TWI823447B - Piezoelectric oscillation device manufacturing apparatus and method for manufacturing piezoelectric oscillation device - Google Patents

Piezoelectric oscillation device manufacturing apparatus and method for manufacturing piezoelectric oscillation device Download PDF

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TWI823447B
TWI823447B TW111124121A TW111124121A TWI823447B TW I823447 B TWI823447 B TW I823447B TW 111124121 A TW111124121 A TW 111124121A TW 111124121 A TW111124121 A TW 111124121A TW I823447 B TWI823447 B TW I823447B
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supply
holding member
piezoelectric element
piezoelectric
head
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TW202310082A (en
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大室裕史
Takashi Sato
大谷浩
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日商大真空股份有限公司
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

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  • Manufacturing & Machinery (AREA)
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Abstract

The present invention provides a piezoelectric oscillation device manufacturing apparatus and method for manufacturing piezoelectric oscillation device, the piezoelectric oscillation device manufacturing apparatus is capable of arranging a plurality of piezoelectric elements on a plurality of holding members at a predetermined position with a predetermined orientation. The piezoelectric oscillation device manufacturing apparatus has an adsorption head moving apparatus (12) that reciprocates a plurality of adsorption heads (20) at the same time. The plurality of adsorption heads (20) adsorb piezoelectric elements (P) by adsorption nozzles (28) respectively. At least one of an adsorption head horizontal moving mechanism (21), an adsorption head vertical moving mechanism (24), and an adsorption head rotary moving mechanism (26) independently and individually adjusts positions of adsorption nozzles (28) respectively, based on information regarding positions of a plurality of piezoelectric elements (P) respectively adsorbed by a plurality of adsorption nozzles (28) and information regarding positions of a plurality of holding members (H) supplied to holding member supply positions (Sh), so that the piezoelectric elements (P) respectively adsorbed by the plurality of adsorption nozzles (28) can be respectively arranged on corresponding holding members (H).

Description

壓電震動裝置製造設備及壓電震動裝置的製造方法 Piezoelectric vibration device manufacturing equipment and piezoelectric vibration device manufacturing method

本發明係有關壓電震動裝置製造設備及壓電震動裝置的製造方法。 The present invention relates to piezoelectric vibration device manufacturing equipment and a piezoelectric vibration device manufacturing method.

壓電震動裝置係例如包括使用晶體震動片的晶體震動子。前述晶體震動子係具有壓電元件即晶體震動片及保持前述晶體震動片的保持構件。前述晶體震動子的前述晶體震動片被保持在由陶瓷(ceramic)等絕緣體構成的箱狀的前述保持構件內。前述晶體震動子係於前述晶體震動片的電極與前述保持構件內的電極已接合的狀態下密閉。 The piezoelectric vibration device includes, for example, a crystal vibrator using a crystal vibrator piece. The crystal vibrator system includes a crystal vibrator element that is a piezoelectric element, and a holding member that holds the crystal vibrator element. The crystal vibrator piece of the crystal vibrator is held in the box-shaped holding member made of an insulator such as ceramic. The crystal vibrator is sealed in a state where the electrodes of the crystal vibrator piece and the electrodes in the holding member are joined.

前述壓電元件與前述保持構件分別被供給至製造上述的前述壓電震動裝置的壓電震動裝置製造設備。前述壓電震動裝置製造設備係將藉由吸附頭(head)等移載設備而被供給的前述壓電元件配置至塗布有接合材的前述保持構件內。此時，前述壓電元件係必須以不使電極以外的部分接觸前述保持構件的方式配置至前述保持構件內。有鑒於此，已知有將相 對於前述移載設備進行定位後的前述壓電元件配置至前述保持構件內的前述壓電震動裝置製造設備。例如在專利文獻1揭示一種元件零件搭載設備，係在將被供給的元件零件定位後，將前述元件零件搭載至元件搭載構件基板。 The piezoelectric element and the holding member are respectively supplied to piezoelectric vibration device manufacturing equipment that manufactures the piezoelectric vibration device described above. The piezoelectric vibration device manufacturing equipment arranges the piezoelectric element supplied by a transfer device such as a head into the holding member coated with a bonding material. At this time, the piezoelectric element must be arranged in the holding member so that parts other than the electrodes do not contact the holding member. In view of this, it is known that there are generals The piezoelectric element after positioning the transfer device is placed in the piezoelectric vibration device manufacturing device in the holding member. For example, Patent Document 1 discloses a component mounting device that positions a supplied component and then mounts the component on a component mounting member substrate.

該專利文獻1記載的元件零件搭載設備係為了將複數個前述元件零件進行定位而具備進行暫時設置的載盤(tray)。前述載盤係具有暫時設置前述元件零件的複數個凹部。前述凹部的壁面係沿深度方向傾斜，並且露出在凹部的開口側。投入到前述凹部的前述元件零件係滑行過前述凹部的壁面而配置至凹部的底面。前述元件零件係藉由前述凹部的壁面而被定位至前述凹部的底面。前述元件零件搭載設備係將在複數個前述凹部的底面定位後的複數個前述元件零件搬送至前述元件搭載構件基板上。藉此，前述元件零件搭載設備係能夠將複數個前述元件零件以預定的擺向分別配置至前述元件搭載構件基板上的預定的位置。 The component mounting equipment described in Patent Document 1 is provided with a tray that is temporarily installed in order to position a plurality of the component components. The aforementioned carrier plate has a plurality of recessed portions for temporarily placing the aforementioned component parts. The wall surface of the recessed portion is inclined in the depth direction and exposed on the opening side of the recessed portion. The component parts put into the recessed part slide over the wall surface of the recessed part and are arranged on the bottom surface of the recessed part. The aforementioned component part is positioned to the bottom surface of the aforementioned recessed portion through the wall surface of the aforementioned recessed portion. The component mounting equipment transports the component components positioned on the bottom surfaces of the recessed portions onto the component mounting member substrate. Thereby, the component mounting equipment can arrange a plurality of the component components in predetermined swing directions at predetermined positions on the component mounting member substrate.

(先前技術文獻) (prior technical literature)

(專利文獻) (patent document)

專利文獻1：日本國特開2012/99560號 Patent document 1: Japanese Patent Application No. 2012/99560

前述元件零件搭載設備係將被供給的複數個前述元件零件藉由吸引移動手段搬送到前述載盤，在前述載盤進行定位。接著，前述元件 零件搭載設備係將在前述載盤定位後的複數個前述元件零件藉由吸引移動手段的吸附部予以吸附，搬送至前述元件搭載構件基板上。因此，複數個前述元件零件係在吸附時有位置及擺向相對於在前述載盤定位後的位置發生偏離的可能性。此外，前述載盤的凹部係為了讓前述元件零件配置至前述凹部內而具有會在前述壁面與位在前述底面的前述元件零件之間產生間隙之大小的底面。因此，前述元件零件係有位置及擺向相對於前述載盤偏離達產生在前述壁面與位在前述底面的前述元件零件之間的間隙量的可能性。 The component mounting equipment transports the plurality of supplied components to the carrier tray by suction and movement means, and positions them on the carrier tray. Next, the aforementioned components The component mounting equipment adsorbs the plurality of component components positioned on the carrier tray by the suction portion of the suction moving means, and transports them to the component mounting member substrate. Therefore, there is a possibility that the position and swing direction of a plurality of the aforementioned component parts may deviate from the position after positioning on the aforementioned carrier plate during adsorption. In addition, the recessed portion of the carrier plate has a bottom surface of a size that creates a gap between the wall surface and the component parts located on the bottom surface in order to allow the component parts to be placed in the recessed portion. Therefore, there is a possibility that the position and swing direction of the component parts may deviate from the carrier plate by an amount that creates a gap between the wall surface and the component parts located on the bottom surface.

本發明之目的在於提供能夠將複數個壓電元件在預定的位置以預定的擺向分別配置至複數個保持構件的壓電震動裝置製造設備及壓電震動裝置的製造方法。 An object of the present invention is to provide a piezoelectric vibration device manufacturing equipment and a piezoelectric vibration device manufacturing method that can respectively arrange a plurality of piezoelectric elements to a plurality of holding members at predetermined positions and predetermined swing directions.

本案發明人等係針對能夠不使節拍時間(takt time)增加而將複數個壓電元件在預定的位置以預定的擺向分別配置至複數個保持構件的壓電震動裝置製造設備及壓電震動裝置的製造方法進行了研究。本案發明人等係在致力研究的結果，想到了如下述的構成。 The inventors of the present invention are directed to a piezoelectric vibration device manufacturing equipment and piezoelectric vibration device that can respectively arrange a plurality of piezoelectric elements at a predetermined position and a predetermined swing direction to a plurality of holding members without increasing the takt time. The manufacturing method of the device was studied. As a result of intensive research, the inventors of the present invention came up with the following configuration.

本發明一實施型態的壓電震動裝置製造設備係供製造壓電震動裝置之用，該壓電震動裝置係至少具有壓電元件及保持前述壓電元件的保持構件，且前述壓電元件係藉由接合材而接合於前述保持構件。 A piezoelectric vibration device manufacturing equipment according to an embodiment of the present invention is used to manufacture a piezoelectric vibration device. The piezoelectric vibration device has at least a piezoelectric element and a holding member for holding the piezoelectric element, and the piezoelectric element is It is joined to the said holding member by a joining material.

壓電震動裝置製造設備係具有：複數個吸附頭，係一個一個地分別吸附前述壓電元件；及吸附頭移動設備，係搭載前述複數個吸附頭，且令前述複數個吸附頭同時於從被供給複數個前述壓電元件的壓電元件供 給位置到被供給複數個前述保持構件的保持構件供給位置為止之間往復移動。前述吸附頭係具有：吸附嘴(nozzle)，係吸附前述壓電元件；吸附頭用水平移動機構，係令前述吸附嘴沿水平方向移動；吸附頭用鉛直移動機構，係令前述吸附嘴沿鉛直方向移動；及吸附頭用旋轉移動機構，係令前述吸附嘴沿繞著鉛直軸旋轉的旋轉方向移動。 The piezoelectric vibration device manufacturing equipment has: a plurality of adsorption heads, which adsorb the aforementioned piezoelectric elements one by one; and an adsorption head moving device, which is equipped with the aforementioned plurality of adsorption heads, and allows the aforementioned plurality of adsorption heads to move from the object to the target at the same time. A piezoelectric element supply for supplying a plurality of the aforementioned piezoelectric elements It reciprocates between the supply position and the holding member supply position where a plurality of the aforementioned holding members are supplied. The aforementioned adsorption head has: an adsorption nozzle (nozzle), which adsorbs the aforementioned piezoelectric element; a horizontal movement mechanism for the adsorption head, which causes the aforementioned adsorption nozzle to move in a horizontal direction; and a vertical movement mechanism for the adsorption head, which moves the aforementioned adsorption nozzle in a vertical direction. Directional movement; and a rotational movement mechanism for the suction head, which causes the aforementioned suction nozzle to move in a rotational direction around a vertical axis.

複數個前述吸附頭係在前述壓電元件供給位置藉由複數個前述吸附嘴而分別吸附被供給至前述壓電元件供給位置的前述壓電元件。複數個前述吸附頭係藉由前述吸附頭移動設備而從前述壓電元件供給位置移動到前述保持構件供給位置。前述吸附頭用水平移動機構、前述吸附頭用鉛直移動機構、前述吸附頭用旋轉移動機構當中的至少一者係根據與複數個前述吸附嘴分別吸附起來的複數個前述壓電元件的位置有關的資訊及與被供給至前述保持構件供給位置的複數個前述保持構件的位置有關的資訊，將複數個前述吸附嘴的位置分別獨立地個別調整為能夠將複數個前述吸附嘴分別吸附著的前述壓電元件分別配置至對應的前述保持構件的位置。 The plurality of suction heads respectively suck the piezoelectric elements supplied to the piezoelectric element supply position through the plurality of suction nozzles at the piezoelectric element supply position. The plurality of suction heads are moved from the piezoelectric element supply position to the holding member supply position by the suction head moving device. At least one of the horizontal movement mechanism for the suction head, the vertical movement mechanism for the suction head, and the rotational movement mechanism for the suction head is related to the positions of the plurality of piezoelectric elements respectively adsorbed by the plurality of suction nozzles. The information and the information about the positions of the plurality of holding members supplied to the holding member supply position are used to independently adjust the positions of the plurality of suction nozzles to the pressures capable of respectively adsorbing the plurality of suction nozzles. The electrical components are respectively arranged at corresponding positions of the holding members.

在上述的構成中，複數個前述吸附頭係由各個吸附嘴吸附前述壓電元件，搬送複數個前述壓電元件。此時，前述吸附頭係根據與吸附起來的複數個前述壓電元件的位置有關的資訊及與分別配置吸附起來的複數個前述壓電元件的複數個前述保持構件的位置有關的資訊，分別獨立地個別調整複數個前述吸附嘴的位置。藉此，複數個前述吸附頭係能夠考慮到吸附時的偏離，分別將所吸附著的複數個前述壓電元件的位置以對應於前述保持構件的水平方向的位置及鉛直方向的位置的方式個別進行調整。 而且，複數個前述吸附頭係根據屬於數值資料(data)的與前述壓電元件的位置有關的資訊及與前述保持構件的位置有關的資訊，個別調整前述吸附嘴的位置。也因此，前述壓電震動裝置製造設備係無需為了對位而進行前述壓電元件的暫時設置等。因此，能夠不使節拍時間增加而將複數個壓電元件在預定的位置以預定的擺向分別配置至複數個保持構件。 In the above-mentioned structure, the plurality of suction heads suction the piezoelectric elements using respective suction nozzles, and transport the plurality of piezoelectric elements. At this time, the suction head is independently configured based on the information on the positions of the plurality of adsorbed piezoelectric elements and the information on the positions of the plurality of holding members that respectively arrange the plurality of adsorbed piezoelectric elements. Individually adjust the positions of a plurality of the aforementioned suction nozzles. Thereby, the plurality of suction heads can individually adjust the positions of the plurality of adsorbed piezoelectric elements so as to correspond to the horizontal position and the vertical position of the holding member, taking into consideration the deviation during suction. Make adjustments. Furthermore, the plurality of suction heads individually adjust the positions of the suction nozzles based on information on the position of the piezoelectric element and information on the position of the holding member, which are numerical data (data). Therefore, the piezoelectric vibration device manufacturing equipment does not need to temporarily install the piezoelectric element for positioning. Therefore, the plurality of piezoelectric elements can be respectively arranged on the plurality of holding members at predetermined positions and in predetermined swing directions without increasing the tact time.

依據其他觀點，本發明的壓電震動裝置製造設備係較佳為含有以下構成。壓電震動裝置製造設備係具有：複數個供給頭，係將前述接合材分別供給至前述保持構件；及供給頭移動設備，係搭載前述複數個供給頭，且令前述複數個供給頭同時於從前述複數個供給頭的待機位置到前述保持構件供給位置為止之間往復移動。 From another viewpoint, the piezoelectric vibration device manufacturing equipment of the present invention preferably includes the following configuration. The piezoelectric vibration device manufacturing equipment includes: a plurality of supply heads that supply the joining materials to the holding members respectively; and a supply head moving device that is equipped with the plurality of supply heads and causes the plurality of supply heads to move simultaneously from The plurality of supply heads reciprocate between the standby position and the holding member supply position.

前述供給頭係具有：供給設備，係供給前述接合材；供給頭用水平移動機構，係令前述供給設備沿水平方向移動；及供給頭用鉛直移動機構，係令前述供給設備沿鉛直方向移動。複數個前述供給頭係藉由前述供給頭移動設備而從前述待機位置移動到前述保持構件供給位置。前述供給頭用水平移動機構或前述供給頭用鉛直移動機構當中的至少一者係根據與被供給至前述保持構件供給位置的複數個前述保持構件的位置有關的資訊，以使複數個前述供給設備能夠將前述接合材分別供給至複數個前述保持構件的方式分別獨立地個別調整前述供給設備的位置。 The supply head includes: a supply device for supplying the joining material; a horizontal movement mechanism for the supply head for moving the supply device in the horizontal direction; and a vertical movement mechanism for the supply head for moving the supply device in the vertical direction. The plurality of supply heads are moved from the standby position to the holding member supply position by the supply head moving device. At least one of the horizontal movement mechanism for the supply head or the vertical movement mechanism for the supply head moves the plurality of supply devices based on information on the positions of the plurality of holding members supplied to the supply position of the holding member. The position of the supply device can be adjusted independently so that the joining material is supplied to the plurality of holding members respectively.

在上述的構成中，複數個前述供給頭係以對應於前述保持構件的水平方向的位置及鉛直方向的位置的方式分別獨立地個別調整前述供給設備的位置。藉此，前述供給設備係能夠將接合材吐出至前述保持構件的預定的位置。而且，複數個前述供給頭係根據所取得的屬於數值資料的 與複數個前述保持構件的位置有關的資訊，分別獨立地個別調整前述供給設備的位置。也因此，前述壓電震動裝置製造設備係無需進行前述保持構件相對於前述供給設備的對位等。因此，能夠不使節拍時間增加而將接合材分別配置至複數個保持構件的預定的位置。藉此，能夠將複數個壓電元件在預定的位置以預定的擺向分別配置至複數個保持構件。 In the above configuration, the plurality of supply heads adjust the positions of the supply equipment independently and individually so as to correspond to the horizontal position and the vertical position of the holding member. Thereby, the said supply equipment can discharge a joining material to the predetermined position of the said holding member. Moreover, the plurality of aforementioned supply heads are based on the acquired numerical data. Information on the positions of the plurality of holding members is used to independently adjust the positions of the supply devices. Therefore, the piezoelectric vibration device manufacturing equipment does not need to perform positioning of the holding member with respect to the supply equipment. Therefore, the joining materials can be arranged at predetermined positions of the plurality of holding members without increasing the tact time. Thereby, the plurality of piezoelectric elements can be respectively arranged on the plurality of holding members at predetermined positions and in predetermined swing directions.

依據其他觀點，本發明的壓電震動裝置製造設備係較佳為含有以下構成。複數個前述供給頭係在前述保持構件供給位置從複數個前述供給設備將前述接合材分別獨立地個別供給至複數個前述保持構件。複數個前述吸附頭係在前述保持構件供給位置將複數個前述吸附嘴分別吸附著的前述壓電元件分別獨立地個別配置至已被供給前述接合材的複數個前述保持構件。 From another viewpoint, the piezoelectric vibration device manufacturing equipment of the present invention preferably includes the following configuration. The plurality of supply heads supply the joining materials to the plurality of holding members independently from the plurality of supply devices at the holding member supply positions. The plurality of suction heads are configured to independently and individually arrange the piezoelectric elements sucked by the plurality of suction nozzles to the plurality of holding members to which the joining material has been supplied at the holding member supply position.

在上述的構成中，複數個前述供給頭係根據與前述保持構件的位置有關的資訊，分別獨立地個別調整複數個前述供給設備的水平方向的位置及鉛直方向的位置。複數個前述供給設備係將前述接合材分別獨立地個別供給至複數個前述保持構件的預定的位置。藉此，複數個前述供給設備係能夠考慮到複數個前述保持構件的位置的變異，並且將接合材吐出至前述保持構件的預定的位置。此外，複數個前述吸附頭係根據與前述壓電元件的位置有關的資訊及與前述保持構件的位置有關的資訊，分別獨立地個別調整複數個前述吸附嘴的水平方向的位置及鉛直方向的位置。複數個前述吸附嘴係將前述壓電元件分別獨立地個別配置至複數個前述保持構件的預定的位置。藉此，前述吸附頭係能夠考慮到前述保持構件的形狀的變異，並且將前述壓電元件配置至前述保持構件。因此，能夠不使節拍時 間增加而將複數個壓電元件在預定的位置以預定的擺向分別配置至複數個保持構件。 In the above-mentioned structure, the plurality of supply heads adjust the horizontal position and the vertical position of the plurality of supply devices independently and individually based on the information on the position of the holding member. The plurality of supply devices independently supply the joining materials to predetermined positions of the plurality of holding members. Thereby, the plurality of supply devices can discharge the joining material to a predetermined position of the holding member, taking into account variations in the positions of the plurality of holding members. In addition, the plurality of suction heads independently adjust the horizontal position and the vertical position of the plurality of suction nozzles based on the information about the position of the piezoelectric element and the information about the position of the holding member. . The plurality of suction nozzles arrange the piezoelectric elements independently and individually at predetermined positions of the plurality of holding members. Thereby, the suction head can arrange the piezoelectric element on the holding member in consideration of the variation in the shape of the holding member. Therefore, it is possible not to make the beat time As the time increases, the plurality of piezoelectric elements are respectively arranged on the plurality of holding members at predetermined positions and in predetermined swing directions.

依據其他觀點，本發明的壓電震動裝置製造設備係較佳為含有以下構成。前述複數個供給頭係藉由前述供給頭用水平移動機構或前述供給頭用鉛直移動機構的至少一者而能夠同時調整各個前述供給設備的位置。此外，複數個前述吸附頭係藉由前述吸附頭用水平移動機構、前述吸附頭用鉛直移動機構或前述吸附頭用旋轉移動機構的至少一者而能夠同時調整各個前述吸附嘴的位置。 From another viewpoint, the piezoelectric vibration device manufacturing equipment of the present invention preferably includes the following configuration. The plurality of supply heads can simultaneously adjust the position of each of the supply devices by at least one of the horizontal movement mechanism for the supply head or the vertical movement mechanism for the supply head. In addition, the plurality of suction heads can simultaneously adjust the positions of the suction nozzles by at least one of the horizontal movement mechanism for the suction head, the vertical movement mechanism for the suction head, or the rotational movement mechanism for the suction head.

在上述的構成中，壓電震動裝置製造設備係藉由各移動機構同時調整前述複數個吸附頭及前述複數個供給頭的位置，因此，不論前述吸附頭及前述供給頭的數目為何，皆會抑制為了調整前述複數個吸附頭及前述複數個供給頭的位置所需的時間。因此，能夠不使節拍時間增加而將供給材分別供給至複數個保持構件的預定的位置。此外，能夠不使節拍時間增加而以預定的擺向將複數個壓電元件分別配置至複數個保持構件的預定的位置。 In the above structure, the piezoelectric vibration device manufacturing equipment simultaneously adjusts the positions of the plurality of suction heads and the plurality of supply heads through each moving mechanism. Therefore, regardless of the number of the above suction heads and the above supply heads, The time required to adjust the positions of the plurality of suction heads and the plurality of supply heads is suppressed. Therefore, the supply materials can be supplied to predetermined positions of the plurality of holding members without increasing the tact time. In addition, the plurality of piezoelectric elements can be arranged in predetermined swing directions at predetermined positions of the plurality of holding members without increasing the tact time.

