丙烷-1-酮等。作為芳香族磺醯氯系光聚合起始劑，例如可例舉：2-萘磺醯氯等。作為光活性肟系光聚合起始劑，例如可例舉：1-苯基-1,1-丙烷二酮-2-(鄰乙氧基羰基)肟等。作為安息香系光聚合起始劑，例如可例舉：安息香等。作為苯偶醯系光聚合起始劑，例如可例舉：苯偶醯等。作為二苯甲酮系光聚合起始劑，例如可例舉：二苯甲酮、苯甲醯苯甲酸、3,3'-二甲基-4-甲氧基二苯甲酮、聚乙烯基二苯甲酮、α-羥基環己基苯基酮等。作為縮酮系光聚合起始劑，例如可例舉：苯偶醯二甲基縮酮等。作為9-氧硫𠮿系光聚合起始劑，例如可例舉：9-氧硫𠮿、2-氯9-氧硫𠮿、2-甲基9-氧硫𠮿、2,4-二甲基9-氧硫𠮿、異丙基9-氧硫𠮿、2,4-二異丙基9-氧硫𠮿、十二烷基9-氧硫𠮿等。Examples of the benzoin ether photopolymerization initiator include: benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and 2,2-dimethoxy-1,2-di Phenylethane-1-one, methoxyanisole, etc. Examples of acetophenone-based photopolymerization initiators include: 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, and 1-hydroxycyclohexyl Phenyl ketone, 4-phenoxydichloroacetophenone, 4-(tert-butyl)dichloroacetophenone, etc. Examples of the α-ketool photopolymerization initiator include: 2-methyl-2-hydroxypropiophenone, 1-[4-(2-hydroxyethyl)phenyl]-2-methylpropane- 1-Keto etc. Examples of the aromatic sulfonyl chloride-based photopolymerization initiator include 2-naphthalene sulfonyl chloride and the like. Examples of the photoactive oxime-based photopolymerization initiator include 1-phenyl-1,1-propanedione-2-(o-ethoxycarbonyl)oxime and the like. Examples of the benzoin-based photopolymerization initiator include benzoin and the like. Examples of the benzilyl-based photopolymerization initiator include benzilyl and the like. Examples of the benzophenone-based photopolymerization initiator include benzophenone, benzoyl benzoic acid, 3,3'-dimethyl-4-methoxybenzophenone, and polyethylene. Benzophenone, α-hydroxycyclohexyl phenyl ketone, etc. Examples of the ketal photopolymerization initiator include benzyl dimethyl ketal and the like. As 9-oxysulfide𠮿 It is a photopolymerization initiator, for example: 9-oxosulfide , 2-chloro-9-oxosulfide𠮿 , 2-Methyl 9-oxosulfide𠮿 , 2,4-dimethyl 9-oxosulfide𠮿 , isopropyl 9-oxosulfide𠮿 , 2,4-diisopropyl 9-oxosulfide𠮿 , dodecyl 9-oxosulfide𠮿 wait.

丙烯酸系黏著劑組合物亦可含有交聯劑。藉由使用交聯劑，可提昇丙烯酸系黏著劑之凝集力，更能夠表現出本發明之效果。交聯劑可僅為1種，亦可為2種以上。The acrylic adhesive composition may also contain a cross-linking agent. By using a cross-linking agent, the cohesive force of the acrylic adhesive can be improved, and the effects of the present invention can be further exhibited. There may be only one type of cross-linking agent, or two or more types of cross-linking agents.

作為交聯劑，可例舉：多官能異氰酸酯系交聯劑、環氧系交聯劑、三聚氰胺系交聯劑、過氧化物系交聯劑、以及脲系交聯劑、金屬烷氧化物系交聯劑、金屬螯合物系交聯劑、金屬鹽系交聯劑、碳二醯亞胺系交聯劑、㗁唑啉系交聯劑、氮丙啶系交聯劑、胺系交聯劑等。該等之中，就更能夠表現出本發明之效果之方面而言，較佳為選自由多官能異氰酸酯系交聯劑及環氧系交聯劑所組成之群中之至少1種(c成分)。Examples of the cross-linking agent include polyfunctional isocyanate-based cross-linking agents, epoxy-based cross-linking agents, melamine-based cross-linking agents, peroxide-based cross-linking agents, urea-based cross-linking agents, and metal alkoxide-based cross-linking agents. Cross-linking agent, metal chelate-based cross-linking agent, metal salt-based cross-linking agent, carbodiimide-based cross-linking agent, oxazoline-based cross-linking agent, aziridine-based cross-linking agent, amine-based cross-linking agent Agents, etc. Among these, at least one selected from the group consisting of polyfunctional isocyanate-based cross-linking agents and epoxy-based cross-linking agents (component c) is preferred in terms of being able to better express the effects of the present invention. ).

作為多官能異氰酸酯系交聯劑，例如可例舉：1,2-乙二異氰酸酯、1,4-丁二異氰酸酯、1,6-己二異氰酸酯等低級脂肪族聚異氰酸酯類；環戊二異氰酸酯、環己二異氰酸酯、異佛爾酮二異氰酸酯、氫化甲苯二異氰酸酯、氫化二甲苯二異氰酸酯等脂環族聚異氰酸酯類；2,4-甲苯二異氰酸酯、2,6-甲苯二異氰酸酯、4,4'-二苯基甲烷二異氰酸酯、苯二甲基二異氰酸酯等芳香族聚異氰酸酯類等。作為多官能異氰酸酯系交聯劑，亦可例舉例如：三羥甲基丙烷/甲苯二異氰酸酯加成物(Nippon Polyurethane Industry股份有限公司製造，商品名「Coronate L」)、三羥甲基丙烷/六亞甲基二異氰酸酯加成物(Nippon Polyurethane Industry股份有限公司製造，商品名「Coronate HL」)、商品名「Coronate HX」(Nippon Polyurethane Industry股份有限公司)、三羥甲基丙烷/苯二甲基二異氰酸酯加成物(三井化學股份有限公司製造，商品名「Takenate 110N」)等市售品。Examples of the polyfunctional isocyanate-based crosslinking agent include lower aliphatic polyisocyanates such as 1,2-ethylene diisocyanate, 1,4-butylene diisocyanate, and 1,6-hexamethylene diisocyanate; cyclopentadiisocyanate, Alicyclic polyisocyanates such as cyclohexane diisocyanate, isophorone diisocyanate, hydrogenated toluene diisocyanate, hydrogenated xylene diisocyanate; 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 4,4' -Aromatic polyisocyanates such as diphenylmethane diisocyanate and xylylene diisocyanate. Examples of the polyfunctional isocyanate cross-linking agent include trimethylolpropane/toluene diisocyanate adduct (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "Coronate L"), trimethylolpropane/ Hexamethylene diisocyanate adduct (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "Coronate HL"), trade name "Coronate HX" (Nippon Polyurethane Industry Co., Ltd.), trimethylolpropane/xylylene Commercially available products such as base diisocyanate adduct (manufactured by Mitsui Chemicals Co., Ltd., trade name "Takenate 110N").

作為環氧系交聯劑(多官能環氧化合物)，例如可例舉：N,N,N',N'-四縮水甘油基間苯二甲胺、二縮水甘油基苯胺、1,3-雙(N,N-二縮水甘油基胺基甲基)環己烷、1,6-己二醇二縮水甘油醚、新戊二醇二縮水甘油醚、乙二醇二縮水甘油醚、丙二醇二縮水甘油醚、聚乙二醇二縮水甘油醚、聚丙二醇二縮水甘油醚、山梨糖醇聚縮水甘油醚、甘油聚縮水甘油醚、季戊四醇聚縮水甘油醚、聚甘油聚縮水甘油醚、山梨醇酐聚縮水甘油醚、三羥甲基丙烷聚縮水甘油醚、己二酸二縮水甘油酯、鄰苯二甲酸二縮水甘油酯、三(2-羥基乙基)異氰尿酸三縮水甘油酯、間苯二酚二縮水甘油醚、雙酚-S-二縮水甘油醚，以及分子內具有2個以上環氧基之環氧系樹脂等。作為環氧系交聯劑，亦可例舉：商品名「Tetrad C」(三菱瓦斯化學股份有限公司製)等市售品。Examples of the epoxy cross-linking agent (polyfunctional epoxy compound) include: N,N,N',N'-tetraglycidyl m-xylylenediamine, diglycidyl aniline, 1,3- Bis(N,N-diglycidylaminomethyl)cyclohexane, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether Glycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, sorbitol polyglycidyl ether, glycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether, sorbitan anhydride Polyglycidyl ether, trimethylolpropane polyglycidyl ether, diglycidyl adipate, diglycidyl phthalate, tris(2-hydroxyethyl)triglycidyl isocyanurate, isophthalic acid Diphenol diglycidyl ether, bisphenol-S-diglycidyl ether, and epoxy resins with two or more epoxy groups in the molecule, etc. Examples of the epoxy cross-linking agent include commercially available products with the trade name "Tetrad C" (manufactured by Mitsubishi Gas Chemical Co., Ltd.).

關於丙烯酸系黏著劑組合物中之交聯劑之含量，可於並不損及本發明之效果之範圍內採用任意適宜之含量。作為此種含量，例如就更能夠表現出本發明之效果之方面而言，相對於丙烯酸系聚合物之固形物成分(100重量份)，較佳為0.05重量份～20重量份，更佳為0.1重量份～18重量份，進而較佳為0.5重量份～15重量份，尤佳為0.5重量份～10重量份。Regarding the content of the cross-linking agent in the acrylic adhesive composition, any appropriate content can be used within the range that does not impair the effects of the present invention. Such a content is preferably 0.05 to 20 parts by weight relative to the solid content (100 parts by weight) of the acrylic polymer in order to better express the effects of the present invention, and more preferably 0.1 to 18 parts by weight, more preferably 0.5 to 15 parts by weight, particularly preferably 0.5 to 10 parts by weight.

丙烯酸系黏著劑組合物可於並不損及本發明之效果之範圍內含有任意適宜之其他成分。作為此種其他成分，例如可例舉：丙烯酸系聚合物以外之聚合物成分、交聯促進劑、交聯觸媒、矽烷偶合劑、黏著賦予樹脂(松香衍生物、聚萜烯樹脂、石油樹脂、油溶性酚等)、抗老化劑、無機填充劑、有機填充劑、金屬粉、著色劑(顏料或染料等)、箔狀物、紫外線吸收劑、抗氧化劑、光穩定劑、鏈轉移劑、塑化劑、軟化劑、界面活性劑、抗靜電劑、導電劑、穩定劑、表面潤滑劑、調平劑、防腐劑、耐熱穩定劑、聚合抑制劑、潤滑劑、溶劑、觸媒等。The acrylic adhesive composition may contain any appropriate other ingredients within the scope that does not impair the effects of the present invention. Examples of such other components include polymer components other than acrylic polymers, crosslinking accelerators, crosslinking catalysts, silane coupling agents, tackifying resins (rosin derivatives, polyterpene resins, petroleum resins) , oil-soluble phenol, etc.), anti-aging agents, inorganic fillers, organic fillers, metal powders, colorants (pigments or dyes, etc.), foils, UV absorbers, antioxidants, light stabilizers, chain transfer agents, Plasticizers, softeners, surfactants, antistatic agents, conductive agents, stabilizers, surface lubricants, leveling agents, preservatives, heat-resistant stabilizers, polymerization inhibitors, lubricants, solvents, catalysts, etc.

＜1-2-2.胺基甲酸酯系黏著劑＞ 作為胺基甲酸酯系黏著劑，可於並不損及本發明之效果之範圍內採用例如日本專利特開2017-039859號公報等中記載之公知之胺基甲酸酯系黏著劑等任意適宜之胺基甲酸酯系黏著劑。作為此種胺基甲酸酯系黏著劑，例如由胺基甲酸酯系黏著劑組合物形成之胺基甲酸酯系黏著劑，且該胺基甲酸酯系黏著劑組合物包含選自由胺基甲酸酯預聚物及多元醇所組成之群中之至少1種與交聯劑。胺基甲酸酯系黏著劑可僅為1種，亦可為2種以上。胺基甲酸酯系黏著劑可於並不損及本發明之效果之範圍內含有任意適宜之成分。＜1-2-2. Urethane adhesive＞ As the urethane adhesive, any known urethane adhesive described in Japanese Patent Application Laid-Open No. 2017-039859, etc. can be used within the scope that does not impair the effects of the present invention. Suitable urethane adhesive. Such a urethane adhesive may be, for example, a urethane adhesive composed of a urethane adhesive composition, and the urethane adhesive composition may include a urethane adhesive selected from the group consisting of: At least one kind from the group consisting of urethane prepolymer and polyol and a cross-linking agent. Only one type of urethane adhesive may be used, or two or more types may be used. The urethane adhesive may contain any appropriate components within the range that does not impair the effects of the present invention.

＜1-2-3.橡膠系黏著劑＞ 作為橡膠系黏著劑，可於並不損及本發明之效果之範圍內採用例如日本專利特開2015-074771號公報等中記載之公知之橡膠系黏著劑等任意適宜之橡膠系黏著劑。該等可僅為1種，亦可為2種以上。橡膠系黏著劑可於並不損及本發明之效果之範圍內含有任意適宜之成分。＜1-2-3. Rubber adhesive＞ As the rubber-based adhesive, any appropriate rubber-based adhesive such as the known rubber-based adhesive described in Japanese Patent Application Laid-Open No. 2015-074771 can be used within the scope that does not impair the effects of the present invention. There may be only one type, or two or more types. The rubber-based adhesive may contain any appropriate component within the range that does not impair the effects of the present invention.

＜1-2-4.聚矽氧系黏著劑＞ 作為聚矽氧系黏著劑，可於並不損及本發明之效果之範圍內採用例如日本專利特開2014-047280號公報等中記載之公知之聚矽氧系黏著劑等任意適宜之聚矽氧系黏著劑。該等可僅為1種，亦可為2種以上。聚矽氧系黏著劑可於並不損及本發明之效果之範圍內含有任意適宜之成分。＜1-2-4.Polysilicone adhesive＞ As the silicone adhesive, any suitable silicone such as the well-known silicone adhesive described in Japanese Patent Application Laid-Open No. 2014-047280 etc. can be used within the scope that does not impair the effect of the present invention. Oxygen adhesive. There may be only one type, or two or more types. The polysiloxane adhesive may contain any appropriate components within the scope that does not impair the effects of the present invention.

＜1-2-5.導電成分＞ 黏著劑層(1)亦可含有導電成分。代表性而言，成為黏著劑層(1)之材料的黏著劑組合物(選自由丙烯酸系黏著劑組合物、胺基甲酸酯系黏著劑組合物、橡膠系黏著劑組合物、聚矽氧系黏著劑組合物所組成之群中之至少1種)亦可含有導電成分。＜1-2-5. Conductive component＞ The adhesive layer (1) may also contain conductive components. Typically, the adhesive composition (selected from the group consisting of an acrylic adhesive composition, a urethane adhesive composition, a rubber adhesive composition, and a polysilicone adhesive composition) used as the material of the adhesive layer (1) At least one of the group consisting of adhesive compositions) may also contain a conductive component.

關於導電成分，可於並不損及本發明之效果之範圍內採用任意適宜之導電成分。作為此種導電成分，較佳為選自離子性液體、離子導電聚合物、離子導電填料、導電聚合物中之至少1種化合物。As for the conductive component, any suitable conductive component can be used within the scope that does not impair the effect of the present invention. As such a conductive component, at least one compound selected from the group consisting of ionic liquids, ion conductive polymers, ion conductive fillers, and conductive polymers is preferred.

於黏著劑組合物含有導電成分之情形時，作為基礎聚合物(例如，丙烯酸系聚合物、多元醇、胺基甲酸酯預聚物、橡膠系聚合物、聚矽氧系聚合物)與導電成分之比率，導電成分相對於基礎聚合物100重量份，較佳為0.01重量份～10重量份，更佳為0.05重量份～9.0重量份，進而較佳為0.075重量份～8.0重量份，尤佳為0.1重量份～7.0重量份。When the adhesive composition contains a conductive component, as the base polymer (for example, acrylic polymer, polyol, urethane prepolymer, rubber polymer, polysiloxane polymer) and conductive The ratio of the components, the conductive component relative to 100 parts by weight of the base polymer, is preferably 0.01 to 10 parts by weight, more preferably 0.05 to 9.0 parts by weight, and further preferably 0.075 to 8.0 parts by weight, especially Preferably, it is 0.1 parts by weight to 7.0 parts by weight.

關於離子性液體，可於並不損及本發明之效果之範圍內採用任意適宜之離子性液體。此處，所謂離子性液體意指於25℃下呈液狀之溶融鹽(離子性化合物)。離子性液體可僅為1種，亦可為2種以上。As for the ionic liquid, any appropriate ionic liquid can be used within the scope that does not impair the effects of the present invention. Here, the term "ionic liquid" means a molten salt (ionic compound) that is liquid at 25°C. There may be only one type of ionic liquid, or two or more types of ionic liquids.

作為此種離子性液體，較佳為包含氟有機陰離子與鎓陽離子之離子性液體。As such an ionic liquid, an ionic liquid containing a fluorine organic anion and an onium cation is preferred.

關於能夠構成離子性液體之鎓陽離子，可於並不損及本發明之效果之範圍內採用任意適宜之鎓陽離子。作為此種鎓陽離子，較佳為選自含氮鎓陽離子、含硫鎓陽離子、含磷鎓陽離子中之至少1種。As for the onium cation capable of constituting the ionic liquid, any suitable onium cation can be used within the scope that does not impair the effects of the present invention. As such an onium cation, at least one selected from the group consisting of nitrogen-containing onium cations, sulfur-containing onium cations, and phosphorus-containing onium cations is preferred.

關於能夠構成離子性液體之鎓陽離子，就更能夠表現出本發明之效果之方面而言，較佳為選自具有通式(1)～(5)所表示之結構之陽離子中之至少1種。 [化1] The onium cation that can constitute the ionic liquid is preferably at least one selected from the group consisting of cations having a structure represented by general formulas (1) to (5) in order to better exhibit the effects of the present invention. . [Chemical 1]

於通式(1)中，Ra表示碳數4至20之烴基，亦可包含雜原子，Rb及Rc相同或不同，表示氫或碳數1至16之烴基，亦可包含雜原子。其中，於氮原子包含雙鍵之情形時，無Rc。In the general formula (1), Ra represents a hydrocarbon group having 4 to 20 carbon atoms, and may also contain a hetero atom. Rb and Rc may be the same or different, and represents hydrogen or a hydrocarbon group having 1 to 16 carbon atoms, and may also contain a hetero atom. Among them, when the nitrogen atom contains a double bond, there is no Rc.

於通式(2)中，Rd表示碳數2至20之烴基，亦可包含雜原子，Re、Rf及Rg相同或不同，表示氫或碳數1至16之烴基，亦可包含雜原子。In the general formula (2), Rd represents a hydrocarbon group having 2 to 20 carbon atoms, and may also contain heteroatoms. Re, Rf, and Rg may be the same or different, and represent hydrogen or a hydrocarbon group having 1 to 16 carbon atoms, and may also contain heteroatoms.

於通式(3)中，Rh表示碳數2至20之烴基，亦可包含雜原子，Ri、Rj及Rk相同或不同，表示氫或碳數1至16之烴基，亦可包含雜原子。In the general formula (3), Rh represents a hydrocarbon group having 2 to 20 carbon atoms, and may also contain heteroatoms. Ri, Rj, and Rk may be the same or different, and represents hydrogen or a hydrocarbon group having 1 to 16 carbon atoms, and may also contain heteroatoms.

於通式(4)中，Z表示氮原子、硫原子或磷原子，Rl、Rm、Rn及Ro相同或不同，表示碳數1至20之烴基，亦可包含雜原子。其中，於Z為硫原子之情形時，無Ro。In the general formula (4), Z represents a nitrogen atom, a sulfur atom or a phosphorus atom, Rl, Rm, Rn and Ro are the same or different, represent a hydrocarbon group having 1 to 20 carbon atoms, and may also contain heteroatoms. Among them, when Z is a sulfur atom, there is no Ro.

於通式(5)中，X表示Li原子、Na原子或K原子。In the general formula (5), X represents a Li atom, a Na atom or a K atom.

作為通式(1)所表示之陽離子，例如可例舉：吡啶鎓陽離子、吡咯烷鎓陽離子、哌啶鎓陽離子、具有吡咯啉骨架之陽離子、具有吡咯骨架之陽離子等。Examples of the cation represented by the general formula (1) include pyridinium cation, pyrrolidinium cation, piperidinium cation, cation having a pyrroline skeleton, cation having a pyrrole skeleton, and the like.

作為通式(1)所表示之陽離子之具體例，例如可例舉：1-乙基吡啶鎓陽離子、1-丁基吡啶鎓陽離子、1-己基吡啶鎓陽離子、1-乙基-3-甲基吡啶鎓陽離子、1-丁基-3-甲基吡啶鎓陽離子、1-己基-3-甲基吡啶鎓陽離子、1-丁基-4-甲基吡啶鎓陽離子、1-辛基-4-甲基吡啶鎓陽離子等吡啶鎓陽離子；1-乙基-1-甲基吡咯烷鎓陽離子、1-甲基-1-丙基吡咯烷鎓陽離子、1-甲基-1-丁基吡咯烷鎓陽離子、1-甲基-1-戊基吡咯烷鎓陽離子、1-甲基-1-己基吡咯烷鎓陽離子、1-甲基-1-庚基吡咯烷鎓陽離子、1-乙基-1-丙基吡咯烷鎓陽離子、1-乙基-1-丁基吡咯烷鎓陽離子、1-乙基-1-戊基吡咯烷鎓陽離子、1-乙基-1-己基吡咯烷鎓陽離子、1-乙基-1-庚基吡咯烷鎓陽離子等吡咯烷鎓陽離子；1-甲基-1-乙基哌啶鎓陽離子、1-甲基-1-丙基哌啶鎓陽離子、1-甲基-1-丁基哌啶鎓陽離子、1-甲基-1-戊基哌啶鎓陽離子、1-甲基-1-己基哌啶鎓陽離子、1-甲基-1-庚基哌啶鎓陽離子、1-乙基-1-丙基哌啶鎓陽離子、1-乙基-1-丁基哌啶鎓陽離子、1-乙基-1-戊基哌啶鎓陽離子、1-乙基-1-己基哌啶鎓陽離子、1-乙基-1-庚基哌啶鎓陽離子、1-丙基-1-丁基哌啶鎓陽離子等哌啶鎓陽離子等；更佳為1-己基吡啶鎓陽離子、1-乙基-3-甲基吡啶鎓陽離子、1-丁基-3-甲基吡啶鎓陽離子、1-辛基-4-甲基吡啶鎓陽離子、1-甲基-1-丙基吡咯烷鎓陽離子、1-甲基-1-丙基哌啶鎓陽離子。Specific examples of the cation represented by the general formula (1) include, for example, 1-ethylpyridinium cation, 1-butylpyridinium cation, 1-hexylpyridinium cation, and 1-ethyl-3-methyl cation. 1-butyl-3-methylpyridinium cation, 1-butyl-3-methylpyridinium cation, 1-hexyl-3-methylpyridinium cation, 1-butyl-4-methylpyridinium cation, 1-octyl-4- Pyridinium cations such as methylpyridinium cation; 1-ethyl-1-methylpyrrolidinium cation, 1-methyl-1-propylpyrrolidinium cation, 1-methyl-1-butylpyrrolidinium cation cation, 1-methyl-1-pentylpyrrolidinium cation, 1-methyl-1-hexylpyrrolidinium cation, 1-methyl-1-heptylpyrrolidinium cation, 1-ethyl-1- Propylpyrrolidinium cation, 1-ethyl-1-butylpyrrolidinium cation, 1-ethyl-1-pentylpyrrolidinium cation, 1-ethyl-1-hexylpyrrolidinium cation, 1- Ethyl-1-heptylpyrrolidinium cation and other pyrrolidinium cations; 1-methyl-1-ethylpiperidinium cation, 1-methyl-1-propylpiperidinium cation, 1-methyl- 1-butylpiperidinium cation, 1-methyl-1-pentylpiperidinium cation, 1-methyl-1-hexylpiperidinium cation, 1-methyl-1-heptylpiperidinium cation, 1-ethyl-1-propylpiperidinium cation, 1-ethyl-1-butylpiperidinium cation, 1-ethyl-1-pentylpiperidinium cation, 1-ethyl-1-hexyl Piperidinium cation, 1-ethyl-1-heptylpiperidinium cation, 1-propyl-1-butylpiperidinium cation and other piperidinium cations; more preferably, 1-hexylpyridinium cation, 1 -Ethyl-3-methylpyridinium cation, 1-butyl-3-methylpyridinium cation, 1-octyl-4-methylpyridinium cation, 1-methyl-1-propylpyrrolidinium Cation, 1-methyl-1-propylpiperidinium cation.

