TWI826497B - 遮罩支撑模板與其製造方法及框架一體型遮罩的製造方法 - Google Patents

遮罩支撑模板與其製造方法及框架一體型遮罩的製造方法 Download PDF

Info

Publication number: TWI826497B
Authority: TW; Taiwan
Prior art keywords: mask; frame; template; metal film; manufacturing
Prior art date: 2018-08-09

Application number

TW108127575A

Other languages

English (en)

Chinese (zh)

Other versions

TW202020930A (zh

Inventor

李炳一

李裕進

Original Assignee

南韓商Tgo科技股份有限公司

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2018-08-09

Filing date

2019-08-02

Publication date

2023-12-21

2018-10-12 Priority claimed from KR1020180122020A external-priority patent/KR101988498B1/ko

2019-08-02 Application filed by 南韓商Tgo科技股份有限公司 filed Critical 南韓商Tgo科技股份有限公司

2020-06-01 Publication of TW202020930A publication Critical patent/TW202020930A/zh

2023-12-21 Application granted granted Critical

2023-12-21 Publication of TWI826497B publication Critical patent/TWI826497B/zh

Links

238000000034 method Methods 0.000 title claims abstract description 103
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239000002184 metal Substances 0.000 claims abstract description 101
239000000853 adhesive Substances 0.000 claims abstract description 68
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238000004519 manufacturing process Methods 0.000 claims abstract description 63
239000000463 material Substances 0.000 claims description 38
238000003466 welding Methods 0.000 claims description 30
238000010438 heat treatment Methods 0.000 claims description 27
238000005323 electroforming Methods 0.000 claims description 16
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 15
MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 14
239000000758 substrate Substances 0.000 claims description 13
239000013078 crystal Substances 0.000 claims description 11
239000011521 glass Substances 0.000 claims description 11
238000005530 etching Methods 0.000 claims description 10
239000000126 substance Substances 0.000 claims description 10
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 9
229910001374 Invar Inorganic materials 0.000 claims description 8
239000005388 borosilicate glass Substances 0.000 claims description 8
230000015572 biosynthetic process Effects 0.000 claims description 7
230000001678 irradiating effect Effects 0.000 claims description 7
TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 7
QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 claims description 5
239000010453 quartz Substances 0.000 claims description 5
239000000377 silicon dioxide Substances 0.000 claims description 5
229910052759 nickel Inorganic materials 0.000 claims description 4
229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 3
238000009281 ultraviolet germicidal irradiation Methods 0.000 claims description 2
230000010354 integration Effects 0.000 abstract 1
239000010408 film Substances 0.000 description 102
230000008569 process Effects 0.000 description 70
238000010586 diagram Methods 0.000 description 34
238000000151 deposition Methods 0.000 description 16
230000008021 deposition Effects 0.000 description 15
229910000831 Steel Inorganic materials 0.000 description 11
239000010959 steel Substances 0.000 description 11
239000012790 adhesive layer Substances 0.000 description 9
239000011248 coating agent Substances 0.000 description 9
238000000576 coating method Methods 0.000 description 9
230000007547 defect Effects 0.000 description 9
238000003490 calendering Methods 0.000 description 8
239000002904 solvent Substances 0.000 description 8
230000003746 surface roughness Effects 0.000 description 7
239000007788 liquid Substances 0.000 description 6
238000005096 rolling process Methods 0.000 description 6
238000007665 sagging Methods 0.000 description 6
238000000926 separation method Methods 0.000 description 6
230000000873 masking effect Effects 0.000 description 5
235000012431 wafers Nutrition 0.000 description 5
230000008901 benefit Effects 0.000 description 4
238000005137 deposition process Methods 0.000 description 4
230000005684 electric field Effects 0.000 description 4
238000005516 engineering process Methods 0.000 description 4
239000012535 impurity Substances 0.000 description 4
238000007747 plating Methods 0.000 description 4
CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 3
239000011324 bead Substances 0.000 description 3
239000004020 conductor Substances 0.000 description 3
230000007423 decrease Effects 0.000 description 3
238000001312 dry etching Methods 0.000 description 3
230000000694 effects Effects 0.000 description 3
238000003475 lamination Methods 0.000 description 3
239000012528 membrane Substances 0.000 description 3
229910044991 metal oxide Inorganic materials 0.000 description 3
150000004706 metal oxides Chemical class 0.000 description 3