依據其他觀點，本發明的壓電震動裝置製造設備係較佳為含有以下構成。壓電震動裝置製造設備係具有：壓電元件位置量測設備，係分別量測複數個前述吸附頭分別吸附起來的複數個前述壓電元件的水平方向的位置及前述壓電元件的擺向，以作為與前述壓電元件的位置有關的資訊；及保持構件位置量測設備，係分別量測被供給至前述保持構件供給位置的複數個前述保持構件的水平方向及鉛直方向的位置，以作為與前述保持構件的位置有關的資訊。 From another viewpoint, the piezoelectric vibration device manufacturing equipment of the present invention preferably includes the following configuration. The piezoelectric vibration device manufacturing equipment includes: a piezoelectric element position measuring device, which measures the horizontal position and the swing direction of the piezoelectric elements respectively adsorbed by the plurality of adsorption heads, As information related to the position of the aforementioned piezoelectric element; and the holding member position measuring device measures the horizontal and vertical positions of the plurality of aforementioned holding members supplied to the aforementioned holding member supply position, as Information related to the position of the aforementioned holding member.

在上述的構成中，壓電元件位置量測設備係於複數個前述吸附嘴分別將前述壓電元件吸附起來的狀態下量測前述壓電元件的水平方向的位置及前述壓電元件的擺向。亦即，壓電元件位置量測設備係分別量測被前述吸附嘴吸附起來的複數個前述壓電元件的偏離。此外，前述保持構件位置量測設備係不僅分別量測被供給至前述保持構件供給位置的複數個前述保持構件的水平方向的位置，還分別量測鉛直方向的位置。也因此，前述保持構件位置量測設備係能夠將分別配置至複數個前述保持構件的前述壓電元件的鉛直方向的位置，根據對應的前述保持構件的鉛直方向的位置而獨立地個別進行調整。因此，能夠不使節拍時間增加而將複數個壓電元件在預定的位置以預定的擺向分別配置至複數個保持構件。 In the above configuration, the piezoelectric element position measuring device measures the horizontal position of the piezoelectric element and the swing direction of the piezoelectric element in a state where the plurality of suction nozzles respectively adsorb the piezoelectric element. . That is, the piezoelectric element position measuring device measures the deviations of the plurality of piezoelectric elements adsorbed by the adsorption nozzle respectively. In addition, the holding member position measuring device measures not only the horizontal position but also the vertical position of the plurality of holding members supplied to the holding member supply position. Therefore, the holding member position measuring device can independently adjust the vertical positions of the piezoelectric elements respectively arranged on the plurality of holding members according to the vertical positions of the corresponding holding members. Therefore, the plurality of piezoelectric elements can be respectively arranged on the plurality of holding members at predetermined positions and in predetermined swing directions without increasing the tact time.

本發明一實施型態的壓電震動裝置的製造方法為：至少具有壓電元件及保持前述壓電元件的保持構件，且前述壓電元件係藉由接合材而接合於前述保持構件的壓電震動裝置的製造方法。 A method of manufacturing a piezoelectric vibration device according to an embodiment of the present invention includes at least a piezoelectric element and a holding member that holds the piezoelectric element, and the piezoelectric element is bonded to the holding member by a bonding material. Method of manufacturing vibrating device.

壓電震動裝置的製造方法係含有下述步驟：壓電元件供給步驟，係將複數個前述壓電元件供給至壓電元件供給位置；壓電元件定位步驟，係將複數個前述壓電元件定位至壓電元件供給位置；保持構件供給步驟，係將複數個前述保持構件供給至保持構件供給位置；保持構件定位步驟，係將複數個前述保持構件定位至保持構件供給位置；壓電元件搬送步驟，係將被定位至壓電元件供給位置的複數個前述壓電元件從前述壓電元件供給位置搬送到前述保持構件供給位置；及壓電元件位置調整步驟，係根據與從前述壓電元件供給位置搬送到前述保持構件供給位置的複數個前述壓電元件的位置有關的資訊及與被定位至前述保持構件供給位置的前述 保持構件的位置有關的資訊，以能夠將從前述壓電元件供給位置搬送到前述保持構件供給位置的複數個前述壓電元件分別配置至對應的前述保持構件的方式，分別獨立地個別調整複數個前述壓電元件的位置。 The manufacturing method of a piezoelectric vibration device includes the following steps: a piezoelectric element supply step, which supplies a plurality of the aforementioned piezoelectric elements to a piezoelectric element supply position; and a piezoelectric element positioning step, which positions a plurality of the aforementioned piezoelectric elements. to the piezoelectric element supply position; the holding member supply step is to supply a plurality of the aforementioned holding members to the holding member supply position; the holding member positioning step is to position the plurality of aforementioned holding members to the holding member supply position; and the piezoelectric element transport step , the plurality of piezoelectric elements positioned at the piezoelectric element supply position are transported from the piezoelectric element supply position to the holding member supply position; and the piezoelectric element position adjustment step is based on the supply from the piezoelectric element Information on the positions of the plurality of piezoelectric elements whose positions are transferred to the holding member supply position and the information on the position of the plurality of piezoelectric elements positioned at the holding member supply position The information on the position of the holding member can be adjusted individually and independently in such a manner that the plurality of piezoelectric elements transported from the piezoelectric element supply position to the holding member supply position can be arranged on the corresponding holding member respectively. The location of the aforementioned piezoelectric element.

在上述的構成中，前述壓電震動裝置的製造方法係含有：壓電元件位置調整步驟，係根據與前述保持構件的位置有關的資訊及在壓電元件搬送步驟中於搬送中取得的與前述壓電元件的位置有關的資訊，分別獨立地個別調整複數個前述壓電元件的位置。在與前述壓電元件的位置有關的資訊中，係含有與將搬送中的複數個前述壓電元件的姿勢考慮在內的位置有關的資訊。藉此，無需在壓電元件搬送步驟後另設藉由進行暫時設置等而將前述壓電元件的姿勢定位之步驟。因此，能夠不使節拍時間增加而將複數個壓電元件在預定的位置以預定的擺向分別配置至複數個保持構件。 In the above-mentioned structure, the manufacturing method of the piezoelectric vibration device includes: a piezoelectric element position adjustment step, which is based on the information about the position of the holding member and the piezoelectric element transportation step and the aforementioned information obtained during transportation. The information related to the position of the piezoelectric element is used to independently adjust the positions of the plurality of piezoelectric elements. The information on the position of the piezoelectric element includes information on the position taking into consideration the postures of the plurality of piezoelectric elements being transported. This eliminates the need for a separate step of temporarily setting the position of the piezoelectric element after the piezoelectric element transport step. Therefore, the plurality of piezoelectric elements can be respectively arranged on the plurality of holding members at predetermined positions and in predetermined swing directions without increasing the tact time.

依據其他觀點，本發明的壓電震動裝置的製造方法係較佳為含有以下構成。含有下述步驟：接合材供給位置調整步驟，係在前述保持構件供給位置，根據與被供給至前述保持構件供給位置的前述保持構件的位置有關的資訊，調整供給至前述保持構件的前述接合材的供給位置。 From another viewpoint, the manufacturing method of the piezoelectric vibration device of the present invention preferably includes the following configuration. The method includes a step of adjusting the joining material supply position, which is a step of adjusting the joining material supplied to the holding member at the holding member supply position based on information on the position of the holding member supplied to the holding member supply position. supply location.

在上述的構成中，在前述接合材供給位置調整步驟中，係配合前述保持構件的位置分別將供給前述接合材的位置個別進行調整。而且，根據所取得的屬於數值資料的與複數個前述保持構件的位置有關的資訊，個別調整接合構件的供給位置，因此，無需按每個前述保持構件進行個別的對位等。因此，能夠不使節拍時間增加而將複數個壓電元件在預定的位置以預定的擺向分別配置至複數個保持構件。 In the above configuration, in the step of adjusting the joining material supply position, the position at which the joining material is supplied is individually adjusted in accordance with the position of the holding member. Furthermore, since the supply positions of the joint members are individually adjusted based on the obtained information on the positions of the plurality of holding members, which is numerical data, there is no need to perform individual alignment for each holding member. Therefore, the plurality of piezoelectric elements can be respectively arranged on the plurality of holding members at predetermined positions and in predetermined swing directions without increasing the tact time.

依據其他觀點，本發明的壓電震動裝置的製造方法係較佳為含有以下構成。壓電震動裝置的製造方法係含有下述步驟：接合材供給步驟，係在前述保持構件供給位置，將前述接合材分別供給至複數個前述保持構件；及壓電元件接合步驟，係在前述保持構件供給位置，將從前述壓電元件供給位置搬送到前述保持構件供給位置的複數個前述壓電元件分別配置至已被供給前述接合材的複數個前述保持構件。 From another viewpoint, the manufacturing method of the piezoelectric vibration device of the present invention preferably includes the following configuration. The manufacturing method of a piezoelectric vibration device includes the following steps: a joining material supply step, which supplies the joining material to a plurality of the holding members respectively at the holding member supply position; and a piezoelectric element joining step, which is at the holding member supply position. The member supply position arranges the plurality of piezoelectric elements transported from the piezoelectric element supply position to the holding member supply position to the plurality of holding members to which the joining material has been supplied.

在上述的構成中，在前述接合材供給步驟中，係根據與複數個前述保持構件的位置有關的資訊，調整在複數個前述保持構件的前述接合材的供給位置。此外，在前述壓電元件接合步驟中，係根據與前述壓電元件的位置有關的資訊及與前述保持構件的位置有關的資訊，調整在複數個前述保持構件的複數個前述壓電元件的配置位置。因此，能夠將複數個壓電元件在預定的位置以預定的擺向分別配置至複數個保持構件。 In the above configuration, in the joining material supply step, the supply positions of the joining materials on the plurality of holding members are adjusted based on the information on the positions of the plurality of holding members. Furthermore, in the piezoelectric element joining step, the arrangement of the plurality of piezoelectric elements on the plurality of holding members is adjusted based on the information on the position of the piezoelectric element and the information on the position of the holding member. Location. Therefore, the plurality of piezoelectric elements can be respectively arranged on the plurality of holding members at predetermined positions and in predetermined swing directions.

依據其他觀點，本發明的壓電震動裝置的製造方法係較佳為含有以下構成。前述接合材供給位置調整步驟係同時分別調整將前述接合材供給至複數個前述保持構件的位置之步驟。此外，前述壓電元件位置調整步驟係以能夠分別配置至前述保持構件的方式同時分別調整前述複數個壓電元件的位置之步驟。 From another viewpoint, the manufacturing method of the piezoelectric vibration device of the present invention preferably includes the following configuration. The step of adjusting the joining material supply position is a step of simultaneously adjusting the positions at which the joining material is supplied to the plurality of holding members. In addition, the piezoelectric element position adjustment step is a step of simultaneously adjusting the positions of the plurality of piezoelectric elements in such a manner that they can be respectively arranged on the holding member.

在上述的構成中，在前述壓電元件位置調整步驟中，係同時調整複數個前述壓電元件的配置位置，在前述接合材供給位置調整步驟中，係同時調整接合構件的複數個供給位置。也因此，不論配置至前述保持構件的前述壓電元件的數目為何，皆會抑制為了調整前述複數個壓電元件的配置位置及前述接合材的供給位置所需的時間。因此，能夠不使節拍時間 增加而將供給材分別供給至複數個保持構件的預定的位置。此外，能夠不使節拍時間增加而將複數個壓電元件在預定的位置以預定的擺向分別配置至複數個保持構件。 In the above configuration, in the piezoelectric element position adjustment step, the arrangement positions of the plurality of piezoelectric elements are adjusted simultaneously, and in the bonding material supply position adjustment step, a plurality of supply positions of the joining members are adjusted simultaneously. Therefore, regardless of the number of the piezoelectric elements arranged on the holding member, the time required to adjust the arrangement positions of the plurality of piezoelectric elements and the supply position of the joining material can be suppressed. Therefore, it is possible not to make the takt time The supply materials are gradually supplied to predetermined positions of the plurality of holding members. In addition, the plurality of piezoelectric elements can be respectively arranged on the plurality of holding members at predetermined positions and in predetermined swing directions without increasing the tact time.

依據其他觀點，本發明的壓電震動裝置的製造方法係較佳為含有以下構成。係含有下述步驟：壓電元件位置資訊取得步驟，係分別取得與從前述壓電元件供給位置搬送到前述保持構件供給位置的複數個前述壓電元件的水平方向的位置及前述壓電元件的擺向有關的資訊；及保持構件位置資訊取得步驟，係分別取得與被供給至前述保持構件供給位置的複數個前述保持構件的水平方向及鉛直方向的位置有關的資訊。 From another viewpoint, the manufacturing method of the piezoelectric vibration device of the present invention preferably includes the following configuration. The method includes the following steps: a step of acquiring piezoelectric element position information, which acquires the horizontal position of the plurality of piezoelectric elements transported from the piezoelectric element supply position to the holding member supply position and the position of the piezoelectric element. The information about the swing direction; and the holding member position information acquisition step are to respectively obtain information about the horizontal and vertical positions of the plurality of holding members supplied to the holding member supply position.

在上述的構成中，在前述壓電元件位置資訊取得步驟中，係量測前述壓電元件搬送步驟中的複數個前述壓電元件的水平方向的位置及前述壓電元件的擺向。亦即，在前述壓電元件位置資訊取得步驟中，係量測被吸附起來的壓電元件的姿勢。此外，在前述保持構件位置資訊取得步驟中，不僅分別量測複數個前述保持構件的水平方向的位置，還分別量測鉛直方向的位置，因此，能夠將分別配置至複數個前述保持構件的前述壓電元件的鉛直方向的位置，根據對應的前述保持構件的鉛直方向的位置而獨立地個別進行調整。因此，能夠不使節拍時間增加而將複數個壓電元件在預定的位置以預定的擺向分別配置至複數個保持構件。 In the above structure, in the piezoelectric element position information acquisition step, the horizontal position of the plurality of piezoelectric elements and the swing direction of the piezoelectric element in the piezoelectric element transport step are measured. That is, in the aforementioned piezoelectric element position information acquisition step, the posture of the adsorbed piezoelectric element is measured. In addition, in the step of obtaining the holding member position information, not only the horizontal positions of the plurality of holding members but also the vertical positions are respectively measured. Therefore, the aforementioned holding members respectively arranged in the plurality of holding members can be measured. The vertical position of the piezoelectric element is independently adjusted based on the vertical position of the corresponding holding member. Therefore, the plurality of piezoelectric elements can be respectively arranged on the plurality of holding members at predetermined positions and in predetermined swing directions without increasing the tact time.

[壓電震動裝置] [Piezoelectric vibration device]

在本說明書中，所謂的壓電震動裝置，係指具有將施加在壓電體的力轉換成電壓或將施加在壓電體的電壓轉換成力的壓電元件之電子零件。壓電震動裝置係包括晶體震動子、晶體振盪器等。壓電震動裝置係使用於振 盪電路、濾波器(filter)電路、致動器(actuator)、感測器(sensor)等。 In this specification, a piezoelectric vibration device refers to an electronic component having a piezoelectric element that converts a force applied to a piezoelectric body into a voltage or converts a voltage applied to a piezoelectric body into a force. Piezoelectric vibration devices include crystal vibrators, crystal oscillators, etc. Piezoelectric vibration device is used for vibrating Oscillation circuit, filter circuit, actuator, sensor, etc.

[壓電元件] [Piezoelectric element]

在本說明書中，所謂的壓電元件，係指將施加的力轉換成電壓或將施加的電壓轉換成力的壓電體。本實施型態中，壓電元件乃係將晶體以特定的方向進行切取而得的板狀的晶體震動片。壓電元件係具有藉由蒸鍍、濺鍍(sputtering)等進行成膜而形成的電極。 In this specification, a piezoelectric element refers to a piezoelectric body that converts an applied force into a voltage or converts an applied voltage into a force. In this embodiment, the piezoelectric element is a plate-shaped crystal vibration piece obtained by cutting the crystal in a specific direction. The piezoelectric element has electrodes formed into films by vapor deposition, sputtering, or the like.

[保持構件] [Keep component]

在本說明書中，所謂的保持構件，係指供保持壓電元件之用的由絕緣體構成的容器。本實施型態中，保持構件乃係陶瓷製的箱體。保持構件係內部具有與壓電元件電性連接的電極。保持構件係內部具有能夠配置壓電元件的凹部。 In this specification, the holding member refers to a container made of an insulator for holding the piezoelectric element. In this embodiment, the holding member is a ceramic box. The holding member has an internal electrode electrically connected to the piezoelectric element. The holding member system has an internal recess in which the piezoelectric element can be disposed.

[接合材] [joining material]

在本說明書中，所謂的接合材，係指將壓電元件接合於保持容器的導電性的材料。接合材係例如為焊料、接著材等。在本實施型態中，接合材乃係熱硬化性的接著劑。 In this specification, the term "joining material" refers to a conductive material that joins the piezoelectric element to the holding container. The joining material is, for example, solder, adhesive material, etc. In this embodiment, the joining material is a thermosetting adhesive.

[相對距離] [relative distance]

在本說明書中，所謂的相對距離，係指零件的中心彼此的距離。 In this specification, the relative distance refers to the distance between the centers of parts.

[與位置有關的資訊] [location-related information]

在本說明書中，所謂的與位置有關的資訊，係指以壓電震動裝置製造設備中的任意點為原點時，作為對象的設備、零件等之中的特定點的X方向、Y方向、Z方向及θ方向的座標。本實施型態中的座標乃係以壓電震動裝置製造設備中的任意點為原點的座標系。 In this specification, the so-called position-related information refers to the X-direction, Y-direction, and Coordinates in Z direction and θ direction. The coordinates in this embodiment are a coordinate system with an arbitrary point in the piezoelectric vibration device manufacturing equipment as the origin.

依據本發明一實施型態，能夠不使節拍時間增加而將複數個壓電元件在預定的位置以預定的擺向分別配置至複數個保持構件。 According to an embodiment of the present invention, a plurality of piezoelectric elements can be respectively arranged on a plurality of holding members at predetermined positions and in predetermined swing directions without increasing the cycle time.

1:壓電震動裝置製造設備 1: Piezoelectric vibration device manufacturing equipment

2:架台 2: Set up the platform

10:壓電元件供給設備 10: Piezoelectric component supply equipment

10a:載盤載置部 10a: Disk loading part

11:保持構件供給設備 11: Maintaining component supply equipment

11a:保持構件載置部 11a: Holding member placement part

12:吸附頭移動設備 12: Adsorption head mobile equipment

12a:吸附頭載置部 12a: Suction head placement part

13:供給頭移動設備 13: Supply head mobile equipment

13a:供給頭載置部 13a: Supply head mounting part

14:攝像機 14:Camera

15:雷射量測設備 15:Laser measurement equipment

16:控制設備 16:Control equipment

20:吸附頭 20:Adsorption head

21:吸附頭用水平移動機構 21: Horizontal moving mechanism for adsorption head

22:吸附頭用第1移動構件 22: First moving member for suction head

23:吸附頭用第2移動構件 23: Second moving member for suction head

24:吸附頭用鉛直移動機構 24: Vertical moving mechanism for adsorption head

25:吸附頭用第3移動構件 25: The third moving member for the suction head

26:吸附頭用旋轉移動機構 26: Rotary moving mechanism for adsorption head

27:吸附頭用第4移動構件 27: Fourth moving member for suction head

28:吸附嘴 28:Suction mouth

30:供給頭 30: Supply head

31:供給頭用水平移動機構 31: Horizontal moving mechanism for supply head

32:供給頭用第1移動構件 32: First moving member for supply head

33:供給頭用第2移動構件 33: Second moving member for supply head

34:供給頭用鉛直移動機構 34: Vertical moving mechanism for supply head

35:供給頭用第3移動構件 35: Third moving member for supply head

36:供給設備 36: Supply equipment

36a:吐出嘴 36a: Spit out the mouth

36b:冷卻設備 36b: Cooling equipment

36c:接觸感測器 36c: Contact sensor

37:確認攝像機 37:Confirm camera

38:試吐部 38: Trial vomiting department

100:壓電震動裝置製造線 100: Piezoelectric vibration device manufacturing line

110:搭載部 110:Mounting part

111:機器人移動設備 111:Robot Mobile Equipment

112:供給台 112: Supply station

113:搬送用機器人 113:Transportation robot

120:產線控制設備 120:Production line control equipment

C:凹部 C: concave part

H:保持構件 H: keep component

H1:第1保持構件 H1: 1st holding member

H2:第2保持構件 H2: 2nd holding member

H3:第3保持構件 H3: The third holding member

H4:第4保持構件 H4: The fourth holding member

Ip:與壓電元件的位置有關的資訊 IP: Information related to the position of the piezoelectric element

Ih:與保持構件的位置有關的資訊 Ih: Information related to maintaining the position of the component

P:壓電元件 P: Piezoelectric element

P1:第1壓電元件 P1: 1st piezoelectric element

P2:第2壓電元件 P2: 2nd piezoelectric element

P3:第3壓電元件 P3: The third piezoelectric element

P4:第4壓電元件 P4: The fourth piezoelectric element

Px:X方向的間隔 Px: interval in X direction

Py:Y方向的間隔 Py: interval in Y direction

Rh1:第1保持構件區域 Rh1: 1st holding member area

Rh2:第2保持構件區域 Rh2: 2nd holding member area

Rh3:第3保持構件區域 Rh3: 3rd holding member area

Rh4:第4保持構件區域 Rh4: 4th holding member area

Rp1:第1壓電元件區域 Rp1: 1st piezoelectric element area

Rp2:第2壓電元件區域 Rp2: 2nd piezoelectric element area

Rp3:第3壓電元件區域 Rp3: 3rd piezoelectric element area

Rp4:第4壓電元件區域 Rp4: 4th piezoelectric element area

S100,S110,S120,S125,S130,S135,S140,S150,S160,S170,S180,S190:步驟 S100, S110, S120, S125, S130, S135, S140, S150, S160, S170, S180, S190: Steps

Sh:保持構件供給位置 Sh: maintain component supply position

Sp:壓電元件供給位置 Sp: Piezoelectric element supply position

T:載盤 T: load disk

W:待機位置 W: standby position

Wh:保持構件待機位置 Wh: Keep the component in the standby position

Wp:壓電元件待機位置 Wp: Piezoelectric element standby position

圖1係顯示本發明實施型態1的壓電震動裝置製造設備的全體構成的概略之俯視圖。 FIG. 1 is a plan view schematically showing the overall structure of a piezoelectric vibration device manufacturing equipment according to Embodiment 1 of the present invention.

圖2A係顯示被供給至本發明實施型態1的壓電震動裝置製造設備的複數個壓電元件與載盤之俯視圖。 2A is a top view showing a plurality of piezoelectric elements and a carrier plate supplied to the piezoelectric vibration device manufacturing equipment according to Embodiment 1 of the present invention.

圖2B係顯示被供給至本發明實施型態的壓電震動裝置製造設備的複數個保持構件的概略之俯視圖。 2B is a schematic plan view showing a plurality of holding members supplied to the piezoelectric vibration device manufacturing equipment according to the embodiment of the present invention.

圖3係顯示本發明實施型態的壓電震動裝置製造設備具有的複數個吸附頭的全體構成的概略之俯視圖。 FIG. 3 is a schematic plan view showing the overall structure of a plurality of suction heads included in the piezoelectric vibration device manufacturing equipment according to the embodiment of the present invention.