作為通式(2)所表示之陽離子，例如可例舉：咪唑鎓陽離子、四氫嘧啶鎓陽離子、二氫嘧啶鎓陽離子等。Examples of the cation represented by the general formula (2) include imidazolium cation, tetrahydropyrimidinium cation, and dihydropyrimidinium cation.

作為通式(2)所表示之陽離子之具體例，例如1,3-二甲基咪唑鎓陽離子、1,3-二乙基咪唑鎓陽離子、1-乙基-3-甲基咪唑鎓陽離子、1-丁基-3-甲基咪唑鎓陽離子、1-己基-3-甲基咪唑鎓陽離子、1-辛基-3-甲基咪唑鎓陽離子、1-癸基-3-甲基咪唑鎓陽離子、1-十二烷基-3-甲基咪唑鎓陽離子、1-十四烷基-3-甲基咪唑鎓陽離子等咪唑鎓陽離子，更佳為1-乙基-3-甲基咪唑鎓陽離子、1-己基-3-甲基咪唑鎓陽離子。Specific examples of the cation represented by the general formula (2) include 1,3-dimethylimidazolium cation, 1,3-diethylimidazolium cation, 1-ethyl-3-methylimidazolium cation, 1-Butyl-3-methylimidazolium cation, 1-hexyl-3-methylimidazolium cation, 1-octyl-3-methylimidazolium cation, 1-decyl-3-methylimidazolium cation , 1-dodecyl-3-methylimidazolium cation, 1-tetradecyl-3-methylimidazolium cation and other imidazolium cations, more preferably 1-ethyl-3-methylimidazolium cation , 1-hexyl-3-methylimidazolium cation.

作為通式(3)所表示之陽離子，例如可例舉：吡唑鎓陽離子、吡唑啉鎓陽離子等。Examples of the cation represented by the general formula (3) include pyrazolium cation, pyrazolinium cation, and the like.

作為通式(3)所表示之陽離子之具體例，例如可例舉：1-甲基吡唑鎓陽離子、3-甲基吡唑鎓陽離子、1-乙基-2-甲基吡唑鎓陽離子、1-乙基-2,3,5-三甲基吡唑鎓陽離子、1-丙基-2,3,5-三甲基吡唑鎓陽離子、1-丁基-2,3,5-三甲基吡唑鎓陽離子等吡唑鎓陽離子；1-乙基-2,3,5-三甲基吡唑啉鎓陽離子、1-丙基-2,3,5-三甲基吡唑啉鎓陽離子、1-丁基-2,3,5-三甲基吡唑啉鎓陽離子等吡唑啉鎓陽離子等。Specific examples of the cation represented by the general formula (3) include, for example, 1-methylpyrazolium cation, 3-methylpyrazolium cation, and 1-ethyl-2-methylpyrazolium cation. , 1-ethyl-2,3,5-trimethylpyrazolium cation, 1-propyl-2,3,5-trimethylpyrazolium cation, 1-butyl-2,3,5- Trimethylpyrazolium cation and other pyrazolium cations; 1-ethyl-2,3,5-trimethylpyrazolinium cation, 1-propyl-2,3,5-trimethylpyrazoline onium cation, 1-butyl-2,3,5-trimethylpyrazolinium cation and other pyrazolinium cations.

作為通式(4)所表示之陽離子，例如可例舉：四烷基銨陽離子、三烷基鋶陽離子、四烷基鏻陽離子，或者上述烷基之一部分經烯基或烷氧基、進而經環氧基取代者等。Examples of the cation represented by the general formula (4) include: tetraalkylammonium cation, trialkylsulfonium cation, tetraalkylphosphonium cation, or a part of the above-mentioned alkyl group via an alkenyl group or an alkoxy group, and further via an alkenyl group or an alkoxy group. Epoxy substituents, etc.

作為通式(4)所表示之陽離子之具體例，例如可例舉：三乙基甲基銨陽離子、三丁基乙基銨陽離子、三甲基癸基銨陽離子、二乙基甲基鋶陽離子、二丁基乙基鋶陽離子、二甲基癸基鋶陽離子、三乙基甲基鏻陽離子、三丁基乙基鏻陽離子、三甲基癸基鏻陽離子等非對稱之四烷基銨陽離子、三烷基鋶陽離子、四烷基鏻陽離子或、N,N-二乙基-N-甲基-N-(2-甲氧基乙基)銨陽離子、縮水甘油基三甲基銨陽離子、二烯丙基二甲基銨陽離子、N,N-二甲基-N-乙基-N-丙基銨陽離子、N,N-二甲基-N-乙基-N-丁基銨陽離子、N,N-二甲基-N-乙基-N-戊基銨陽離子、N,N-二甲基-N-乙基-N-己基銨陽離子、N,N-二甲基-N-乙基-N-庚基銨陽離子、N,N-二甲基-N-乙基-N-壬基銨陽離子、N,N-二甲基-N,N-二丙基銨陽離子、N,N-二乙基-N-丙基-N-丁基銨陽離子、N,N-二甲基-N-丙基-N-戊基銨陽離子、N,N-二甲基-N-丙基-N-己基銨陽離子、N,N-二甲基-N-丙基-N-庚基銨陽離子、N,N-二甲基-N-丁基-N-己基銨陽離子、N,N-二乙基-N-丁基-N-庚基銨陽離子、N,N-二甲基-N-戊基-N-己基銨陽離子、N,N-二甲基-N,N-二己基銨陽離子、三甲基庚基銨陽離子、N,N-二乙基-N-甲基-N-丙基銨陽離子、N,N-二乙基-N-甲基-N-戊基銨陽離子、N,N-二乙基-N-甲基-N-庚基銨陽離子、N,N-二乙基-N-丙基-N-戊基銨陽離子、三乙基丙基銨陽離子、三乙基戊基銨陽離子、三乙基庚基銨陽離子、N,N-二丙基-N-甲基-N-乙基銨陽離子、N,N-二丙基-N-甲基-N-戊基銨陽離子、N,N-二丙基-N-丁基-N-己基銨陽離子、N,N-二丙基-N,N-二己基銨陽離子、N,N-二丁基-N-甲基-N-戊基銨陽離子、N,N-二丁基-N-甲基-N-己基銨陽離子、三辛基甲基銨陽離子、N-甲基-N-乙基-N-丙基-N-戊基銨陽離子等，更佳為三甲基丙基銨陽離子。Specific examples of the cation represented by the general formula (4) include triethylmethylammonium cation, tributylethylammonium cation, trimethyldecylammonium cation, and diethylmethylsulfonium cation. , dibutylethylphosphonium cation, dimethyldecylphosphonium cation, triethylmethylphosphonium cation, tributylethylphosphonium cation, trimethyldecylphosphonium cation and other asymmetric tetraalkylammonium cations, trialkyl sulfonium cation, tetraalkyl phosphonium cation or, N,N-diethyl-N-methyl-N-(2-methoxyethyl) ammonium cation, glycidyl trimethyl ammonium cation, di Allyldimethylammonium cation, N,N-dimethyl-N-ethyl-N-propylammonium cation, N,N-dimethyl-N-ethyl-N-butylammonium cation, N ,N-dimethyl-N-ethyl-N-pentylammonium cation, N,N-dimethyl-N-ethyl-N-hexylammonium cation, N,N-dimethyl-N-ethyl -N-Heptyl ammonium cation, N,N-dimethyl-N-ethyl-N-nonylammonium cation, N,N-dimethyl-N,N-dipropylammonium cation, N,N- Diethyl-N-propyl-N-butylammonium cation, N,N-dimethyl-N-propyl-N-pentylammonium cation, N,N-dimethyl-N-propyl-N -Hexylammonium cation, N,N-dimethyl-N-propyl-N-heptyl ammonium cation, N,N-dimethyl-N-butyl-N-hexylammonium cation, N,N-diethyl N-N-butyl-N-heptyl ammonium cation, N,N-dimethyl-N-pentyl-N-hexylammonium cation, N,N-dimethyl-N,N-dihexylammonium cation, Trimethylheptyl ammonium cation, N,N-diethyl-N-methyl-N-propylammonium cation, N,N-diethyl-N-methyl-N-pentylammonium cation, N, N-diethyl-N-methyl-N-heptyl ammonium cation, N,N-diethyl-N-propyl-N-pentylammonium cation, triethypropylammonium cation, triethylpentylammonium cation ammonium cation, triethylheptyl ammonium cation, N,N-dipropyl-N-methyl-N-ethylammonium cation, N,N-dipropyl-N-methyl-N-pentylammonium cation Cation, N,N-dipropyl-N-butyl-N-hexylammonium cation, N,N-dipropyl-N,N-dihexylammonium cation, N,N-dibutyl-N-methyl -N-pentylammonium cation, N,N-dibutyl-N-methyl-N-hexylammonium cation, trioctylmethylammonium cation, N-methyl-N-ethyl-N-propyl- N-pentylammonium cation and the like, more preferably trimethylpropylammonium cation.

關於能夠構成離子性液體之氟有機陰離子，可於並不損及本發明之效果之範圍內採用任意適宜之氟有機陰離子。此種氟有機陰離子可完全經氟化(全氟化)，亦可部分經氟化。Regarding the fluorine organic anion capable of constituting the ionic liquid, any appropriate fluorine organic anion can be used within the scope that does not impair the effects of the present invention. Such fluorine organic anions can be completely fluorinated (perfluorinated) or partially fluorinated.

作為此種氟有機陰離子，例如：全氟烷基磺酸鹽、雙(氟磺醯基)醯亞胺、雙(全氟烷烴磺醯基)醯亞胺，更具體而言，例如：三氟甲磺酸鹽、五氟乙磺酸鹽、七氟丙磺酸鹽、九氟丁磺酸鹽、雙(氟磺醯基)醯亞胺、雙(三氟甲磺醯基)醯亞胺。Examples of such fluorine organic anions include: perfluoroalkyl sulfonate, bis(fluorosulfonyl)imide, bis(perfluoroalkane sulfonyl)imide, and more specifically, for example: trifluoro Methanesulfonate, pentafluoroethanesulfonate, heptafluoropropanesulfonate, nonafluorobutanesulfonate, bis(fluoromethanesulfonyl)imide, bis(trifluoromethanesulfonyl)imide.

關於離子性液體之具體例，可適當選用上述陽離子成分與上述陰離子成分之組合。作為此種離子性液體之具體例，例如：1-己基吡啶鎓雙(氟磺醯基)醯亞胺、1-乙基-3-甲基吡啶鎓三氟甲磺酸鹽、1-乙基-3-甲基吡啶鎓五氟乙磺酸鹽、1-乙基-3-甲基吡啶鎓七氟丙磺酸鹽、1-乙基-3-甲基吡啶鎓九氟丁磺酸鹽、1-丁基-3-甲基吡啶鎓三氟甲磺酸鹽、1-丁基-3-甲基吡啶鎓雙(三氟甲磺醯基)醯亞胺、1-辛基-4-甲基吡啶鎓雙(氟磺醯基)醯亞胺、1-甲基-1-丙基吡咯烷鎓雙(三氟甲磺醯基)醯亞胺、1-甲基-1-丙基吡咯烷鎓雙(氟磺醯基)醯亞胺、1-甲基-1-丙基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1-甲基-1-丙基哌啶鎓雙(氟磺醯基)醯亞胺、1-乙基-3-甲基咪唑鎓三氟甲磺酸鹽、1-乙基-3-甲基咪唑鎓七氟丙磺酸鹽、1-乙基-3-甲基咪唑鎓雙(三氟甲磺醯基)醯亞胺、1-乙基-3-甲基咪唑鎓雙(氟磺醯基)醯亞胺、1-己基-3-甲基咪唑鎓雙(氟磺醯基)醯亞胺、三甲基丙基銨雙(三氟甲磺醯基)醯亞胺、雙(三氟甲磺醯基)醯亞胺鋰、雙(氟磺醯基)醯亞胺鋰。Regarding specific examples of the ionic liquid, a combination of the above-mentioned cationic component and the above-mentioned anionic component can be appropriately selected. Specific examples of such ionic liquids include: 1-hexylpyridinium bis(fluorosulfonyl)imide, 1-ethyl-3-methylpyridinium trifluoromethanesulfonate, 1-ethyl -3-methylpyridinium pentafluoroethanesulfonate, 1-ethyl-3-methylpyridinium heptafluoropropanesulfonate, 1-ethyl-3-methylpyridinium nonafluorobutanesulfonate, 1-Butyl-3-methylpyridinium triflate, 1-butyl-3-methylpyridinium bis(trifluoromethanesulfonyl)imide, 1-octyl-4-methyl Pyridinium bis(fluorosulfonyl)imide, 1-methyl-1-propylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-methyl-1-propylpyrrolidine Onium bis(fluorosulfonyl)imide, 1-methyl-1-propylpiperidinium bis(trifluoromethanesulfonyl)amide, 1-methyl-1-propylpiperidinium bis (Fluorosulfonyl)imide, 1-ethyl-3-methylimidazolium trifluoromethanesulfonate, 1-ethyl-3-methylimidazolium heptafluoropropanesulfonate, 1-ethyl -3-methylimidazolium bis(trifluoromethanesulfonyl)imide, 1-ethyl-3-methylimidazolium bis(fluorosulfonyl)imide, 1-hexyl-3-methyl Imidazolium bis(fluoromethanesulfonyl)imide, trimethylpropylammonium bis(trifluoromethanesulfonyl)imide, lithium bis(trifluoromethanesulfonyl)imide, bis(fluorosulfonyl) Lithium acyl) acyl imide.

離子性液體可使用市售者，亦可藉由如下方式合成。作為離子性液體之合成方法，只要能夠獲得目標離子性液體，則無特別限定，一般而言，可採用如文獻「離子性液體-開發之最前線與未來-」(CMC股份有限公司出版發行)中記載之鹵化物法、氫氧化物法、酸酯法、錯合法及中和法等。Ionic liquids can be commercially available or can be synthesized as follows. The method for synthesizing ionic liquids is not particularly limited as long as the target ionic liquid can be obtained. Generally speaking, the document "Ionic Liquids - The Frontier and Future of Development -" (published by CMC Co., Ltd.) can be used The halide method, hydroxide method, acid ester method, miscellaneous method and neutralization method described in

下文中關於鹵化物法、氫氧化物法、酸酯法、錯合法及中和法，以含氮鎓鹽為例，就其合成方法進行展示，其他之含硫鎓鹽、含磷鎓鹽等其他離子性液體亦可藉由相同方法獲得。In the following section, regarding the halide method, hydroxide method, acid ester method, miscellaneous method and neutralization method, nitrogen-containing onium salts are taken as an example to demonstrate their synthesis methods. Other sulfur-containing onium salts, phosphorus-containing onium salts, etc. Other ionic liquids can also be obtained by the same method.

鹵化物法係藉由如反應式(1)～(3)所示之反應而進行之方法。首先，使三級胺與鹵化烷基進行反應而獲得鹵化物(反應式(1)，作為鹵素可使用氯、溴、碘)。The halide method is a method performed by reactions shown in reaction formulas (1) to (3). First, a halide is obtained by reacting a tertiary amine with a halogenated alkyl group (reaction formula (1), chlorine, bromine, or iodine can be used as the halogen).

使所獲得之鹵化物與具有目標離子性液體之陰離子結構(A- )之酸(HA)或鹽(MA，M為銨、鋰、鈉、鉀等與目標陰離子形成鹽之陽離子)進行反應而獲得目標離子性液體(R4 NA)。The obtained halide is reacted with an acid (HA) or a salt (MA, M is a cation such as ammonium, lithium, sodium, potassium, etc. that forms a salt with the target anion) having the anion structure (A - ) of the target ionic liquid. The target ionic liquid (R 4 NA) was obtained.

[化2] [Chemicalization 2]

氫氧化物法係藉由如反應式(4)～(8)所示之反應而進行之方法。首先，藉由離子交換膜法電解(反應式(4))、OH型離子交換樹脂法(反應式(5))或與氧化銀(Ag2 O)之反應(反應式(6))，由鹵化物(R4 NX)獲得氫氧化物(R4 NOH)(作為鹵素可使用氯、溴、碘)。The hydroxide method is a method performed by reactions shown in reaction formulas (4) to (8). First, through ion exchange membrane electrolysis (reaction equation (4)), OH type ion exchange resin method (reaction equation (5)) or reaction with silver oxide (Ag 2 O) (reaction equation (6)), The halide (R 4 NX) gives the hydroxide (R 4 NOH) (as the halogen, chlorine, bromine, and iodine can be used).

對於所獲得之氫氧化物，與上述鹵化法同樣地藉由採用反應式(7)～(8)之反應而獲得目標離子性液體(R4 NA)。For the obtained hydroxide, the target ionic liquid (R 4 NA) is obtained by reacting according to the reaction formulas (7) to (8) in the same manner as the above-mentioned halogenation method.

[化3] [Chemical 3]

酸酯法係藉由如反應式(9)～(11)所示之反應而進行之方法。首先，使三級胺(R3 N)與酸酯進行反應而獲得酸酯物(反應式(9)，作為酸酯可使用硫酸、亞硫酸、磷酸、亞磷酸、碳酸等無機酸之酯或甲磺酸、甲基膦酸、甲酸等有機酸之酯等)。The acid ester method is a method performed by reactions shown in reaction formulas (9) to (11). First, the tertiary amine (R 3 N) is reacted with an acid ester to obtain an acid ester (reaction formula (9)). As the acid ester, esters of inorganic acids such as sulfuric acid, sulfurous acid, phosphoric acid, phosphorous acid, and carbonic acid can be used, or Methanesulfonic acid, methylphosphonic acid, formic acid and other organic acid esters, etc.).

對於所獲得之酸酯物，與上述鹵化法同樣地藉由採用反應式(10)～(11)之反應而獲得目標離子性液體(R4 NA)。又，藉由使用三氟甲磺酸甲酯、三氟乙酸甲酯等作為酸酯，亦可獲得直接離子性液體。The obtained acid ester product is reacted by reaction formulas (10) to (11) in the same manner as the above-mentioned halogenation method to obtain the target ionic liquid (R 4 NA). Moreover, by using methyl trifluoromethanesulfonate, methyl trifluoroacetate, etc. as an acid ester, a direct ionic liquid can also be obtained.

[化4] [Chemical 4]

中和法係藉由如反應式(12)所示之反應而進行之方法。可藉由使三級胺與CF3 COOH、CF3 SO3 H、(CF3 SO2 )2 NH、(CF3 SO2 )3 CH、(C2 F5 SO2 )2 NH等有機酸進行反應而獲得。The neutralization method is a method performed by the reaction shown in reaction formula (12). It can be carried out by combining tertiary amines with organic acids such as CF 3 COOH, CF 3 SO 3 H, (CF 3 SO 2 ) 2 NH, (CF 3 SO 2 ) 3 CH, (C 2 F 5 SO 2 ) 2 NH, etc. obtained by reaction.

[化5] [Chemistry 5]

上述反應式(1)～(12)中記載之R表示氫或碳數1至20之烴基，亦可包含雜原子。R described in the above reaction formulas (1) to (12) represents hydrogen or a hydrocarbon group having 1 to 20 carbon atoms, and may also contain a heteroatom.

關於離子導電聚合物，可於並不損及本發明之效果之範圍內採用任意適宜之離子導電聚合物。作為此種離子導電聚合物，例如可例舉：使具有四級銨鹽基)之單體進行聚合或共聚合所獲得之離子導電性重合體；聚噻吩、聚苯胺、聚吡咯、聚伸乙亞胺、烯丙基胺系聚合物等導電性聚合物等。離子導電聚合物可僅為1種，亦可為2種以上。Regarding the ion conductive polymer, any suitable ion conductive polymer can be used within the scope that does not impair the effects of the present invention. Examples of such an ion conductive polymer include: an ion conductive laminate obtained by polymerizing or copolymerizing a monomer having a quaternary ammonium salt group; polythiophene, polyaniline, polypyrrole, and polyethylene Conductive polymers such as imine and allylamine polymers, etc. The number of ion conductive polymers may be only one type or two or more types.

關於離子導電填料，可於並不損及本發明之效果之範圍內採用任意適宜之離子導電填料。作為此種離子導電填料，例如可例舉：氧化錫、氧化銻、氧化銦、氧化鎘、氧化鈦、氧化鋅、銦、錫、銻、金、銀、銅、鋁、鎳、鉻、鈦、鐵、鈷、碘化銅、ITO(氧化銦/氧化錫)、ATO(氧化銻/氧化錫)等。離子導電填料可僅為1種，亦可為2種以上。Regarding the ion conductive filler, any suitable ion conductive filler can be used within the scope that does not impair the effects of the present invention. Examples of such ion conductive fillers include tin oxide, antimony oxide, indium oxide, cadmium oxide, titanium oxide, zinc oxide, indium, tin, antimony, gold, silver, copper, aluminum, nickel, chromium, and titanium. Iron, cobalt, copper iodide, ITO (indium oxide/tin oxide), ATO (antimony oxide/tin oxide), etc. The number of ion conductive fillers may be only one type or two or more types.

關於導電聚合物，可於並不損及本發明之效果之範圍內採用任意適宜之導電聚合物。作為此種導電聚合物，例如可例舉：(3,4-乙二氧基噻吩)-聚(苯乙烯磺酸)等。Regarding the conductive polymer, any appropriate conductive polymer can be used within the scope that does not impair the effects of the present invention. Examples of such a conductive polymer include: (3,4-ethylenedioxythiophene)-poly(styrenesulfonic acid) and the like.