238000000059 patterning Methods 0.000 description 3
239000004065 semiconductor Substances 0.000 description 3
239000012780 transparent material Substances 0.000 description 3
238000001039 wet etching Methods 0.000 description 3
CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
229910001111 Fine metal Inorganic materials 0.000 description 2
229920000459 Nitrile rubber Polymers 0.000 description 2
238000004026 adhesive bonding Methods 0.000 description 2
239000005352 borofloat Substances 0.000 description 2
239000003575 carbonaceous material Substances 0.000 description 2
239000003795 chemical substances by application Substances 0.000 description 2
239000007769 metal material Substances 0.000 description 2
229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
239000005416 organic matter Substances 0.000 description 2
229920002120 photoresistant polymer Polymers 0.000 description 2
238000005498 polishing Methods 0.000 description 2
BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
239000011347 resin Substances 0.000 description 2
229920005989 resin Polymers 0.000 description 2
239000002210 silicon-based material Substances 0.000 description 2
239000010936 titanium Substances 0.000 description 2
229910052719 titanium Inorganic materials 0.000 description 2
SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
229920002799 BoPET Polymers 0.000 description 1
101000869592 Daucus carota Major allergen Dau c 1 Proteins 0.000 description 1
229910001218 Gallium arsenide Inorganic materials 0.000 description 1
101000650136 Homo sapiens WAS/WASL-interacting protein family member 3 Proteins 0.000 description 1
239000004677 Nylon Substances 0.000 description 1
229910002370 SrTiO3 Inorganic materials 0.000 description 1
RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
102100027539 WAS/WASL-interacting protein family member 3 Human genes 0.000 description 1
239000002253 acid Substances 0.000 description 1
229910045601 alloy Inorganic materials 0.000 description 1
239000000956 alloy Substances 0.000 description 1
229910052782 aluminium Inorganic materials 0.000 description 1
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
239000010406 cathode material Substances 0.000 description 1
239000000919 ceramic Substances 0.000 description 1
239000002131 composite material Substances 0.000 description 1
229920001940 conductive polymer Polymers 0.000 description 1
230000008602 contraction Effects 0.000 description 1
238000007796 conventional method Methods 0.000 description 1
239000000498 cooling water Substances 0.000 description 1
229910052802 copper Inorganic materials 0.000 description 1
239000013039 cover film Substances 0.000 description 1
VYQRBKCKQCRYEE-UHFFFAOYSA-N ctk1a7239 Chemical compound C12=CC=CC=C2N2CC=CC3=NC=CC1=C32 VYQRBKCKQCRYEE-UHFFFAOYSA-N 0.000 description 1
238000000354 decomposition reaction Methods 0.000 description 1
238000011161 development Methods 0.000 description 1
229910021389 graphene Inorganic materials 0.000 description 1
229910002804 graphite Inorganic materials 0.000 description 1
239000010439 graphite Substances 0.000 description 1
238000009413 insulation Methods 0.000 description 1
239000010410 layer Substances 0.000 description 1
238000012423 maintenance Methods 0.000 description 1
150000002739 metals Chemical class 0.000 description 1
239000000203 mixture Substances 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
229920001778 nylon Polymers 0.000 description 1
229910052760 oxygen Inorganic materials 0.000 description 1
239000001301 oxygen Substances 0.000 description 1
230000035515 penetration Effects 0.000 description 1
230000002093 peripheral effect Effects 0.000 description 1
238000007517 polishing process Methods 0.000 description 1
229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
229920000642 polymer Polymers 0.000 description 1
238000007639 printing Methods 0.000 description 1
238000012545 processing Methods 0.000 description 1
230000009467 reduction Effects 0.000 description 1
238000004062 sedimentation Methods 0.000 description 1
229910052709 silver Inorganic materials 0.000 description 1
239000007787 solid Substances 0.000 description 1
238000004528 spin coating Methods 0.000 description 1
239000002887 superconductor Substances 0.000 description 1
239000002344 surface layer Substances 0.000 description 1
238000004381 surface treatment Methods 0.000 description 1
239000010409 thin film Substances 0.000 description 1
230000037303 wrinkles Effects 0.000 description 1

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

Landscapes

Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Electroluminescent Light Sources (AREA)

TW108127575A 2018-08-09 2019-08-02 遮罩支撑模板與其製造方法及框架一體型遮罩的製造方法 TWI826497B (zh)