圖4係圖3的A箭頭視圖。 Figure 4 is a view of arrow A in Figure 3 .

圖5係顯示本發明實施型態的壓電震動裝置製造設備具有的複數個供給頭的全體構成的概略之側視圖。 FIG. 5 is a schematic side view showing the overall structure of a plurality of supply heads included in the piezoelectric vibration device manufacturing equipment according to the embodiment of the present invention.

圖6係顯示本發明實施型態的壓電震動裝置製造設備的控制構成之方塊圖(block diagram)。 FIG. 6 is a block diagram showing the control structure of the piezoelectric vibration device manufacturing equipment according to the embodiment of the present invention.

圖7係顯示本發明實施型態的壓電震動裝置製造設備的複數個吸附頭將壓電元件搬送至保持構件供給位置後的狀態的概略之俯視圖。 7 is a schematic plan view showing a state in which a plurality of suction heads of the piezoelectric vibration device manufacturing equipment according to the embodiment of the present invention have transported piezoelectric elements to a holding member supply position.

圖8係顯示本發明實施型態的壓電震動裝置製造設備的複數個吸附頭 調整吸附嘴的位置後的狀態的概略之俯視圖。 Figure 8 shows a plurality of adsorption heads of the piezoelectric vibration device manufacturing equipment according to the embodiment of the present invention. A schematic top view of the state after adjusting the position of the suction nozzle.

圖9係本發明實施型態的壓電震動裝置的製造方法的流程圖(flowchart)。 FIG. 9 is a flowchart of the manufacturing method of the piezoelectric vibration device according to the embodiment of the present invention.

圖10係顯示在本發明實施型態的壓電震動裝置的製造方法中的保持構件位置資訊取得步驟、壓電元件供給步驟、保持構件供給步驟、壓電元件定位步驟及保持構件定位步驟中，壓電震動裝置製造設備的作動狀態之俯視圖。 10 shows the holding member position information acquisition step, the piezoelectric element supply step, the holding member supply step, the piezoelectric element positioning step and the holding member positioning step in the manufacturing method of the piezoelectric vibration device according to the embodiment of the present invention. A top view of the piezoelectric vibration device manufacturing equipment in action.

圖11係顯示在本發明實施型態的壓電震動裝置的製造方法中的接合材供給位置調整步驟及接合材供給步驟中，壓電震動裝置製造設備的作動狀態之俯視圖。 11 is a plan view showing the operating state of the piezoelectric vibration device manufacturing equipment in the joining material supply position adjustment step and the joining material supply step in the piezoelectric vibration device manufacturing method according to the embodiment of the present invention.

圖12係顯示在本發明實施型態的壓電震動裝置的製造方法中的壓電元件搬送步驟、壓電元件位置資訊取得步驟、壓電元件位置調整步驟及壓電元件接合步驟中，壓電震動裝置製造設備的作動狀態之俯視圖。 12 shows the piezoelectric element transport step, the piezoelectric element position information acquisition step, the piezoelectric element position adjustment step and the piezoelectric element bonding step in the manufacturing method of the piezoelectric vibration device according to the embodiment of the present invention. A top view of the vibration device manufacturing equipment in action.

圖13係顯示含有本發明實施型態的壓電震動裝置製造設備的壓電震動裝置製造線(line)的構成之俯視圖。 13 is a top view showing the structure of a piezoelectric vibration device manufacturing line including the piezoelectric vibration device manufacturing equipment according to the embodiment of the present invention.

圖14係顯示含有本發明實施型態的壓電震動裝置製造設備的壓電震動裝置製造線的控制構成之方塊圖。 14 is a block diagram showing the control structure of a piezoelectric vibration device manufacturing line including the piezoelectric vibration device manufacturing equipment according to the embodiment of the present invention.

以下，針對各實施型態，參照圖式進行說明。在各圖中，相同部分係給予相同的元件符號，且該相同部分不再重複說明。另外，各圖中的構成構件的尺寸並非忠實地表現出實際上的構成構件的尺寸及各構成構 件的尺寸比率等。 Each embodiment will be described below with reference to the drawings. In each drawing, the same parts are given the same reference numerals, and the description of the same parts will not be repeated. In addition, the dimensions of the constituent members in each figure do not faithfully represent the actual dimensions of the constituent members and the dimensions of each constituent member. Part size ratio, etc.

另外，在以下的本發明實施型態即壓電震動裝置製造設備1的說明中，係規定將壓電元件P搬送到壓電元件供給位置Sp的方向為「X方向」。規定與X方向正交的方向且為將壓電元件P從壓電元件供給位置Sp搬送到保持構件供給位置Sh的方向為「Y方向」。規定與X方向及Y方向正交的方向為「Z方向」。規定繞著沿Z方向延伸的軸線進行旋轉的旋轉方向為θ方向。此外，在本實施型態中，X方向及Y方向乃係水平面上的方向。Z方向乃係鉛直方向。惟，並無藉由上述方向的定義來限定壓電震動裝置製造設備1使用時的擺向之意圖。 In addition, in the following description of the piezoelectric vibration device manufacturing equipment 1 according to the embodiment of the present invention, the direction in which the piezoelectric element P is transported to the piezoelectric element supply position Sp is defined as the "X direction". The "Y direction" defines a direction orthogonal to the X direction and is a direction in which the piezoelectric element P is transported from the piezoelectric element supply position Sp to the holding member supply position Sh. The direction orthogonal to the X direction and the Y direction is defined as the "Z direction". The rotation direction about the axis extending in the Z direction is defined as the θ direction. In addition, in this embodiment, the X direction and the Y direction are directions on the horizontal plane. The Z direction is the vertical direction. However, there is no intention to limit the swing direction of the piezoelectric vibration device manufacturing equipment 1 when used by the above definition of direction.

此外，在以下的說明中，「固定」、「連接」、「接合」及「安裝」等(以下，以固定等來代表)之描述係不僅包括構件彼此間直接地固定等的情形，亦包括透過其他構件而固定等的情形。亦即，在以下的說明中，固定等之描述係包含構件彼此間的直接性的及間接性的固定等之意。 In addition, in the following description, descriptions such as "fixing", "connecting", "joining" and "installing" (hereinafter, represented by fixing, etc.) include not only the case where members are directly fixed to each other, but also the case where the members are directly fixed to each other. Fixing through other members, etc. That is, in the following description, descriptions of fixation and the like include direct and indirect fixation of members to each other.

[實施型態1] [Implementation type 1]

<壓電震動裝置製造設備的全體構成> <Overall structure of piezoelectric vibration device manufacturing equipment>

利用圖1至圖6，針對本發明的製造壓電震動裝置的設備即壓電震動裝置製造設備的實施型態1(即壓電震動裝置製造設備1)進行說明。圖1係顯示本發明實施型態1的壓電震動裝置製造設備1的全體構成的概略之俯視圖。圖2A係顯示被供給至壓電震動裝置製造設備1的複數個壓電元件P與載盤T之俯視圖。圖2B係顯示被供給至壓電震動裝置製造設備1的複數個保持構件H的概略之俯視圖。圖3係顯示壓電震動裝置製造設備1具有的複數個吸附頭20的全體構成的概略之俯視圖。圖4係圖3的A箭 頭視圖。圖5係顯示壓電震動裝置製造設備1具有的複數個供給頭30的全體構成的概略之側視圖。圖6係顯示壓電震動裝置製造設備1的控制構成之方塊圖。 Embodiment 1 of the piezoelectric vibration device manufacturing equipment (that is, the piezoelectric vibration device manufacturing equipment 1 ), which is a device for manufacturing a piezoelectric vibration device according to the present invention, will be described using FIGS. 1 to 6 . FIG. 1 is a plan view schematically showing the overall structure of a piezoelectric vibration device manufacturing equipment 1 according to Embodiment 1 of the present invention. FIG. 2A is a top view showing a plurality of piezoelectric elements P and a carrier T supplied to the piezoelectric vibration device manufacturing equipment 1 . FIG. 2B is a schematic plan view showing a plurality of holding members H supplied to the piezoelectric vibration device manufacturing equipment 1 . FIG. 3 is a plan view schematically showing the overall structure of a plurality of suction heads 20 included in the piezoelectric vibration device manufacturing equipment 1 . Figure 4 is arrow A in Figure 3 Head view. FIG. 5 is a schematic side view showing the overall structure of the plurality of supply heads 30 included in the piezoelectric vibration device manufacturing equipment 1 . FIG. 6 is a block diagram showing the control structure of the piezoelectric vibration device manufacturing equipment 1.

如圖1所示，壓電震動裝置製造設備1係具有：架台2、壓電元件供給設備10、保持構件供給設備11、吸附頭移動設備12、供給頭移動設備13、作為壓電元件位置量測設備的攝像機(camera)14、作為保持構件位置量測設備的雷射(laser)量測設備15、控制設備16、吸附頭20及供給頭30。壓電震動裝置製造設備1係在架台2的屬於水平的面的載置面上配置有各設備。壓電震動裝置製造設備1係從未圖示的供給線被供給複數個壓電元件P與複數個保持構件H。 As shown in FIG. 1 , the piezoelectric vibration device manufacturing equipment 1 includes a gantry 2 , a piezoelectric element supply device 10 , a holding member supply device 11 , an adsorption head moving device 12 , and a supply head moving device 13 . A camera 14 of the measuring device, a laser measuring device 15 as a holding member position measuring device, a control device 16, an adsorption head 20 and a supply head 30. The piezoelectric vibration device manufacturing equipment 1 has various devices arranged on a horizontal mounting surface of the stand 2 . The piezoelectric vibration device manufacturing equipment 1 is supplied with a plurality of piezoelectric elements P and a plurality of holding members H from a supply line (not shown).

如圖2A及圖2B所示，複數個壓電元件P以維持著彼此間之相對距離的狀態被供給至壓電震動裝置製造設備1。在本實施型態中，在作為壓電元件P的容器的載盤T係設有供配置壓電元件P的複數個凹部C。凹部C係在俯視下形成為矩形。沿X方向每隔間隔Px設置的複數個凹部C的一群係沿Y方向每隔間隔Py排列於載盤T。亦即，複數個凹部C係於載盤T配置成沿X方向每隔間隔Px定位且沿Y方向每隔間隔Py定位的矩陣(matrix)狀。壓電元件P係分別位在載盤T的凹部C內。另外，相鄰的凹部C的間隔Px、間隔Py乃係俯視呈矩形的凹部C的中心(對角線的交點)間的間隔。 As shown in FIGS. 2A and 2B , a plurality of piezoelectric elements P are supplied to the piezoelectric vibration device manufacturing equipment 1 while maintaining a relative distance between them. In this embodiment, a plurality of recessed portions C in which the piezoelectric elements P are arranged are provided on the carrier T as a container for the piezoelectric elements P. The recessed portion C is formed in a rectangular shape in plan view. A group of the plurality of recessed portions C provided at intervals Px along the X direction is arranged on the carrier T at intervals Py along the Y direction. That is, the plurality of recessed portions C are arranged on the carrier T in a matrix shape positioned at intervals Px in the X direction and at intervals Py in the Y direction. The piezoelectric elements P are respectively located in the recessed portions C of the carrier T. In addition, the distance Px and the distance Py between adjacent recessed portions C are the distances between the centers (intersections of diagonal lines) of the recessed portions C that are rectangular in plan view.

複數個保持構件H以維持著彼此間之相對距離的狀態被供給至壓電震動裝置製造設備1。在本實施型態中，複數個保持構件H設為：沿X方向每隔間隔Px整齊排列的複數個保持構件H的一群係每隔間隔Py 沿Y方向整齊排列。亦即，複數個保持構件H係配置成：沿X方向每隔間隔Px定位且沿Y方向每隔間隔Py定位的矩陣狀。此外，複數個保持構件H係形成為彼此連結在一起的片(sheet)狀。另外，配置成片狀的複數個保持構件H係以對應於凹部C的X方向的間隔Px、Y方向的間隔Py的方式定位。 The plurality of holding members H are supplied to the piezoelectric vibration device manufacturing equipment 1 in a state where the relative distance between them is maintained. In this embodiment, the plurality of holding members H are arranged neatly at intervals Px along the X direction. A group of the plurality of holding members H is arranged at intervals Py. Arrange neatly along the Y direction. That is, the plurality of holding members H are arranged in a matrix shape positioned at intervals Px in the X direction and positioned at intervals Py in the Y direction. In addition, the plurality of holding members H are formed in a sheet shape connected to each other. In addition, the plurality of holding members H arranged in a sheet shape are positioned so as to correspond to the interval Px in the X direction and the interval Py in the Y direction of the recessed portion C.

保持構件H係例如在俯視下為長方形形狀。保持構件H係例如構成為長邊2.0mm、短邊1.6mm之大小。此外，保持構件H係例如構成為長邊1.6mm、短邊1.2mm之大小。此外，保持構件H係例如構成為長邊1.2mm、短邊1.0mm之大小。另外，複數個保持構件彼此連結在一起而形成的片之大小係以不論保持構件H的大小為何皆成為相同大小的方式構成。亦即，片係構成為：片所含的保持構件H的數目依保持構件H之大小而異。藉由如上述的方式構成，即使保持構件H之大小變更，壓電震動裝置製造設備1也無需更換後述的吸附頭移動設備12、供給頭移動設備13等。 The holding member H has a rectangular shape in plan view, for example. The holding member H is configured to have a long side of 2.0 mm and a short side of 1.6 mm, for example. In addition, the holding member H is configured to have a long side of 1.6 mm and a short side of 1.2 mm, for example. In addition, the holding member H is configured to have a long side of 1.2 mm and a short side of 1.0 mm, for example. In addition, the size of the piece formed by connecting a plurality of holding members to each other is configured so that the size is the same regardless of the size of the holding member H. That is, the sheet system is configured such that the number of holding members H included in the sheet varies depending on the size of the holding members H. By being configured as described above, even if the size of the holding member H is changed, the piezoelectric vibration device manufacturing equipment 1 does not need to replace the suction head moving equipment 12, the supply head moving equipment 13, etc. described later.

如圖1所示，壓電元件供給設備10乃係將收容有複數個壓電元件P的載盤T搬送到壓電元件供給位置Sp並且在壓電元件供給位置Sp決定供給對象的壓電元件P的位置之定位設備。在本實施型態中，壓電元件供給設備10乃係具有作為致動器的伺服馬達(servo motor)與作為直動機構的滾珠螺桿單元(ball screw unit)的單軸的直動單元。沿鉛直方向觀看，壓電元件供給設備10係以使搬送壓電元件P的方向成為X方向的方式配置在架台2上。 As shown in FIG. 1 , the piezoelectric element supply equipment 10 transports a carrier T containing a plurality of piezoelectric elements P to a piezoelectric element supply position Sp and determines a piezoelectric element to be supplied at the piezoelectric element supply position Sp. P's location positioning device. In this embodiment, the piezoelectric element supply device 10 is a single-axis linear motion unit including a servo motor as an actuator and a ball screw unit as a linear motion mechanism. Viewed in the vertical direction, the piezoelectric element supply device 10 is arranged on the gantry 2 so that the direction in which the piezoelectric element P is transported becomes the X direction.

壓電元件供給設備10係具有載置載盤T的載盤載置部10a。 壓電元件供給設備10係相應於伺服馬達的旋轉量而能夠將載盤載置部10a移動到稼動範圍內的任意位置。壓電元件供給設備10中，在壓電元件待機位置Wp，載盤T係從未圖示的外部的供給線被供給至載盤載置部10a。能夠將載置在載盤載置部10a的載盤T搬送到壓電元件供給位置Sp。另外，在壓電元件供給設備10中的壓電元件供給位置Sp係預先決定。此外，為了將載盤T所收容的複數個壓電元件P當中的供給對象的壓電元件P定位至壓電元件供給位置Sp，壓電元件供給設備10係根據供給對象的壓電元件P在載盤載置部10a上的位置，按供給對象的每個壓電元件P決定載盤載置部10a的停止位置。壓電元件供給設備10係根據按供給對象的每個壓電元件P決定的停止位置，將供給對象的壓電元件P定位至壓電元件供給位置Sp。 The piezoelectric element supply equipment 10 has a disk mounting part 10a on which the disk T is placed. The piezoelectric element supply device 10 can move the disk mounting portion 10a to any position within the operating range in accordance with the amount of rotation of the servo motor. In the piezoelectric element supply equipment 10, at the piezoelectric element standby position Wp, the carrier T is supplied to the carrier mounting portion 10a from an external supply line (not shown). The tray T placed on the tray placement portion 10a can be transported to the piezoelectric element supply position Sp. In addition, the piezoelectric element supply position Sp in the piezoelectric element supply device 10 is determined in advance. In addition, in order to position the piezoelectric element P to be supplied among the plurality of piezoelectric elements P accommodated in the carrier tray T to the piezoelectric element supply position Sp, the piezoelectric element supply device 10 positions the piezoelectric element P to be supplied according to the position of the piezoelectric element P to be supplied. The position on the disk placing portion 10a determines the stopping position of the disk placing portion 10a for each piezoelectric element P to be supplied. The piezoelectric element supply device 10 positions the piezoelectric element P to be supplied to the piezoelectric element supply position Sp based on the stop position determined for each piezoelectric element P to be supplied.

保持構件供給設備11乃係將連結成片狀的複數個保持構件H搬送到保持構件供給位置Sh並且在保持構件供給位置Sh將供給對象的保持構件H的位置進行定位之設備。在本實施型態中，保持構件供給設備11乃係具有作為致動器的伺服馬達與作為直動機構的滾珠螺桿單元等的單軸的直動單元。沿鉛直方向觀看，保持構件供給設備11係以使搬送保持構件H的方向成為X方向的方式配置在架台2上。 The holding member supply device 11 is a device that transports a plurality of holding members H connected in a sheet shape to the holding member supply position Sh and positions the holding member H to be supplied at the holding member supply position Sh. In this embodiment, the holding member supply device 11 is a single-axis linear motion unit including a servo motor as an actuator and a ball screw unit as a linear motion mechanism. Viewed in the vertical direction, the holding member supply device 11 is arranged on the stand 2 so that the direction in which the holding member H is transported becomes the X direction.

保持構件供給設備11係配置在架台2上的與壓電元件供給設備10相鄰的位置。保持構件供給設備11係具有載置複數個保持構件H的保持構件載置部11a。保持構件供給設備11係相應於伺服馬達的旋轉量而能夠將保持構件載置部11a移動到稼動範圍內的任意位置。保持構件供給設備11中，在保持構件待機位置Wh，複數個保持構件H係從未圖示的 外部的供給線被供給至保持構件載置部11a。保持構件供給設備11係能夠將載置在保持構件載置部11a的複數個保持構件H搬送到保持構件供給位置Sh。另外，在保持構件供給設備11中的保持構件供給位置Sh係預先決定。此外，為了將整齊排列成片狀的複數個保持構件H當中的任意位置的保持構件H定位至保持構件供給位置Sh，保持構件供給設備11係根據供給對象的保持構件H在保持構件載置部11a上的位置，按供給對象的每個保持構件H決定保持構件載置部11a的停止位置。保持構件供給設備11係根據按供給對象的每個保持構件H決定的停止位置，將供給對象的保持構件H定位至保持構件供給位置Sh。 The holding member supply device 11 is arranged on the stand 2 at a position adjacent to the piezoelectric element supply device 10 . The holding member supply equipment 11 has a holding member placing part 11a on which a plurality of holding members H are placed. The holding member supply device 11 can move the holding member placement portion 11a to any position within the operating range in accordance with the amount of rotation of the servo motor. In the holding member supply device 11, in the holding member standby position Wh, a plurality of holding members H are not shown in the figure. The external supply line is supplied to the holding member placement part 11a. The holding member supply equipment 11 is capable of conveying a plurality of holding members H placed on the holding member placing portion 11a to the holding member supply position Sh. In addition, the holding member supply position Sh in the holding member supply device 11 is determined in advance. In addition, in order to position the holding member H at any position among the plurality of holding members H neatly arranged in a sheet shape to the holding member supply position Sh, the holding member supply device 11 places the holding member H at the holding member placement portion according to the holding member H to be supplied. The stop position of the holding member placement portion 11a is determined for each holding member H to be supplied. The holding member supply device 11 positions the holding member H to be supplied to the holding member supply position Sh based on the stop position determined for each holding member H to be supplied.

吸附頭移動設備12乃係將複數個吸附頭20同時移動之設備。在本實施型態中，吸附頭移動設備12乃係具有作為致動器的伺服馬達與作為直動機構的滾珠螺桿單元等的單軸的直動單元。沿鉛直方向觀看，吸附頭移動設備12係以使搬送複數個吸附頭20的方向成為Y方向的方式配置在架台2上。此外，吸附頭移動設備12係相較於壓電元件供給設備10及保持構件供給設備11位在鉛直方向(Z方向)的上方。 The suction head moving device 12 is a device that moves a plurality of suction heads 20 simultaneously. In this embodiment, the suction head moving device 12 is a single-axis linear motion unit including a servo motor as an actuator and a ball screw unit as a linear motion mechanism. Viewed in the vertical direction, the suction head moving device 12 is arranged on the gantry 2 so that the direction in which the plurality of suction heads 20 is transported becomes the Y direction. In addition, the suction head moving device 12 is located above the piezoelectric element supply device 10 and the holding member supply device 11 in the vertical direction (Z direction).

吸附頭移動設備12係具有載置複數個吸附頭20的吸附頭載置部12a。吸附頭載置部12a係具有搭載複數個吸附頭20的水平的載置面。吸附頭移動設備12係相應於伺服馬達的旋轉量而能夠將吸附頭載置部12a移動到稼動範圍內的任意位置。吸附頭移動設備12係令載置在吸附頭載置部12a的載置面的複數個吸附頭20於從壓電元件供給位置Sp到保持構件供給位置Sh為止之間往復移動。 The suction head moving device 12 has a suction head placing part 12a on which a plurality of suction heads 20 are placed. The suction head placement portion 12a has a horizontal placement surface on which a plurality of suction heads 20 are mounted. The suction head moving device 12 can move the suction head placement part 12a to any position within the operating range in accordance with the amount of rotation of the servo motor. The suction head moving device 12 reciprocates the plurality of suction heads 20 placed on the mounting surface of the suction head placement portion 12a from the piezoelectric element supply position Sp to the holding member supply position Sh.

為了使複數個吸附頭20移動到壓電元件供給位置Sp，吸附 頭移動設備12係根據供給對象的壓電元件P在載盤載置部10a上的位置，按供給對象的每個壓電元件P決定吸附頭載置部12a的停止位置。同樣地，為了使複數個吸附頭20移動到保持構件供給位置Sh，吸附頭移動設備12係根據供給對象的保持構件H在保持構件載置部11a上的位置，按供給對象的每個保持構件H決定吸附頭載置部12a的停止位置。 In order to move the plurality of suction heads 20 to the piezoelectric element supply position Sp, suction The head moving device 12 determines the stop position of the suction head mounting portion 12a for each piezoelectric element P to be supplied based on the position of the piezoelectric element P to be supplied on the disk mounting portion 10a. Similarly, in order to move the plurality of suction heads 20 to the holding member supply position Sh, the suction head moving device 12 moves each holding member of the supply target based on the position of the holding member H of the supply target on the holding member placement part 11a. H determines the stop position of the suction head mounting portion 12a.