＜1-2-6.其他成分＞ 成為黏著劑層(1)之材料的黏著劑組合物(選自由丙烯酸系黏著劑組合物、胺基甲酸酯系黏著劑組合物、橡膠系黏著劑組合物、聚矽氧系黏著劑組合物所組成之群中之至少1種)可於並不損及本發明之效果之範圍內含有任意適宜之其他成分。作為此種其他成分，例如可例舉：其他聚合物成分、交聯促進劑、交聯觸媒、矽烷偶合劑、黏著賦予樹脂(松香衍生物、聚萜烯樹脂、石油樹脂、油溶性酚等)、抗老化劑、無機填充劑、有機填充劑、金屬粉、著色劑(顏料或染料等)、箔狀物、紫外線吸收劑、抗氧化劑、光穩定劑、鏈轉移劑、塑化劑、軟化劑、界面活性劑、抗靜電劑、導電劑、穩定劑、表面潤滑劑、調平劑、防腐劑、耐熱穩定劑、聚合抑制劑、潤滑劑、溶劑、觸媒等。＜1-2-6.Other ingredients＞ An adhesive composition (selected from an acrylic adhesive composition, a urethane adhesive composition, a rubber adhesive composition, and a silicone adhesive composition) that becomes the material of the adhesive layer (1) At least one of the groups formed) may contain any appropriate other ingredients within the scope that does not impair the effect of the present invention. Examples of such other components include other polymer components, cross-linking accelerators, cross-linking catalysts, silane coupling agents, adhesive resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.) ), anti-aging agents, inorganic fillers, organic fillers, metal powders, colorants (pigments or dyes, etc.), foils, UV absorbers, antioxidants, light stabilizers, chain transfer agents, plasticizers, softeners Agents, surfactants, antistatic agents, conductive agents, stabilizers, surface lubricants, leveling agents, preservatives, heat-resistant stabilizers, polymerization inhibitors, lubricants, solvents, catalysts, etc.

≪1-3.樹脂膜(2)≫ 關於樹脂膜(2)之厚度，可於並不損及本發明之效果之範圍內根據目的而採用任意適宜之厚度。作為此種厚度，就更能夠表現出本發明之效果之方面而言，較佳為25 μm～500 μm，更佳為25 μm～400 μm，進而較佳為25 μm～300 μm，尤佳為25 μm～200 μm，最佳為25 μm～150 μm。≪1-3.Resin film(2)≫ Regarding the thickness of the resin film (2), any suitable thickness can be adopted according to the purpose within the range that does not impair the effect of the present invention. In order to better express the effect of the present invention, the thickness is preferably 25 μm to 500 μm, more preferably 25 μm to 400 μm, further preferably 25 μm to 300 μm, and particularly preferably 25 μm to 300 μm. 25 μm～200 μm, optimally 25 μm～150 μm.

樹脂膜(2)包含樹脂基材膜(2a)。The resin film (2) includes a resin base film (2a).

作為樹脂基材膜(2a)，例如可例舉：包含聚對苯二甲酸乙二酯(PET)、聚萘二甲酸乙二酯(PEN)、聚對苯二甲酸丁二酯(PBT)等聚酯系樹脂之塑膠膜；包含以聚乙烯(PE)、聚丙烯(PP)、聚甲基戊烯(PMP)、乙烯-丙烯共聚物、乙烯-乙酸乙烯酯共聚物(EVA)等α-烯烴作為單體成分之烯烴系樹脂之塑膠膜；包含聚氯乙烯(PVC)之塑膠膜；包含乙酸乙烯酯系樹脂之塑膠膜；包含聚碳酸酯(PC)之塑膠膜；包含聚苯硫醚(PPS)之塑膠膜；包含聚醯胺(尼龍)、全芳香族聚醯胺(aramid)等醯胺系樹脂之塑膠膜；包含聚醯亞胺系樹脂之塑膠膜；包含聚醚醚酮(PEEK)之塑膠膜；包含聚乙烯(PE)、聚丙烯(PP)等烯烴系樹脂之塑膠膜；包含聚四氟乙烯、聚氯三氟乙烯、聚氟乙烯、聚偏二氟乙烯、四氟乙烯-六氟丙烯共聚物、氯氟乙烯-偏二氟乙烯共聚物等氟系樹脂等之塑膠膜等。Examples of the resin base film (2a) include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), etc. Plastic films made of polyester resins; including polyethylene (PE), polypropylene (PP), polymethylpentene (PMP), ethylene-propylene copolymer, ethylene-vinyl acetate copolymer (EVA) and other α- Plastic films of olefin-based resins with olefin as a monomer component; plastic films containing polyvinyl chloride (PVC); plastic films containing vinyl acetate-based resins; plastic films containing polycarbonate (PC); containing polyphenylene sulfide (PPS) plastic film; plastic film containing polyamide (nylon), fully aromatic polyamide (aramid) and other amide resins; plastic film containing polyimide resin; including polyether ether ketone ( PEEK) plastic film; plastic film containing polyethylene (PE), polypropylene (PP) and other olefin resins; including polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene Plastic films of fluorine-based resins such as ethylene-hexafluoropropylene copolymer, chlorofluoroethylene-vinylidene fluoride copolymer, etc.

樹脂基材膜(2a)可僅為1層，亦可為2層以上。樹脂基材膜(2a)亦可為經延伸者。The resin base film (2a) may be only one layer, or may be two or more layers. The resin base film (2a) may be stretched.

亦可對樹脂基材膜(2a)實施表面處理。作為表面處理，例如可例舉：電暈處理、電漿處理、鉻酸處理、臭氧暴露、火焰暴露、高壓電擊暴露、離子化放射線處理、底塗劑塗覆處理等。The resin base film (2a) may also be subjected to surface treatment. Examples of surface treatment include corona treatment, plasma treatment, chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, ionizing radiation treatment, primer coating treatment, and the like.

樹脂基材膜(2a)亦可於並不損及本發明之效果之範圍內根據目的而包含任意適宜之添加劑。The resin base film (2a) may also contain any suitable additive according to the purpose within a range that does not impair the effects of the present invention.

樹脂膜(2)亦可具有導電層(2b)。導電層(2b)可配置於黏著劑層(1)與樹脂基材膜(2a)之間。The resin film (2) may have a conductive layer (2b). The conductive layer (2b) can be disposed between the adhesive layer (1) and the resin base film (2a).

導電層(2b)可僅為1層，亦可為2層以上。The conductive layer (2b) may be only one layer, or may be two or more layers.

導電層(2b)可藉由形成於任意適宜之基材上而設置。作為此種基材，較佳為樹脂基材膜(2a)。The conductive layer (2b) can be provided by being formed on any suitable substrate. As such a base material, a resin base film (2a) is preferred.

導電層(2b)係藉由例如真空蒸鍍法、濺鍍法、離子鍍覆法、噴霧熱分解法、化學鍍覆法、電氣鍍覆法、或該等之組合法等任意適宜之薄膜形成法於任意適宜之基材(較佳為樹脂基材膜(2a))上形成導電膜。該等薄膜形成法之中，就導電膜之形成速度或大面積膜之形成性、生產性等方面而言，較佳為真空蒸鍍法或濺鍍法。The conductive layer (2b) is formed by any suitable thin film such as vacuum evaporation, sputtering, ion plating, spray thermal decomposition, chemical plating, electrical plating, or a combination thereof. The conductive film is formed on any suitable base material (preferably the resin base material film (2a)). Among these thin film forming methods, the vacuum evaporation method or the sputtering method is preferred in terms of the formation speed of the conductive film or the formability and productivity of the large-area film.

作為用以形成導電膜之材料，例如可使用：包含金、銀、鉑、鈀、銅、鋁、鎳、鉻、鈦、鐵、鈷、錫、該等之合金等之金屬系材料；包含氧化銦、氧化錫、氧化鈦、氧化鎘、該等之混合物等之金屬氧化物系材料；包含碘化銅等之其他金屬化合物等。As materials for forming the conductive film, for example, metal-based materials including gold, silver, platinum, palladium, copper, aluminum, nickel, chromium, titanium, iron, cobalt, tin, and alloys thereof; including oxide Metal oxide materials such as indium, tin oxide, titanium oxide, cadmium oxide, and mixtures thereof; other metal compounds including copper iodide, etc.

關於導電層(2b)之厚度，可於並不損及本發明之效果之範圍內根據目的而採用任意適宜之厚度。作為此種厚度，例如，於由金屬系材料形成之情形時，較佳為30 Å～600 Å，於由金屬氧化物系材料形成之情形時，較佳為80 Å～5000 Å。As for the thickness of the conductive layer (2b), any suitable thickness can be adopted according to the purpose within the range that does not impair the effect of the present invention. Such a thickness is preferably 30 Å to 600 Å when formed of a metal-based material, and 80 Å to 5000 Å when formed of a metal oxide-based material.

導電層(2b)之表面電阻值較佳為1.0×1010 Ω/□以下，更佳為1.0×109 Ω/□以下，進而較佳為1.0×108 Ω/□以下，尤佳為1.0×107 Ω/□以下。The surface resistance value of the conductive layer (2b) is preferably 1.0×10 10 Ω/□ or less, more preferably 1.0×10 9 Ω/□ or less, further preferably 1.0×10 8 Ω/□ or less, especially 1.0 ×10 7 Ω/□ or less.

於任意適宜之基材(較佳為樹脂基材膜(2a))上形成導電膜時，亦可對該基材(較佳為樹脂基材膜(2a))之表面實施電暈放電處理、紫外線照射處理、電漿處理、濺鍍蝕刻處理、底漆塗佈處理等任意適宜之預處理，以提高導電膜與該基材(較佳為樹脂基材膜(2a))之密接性。When forming a conductive film on any suitable base material (preferably a resin base film (2a)), the surface of the base material (preferably a resin base film (2a)) can also be subjected to corona discharge treatment, Any suitable pre-treatment such as ultraviolet irradiation treatment, plasma treatment, sputtering etching treatment, primer coating treatment, etc. can be used to improve the adhesion between the conductive film and the base material (preferably the resin base material film (2a)).

樹脂膜(2)亦可具有抗靜電層(2c)。抗靜電層(2c)可配置於黏著劑層(1)與樹脂基材膜(2a)之間、及/或樹脂基材膜(2a)與黏著劑層(2)之間。The resin film (2) may also have an antistatic layer (2c). The antistatic layer (2c) can be disposed between the adhesive layer (1) and the resin base film (2a), and/or between the resin base film (2a) and the adhesive layer (2).

抗靜電層(2c)可僅為1層，亦可為2層以上。The antistatic layer (2c) may be only one layer or may be two or more layers.

關於抗靜電層(2c)之厚度，可於並不損及本發明之效果之範圍內根據目的而採用任意適宜之厚度。作為此種厚度，較佳為1 nm～1000 nm，更佳為5 nm～900 nm，進而較佳為7.5 nm～800 nm，尤佳為10 nm～700 nm。As for the thickness of the antistatic layer (2c), any suitable thickness can be adopted according to the purpose within the range that does not impair the effect of the present invention. Such a thickness is preferably 1 nm to 1000 nm, more preferably 5 nm to 900 nm, further preferably 7.5 nm to 800 nm, and particularly preferably 10 nm to 700 nm.

抗靜電層(2c)之表面電阻值較佳為1.0×1010 Ω/□以下，更佳為8.0×109 Ω/□以下，進而較佳為5.0×109 Ω/□以下，尤佳為1.0×109 Ω/□以下。The surface resistance value of the antistatic layer (2c) is preferably 1.0×10 10 Ω/□ or less, more preferably 8.0×10 9 Ω/□ or less, further preferably 5.0×10 9 Ω/□ or less, particularly preferably 1.0×10 9 Ω/□ or less.

關於抗靜電層(2c)，只要為能夠發揮抗靜電效果之層，則可於並不損及本發明之效果之範圍內採用任意適宜之抗靜電層。作為此種抗靜電層，較佳為於任意適宜之基材層上塗佈包含導電性聚合物之導電塗佈液而形成之抗靜電層。具體而言，例如於樹脂基材膜(2a)上塗佈包含導電性聚合物之導電塗佈液而形成之抗靜電層。於塗佈後，視需要加以乾燥，視需要進行硬化處理(熱處理、紫外線處理等)。作為具體之塗佈方法，可例舉：輥式塗佈法、棒式塗佈法、凹版塗佈法等。As for the antistatic layer (2c), as long as it is a layer that can exert an antistatic effect, any suitable antistatic layer can be used within the scope that does not impair the effect of the present invention. As such an antistatic layer, an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on any suitable base material layer is preferred. Specifically, for example, an antistatic layer is formed by coating a conductive coating liquid containing a conductive polymer on the resin base film (2a). After coating, it is dried if necessary and hardened (heat treatment, ultraviolet treatment, etc.) if necessary. Specific coating methods include roll coating, rod coating, gravure coating, and the like.

關於包含導電性聚合物之導電塗佈液，可於並不損及本發明之效果之範圍內採用任意適宜之導電塗佈液。此種導電塗佈液較佳為包含導電性聚合物、黏合劑、交聯劑及溶劑。該溶劑於形成抗靜電層(2c)之過程中會藉由加熱等而揮發或蒸發等，從而實質上消失，因此，抗靜電層(2c)較佳為包含導電性聚合物、黏合劑及交聯劑。Regarding the conductive coating liquid containing a conductive polymer, any appropriate conductive coating liquid can be used within the scope that does not impair the effects of the present invention. This conductive coating liquid preferably contains a conductive polymer, a binder, a cross-linking agent and a solvent. During the process of forming the antistatic layer (2c), the solvent will volatilize or evaporate through heating, etc., and thus substantially disappear. Therefore, the antistatic layer (2c) preferably contains a conductive polymer, an adhesive and a crosslinking agent. combination agent.

作為溶劑，例如可例舉：有機溶劑、水、或該等之混合溶劑。作為有機溶劑，例如可例舉：乙酸乙酯等酯類；甲基乙基酮、丙酮、環己酮等酮類；四氫呋喃(THF)、二㗁烷等環狀醚類；正己烷、環己烷等脂肪族或脂環族烴類；甲苯、二甲苯等芳香族烴類；甲醇、乙醇、正丙醇、異丙醇、環己醇等脂肪族或脂環族醇類；伸烷基二醇單烷基醚(例如，乙二醇單甲醚、乙二醇單***)、二伸烷基二醇單烷基醚等二醇醚類等。溶劑較佳為水、或以水為主成分之混合溶劑(例如水與乙醇之混合溶劑)。Examples of the solvent include organic solvents, water, and mixed solvents thereof. Examples of organic solvents include: esters such as ethyl acetate; ketones such as methyl ethyl ketone, acetone, and cyclohexanone; cyclic ethers such as tetrahydrofuran (THF) and dioxane; n-hexane and cyclohexane Aliphatic or alicyclic hydrocarbons such as alkanes; aromatic hydrocarbons such as toluene and xylene; aliphatic or alicyclic alcohols such as methanol, ethanol, n-propanol, isopropanol, and cyclohexanol; alkylene di Glycol ethers such as alcohol monoalkyl ether (for example, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether), dialkylene glycol monoalkyl ether, etc. The solvent is preferably water or a mixed solvent containing water as the main component (for example, a mixed solvent of water and ethanol).

抗靜電層(2c)中之導電性聚合物之含有比率較佳為3重量%～80重量%，更佳為5重量%～60重量%。The content ratio of the conductive polymer in the antistatic layer (2c) is preferably 3% to 80% by weight, more preferably 5% to 60% by weight.

關於導電性聚合物，可於並不損及本發明之效果之範圍內採用任意適宜之導電性聚合物。作為此種導電性聚合物，例如可例舉：於π共軛系導電性聚合物中摻雜有聚陰離子之導電性聚合物等。作為π共軛系導電性聚合物，可例舉：聚噻吩、聚吡咯、聚苯胺、聚乙炔等鏈狀導電性聚合物。作為聚陰離子，可例舉：聚苯乙烯磺酸、聚異戊二烯磺酸、聚乙烯基磺酸、聚烯丙基磺酸、聚丙烯酸乙酯磺酸、聚甲基丙烯醯羧酸等。Regarding the conductive polymer, any appropriate conductive polymer can be used within the scope that does not impair the effects of the present invention. Examples of such a conductive polymer include a conductive polymer in which a π-conjugated conductive polymer is doped with polyanions. Examples of the π-conjugated conductive polymer include chain conductive polymers such as polythiophene, polypyrrole, polyaniline, and polyacetylene. Examples of the polyanion include polystyrene sulfonic acid, polyisoprene sulfonic acid, polyvinyl sulfonic acid, polyallylsulfonic acid, polyethyl acrylate sulfonic acid, polymethacryl carboxylic acid, etc. .

導電性聚合物可僅為1種，亦可為2種以上。Only one type of conductive polymer may be used, or two or more types may be used.

抗靜電層(2c)中之黏合劑之含有比率較佳為50重量%～95重量%，更佳為60重量%～90重量%。The content ratio of the binder in the antistatic layer (2c) is preferably 50% to 95% by weight, more preferably 60% to 90% by weight.

關於導電塗佈液中可含有之黏合劑，可於並不損及本發明之效果之範圍內採用任意適宜之黏合劑。黏合劑可僅為1種，亦可為2種以上。作為此種黏合劑，較佳為樹脂，更佳為聚酯樹脂。聚酯樹脂於黏合劑中所占比率較佳為90重量%～100重量%，更佳為98重量%～100重量%。Regarding the binder that may be contained in the conductive coating liquid, any appropriate binder may be used within the scope that does not impair the effects of the present invention. Only one type of binder may be used, or two or more types of binders may be used. As such a binder, resin is preferred, and polyester resin is more preferred. The proportion of polyester resin in the adhesive is preferably 90% to 100% by weight, more preferably 98% to 100% by weight.

聚酯樹脂較佳為包含聚酯作為主成分(占比較佳為超過50重量%、更佳為75重量%以上、進而較佳為90重量%以上、尤佳為實質上100重量%之成分)。The polyester resin preferably contains polyester as the main component (the proportion is preferably more than 50% by weight, more preferably more than 75% by weight, further preferably more than 90% by weight, and most preferably substantially 100% by weight) .

關於聚酯，可於並不損及本發明之效果之範圍內採用任意適宜之聚酯。作為此種聚酯，較佳為具有較佳為由選自一分子中含有2個以上之羧基之多元羧酸(例如，二羧酸化合物)及其衍生物(例如，多元羧酸之酸酐、酯化物、鹵化物等)中之1種或2種以上之化合物(多元羧酸成分)與選自一分子中含有2個以上之羥基之多元醇(例如，二醇)中之1種或2種以上之化合物(多元醇成分)縮合而成的結構。As for the polyester, any appropriate polyester can be used within the scope that does not impair the effects of the present invention. As such a polyester, one preferably selected from the group consisting of polycarboxylic acids (for example, dicarboxylic acid compounds) containing two or more carboxyl groups per molecule and their derivatives (for example, anhydrides of polycarboxylic acids, One or more compounds (polycarboxylic acid components) selected from esters, halides, etc.) and one or two selected from polyols (for example, glycols) containing two or more hydroxyl groups in one molecule. A structure formed by the condensation of more than one compound (polyol component).

關於多元羧酸成分，可於並不損及本發明之效果之範圍內採用任意適宜之多元羧酸。作為此種多元羧酸成分，例如可例舉：草酸、丙二酸、二氟丙二酸、烷基丙二酸、琥珀酸、四氟琥珀酸、烷基琥珀酸、(±)-蘋果酸、內消旋酒石酸、伊康酸、順丁烯二酸、甲基順丁烯二酸、反丁烯二酸、甲基反丁烯二酸、乙炔二羧酸、戊二酸、六氟戊二酸、甲基戊二酸、戊烯二酸、己二酸、二硫代己二酸、甲基己二酸、二甲基己二酸、四甲基己二酸、亞甲基己二酸、黏康酸、半乳糖二酸、庚二酸、辛二酸、全氟辛二酸、3,3,6,6-四甲基辛二酸、壬二酸、癸二酸、全氟癸二酸、十三烷二酸、十二烷基二羧酸、十三烷基二羧酸、十四烷基二羧酸等脂肪族二羧酸類；環烷基二羧酸(例如，1,4-環己烷二羧酸、1,2-環己烷二羧酸)、1,4-(2-降𦯉烯)二羧酸、5-降𦯉烯-2,3-二羧酸(雙環庚烯二甲酸)、金剛烷二羧酸、螺庚烷二羧酸等脂環式二羧酸類；鄰苯二甲酸、間苯二甲酸、二硫代間苯二甲酸、甲基間苯二甲酸、二甲基間苯二甲酸、氯間苯二甲酸、二氯間苯二甲酸、對苯二甲酸、甲基對苯二甲酸、二甲基對苯二甲酸、氯對苯二甲酸、溴對苯二甲酸、萘二羧酸、側氧基茀二羧酸、蒽二羧酸、聯苯二羧酸、聯伸苯二羧酸、二甲基聯伸苯二羧酸、4,4''-對三聯苯二羧酸、4,4''-對四聯苯二羧酸、聯苄基二羧酸、偶氮苯二羧酸、高鄰苯二甲酸、伸苯基二乙酸、伸苯基二丙酸、萘二羧酸、萘二丙酸、聯苯二乙酸、聯苯二丙酸、3,3'-[4,4'-(亞甲基二對聯伸苯)]二丙酸、4,4'-聯苄基二乙酸、3,3'-[(4,4'-聯苄基)]二丙酸、氧二對伸苯基二乙酸等芳香族二羧酸類；上述任一種多元羧酸之酸酐；上述任一種多元羧酸之酯(例如，烷基酯；單酯、二酯等)；上述任一種多元羧酸所對應之醯鹵化物(例如，二羧醯氯)等。Regarding the polycarboxylic acid component, any suitable polycarboxylic acid can be used within the range that does not impair the effects of the present invention. Examples of such a polycarboxylic acid component include: oxalic acid, malonic acid, difluoromalonic acid, alkylmalonic acid, succinic acid, tetrafluorosuccinic acid, alkylsuccinic acid, and (±)-malic acid. , mesotartaric acid, itaconic acid, maleic acid, methylmaleic acid, fumaric acid, methylfumaric acid, acetylenedicarboxylic acid, glutaric acid, hexafluoropentane Diacid, methylglutaric acid, glutenedioic acid, adipic acid, dithioadipic acid, methyladipic acid, dimethyladipic acid, tetramethyladipic acid, methyleneadipic acid Acid, muconic acid, galactic acid, pimelic acid, suberic acid, perfluorosuberic acid, 3,3,6,6-tetramethylsuberic acid, azelaic acid, sebacic acid, perfluorinated Aliphatic dicarboxylic acids such as sebacic acid, tridecanedioic acid, dodecyldicarboxylic acid, tridecyldicarboxylic acid, and tetradecyldicarboxylic acid; cycloalkyldicarboxylic acids (for example, 1 ,4-cyclohexanedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid), 1,4-(2-norphenyl)dicarboxylic acid, 5-norphenyl-2,3-dicarboxylic acid (bicycloheptenedicarboxylic acid), adamantanedicarboxylic acid, spiroheptanedicarboxylic acid and other alicyclic dicarboxylic acids; phthalic acid, isophthalic acid, dithioisophthalic acid, methyl isophthalic acid Dicarboxylic acid, dimethylisophthalic acid, chloroisophthalic acid, dichloroisophthalic acid, terephthalic acid, methylterephthalic acid, dimethylterephthalic acid, chloroterephthalic acid, Bromoterephthalic acid, naphthalene dicarboxylic acid, pendant oxybenzodicarboxylic acid, anthracene dicarboxylic acid, biphenyl dicarboxylic acid, diphenylene dicarboxylic acid, dimethyl diphenylene dicarboxylic acid, 4,4 ''-p-terphenyldicarboxylic acid, 4,4''-p-tetraphenyldicarboxylic acid, bibenzyldicarboxylic acid, azobenzenedicarboxylic acid, homophthalic acid, phenylenedicarboxylic acid, Phenyl dipropionic acid, naphthalene dicarboxylic acid, naphthalene dipropionic acid, biphenyl diacetic acid, biphenyl dipropionic acid, 3,3'-[4,4'-(methylene bis-biphenylene)]di Aromatic dicarboxylic acids such as propionic acid, 4,4'-bibenzyldiacetic acid, 3,3'-[(4,4'-bibenzyl)]dipropionic acid, oxydi-p-phenylenediacetic acid; Anhydrides of any of the above-mentioned polycarboxylic acids; esters of any of the above-mentioned polycarboxylic acids (for example, alkyl esters; monoesters, diesters, etc.); acyl halides corresponding to any of the above-mentioned polycarboxylic acids (for example, dicarboxylic acid Chlorine) etc.