Applications Claiming Priority (4)

Application Number	Priority Date	Filing Date	Title
KR20180092948		2018-08-09
KR10-2018-0092948		2018-08-09
KR10-2018-0122020		2018-10-12
KR1020180122020A KR101988498B1 (ko)	2018-10-12	2018-10-12	마스크 지지 템플릿과 그의 제조 방법 및 프레임 일체형 마스크의 제조 방법

Publications (2)

Publication Number	Publication Date
TW202020930A TW202020930A (zh)	2020-06-01
TWI826497B true TWI826497B (zh)	2023-12-21

Family

ID=69414943

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW108127575A TWI826497B (zh)	2018-08-09	2019-08-02	遮罩支撑模板與其製造方法及框架一體型遮罩的製造方法

Country Status (3)

Country	Link
CN (1)	CN112470302A (ko)
TW (1)	TWI826497B (ko)
WO (1)	WO2020032513A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN111224019B (zh) *	2018-11-23	2023-05-02	Tgo科技株式会社	掩模支撑模板和其制造方法及掩模与框架连接体的制造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR20130043635A (ko) *	2010-07-09	2013-04-30	미쓰이 가가쿠 가부시키가이샤	펠리클 및 그것에 이용하는 마스크 접착제
KR20160071578A (ko) *	2014-12-11	2016-06-22	삼성디스플레이 주식회사	마스크 프레임 조립체, 그 제조 방법 및 유기 발광 표시 장치의 제조 방법
KR20180087537A (ko) *	2017-01-24	2018-08-02	삼성디스플레이 주식회사	전기 도금 마스크, 이를 이용하여 제작된 유기발광 표시장치 및 이의 제작방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR100534580B1 (ko) *	2003-03-27	2005-12-07	삼성에스디아이 주식회사	표시장치용 증착 마스크 및 그의 제조방법
JP2005042133A (ja) *	2003-07-22	2005-02-17	Seiko Epson Corp	蒸着マスク及びその製造方法、表示装置及びその製造方法、表示装置を備えた電子機器
JP2005105328A (ja) *	2003-09-30	2005-04-21	Canon Inc	マスク構造体の製造方法およびマスク構造体ならびに蒸着装置
KR102282216B1 (ko) *	2015-02-24	2021-07-27	삼성디스플레이 주식회사	마스크 제조방법
US20190252614A1 (en) *	2016-11-03	2019-08-15	Tgo Tech. Corporation	Mother plate, method for manufacturing mother plate, method for manufacturing mask, and oled pixel deposition method
KR101889165B1 (ko) *	2016-11-14	2018-09-21	주식회사 포스코	증착용 마스크 제조방법, 이에 의해 제조된 증착용 마스크 및 이를 이용한 유기 발광 소자 제조방법
KR102609073B1 (ko) *	2016-11-30	2023-12-05	엘지디스플레이 주식회사	증착용 마스크 및 그 제조방법
KR20180087824A (ko) *	2017-01-25	2018-08-02	주식회사 티지오테크	프레임 일체형 마스크 및 그 제조방법
KR101988498B1 (ko) *	2018-10-12	2019-06-12	주식회사 티지오테크	마스크 지지 템플릿과 그의 제조 방법 및 프레임 일체형 마스크의 제조 방법

2019
- 2019-08-02 TW TW108127575A patent/TWI826497B/zh active
- 2019-08-05 WO PCT/KR2019/009744 patent/WO2020032513A1/ko active Application Filing
- 2019-08-05 CN CN201980048804.XA patent/CN112470302A/zh active Pending

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR20130043635A (ko) *	2010-07-09	2013-04-30	미쓰이 가가쿠 가부시키가이샤	펠리클 및 그것에 이용하는 마스크 접착제
KR20160071578A (ko) *	2014-12-11	2016-06-22	삼성디스플레이 주식회사	마스크 프레임 조립체, 그 제조 방법 및 유기 발광 표시 장치의 제조 방법
KR20180087537A (ko) *	2017-01-24	2018-08-02	삼성디스플레이 주식회사	전기 도금 마스크, 이를 이용하여 제작된 유기발광 표시장치 및 이의 제작방법

Also Published As

Publication number	Publication date
TW202020930A (zh)	2020-06-01
CN112470302A (zh)	2021-03-09
WO2020032513A1 (ko)	2020-02-13

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