供給頭移動設備13乃係將複數個供給頭30同時移動之設備。在本實施型態中，供給頭移動設備13乃係具有作為致動器的伺服馬達與作為直動機構的滾珠螺桿單元等的單軸的直動單元。沿鉛直方向觀看，供給頭移動設備13係以使搬送複數個供給頭30的方向成為Y方向的方式配置在架台2上。供給頭移動設備13係位在保持構件供給設備11的鉛直方向(Z方向)的上方。 The supply head moving device 13 is a device that moves a plurality of supply heads 30 simultaneously. In this embodiment, the supply head moving device 13 is a single-axis linear motion unit including a servo motor as an actuator and a ball screw unit as a linear motion mechanism. Viewed in the vertical direction, the supply head moving device 13 is arranged on the gantry 2 so that the direction in which the plurality of supply heads 30 are transported becomes the Y direction. The supply head moving device 13 is located above the holding member supply device 11 in the vertical direction (Z direction).

供給頭移動設備13係具有載置複數個供給頭30的供給頭載置部13a。供給頭載置部13a係具有搭載複數個供給頭30的水平的載置面。供給頭移動設備13係相應於伺服馬達的旋轉量而能夠將供給頭載置部13a移動到稼動範圍內的任意位置。供給頭移動設備13係能夠將載置在供給頭載置部13a的複數個供給頭30從待機位置W搬送到保持構件供給位置Sh。另外，為了使複數個供給頭30移動到保持構件供給位置Sh，供給頭移動設備13係根據供給對象的保持構件H在保持構件載置部11a上的位置，按供給對象的每個保持構件H決定供給頭載置部13a的停止位置。 The supply head moving device 13 has a supply head placing part 13a on which a plurality of supply heads 30 are placed. The supply head mounting part 13a has a horizontal mounting surface on which a plurality of supply heads 30 are mounted. The supply head moving device 13 can move the supply head placing portion 13a to any position within the operating range in accordance with the amount of rotation of the servo motor. The supply head moving device 13 can transport the plurality of supply heads 30 placed on the supply head mounting part 13a from the waiting position W to the holding member supply position Sh. In addition, in order to move the plurality of supply heads 30 to the holding member supply position Sh, the supply head moving device 13 moves the supply head moving device 13 according to the position of the holding member H of the supply target on the holding member placement part 11a. The stop position of the supply head mounting part 13a is determined.

如圖3與圖4所示，吸附頭20乃係將壓電元件P藉由吸附嘴28吸附，並配置至保持構件H的凹部內之設備。吸附頭20係具有吸附頭用水平移動機構21、吸附頭用鉛直移動機構24、吸附頭用旋轉移動機構 26、及吸附嘴28。 As shown in FIGS. 3 and 4 , the suction head 20 is a device that sucks the piezoelectric element P through the suction nozzle 28 and arranges it into the recessed portion of the holding member H. The suction head 20 has a horizontal movement mechanism 21 for the suction head, a vertical movement mechanism 24 for the suction head, and a rotational movement mechanism for the suction head. 26, and suction nozzle 28.

吸附頭用水平移動機構21係具有沿第1方向移動的板狀的吸附頭用第1移動構件22、及沿與第1方向相異的第2方向移動的板狀的吸附頭用第2移動構件23。吸附頭用第1移動構件22係藉由作為致動器的步進馬達(stepping motor)與凸輪(cam)機構而能夠沿第1方向移動。吸附頭用第2移動構件23係藉由作為致動器的步進馬達與凸輪機構而能夠沿第2方向移動。 The horizontal movement mechanism 21 for the suction head has a plate-shaped first movement member 22 for the suction head that moves in the first direction, and a plate-shaped second movement member 22 for the suction head that moves in a second direction different from the first direction. Component 23. The first moving member 22 for the suction head is movable in the first direction by a stepping motor and a cam mechanism as an actuator. The second moving member 23 for the suction head is movable in the second direction by a stepping motor and a cam mechanism as an actuator.

吸附頭用第1移動構件22係配置於吸附頭移動設備12的吸附頭載置部12a。此時，沿鉛直方向觀看，吸附頭用第1移動構件22係以使移動方向的第1方向成為水平方向中的X方向的方式配置。藉此，吸附頭用第1移動構件22係能夠相對於吸附頭載置部12a沿水平方向中的X方向移動。 The first moving member 22 for the suction head is arranged in the suction head placement portion 12 a of the suction head moving device 12 . At this time, when viewed in the vertical direction, the first moving member 22 for the suction head is arranged so that the first direction of the moving direction becomes the X direction in the horizontal direction. Thereby, the first moving member 22 for the suction head can move in the X direction in the horizontal direction with respect to the suction head placement part 12a.

吸附頭用第2移動構件23係配置於吸附頭用第1移動構件22。沿鉛直方向觀看，吸附頭用第2移動構件23係以使移動方向的第2方向成為水平方向中的與X方向正交的Y方向的方式配置。藉此，吸附頭用第2移動構件23係能夠相對於吸附頭用第1移動構件22沿水平方向中的與X方向正交的Y方向移動。 The second moving member 23 for the suction head is arranged on the first moving member 22 for the suction head. Viewed in the vertical direction, the second moving member 23 for the suction head is arranged so that the second moving direction becomes the Y direction orthogonal to the X direction among the horizontal directions. Thereby, the second moving member 23 for an adsorption head can move in the Y direction orthogonal to the X direction in the horizontal direction relative to the first moving member 22 for an adsorption head.

如上述的方式構成的吸附頭用水平移動機構21係藉由吸附頭用第1移動構件22而能夠將吸附頭用第2移動構件23相對於吸附頭載置部12a沿水平方向中的X方向移動。此外，吸附頭用水平移動機構21係能夠將吸附頭用第2移動構件23相對於吸附頭用第1移動構件22沿水平方向中的與X方向正交的Y方向移動。亦即，吸附頭用水平移動機構21 係能夠將吸附頭用第2移動構件23相對於吸附頭載置部12a沿水平方向中的X方向及與X方向正交的Y方向移動。 The horizontal moving mechanism 21 for the suction head configured as described above can move the second moving member 23 for the suction head in the X direction in the horizontal direction with respect to the suction head placing part 12a by the first moving member 22 for the suction head. Move. In addition, the horizontal moving mechanism 21 for the suction head can move the second moving member 23 for the suction head in the Y direction orthogonal to the X direction in the horizontal direction relative to the first moving member 22 for the suction head. That is, the horizontal moving mechanism 21 for the suction head The second moving member 23 for the suction head can move in the X direction in the horizontal direction and the Y direction orthogonal to the X direction with respect to the suction head mounting portion 12 a.

吸附頭用鉛直移動機構24係具有沿相對於吸附頭用水平移動機構21的移動方向的第1方向及第2方向垂直的方向移動的板狀的吸附頭用第3移動構件25。吸附頭用第3移動構件25係藉由作為致動器的伺服馬達與作為直動機構的滾珠螺桿單元等而能夠沿第3方向移動。 The vertical moving mechanism 24 for the suction head has a plate-shaped third moving member 25 for the suction head that moves in a direction perpendicular to the first direction and the second direction of the movement direction of the horizontal movement mechanism 21 for the suction head. The third moving member 25 for the suction head is movable in the third direction by a servo motor as an actuator, a ball screw unit as a linear motion mechanism, or the like.

吸附頭用第3移動構件25係搭載於吸附頭用鉛直移動機構24。此時，吸附頭用第3移動構件25係以使移動方向的第3方向成為Z方向的方式配置。藉此，吸附頭用第3移動構件25係能夠相對於吸附頭載置部12a沿水平方向中的X方向及Y方向移動，且能夠沿作為鉛直方向的Z方向移動。 The third moving member 25 for the suction head is mounted on the vertical movement mechanism 24 for the suction head. At this time, the third moving member 25 for the suction head is arranged so that the third direction of the moving direction becomes the Z direction. Thereby, the third moving member 25 for the suction head is movable in the X direction and the Y direction in the horizontal direction with respect to the suction head mounting part 12a, and is movable in the Z direction which is the vertical direction.

吸附頭用旋轉移動機構26係具有：筒狀的吸附頭用第4移動構件27，係繞著沿吸附頭用鉛直移動機構24的移動方向的第3方向延伸的軸線進行移動(旋轉)。吸附頭用第4移動構件27係藉由作為致動器的步進馬達等而能夠沿旋轉方向移動。 The rotational movement mechanism 26 for the suction head has a cylindrical fourth movement member 27 for the suction head, and moves (rotates) around an axis extending in the third direction of the movement direction of the vertical movement mechanism 24 for the suction head. The fourth moving member 27 for the suction head is movable in the rotation direction by a stepping motor or the like as an actuator.

吸附頭用第4移動構件27係搭載於吸附頭用旋轉移動機構26。此時，吸附頭用第4移動構件27係以使作為旋轉軸線的第3方向成為Z方向的方式配置。亦即，吸附頭用第4移動構件27係能夠沿繞著鉛直軸旋轉的作為旋轉方向的θ方向旋轉。藉此，吸附頭用第4移動構件27係能夠相對於吸附頭載置部12a沿水平方向中的X方向及Y方向移動，且能夠沿作為鉛直方向的Z方向移動，且能夠沿θ方向旋轉。 The fourth moving member 27 for the suction head is mounted on the rotational movement mechanism 26 for the suction head. At this time, the fourth moving member 27 for the suction head is arranged so that the third direction as the rotation axis becomes the Z direction. That is, the fourth moving member 27 for the suction head is rotatable in the θ direction which is the rotation direction around the vertical axis. Thereby, the fourth moving member 27 for the suction head can move in the X direction and the Y direction in the horizontal direction with respect to the suction head mounting portion 12a, can move in the Z direction which is the vertical direction, and can rotate in the θ direction. .

吸附嘴28乃係對載盤T的凹部C內的壓電元件P進行吸附 之吸嘴。吸附嘴28係搭載於吸附頭用第4移動構件27。吸附嘴28係配置在吸附頭用第4移動構件27的下端部。吸附嘴28係具有能夠吸附壓電元件P的下端部形狀。此外，吸附嘴28係在下端部具有吸附孔。吸附嘴28係在藉由壓電元件P封堵住吸附孔的狀態將吸附孔內的壓力形成為負壓，藉此吸附壓電元件P。配置在吸附頭用第4移動構件27的吸附嘴28係能夠相對於吸附頭載置部12a沿水平方向中的X方向及Y方向移動，且能夠沿作為鉛直方向的Z方向移動，且能夠沿θ方向旋轉。 The adsorption nozzle 28 adsorbs the piezoelectric element P in the recess C of the carrier T. The mouthpiece. The suction nozzle 28 is mounted on the fourth moving member 27 for the suction head. The suction nozzle 28 is arranged at the lower end of the fourth moving member 27 for the suction head. The suction nozzle 28 has a lower end shape capable of suctioning the piezoelectric element P. In addition, the adsorption nozzle 28 has an adsorption hole at the lower end. The suction nozzle 28 absorbs the piezoelectric element P by forming the pressure in the suction hole into a negative pressure while the suction hole is blocked by the piezoelectric element P. The suction nozzle 28 arranged in the fourth moving member 27 for the suction head is movable in the X direction and the Y direction in the horizontal direction with respect to the suction head placement part 12a, and is movable in the Z direction which is the vertical direction, and is movable in the vertical direction. Rotate in the θ direction.

如上述，構成吸附頭20的吸附頭用水平移動機構21、吸附頭用鉛直移動機構24及吸附頭用旋轉移動機構26係按各自的每個移動方向具有作為致動器的伺服馬達。此外，吸附頭用水平移動機構21、吸附頭用鉛直移動機構24及吸附頭用旋轉移動機構26並未以彼此連動的方式構成。亦即，吸附頭用水平移動機構21、吸附頭用鉛直移動機構24及吸附頭用旋轉移動機構26係能夠互為獨立地個別沿各自的移動方向移動。 As described above, the horizontal movement mechanism 21 for the suction head, the vertical movement mechanism 24 for the suction head, and the rotational movement mechanism 26 for the suction head that constitute the suction head 20 have servo motors as actuators for each movement direction. In addition, the horizontal movement mechanism 21 for the suction head, the vertical movement mechanism 24 for the suction head, and the rotational movement mechanism 26 for the suction head are not configured to interlock with each other. That is, the horizontal movement mechanism 21 for the suction head, the vertical movement mechanism 24 for the suction head, and the rotational movement mechanism 26 for the suction head can move in respective movement directions independently of each other.

壓電震動裝置製造設備1係具有複數個吸附頭20。壓電震動裝置製造設備1係例如具有4台吸附頭20。4台吸附頭20係搭載在吸附頭移動設備12的吸附頭載置部12a。藉此，4台吸附頭20係構成為藉由吸附頭移動設備12而能夠同時於壓電元件供給位置Sp與保持構件供給位置Sh之間移動。另一方面，4台吸附頭20的可動部分彼此並未連結。亦即，4台吸附頭20的吸附嘴28係於搭載在吸附頭載置部12a的狀態下能夠互為獨立地個別沿X方向、Y方向、Z方向及θ方向移動。 The piezoelectric vibration device manufacturing equipment 1 has a plurality of suction heads 20 . The piezoelectric vibration device manufacturing equipment 1 has, for example, four suction heads 20 . The four suction heads 20 are mounted on the suction head placement portion 12 a of the suction head moving device 12 . Thereby, the four suction heads 20 are configured to be movable simultaneously between the piezoelectric element supply position Sp and the holding member supply position Sh by the suction head moving device 12 . On the other hand, the movable parts of the four suction heads 20 are not connected to each other. That is, the suction nozzles 28 of the four suction heads 20 can move independently from each other in the X direction, the Y direction, the Z direction, and the θ direction while being mounted on the suction head mounting portion 12 a.

吸附頭20係沿X方向排列配置2台。此外，在沿X方向排列配置2台的吸附頭20的Y方向係排列配置各1台吸附頭20。亦即，4 台吸附頭20係配置成沿X方向與Y方向排列的矩陣狀。沿X方向排列的吸附頭20的吸附嘴28係以成為設在載盤T上的凹部C及片狀的保持構件H的間隔Px的整數倍(即A倍)的間隔的方式配置。沿Y方向排列的吸附頭20的吸附嘴28係以成為設在載盤T上的凹部C及片狀的保持構件H的間隔Py的整數倍(即B倍)的間隔的方式配置。 Two suction heads 20 are arranged side by side in the X direction. In addition, two suction heads 20 are arranged side by side in the X direction, and one suction head 20 is arranged side by side in the Y direction. That is, 4 The stage suction heads 20 are arranged in a matrix array along the X direction and the Y direction. The suction nozzles 28 of the suction head 20 arranged in the X direction are arranged at an interval that is an integer multiple (that is, A times) of the interval Px between the concave portion C provided on the carrier T and the sheet-shaped holding member H. The suction nozzles 28 of the suction head 20 arranged in the Y direction are arranged at an interval that is an integral multiple (ie, B times) of the interval Py between the concave portion C provided on the carrier T and the sheet-shaped holding member H.

藉由如上述的方式構成，4台吸附頭20係在壓電元件供給位置Sp藉由各自的吸附嘴28而能夠一個一個地分別吸附位在載盤T上的壓電元件P。亦即，4台吸附頭20係分別能夠吸附任意選擇的壓電元件P、從前述任意選擇的壓電元件P起沿X方向的第A個壓電元件P、從前述任意選擇的壓電元件P起沿Y方向的第B個壓電元件P、及從前述任意選擇的壓電元件P起沿X方向的第A個且為沿Y方向的第B個壓電元件P。 With the structure as described above, the four suction heads 20 can suction the piezoelectric elements P positioned on the carrier T one by one through their respective suction nozzles 28 at the piezoelectric element supply position Sp. That is, the four suction heads 20 can respectively suck an arbitrarily selected piezoelectric element P, the A-th piezoelectric element P in the The B-th piezoelectric element P along the Y direction starting from P, and the A-th piezoelectric element P along the X direction starting from the aforementioned arbitrarily selected piezoelectric element P and being the B-th piezoelectric element P along the Y direction.

同樣地，4台吸附頭20係在保持構件供給位置Sh能夠將各自的吸附嘴28所吸附著的壓電元件P一個一個地配置至保持構件H的凹部內。亦即，4台吸附頭20係分別能夠吸附任意選擇的保持構件H、從前述任意選擇的保持構件H起沿X方向的第A個保持構件H、從前述任意選擇的保持構件H起沿Y方向的第B個保持構件H、及從前述任意選擇的保持構件H起沿X方向的第A個且為沿Y方向的第B個保持構件H。 Similarly, the four suction heads 20 can arrange the piezoelectric elements P adsorbed by the respective suction nozzles 28 into the recessed portions of the holding member H one by one at the holding member supply position Sh. That is, the four adsorption heads 20 can respectively adsorb the arbitrarily selected holding member H, the A-th holding member H along the X direction starting from the arbitrarily selected holding member H, and the arbitrarily selected holding member H starting from the aforementioned holding member H along the Y direction. The B-th holding member H in the direction, and the A-th holding member H along the X direction starting from the arbitrarily selected holding member H and the B-th holding member H along the Y direction.

如圖5所示，供給頭30乃係將接合材供給至片狀的複數個保持構件H的凹部內之設備。供給頭30係具有供給頭用水平移動機構31、供給頭用鉛直移動機構34、及供給設備36。 As shown in FIG. 5 , the supply head 30 is a device that supplies the joining material into the recessed portions of a plurality of sheet-shaped holding members H. The supply head 30 has a horizontal movement mechanism 31 for the supply head, a vertical movement mechanism 34 for the supply head, and a supply device 36 .

供給頭用水平移動機構31係具有沿第1方向移動的供給頭用第1移動構件32、及沿與第1方向相異的第2方向移動的供給頭用第2 移動構件33。供給頭用第1移動構件32係藉由作為致動器的步進馬達與凸輪機構而能夠沿第1方向移動。供給頭用第2移動構件33係藉由作為致動器的步進馬達與凸輪機構而能夠沿第2方向移動。 The horizontal moving mechanism 31 for the supply head has a first moving member 32 for the supply head that moves in the first direction, and a second moving member 32 for the supply head that moves in a second direction different from the first direction. Moving member 33. The first moving member 32 for the supply head is movable in the first direction by a stepping motor and a cam mechanism as an actuator. The second moving member 33 for the supply head is movable in the second direction by a stepping motor and a cam mechanism as an actuator.

供給頭用第1移動構件32係配置於供給頭移動設備13的供給頭載置部13a。此時，沿鉛直方向觀看，供給頭用第1移動構件32係以使移動方向的第1方向成為X方向的方式配置。藉此，供給頭用第1移動構件32係能夠相對於供給頭載置部13a沿水平方向中的X方向移動。 The first moving member 32 for the supply head is arranged in the supply head placing portion 13 a of the supply head moving device 13 . At this time, when viewed in the vertical direction, the first moving member 32 for the supply head is arranged so that the first direction of the moving direction becomes the X direction. Thereby, the first moving member 32 for the supply head is movable in the X direction in the horizontal direction with respect to the supply head mounting part 13a.

供給頭用第2移動構件33係配置於供給頭用第1移動構件32。沿鉛直方向觀看，供給頭用第2移動構件33係以使移動方向的第2方向成為水平方向中的與X方向正交的Y方向的方式配置。藉此，供給頭用第2移動構件33係能夠相對於供給頭用第1移動構件32沿水平方向中的Y方向移動。 The second moving member 33 for the supply head is arranged on the first moving member 32 for the supply head. Viewed in the vertical direction, the second moving member 33 for the supply head is arranged so that the second direction of the moving direction becomes the Y direction orthogonal to the X direction among the horizontal directions. Thereby, the second moving member 33 for the supply head can move in the Y direction in the horizontal direction relative to the first moving member 32 for the supply head.

如上述的方式構成的供給頭用水平移動機構31係藉由供給頭用第1移動構件32而能夠將供給頭用第2移動構件33相對於供給頭載置部13a沿水平方向中的X方向移動。此外，供給頭用水平移動機構31係能夠將供給頭用第2移動構件33相對於供給頭用第1移動構件32沿水平方向中的與X方向正交的Y方向移動。亦即，供給頭用水平移動機構31係能夠將供給頭用第2移動構件33相對於供給頭載置部13a沿水平方向中的X方向及與X方向正交的Y方向移動。 The horizontal moving mechanism 31 for the supply head configured as described above can move the second moving member 33 for the supply head in the X direction in the horizontal direction with respect to the supply head mounting part 13 a by the first moving member 32 for the supply head. Move. In addition, the horizontal moving mechanism 31 for the supply head can move the second moving member 33 for the supply head in the Y direction orthogonal to the X direction in the horizontal direction relative to the first moving member 32 for the supply head. That is, the supply head horizontal moving mechanism 31 can move the supply head second moving member 33 in the X direction in the horizontal direction and the Y direction orthogonal to the X direction relative to the supply head mounting portion 13 a.

供給頭用鉛直移動機構34係具有：板狀的供給頭用第3移動構件35，係沿相對於供給頭用水平移動機構31的移動方向的第1方向及第2方向垂直的方向移動。供給頭用第3移動構件35係藉由作為致動器的 伺服馬達與作為直動機構的滾珠螺桿單元等而能夠沿第3方向移動。 The vertical movement mechanism 34 for the supply head has a plate-shaped third movement member 35 for the supply head, and moves in a direction perpendicular to the first direction and the second direction of the movement direction of the horizontal movement mechanism 31 for the supply head. The third moving member 35 for the supply head is driven by The servo motor and the ball screw unit as a linear motion mechanism can move in the third direction.

供給頭用第3移動構件35係配置於供給頭用第2移動構件33。此時，供給頭用第3移動構件35係以使移動方向的第3方向成為Z方向的方式配置。藉此，供給頭用第3移動構件35係能夠相對於供給頭載置部13a沿水平方向中的X方向及Y方向移動，且能夠沿作為鉛直方向的Z方向移動。 The third moving member 35 for the supply head is arranged on the second moving member 33 for the supply head. At this time, the third moving member 35 for the supply head is arranged so that the third direction of the moving direction becomes the Z direction. Thereby, the third moving member 35 for the supply head is movable in the X direction and the Y direction in the horizontal direction with respect to the supply head mounting part 13a, and is movable in the Z direction which is the vertical direction.