作為多元羧酸成分，可較佳地例舉：對苯二甲酸、間苯二甲酸、萘二羧酸等芳香族二羧酸類及其酸酐；己二酸、癸二酸、壬二酸、琥珀酸、反丁烯二酸、順丁烯二酸、雙環庚烯二甲酸、1,4-環己烷二羧酸等脂肪族二羧酸類及其酸酐；該等二羧酸類之低級烷基酯(例如，與碳原子數1～3之單醇之酯)等。Preferable examples of the polycarboxylic acid component include aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, naphthalenedicarboxylic acid, and their anhydrides; adipic acid, sebacic acid, azelaic acid, and succinic acid. Acid, fumaric acid, maleic acid, bicycloheptenedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid and other aliphatic dicarboxylic acids and their anhydrides; lower alkyl esters of these dicarboxylic acids (For example, esters with monoalcohols having 1 to 3 carbon atoms), etc.

關於多元醇成分，可於並不損及本發明之效果之範圍內採用任意適宜之多元醇。作為此種多元醇成分，例如可例舉：乙二醇、丙二醇、1,2-丙二醇、1,3-丙二醇、1,3-丁二醇、1,4-丁二醇、新戊二醇、1,5-戊二醇、1,6-己二醇、3-甲基戊二醇、二乙二醇、1,4-環己烷二甲醇、3-甲基-1,5-戊二醇、2-甲基-1,3-丙二醇、2,2-二乙基-1,3-丙二醇、2-丁基-2-乙基-1,3-丙二醇、苯二甲醇、氫化雙酚A、雙酚A等二醇類；該等二醇類之環氧烷加成物(例如，環氧乙烷加成物、環氧丙烷加成物等)等。Regarding the polyol component, any suitable polyol can be used within the range that does not impair the effects of the present invention. Examples of such polyol components include ethylene glycol, propylene glycol, 1,2-propanediol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, and neopentyl glycol. , 1,5-pentanediol, 1,6-hexanediol, 3-methylpentanediol, diethylene glycol, 1,4-cyclohexanedimethanol, 3-methyl-1,5-pentanediol Diol, 2-methyl-1,3-propanediol, 2,2-diethyl-1,3-propanediol, 2-butyl-2-ethyl-1,3-propanediol, benzenedimethanol, hydrogenated bis Diols such as phenol A and bisphenol A; alkylene oxide adducts of these glycols (for example, ethylene oxide adducts, propylene oxide adducts, etc.).

聚酯樹脂之分子量作為藉由凝膠滲透層析法(GPC)測定之標準聚苯乙烯換算之重量平均分子量(Mw)，較佳為5×103 ～1.5×105 ，更佳為1×104 ～6×104 。The molecular weight of the polyester resin is preferably 5×10 3 to 1.5×10 5 , and more preferably 1× as a weight average molecular weight (Mw) in terms of standard polystyrene measured by gel permeation chromatography (GPC). 10 4 ~ 6 × 10 4 .

聚酯樹脂之玻璃轉移溫度(Tg)較佳為0℃～120℃，更佳為10℃～80℃。The glass transition temperature (Tg) of the polyester resin is preferably 0°C to 120°C, more preferably 10°C to 80°C.

作為聚酯樹脂，可使用例如市售之東洋紡公司製造之商品名「VYLONAL」等。As the polyester resin, for example, commercially available product under the trade name "VYLONAL" manufactured by Toyobo Co., Ltd. can be used.

導電塗佈液可於並不損及本發明之效果之範圍內進而含有聚酯樹脂以外之樹脂(例如，選自丙烯酸樹脂、丙烯酸胺基甲酸酯樹脂、丙烯酸苯乙烯樹脂、丙烯酸聚矽氧樹脂、聚矽氧樹脂、聚矽氮烷樹脂、聚胺基甲酸酯樹脂、氟樹脂、聚烯烴樹脂中之至少1種樹脂)作為黏合劑。The conductive coating liquid may further contain resins other than polyester resin (for example, selected from acrylic resin, acrylic urethane resin, acrylic styrene resin, acrylic polysiloxane) within the range that does not impair the effect of the present invention. resin, polysiloxy resin, polysilazane resin, polyurethane resin, fluororesin, and polyolefin resin) as the adhesive.

關於導電塗佈液中可含有之交聯劑，可於並不損及本發明之效果之範圍內採用任意適宜之交聯劑。交聯劑可僅為1種，亦可為2種以上。作為此種交聯劑，可較佳地例舉：異氰酸酯系交聯劑、環氧系交聯劑、三聚氰胺系交聯劑、過氧化物系交聯劑、以及脲系交聯劑、金屬烷氧化物系交聯劑、金屬螯合物系交聯劑、金屬鹽系交聯劑、碳二醯亞胺系交聯劑、㗁唑啉系交聯劑、氮丙啶系交聯劑、胺系交聯劑等。其中，較佳為三聚氰胺系交聯劑。As for the cross-linking agent that may be contained in the conductive coating liquid, any appropriate cross-linking agent may be used within the scope that does not impair the effects of the present invention. There may be only one type of cross-linking agent, or two or more types of cross-linking agents. Preferred examples of such cross-linking agents include isocyanate-based cross-linking agents, epoxy-based cross-linking agents, melamine-based cross-linking agents, peroxide-based cross-linking agents, urea-based cross-linking agents, and metal alkane Oxide-based cross-linking agents, metal chelate-based cross-linking agents, metal salt-based cross-linking agents, carbodiimide-based cross-linking agents, oxazoline-based cross-linking agents, aziridine-based cross-linking agents, amines Cross-linking agent, etc. Among them, a melamine-based cross-linking agent is preferred.

抗靜電層(2c)中之交聯劑之含有比率較佳為1重量%～30重量%，更佳為2重量%～20重量%。The content ratio of the cross-linking agent in the antistatic layer (2c) is preferably 1% to 30% by weight, more preferably 2% to 20% by weight.

抗靜電層(2c)中可於並不損及本發明之效果之範圍內含有任意適宜之其他成分。The antistatic layer (2c) may contain any appropriate other components within the scope that does not impair the effect of the present invention.

≪1-4.黏著劑層(2)≫ 黏著劑層(2)可於並不損及本發明之效果之範圍內採用任意適宜之黏著劑層。黏著劑層(2)可僅為1層，亦可為2層以上。≪1-4. Adhesive layer (2)≫ The adhesive layer (2) can use any suitable adhesive layer within the scope that does not impair the effect of the present invention. The adhesive layer (2) may be only one layer, or may be two or more layers.

關於黏著劑層(2)之厚度，就更能夠表現出本發明之效果之方面而言，較佳為0.5 μm～150 μm，更佳為1 μm～100 μm，進而較佳為2 μm～80 μm，尤佳為3 μm～50 μm，最佳為5 μm～30 μm。The thickness of the adhesive layer (2) is preferably 0.5 μm to 150 μm, more preferably 1 μm to 100 μm, and further preferably 2 μm to 80 μm in order to better express the effects of the present invention. μm, preferably 3 μm～50 μm, most preferably 5 μm～30 μm.

黏著劑層(2)可藉由任意適宜之方法形成。作為此種方法，例如可例舉以下方法：於任意適宜之基材(例如樹脂膜(3))上塗佈形成構成黏著劑層(2)之黏著劑的黏著劑組合物，視需要進行加熱、乾燥後，視需要使之硬化，於該基材上形成黏著劑層。作為此種塗佈方法，例如可例舉：凹版輥式塗佈機、逆輥塗佈機、接觸輥塗佈機、浸漬輥塗機、棒式塗佈機、刮刀塗佈機、氣刀塗佈機、噴霧塗佈機、缺角輪塗佈機、直接塗佈機、輥刷塗佈機等方法。The adhesive layer (2) can be formed by any suitable method. As such a method, for example, the following method can be exemplified: Coating an adhesive composition forming an adhesive constituting the adhesive layer (2) on any suitable base material (such as a resin film (3)), and heating if necessary , after drying, if necessary, harden it to form an adhesive layer on the base material. Examples of such a coating method include a gravure roll coater, a reverse roll coater, a contact roll coater, a dip roll coater, a rod coater, a blade coater, and an air knife coater. cloth machine, spray coating machine, notch wheel coating machine, direct coating machine, roller brush coating machine and other methods.

＜1-4-1.丙烯酸系黏著劑＞ 黏著劑層(2)較佳為包含丙烯酸系黏著劑。＜1-4-1. Acrylic adhesive＞ The adhesive layer (2) preferably contains an acrylic adhesive.

丙烯酸系黏著劑係由丙烯酸系黏著劑組合物形成。The acrylic adhesive is formed from an acrylic adhesive composition.

就更能表現出本發明之效果之方面而言，丙烯酸系黏著劑組合物較佳為包含丙烯酸系聚合物與交聯劑。In order to better express the effects of the present invention, the acrylic adhesive composition preferably contains an acrylic polymer and a cross-linking agent.

丙烯酸系聚合物於丙烯酸系黏著劑之領域中可稱作所謂之基礎聚合物。丙烯酸系聚合物可僅為1種，亦可為2種以上。Acrylic polymers can be called so-called base polymers in the field of acrylic adhesives. Only one type of acrylic polymer may be used, or two or more types may be used.

丙烯酸系黏著劑組合物中之丙烯酸系聚合物之含有比率以固形物成分換算計，較佳為60重量%～99.9重量%，更佳為65重量%～99.9重量%，進而較佳為70重量%～99.9重量%，尤佳為75重量%～99.9重量%，最佳為80重量%～99.9重量%。The content ratio of the acrylic polymer in the acrylic adhesive composition is preferably 60% to 99.9% by weight, more preferably 65% to 99.9% by weight, and still more preferably 70% by weight in terms of solid content. % to 99.9% by weight, particularly preferably 75% to 99.9% by weight, most preferably 80% to 99.9% by weight.

作為丙烯酸系聚合物，可於並不損及本發明之效果之範圍內採用任意適宜之丙烯酸系聚合物。As the acrylic polymer, any suitable acrylic polymer can be used within the range that does not impair the effects of the present invention.

就更能夠表現出本發明之效果之方面而言，丙烯酸系聚合物之重量平均分子量較佳為30萬～250萬，更佳為35萬～200萬，進而較佳為40萬～180萬，尤佳為50萬～150萬。In order to better express the effects of the present invention, the weight average molecular weight of the acrylic polymer is preferably 300,000 to 2,500,000, more preferably 350,000 to 2,000,000, and still more preferably 400,000 to 1,800,000. Especially preferably, it is 500,000 to 1.5 million.

作為丙烯酸系聚合物，就更能夠表現出本發明之效果之方面而言，較佳為由組合物(B)藉由聚合所形成之丙烯酸系聚合物，上述組合物(B)包含(a成分)烷基酯部分之烷基之碳數為4～12之(甲基)丙烯酸烷基酯、(b成分)選自由具有OH基之(甲基)丙烯酸酯及(甲基)丙烯酸所組成之群中之至少1種。(a成分)、(b成分)分別獨立地可僅為1種，亦可為2種以上。The acrylic polymer is preferably an acrylic polymer formed by polymerization of the composition (B) containing the component (a) in order to better express the effects of the present invention. ) (meth)acrylic acid alkyl ester in which the alkyl group of the alkyl ester part has a carbon number of 4 to 12, (b component) is selected from the group consisting of (meth)acrylate and (meth)acrylic acid having an OH group At least 1 species in the group. Each of (a component) and (b component) may be independently one type, or two or more types.

作為烷基酯部分之烷基之碳數為4～12之(甲基)丙烯酸烷基酯(a成分)，例如可例舉：(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸十二烷基酯等。該等之中，就更能夠表現出本發明之效果之方面而言，較佳為(甲基)丙烯酸正丁酯、(甲基)丙烯酸2-乙基己酯，更佳為丙烯酸正丁酯、丙烯酸2-乙基己酯。Examples of (meth)acrylic acid alkyl esters (component a) in which the alkyl group of the alkyl ester part has 4 to 12 carbon atoms include (meth)n-butyl acrylate and (meth)isobutyl acrylate. Ester, 2nd butyl (meth)acrylate, 3rd butyl (meth)acrylate, amyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, (methyl) Octyl acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, Isodecyl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate, etc. Among these, n-butyl (meth)acrylate and 2-ethylhexyl (meth)acrylate are preferred, and n-butyl acrylate is more preferred in terms of being able to exhibit the effects of the present invention more effectively. , 2-ethylhexyl acrylate.

作為選自由具有OH基之(甲基)丙烯酸酯及(甲基)丙烯酸所組成之群中之至少1種(b成分)，例如可例舉：(甲基)丙烯酸羥基乙酯、(甲基)丙烯酸羥基丙酯、(甲基)丙烯酸羥基丁酯等具有OH基之(甲基)丙烯酸酯、(甲基)丙烯酸等。該等之中，就更能夠表現出本發明之效果之方面而言，較佳為(甲基)丙烯酸羥基乙酯、(甲基)丙烯酸，更佳為丙烯酸羥基乙酯、丙烯酸。Examples of at least one type (b component) selected from the group consisting of (meth)acrylate and (meth)acrylic acid having an OH group include: (meth)hydroxyethyl acrylate, (meth)acrylate )Hydroxypropyl acrylate, hydroxybutyl (meth)acrylate and other (meth)acrylate and (meth)acrylic acid esters having OH groups. Among these, hydroxyethyl (meth)acrylate and (meth)acrylic acid are preferable, and hydroxyethyl acrylate and acrylic acid are more preferable in terms of being able to express the effects of the present invention more effectively.

組合物(B)亦可包含(a)成分及(b)成分以外之共聚性單體。共聚性單體可僅為1種，亦可為2種以上。作為此種共聚性單體，例如可例舉：伊康酸、順丁烯二酸、反丁烯二酸、丁烯酸、異丁烯酸、該等之酸酐(例如，順丁烯二酸酐、伊康酸酐等含酸酐基之單體)等含羧基之單體(其中不包括(甲基)丙烯酸)；(甲基)丙烯醯胺、N,N-二甲基(甲基)丙烯醯胺、N-羥甲基(甲基)丙烯醯胺、N-甲氧基甲基(甲基)丙烯醯胺、N-丁氧基甲基(甲基)丙烯醯胺、N-羥基乙基(甲基)丙烯醯胺等含醯胺基之單體；(甲基)丙烯酸胺基乙酯、(甲基)丙烯酸二甲基胺基乙酯、(甲基)丙烯酸第三丁基胺基乙酯等含胺基之單體；(甲基)丙烯酸縮水甘油酯、(甲基)丙烯酸甲基縮水甘油酯等含環氧基之單體；丙烯腈或甲基丙烯腈等含氰基之單體；N-乙烯基-2-吡咯啶酮、(甲基)丙烯醯𠰌啉、N-乙烯基哌啶酮、N-乙烯基哌𠯤、N-乙烯基吡咯、N-乙烯基咪唑、乙烯基吡啶、乙烯基嘧啶、乙烯基㗁唑等含雜環之乙烯基系單體；乙烯基磺酸鈉等含磺酸基之單體；丙烯醯磷酸2-羥基乙酯等含磷酸基之單體；環己基順丁烯二醯亞胺、異丙基順丁烯二醯亞胺等含醯亞胺基之單體；異氰酸2-甲基丙烯醯氧基乙酯等含異氰酸基之單體；(甲基)丙烯酸環戊酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸異𦯉酯等具有脂環式烴基之(甲基)丙烯酸酯；(甲基)丙烯酸苯酯、(甲基)丙烯酸苯氧基乙酯、(甲基)丙烯酸苄酯等具有芳香族烴基之(甲基)丙烯酸酯；乙酸乙烯酯、丙酸乙烯酯等乙烯酯；苯乙烯、乙烯基甲苯等芳香族乙烯基化合物；乙烯、丁二烯、異戊二烯、異丁烯等烯烴類或二烯類；乙烯基烷基醚等乙烯醚類；氯乙烯等。The composition (B) may contain copolymerizable monomers other than the component (a) and the component (b). The number of copolymerizable monomers may be only one type, or two or more types. Examples of such copolymerizable monomers include itaconic acid, maleic acid, fumaric acid, crotonic acid, methacrylic acid, and acid anhydrides thereof (for example, maleic anhydride, (Meth)acrylamide, N,N-dimethyl(meth)acrylamide, N-hydroxymethyl(meth)acrylamide, N-methoxymethyl(meth)acrylamide, N-butoxymethyl(meth)acrylamide, N-hydroxyethyl(meth)acrylamide (meth)acrylamide and other amide group-containing monomers; (meth)aminoethyl acrylate, (meth)acrylic acid dimethylaminoethyl, (meth)acrylic acid tert-butylaminoethyl and other amine group-containing monomers; (meth)acrylic acid glycidyl ester, (meth)acrylic acid methyl glycidyl ester and other epoxy group-containing monomers; acrylonitrile or methacrylonitrile and other cyano group-containing monomers ;N-vinyl-2-pyrrolidinone, (meth)acrylamide, N-vinyl piperidone, N-vinyl piperidone, N-vinylpyrrole, N-vinylimidazole, vinyl Heterocyclic ring-containing vinyl monomers such as pyridine, vinyl pyrimidine, vinyl ethazole; sulfonic acid group-containing monomers such as sodium vinyl sulfonate; phosphate group-containing monomers such as 2-hydroxyethyl acrylate phosphate ; Cyclohexylmaleimide, isopropylmaleimide and other imide-containing monomers; 2-methacrylyloxyethyl isocyanate and other isocyanate-containing monomers Monomers; (meth)acrylates with alicyclic hydrocarbon groups such as cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, isopropyl (meth)acrylate, etc.; benzene (meth)acrylate Ester, phenoxyethyl (meth)acrylate, benzyl (meth)acrylate and other (meth)acrylates with aromatic hydrocarbon groups; vinyl esters such as vinyl acetate and vinyl propionate; styrene, vinyl Aromatic vinyl compounds such as toluene; olefins or dienes such as ethylene, butadiene, isoprene, isobutylene; vinyl ethers such as vinyl alkyl ether; vinyl chloride, etc.

作為共聚性單體，亦可採用多官能性單體。所謂多官能性單體係指一分子中具有2個以上之乙烯性不飽和基之單體。關於乙烯性不飽和基，可於並不損及本發明之效果之範圍內採用任意適宜之乙烯性不飽和基。作為此種乙烯性不飽和基，例如可例舉：乙烯基、丙烯基、異丙烯基、乙烯醚基(乙烯氧基)、烯丙醚基(烯丙氧基)等自由基聚合性官能基。作為多官能性單體，例如可例舉：己二醇二(甲基)丙烯酸酯、丁二醇二(甲基)丙烯酸酯、(聚)乙二醇二(甲基)丙烯酸酯、(聚)丙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、四羥甲基甲烷三(甲基)丙烯酸酯、(甲基)丙烯酸烯丙酯、(甲基)丙烯酸乙烯酯、二乙烯苯、環氧丙烯酸酯、聚酯丙烯酸酯、丙烯酸胺基甲酸酯等。此種多官能性單體可僅為1種，亦可為2種以上。As the copolymerizable monomer, a polyfunctional monomer can also be used. The so-called multifunctional monomer refers to a monomer having more than two ethylenically unsaturated groups in one molecule. As for the ethylenically unsaturated group, any suitable ethylenically unsaturated group can be used within the range that does not impair the effects of the present invention. Examples of such ethylenically unsaturated groups include radically polymerizable functional groups such as vinyl, propenyl, isopropenyl, vinyl ether (ethyleneoxy), and allyl ether (allyloxy) groups. . Examples of the polyfunctional monomer include: hexylene glycol di(meth)acrylate, butylene glycol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, ) Propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, Trimethylolpropane tri(meth)acrylate, tetramethylolmethane tri(meth)acrylate, allyl (meth)acrylate, vinyl (meth)acrylate, divinylbenzene, epoxy acrylic acid ester, polyester acrylate, acrylic urethane, etc. Only one type of such polyfunctional monomer may be used, or two or more types may be used.

作為共聚性單體，亦可採用(甲基)丙烯酸烷氧基烷基酯。作為(甲基)丙烯酸烷氧基烷基酯，例如可例舉：(甲基)丙烯酸2-甲氧基乙酯、(甲基)丙烯酸2-乙氧基乙酯、(甲基)丙烯酸甲氧基三乙二醇酯、(甲基)丙烯酸3-甲氧基丙酯、(甲基)丙烯酸3-乙氧基丙酯、(甲基)丙烯酸4-甲氧基丁酯、(甲基)丙烯酸4-乙氧基丁酯等。(甲基)丙烯酸烷氧基烷基酯可僅為1種，亦可為2種以上。As the copolymerizable monomer, alkoxyalkyl (meth)acrylate can also be used. Examples of (meth)acrylic acid alkoxyalkyl esters include: (meth)acrylic acid 2-methoxyethyl ester, (meth)acrylic acid 2-ethoxyethyl ester, (meth)acrylic acid methyl ester Oxytriethylene glycol ester, 3-methoxypropyl (meth)acrylate, 3-ethoxypropyl (meth)acrylate, 4-methoxybutyl (meth)acrylate, (meth)acrylate ) 4-ethoxybutyl acrylate, etc. Only one type of (meth)acrylic acid alkoxyalkyl ester may be used, or two or more types may be used.

關於烷基酯部分之烷基之碳數為4～12之(甲基)丙烯酸烷基酯(a成分)之含量，就更能夠表現出本發明之效果之方面而言，相對於構成丙烯酸系聚合物之單體成分總量(100重量%)，較佳為30重量%以上，更佳為35重量%～99重量%，進而較佳為40重量%～98重量%，尤佳為50重量%～95重量%。The content of the (meth)acrylic acid alkyl ester (component a) whose alkyl group in the alkyl ester part has a carbon number of 4 to 12 is more effective in expressing the effects of the present invention than in the acrylic system. The total amount of monomer components of the polymer (100% by weight) is preferably 30% by weight or more, more preferably 35% by weight to 99% by weight, further preferably 40% by weight to 98% by weight, and particularly preferably 50% by weight. %~95% by weight.

關於選自由具有OH基之(甲基)丙烯酸酯及(甲基)丙烯酸所組成之群中之至少1種(b成分)之含量，就更能夠表現出本發明之效果之方面而言，相對於構成丙烯酸系聚合物之單體成分總量(100重量%)，較佳為1重量%以上，更佳為1重量%～30重量%，進而較佳為2重量%～20重量%，尤佳為3重量%～10重量%。The content of at least one (b component) selected from the group consisting of (meth)acrylate and (meth)acrylic acid having an OH group is relatively high in terms of being able to better express the effects of the present invention. The total amount of monomer components constituting the acrylic polymer (100% by weight) is preferably 1% by weight or more, more preferably 1% by weight to 30% by weight, further preferably 2% by weight to 20% by weight, especially Preferably, it is 3% by weight to 10% by weight.

組合物(B)可於並不損及本發明之效果之範圍內含有任意適宜之其他成分。作為此種其他成分，例如可例舉：聚合起始劑、鏈轉移劑、溶劑等。該等其他成分之含量可於並不損及本發明之效果之範圍內採用任意適宜之含量。Composition (B) may contain any appropriate other ingredients within the scope that does not impair the effects of the present invention. Examples of such other components include polymerization initiators, chain transfer agents, solvents, and the like. The content of these other components can be any appropriate content within the range that does not impair the effects of the present invention.

聚合起始劑可根據聚合反應之種類而採用熱聚合起始劑或光聚合起始劑(光起始劑)等。聚合起始劑可僅為1種，亦可為2種以上。As a polymerization initiator, a thermal polymerization initiator, a photopolymerization initiator (photoinitiator), etc. can be used according to the type of polymerization reaction. The polymerization initiator may be only one type or two or more types.

較佳為於藉由溶液聚合獲得丙烯酸系聚合物時可採用熱聚合起始劑。作為此種熱聚合起始劑，例如可例舉：偶氮系聚合起始劑、過氧化物系聚合起始劑(例如，過氧化二苯甲醯、過氧化順丁烯二酸第三丁酯等)、氧化還原系聚合起始劑等。該等熱聚合起始劑之中，尤佳為日本專利特開2002-69411號公報中揭示之偶氮系起始劑。此種偶氮系聚合起始劑就聚合起始劑之分解物不易作為成為加熱產生氣體(釋氣)之產生原因之部分而殘留於丙烯酸系聚合物中的方面而言較佳。作為偶氮系聚合起始劑，可例舉：2,2'-偶氮二異丁腈(以下有時稱為AIBN)、2,2'-偶氮雙-2-甲基丁腈(以下有時稱為AMBN)、2,2'-偶氮雙(2-甲基丙酸)二甲酯、4,4'-偶氮雙-4-氰基戊酸等。It is preferable to use a thermal polymerization initiator when obtaining an acrylic polymer by solution polymerization. Examples of such thermal polymerization initiators include azo-based polymerization initiators and peroxide-based polymerization initiators (for example, dibenzoyl peroxide, butyl peroxymaleic acid). ester, etc.), redox polymerization initiator, etc. Among these thermal polymerization initiators, the azo initiator disclosed in Japanese Patent Application Laid-Open No. 2002-69411 is particularly preferred. Such an azo polymerization initiator is preferable in that decomposition products of the polymerization initiator are less likely to remain in the acrylic polymer as a cause of gas (outgassing) generated by heating. Examples of the azo polymerization initiator include: 2,2'-azobisisobutyronitrile (hereinafter sometimes referred to as AIBN), 2,2'-azobis-2-methylbutyronitrile (hereinafter sometimes referred to as AIBN) Sometimes called AMBN), 2,2'-azobis(2-methylpropionate)dimethyl ester, 4,4'-azobis-4-cyanovaleric acid, etc.

較佳為於藉由活性能量線聚合獲得丙烯酸系聚合物時可採用光聚合起始劑。作為光聚合起始劑，例如可例舉：安息香醚系光聚合起始劑、苯乙酮系光聚合起始劑、α-酮醇系光聚合起始劑、芳香族磺醯氯系光聚合起始劑、光活性肟系光聚合起始劑、安息香系光聚合起始劑、苯偶醯系光聚合起始劑、二苯甲酮系光聚合起始劑、縮酮系光聚合起始劑、9-氧硫𠮿系光聚合起始劑等。It is preferable to use a photopolymerization initiator when obtaining an acrylic polymer by active energy ray polymerization. Examples of the photopolymerization initiator include: benzoin ether-based photopolymerization initiator, acetophenone-based photopolymerization initiator, α-ketool-based photopolymerization initiator, and aromatic sulfonyl chloride-based photopolymerization initiator. Initiator, photoactive oxime-based photopolymerization initiator, benzoin-based photopolymerization initiator, benzil-based photopolymerization initiator, benzophenone-based photopolymerization initiator, ketal-based photopolymerization initiator Agent, 9-oxosulfide𠮿 It is a photopolymerization initiator, etc.

作為安息香醚系光聚合起始劑，例如可例舉：安息香甲醚、安息香***、安息香丙醚、安息香異丙醚、安息香異丁醚、2,2-二甲氧基-1,2-二苯基乙烷-1-酮、甲氧苯甲醚等。作為苯乙酮系光聚合起始劑，例如可例舉：2,2-二乙氧基苯乙酮、2,2-二甲氧基-2-苯基苯乙酮、1-羥基環己基苯基酮、4-苯氧基二氯苯乙酮、4-(第三丁基)二氯苯乙酮等。作為α-酮醇系光聚合起始劑，例如可例舉：2-甲基-2-羥基苯丙酮、1-[4-(2-羥基乙基)苯基]-2-甲基丙烷-1-酮等。作為芳香族磺醯氯系光聚合起始劑，例如可例舉：2-萘磺醯氯等。作為光活性肟系光聚合起始劑，例如可例舉：1-苯基-1,1-丙烷二酮-2-(鄰乙氧基羰基)肟等。作為安息香系光聚合起始劑，例如可例舉：安息香等。作為苯偶醯系光聚合起始劑，例如可例舉：苯偶醯等。作為二苯甲酮系光聚合起始劑，例如可例舉：二苯甲酮、苯甲醯苯甲酸、3,3'-二甲基-4-甲氧基二苯甲酮、聚乙烯基二苯甲酮、α-羥基環己基苯基酮等。作為縮酮系光聚合起始劑，例如可例舉：苯偶醯二甲基縮酮等。作為9-氧硫𠮿系光聚合起始劑，例如可例舉：9-氧硫𠮿、2-氯9-氧硫𠮿、2-甲基9-氧硫𠮿、2,4-二甲基9-氧硫𠮿、異丙基9-氧硫𠮿、2,4-二異丙基9-氧硫𠮿、十二烷基9-氧硫𠮿等。Examples of the benzoin ether photopolymerization initiator include: benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and 2,2-dimethoxy-1,2-di Phenylethane-1-one, methoxyanisole, etc. Examples of acetophenone-based photopolymerization initiators include: 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, and 1-hydroxycyclohexyl Phenyl ketone, 4-phenoxydichloroacetophenone, 4-(tert-butyl)dichloroacetophenone, etc. Examples of the α-ketool photopolymerization initiator include: 2-methyl-2-hydroxypropiophenone, 1-[4-(2-hydroxyethyl)phenyl]-2-methylpropane- 1-Keto etc. Examples of the aromatic sulfonyl chloride-based photopolymerization initiator include 2-naphthalene sulfonyl chloride and the like. Examples of the photoactive oxime-based photopolymerization initiator include 1-phenyl-1,1-propanedione-2-(o-ethoxycarbonyl)oxime and the like. Examples of the benzoin-based photopolymerization initiator include benzoin and the like. Examples of the benzilyl-based photopolymerization initiator include benzilyl and the like. Examples of the benzophenone-based photopolymerization initiator include benzophenone, benzoyl benzoic acid, 3,3'-dimethyl-4-methoxybenzophenone, and polyethylene. Benzophenone, α-hydroxycyclohexyl phenyl ketone, etc. Examples of the ketal photopolymerization initiator include benzyl dimethyl ketal and the like. As 9-oxysulfide𠮿 It is a photopolymerization initiator, for example: 9-oxosulfide , 2-chloro-9-oxosulfide𠮿 , 2-Methyl 9-oxosulfide𠮿 , 2,4-dimethyl 9-oxosulfide𠮿 , isopropyl 9-oxosulfide𠮿 , 2,4-diisopropyl 9-oxosulfide𠮿 , dodecyl 9-oxosulfide𠮿 wait.

丙烯酸系黏著劑組合物亦可含有交聯劑。藉由使用交聯劑，可提昇丙烯酸系黏著劑之凝集力，更能夠表現出本發明之效果。交聯劑可僅為1種，亦可為2種以上。The acrylic adhesive composition may also contain a cross-linking agent. By using a cross-linking agent, the cohesive force of the acrylic adhesive can be improved, and the effects of the present invention can be further expressed. There may be only one type of cross-linking agent, or two or more types of cross-linking agents.

作為交聯劑，可例舉：多官能異氰酸酯系交聯劑、環氧系交聯劑、三聚氰胺系交聯劑、過氧化物系交聯劑、以及脲系交聯劑、金屬烷氧化物系交聯劑、金屬螯合物系交聯劑、金屬鹽系交聯劑、碳二醯亞胺系交聯劑、㗁唑啉系交聯劑、氮丙啶系交聯劑、胺系交聯劑等。該等之中，就更能夠表現出本發明之效果之方面而言，較佳為選自由多官能異氰酸酯系交聯劑及環氧系交聯劑所組成之群中之至少1種(c成分)。Examples of the cross-linking agent include polyfunctional isocyanate-based cross-linking agents, epoxy-based cross-linking agents, melamine-based cross-linking agents, peroxide-based cross-linking agents, urea-based cross-linking agents, and metal alkoxide-based cross-linking agents. Cross-linking agent, metal chelate-based cross-linking agent, metal salt-based cross-linking agent, carbodiimide-based cross-linking agent, oxazoline-based cross-linking agent, aziridine-based cross-linking agent, amine-based cross-linking agent Agents, etc. Among these, at least one selected from the group consisting of polyfunctional isocyanate-based cross-linking agents and epoxy-based cross-linking agents (component c) is preferred in terms of being able to better express the effects of the present invention. ).

作為多官能異氰酸酯系交聯劑，例如可例舉：1,2-乙二異氰酸酯、1,4-丁二異氰酸酯、1,6-己二異氰酸酯等低級脂肪族聚異氰酸酯類；環戊二異氰酸酯、環己二異氰酸酯、異佛爾酮二異氰酸酯、氫化甲苯二異氰酸酯、氫化二甲苯二異氰酸酯等脂環族聚異氰酸酯類；2,4-甲苯二異氰酸酯、2,6-甲苯二異氰酸酯、4,4'-二苯基甲烷二異氰酸酯、苯二甲基二異氰酸酯等芳香族聚異氰酸酯類等。作為多官能異氰酸酯系交聯劑，亦可例舉例如：三羥甲基丙烷/甲苯二異氰酸酯加成物(Nippon Polyurethane Industry股份有限公司製造，商品名「Coronate L」)、三羥甲基丙烷/六亞甲基二異氰酸酯加成物(Nippon Polyurethane Industry股份有限公司製造，商品名「Coronate HL」)、商品名「Coronate HX」(Nippon Polyurethane Industry股份有限公司)、三羥甲基丙烷/苯二甲基二異氰酸酯加成物(三井化學股份有限公司製造，商品名「Takenate 110N」)等市售品。Examples of the polyfunctional isocyanate-based crosslinking agent include lower aliphatic polyisocyanates such as 1,2-ethylene diisocyanate, 1,4-butylene diisocyanate, and 1,6-hexamethylene diisocyanate; cyclopentadiisocyanate, Alicyclic polyisocyanates such as cyclohexane diisocyanate, isophorone diisocyanate, hydrogenated toluene diisocyanate, hydrogenated xylene diisocyanate; 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 4,4' -Aromatic polyisocyanates such as diphenylmethane diisocyanate and xylylene diisocyanate. Examples of the polyfunctional isocyanate cross-linking agent include trimethylolpropane/toluene diisocyanate adduct (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "Coronate L"), trimethylolpropane/ Hexamethylene diisocyanate adduct (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "Coronate HL"), trade name "Coronate HX" (Nippon Polyurethane Industry Co., Ltd.), trimethylolpropane/xylylene Commercially available products such as base diisocyanate adduct (manufactured by Mitsui Chemicals Co., Ltd., trade name "Takenate 110N").

作為環氧系交聯劑(多官能環氧化合物)，例如可例舉：N,N,N',N'-四縮水甘油基間苯二甲胺、二縮水甘油基苯胺、1,3-雙(N,N-二縮水甘油基胺基甲基)環己烷、1,6-己二醇二縮水甘油醚、新戊二醇二縮水甘油醚、乙二醇二縮水甘油醚、丙二醇二縮水甘油醚、聚乙二醇二縮水甘油醚、聚丙二醇二縮水甘油醚、山梨糖醇聚縮水甘油醚、甘油聚縮水甘油醚、季戊四醇聚縮水甘油醚、聚甘油聚縮水甘油醚、山梨醇酐聚縮水甘油醚、三羥甲基丙烷聚縮水甘油醚、己二酸二縮水甘油酯、鄰苯二甲酸二縮水甘油酯、三(2-羥基乙基)異氰尿酸三縮水甘油酯、間苯二酚二縮水甘油醚、雙酚-S-二縮水甘油醚，以及分子內具有2個以上環氧基之環氧系樹脂等。作為環氧系交聯劑，亦可例舉：商品名「Tetrad C」(三菱瓦斯化學股份有限公司製)等市售品。Examples of the epoxy-based crosslinking agent (polyfunctional epoxy compound) include: N,N,N',N'-tetraglycidyl metaxylylenediamine, diglycidylaniline, 1,3- Bis(N,N-diglycidylaminomethyl)cyclohexane, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether Glycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, sorbitol polyglycidyl ether, glycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether, sorbitan anhydride Polyglycidyl ether, trimethylolpropane polyglycidyl ether, diglycidyl adipate, diglycidyl phthalate, tris(2-hydroxyethyl)triglycidyl isocyanurate, isophthalic acid Diphenol diglycidyl ether, bisphenol-S-diglycidyl ether, and epoxy resins with two or more epoxy groups in the molecule, etc. Examples of the epoxy cross-linking agent include commercially available products with the trade name "Tetrad C" (manufactured by Mitsubishi Gas Chemical Co., Ltd.).

關於丙烯酸系黏著劑組合物中之交聯劑之含量，可於並不損及本發明之效果之範圍內採用任意適宜之含量。作為此種含量，例如就更能夠表現出本發明之效果之方面而言，相對於丙烯酸系聚合物之固形物成分(100重量份)，較佳為0.05重量份～20重量份，更佳為0.1重量份～18重量份，進而較佳為0.5重量份～15重量份，尤佳為0.5重量份～10重量份。Regarding the content of the cross-linking agent in the acrylic adhesive composition, any appropriate content can be used within the range that does not impair the effects of the present invention. Such a content is preferably 0.05 to 20 parts by weight relative to the solid content (100 parts by weight) of the acrylic polymer in order to better express the effects of the present invention, and more preferably 0.1 to 18 parts by weight, more preferably 0.5 to 15 parts by weight, particularly preferably 0.5 to 10 parts by weight.

丙烯酸系黏著劑組合物可於並不損及本發明之效果之範圍內含有任意適宜之其他成分。作為此種其他成分，例如可例舉：丙烯酸系聚合物以外之聚合物成分、交聯促進劑、交聯觸媒、矽烷偶合劑、黏著賦予樹脂(松香衍生物、聚萜烯樹脂、石油樹脂、油溶性酚等)、抗老化劑、無機填充劑、有機填充劑、金屬粉、著色劑(顏料或染料等)、箔狀物、紫外線吸收劑、抗氧化劑、光穩定劑、鏈轉移劑、塑化劑、軟化劑、界面活性劑、抗靜電劑、導電劑、穩定劑、表面潤滑劑、調平劑、防腐劑、耐熱穩定劑、聚合抑制劑、潤滑劑、溶劑、觸媒等。The acrylic adhesive composition may contain any appropriate other ingredients within the scope that does not impair the effects of the present invention. Examples of such other components include polymer components other than acrylic polymers, crosslinking accelerators, crosslinking catalysts, silane coupling agents, tackifying resins (rosin derivatives, polyterpene resins, petroleum resins) , oil-soluble phenol, etc.), anti-aging agents, inorganic fillers, organic fillers, metal powders, colorants (pigments or dyes, etc.), foils, UV absorbers, antioxidants, light stabilizers, chain transfer agents, Plasticizers, softeners, surfactants, antistatic agents, conductive agents, stabilizers, surface lubricants, leveling agents, preservatives, heat-resistant stabilizers, polymerization inhibitors, lubricants, solvents, catalysts, etc.

＜1-4-2.導電成分＞ 黏著劑層(2)亦可含有導電成分。關於導電成分，可直接援用＜1-2-5.導電成分＞項中之說明。＜1-4-2. Conductive component＞ The adhesive layer (2) may also contain conductive components. Regarding the conductive components, you can directly refer to the description in <1-2-5. Conductive components>.

＜1-4-3.其他成分＞ 成為黏著劑層(2)之材料的黏著劑組合物(較佳為丙烯酸系黏著劑組合物)可於並不損及本發明之效果之範圍內含有任意適宜之其他成分。作為此種其他成分，例如可例舉：其他聚合物成分、交聯促進劑、交聯觸媒、矽烷偶合劑、黏著賦予樹脂(松香衍生物、聚萜烯樹脂、石油樹脂、油溶性酚等)、抗老化劑、無機填充劑、有機填充劑、金屬粉、著色劑(顏料或染料等)、箔狀物、紫外線吸收劑、抗氧化劑、光穩定劑、鏈轉移劑、塑化劑、軟化劑、界面活性劑、抗靜電劑、導電劑、穩定劑、表面潤滑劑、調平劑、防腐劑、耐熱穩定劑、聚合抑制劑、潤滑劑、溶劑、觸媒等。＜1-4-3.Other ingredients＞ The adhesive composition (preferably an acrylic adhesive composition) used as the material of the adhesive layer (2) may contain any appropriate other components within the range that does not impair the effects of the present invention. Examples of such other components include other polymer components, cross-linking accelerators, cross-linking catalysts, silane coupling agents, adhesive resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.) ), anti-aging agents, inorganic fillers, organic fillers, metal powders, colorants (pigments or dyes, etc.), foils, UV absorbers, antioxidants, light stabilizers, chain transfer agents, plasticizers, softeners Agents, surfactants, antistatic agents, conductive agents, stabilizers, surface lubricants, leveling agents, preservatives, heat-resistant stabilizers, polymerization inhibitors, lubricants, solvents, catalysts, etc.

≪1-5.樹脂膜(3)≫ 關於樹脂膜(3)之厚度，就更能夠表現出本發明之效果之方面而言，較佳為4 μm～450 μm，更佳為8 μm～350 μm，進而較佳為12 μm～250 μm，尤佳為16 μm～150 μm，最佳為20 μm～100 μm。≪1-5.Resin film(3)≫ The thickness of the resin film (3) is preferably 4 μm to 450 μm, more preferably 8 μm to 350 μm, and further preferably 12 μm to 250 μm in order to better express the effects of the present invention. , especially preferably 16 μm ~ 150 μm, and optimally 20 μm ~ 100 μm.

樹脂膜(3)包含樹脂基材膜(3a)。The resin film (3) includes a resin base film (3a).

作為樹脂基材膜(3a)，例如可例舉：包含聚對苯二甲酸乙二酯(PET)、聚萘二甲酸乙二酯(PEN)、聚對苯二甲酸丁二酯(PBT)等聚酯系樹脂之塑膠膜；包含以聚乙烯(PE)、聚丙烯(PP)、聚甲基戊烯(PMP)、乙烯-丙烯共聚物、乙烯-乙酸乙烯酯共聚物(EVA)等α-烯烴作為單體成分之烯烴系樹脂之塑膠膜；包含聚氯乙烯(PVC)之塑膠膜；包含乙酸乙烯酯系樹脂之塑膠膜；包含聚碳酸酯(PC)之塑膠膜；包含聚苯硫醚(PPS)之塑膠膜；包含聚醯胺(尼龍)、全芳香族聚醯胺(aramid)等醯胺系樹脂之塑膠膜；包含聚醯亞胺系樹脂之塑膠膜；包含聚醚醚酮(PEEK)之塑膠膜；包含聚乙烯(PE)、聚丙烯(PP)等烯烴系樹脂之塑膠膜；包含聚四氟乙烯、聚氯三氟乙烯、聚氟乙烯、聚偏二氟乙烯、四氟乙烯-六氟丙烯共聚物、氯氟乙烯-偏二氟乙烯共聚物等氟系樹脂等之塑膠膜等。Examples of the resin base film (3a) include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), etc. Plastic films made of polyester resins; including polyethylene (PE), polypropylene (PP), polymethylpentene (PMP), ethylene-propylene copolymer, ethylene-vinyl acetate copolymer (EVA) and other α- Plastic films of olefin-based resins with olefin as a monomer component; plastic films containing polyvinyl chloride (PVC); plastic films containing vinyl acetate-based resins; plastic films containing polycarbonate (PC); containing polyphenylene sulfide (PPS) plastic film; plastic film containing polyamide (nylon), fully aromatic polyamide (aramid) and other amide resins; plastic film containing polyimide resin; including polyether ether ketone ( PEEK) plastic film; plastic film containing polyethylene (PE), polypropylene (PP) and other olefin resins; including polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene Plastic films of fluorine-based resins such as ethylene-hexafluoropropylene copolymer, chlorofluoroethylene-vinylidene fluoride copolymer, etc.

樹脂基材膜(3a)可僅為1層，亦可為2層以上。樹脂基材膜(3a)亦可為經延伸者。The resin base film (3a) may be only one layer, or may be two or more layers. The resin base film (3a) may be stretched.

亦可對樹脂基材膜(3a)實施表面處理。作為表面處理，例如可例舉：電暈處理、電漿處理、鉻酸處理、臭氧暴露、火焰暴露、高壓電擊暴露、離子化放射線處理、底塗劑塗覆處理等。The resin base film (3a) may also be subjected to surface treatment. Examples of surface treatment include corona treatment, plasma treatment, chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, ionizing radiation treatment, primer coating treatment, and the like.

對於樹脂膜(3)之未設置黏著劑層(2)之面，為了形成易於解捲之捲繞體等，例如可對樹脂膜(3)添加脂肪酸醯胺、聚伸乙亞胺、長鏈烷基系添加劑等進行離型處理，或可設置包含聚矽氧系、長鏈烷基系、氟系等任意適宜之剝離劑之塗層。For the surface of the resin film (3) that is not provided with the adhesive layer (2), in order to form a roll that is easy to unwind, for example, fatty acid amide, polyethyleneimine, or long-chain amide can be added to the resin film (3). Alkyl additives, etc. are used for release treatment, or a coating containing any suitable release agent such as polysiloxane, long-chain alkyl, fluorine, etc. can be provided.

樹脂膜(3)可於並不損及本發明之效果之範圍內根據目的而包含任意適宜之添加劑。The resin film (3) may contain any appropriate additive according to the purpose within the range that does not impair the effects of the present invention.

樹脂膜(3)亦可具有導電層(3b)。導電層(3b)可配置於黏著劑層(2)與樹脂基材膜(3a)之間。The resin film (3) may have a conductive layer (3b). The conductive layer (3b) can be disposed between the adhesive layer (2) and the resin base film (3a).

導電層(3b)可僅為1層，亦可為2層以上。The conductive layer (3b) may be only one layer, or may be two or more layers.

導電層(3b)可藉由形成於任意適宜之基材上而設置。作為此種基材，較佳為樹脂基材膜(3a)。The conductive layer (3b) can be provided by being formed on any suitable substrate. As such a base material, a resin base film (3a) is preferred.

導電層(3b)係藉由例如真空蒸鍍法、濺鍍法、離子鍍覆法、噴霧熱分解法、化學鍍覆法、電氣鍍覆法、或該等之組合法等任意適宜之薄膜形成法於任意適宜之基材(較佳為樹脂基材膜(3a))上形成導電膜。該等薄膜形成法之中，就導電膜之形成速度或大面積膜之形成性、生產性等方面而言，較佳為真空蒸鍍法或濺鍍法。The conductive layer (3b) is formed by any suitable thin film such as vacuum evaporation, sputtering, ion plating, spray thermal decomposition, chemical plating, electrical plating, or a combination thereof. The conductive film is formed on any suitable base material (preferably a resin base material film (3a)). Among these thin film forming methods, the vacuum evaporation method or the sputtering method is preferred in terms of the formation speed of the conductive film or the formability and productivity of the large-area film.