供給設備36乃係將接合材供給至配置壓電元件P的保持構件H的凹部內之設備。在本實施型態中，供給設備36乃係將導電性的接著劑吐出達預定量的吐出設備。供給設備36係配置於供給頭用第3移動構件35。供給設備36係具有能夠將接合材供給至鉛直方向(Z方向)下方的保持構件H的凹部內之形狀的吐出嘴36a。沿水平方向觀看，供給設備36係朝鉛直方向(Z方向)下方從吐出嘴36a吐出接合材。此外，吐出嘴36a係構成為：在從Z方向接觸到保持構件H時，能夠沿Z方向移動。搭載於供給頭用第3移動構件35的供給設備36係能夠相對於供給頭載置部13a沿水平方向中的X方向及Y方向移動，且能夠沿作為鉛直方向的Z方向移動。 The supply device 36 is a device that supplies the bonding material into the recessed portion of the holding member H where the piezoelectric element P is arranged. In this embodiment, the supply device 36 is a discharge device that discharges a predetermined amount of conductive adhesive. The supply device 36 is arranged on the third moving member 35 for the supply head. The supply device 36 has a discharge nozzle 36 a having a shape capable of supplying the joining material into the recess of the holding member H downward in the vertical direction (Z direction). When viewed in the horizontal direction, the supply device 36 discharges the joining material from the discharge nozzle 36a downward in the vertical direction (Z direction). In addition, the discharge nozzle 36a is configured to be movable in the Z direction when contacting the holding member H from the Z direction. The supply device 36 mounted on the third moving member 35 for the supply head is movable in the X direction and the Y direction in the horizontal direction with respect to the supply head mounting part 13a, and is movable in the Z direction which is the vertical direction.

此外，供給設備36係具有冷卻設備36b。冷卻設備36b係由半導體熱電元件即帕耳帖(Peltier)元件與冷卻前述帕耳帖元件的空冷風扇(fan)構成。冷卻設備36b係位在吐出嘴36a近旁。冷卻設備36b係將供給設備36內的接合材的溫度維持在適切的溫度。藉此，供給設備36係其內部的接合材的黏度維持在一定的範圍，因此能夠抑制接合材阻塞在吐出嘴36a。 Furthermore, the supply device 36 has a cooling device 36b. The cooling device 36b is composed of a Peltier element, which is a semiconductor thermoelectric element, and an air-cooling fan (fan) that cools the Peltier element. The cooling device 36b is located near the discharge nozzle 36a. The cooling device 36b maintains the temperature of the joining material in the supply device 36 at an appropriate temperature. Thereby, the viscosity of the bonding material inside the supply device 36 is maintained within a certain range, so that the bonding material can be prevented from being clogged in the discharge nozzle 36a.

此外，供給設備36係具有檢測吐出嘴36a的Z方向的位置 的接觸感測器(未圖示)。接觸感測器乃係檢測吐出嘴36a的Z方向的運動之感測器。也因此，接觸感測器係能夠檢測出吐出嘴36a的前端接觸到保持構件H。後述的控制設備16係以接觸感測器檢測到吐出嘴36a與保持構件H的接觸時之供給頭用第3移動構件35的位置作為零點來控制供給設備36。接觸感測器係配置在相較於供給頭用第3移動構件35所具有的未圖示的Z方向的導引設備更靠近供給設備36側處。較佳為，接觸感測器係配置在吐出嘴36a的Z軸線上。 In addition, the supply device 36 has a position for detecting the Z direction of the discharge nozzle 36a. contact sensor (not shown). The contact sensor is a sensor that detects the movement of the discharge nozzle 36a in the Z direction. Therefore, the contact sensor can detect that the tip of the discharge nozzle 36a comes into contact with the holding member H. The control device 16 to be described later controls the supply device 36 using the position of the third moving member 35 for the supply head when the contact sensor detects the contact between the discharge nozzle 36a and the holding member H as a zero point. The contact sensor is arranged closer to the supply device 36 than the Z-direction guide device (not shown) included in the third moving member 35 for the supply head. Preferably, the contact sensor is arranged on the Z axis of the discharge nozzle 36a.

如上述的方式構成供給頭30的供給頭用水平移動機構31及供給頭用鉛直移動機構34係按各自的每個移動方向具有作為致動器的伺服馬達。此外，供給頭用水平移動機構31及供給頭用鉛直移動機構34並未以彼此連動的方式構成。亦即，供給頭用水平移動機構31及供給頭用鉛直移動機構34係能夠互為獨立地個別移動。 The supply head horizontal movement mechanism 31 and the supply head vertical movement mechanism 34 of the supply head 30 configured as described above have servo motors as actuators for each movement direction. In addition, the horizontal movement mechanism 31 for the supply head and the vertical movement mechanism 34 for the supply head are not configured to interlock with each other. That is, the horizontal movement mechanism 31 for the supply head and the vertical movement mechanism 34 for the supply head can move independently of each other.

壓電震動裝置製造設備1係具有複數個供給頭30。壓電震動裝置製造設備1係例如具有4台供給頭30。4台供給頭30係配置在供給頭移動設備13的供給頭載置部13a。藉此，4台供給頭30係構成為藉由供給頭移動設備13而能夠同時於待機位置W與保持構件供給位置Sh之間移動。另一方面，4台供給頭30的可動部分彼此並未連結。亦即，4台供給頭30的供給設備36係於搭載在供給頭載置部13a的狀態下能夠互為獨立地個別沿X方向、Y方向及Z方向移動。 The piezoelectric vibration device manufacturing equipment 1 has a plurality of supply heads 30 . The piezoelectric vibration device manufacturing equipment 1 has, for example, four supply heads 30 . The four supply heads 30 are arranged in the supply head placement portion 13 a of the supply head moving equipment 13 . Thereby, the four supply heads 30 are configured to be movable simultaneously between the waiting position W and the holding member supply position Sh by the supply head moving device 13 . On the other hand, the movable parts of the four supply heads 30 are not connected to each other. That is, the supply equipment 36 of the four supply heads 30 can move in the X direction, the Y direction, and the Z direction independently of each other while being mounted on the supply head mounting portion 13a.

供給頭30係沿X方向排列配置2台。此外，在沿X方向排列配置2台的供給頭30的Y方向係排列配置各1台供給頭30。亦即，4台供給頭30係配置成沿X方向與Y方向排列的矩陣狀。沿X方向排列的 供給頭30的供給設備36的吐出嘴36a係以成為片狀的保持構件H的間隔Px的整數倍(即A倍)的間隔的方式配置。沿Y方向排列的供給頭30的供給設備36的吐出嘴36a係以成為片狀的保持構件H的間隔Py的整數倍(即B倍)的間隔的方式配置。 Two supply heads 30 are arranged side by side in the X direction. In addition, two supply heads 30 are arranged side by side in the X direction, and one supply head 30 is arranged side by side in the Y direction. That is, the four supply heads 30 are arranged in a matrix shape along the X direction and the Y direction. arranged along the X direction The discharge nozzles 36 a of the supply device 36 of the supply head 30 are arranged at intervals that are an integral multiple of the interval Px of the sheet-shaped holding members H (that is, A times). The ejection nozzles 36 a of the supply devices 36 of the supply heads 30 arranged in the Y direction are arranged at intervals that are an integral multiple (that is, B times) of the interval Py of the sheet-shaped holding members H.

此外，在供給頭載置部13a係載置有對供給設備36所試吐的接合材的塗布徑進行確認的確認攝像機37。此外，在後述的待機位置W(供給設備36的下方)係配置有供給設備36進行試吐的試吐部38。 In addition, a confirmation camera 37 for confirming the coating diameter of the bonding material discharged by the supply device 36 is mounted on the supply head mounting portion 13a. In addition, a trial vomiting unit 38 for trial vomiting by the supply device 36 is disposed at a waiting position W (under the supply device 36) to be described later.

藉由如上述的方式構成，在保持構件供給位置Sh，4台供給頭30係於將接合材供給至保持構件H時，無需藉由供給頭移動設備13及供給頭用水平移動機構31使供給設備36的位置移動，就能夠藉由各自的供給設備36將接合材供給至保持構件H。亦即，4台供給頭30係能夠將接合材供給至任意選擇的保持構件H、從前述任意選擇的保持構件H起沿X方向的第A個保持構件H、從前述任意選擇的保持構件H起沿Y方向的第B個保持構件H、及從前述任意選擇的保持構件H起沿X方向的第A個且為沿Y方向的第B個保持構件H。 With the structure as described above, when the four supply heads 30 supply the joining material to the holding member H at the holding member supply position Sh, there is no need to use the supply head moving device 13 and the supply head horizontal movement mechanism 31 to supply the joining material. By moving the position of the device 36, the joining material can be supplied to the holding member H by the respective supply device 36. That is, the four supply heads 30 can supply the joining material to the arbitrarily selected holding member H, the A-th holding member H in the X direction from the arbitrarily selected holding member H, and the arbitrarily selected holding member H from the above. The B-th holding member H along the Y direction, and the A-th holding member H along the X direction starting from the aforementioned arbitrarily selected holding member H and being the B-th holding member H along the Y direction.

如圖1與圖6所示，作為壓電元件位置量測設備的攝像機14乃係量測4個吸附嘴28分別吸附起來的壓電元件P相對於吸附頭20的位置之攝像機。攝像機14係在架台2上，相較於吸附頭移動設備12位在鉛直方向的下方。此外，沿鉛直方向觀看，攝像機14係配置在與藉由吸附頭移動設備12而移動的吸附頭20重疊的位置。此外，攝像機14係以拍攝鉛直方向上方的方式設置。藉此，攝像機14係能夠從吸附頭20的下方拍攝藉由吸附頭移動設備12而移動的吸附頭20及吸附頭20分別吸附著的壓 電元件P。亦即，攝像機14係能夠拍攝供量測4個吸附嘴28分別吸附起來的壓電元件P相對於吸附頭20的位置之用的圖像。 As shown in FIGS. 1 and 6 , the camera 14 as a piezoelectric element position measurement device is a camera that measures the position of the piezoelectric element P that is adsorbed by the four adsorption nozzles 28 relative to the adsorption head 20 . The camera 14 is attached to the stand 2 and is located vertically below the suction head moving device 12 . In addition, when viewed in the vertical direction, the camera 14 is disposed at a position overlapping the suction head 20 moved by the suction head moving device 12 . In addition, the camera 14 is installed to capture images in the vertical direction upward. Thereby, the camera 14 can capture the suction head 20 moved by the suction head moving device 12 and the pressure of the suction head 20 adsorbing respectively from below the suction head 20 . Electrical components P. That is, the camera 14 can capture images for measuring the positions of the piezoelectric elements P that are respectively sucked by the four suction nozzles 28 relative to the suction head 20 .

作為保持構件位置量測設備的雷射量測設備15乃係量測連結成片狀的複數個保持構件H的含有位置的形狀之量測設備。雷射量測設備15係在架台2上，相較於保持構件供給設備11位在鉛直方向的上方。此外，沿鉛直方向觀看，雷射量測設備15係配置在與藉由保持構件供給設備11搬送的片狀的保持構件H重疊的位置。此外，雷射量測設備15係以往鉛直方向下方照射雷射的方式設置。藉此，雷射量測設備15係能夠從保持構件H的上方量測被供給至保持構件供給設備11的片狀的保持構件H。 The laser measuring device 15 as a holding member position measuring device is a measuring device that measures the shape including the position of a plurality of holding members H connected in a sheet shape. The laser measurement device 15 is attached to the stand 2 and is located vertically above the holding member supply device 11 . In addition, when viewed in the vertical direction, the laser measurement device 15 is disposed in a position overlapping the sheet-shaped holding member H conveyed by the holding member supply device 11 . In addition, the laser measuring device 15 is arranged to irradiate laser downward in the vertical direction. Thereby, the laser measuring device 15 can measure the sheet-shaped holding member H supplied to the holding member supply device 11 from above the holding member H.

亦即，雷射量測設備15係根據連結成片狀的複數個保持構件H各者的形狀、位置、各個部位的鉛直方向的厚度資訊而能夠以三維來量測形狀。此外，雷射量測設備15係構成為能夠旋轉及沿水平方向移動，以對各個保持構件H的水平方向中的位置及旋轉程度進行匹配。藉此，能夠更正確地量測藉由雷射掃描所掃描出的保持構件的含有位置的形狀。 That is, the laser measuring device 15 can measure the shape in three dimensions based on the shape, position, and vertical thickness information of each part of the plurality of holding members H connected in a sheet shape. In addition, the laser measurement device 15 is configured to be able to rotate and move in the horizontal direction to match the position and degree of rotation of each holding member H in the horizontal direction. Thereby, the shape of the holding member including the position scanned by laser scanning can be measured more accurately.

如圖6所示，控制設備16係控制壓電元件供給設備10、保持構件供給設備11、吸附頭移動設備12、供給頭移動設備13、吸附頭20、供給頭30、攝像機14及雷射量測設備15。在實體上，控制設備16係以匯流排(bus)連接CPU(Central Processing Unit；中央處理器)、ROM(Read Only Memory；唯讀記憶體)、RAM(Random Access Memory；隨機存取記憶體)等。或者，控制設備16係亦可由單晶片(one chip)的LSI(Large Scale Integrated circuit；大型積體電路)等構成。控制設備16係為了控制各致動器、攝像機14、雷射量測設備15的動作、處理圖像資料而儲存有 各種程式(program)及資料。 As shown in FIG. 6 , the control device 16 controls the piezoelectric element supply device 10 , the holding member supply device 11 , the suction head moving device 12 , the supply head moving device 13 , the suction head 20 , the supply head 30 , the camera 14 and the laser quantity. Test equipment 15. Physically, the control device 16 is connected to the CPU (Central Processing Unit; central processing unit), ROM (Read Only Memory; read-only memory), and RAM (Random Access Memory; random access memory) via a bus. wait. Alternatively, the control device 16 may be composed of a one-chip LSI (Large Scale Integrated circuit) or the like. The control device 16 stores the operation of each actuator, camera 14, and laser measurement device 15 and processes image data. Various programs and information.

控制設備16係與壓電元件供給設備10、保持構件供給設備11、吸附頭移動設備12及供給頭移動設備13的各伺服馬達電性連接，能夠分別獨立地個別進行控制。此外，控制設備16係與吸附頭20的吸附頭用水平移動機構21、吸附頭用鉛直移動機構24及吸附頭用旋轉移動機構26的伺服馬達電性連接，能夠分別獨立地個別進行控制。此外，控制設備16係能夠對未圖示的吸附頭20的切換吸引用的電磁閥進行控制。此外，控制設備16係與供給頭用水平移動機構31及供給頭用鉛直移動機構34的伺服馬達電性連接，能夠分別獨立地個別進行控制。此外，控制設備16係與4個供給設備36電性連接，能夠分別獨立地個別進行控制。 The control device 16 is electrically connected to the servo motors of the piezoelectric element supply device 10 , the holding member supply device 11 , the suction head moving device 12 and the supply head moving device 13 , and can be controlled independently and individually. In addition, the control device 16 is electrically connected to the servo motors of the suction head horizontal movement mechanism 21 , the suction head vertical movement mechanism 24 , and the suction head rotation movement mechanism 26 of the suction head 20 , and can be controlled independently. In addition, the control device 16 can control a solenoid valve for switching suction of the suction head 20 (not shown). In addition, the control device 16 is electrically connected to the servo motors of the horizontal movement mechanism 31 for the supply head and the vertical movement mechanism 34 for the supply head, and can be controlled independently. In addition, the control device 16 is electrically connected to the four supply devices 36 and can be controlled independently.

控制設備16係與攝像機14電性連接，能夠對攝像機14進行控制。此外，控制設備16係能夠取得攝像機14所拍攝到的圖像。此外，控制設備16係與雷射量測設備15電性連接，能夠對雷射量測設備15進行控制。此外，控制設備16係能夠取得由雷射量測設備15所量測到的關於複數個保持構件H各者的位置、形狀之量測值。 The control device 16 is electrically connected to the camera 14 and can control the camera 14 . In addition, the control device 16 can obtain the image captured by the camera 14 . In addition, the control device 16 is electrically connected to the laser measurement device 15 and can control the laser measurement device 15 . In addition, the control device 16 can obtain the measurement values of the positions and shapes of each of the plurality of holding members H measured by the laser measurement device 15 .

如上述的方式構成的壓電震動裝置製造設備1係具有複數個能夠獨立地個別將吸附嘴28沿X方向、Y方向、Z方向及θ方向移動的吸附頭20。此外，壓電震動裝置製造設備1係能夠分別獨立地個別控制複數個吸附頭20的吸附嘴28的位置。此外，壓電震動裝置製造設備1係具有複數個能夠獨立地個別將接合材的供給設備36沿X方向、Y方向及Z方向移動的供給頭30。此外，壓電震動裝置製造設備1係能夠分別獨立地個別控制複數個供給頭30的供給設備36的位置。 The piezoelectric vibration device manufacturing equipment 1 configured as described above has a plurality of suction heads 20 that can independently move the suction nozzles 28 in the X direction, the Y direction, the Z direction, and the θ direction. In addition, the piezoelectric vibration device manufacturing equipment 1 can individually and independently control the positions of the suction nozzles 28 of the plurality of suction heads 20 . In addition, the piezoelectric vibration device manufacturing equipment 1 has a plurality of supply heads 30 that can independently and individually move the supply equipment 36 of the bonding material in the X direction, the Y direction, and the Z direction. In addition, the piezoelectric vibration device manufacturing equipment 1 can independently control the positions of the supply devices 36 of the plurality of supply heads 30 .

<關於壓電元件的吸附位置與保持構件的位置> <About the adsorption position of the piezoelectric element and the position of the holding member>

接著，利用圖2A及圖2B，針對本發明的壓電震動裝置製造設備1的4個吸附頭20吸附的壓電元件P在載盤T上的位置、及供配置壓電元件P的保持構件H的位置進行說明。 Next, using FIGS. 2A and 2B , the positions of the piezoelectric elements P adsorbed by the four suction heads 20 of the piezoelectric vibration device manufacturing equipment 1 of the present invention on the carrier T and the holding members for arranging the piezoelectric elements P are shown. The position of H is explained.

4個吸附頭20的吸附嘴28係彼此沿X方向具有間隔Px的A倍的間隔，且沿Y方向具有間隔Py的B倍的間隔。也因此，4個吸附頭20當中的第1吸附頭20係吸附收容有壓電元件P的載盤T上的複數個凹部C當中的任意位置的凹部C所收容的第1壓電元件P1。4個吸附頭20當中的第2吸附頭20係吸附從收容有第1壓電元件P1的凹部C起沿X方向隔鄰的第A個凹部C所收容的第2壓電元件P2。4個吸附頭20當中的第3吸附頭20係吸附從收容有第1壓電元件P1的凹部C起沿Y方向隔鄰的第B個凹部C所收容的第3壓電元件P3。4個吸附頭20當中的第4吸附頭20係吸附從收容有第1壓電元件P1的凹部C起沿X方向隔鄰的第A個且為沿Y方向隔鄰的第B個凹部C所收容的第4壓電元件P4。 The suction nozzles 28 of the four suction heads 20 have a distance A times the distance Px from each other in the X direction, and have a distance B times the distance Py along the Y direction. Therefore, the first suction head 20 among the four suction heads 20 suctions the first piezoelectric element P1 accommodated in the concave portion C at any position among the plurality of concave portions C on the carrier T in which the piezoelectric element P is stored. The second suction head 20 among the four suction heads 20 suctions the second piezoelectric element P2 housed in the A-th recess C adjacent in the X direction from the recess C in which the first piezoelectric element P1 is housed. 4 pieces The third suction head 20 among the suction heads 20 suctions the third piezoelectric element P3 housed in the B-th recess C adjacent in the Y direction from the recess C in which the first piezoelectric element P1 is housed. Four suction heads. The fourth suction head 20 among the 20 is for suctioning the Ath adjacent recessed portion C in the X direction from the recessed portion C housing the first piezoelectric element P1 and the fourth recessed portion C accommodated in the Bth recessed portion adjacent along the Y direction. Piezoelectric element P4.

在以從收容有第1壓電元件P1的凹部C起沿X方向隔鄰的第1個凹部C所收容的壓電元件P作為吸附對象的壓電元件P進行吸附的情形中，4個吸附頭20係以從分別收容有第1壓電元件P1、第2壓電元件P2、第3壓電元件P3及第4壓電元件P4的凹部C起沿X方向隔鄰的第1個凹部C所收容的壓電元件P作為吸附對象的壓電元件P進行吸附。在以從收容有第1壓電元件P1的凹部C起沿Y方向隔鄰的第1個凹部C所收容的壓電元件P作為吸附對象的壓電元件P進行吸附的情形中，4個吸附頭20係以從分別收容有第1壓電元件P1、第2壓電元件P2、第3壓 電元件P3及第4壓電元件P4的凹部C起沿Y方向隔鄰的第1個凹部C所收容的壓電元件P作為吸附對象的壓電元件P進行吸附。 In the case of adsorbing the piezoelectric element P accommodated in the first recessed portion C adjacent in the X direction from the recessed portion C in which the first piezoelectric element P1 is accommodated, as the piezoelectric element P to be adsorbed, four adsorbed The head 20 is a first recess C adjacent to the recess C in the X direction from the recess C in which the first piezoelectric element P1, the second piezoelectric element P2, the third piezoelectric element P3 and the fourth piezoelectric element P4 are respectively accommodated. The accommodated piezoelectric element P is adsorbed as the piezoelectric element P to be adsorbed. In the case of adsorbing the piezoelectric element P accommodated in the first recessed portion C adjacent in the Y direction from the recessed portion C in which the first piezoelectric element P1 is accommodated, as the piezoelectric element P to be adsorbed, four adsorbed The head 20 accommodates the first piezoelectric element P1, the second piezoelectric element P2, and the third piezoelectric element P2 respectively. The piezoelectric element P accommodated in the first recessed portion C adjacent in the Y direction from the recessed portion C of the electric element P3 and the fourth piezoelectric element P4 is adsorbed as the piezoelectric element P to be adsorbed.

因此，在載盤T上的複數個凹部C中，4個吸附頭20係分別吸附以從收容有第1壓電元件P1、第2壓電元件P2、第3壓電元件P3及第4壓電元件P4的凹部C起到分別沿X方向隔鄰的第(A-1)個凹部C為止的範圍、和從收容有第1壓電元件P1、第2壓電元件P2、第3壓電元件P3及第4壓電元件P4的凹部C起到分別沿Y方向隔鄰的第(B-1)個凹部C為止的範圍所圍起的4個區域所含的凹部C所收容的壓電元件P。亦即，第1吸附頭20係吸附含有收容有第1壓電元件P1的凹部C之第1壓電元件區域Rp1內的壓電元件P。第2吸附頭20係吸附含有收容有第2壓電元件P2的凹部C之第2壓電元件區域Rp2內的壓電元件P。第3吸附頭20係吸附含有收容有第3壓電元件P3的凹部C之第3壓電元件區域Rp3內的壓電元件P。第4吸附頭20係吸附含有收容有第4壓電元件P4的凹部C之第4壓電元件區域Rp4內的壓電元件P。如上述，各吸附頭20係分別吸附數目與吸附頭20的數目對應且為相等的形狀的區域所含的壓電元件P。 Therefore, in the plurality of recesses C on the carrier T, the four suction heads 20 respectively suction to accommodate the first piezoelectric element P1, the second piezoelectric element P2, the third piezoelectric element P3 and the fourth piezoelectric element. The range from the recessed portion C of the electric element P4 to the (A-1)th recessed portion C adjacent to each other in the The piezoelectric elements contained in the four regions enclosed by the recessed portions C of the element P3 and the fourth piezoelectric element P4 and ending with the (B-1)th recessed portion C adjacent in the Y direction are accommodated in the recessed portions C. Component P. That is, the first suction head 20 suctions the piezoelectric element P in the first piezoelectric element region Rp1 including the recessed portion C in which the first piezoelectric element P1 is accommodated. The second suction head 20 suctions the piezoelectric element P in the second piezoelectric element region Rp2 including the recess C in which the second piezoelectric element P2 is accommodated. The third suction head 20 suctions the piezoelectric element P in the third piezoelectric element region Rp3 including the recess C in which the third piezoelectric element P3 is accommodated. The fourth suction head 20 suctions the piezoelectric element P in the fourth piezoelectric element region Rp4 including the recess C in which the fourth piezoelectric element P4 is accommodated. As described above, each of the suction heads 20 suctions the piezoelectric elements P contained in a region having an equal shape corresponding to the number of the suction heads 20 .