作為用以形成導電膜之材料，例如可使用：包含金、銀、鉑、鈀、銅、鋁、鎳、鉻、鈦、鐵、鈷、錫、該等之合金等之金屬系材料；包含氧化銦、氧化錫、氧化鈦、氧化鎘、該等之混合物等之金屬氧化物系材料；包含碘化銅等之其他金屬化合物等。As materials for forming the conductive film, for example, metal-based materials including gold, silver, platinum, palladium, copper, aluminum, nickel, chromium, titanium, iron, cobalt, tin, and alloys thereof; including oxide Metal oxide materials such as indium, tin oxide, titanium oxide, cadmium oxide, and mixtures thereof; other metal compounds including copper iodide, etc.

關於導電層(3b)之厚度，可於並不損及本發明之效果之範圍內根據目的而採用任意適宜之厚度。作為此種厚度，例如，於由金屬系材料形成之情形時，較佳為30 Å～600 Å，於由金屬氧化物系材料形成之情形時，較佳為80 Å～5000 Å。As for the thickness of the conductive layer (3b), any suitable thickness can be adopted according to the purpose within the range that does not impair the effect of the present invention. Such a thickness is preferably 30 Å to 600 Å when formed of a metal-based material, and 80 Å to 5000 Å when formed of a metal oxide-based material.

導電層(3b)之表面電阻值較佳為1.0×1010 Ω/□以下，更佳為1.0×109 Ω/□以下，進而較佳為1.0×108 Ω/□以下，尤佳為1.0×107 Ω/□以下。The surface resistance value of the conductive layer (3b) is preferably 1.0×10 10 Ω/□ or less, more preferably 1.0×10 9 Ω/□ or less, further preferably 1.0×10 8 Ω/□ or less, especially 1.0 ×10 7 Ω/□ or less.

於任意適宜之基材(較佳為樹脂基材膜(3a))上形成導電膜時，亦可對該基材(較佳為樹脂基材膜(3a))之表面實施電暈放電處理、紫外線照射處理、電漿處理、濺鍍蝕刻處理、底漆塗佈處理等任意適宜之預處理，以提高導電膜與該基材(較佳為樹脂基材膜(3a))之密接性。When forming a conductive film on any suitable base material (preferably a resin base film (3a)), the surface of the base material (preferably a resin base film (3a)) can also be subjected to corona discharge treatment, Any suitable pre-treatment such as ultraviolet irradiation treatment, plasma treatment, sputtering etching treatment, primer coating treatment, etc. can be used to improve the adhesion between the conductive film and the base material (preferably the resin base material film (3a)).

樹脂膜(3)亦可具有抗靜電層(3c)。抗靜電層(3c)可配置於黏著劑層(2)與樹脂基材膜(3a)之間、及/或樹脂基材膜(3a)之黏著劑層(2)之相反側。The resin film (3) may also have an antistatic layer (3c). The antistatic layer (3c) can be disposed between the adhesive layer (2) and the resin base film (3a), and/or on the opposite side of the adhesive layer (2) of the resin base film (3a).

抗靜電層(3c)可僅為1層，亦可為2層以上。The antistatic layer (3c) may be only one layer or may be two or more layers.

關於抗靜電層(3c)之厚度，可於並不損及本發明之效果之範圍內根據目的而採用任意適宜之厚度。作為此種厚度，較佳為1 nm～1000 nm，更佳為5 nm～900 nm，進而較佳為7.5 nm～800 nm，尤佳為10 nm～700 nm。As for the thickness of the antistatic layer (3c), any suitable thickness can be adopted according to the purpose within the range that does not impair the effect of the present invention. Such a thickness is preferably 1 nm to 1000 nm, more preferably 5 nm to 900 nm, further preferably 7.5 nm to 800 nm, and particularly preferably 10 nm to 700 nm.

抗靜電層(3c)之表面電阻值較佳為1.0×1010 Ω/□以下，更佳為8.0×109 Ω/□以下，進而較佳為5.0×109 Ω/□以下，尤佳為1.0×109 Ω/□以下。The surface resistance value of the antistatic layer (3c) is preferably 1.0×10 10 Ω/□ or less, more preferably 8.0×10 9 Ω/□ or less, further preferably 5.0×10 9 Ω/□ or less, particularly preferably 1.0×10 9 Ω/□ or less.

關於抗靜電層(3c)，只要為能夠發揮抗靜電效果之層，則可於並不損及本發明之效果之範圍內採用任意適宜之抗靜電層。作為此種抗靜電層，較佳為於任意適宜之基材層上塗佈包含導電性聚合物之導電塗佈液所形成之抗靜電層。具體而言，例如於樹脂基材膜(3a)上塗佈包含導電性聚合物之導電塗佈液所形成之抗靜電層。於塗佈後，視需要加以乾燥，視需要進行硬化處理(熱處理、紫外線處理等)。作為具體之塗佈方法，可例舉：輥式塗佈法、棒式塗佈法、凹版塗佈法等。As for the antistatic layer (3c), as long as it is a layer that can exert an antistatic effect, any suitable antistatic layer can be used within the scope that does not impair the effect of the present invention. As such an antistatic layer, an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on any suitable base material layer is preferred. Specifically, for example, an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on the resin base film (3a). After coating, it is dried if necessary and hardened (heat treatment, ultraviolet treatment, etc.) if necessary. Specific coating methods include roll coating, rod coating, gravure coating, and the like.

關於包含導電性聚合物之導電塗佈液，可於並不損及本發明之效果之範圍內採用任意適宜之導電塗佈液。此種導電塗佈液較佳為包含導電性聚合物、黏合劑、交聯劑及溶劑。該溶劑於形成抗靜電層(3c)之過程中會藉由加熱等而揮發或蒸發等，從而實質上消失，因此，抗靜電層(3c)較佳為包含導電性聚合物、黏合劑及交聯劑。Regarding the conductive coating liquid containing a conductive polymer, any appropriate conductive coating liquid can be used within the scope that does not impair the effects of the present invention. This conductive coating liquid preferably contains a conductive polymer, a binder, a cross-linking agent and a solvent. In the process of forming the antistatic layer (3c), the solvent will volatilize or evaporate through heating, etc., and thus substantially disappear. Therefore, the antistatic layer (3c) preferably contains a conductive polymer, an adhesive and a crosslinking agent. combination agent.

作為溶劑，例如可例舉：有機溶劑、水、或該等之混合溶劑。作為有機溶劑，例如可例舉：乙酸乙酯等酯類；甲基乙基酮、丙酮、環己酮等酮類；四氫呋喃(THF)、二㗁烷等環狀醚類；正己烷、環己烷等脂肪族或脂環族烴類；甲苯、二甲苯等芳香族烴類；甲醇、乙醇、正丙醇、異丙醇、環己醇等脂肪族或脂環族醇類；伸烷基二醇單烷基醚(例如，乙二醇單甲醚、乙二醇單***)、二伸烷基二醇單烷基醚等二醇醚類等。溶劑較佳為水、或以水為主成分之混合溶劑(例如水與乙醇之混合溶劑)。Examples of the solvent include organic solvents, water, and mixed solvents thereof. Examples of organic solvents include: esters such as ethyl acetate; ketones such as methyl ethyl ketone, acetone, and cyclohexanone; cyclic ethers such as tetrahydrofuran (THF) and dioxane; n-hexane and cyclohexane Aliphatic or alicyclic hydrocarbons such as alkanes; aromatic hydrocarbons such as toluene and xylene; aliphatic or alicyclic alcohols such as methanol, ethanol, n-propanol, isopropanol, and cyclohexanol; alkylene di Glycol ethers such as alcohol monoalkyl ether (for example, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether), dialkylene glycol monoalkyl ether, etc. The solvent is preferably water or a mixed solvent containing water as the main component (for example, a mixed solvent of water and ethanol).

抗靜電層(3c)中之導電性聚合物之含有比率較佳為3重量%～80重量%，更佳為5重量%～60重量%。The content ratio of the conductive polymer in the antistatic layer (3c) is preferably 3% to 80% by weight, more preferably 5% to 60% by weight.

關於導電性聚合物，可於並不損及本發明之效果之範圍內採用任意適宜之導電性聚合物。作為此種導電性聚合物，例如可例舉：於π共軛系導電性聚合物中摻雜有聚陰離子之導電性聚合物等。作為π共軛系導電性聚合物，可例舉：聚噻吩、聚吡咯、聚苯胺、聚乙炔等鏈狀導電性聚合物。作為聚陰離子，可例舉：聚苯乙烯磺酸、聚異戊二烯磺酸、聚乙烯基磺酸、聚烯丙基磺酸、聚丙烯酸乙酯磺酸、聚甲基丙烯醯羧酸等。Regarding the conductive polymer, any appropriate conductive polymer can be used within the scope that does not impair the effects of the present invention. Examples of such a conductive polymer include a conductive polymer in which a π-conjugated conductive polymer is doped with polyanions. Examples of the π-conjugated conductive polymer include chain conductive polymers such as polythiophene, polypyrrole, polyaniline, and polyacetylene. Examples of the polyanion include polystyrene sulfonic acid, polyisoprene sulfonic acid, polyvinyl sulfonic acid, polyallylsulfonic acid, polyethyl acrylate sulfonic acid, polymethacryl carboxylic acid, etc. .

導電性聚合物可僅為1種，亦可為2種以上。Only one type of conductive polymer may be used, or two or more types may be used.

抗靜電層(3c)中之黏合劑之含有比率較佳為50重量%～95重量%，更佳為60重量%～90重量%。The content ratio of the binder in the antistatic layer (3c) is preferably 50% to 95% by weight, more preferably 60% to 90% by weight.

關於導電塗佈液中可含有之黏合劑，可於並不損及本發明之效果之範圍內採用任意適宜之黏合劑。黏合劑可僅為1種，亦可為2種以上。作為此種黏合劑，較佳為樹脂，更佳為聚酯樹脂。聚酯樹脂於黏合劑中所占比率較佳為90重量%～100重量%，更佳為98重量%～100重量%。Regarding the binder that may be contained in the conductive coating liquid, any suitable binder may be used within the scope that does not impair the effects of the present invention. Only one type of binder may be used, or two or more types of binders may be used. As such a binder, resin is preferred, and polyester resin is more preferred. The proportion of polyester resin in the adhesive is preferably 90% to 100% by weight, more preferably 98% to 100% by weight.

聚酯樹脂較佳為包含聚酯作為主成分(占比較佳為超過50重量%、更佳為75重量%以上、進而較佳為90重量%以上、尤佳為實質上100重量%之成分)。The polyester resin preferably contains polyester as the main component (the proportion is preferably more than 50% by weight, more preferably more than 75% by weight, further preferably more than 90% by weight, and most preferably substantially 100% by weight) .

關於聚酯，可於並不損及本發明之效果之範圍內採用任意適宜之聚酯。作為此種聚酯，較佳為具有如下結構：較佳為由選自一分子中含有2個以上羧基之多元羧酸(例如二羧酸化合物)及其衍生物(例如多元羧酸之酸酐、酯化物、鹵化物等)中之1種或2種以上化合物(多元羧酸成分)與選自一分子中含有2個以上羥基之多元醇(例如二醇)中之1種或2種以上化合物(多元醇成分)縮合而成的結構。As for the polyester, any appropriate polyester can be used within the scope that does not impair the effects of the present invention. Such a polyester preferably has the following structure: preferably it is selected from the group consisting of polycarboxylic acids (for example, dicarboxylic acid compounds) containing two or more carboxyl groups per molecule and their derivatives (for example, anhydrides of polycarboxylic acids, One or more compounds (polycarboxylic acid components) selected from esters, halides, etc.) and one or more compounds selected from polyols (such as diols) containing two or more hydroxyl groups in one molecule (polyol component) condensed structure.

關於多元羧酸成分，可於並不損及本發明之效果之範圍內採用任意適宜之多元羧酸。作為此種多元羧酸成分，例如可例舉：草酸、丙二酸、二氟丙二酸、烷基丙二酸、琥珀酸、四氟琥珀酸、烷基琥珀酸、(±)-蘋果酸、內消旋酒石酸、伊康酸、順丁烯二酸、甲基順丁烯二酸、反丁烯二酸、甲基反丁烯二酸、乙炔二羧酸、戊二酸、六氟戊二酸、甲基戊二酸、戊烯二酸、己二酸、二硫代己二酸、甲基己二酸、二甲基己二酸、四甲基己二酸、亞甲基己二酸、黏康酸、半乳糖二酸、庚二酸、辛二酸、全氟辛二酸、3,3,6,6-四甲基辛二酸、壬二酸、癸二酸、全氟癸二酸、十三烷二酸、十二烷基二羧酸、十三烷基二羧酸、十四烷基二羧酸等脂肪族二羧酸類；環烷基二羧酸(例如1,4-環己烷二羧酸、1,2-環己烷二羧酸)、1,4-(2-降𦯉烯)二羧酸、5-降𦯉烯-2,3-二羧酸(雙環庚烯二甲酸)、金剛烷二羧酸、螺庚烷二羧酸等脂環式二羧酸類；鄰苯二甲酸、間苯二甲酸、二硫代間苯二甲酸、甲基間苯二甲酸、二甲基間苯二甲酸、氯間苯二甲酸、二氯間苯二甲酸、對苯二甲酸、甲基對苯二甲酸、二甲基對苯二甲酸、氯對苯二甲酸、溴對苯二甲酸、萘二羧酸、側氧基茀二羧酸、蒽二羧酸、聯苯二羧酸、聯伸苯二羧酸、二甲基聯伸苯二羧酸、4,4''-對三聯苯二羧酸、4,4''-對四聯苯二羧酸、聯苄基二羧酸、偶氮苯二羧酸、高鄰苯二甲酸、伸苯基二乙酸、伸苯基二丙酸、萘二羧酸、萘二丙酸、聯苯二乙酸、聯苯二丙酸、3,3'-[4,4'-(亞甲基二對聯伸苯)]二丙酸、4,4'-聯苄基二乙酸、3,3'-[(4,4'-聯苄基)]二丙酸、氧二對伸苯基二乙酸等芳香族二羧酸類；上述任一種多元羧酸之酸酐；上述任一種多元羧酸之酯(例如烷基酯。單酯、二酯等)；上述任一種多元羧酸所對應之醯鹵化物(例如二羧醯氯)等。Regarding the polycarboxylic acid component, any suitable polycarboxylic acid can be used within the range that does not impair the effects of the present invention. Examples of such a polycarboxylic acid component include: oxalic acid, malonic acid, difluoromalonic acid, alkylmalonic acid, succinic acid, tetrafluorosuccinic acid, alkylsuccinic acid, and (±)-malic acid. , mesotartaric acid, itaconic acid, maleic acid, methylmaleic acid, fumaric acid, methylfumaric acid, acetylenedicarboxylic acid, glutaric acid, hexafluoropentane Diacid, methylglutaric acid, glutenedioic acid, adipic acid, dithioadipic acid, methyladipic acid, dimethyladipic acid, tetramethyladipic acid, methyleneadipic acid Acid, muconic acid, galactic acid, pimelic acid, suberic acid, perfluorosuberic acid, 3,3,6,6-tetramethylsuberic acid, azelaic acid, sebacic acid, perfluorinated Aliphatic dicarboxylic acids such as sebacic acid, tridecanedioic acid, dodecyldicarboxylic acid, tridecyldicarboxylic acid, and tetradecyldicarboxylic acid; cycloalkyldicarboxylic acids (such as 1, 4-cyclohexanedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid), 1,4-(2-norphenyl)dicarboxylic acid, 5-norphenyl-2,3-dicarboxylic acid ( Bicycloheptenedicarboxylic acid), adamantanedicarboxylic acid, spiroheptanedicarboxylic acid and other alicyclic dicarboxylic acids; phthalic acid, isophthalic acid, dithioisophthalic acid, methylisophthalic acid Formic acid, dimethylisophthalic acid, chloroisophthalic acid, dichloroisophthalic acid, terephthalic acid, methylterephthalic acid, dimethylterephthalic acid, chloroterephthalic acid, bromine Terephthalic acid, naphthalenedicarboxylic acid, oxybenzodicarboxylic acid, anthracenedicarboxylic acid, biphenyldicarboxylic acid, dibenzenedicarboxylic acid, dimethyldiphenyldicarboxylic acid, 4,4' '-p-terphenyldicarboxylic acid, 4,4''-p-tetraphenyldicarboxylic acid, bibenzyldicarboxylic acid, azobenzenedicarboxylic acid, homophthalic acid, phenylenedicarboxylic acid, Phenyl dipropionic acid, naphthalene dicarboxylic acid, naphthalene dipropionic acid, biphenyl diacetic acid, biphenyl dipropionic acid, 3,3'-[4,4'-(methylene bis-biphenylene)]dipropylene Aromatic dicarboxylic acids such as acid, 4,4'-bibenzyldiacetic acid, 3,3'-[(4,4'-bibenzyl)]dipropionic acid, oxydi-p-phenylenediacetic acid; the above Anhydrides of any polycarboxylic acid; esters of any of the above polycarboxylic acids (such as alkyl esters, monoesters, diesters, etc.); acyl halides corresponding to any of the above polycarboxylic acids (such as dicarboxylic acid chlorides), etc. .

作為多元羧酸成分，可較佳地例舉：對苯二甲酸、間苯二甲酸、萘二羧酸等芳香族二羧酸類及其酸酐；己二酸、癸二酸、壬二酸、琥珀酸、反丁烯二酸、順丁烯二酸、雙環庚烯二甲酸、1,4-環己烷二羧酸等脂肪族二羧酸類及其酸酐；該等二羧酸類之低級烷基酯(例如與碳原子數1～3之單醇之酯)等。Preferable examples of the polycarboxylic acid component include aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, naphthalenedicarboxylic acid, and their anhydrides; adipic acid, sebacic acid, azelaic acid, and succinic acid. Acid, fumaric acid, maleic acid, bicycloheptenedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid and other aliphatic dicarboxylic acids and their anhydrides; lower alkyl esters of these dicarboxylic acids (For example, esters with monoalcohols having 1 to 3 carbon atoms), etc.

關於多元醇成分，可於並不損及本發明之效果之範圍內採用任意適宜之多元醇。作為此種多元醇成分，例如可例舉：乙二醇、丙二醇、1,2-丙二醇、1,3-丙二醇、1,3-丁二醇、1,4-丁二醇、新戊二醇、1,5-戊二醇、1,6-己二醇、3-甲基戊二醇、二乙二醇、1,4-環己烷二甲醇、3-甲基-1,5-戊二醇、2-甲基-1,3-丙二醇、2,2-二乙基-1,3-丙二醇、2-丁基-2-乙基-1,3-丙二醇、苯二甲醇、氫化雙酚A、雙酚A等二醇類；該等二醇類之環氧烷加成物(例如，環氧乙烷加成物、環氧丙烷加成物等)等。Regarding the polyol component, any suitable polyol can be used within the range that does not impair the effects of the present invention. Examples of such polyol components include ethylene glycol, propylene glycol, 1,2-propanediol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, and neopentyl glycol. , 1,5-pentanediol, 1,6-hexanediol, 3-methylpentanediol, diethylene glycol, 1,4-cyclohexanedimethanol, 3-methyl-1,5-pentanediol Diol, 2-methyl-1,3-propanediol, 2,2-diethyl-1,3-propanediol, 2-butyl-2-ethyl-1,3-propanediol, benzenedimethanol, hydrogenated bis Diols such as phenol A and bisphenol A; alkylene oxide adducts of these glycols (for example, ethylene oxide adducts, propylene oxide adducts, etc.).

聚酯樹脂之分子量作為藉由凝膠滲透層析法(GPC)測定之標準聚苯乙烯換算之重量平均分子量(Mw)，較佳為5×103 ～1.5×105 ，更佳為1×104 ～6×104 。The molecular weight of the polyester resin is preferably 5×10 3 to 1.5×10 5 , and more preferably 1× as a weight average molecular weight (Mw) in terms of standard polystyrene measured by gel permeation chromatography (GPC). 10 4 ~ 6 × 10 4 .

聚酯樹脂之玻璃轉移溫度(Tg)較佳為0℃～120℃，更佳為10℃～80℃。The glass transition temperature (Tg) of the polyester resin is preferably 0°C to 120°C, more preferably 10°C to 80°C.

作為聚酯樹脂，可使用例如市售之東洋紡公司製造之商品名「VYLONAL」等。As the polyester resin, for example, commercially available product under the trade name "VYLONAL" manufactured by Toyobo Co., Ltd. can be used.

導電塗佈液可於並不損及本發明之效果之範圍內進而含有聚酯樹脂以外之樹脂(例如，選自丙烯酸樹脂、丙烯酸胺基甲酸酯樹脂、丙烯酸苯乙烯樹脂、丙烯酸聚矽氧樹脂、聚矽氧樹脂、聚矽氮烷樹脂、聚胺基甲酸酯樹脂、氟樹脂、聚烯烴樹脂中之至少1種樹脂)作為黏合劑。The conductive coating liquid may further contain resins other than polyester resin (for example, selected from acrylic resin, acrylic urethane resin, acrylic styrene resin, acrylic polysiloxane) within the range that does not impair the effect of the present invention. resin, polysiloxy resin, polysilazane resin, polyurethane resin, fluororesin, and polyolefin resin) as the adhesive.

關於導電塗佈液中可含有之交聯劑，可於並不損及本發明之效果之範圍內採用任意適宜之交聯劑。交聯劑可僅為1種，亦可為2種以上。作為此種交聯劑，可較佳地例舉：異氰酸酯系交聯劑、環氧系交聯劑、三聚氰胺系交聯劑、過氧化物系交聯劑、以及脲系交聯劑、金屬烷氧化物系交聯劑、金屬螯合物系交聯劑、金屬鹽系交聯劑、碳二醯亞胺系交聯劑、㗁唑啉系交聯劑、氮丙啶系交聯劑、胺系交聯劑等。其中，較佳為三聚氰胺系交聯劑。As for the cross-linking agent that may be contained in the conductive coating liquid, any appropriate cross-linking agent may be used within the scope that does not impair the effects of the present invention. There may be only one type of cross-linking agent, or two or more types of cross-linking agents. Preferred examples of such cross-linking agents include isocyanate-based cross-linking agents, epoxy-based cross-linking agents, melamine-based cross-linking agents, peroxide-based cross-linking agents, urea-based cross-linking agents, and metal alkane Oxide-based cross-linking agents, metal chelate-based cross-linking agents, metal salt-based cross-linking agents, carbodiimide-based cross-linking agents, oxazoline-based cross-linking agents, aziridine-based cross-linking agents, amines Cross-linking agent, etc. Among them, a melamine-based cross-linking agent is preferred.

抗靜電層(3c)中之交聯劑之含有比率較佳為1重量%～30重量%，更佳為2重量%～20重量%。The content ratio of the cross-linking agent in the antistatic layer (3c) is preferably 1% to 30% by weight, more preferably 2% to 20% by weight.

抗靜電層(3c)中可於並不損及本發明之效果之範圍內含有任意適宜之其他成分。The antistatic layer (3c) may contain any appropriate other components within the scope that does not impair the effect of the present invention.

≪≪2.積層體之製造方法≫≫ 本發明之積層體可於並不損及本發明之效果之範圍內藉由任意適宜之方法製造。≪≪2. Manufacturing method of laminated body≫≫ The laminated body of the present invention can be produced by any appropriate method within the scope that does not impair the effects of the present invention.