吸附著第1壓電元件P1的第1吸附頭20係將第1壓電元件P1配置至任意位置的保持構件H即第1保持構件H1的凹部內。吸附著第2壓電元件P2的第2吸附頭20係將第2壓電元件P2配置至從第1保持構件H1起沿X方向隔鄰的第A個保持構件H即第2保持構件H2的凹部內。吸附著第3壓電元件P3的第3吸附頭20係將第3壓電元件P3配置至從第1保持構件H1起沿Y方向隔鄰的第B個保持構件H即第3保持構 件H3的凹部內。吸附著第4壓電元件P4的第4吸附頭20係將第4壓電元件P4配置至從第1保持構件H1起沿X方向隔鄰的第A個且為沿Y方向隔鄰的第B個保持構件H即第4保持構件H4的凹部內。如上述，各保持構件H係保持有壓電元件P。 The first suction head 20 that adsorbs the first piezoelectric element P1 arranges the first piezoelectric element P1 in the recessed portion of the first holding member H1 of the holding member H at an arbitrary position. The second suction head 20 that adsorbs the second piezoelectric element P2 arranges the second piezoelectric element P2 on the A-th holding member H adjacent in the X direction from the first holding member H1, that is, the second holding member H2. inside the recess. The third suction head 20 that adsorbs the third piezoelectric element P3 disposes the third piezoelectric element P3 to the B-th holding member H adjacent in the Y direction from the first holding member H1, that is, the third holding member. into the recess of piece H3. The fourth suction head 20 that adsorbs the fourth piezoelectric element P4 disposes the fourth piezoelectric element P4 to the Ath adjacent to the X direction from the first holding member H1 and to the Bth adjacent to the Y direction. into the recess of the first holding member H, that is, the fourth holding member H4. As described above, each holding member H holds the piezoelectric element P.

在將壓電元件P配置至從配置有第1壓電元件P1的第1保持構件H1起沿X方向隔鄰的第1個保持構件H的情形中，4個吸附頭20係將壓電元件P配置至從第1保持構件H1、第2保持構件H2、第3保持構件H3及第4保持構件H4起沿X方向隔鄰的第1個保持構件H。在將壓電元件P配置至從配置有第1壓電元件P1的第1保持構件H1起沿Y方向隔鄰的第1個保持構件H的凹部內的情形中，4個吸附頭20係將壓電元件P配置至從第1保持構件H1、第2保持構件H2、第3保持構件H3及第4保持構件H4起沿Y方向隔鄰的第1個保持構件H的凹部內。 When the piezoelectric element P is arranged on the first holding member H adjacent in the X direction from the first holding member H1 on which the first piezoelectric element P1 is arranged, the four suction heads 20 hold the piezoelectric element P is arranged on the first holding member H next to the first holding member H1, the second holding member H2, the third holding member H3, and the fourth holding member H4 in the X direction. When the piezoelectric element P is arranged in the recess of the first holding member H adjacent in the Y direction from the first holding member H1 where the first piezoelectric element P1 is arranged, the four suction heads 20 The piezoelectric element P is arranged in the recessed portion of the first holding member H adjacent to the first holding member H1, the second holding member H2, the third holding member H3, and the fourth holding member H4 in the Y direction.

因此，在連結成片狀的複數個保持構件H中，4個吸附頭20係將壓電元件P分別配置至以從第1保持構件H1、第2保持構件H2、第3保持構件H3及第4保持構件H4起到分別沿X方向隔鄰的第(A-1)個保持構件H為止的範圍、和從第1保持構件H1、第2保持構件H2、第3保持構件H3及第4保持構件H4起到分別沿Y方向隔鄰的第(B-1)個保持構件H為止的範圍所圍起的4個區域所含的保持構件H的凹部內。亦即，第1吸附頭20係將第1壓電元件P1配置至含有第1保持構件H1之第1保持構件區域Rh1內的保持構件H的凹部內。第2吸附頭20係將第2壓電元件P2配置至含有第2保持構件H2之第2保持構件區域Rh2內的保持構件H的凹部內。第3吸附頭20係將第3壓電元件P3配置至含有第3保 持構件H3之第3保持構件區域Rh3內的保持構件H的凹部內。第4吸附頭20係將第4壓電元件P4分別配置至含有第4保持構件H4之第4保持構件區域Rh4內的保持構件H的凹部內。如上述，各吸附頭20係將壓電元件P分別配置至數目與吸附頭20的數目對應且彼此為相等的形狀的區域所含的保持構件H的凹部內。 Therefore, among the plurality of holding members H connected in a sheet shape, the four suction heads 20 respectively arrange the piezoelectric elements P to the first holding member H1, the second holding member H2, the third holding member H3, and the third holding member H3. 4 The range from the holding member H4 to the (A-1)th holding member H adjacent in the X direction, and from the first holding member H1, the second holding member H2, the third holding member H3 and the fourth holding member H4. The member H4 reaches into the recessed portion of the holding member H included in the four areas enclosed by the range up to the (B-1)th holding member H adjacent in the Y direction. That is, the first suction head 20 arranges the first piezoelectric element P1 in the recessed portion of the holding member H in the first holding member region Rh1 including the first holding member H1. The second suction head 20 arranges the second piezoelectric element P2 in the recessed portion of the holding member H in the second holding member region Rh2 including the second holding member H2. The third suction head 20 disposes the third piezoelectric element P3 to include the third piezoelectric element P3. In the recessed portion of the holding member H in the third holding member region Rh3 of the holding member H3. The fourth suction head 20 arranges the fourth piezoelectric elements P4 in the recessed portions of the holding member H in the fourth holding member region Rh4 including the fourth holding member H4. As described above, in each suction head 20 , the piezoelectric elements P are arranged in the recessed portions of the holding member H included in the regions whose number corresponds to the number of suction heads 20 and are equal to each other.

另外，在將藉由吸附頭20而從第1壓電元件區域Rp1內的任意位置的凹部C吸附起來的壓電元件P，配置至在第1保持構件區域Rh1內與原本收容吸附起來的壓電元件P的第1壓電元件區域Rp1內的凹部C對應之位置的保持構件H的情形中，第1保持構件區域Rh1與第1壓電元件區域Rp1係成為相等的形狀。第2保持構件區域Rh2與第2壓電元件區域Rp2係成為相等的形狀。第3保持構件區域Rh3與第3壓電元件區域Rp3係成為相等的形狀。第4保持構件區域Rh4與第4壓電元件區域Rp4係成為相等的形狀。亦即，第1保持構件區域Rh1至第4保持構件區域Rh4內的保持構件H的配置係與第1壓電元件區域Rp1至第4壓電元件區域Rp4內的壓電元件P的配置相等。 In addition, when the piezoelectric element P is suctioned by the suction head 20 from the recessed portion C at an arbitrary position in the first piezoelectric element region Rp1, it is arranged so as to be in the first holding member region Rh1 in the same position as the piezoelectric element P which is originally accommodated and suctioned. In the case of the holding member H at a position corresponding to the recessed portion C in the first piezoelectric element region Rp1 of the electric element P, the first holding member region Rh1 and the first piezoelectric element region Rp1 have the same shape. The second holding member region Rh2 and the second piezoelectric element region Rp2 have the same shape. The third holding member region Rh3 and the third piezoelectric element region Rp3 have the same shape. The fourth holding member region Rh4 and the fourth piezoelectric element region Rp4 have the same shape. That is, the arrangement of the holding members H in the first to fourth holding member regions Rh1 to Rh4 is equal to the arrangement of the piezoelectric elements P in the first to fourth piezoelectric element regions Rp1 to Rp4.

<壓電元件的配置位置的調整> <Adjustment of piezoelectric element placement>

接著，利用圖1、圖7及圖8，針對本發明的壓電震動裝置製造設備1的吸附頭20的吸附嘴28的位置調整進行說明。圖7係顯示壓電震動裝置製造設備1的複數個吸附頭20將壓電元件P搬送至保持構件供給位置Sh後的狀態的概略之俯視圖。圖8係顯示壓電震動裝置製造設備1的複數個吸附頭20調整吸附嘴28的位置後的狀態的概略之俯視圖。 Next, the position adjustment of the suction nozzle 28 of the suction head 20 of the piezoelectric vibration device manufacturing equipment 1 of the present invention will be described using FIGS. 1 , 7 and 8 . FIG. 7 is a schematic plan view showing a state in which the plurality of adsorption heads 20 of the piezoelectric vibration device manufacturing equipment 1 have transported the piezoelectric element P to the holding member supply position Sh. FIG. 8 is a schematic plan view showing a state in which the plurality of suction heads 20 of the piezoelectric vibration device manufacturing equipment 1 adjust the positions of the suction nozzles 28 .

控制設備16係擁有與保持構件供給設備11的位置有關的資 訊、與吸附頭移動設備12的位置有關的資訊、與供給頭移動設備13的位置有關的資訊、與攝像機14的位置有關的資訊、與雷射量測設備15的位置有關的資訊、與吸附頭20的位置有關的資訊及與供給頭30的位置有關的資訊。 The control device 16 has information regarding the position of the holding member supply device 11 information, information related to the position of the suction head moving device 12, information related to the position of the supply head moving device 13, information related to the position of the camera 14, information related to the position of the laser measurement device 15, information related to the position of the suction head Information about the position of the head 20 and information about the position of the head 30 are supplied.

如圖1所示，控制設備16係藉由雷射量測設備15量測藉由保持構件供給設備11搬送的片狀的複數個保持構件H的形狀。此時，控制設備16係取得雷射量測設備15所量測到的關於片狀的複數個保持構件H的形狀之量測值。控制設備16係在取得關於保持構件H的形狀之量測值後，藉由保持構件供給設備11將片狀的複數個保持構件H搬送到保持構件供給位置Sh。 As shown in FIG. 1 , the control device 16 measures the shapes of the plurality of sheet-like holding members H conveyed by the holding member supply device 11 using the laser measurement device 15 . At this time, the control device 16 obtains the measurement values measured by the laser measurement device 15 regarding the shapes of the plurality of sheet-shaped holding members H. After acquiring the measurement value regarding the shape of the holding member H, the control device 16 transports the plurality of sheet-shaped holding members H to the holding member supply position Sh via the holding member supply device 11 .

控制設備16係根據所取得的關於複數個保持構件H的量測值及雷射量測設備15進行量測時之複數個保持構件H在保持構件供給設備11中的搬送位置，分別算出關於所量測到的各保持構件H的X方向、Y方向及Z方向的中心位置與長邊方向的擺向(即θ方向)之座標值(即H(n)(x0,y0,z0,θ0))。另外，(n)乃係保持構件H的號碼。控制設備16係將所量測到的保持構件H的座標值(即H(n)(x0n,y0n,z0n,θ0n))作為與保持構件H的位置有關的資訊Ih予以記憶。 The control device 16 calculates the respective values of the plurality of holding members H based on the acquired measurement values of the plurality of holding members H and the conveying positions of the plurality of holding members H in the holding member supply device 11 when the laser measurement device 15 performs the measurement. The measured coordinate values of the center position of each holding member H in the X direction, Y direction and Z direction and the swing direction in the long side direction (i.e. the θ direction) (i.e. H(n)(x0, y0, z0, θ0) ). In addition, (n) is the number of the holding member H. The control device 16 memorizes the measured coordinate value of the holding member H (that is, H(n)(x0n, y0n, z0n, θ0n)) as information Ih related to the position of the holding member H.

如圖7所示，控制設備16係根據在複數個保持構件H中已預先決定的壓電元件P的接合順序，以將複數個保持構件H當中的配置有第1壓電元件P1至第4壓電元件P4的第1保持構件H1至第4保持構件H4搬送至保持構件供給位置Sh的方式控制保持構件供給設備11。控制設備16係根據所算出的與保持構件H的位置有關的資訊Ih，抽出第1保持 構件H1至第4保持構件H4在保持構件供給位置Sh的座標值(即H1(x11,y11,z11,θ11)、H2(x12,y12,z12,θ12)、H3(x13,y13,z13,θ13)、H4(x14,y14,z14,θ14))。 As shown in FIG. 7 , the control device 16 controls the first to fourth piezoelectric elements P1 to 4th among the plurality of holding members H according to the predetermined bonding order of the piezoelectric elements P among the plurality of holding members H. The holding member supply device 11 is controlled so that the first holding member H1 to the fourth holding member H4 of the piezoelectric element P4 are transported to the holding member supply position Sh. The control device 16 extracts the first holding member H based on the calculated information Ih regarding the position of the holding member H. The coordinate values of the members H1 to the fourth holding member H4 at the holding member supply position Sh (i.e. H1 (x11, y11, z11, θ11), H2 (x12, y12, z12, θ12), H3 (x13, y13, z13, θ13 ), H4(x14,y14,z14,θ14)).

控制設備16係以將分別吸附有第1壓電元件P1至第4壓電元件P4的4個壓電元件P的4個吸附頭20搬送到保持構件供給位置Sh的方式控制吸附頭移動設備12。控制設備16係以從下方拍攝4個吸附頭20分別以吸附嘴28吸附起來的第1壓電元件P1至第4壓電元件P4的方式控制攝像機14。 The control device 16 controls the suction head moving device 12 so as to transport the four suction heads 20 on which the four piezoelectric elements P, which are the first piezoelectric element P1 to the fourth piezoelectric element P4, are respectively suctioned, to the holding member supply position Sh. . The control device 16 controls the camera 14 to capture from below the first to fourth piezoelectric elements P1 to P4 that are sucked by the suction nozzles 28 of the four suction heads 20 .

控制設備16係取得攝像機14所拍攝到的圖像。控制設備16係從所取得的圖像檢測吸附頭20及被吸附嘴28吸附起來的第1壓電元件P1至第4壓電元件P4。控制設備16係根據所檢測到的吸附頭20及被吸附嘴28吸附起來的第1壓電元件P1至第4壓電元件P4、以及拍攝到圖像時之吸附頭20在吸附頭移動設備12中的搬送位置，分別算出表示所檢測到的第1壓電元件P1至第4壓電元件P4的X方向及Y方向的中心位置與長邊方向的擺向之座標值(即P1(x01,y01,θ01)、P2(x02,y02,θ02)、P3(x03,y03,θ03)、P4(x04,y04,θ04))。 The control device 16 acquires the image captured by the camera 14 . The control device 16 detects the first to fourth piezoelectric elements P1 to P4 sucked by the suction head 20 and the suction nozzle 28 from the acquired image. The control device 16 moves the suction head moving device 12 based on the detected suction head 20 and the first to fourth piezoelectric elements P1 to P4 adsorbed by the suction nozzle 28 , and the position of the suction head 20 when the image is captured. The coordinate values representing the detected center positions in the X direction and the Y direction and the longitudinal direction of the first piezoelectric element P1 to the fourth piezoelectric element P4 are respectively calculated (i.e., P1 (x01, y01, θ01), P2 (x02, y02, θ02), P3 (x03, y03, θ03), P4 (x04, y04, θ04)).

控制設備16係根據第1保持構件H1至第4保持構件H4在保持構件供給位置Sh的X方向、Y方向及θ方向的座標值(即H1(x11,y11,θ11)、H2(x12,y12,θ12)、H3(x13,y13,θ13)、H4(x14,y14,θ14))，算出被吸附嘴28吸附起來的第1壓電元件P1至第4壓電元件P4在保持構件供給位置Sh的座標值(即P1(x11,y11,θ11)、P2(x12,y12,θ12)、P3(x13,y13,θ13)、P4(x14,y14,θ14))，且作為與壓電元件P的位置有關的資訊Ip予以記憶。 The control device 16 is based on the coordinate values of the first holding member H1 to the fourth holding member H4 in the X direction, Y direction and θ direction of the holding member supply position Sh (that is, H1 (x11, y11, θ11), H2 (x12, y12 , θ12), H3 (x13, y13, θ13), H4 (x14, y14, θ14)), calculate the holding member supply position Sh of the first to fourth piezoelectric elements P1 to P4 adsorbed by the suction nozzle 28 The coordinate values of (i.e. P1(x11,y11,θ11), P2(x12,y12,θ12), P3(x13,y13,θ13), P4(x14,y14,θ14)), and as the coordinates with the piezoelectric element P The location-related information IP is memorized.

控制設備16係算出為了使第1壓電元件P1在保持構件供給位置Sh的座標值(即P1(x11,y11,θ11))與在保持構件供給位置Sh中對應的第1保持構件H1的座標值(即H1(x11,y11,θ11))一致所需的吸附嘴28的X方向、Y方向、θ方向及Z方向的移動量(即Ap1(x11,y11,z11,θ11))。同樣地，控制設備16係算出為了使第2壓電元件P2至第4壓電元件P4在保持構件供給位置Sh的座標值(即P2(x12,y12,θ12)、P3(x13,y13,θ13)、P4(x14,y14,θ14))分別在保持構件供給位置Sh中與對應的第2保持構件H2至第4保持構件H4的座標值(即H2(x12,y12,θ12)、H3(x13,y13,θ13)、H4(x14,y14,θ14))一致所需的吸附嘴28的X方向、Y方向、θ方向的調整量及Z方向的移動量(即Ap2(x11,y11,z11,θ11)、Ap3(x13,y13,z13,θ13)、Ap4(x14,y14,z14,θ14))。 The control device 16 calculates the coordinate value of the first piezoelectric element P1 at the holding member supply position Sh (that is, P1 (x11, y11, θ11)) and the coordinates of the first holding member H1 corresponding to the holding member supply position Sh. The movement amount of the suction nozzle 28 in the X direction, Y direction, θ direction and Z direction (that is, Ap1 (x11, y11, z11, θ11)) required to match the value (that is, H1 (x11, y11, θ11)). Similarly, the control device 16 calculates the coordinate values (that is, P2 (x12, y12, θ12), P3 (x13, y13, θ13) in order to position the second piezoelectric element P2 to the fourth piezoelectric element P4 at the holding member supply position Sh ), P4 (x14, y14, θ14)) respectively correspond to the coordinate values of the second to fourth holding members H2 to H4 in the holding member supply position Sh (i.e., H2 (x12, y12, θ12), H3 (x13 , y13, θ13) and H4 (x14, y14, θ14)), the adjustment amount of the suction nozzle 28 in the X direction, Y direction, θ direction and the movement amount in the Z direction (i.e. Ap2 (x11, y11, z11, θ11), Ap3(x13,y13,z13,θ13), Ap4(x14,y14,z14,θ14)).

如圖8所示，控制設備16係根據所算出的4個吸附嘴28的X方向、Y方向、θ方向的調整量及Z方向的移動量(即Ap1(x11,y11,z11,θ11)、Ap2(x11,y11,z11,θ11)、Ap3(x13,y13,z13,θ13)、Ap4(x14,y14,z14,θ14))，控制各個吸附頭20的吸附頭用水平移動機構21及吸附頭用旋轉移動機構26，以按每個吸附頭20獨立地個別調整吸附嘴28的水平方向的位置及傾斜。此外，控制設備16係根據所算出的Z方向的移動量，控制各個吸附頭20的吸附頭用鉛直移動機構24，以將第1壓電元件P1至第4壓電元件P4配置至第1保持構件H1至第4保持構件H4內。亦即，控制設備16係根據與壓電元件P的位置有關的資訊Ip及與保持構件H的位置有關的資訊Ih，控制各個吸附頭20的吸附頭用水平移動機構21、吸附頭用鉛直移動機構24或吸附頭用旋轉移動機構26當中的至少一者，以調整吸附 嘴28的位置。 As shown in FIG. 8 , the control device 16 is based on the calculated adjustment amounts of the four suction nozzles 28 in the X direction, Y direction, and θ direction and the movement amount in the Z direction (i.e., Ap1 (x11, y11, z11, θ11), Ap2 (x11, y11, z11, θ11), Ap3 (x13, y13, z13, θ13), Ap4 (x14, y14, z14, θ14)), control the suction head horizontal movement mechanism 21 and suction head of each suction head 20 The rotational movement mechanism 26 is used to independently adjust the horizontal position and inclination of the suction nozzle 28 for each suction head 20 . In addition, the control device 16 controls the vertical movement mechanism 24 for the suction head of each suction head 20 based on the calculated movement amount in the Z direction, so that the first to fourth piezoelectric elements P1 to P4 are arranged in the first holding position. member H1 to the fourth holding member H4. That is, the control device 16 controls the horizontal movement mechanism 21 for the suction head and the vertical movement of the suction head 20 of each suction head 20 based on the information Ip about the position of the piezoelectric element P and the information Ih about the position of the holding member H. At least one of the mechanism 24 or the suction head rotation moving mechanism 26 is used to adjust the suction head. Mouth 28 position.

<接合材的供給位置的調整> <Adjustment of the supply position of the joining material>

接著，針對本發明的壓電震動裝置製造設備1的供給頭30的吐出嘴36a的位置調整進行說明。 Next, the position adjustment of the discharge nozzle 36a of the supply head 30 of the piezoelectric vibration device manufacturing equipment 1 of the present invention will be described.

控制設備16係控制供給頭移動設備13，以將4個供給頭30搬送至保持構件供給位置Sh。控制設備16係根據與供給頭30的位置有關的資訊、及第1保持構件H1至第4保持構件H4在保持構件供給位置Sh的座標值(即H1(x11,y11,z11,θ11)、H2(x12,y12,z12,θ12)、H3(x13,y13,z13,θ13)、H4(x14,y14,z14,θ14))，算出4個吐出嘴36a在保持構件供給位置Sh的座標值(即J1(x11,y11)、J2(x12,y12)、J3(x13,y13)、J4(x14,y14))，且作為與接合材的位置有關的資訊予以記憶。 The control device 16 controls the supply head moving device 13 so as to transport the four supply heads 30 to the holding member supply position Sh. The control device 16 is based on the information about the position of the supply head 30 and the coordinate values of the first to fourth holding members H1 to H4 at the holding member supply position Sh (that is, H1 (x11, y11, z11, θ11), H2 (x12, y12, z12, θ12), H3 (x13, y13, z13, θ13), H4 (x14, y14, z14, θ14)), calculate the coordinate values of the four discharge nozzles 36a at the holding member supply position Sh (that is, J1 (x11, y11), J2 (x12, y12), J3 (x13, y13), J4 (x14, y14)), and are stored as information related to the position of the joining material.