作為本發明之積層體之製造方法之代表例，就本發明之積層體依序具有樹脂膜(1)、黏著劑層(1)、樹脂膜(2)、黏著劑層(2)、樹脂膜(3)且包含該等構成要素之積層體的情況進行說明。As a representative example of the manufacturing method of the laminated body of the present invention, the laminated body of the present invention has a resin film (1), an adhesive layer (1), a resin film (2), an adhesive layer (2), and a resin film in this order. (3) and the case of a laminated body containing these components will be described.

於本發明之積層體之製造方法之一實施形態中，分別製造依序具有樹脂膜(1)、黏著劑層(1)、樹脂膜(2)且包含該等構成要素之積層體(I)、及依序具有黏著劑層(2)與樹脂膜(3)且包含該等構成要素之積層體(II)，其後，將積層體(I)之樹脂膜(2)之面與積層體(II)之黏著劑層(2)之面進行貼附。In one embodiment of the method for manufacturing a laminated body of the present invention, a laminated body (I) having a resin film (1), an adhesive layer (1), and a resin film (2) in this order and including these components is produced. , and a laminated body (II) having an adhesive layer (2) and a resin film (3) in sequence and including these constituent elements, and then connecting the surface of the resin film (2) of the laminated body (I) to the laminated body (II) is attached to the adhesive layer (2).

積層體(I)例如可藉由以下方式製造：於樹脂膜(2)上塗佈形成構成黏著劑層(1)之黏著劑之黏著劑組合物(選自由丙烯酸系黏著劑組合物、胺基甲酸酯系黏著劑組合物、橡膠系黏著劑組合物、聚矽氧系黏著劑組合物所組成之群中之至少1種)，視需要進行加熱、乾燥後，視需要使之硬化，而於該樹脂膜(2)上形成該黏著劑層(1)，其後，於該黏著劑層(1)之與該樹脂膜(2)之相反側之面貼附樹脂膜(1)(具有離型層(1b)時之其側)。The laminated body (I) can be produced, for example, by applying an adhesive composition (selected from an acrylic adhesive composition, an amine-based adhesive composition, etc.) to form an adhesive constituting the adhesive layer (1) on the resin film (2). At least one of the group consisting of a formate-based adhesive composition, a rubber-based adhesive composition, and a polysiloxane-based adhesive composition), after heating and drying as necessary, hardening it as necessary, and The adhesive layer (1) is formed on the resin film (2), and then the resin film (1) (having The release layer (1b) is on its side).

積層體(II)例如可藉由以下方式製造：於樹脂膜(3)上塗佈形成構成黏著劑層(2)之黏著劑之黏著劑組合物(較佳為丙烯酸系黏著劑組合物)，視需要進行加熱、乾燥後，視需要使之硬化，而於該樹脂膜(3)上形成該黏著劑層(2)。再者，於將積層體(I)與積層體(II)進行貼附之前的期間，為了保護黏著劑層(2)之露出面，亦可貼附任意適宜之隔離件(例如，與樹脂膜(1)相同之膜)。 [實施例]The laminated body (II) can be produced, for example, by applying an adhesive composition (preferably an acrylic adhesive composition) forming an adhesive constituting the adhesive layer (2) on the resin film (3), After heating and drying if necessary, it is hardened if necessary, and the adhesive layer (2) is formed on the resin film (3). Furthermore, before attaching the laminated body (I) and the laminated body (II), in order to protect the exposed surface of the adhesive layer (2), any appropriate spacer (for example, a resin film) may be attached. (1) Same film). [Example]

以下，藉由實施例來具體地說明本發明，但本發明並不受該等實施例之任何限定。再者，實施例等中之試驗及評價方法如下所述。再者，於記為「份」之情形時，無特別說明則意指「重量份」，於記為「%」情形時，無特別說明則意指「重量%」。Hereinafter, the present invention will be described in detail through examples, but the present invention is not limited by these examples. In addition, the test and evaluation methods in Examples etc. are as follows. Furthermore, when expressed as "parts", it means "parts by weight" unless otherwise specified, and when expressed as "%", it means "% by weight" unless otherwise specified.

＜重量平均分子量之測定＞ 重量平均分子量係藉由凝膠滲透層析(GPC)法測定。具體而言，作為GPC測定裝置，使用商品名「HLC-8120GPC」(Tosoh股份有限公司製造)，於下述條件下進行測定，藉由標準聚苯乙烯換算值而算出。 (分子量測定條件) ・樣品濃度：0.2重量%(四氫呋喃溶液) ・樣品注入量：10 μL ・管柱：商品名「TSKguardcolumn SuperHZ-H(1根)＋TSKgel SuperHZM-H(2根)」(Tosoh股份有限公司製造) ・參考管柱：商品名「TSKgel SuperH-RC(1根)」(Tosoh股份有限公司製造) ・溶離液：四氫呋喃(THF) ・流量：0.6 mL/min ・檢測器：示差折射計(RI) ・管柱溫度(測定溫度)：40℃＜Measurement of weight average molecular weight＞ The weight average molecular weight is determined by gel permeation chromatography (GPC). Specifically, as a GPC measuring device, a trade name "HLC-8120GPC" (manufactured by Tosoh Co., Ltd.) was used, the measurement was performed under the following conditions, and the value was calculated based on the standard polystyrene conversion value. (Molecular weight measurement conditions) ・Sample concentration: 0.2% by weight (tetrahydrofuran solution) ・Sample injection volume: 10 μL ・Column: Trade name "TSKguardcolumn SuperHZ-H (1 piece) + TSKgel SuperHZM-H (2 pieces)" (manufactured by Tosoh Co., Ltd.) ・Reference column: Trade name "TSKgel SuperH-RC (1 piece)" (manufactured by Tosoh Co., Ltd.) ・Eluent: Tetrahydrofuran (THF) ・Flow rate: 0.6 mL/min ・Detector: Differential Refractometer (RI) ・Column temperature (measurement temperature): 40℃

＜以剝離角度180度、剝離速度30 mm/分鐘自樹脂膜(2)剝離黏著劑層(2)時之黏著力之測定＞ 將10 cm×10 cm之積層體(I)之隔離件剝離，於溫度23℃、濕度50%RH之環境下，藉由手壓輥將評價用樣品之黏著劑層表面貼附於10 cm×10 cm玻璃板(松浪硝子工業股份有限公司製造，商品名：MICRO SLIDE GLASS S)，其後，以0.25 MPa之壓力進行壓接。將經預先除電之附隔離件之表面保護膜(亦可稱為載體片材)切割成寬度25 mm、長度150 mm，於溫度23℃、濕度50%RH之環境下，藉由2.0 kg輥一次往返而貼附於固定在玻璃上之積層體(I)之樹脂膜側，其後，以0.25 MPa之壓力進行壓接。於溫度23℃、濕度50%RH之環境下進行30分鐘熟化後，使用萬能拉伸試驗機(Minebea股份有限公司製造，製品名：TCM-1kNB)，以剝離角度180度、剝離速度30 mm/分鐘自樹脂膜(2)剝離黏著劑層(2)，測定黏著力。<Measurement of the adhesive force when peeling the adhesive layer (2) from the resin film (2) at a peeling angle of 180 degrees and a peeling speed of 30 mm/min> Peel off the separator of the 10 cm×10 cm laminated body (I), and stick the adhesive layer surface of the evaluation sample on the 10 cm×10 cm 10 cm glass plate (manufactured by Shonami Glass Industry Co., Ltd., trade name: MICRO SLIDE GLASS S), and then crimped with a pressure of 0.25 MPa. Cut the pre-decharged surface protective film with separator (also called a carrier sheet) into a width of 25 mm and a length of 150 mm, and pass it through a 2.0 kg roller at a temperature of 23°C and a humidity of 50% RH. It is attached to the resin film side of the laminate (I) fixed on the glass in a reciprocating manner, and then pressed with a pressure of 0.25 MPa. After aging for 30 minutes in an environment with a temperature of 23°C and a humidity of 50% RH, use a universal tensile testing machine (manufactured by Minebea Co., Ltd., product name: TCM-1kNB) to peel at a peeling angle of 180 degrees and a peeling speed of 30 mm/ Peel off the adhesive layer (2) from the resin film (2) within 1 minute, and measure the adhesive force.

＜以剝離角度180度、剝離速度300 mm/分鐘自樹脂膜(2)剝離黏著劑層(2)時之黏著力之測定＞ 將10 cm×10 cm之積層體(I)之隔離件剝離，於溫度23℃、濕度50%RH之環境下，藉由手壓輥將評價用樣品之黏著劑層表面貼附於10 cm×10 cm玻璃板(松浪硝子工業股份有限公司製造，商品名：MICRO SLIDE GLASS S)，其後，以0.25 MPa之壓力進行壓接。將經預先除電之附隔離件之表面保護膜(亦可稱為載體片材)切割成寬度25 mm、長度150 mm，於溫度23℃、濕度50%RH之環境下，藉由2.0 kg輥一次往返而貼附於固定在玻璃上之積層體(I)之樹脂膜側，其後，以0.25 MPa之壓力進行壓接。於溫度23℃、濕度50%RH之環境下進行30分鐘熟化後，使用萬能拉伸試驗機(Minebea股份有限公司製造，製品名：TCM-1kNB)，以剝離角度180度、剝離速度300 mm/分鐘自樹脂膜(2)剝離黏著劑層(2)，測定黏著力。<Measurement of the adhesive force when the adhesive layer (2) is peeled off the resin film (2) at a peeling angle of 180 degrees and a peeling speed of 300 mm/min> Peel off the separator of the 10 cm×10 cm laminated body (I), and stick the adhesive layer surface of the evaluation sample on the 10 cm×10 cm 10 cm glass plate (manufactured by Shonami Glass Industry Co., Ltd., trade name: MICRO SLIDE GLASS S), and then crimped with a pressure of 0.25 MPa. Cut the pre-decharged surface protective film with separator (also called a carrier sheet) into a width of 25 mm and a length of 150 mm, and pass it through a 2.0 kg roller at a temperature of 23°C and a humidity of 50% RH. It is attached to the resin film side of the laminate (I) fixed on the glass in a reciprocating manner, and then pressed with a pressure of 0.25 MPa. After aging for 30 minutes in an environment with a temperature of 23°C and a humidity of 50% RH, use a universal tensile testing machine (manufactured by Minebea Co., Ltd., product name: TCM-1kNB) to peel at a peeling angle of 180 degrees and a peeling speed of 300 mm/ Peel off the adhesive layer (2) from the resin film (2) within 1 minute, and measure the adhesive force.

＜以剝離角度180度、剝離速度2400 mm/分鐘自樹脂膜(2)剝離黏著劑層(2)時之黏著力之測定＞ 將10 cm×10 cm之積層體(I)之隔離件剝離，於溫度23℃、濕度50%RH之環境下，藉由手壓輥將評價用樣品之黏著劑層表面貼附於10 cm×10 cm玻璃板(松浪硝子工業股份有限公司製造，商品名：MICRO SLIDE GLASS S)，其後，以0.25 MPa之壓力進行壓接。將經預先除電之附隔離件之表面保護膜(亦可稱為載體片材)切割成寬度25 mm、長度150 mm，於溫度23℃、濕度50%RH之環境下，藉由2.0 kg輥一次往返而貼附於固定在玻璃上之積層體(I)之樹脂膜側，其後，以0.25 MPa之壓力進行壓接。於溫度23℃、濕度50%RH之環境下進行30分鐘熟化後，使用萬能拉伸試驗機(Minebea股份有限公司製造，製品名：TCM-1kNB)，以剝離角度180度、剝離速度2400 mm/分鐘自樹脂膜(2)剝離黏著劑層(2)，測定黏著力。<Measurement of the adhesive force when peeling the adhesive layer (2) from the resin film (2) at a peeling angle of 180 degrees and a peeling speed of 2400 mm/min> Peel off the separator of the 10 cm×10 cm laminated body (I), and stick the adhesive layer surface of the evaluation sample on the 10 cm×10 cm 10 cm glass plate (manufactured by Shonami Glass Industry Co., Ltd., trade name: MICRO SLIDE GLASS S), and then crimped with a pressure of 0.25 MPa. Cut the pre-decharged surface protective film with separator (also called a carrier sheet) into a width of 25 mm and a length of 150 mm, and pass it through a 2.0 kg roller at a temperature of 23°C and a humidity of 50% RH. It is attached to the resin film side of the laminate (I) fixed on the glass in a reciprocating manner, and then pressed with a pressure of 0.25 MPa. After aging for 30 minutes in an environment with a temperature of 23°C and a humidity of 50% RH, use a universal tensile testing machine (manufactured by Minebea Co., Ltd., product name: TCM-1kNB) to peel at a peeling angle of 180 degrees and a peeling speed of 2400 mm/ Peel off the adhesive layer (2) from the resin film (2) within 1 minute, and measure the adhesive force.

＜黏著力(1)之測定＞ 將包含樹脂膜(1)/黏著劑層(1)/樹脂膜(2)之積層體(I)切割成寬度25 mm、長度150 mm而製作評價用樣品。於溫度23℃、濕度50%RH之環境下，自所製作之評價用樣品剝離樹脂膜(1)，藉由2.0 kg輥一次往返而貼附於玻璃板(松浪硝子工業股份有限公司製造，商品名：MICRO SLIDE GLASS S)。於溫度23℃、濕度50%RH之環境下進行30分鐘熟化後，使用萬能拉伸試驗機，以剝離角度180度、剝離速度300 mm/分鐘剝離，測定黏著力(1)。＜Measurement of Adhesion (1)＞ The laminated body (I) including the resin film (1)/adhesive layer (1)/resin film (2) was cut into a width of 25 mm and a length of 150 mm to prepare a sample for evaluation. In an environment with a temperature of 23°C and a humidity of 50% RH, peel off the resin film (1) from the prepared sample for evaluation and attach it to the glass plate (manufactured by Shonami Glass Industry Co., Ltd., product Name: MICRO SLIDE GLASS S). After curing for 30 minutes in an environment with a temperature of 23°C and a humidity of 50% RH, use a universal tensile testing machine to peel off at a peeling angle of 180 degrees and a peeling speed of 300 mm/min to measure the adhesion (1).

＜黏著力(2)之測定＞ 將包含隔離件/黏著劑層(2)/樹脂膜(3)之附隔離件之積層體(II)切割成寬度25 mm、長度150 mm而製作評價用樣品。另外，預先準備＜黏著力(1)之測定＞之項目中所說明之自積層體(I)剝離樹脂膜(1)後貼附於玻璃板而成之被黏著體，於溫度23℃、濕度50%RH之環境下，自上述評價用樣品將隔離件剝離，藉由2.0 kg輥一次往返而貼附於上述被黏著體。於溫度23℃、濕度50%RH之環境下進行30分鐘熟化後，使用萬能拉伸試驗機，以剝離角度180度、剝離速度300 mm/分鐘進行剝離，測定黏著力(2)。＜Measurement of Adhesion (2)＞ The separator-attached laminated body (II) containing the separator/adhesive layer (2)/resin film (3) was cut into a width of 25 mm and a length of 150 mm to prepare a sample for evaluation. In addition, prepare in advance the adherend obtained by peeling off the resin film (1) from the laminated body (I) and attaching it to the glass plate as described in the item "Measurement of Adhesion (1)", and test it at a temperature of 23°C and a humidity of In an environment of 50% RH, the separator was peeled off from the above-mentioned evaluation sample and attached to the above-mentioned adherend with a single reciprocation of a 2.0 kg roller. After curing for 30 minutes in an environment with a temperature of 23°C and a humidity of 50% RH, use a universal tensile testing machine to peel off at a peeling angle of 180 degrees and a peeling speed of 300 mm/min to measure the adhesion (2).

＜全光線透過率、霧度之測定＞ 使用村上色彩技術研究所之HM-150N，於JIS-K-7361之條件下測定全光線透過率，於JIS-K-7136之條件下測定霧度。此時，以樹脂膜(3)朝向光源側之方式設置5層積層品。＜Measurement of total light transmittance and haze＞ The total light transmittance was measured under the conditions of JIS-K-7361 and the haze was measured under the conditions of JIS-K-7136 using the HM-150N of Murakami Color Technology Research Institute. At this time, the five-layer laminated product is installed so that the resin film (3) faces the light source side.

＜浮起之測定＞ 將積層體(I)切割成寬度50 mm、長度300 mm，藉由CO2 雷射以寬度5 mm且等間隔地於5處自樹脂膜(2)側半切至樹脂膜(1)之面(即，樹脂膜(1)未被切斷)，用手去除5 mm寬度之部分。其後，將切割成寬度60 mm、長度400 mm之積層體(II)之黏著劑層(2)之面貼附於積層體(I)之樹脂膜(2)之面，製成測定樣品。 將測定樣品以樹脂膜(1)成為外側之方式捲繞於直徑為6英吋之捲筒上，於放大鏡下測定分開之複數個黏著劑層(1)與樹脂膜(2)之積層部分自黏著劑層(2)浮起之最大量，取任意5個部位之測定之平均值作為浮起量。<Measurement of Lifting> Cut the laminate (I) into a width of 50 mm and a length of 300 mm, and use a CO 2 laser to cut in half from the resin film (2) side to the resin film at 5 points with a width of 5 mm and equal intervals. (1) (that is, the resin film (1) has not been cut), remove the 5 mm wide part by hand. Thereafter, the surface of the adhesive layer (2) of the laminated body (II) cut into a width of 60 mm and a length of 400 mm was attached to the surface of the resin film (2) of the laminated body (I) to prepare a measurement sample. The measurement sample is wound on a roll with a diameter of 6 inches with the resin film (1) on the outside, and the laminated portion of the separated plurality of adhesive layers (1) and the resin film (2) is measured under a magnifying glass. For the maximum floating amount of the adhesive layer (2), take the average value of the measurements at any five locations as the floating amount.

〔製造例1〕黏著劑組合物(1)之製造 於具備攪拌翼、溫度計、氮氣導入管、冷凝器之四口燒瓶中添加丙烯酸丁酯(日本觸媒公司製造)95份、丙烯酸(東亞合成公司製造)5份、作為聚合起始劑之2,2'-偶氮二異丁腈(和光純藥工業公司製造)0.2份及乙酸乙酯156重量份，一面緩慢地攪拌一面導入氮氣，將燒瓶內之液溫保持於63℃左右而進行10小時之聚合反應，製備重量平均分子量70萬之(甲基)丙烯酸系聚合物(1)溶液(40重量%)。於(甲基)丙烯酸系聚合物(1)溶液中，添加相對於(甲基)丙烯酸系聚合物(1)溶液之固形物成分100重量份而言以固形物成分換算計為6重量份之TETRAD-C(三菱瓦斯化學公司製造)作為交聯劑，使用乙酸乙酯進行稀釋以使全部固形物成分成為20重量%，利用分散機進行攪拌，獲得包含丙烯酸系樹脂之黏著劑組合物(1)。[Manufacture Example 1] Production of adhesive composition (1) Add 95 parts of butyl acrylate (manufactured by Nippon Shokubai Co., Ltd.), 5 parts of acrylic acid (manufactured by Toa Gosei Co., Ltd.), and 2 of the polymerization initiators into a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen gas inlet pipe, and a condenser. 0.2 parts by weight of 2'-azobisisobutyronitrile (manufactured by Wako Pure Chemical Industries, Ltd.) and 156 parts by weight of ethyl acetate were introduced into the flask while slowly stirring, and the liquid temperature in the flask was maintained at about 63°C for 10 hours. The polymerization reaction was carried out to prepare a (meth)acrylic polymer (1) solution (40% by weight) with a weight average molecular weight of 700,000. To the (meth)acrylic polymer (1) solution, add 6 parts by weight in terms of solid content relative to 100 parts by weight of the solid content of the (meth)acrylic polymer (1) solution. TETRAD-C (manufactured by Mitsubishi Gas Chemical Co., Ltd.) was used as a cross-linking agent, diluted with ethyl acetate so that the total solid content became 20% by weight, and stirred with a disperser to obtain an adhesive composition (1) containing an acrylic resin. ).

〔製造例2〕黏著劑組合物(2)之製造 於具備攪拌翼、溫度計、氮氣導入管、冷凝器之四口燒瓶中添加丙烯酸2-乙基己酯(日本觸媒公司製造)100重量份、丙烯酸2-羥基乙酯(東亞合成公司製造)4重量份、作為聚合起始劑之2,2'-偶氮二異丁腈(和光純藥工業公司製造)0.2重量份及乙酸乙酯156重量份，一面緩慢地攪拌一面導入氮氣，將燒瓶內之液溫保持於65℃左右進行8小時聚合反應，製備重量平均分子量55萬之(甲基)丙烯酸系聚合物(2)溶液(40重量%)。於(甲基)丙烯酸系聚合物(2)溶液中，添加相對於(甲基)丙烯酸系聚合物(2)溶液之固形物成分100重量份而言以固形物成分換算計為4重量份之Coronate HX(Tosoh公司製造)作為交聯劑，以固形物成分換算計為0.01重量份之EMBILIZER OL-1(Tokyo Fine Chemical公司製造)作為交聯觸媒，使用乙酸乙酯進行稀釋以使全部固形物成分成為25重量%，利用分散機進行攪拌，獲得包含丙烯酸系樹脂之黏著劑組合物(2)。[Manufacture Example 2] Production of adhesive composition (2) Add 100 parts by weight of 2-ethylhexyl acrylate (manufactured by Nippon Shokubai Co., Ltd.) and 2-hydroxyethyl acrylate (manufactured by Toagosei Co., Ltd.) into a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen introduction tube, and a condenser. 0.2 parts by weight of 2,2'-azobisisobutyronitrile (manufactured by Wako Pure Chemical Industries, Ltd.) as a polymerization initiator and 156 parts by weight of ethyl acetate were introduced into the flask while stirring slowly. The liquid temperature was maintained at about 65° C., and a polymerization reaction was performed for 8 hours to prepare a (meth)acrylic polymer (2) solution (40% by weight) with a weight average molecular weight of 550,000. To the (meth)acrylic polymer (2) solution, add 4 parts by weight in terms of solid content relative to 100 parts by weight of the solid content of the (meth)acrylic polymer (2) solution. Coronate HX (manufactured by Tosoh Co., Ltd.) was used as a cross-linking agent, and 0.01 parts by weight of EMBILIZER OL-1 (manufactured by Tokyo Fine Chemical Co., Ltd.) in terms of solid content was used as a cross-linking catalyst. It was diluted with ethyl acetate so that all solid contents The composition was adjusted to 25% by weight, and the mixture was stirred using a disperser to obtain an adhesive composition (2) containing an acrylic resin.

〔製造例3〕黏著劑組合物(3)之製造 將作為交聯觸媒之EMBILIZER OL-1之使用量設為以固形物成分換算計之0.05重量份，除此以外，藉由與製造例2相同之步驟獲得包含丙烯酸系樹脂之黏著劑組合物(3)。[Manufacture Example 3] Production of adhesive composition (3) An adhesive composition containing an acrylic resin was obtained by the same procedure as Production Example 2 except that the usage amount of EMBILIZER OL-1 as a cross-linking catalyst was 0.05 parts by weight in terms of solid content. (3).