控制設備16係算出為了使4個供給設備36當中的一者在保持構件供給位置Sh的座標值(即J1(x11,y11))與對應的第1保持構件H1在保持構件供給位置Sh的座標值(即H1(x11,y11,z11,θ11))一致所需的吐出嘴36a的X方向、Y方向、θ方向的調整量及Z方向的移動量(即Aj1(x11、y11、z11))。同樣地，控制設備16係算出為了使其他3個吐出嘴36a在保持構件供給位置Sh的座標值(即J2(x12、y12)、J3(x13、y13)、J4(x14、y14))分別與對應的第2保持構件H2至第4保持構件H4在保持構件供給位置Sh的座標值(即H2(x12,y12,z12,θ12)、H3(x13,y13,z13,θ13)、H4(x14,y14,z14,θ14))一致所需的吐出嘴36a的X方向、Y方向的調整量及Z方向的移動量(即Aj2(x12,y12,z12)、Aj3(x13,y13,z13)、Aj4(x14,y14,z14))。 The control device 16 calculates the coordinate value of one of the four supply devices 36 at the holding member supply position Sh (that is, J1 (x11, y11)) and the coordinate value of the corresponding first holding member H1 at the holding member supply position Sh. The adjustment amounts in the X direction, Y direction, and θ direction and the movement amount in the Z direction of the discharge nozzle 36a (that is, Aj1 (x11, y11, z11)) required to match the values (i.e., H1 (x11, y11, z11, θ11)) . Similarly, the control device 16 calculates the coordinate values (that is, J2 (x12, y12), J3 (x13, y13), J4 (x14, y14)) of the other three discharge nozzles 36a at the holding member supply position Sh, respectively, and The coordinate values of the corresponding second holding member H2 to fourth holding member H4 at the holding member supply position Sh (i.e. H2(x12,y12,z12,θ12), H3(x13,y13,z13,θ13), H4(x14, y14, z14, θ14)) The adjustment amount in the X direction, Y direction and the movement amount in the Z direction of the discharge nozzle 36a (i.e., Aj2 (x12, y12, z12), Aj3 (x13, y13, z13), Aj4 (x14,y14,z14)).

控制設備16係根據所算出的4個吸附嘴28的X方向、Y方 向、θ方向的調整量及Z方向的移動量(即Aj1(x11,y11,z11)、Aj2(x12,y12,z12)、Aj3(x13,y13,z13)、Aj4(x14,y14,z14))，控制各個供給頭30的供給頭用水平移動機構31，以按每個供給頭30獨立地個別調整吐出嘴36a的水平方向的位置。此外，控制設備16係根據Aj1(x11,y11,z11)、Aj2(x12,y12,z12)、Aj3(x13,y13,z13)、Aj4(x14,y14,z14)，控制各個供給頭30的供給頭用鉛直移動機構34，以按每個供給頭30令吐出嘴36a沿鉛直方向移動而將接合材配置至保持構件H的凹部內。亦即，控制設備16係根據與壓電元件P的位置有關的資訊Ip及與保持構件H的位置有關的資訊Ih，控制各個供給頭30的供給頭用水平移動機構31或供給頭用鉛直移動機構34當中的至少一者，以調整供給設備36的位置。 The control device 16 is based on the calculated X direction and Y direction of the four suction nozzles 28 The adjustment amount in the θ direction and the movement amount in the Z direction (i.e. Aj1(x11,y11,z11), Aj2(x12,y12,z12), Aj3(x13,y13,z13), Aj4(x14,y14,z14) ), the supply head horizontal movement mechanism 31 of each supply head 30 is controlled to adjust the horizontal position of the discharge nozzle 36 a independently for each supply head 30 . In addition, the control device 16 controls the supply of each supply head 30 based on Aj1 (x11, y11, z11), Aj2 (x12, y12, z12), Aj3 (x13, y13, z13), and Aj4 (x14, y14, z14). The head vertical movement mechanism 34 moves the discharge nozzle 36 a in the vertical direction for each supply head 30 to arrange the joining material in the recessed portion of the holding member H. That is, the control device 16 controls the horizontal movement mechanism 31 or the vertical movement of the supply head of each supply head 30 based on the information Ip regarding the position of the piezoelectric element P and the information Ih regarding the position of the holding member H. At least one of the mechanisms 34 to adjust the position of the supply device 36 .

接著，利用圖9至圖12，針對藉由壓電震動裝置製造設備1進行的壓電震動裝置的製造方法含有的壓電元件搭載步驟S100進行說明。圖9係壓電震動裝置的製造方法含有的壓電元件搭載步驟S100的流程圖。圖10係顯示在壓電元件搭載步驟S100中的保持構件位置資訊取得步驟S110、壓電元件供給步驟S120、保持構件供給步驟S125、壓電元件定位步驟S130及保持構件定位步驟S135中，壓電震動裝置製造設備1的作動狀態之俯視圖。圖11係顯示在壓電元件搭載步驟S100中的接合材供給位置調整步驟S140及接合材供給步驟S150中，壓電震動裝置製造設備1的作動狀態之俯視圖。圖12係顯示在壓電元件搭載步驟S100中的壓電元件搬送步驟S160、壓電元件位置資訊取得步驟S170、壓電元件位置調整步驟S180及壓電元件接合步驟S190中，壓電震動裝置製造設備1的作動狀態之俯視圖。 Next, the piezoelectric element mounting step S100 included in the method of manufacturing a piezoelectric vibration device using the piezoelectric vibration device manufacturing equipment 1 will be described using FIGS. 9 to 12 . FIG. 9 is a flowchart of the piezoelectric element mounting step S100 included in the method of manufacturing a piezoelectric vibration device. FIG. 10 shows the piezoelectric element in the holding member position information acquisition step S110, piezoelectric element supply step S120, holding member supply step S125, piezoelectric element positioning step S130 and holding member positioning step S135 in the piezoelectric element mounting step S100. A top view of the vibration device manufacturing equipment 1 in operation. FIG. 11 is a plan view showing the operating state of the piezoelectric vibration device manufacturing equipment 1 in the bonding material supply position adjustment step S140 in the piezoelectric element mounting step S100 and the bonding material supply step S150. FIG. 12 shows the piezoelectric vibration device manufacturing step S160 of the piezoelectric element mounting step S100, the piezoelectric element position information acquisition step S170, the piezoelectric element position adjustment step S180, and the piezoelectric element bonding step S190. Top view of device 1 in action.

如圖9所示，壓電元件搭載步驟S100係含有：保持構件位置資訊取得步驟S110、壓電元件供給步驟S120、保持構件供給步驟S125、壓電元件定位步驟S130、保持構件定位步驟S135、接合材供給位置調整步驟S140、接合材供給步驟S150、壓電元件搬送步驟S160、壓電元件位置資訊取得步驟S170、壓電元件位置調整步驟S180、壓電元件接合步驟S190。 As shown in FIG. 9 , the piezoelectric element mounting step S100 includes: a holding member position information acquisition step S110, a piezoelectric element supply step S120, a holding member supply step S125, a piezoelectric element positioning step S130, a holding member positioning step S135, and bonding. The material supply position adjustment step S140, the joining material supply step S150, the piezoelectric element transport step S160, the piezoelectric element position information acquisition step S170, the piezoelectric element position adjustment step S180, and the piezoelectric element bonding step S190.

就壓電震動裝置製造設備1的初始狀態而言，在壓電元件供給設備10中，收容有複數個壓電元件P的載盤T從未圖示的外部的供給線被供給至載盤載置部10a。此外，在保持構件供給設備11中，片狀的複數個保持構件H從未圖示的外部的供給線被供給至保持構件載置部11a(參照圖1)。 In the initial state of the piezoelectric vibration device manufacturing equipment 1 , in the piezoelectric element supply equipment 10 , a carrier T accommodating a plurality of piezoelectric elements P is supplied to the carrier T from an external supply line (not shown). Set part 10a. Furthermore, in the holding member supply device 11, a plurality of sheet-shaped holding members H are supplied to the holding member placement portion 11a (see FIG. 1) from an external supply line (not shown).

保持構件位置資訊取得步驟S110乃係取得與複數個保持構件H的位置有關的資訊Ih之步驟。在保持構件位置資訊取得步驟S110中，一邊藉由保持構件供給設備11令複數個保持構件H移動，一邊由雷射量測設備15量測複數個保持構件H的形狀。雷射量測設備15係將量測值發送至控制設備16。壓電元件搭載步驟S100係在保持構件位置資訊取得步驟S110完成後前進至壓電元件供給步驟S120。 The holding member position information acquisition step S110 is a step of obtaining information Ih regarding the positions of a plurality of holding members H. In the holding member position information acquisition step S110, while the plurality of holding members H are moved by the holding member supply device 11, the shapes of the plurality of holding members H are measured by the laser measurement device 15. The laser measurement device 15 sends the measurement value to the control device 16 . The piezoelectric element mounting step S100 proceeds to the piezoelectric element supply step S120 after completing the holding member position information acquisition step S110.

如圖10所示，壓電元件供給步驟S120乃係將載盤T所收容的複數個壓電元件P當中的要搭載至保持構件H的壓電元件P供給至壓電元件供給位置Sp之步驟。在壓電元件供給步驟S120中，壓電元件供給設備10係藉由載盤載置部10a，將載盤載置部10a上的載盤T所收容的複數個壓電元件P當中的作為對象的壓電元件P從壓電元件待機位置Wp搬送 到壓電元件供給位置Sp的搬送基準位置。壓電元件搭載步驟S100係在壓電元件供給步驟S120完成後前進至保持構件供給步驟S125。 As shown in FIG. 10 , the piezoelectric element supply step S120 is a step of supplying the piezoelectric element P to be mounted on the holding member H among the plurality of piezoelectric elements P accommodated in the carrier T to the piezoelectric element supply position Sp. . In the piezoelectric element supply step S120 , the piezoelectric element supply device 10 uses the tray placement portion 10 a to target one of the plurality of piezoelectric elements P accommodated on the tray T on the tray placement portion 10 a. The piezoelectric element P is transported from the piezoelectric element standby position Wp The transfer reference position to the piezoelectric element supply position Sp. The piezoelectric element mounting step S100 proceeds to the holding member supplying step S125 after the piezoelectric element supplying step S120 is completed.

保持構件供給步驟S125乃係將複數個保持構件H當中的要配置壓電元件P的保持構件H供給至保持構件供給位置Sh之步驟。在保持構件供給步驟S125中，保持構件供給設備11係藉由保持構件載置部11a，將保持構件載置部11a上的複數個保持構件H當中的作為對象的保持構件H從保持構件待機位置Wh搬送到保持構件供給位置Sh的搬送基準位置。壓電元件搭載步驟S100係在保持構件供給步驟S125完成後前進至壓電元件定位步驟S130。 The holding member supply step S125 is a step of supplying the holding member H on which the piezoelectric element P is to be arranged among the plurality of holding members H to the holding member supply position Sh. In the holding member supply step S125, the holding member supply device 11 moves the target holding member H among the plurality of holding members H on the holding member placing unit 11a from the holding member standby position through the holding member placing unit 11a. Wh is conveyed to the conveyance reference position of the holding member supply position Sh. The piezoelectric element mounting step S100 proceeds to the piezoelectric element positioning step S130 after completion of the holding member supply step S125.

壓電元件定位步驟S130乃係下述之步驟：將搬送至壓電元件供給位置Sp的搬送基準位置的複數個壓電元件P當中的作為接合於保持構件H之對象的壓電元件P進行定位。壓電元件供給設備10係藉由載盤載置部10a，將壓電元件供給位置Sp的搬送基準位置的載盤T所收容的複數個壓電元件P當中的作為對象的壓電元件P定位至壓電元件供給位置Sp。壓電元件搭載步驟S100係在壓電元件定位步驟S130完成後前進至保持構件定位步驟S135。 The piezoelectric element positioning step S130 is a step of positioning the piezoelectric element P to be joined to the holding member H among the plurality of piezoelectric elements P transported to the transportation reference position of the piezoelectric element supply position Sp. . The piezoelectric element supply equipment 10 positions the target piezoelectric element P among the plurality of piezoelectric elements P stored in the carrier plate T at the transportation reference position of the piezoelectric element supply position Sp by the plate mounting portion 10 a to the piezoelectric element supply position Sp. The piezoelectric element mounting step S100 proceeds to the holding member positioning step S135 after the piezoelectric element positioning step S130 is completed.

保持構件定位步驟S135乃係下述之步驟：將搬送至保持構件供給位置Sh的搬送基準位置的複數個保持構件H當中的作為壓電元件P接合之對象的保持構件H進行定位。保持構件供給設備11係藉由保持構件載置部11a，將保持構件供給位置Sh的搬送基準位置的複數個保持構件H當中的作為對象的保持構件H定位至保持構件供給位置Sh。壓電元件搭載步驟S100係在保持構件定位步驟S135完成後前進至接合材供給位置調 整步驟S140。 The holding member positioning step S135 is a step of positioning the holding member H to be joined to the piezoelectric element P among the plurality of holding members H transported to the transportation reference position of the holding member supply position Sh. The holding member supply equipment 11 positions the target holding member H among the plurality of holding members H at the transportation reference position of the holding member supply position Sh to the holding member supply position Sh via the holding member placing portion 11a. The piezoelectric element mounting step S100 proceeds to the bonding material supply position adjustment after completion of the holding member positioning step S135. Complete step S140.

如圖11所示，接合材供給位置調整步驟S140乃係調整供給接合材的供給設備36的位置之步驟。在接合材供給位置調整步驟S140中，供給頭移動設備13係將供給頭30從待機位置W搬送到保持構件供給位置Sh。各個供給頭30的供給頭用水平移動機構31係根據控制設備16所算出的各個供給設備36的吐出嘴36a的X方向、Y方向的調整量，按每個供給頭30獨立地個別調整吐出嘴36a的水平方向的位置。壓電元件搭載步驟S100係在接合材供給位置調整步驟S140完成後前進至接合材供給步驟S150。 As shown in FIG. 11 , the joining material supply position adjustment step S140 is a step of adjusting the position of the supply device 36 that supplies the joining material. In the joining material supply position adjustment step S140, the supply head moving device 13 transports the supply head 30 from the standby position W to the holding member supply position Sh. The supply head horizontal movement mechanism 31 of each supply head 30 adjusts the discharge nozzle independently for each supply head 30 based on the adjustment amount of the discharge nozzle 36a of each supply device 36 in the X direction and the Y direction calculated by the control device 16 The horizontal position of 36a. The piezoelectric element mounting step S100 proceeds to the bonding material supply step S150 after the bonding material supply position adjustment step S140 is completed.

接合材供給步驟S150乃係將接合材供給至保持構件H的凹部內之步驟。在接合材供給步驟S150中，各個供給頭30的供給頭用鉛直移動機構34係根據控制設備16算出的各個供給設備36的吐出嘴36a的Z方向的移動量，按每個供給頭30令供給設備36獨立地個別往鉛直方向下方移動。供給設備36係將接合材供給至保持構件H的凹部內。當接合材的供給完成，各個供給頭30的供給頭用鉛直移動機構34便令供給設備36往鉛直方向上方移動。供給頭移動設備13係將供給頭30從保持構件供給位置Sh搬送到待機位置W。壓電元件搭載步驟S100係在接合材供給步驟S150完成後前進至壓電元件搬送步驟S160。 The joining material supply step S150 is a step of supplying the joining material into the recessed portion of the holding member H. In the joining material supply step S150 , the supply head vertical movement mechanism 34 of each supply head 30 instructs supply for each supply head 30 based on the movement amount of the discharge nozzle 36 a of each supply device 36 in the Z direction calculated by the control device 16 . The devices 36 move independently and individually downward in the vertical direction. The supply device 36 supplies the joining material into the recessed portion of the holding member H. When the supply of the joining material is completed, the supply head vertical movement mechanism 34 of each supply head 30 moves the supply device 36 upward in the vertical direction. The supply head moving device 13 transports the supply head 30 from the holding member supply position Sh to the waiting position W. The piezoelectric element mounting step S100 proceeds to the piezoelectric element conveyance step S160 after the joining material supply step S150 is completed.

如圖12所示，壓電元件搬送步驟S160乃係將要配置至保持構件H的壓電元件P從壓電元件供給位置Sp搬送至保持構件供給位置Sh之步驟。在壓電元件搬送步驟S160中，各個吸附頭20的吸附頭用鉛直移動機構24係在壓電元件供給位置Sp令吸附嘴28往鉛直方向下方移動。 各個吸附頭20係藉由吸附嘴28而從載盤T分別吸附壓電元件P。各個吸附頭20的吸附頭用鉛直移動機構24係在壓電元件供給位置Sp令吸附嘴28往鉛直方向上方移動。吸附頭移動設備12係將吸附頭20搬送至保持構件供給位置Sh。壓電元件搭載步驟S100係在壓電元件搬送步驟S160完成後前進至壓電元件位置資訊取得步驟S170。 As shown in FIG. 12 , the piezoelectric element transport step S160 is a step of transporting the piezoelectric element P to be arranged on the holding member H from the piezoelectric element supply position Sp to the holding member supply position Sh. In the piezoelectric element transport step S160, the vertical movement mechanism 24 for the suction head of each suction head 20 moves the suction nozzle 28 downward in the vertical direction at the piezoelectric element supply position Sp. Each suction head 20 suctions the piezoelectric element P from the carrier T via the suction nozzle 28 . The suction head vertical movement mechanism 24 of each suction head 20 moves the suction nozzle 28 upward in the vertical direction at the piezoelectric element supply position Sp. The suction head moving device 12 transports the suction head 20 to the holding member supply position Sh. The piezoelectric element mounting step S100 proceeds to the piezoelectric element position information acquisition step S170 after the piezoelectric element transport step S160 is completed.

壓電元件位置資訊取得步驟S170乃係取得與被吸附起來的壓電元件P的位置有關的資訊Ip之步驟。在壓電元件位置資訊取得步驟S170中，攝像機14係對藉由被吸附頭移動設備12進行搬送中的吸附頭20及被吸附嘴28吸附著的壓電元件P進行拍攝。攝像機14係將所拍攝到的圖像發送至控制設備16。壓電元件搭載步驟S100係在壓電元件位置資訊取得步驟S170完成後前進至壓電元件位置調整步驟S180。 The piezoelectric element position information acquisition step S170 is a step of acquiring information Ip regarding the position of the adsorbed piezoelectric element P. In the piezoelectric element position information acquisition step S170 , the camera 14 photographs the suction head 20 being transported by the suction head moving device 12 and the piezoelectric element P adsorbed by the adsorption nozzle 28 . The camera 14 sends the captured image to the control device 16 . The piezoelectric element mounting step S100 proceeds to the piezoelectric element position adjustment step S180 after the piezoelectric element position information acquisition step S170 is completed.

壓電元件位置調整步驟S180乃係調整吸附嘴28的位置之步驟。在壓電元件位置調整步驟S180中，各個吸附頭20的吸附頭用水平移動機構21及吸附頭用旋轉移動機構26係根據控制設備16算出的各個吸附嘴28的X方向、Y方向及θ方向的調整量，按每個吸附頭20獨立地個別調整吸附嘴28的水平方向的位置及擺向(參照圖7、圖8)。壓電元件搭載步驟S100係在壓電元件位置調整步驟S180完成後前進至壓電元件接合步驟S190。 The piezoelectric element position adjustment step S180 is a step of adjusting the position of the suction nozzle 28 . In the piezoelectric element position adjustment step S180, the suction head horizontal movement mechanism 21 and the suction head rotation movement mechanism 26 of each suction head 20 are calculated based on the X direction, Y direction and θ direction of each suction nozzle 28 calculated by the control device 16 The adjustment amount allows the horizontal position and swing direction of the suction nozzle 28 to be independently adjusted for each suction head 20 (see FIGS. 7 and 8 ). The piezoelectric element mounting step S100 proceeds to the piezoelectric element bonding step S190 after the piezoelectric element position adjustment step S180 is completed.

壓電元件接合步驟S190乃係將壓電元件P配置至已被供給接合材的保持構件H的凹部內，將壓電元件P與保持構件H接合之步驟。在壓電元件接合步驟S190中，各個吸附頭20的吸附頭用鉛直移動機構24係根據控制設備16算出的各個吸附嘴28的Z方向的移動量，按每個吸附 頭20令吸附嘴28獨立地個別往鉛直方向下方移動。藉此，壓電元件P係透過接合材而接合於保持構件H。各個吸附頭20係將壓電元件P從吸附嘴28釋放。各個吸附頭20的吸附頭用鉛直移動機構24係令供給設備36往鉛直方向上方移動。吸附頭移動設備12係將吸附頭20搬送到壓電元件供給位置Sp。壓電元件搭載步驟S100係在壓電元件接合步驟S190完成後前進至壓電元件定位步驟S130。 The piezoelectric element bonding step S190 is a step of arranging the piezoelectric element P in the recess of the holding member H to which the bonding material has been supplied, and bonding the piezoelectric element P and the holding member H. In the piezoelectric element bonding step S190, the suction head vertical movement mechanism 24 of each suction head 20 moves the suction head vertically for each suction head based on the Z-direction movement amount of each suction nozzle 28 calculated by the control device 16. The head 20 moves the suction nozzles 28 independently and downward in the vertical direction. Thereby, the piezoelectric element P is bonded to the holding member H through the bonding material. Each suction head 20 releases the piezoelectric element P from the suction nozzle 28 . The vertical movement mechanism 24 for the suction head of each suction head 20 moves the supply device 36 upward in the vertical direction. The suction head moving device 12 moves the suction head 20 to the piezoelectric element supply position Sp. The piezoelectric element mounting step S100 proceeds to the piezoelectric element positioning step S130 after the piezoelectric element bonding step S190 is completed.

此外，壓電元件接合步驟S190係在已對全部的保持構件H接合壓電元件P時，將已分別接合壓電元件P的複數個保持構件H從保持構件供給位置Sh搬送至保持構件待機位置Wh。此外，所搬送的複數個保持構件H係為了確認壓電元件P的搭載狀態而藉由雷射量測設備15取得與複數個保持構件H的位置有關的資訊Ih。 In addition, in the piezoelectric element bonding step S190, when the piezoelectric elements P have been bonded to all the holding members H, the plurality of holding members H to which the piezoelectric elements P have been bonded are transported from the holding member supply position Sh to the holding member standby position. Wh. In addition, in order to confirm the mounting state of the piezoelectric element P of the transported holding members H, the information Ih on the positions of the plurality of holding members H is obtained by the laser measurement device 15 .

如上述的方式構成的壓電震動裝置製造設備1中，複數個壓電元件P以排列成維持著彼此間之相對距離的矩陣狀的狀態被供給。同樣地，複數個保持構件H以排列成維持著彼此間之相對距離的矩陣狀的狀態被供給。藉此，壓電震動裝置製造設備1係能夠同時取得與被吸附頭20吸附起來的複數個壓電元件P的位置有關的資訊Ip及與保持構件H的位置有關的資訊Ih。 In the piezoelectric vibration device manufacturing equipment 1 configured as described above, a plurality of piezoelectric elements P are supplied in a matrix state in which the relative distance between them is maintained. Similarly, a plurality of holding members H are supplied in a matrix-like state in which the relative distance between them is maintained. Thereby, the piezoelectric vibration device manufacturing equipment 1 can simultaneously obtain the information Ip on the positions of the plurality of piezoelectric elements P sucked by the suction head 20 and the information Ih on the positions of the holding members H.