〔製造例4〕黏著劑組合物(4)之製造 於具備攪拌翼、溫度計、氮氣導入管、冷凝器之四口燒瓶中添加丙烯酸2-乙基己酯(日本觸媒公司製造)100重量份、乙酸乙烯酯單體(昭和電工公司製造)80重量份、丙烯酸(東亞合成公司製造)5重量份及甲苯45重量份，一面緩慢地攪拌一面導入氮氣，放入Nyper BW(日油公司製造)0.2重量份作為聚合起始劑，將燒瓶內之液溫保持於40℃左右進行3小時聚合反應，製備重量平均分子量70萬之(甲基)丙烯酸系聚合物(4)溶液(35重量%)。於(甲基)丙烯酸系聚合物(4)溶液中，添加相對於(甲基)丙烯酸系聚合物(4)溶液之固形物成分100重量份而言以固形物成分換算計為10重量份之TETRAD-C(三菱瓦斯化學公司製造)作為交聯劑，使用甲基乙基酮進行稀釋以使全部固形物成分成為20重量%，利用分散機進行攪拌，獲得包含丙烯酸系樹脂之黏著劑組合物(4)。[Manufacture Example 4] Production of adhesive composition (4) 100 parts by weight of 2-ethylhexyl acrylate (manufactured by Nippon Shokubai Co., Ltd.) and 80 parts by weight of vinyl acetate monomer (manufactured by Showa Denko Co., Ltd.) were added to a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen introduction tube, and a condenser. parts, 5 parts by weight of acrylic acid (manufactured by Toagosei Co., Ltd.) and 45 parts by weight of toluene, introduce nitrogen while stirring slowly, add 0.2 parts by weight of Nyper BW (manufactured by NOF Corporation) as a polymerization initiator, and add the liquid in the flask The temperature was kept at about 40° C. and a polymerization reaction was performed for 3 hours to prepare a (meth)acrylic polymer (4) solution (35% by weight) with a weight average molecular weight of 700,000. To the (meth)acrylic polymer (4) solution, add 10 parts by weight in terms of solid content relative to 100 parts by weight of the solid content of the (meth)acrylic polymer (4) solution. TETRAD-C (manufactured by Mitsubishi Gas Chemical Co., Ltd.) was used as a cross-linking agent, diluted with methyl ethyl ketone so that the total solid content became 20% by weight, and stirred with a disperser to obtain an adhesive composition containing an acrylic resin. (4).

〔製造例5〕黏著劑組合物(5)之製造 添加以固形物成分換算計100重量份之PREMINOL S3011(旭硝子股份有限公司製造，Mn＝10000)作為多官能多元醇，以固形物成分換算計18重量份之Coronate HX(Nippon Polyurethane Industry公司製造)作為交聯劑，以固形物成分換算計0.04重量份之三乙醯丙酮鐵(日本化學產業公司製造)作為交聯觸媒，以固形物成分換算計0.5重量份之Irganox1010(BASF公司製造)作為防劣化劑，利用乙酸乙酯進行稀釋以使全部固形物成分成為35重量%，利用分散機進行攪拌，獲得包含胺基甲酸酯系樹脂之黏著劑組合物(5)。[Manufacture Example 5] Production of adhesive composition (5) 100 parts by weight of PREMINOL S3011 (manufactured by Asahi Glass Co., Ltd., Mn=10000) in terms of solid content was added as a polyfunctional polyol, and 18 parts by weight of Coronate HX (manufactured by Nippon Polyurethane Industry Co., Ltd.) in terms of solid content was added. The cross-linking agent is 0.04 parts by weight of iron triacetyl acetonate (manufactured by Nippon Chemical Industry Co., Ltd.) in terms of solid content as the cross-linking catalyst, and 0.5 parts by weight of Irganox 1010 (manufactured by BASF) in terms of solid content as the cross-linking agent. The deteriorating agent was diluted with ethyl acetate so that the total solid content became 35% by weight, and stirred with a disperser to obtain an adhesive composition (5) containing a urethane resin.

〔製造例6〕黏著劑組合物(6)之製造 將作為交聯劑之TETRAD-C(三菱瓦斯化學公司製造)之使用量設為以固形物成分換算計之0.07重量份，除此以外，藉由與製造例1相同之步驟獲得包含丙烯酸系樹脂之黏著劑組合物(6)。[Manufacture Example 6] Production of adhesive composition (6) An acrylic resin was obtained by the same procedure as in Production Example 1 except that the usage amount of TETRAD-C (manufactured by Mitsubishi Gas Chemical Co., Ltd.) as a cross-linking agent was 0.07 parts by weight in terms of solid content. Adhesive composition (6).

〔製造例7〕積層體(A)之製造 利用槽輥於包含聚酯樹脂之基材「Lumirror S10」(厚度75 μm，TORAY公司製造)上以乾燥後之厚度成為15 μm之方式塗佈製造例6中獲得之黏著劑組合物(6)，於乾燥溫度130℃、乾燥時間2分鐘之條件下進行固化、乾燥。如此於基材上製作黏著劑層。繼而，於黏著劑層之表面貼合一面經聚矽氧處理之厚度75 μm之包含聚酯樹脂「Lumirror S10」(厚度75 μm，TORAY公司製造)之基材之聚矽氧處理面，獲得樹脂膜(附聚矽氧處理面)/黏著劑層/樹脂膜之構成之積層體(A)。[Manufacture Example 7] Production of laminated body (A) The adhesive composition (6) obtained in Production Example 6 was applied with a grooved roller on the base material "Lumirror S10" (thickness 75 μm, manufactured by TORAY Co., Ltd.) containing polyester resin so that the thickness after drying became 15 μm. , solidify and dry at a drying temperature of 130°C and a drying time of 2 minutes. In this way, an adhesive layer is formed on the substrate. Then, a silicone-treated surface of a base material containing polyester resin "Lumirror S10" (thickness 75 μm, manufactured by TORAY Co., Ltd.) with a thickness of 75 μm was bonded to the surface of the adhesive layer to obtain a resin. A laminate (A) consisting of film (agglomerated silicone treated surface)/adhesive layer/resin film.

〔製造例8〕積層體(B1)之製造 利用槽輥於包含聚酯樹脂之基材「Lumirror S10」(厚度38 μm，TORAY公司製造)以乾燥後之厚度成為5 μm之方式塗佈製造例1中獲得之黏著劑組合物(1)，於乾燥溫度130℃、乾燥時間30秒之條件下進行固化、乾燥。如此於基材上製作黏著劑層。繼而，於黏著劑層之表面貼合一面經聚矽氧處理之厚度25 μm之包含聚酯樹脂之基材之聚矽氧處理面，獲得隔離件/黏著劑層/樹脂膜之構成之積層體(B1)。[Manufacture Example 8] Production of laminated body (B1) The adhesive composition (1) obtained in Production Example 1 was applied using a grooved roller to the base material "Lumirror S10" (thickness 38 μm, manufactured by TORAY Co., Ltd.) containing polyester resin so that the thickness after drying became 5 μm. Curing and drying are performed at a drying temperature of 130°C and a drying time of 30 seconds. In this way, an adhesive layer is formed on the substrate. Then, a silicone-treated surface of a substrate containing polyester resin with a thickness of 25 μm was bonded to the surface of the adhesive layer to obtain a laminate composed of a separator/adhesive layer/resin film. (B1).

〔製造例9〕積層體(B2)之製造 將包含聚酯樹脂之基材「Lumirror S10」(厚度38 μm，TORAY公司製造)變更為「Lumirror S10」(厚度50 μm，TORAY公司製造)，除此以外，藉由與製造例8相同之步驟獲得隔離件/黏著劑層/樹脂膜之構成之積層體(B2)。[Manufacture Example 9] Production of laminated body (B2) The same procedure as Production Example 8 was used except that the base material "Lumirror S10" (thickness 38 μm, manufactured by TORAY Co., Ltd.) containing polyester resin was changed to "Lumirror S10" (thickness 50 μm, manufactured by TORAY Co., Ltd.). A laminate consisting of a separator/adhesive layer/resin film is obtained (B2).

〔製造例10〕積層體(B3)之製造 將包含聚酯樹脂之基材「Lumirror S10」(厚度38 μm，TORAY公司製造)變更為基材「Lumirror S10」(厚度75 μm，TORAY公司製造)，並將黏著劑層之厚度變更為15 μm，除此以外，藉由與製造例8相同之步驟獲得隔離件/黏著劑層/樹脂膜之構成之積層體(B3)。[Manufacture Example 10] Production of laminated body (B3) The base material "Lumirror S10" (thickness 38 μm, manufactured by TORAY Co., Ltd.) containing polyester resin was changed to the base material "Lumirror S10" (thickness 75 μm, manufactured by TORAY Co., Ltd.), and the thickness of the adhesive layer was changed to 15 μm , except for this, a laminated body (B3) composed of a separator/adhesive layer/resin film was obtained by the same procedure as in Production Example 8.

〔製造例11〕積層體(B4)之製造 利用槽輥於包含聚酯樹脂之基材「Lumirror S10」(厚度38 μm，TORAY公司製造)以乾燥後之厚度成為20 μm之方式塗佈製造例2中獲得之黏著劑組合物(2)，於乾燥溫度130℃、乾燥時間30秒之條件下進行固化、乾燥。如此於基材上製作黏著劑層。繼而，於黏著劑層之表面貼合一面經聚矽氧處理之厚度25 μm之包含聚酯樹脂之基材之聚矽氧處理面，獲得隔離件/黏著劑層/樹脂膜之構成之積層體(B4)。[Manufacture Example 11] Production of laminated body (B4) The adhesive composition (2) obtained in Production Example 2 was applied using a grooved roller to the base material "Lumirror S10" (thickness 38 μm, manufactured by TORAY Co., Ltd.) containing polyester resin so that the thickness after drying became 20 μm. Curing and drying are performed at a drying temperature of 130°C and a drying time of 30 seconds. In this way, an adhesive layer is formed on the substrate. Then, a silicone-treated surface of a substrate containing polyester resin with a thickness of 25 μm was bonded to the surface of the adhesive layer to obtain a laminate composed of a separator/adhesive layer/resin film. (B4).

〔製造例12〕積層體(B5)之製造 利用槽輥於包含聚酯樹脂之基材「Lumirror S10」(厚度38 μm，TORAY公司製造)以乾燥後之厚度成為20 μm之方式塗佈製造例3中獲得之黏著劑組合物(3)，於乾燥溫度130℃、乾燥時間30秒之條件下進行固化、乾燥。如此於基材上製作黏著劑層。繼而，於黏著劑層之表面貼合一面經聚矽氧處理之厚度25 μm之包含聚酯樹脂之基材之聚矽氧處理面，獲得隔離件/黏著劑層/樹脂膜之構成之積層體(B5)。[Manufacture Example 12] Production of laminated body (B5) The adhesive composition (3) obtained in Production Example 3 was applied using a grooved roller to the base material "Lumirror S10" (thickness 38 μm, manufactured by TORAY Co., Ltd.) containing polyester resin so that the thickness after drying became 20 μm. Curing and drying are performed at a drying temperature of 130°C and a drying time of 30 seconds. In this way, an adhesive layer is formed on the substrate. Then, a silicone-treated surface of a substrate containing polyester resin with a thickness of 25 μm was bonded to the surface of the adhesive layer to obtain a laminate composed of a separator/adhesive layer/resin film. (B5).

〔製造例13〕積層體(B6)之製造 利用槽輥於包含聚酯樹脂之基材「Lumirror S10」(厚度38 μm，TORAY公司製造)以乾燥後之厚度成為20 μm之方式塗佈製造例4中獲得之黏著劑組合物(4)，於乾燥溫度130℃、乾燥時間30秒之條件下進行固化、乾燥。如此於基材上製作黏著劑層。繼而，於黏著劑層之表面貼合一面經聚矽氧處理之厚度25 μm之包含聚酯樹脂之基材之聚矽氧處理面，獲得隔離件/黏著劑層/樹脂膜之構成之積層體(B6)。[Manufacture Example 13] Production of laminated body (B6) The adhesive composition (4) obtained in Production Example 4 was applied using a grooved roller to the base material "Lumirror S10" (thickness 38 μm, manufactured by TORAY Co., Ltd.) containing polyester resin so that the thickness after drying became 20 μm. Curing and drying are performed at a drying temperature of 130°C and a drying time of 30 seconds. In this way, an adhesive layer is formed on the substrate. Then, a silicone-treated surface of a substrate containing polyester resin with a thickness of 25 μm was bonded to the surface of the adhesive layer to obtain a laminate composed of a separator/adhesive layer/resin film. (B6).

〔製造例14〕積層體(B7)之製造 利用槽輥於包含聚酯樹脂之基材「Lumirror S10」(厚度38 μm，TORAY公司製造)以乾燥後之厚度成為12 μm之方式塗佈製造例5中獲得之黏著劑組合物(5)，於乾燥溫度130℃、乾燥時間30秒之條件下進行固化、乾燥。如此於基材上製作黏著劑層。繼而，於黏著劑層之表面貼合一面經聚矽氧處理之厚度25 μm之包含聚酯樹脂之基材之聚矽氧處理面，獲得隔離件/黏著劑層/樹脂膜之構成之積層體(B7)。[Manufacture Example 14] Production of laminated body (B7) The adhesive composition (5) obtained in Production Example 5 was applied using a grooved roller to the base material "Lumirror S10" (thickness 38 μm, manufactured by TORAY Co., Ltd.) containing polyester resin so that the thickness after drying became 12 μm. Curing and drying are performed at a drying temperature of 130°C and a drying time of 30 seconds. In this way, an adhesive layer is formed on the substrate. Then, a silicone-treated surface of a substrate containing polyester resin with a thickness of 25 μm was bonded to the surface of the adhesive layer to obtain a laminate composed of a separator/adhesive layer/resin film. (B7).

〔實施例1〕 自製造例8中獲得之積層體(B1)將隔離件剝離，於露出之黏著劑層貼附製造例7中獲得之積層體(A)之樹脂膜(未經聚矽氧處理之樹脂膜)側，獲得積層體(1)。將結果示於表1。[Example 1] The separator was peeled off from the laminated body (B1) obtained in Production Example 8, and the resin film of the laminated body (A) obtained in Production Example 7 (resin film without silicone treatment) was attached to the exposed adhesive layer. side to obtain the laminated body (1). The results are shown in Table 1.

〔實施例2〕 自製造例9中獲得之積層體(B2)將隔離件剝離，於露出之黏著劑層貼附製造例7中獲得之積層體(A)之樹脂膜(未經聚矽氧處理之樹脂膜)側，獲得積層體(2)。將結果示於表1。[Example 2] The separator was peeled off from the laminated body (B2) obtained in Production Example 9, and the resin film of the laminated body (A) obtained in Production Example 7 (resin film without silicone treatment) was attached to the exposed adhesive layer. side to obtain the laminated body (2). The results are shown in Table 1.

〔實施例3〕 自製造例10中獲得之積層體(B3)將隔離件剝離，於露出之黏著劑層貼附製造例7中獲得之積層體(A)之樹脂膜(未經聚矽氧處理之樹脂膜)側，獲得積層體(3)。將結果示於表1。[Example 3] The separator was peeled off from the laminated body (B3) obtained in Production Example 10, and the resin film of the laminated body (A) obtained in Production Example 7 (resin film without silicone treatment) was attached to the exposed adhesive layer. side to obtain the layered body (3). The results are shown in Table 1.

〔實施例4〕 自製造例11中獲得之積層體(B4)將隔離件剝離，於露出之黏著劑層貼附製造例7中獲得之積層體(A)之樹脂膜(未經聚矽氧處理之樹脂膜)側，獲得積層體(4)。將結果示於表1。[Example 4] The separator was peeled off from the laminated body (B4) obtained in Production Example 11, and the resin film of the laminated body (A) obtained in Production Example 7 (resin film without silicone treatment) was attached to the exposed adhesive layer. side to obtain the laminated body (4). The results are shown in Table 1.

〔實施例5〕 自製造例12中獲得之積層體(B5)將隔離件剝離，於露出之黏著劑層貼附製造例7中獲得之積層體(A)之樹脂膜(未經聚矽氧處理之樹脂膜)側，獲得積層體(5)。將結果示於表1。[Example 5] The separator was peeled off from the laminated body (B5) obtained in Production Example 12, and the resin film of the laminated body (A) obtained in Production Example 7 (resin film without silicone treatment) was attached to the exposed adhesive layer. side to obtain the layered body (5). The results are shown in Table 1.

〔實施例6〕 自製造例13中獲得之積層體(B6)將隔離件剝離，於露出之黏著劑層貼附製造例7中獲得之積層體(A)之樹脂膜(未經聚矽氧處理之樹脂膜)側，獲得積層體(6)。將結果示於表1。[Example 6] The separator was peeled off from the laminated body (B6) obtained in Production Example 13, and the resin film of the laminated body (A) obtained in Production Example 7 (resin film without silicone treatment) was attached to the exposed adhesive layer. side to obtain the layered body (6). The results are shown in Table 1.

〔比較例1〕 自製造例14中獲得之積層體(B7)將隔離件剝離，於露出之黏著劑層貼附製造例7中獲得之積層體(A)之樹脂膜(未經聚矽氧處理之樹脂膜)側，獲得積層體(C1)。將結果示於表1。[Comparative example 1] The separator was peeled off from the laminated body (B7) obtained in Production Example 14, and the resin film of the laminated body (A) obtained in Production Example 7 (resin film without silicone treatment) was attached to the exposed adhesive layer. side to obtain a laminated body (C1). The results are shown in Table 1.

[表1]    黏著劑層(2)/樹脂膜(2) 黏著力 (gf/25 mm) 浮起 (mm) 黏著力 (1) (gf/ 25 mm) 黏著力 (2) (gf/ 25 mm) 全光線 透過率 (%) 霧度 (%) 剝離速度 30 mm/min 剝離速度 300 mm/min 剝離速度 2400 mm/min 實施例1 1.7 4.0 12.1 0 1800 4.0 90 4.5 實施例2 2.0 3.9 11.2 0 1800 3.9 91 4.3 實施例3 1.9 5.6 12.5 0.03 1800 5.6 90 4.3 實施例4 1.5 5.2 22.2 0.07 1800 5.2 90 4.4 實施例5 1.0 4.7 21.6 0.06 1800 4.7 90 4.5 實施例6 7.6 19.5 45.2 0 1800 19.5 91 4.2 比較例1 0.3 1.1 4.1 0.22 1800 1.1 90 3.8 [產業上之可利用性][Table 1] Adhesive layer (2)/resin film (2) Adhesion (gf/25 mm) Lift(mm) Adhesion (1) (gf/ 25 mm) Adhesion(2) (gf/ 25 mm) Total light transmittance (%) Haze(%) Peeling speed 30 mm/min Peeling speed 300 mm/min Peeling speed 2400 mm/min Example 1 1.7 4.0 12.1 0 1800 4.0 90 4.5 Example 2 2.0 3.9 11.2 0 1800 3.9 91 4.3 Example 3 1.9 5.6 12.5 0.03 1800 5.6 90 4.3 Example 4 1.5 5.2 22.2 0.07 1800 5.2 90 4.4 Example 5 1.0 4.7 21.6 0.06 1800 4.7 90 4.5 Example 6 7.6 19.5 45.2 0 1800 19.5 91 4.2 Comparative example 1 0.3 1.1 4.1 0.22 1800 1.1 90 3.8 [Industrial availability]

本發明之積層體能夠良好地用於光學構件或電子構件之製造步驟等。The laminated body of the present invention can be favorably used in manufacturing steps of optical components or electronic components.

10:樹脂膜(1) 20:黏著劑層(1) 30:樹脂膜(2) 40:黏著劑層(2) 50:樹脂膜(3) 100:積層體10:Resin film(1) 20:Adhesive layer(1) 30:Resin film(2) 40: Adhesive layer (2) 50:Resin film(3) 100:Laminated body

圖1係本發明之積層體之一實施形態之概略剖視圖。FIG. 1 is a schematic cross-sectional view of one embodiment of the laminated body of the present invention.

10:樹脂膜(1) 10:Resin film(1)

20:黏著劑層(1) 20: Adhesive layer (1)

30:樹脂膜(2) 30:Resin film(2)

40:黏著劑層(2) 40: Adhesive layer (2)

50:樹脂膜(3) 50:Resin film(3)

100:積層體 100:Laminated body

Claims (3)

一種積層體，其係依序具有樹脂膜(1)、黏著劑層(1)、樹脂膜(2)、黏著劑層(2)、樹脂膜(3)之5層以上之積層體，且該樹脂膜(2)與該黏著劑層(2)直接積層，該黏著劑層(2)與該樹脂膜(3)直接積層，該黏著劑層(2)與該樹脂膜(3)之積層體部分為載體片材，該黏著劑層(2)包含丙烯酸系黏著劑，該丙烯酸系黏著劑係由丙烯酸系黏著劑組合物形成，該丙烯酸系黏著劑組合物包含丙烯酸系聚合物與交聯劑，該丙烯酸系聚合物係由組合物(B)藉由聚合所形成，該組合物(B)包含(a成分)烷基酯部分之烷基之碳數為4~12之(甲基)丙烯酸烷基酯、(b成分)選自由具有OH基之(甲基)丙烯酸酯及(甲基)丙烯酸所組成之群中之至少1種，相對於構成該丙烯酸系聚合物之單體成分總量，該a成分之含量為50重量%~99重量%，相對於構成該丙烯酸系聚合物之單體成分總量，該b成分之含量為1重量%~30重量%，於溫度23℃、濕度50%RH之環境下以剝離角度180度、剝離速度30mm/分鐘將該黏著劑層(2)自該樹脂膜(2)剝離時之黏著力為1gf/25mm~7gf/25mm。 A laminated body having at least five layers of resin film (1), adhesive layer (1), resin film (2), adhesive layer (2), and resin film (3) in this order, and the The resin film (2) and the adhesive layer (2) are directly laminated, the adhesive layer (2) and the resin film (3) are directly laminated, and the laminate of the adhesive layer (2) and the resin film (3) is Part is a carrier sheet, and the adhesive layer (2) includes an acrylic adhesive. The acrylic adhesive is formed from an acrylic adhesive composition. The acrylic adhesive composition includes an acrylic polymer and a cross-linking agent. , the acrylic polymer is formed by polymerization of the composition (B), which contains (a component) alkyl ester part of the alkyl group having a carbon number of 4 to 12 (meth)acrylic acid Alkyl ester and (b component) are at least one selected from the group consisting of (meth)acrylate and (meth)acrylic acid having an OH group, relative to the total amount of monomer components constituting the acrylic polymer , the content of component a is 50% to 99% by weight, and the content of component b is 1% to 30% by weight relative to the total amount of monomer components constituting the acrylic polymer, at a temperature of 23°C and a humidity of The adhesive force when the adhesive layer (2) is peeled off from the resin film (2) at a peeling angle of 180 degrees and a peeling speed of 30mm/minute is 1gf/25mm~7gf/25mm in an environment of 50%RH. 如請求項1之積層體，其中於溫度23℃、濕度50%RH之環境下以剝離角度180度、剝離速度300mm/分鐘將該黏著劑層(2)自該樹脂膜(2)剝離時之黏著力為2gf/25mm以上。 For example, the laminate of claim 1, wherein the adhesive layer (2) is peeled off from the resin film (2) at a peeling angle of 180 degrees and a peeling speed of 300mm/min in an environment of 23°C and 50% RH. The adhesion force is above 2gf/25mm. 如請求項1或2之積層體，其中於溫度23℃、濕度50%RH之環境下以剝離角度180度、剝離速度2400mm/分鐘將該黏著劑層(2)自該樹脂膜(2)剝離時之黏著力為5gf/25mm以上。The laminate of claim 1 or 2, wherein the adhesive layer (2) is peeled off from the resin film (2) at a peeling angle of 180 degrees and a peeling speed of 2400mm/min in an environment of 23°C and 50% RH. The adhesion force at this time is above 5gf/25mm.
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