此外，壓電震動裝置製造設備1係根據與被吸附頭20吸附起來的複數個壓電元件P之各者的位置有關的資訊及與保持構件H的位置有關的資訊Ih，藉由吸附頭用水平移動機構21及吸附頭用旋轉移動機構26，分別獨立地個別調整複數個吸附嘴28的X方向、Y方向及θ方向的位置。藉此，複數個吸附頭20係能夠將各自吸附起來的複數個壓電元件P的位 置分別相應於保持構件H的位置個別進行調整。藉此，吸附頭20係能夠考慮到保持構件H的形狀的變異並且將壓電元件P配置至保持構件H的凹部內。而且，複數個吸附頭20係能夠根據屬於數值資料的與壓電元件P的位置有關的資訊Ip及與保持構件H的位置有關的資訊Ih而個別調整吸附嘴28的位置，因此，無需進行供對位之用的暫時設置等。 In addition, the piezoelectric vibration device manufacturing equipment 1 uses the suction head 20 to use the suction head 20 to generate the information about the position of each of the plurality of piezoelectric elements P and the information Ih about the position of the holding member H. The horizontal movement mechanism 21 and the suction head rotation movement mechanism 26 independently adjust the positions of the plurality of suction nozzles 28 in the X direction, the Y direction, and the θ direction. Thereby, the plurality of adsorption heads 20 can adsorb the positions of the plurality of piezoelectric elements P respectively. The positions are individually adjusted corresponding to the positions of the holding members H. Thereby, the suction head 20 can arrange the piezoelectric element P into the recessed portion of the holding member H taking into consideration the variation in the shape of the holding member H. Furthermore, the plurality of suction heads 20 can individually adjust the positions of the suction nozzles 28 based on the information Ip on the position of the piezoelectric element P and the information Ih on the position of the holding member H, which are numerical data. Therefore, there is no need to supply Temporary settings for alignment purposes, etc.

此外，複數個供給頭30係藉由供給頭用水平移動機構31及供給頭用鉛直移動機構34，配合保持構件H的位置分別獨立地個別調整供給接合材的位置。而且，複數個供給頭30係取得屬於數值資料的與保持構件H的位置有關的資訊Ih，藉此，能夠個別調整供給設備36的位置，因此，無需進行保持構件H的對位等。此外，雷射量測設備15係不僅分別量測被供給至保持構件供給位置Sh的複數個保持構件H的水平方向的位置，還分別量測鉛直方向的位置。也因此，能夠將分別配置至複數個保持構件H的壓電元件P的鉛直方向的位置，相應於保持構件H的鉛直方向的位置而獨立地個別進行調整。因此，能夠不使節拍時間增加而將複數個壓電元件P在預定的位置以預定的擺向高精度地配置至複數個保持構件H的凹部內。 In addition, the plurality of supply heads 30 independently and individually adjust the positions of the supply joining materials according to the position of the holding member H through the horizontal movement mechanism 31 for the supply head and the vertical movement mechanism 34 for the supply head. Furthermore, the plurality of supply heads 30 acquire the information Ih regarding the position of the holding member H which is numerical data. This allows the position of the supply device 36 to be adjusted individually, and therefore there is no need to perform positioning of the holding member H or the like. In addition, the laser measuring device 15 not only measures the horizontal position but also the vertical position of the plurality of holding members H supplied to the holding member supply position Sh. Therefore, the vertical positions of the piezoelectric elements P respectively arranged on the plurality of holding members H can be independently adjusted corresponding to the vertical positions of the holding members H. Therefore, the plurality of piezoelectric elements P can be arranged in the recessed portions of the plurality of holding members H at predetermined positions and in predetermined swing directions with high accuracy without increasing the tact time.

此外，壓電震動裝置的製造方法係含有：壓電元件位置調整步驟S180，係根據與保持構件H的位置有關的資訊Ih及在壓電元件搬送步驟S160中於搬送中取得的與壓電元件P的位置有關的資訊Ip，將複數個壓電元件P的位置分別獨立地個別進行調整。攝像機14係對被吸附頭20的吸附嘴28吸附起來的壓電元件P及吸附嘴28同時進行拍攝。因此，在與壓電元件P的位置有關的資訊Ip中，係考慮到壓電元件P相對於複數 個吸附嘴28的偏離。因此，藉此，無需在壓電元件搬送步驟S160後另設藉由將壓電元件P進行暫時設置等而將壓電元件P相對於吸附嘴28定位之步驟。此外，接合材供給位置調整步驟S140係根據屬於數值資料的與保持構件H的位置有關的資訊Ih而個別調整接合構件的供給位置。也因此，壓電震動裝置的製造方法係無需按每個保持構件H進行個別的對位等。因此，能夠不使節拍時間增加而將複數個壓電元件P在預定的位置以預定的擺向分別配置至複數個保持構件H的凹部內。 In addition, the manufacturing method of the piezoelectric vibration device includes: a piezoelectric element position adjustment step S180, which is based on the information Ih related to the position of the holding member H and the piezoelectric element obtained during transportation in the piezoelectric element transportation step S160. The information Ip related to the position of P adjusts the positions of the plurality of piezoelectric elements P independently and individually. The camera 14 simultaneously captures the piezoelectric element P and the suction nozzle 28 that are suctioned by the suction nozzle 28 of the suction head 20 . Therefore, in the information Ip related to the position of the piezoelectric element P, it is considered that the piezoelectric element P is relative to the complex number The deviation of the suction nozzle 28. Therefore, this eliminates the need for a separate step of positioning the piezoelectric element P relative to the suction nozzle 28 by temporarily setting the piezoelectric element P after the piezoelectric element transfer step S160 . In addition, the joining material supply position adjustment step S140 individually adjusts the supply position of the joining member based on the information Ih regarding the position of the holding member H which is numerical data. Therefore, the manufacturing method of the piezoelectric vibration device does not require individual alignment for each holding member H. Therefore, the plurality of piezoelectric elements P can be arranged in the recessed portions of the plurality of holding members H at predetermined positions and in predetermined swing directions without increasing the tact time.

[實施型態2] [Implementation type 2]

<壓電震動裝置製造設備的組合> <Composition of Piezoelectric Vibration Device Manufacturing Equipment>

接著，利用圖13與圖14，針對本發明的含有壓電震動裝置製造設備1的實施型態2的壓電震動裝置製造線100的一部分進行說明。圖13係顯示含有壓電震動裝置製造設備1的壓電震動裝置製造線100的構成之俯視圖。圖14係顯示含有壓電震動裝置製造設備1的壓電震動裝置製造線100的控制構成之方塊圖。本實施型態的壓電震動裝置製造線100的一部分乃係將壓電元件P搭載至保持構件H之搭載部110。 Next, a part of the piezoelectric vibration device manufacturing line 100 including the piezoelectric vibration device manufacturing equipment 1 according to Embodiment 2 of the present invention will be described using FIGS. 13 and 14 . FIG. 13 is a plan view showing the structure of the piezoelectric vibration device manufacturing line 100 including the piezoelectric vibration device manufacturing equipment 1. FIG. 14 is a block diagram showing the control structure of the piezoelectric vibration device manufacturing line 100 including the piezoelectric vibration device manufacturing equipment 1. A part of the piezoelectric vibration device manufacturing line 100 of this embodiment is the mounting part 110 for mounting the piezoelectric element P on the holding member H.

如圖13所示，搭載部110係具有將收容有複數個壓電元件P的載盤T、整齊排列成片狀的複數個保持構件H進行搬送的搬送設備及複數台壓電震動裝置製造設備1。在本實施型態中，搭載部110係由作為搬送設備的機器人(robot)移動設備111、供給台112及搬送用機器人113、以及4台壓電震動裝置製造設備1所構成。搭載部110係由壓電震動裝置製造線100的產線控制設備120(參照圖14)進行控制。 As shown in FIG. 13 , the mounting unit 110 has a conveying device for conveying a carrier T accommodating a plurality of piezoelectric elements P, a plurality of holding members H arranged in a sheet shape, and a plurality of piezoelectric vibration device manufacturing equipment. 1. In this embodiment, the mounting unit 110 is composed of a robot moving device 111 as a conveying device, a supply table 112 and a conveying robot 113, and four pieces of piezoelectric vibration device manufacturing equipment 1. The mounting unit 110 is controlled by the production line control equipment 120 (see FIG. 14 ) of the piezoelectric vibration device manufacturing line 100.

機器人移動設備111及搬送用機器人113係將收容有複數個 壓電元件P的載盤T分別搬送至4台壓電震動裝置製造設備1的壓電元件供給設備10。此外，機器人移動設備111及搬送用機器人113係將整齊排列成片狀的複數個保持構件H分別搬送至4台壓電震動裝置製造設備1的保持構件供給設備11。此外，機器人移動設備111及搬送用機器人113係將已接合壓電元件P的片狀的保持構件H從4台壓電震動裝置製造設備1的保持構件供給設備11回收。 The robot mobile device 111 and the transport robot 113 accommodate a plurality of The carriers T of the piezoelectric elements P are respectively transported to the piezoelectric element supply equipment 10 of the four piezoelectric vibration device manufacturing equipments 1 . In addition, the robot moving device 111 and the transport robot 113 transport the plurality of holding members H arranged in a sheet shape to the holding member supply equipment 11 of the four piezoelectric vibration device manufacturing equipments 1 respectively. In addition, the robot moving equipment 111 and the transport robot 113 collect the sheet-shaped holding members H to which the piezoelectric elements P have been joined from the holding member supply equipment 11 of the four piezoelectric vibration device manufacturing equipments 1 .

機器人移動設備111乃係令搬送用機器人113移動的設備。機器人搬送設備係例如為具有作為致動器的伺服馬達與作為直動機構的滾珠螺桿單元等的單軸的直動單元。搬送用機器人113係裝載在機器人移動設備111的可動部。沿Z方向觀看，機器人移動設備111係將令搬送用機器人113移動的方向設置為Y方向。也因此，機器人移動設備111係構成為能夠將搬送用機器人113移動到Y方向的任意位置。 The robot moving device 111 is a device for moving the transport robot 113 . The robot transfer equipment is, for example, a single-axis linear motion unit including a servo motor as an actuator and a ball screw unit as a linear motion mechanism. The transport robot 113 is mounted on the movable portion of the robot moving device 111 . Viewed in the Z direction, the robot moving device 111 sets the direction in which the transport robot 113 moves to the Y direction. Therefore, the robot moving device 111 is configured to be able to move the transport robot 113 to any position in the Y direction.

供給台112乃係貯留收容有複數個壓電元件P的載盤T及片狀的保持構件H之台。藉由未圖示的上游步驟的供給設備或作業人員，而使收容有壓電元件P的載盤T及片狀的保持構件H被供給至供給台112。供給台112係配置在機器人移動設備111的端部。 The supply table 112 is a table that stores a carrier T accommodating a plurality of piezoelectric elements P and a sheet-shaped holding member H. The carrier T accommodating the piezoelectric element P and the sheet-shaped holding member H are supplied to the supply table 112 by supply equipment or workers in an upstream step (not shown). The supply table 112 is arranged at the end of the robot mobile device 111 .

搬送用機器人113係將收容有壓電元件P的載盤T供給至壓電震動裝置製造設備1的壓電元件供給設備10。此外，搬送用機器人113係將片狀的保持構件H供給至壓電震動裝置製造設備1的保持構件供給設備11。搬送用機器人113係例如為具有2支臂(arm)的雙臂式水平多關節型機器人(SCARA(selective compliance assembly robot arm；選擇順應性裝配機械手臂)型機器人)。搬送用機器人113係搭載在機器人移動設備111 的可動部。也因此，搬送用機器人113係構成為：沿Z方向觀看，藉由機器人移動設備111而能夠移動到Y方向的任意位置。此外，搬送用機器人113係構成為：沿鉛直方向觀看，藉由各個臂而能夠將載盤T及片狀的保持構件H沿與Y方向(藉由機器人移動設備111進行移動的移動方向)垂直之X方向的一方向側(X+方向側)與X方向的另一方向側(X-方向側)移動。 The transfer robot 113 supplies the carrier T accommodating the piezoelectric element P to the piezoelectric element supply facility 10 of the piezoelectric vibration device manufacturing facility 1 . Furthermore, the transport robot 113 supplies the sheet-shaped holding member H to the holding member supply facility 11 of the piezoelectric vibration device manufacturing facility 1 . The transport robot 113 is, for example, a two-arm horizontal articulated robot (SCARA (selective compliance assembly robot arm; selective compliance assembly robot arm) type robot) having two arms. The transport robot 113 is mounted on the robot mobile device 111 movable part. Therefore, the transport robot 113 is configured to be able to move to any position in the Y direction by the robot moving device 111 when viewed in the Z direction. In addition, the transport robot 113 is configured such that each arm can move the carrier T and the sheet-shaped holding member H perpendicularly to the Y direction (the moving direction of the robot moving device 111 ) when viewed in the vertical direction. One side of the X direction (X+ direction side) and the other side of the X direction (X- direction side) move.

4台壓電震動裝置製造設備1係分別獨立地令壓電元件P接合於保持構件H。沿鉛直方向觀看，在機器人移動設備111的一側配置4台壓電震動裝置製造設備1當中的2台壓電震動裝置製造設備1。此外，2台壓電震動裝置製造設備1係沿Y方向排列配置2台。此時，2台壓電震動裝置製造設備1係以使吸附頭移動設備12的移動方向(Y方向)成為與機器人移動設備111的移動方向平行的方式配置。此外，2台壓電震動裝置製造設備1係以下列的方式配置：使壓電元件供給設備10的壓電元件待機位置Wp及保持構件供給設備11的保持構件待機位置Wh位在機器人移動設備111側且位在搬送用機器人113的可動範圍內。 Each of the four pieces of piezoelectric vibration device manufacturing equipment 1 independently joins the piezoelectric element P to the holding member H. Viewed in the vertical direction, two pieces of the piezoelectric vibration device manufacturing equipment 1 among the four pieces of the piezoelectric vibration device manufacturing equipment 1 are arranged on one side of the robot mobile device 111 . In addition, two pieces of piezoelectric vibration device manufacturing equipment 1 are arranged side by side in the Y direction. At this time, the two pieces of piezoelectric vibration device manufacturing equipment 1 are arranged so that the moving direction (Y direction) of the suction head moving device 12 becomes parallel to the moving direction of the robot moving device 111 . In addition, the two piezoelectric vibration device manufacturing equipments 1 are arranged so that the piezoelectric element standby position Wp of the piezoelectric element supply equipment 10 and the holding member standby position Wh of the holding member supply equipment 11 are located at the robot moving equipment 111 side and is located within the movable range of the transport robot 113.

沿鉛直方向觀看，4台壓電震動裝置製造設備1當中的其他2台壓電震動裝置製造設備1係配置在機器人移動設備111的另一側。此外，2台壓電震動裝置製造設備1係沿Y方向排列配置2台。此時，2台壓電震動裝置製造設備1係以使吸附頭移動設備12的移動方向(Y方向)成為與機器人移動設備111的移動方向平行的方式配置。此外，2台壓電震動裝置製造設備1係以下列的方式配置：使壓電元件供給設備10的壓電元件待機位置Wp及保持構件供給設備11的保持構件待機位置Wh位在機器人移動設備111側且位在搬送用機器人113的可動範圍內。 Viewed in the vertical direction, the other two piezoelectric vibration device manufacturing devices 1 among the four piezoelectric vibration device manufacturing devices 1 are arranged on the other side of the robot mobile device 111 . In addition, two pieces of piezoelectric vibration device manufacturing equipment 1 are arranged side by side in the Y direction. At this time, the two pieces of piezoelectric vibration device manufacturing equipment 1 are arranged so that the moving direction (Y direction) of the suction head moving device 12 becomes parallel to the moving direction of the robot moving device 111 . In addition, the two piezoelectric vibration device manufacturing equipments 1 are arranged so that the piezoelectric element standby position Wp of the piezoelectric element supply equipment 10 and the holding member standby position Wh of the holding member supply equipment 11 are located at the robot moving equipment 111 side and is located within the movable range of the transport robot 113.

如上述的方式構成的搭載部110係藉由搬送用機器人113而能夠將貯留在供給台112的載盤T分別供給至4台壓電震動裝置製造設備1的壓電元件供給設備10的壓電元件待機位置Wp。此外，搭載部110係藉由搬送用機器人113而能夠將貯留在供給台112的片狀的保持構件H供給至4台壓電震動裝置製造設備1的保持構件供給設備11的保持構件待機位置Wh。此外，搭載部110係藉由搬送用機器人113而能夠從4台壓電震動裝置製造設備1的保持構件供給設備11的保持構件待機位置Wh將已分別收容壓電元件P的片狀的保持構件H回收。搭載部110係構成為：藉由搬送用機器人113而能夠將回收的片狀的保持構件H供給至下游側的未圖示的接合劑硬化爐。 The loading unit 110 configured as described above is capable of supplying the carrier trays T stored on the supply table 112 to the piezoelectric elements of the piezoelectric element supply equipment 10 of the four piezoelectric vibration device manufacturing equipments 1 by the transport robot 113 . Component standby position Wp. In addition, the loading unit 110 can supply the sheet-shaped holding members H stored in the supply table 112 to the holding member standby positions Wh of the holding member supply equipment 11 of the four piezoelectric vibration device manufacturing equipments 1 by the transportation robot 113 . In addition, the mounting unit 110 is capable of transferring the sheet-shaped holding members respectively housing the piezoelectric elements P from the holding member standby positions Wh of the holding member supply equipment 11 of the four piezoelectric vibration device manufacturing equipments 1 by the transportation robot 113 H recycling. The loading unit 110 is configured to be able to supply the recovered sheet-shaped holding member H to an adhesive curing furnace (not shown) on the downstream side by the transport robot 113 .

如圖13與圖14所示，當從壓電震動裝置製造線100的產線控制設備120輸入與生產開始有關的控制信號，搭載部110的4台壓電震動裝置製造設備1的其中至少1台便開始壓電震動裝置的製造。另外，產線控制設備120係根據壓電元件器件的生產量來決定進行稼動的壓電震動裝置製造設備1的台數。 As shown in FIGS. 13 and 14 , when a control signal related to the start of production is input from the production line control device 120 of the piezoelectric vibration device manufacturing line 100, at least one of the four piezoelectric vibration device manufacturing devices 1 in the mounting unit 110 Taiwan began to manufacture piezoelectric vibration devices. In addition, the production line control equipment 120 determines the number of piezoelectric vibration device manufacturing equipment 1 to be activated based on the production volume of piezoelectric element devices.

稼動中的壓電震動裝置製造設備1係例如在需要壓電元件P的供給時，對產線控制設備120輸出壓電元件P的供給信號。當取得前述壓電元件P的供給信號，產線控制設備120便對搬送設備輸出供給壓電元件P的控制信號。機器人移動設備111及搬送用機器人113係從供給台112將收容有複數個壓電元件P的載盤T供給至壓電震動裝置製造設備1的壓電元件供給設備10的壓電元件待機位置Wp。 For example, when the piezoelectric vibration device manufacturing equipment 1 in operation requires the supply of the piezoelectric element P, it outputs a supply signal of the piezoelectric element P to the production line control device 120 . After acquiring the supply signal of the piezoelectric element P, the production line control device 120 outputs a control signal for supplying the piezoelectric element P to the conveying device. The robot moving device 111 and the transport robot 113 supply the carrier T accommodating the plurality of piezoelectric elements P from the supply table 112 to the piezoelectric element waiting position Wp of the piezoelectric element supply device 10 of the piezoelectric vibration device manufacturing device 1 .

稼動中的壓電震動裝置製造設備1係例如在需要將收容有壓 電元件P的載盤T排出時，對產線控制設備120輸出收容有壓電元件P的載盤T的排出信號。當取得收容有壓電元件P的載盤T的排出信號，產線控制設備120便對機器人移動設備111及搬送用機器人113輸出將收容有壓電元件P的載盤T排出的控制信號。機器人移動設備111及搬送用機器人113係從壓電震動裝置製造設備1的保持構件供給設備11的保持構件待機位置Wh將收容有壓電元件P的載盤T回收，供給至未圖示的接合劑硬化爐。 The Piezoelectric Vibration Device Manufacturing Equipment Series 1 is in operation, for example, when it is necessary to accommodate a pressure-sensitive device. When the carrier T containing the electrical component P is discharged, a discharge signal for the carrier T containing the piezoelectric component P is output to the production line control device 120 . When acquiring the ejection signal of the carrier T containing the piezoelectric element P, the production line control device 120 outputs a control signal to the robot moving device 111 and the transport robot 113 to eject the carrier T containing the piezoelectric element P. The robot moving device 111 and the transport robot 113 collect the carrier T containing the piezoelectric element P from the holding member standby position Wh of the holding member supply device 11 of the piezoelectric vibration device manufacturing equipment 1 and supply it to a bonding unit (not shown). Agent hardening furnace.

如上述，壓電震動裝置製造線100係藉由組合複數台壓電震動裝置製造設備1，而能夠彈性地應對壓電震動裝置的生產量。 As described above, the piezoelectric vibration device manufacturing line 100 can flexibly cope with the production volume of piezoelectric vibration devices by combining a plurality of piezoelectric vibration device manufacturing equipments 1 .

[其他實施型態] [Other implementation types]

另外，在上述的實施型態中，壓電震動裝置製造設備1係具有4個吸附頭20及4個供給頭30。然而，壓電震動裝置製造設備1係只要分別具有複數個吸附頭20及供給頭30即可。 In addition, in the above-described embodiment, the piezoelectric vibration device manufacturing equipment 1 has four suction heads 20 and four supply heads 30 . However, the piezoelectric vibration device manufacturing equipment 1 only needs to have a plurality of suction heads 20 and supply heads 30 respectively.

此外，在上述的實施型態中，複數個供給頭30係亦可為能夠同時調整各個的供給設備36的位置之構成。此外，複數個吸附頭20係亦可為能夠同時調整各個的吸附嘴28的位置之構成。藉此，不論吸附頭20及供給頭30的數目為何，皆會抑制為了調整複數個吸附頭20及複數個供給頭30的位置所需的時間。 In addition, in the above-mentioned embodiment, the plurality of supply heads 30 may be configured so that the positions of the respective supply devices 36 can be adjusted simultaneously. In addition, the plurality of suction heads 20 may be configured so that the positions of the respective suction nozzles 28 can be adjusted simultaneously. Thereby, regardless of the number of the suction heads 20 and the supply heads 30 , the time required to adjust the positions of the plurality of suction heads 20 and the plurality of supply heads 30 can be suppressed.

此外，在上述的實施型態中，就壓電元件位置量測設備而言，壓電震動裝置製造設備1係從攝像機14所拍攝到的圖像來量測壓電元件P相對於吸附頭20的位置。然而，壓電元件位置量測設備係只要為能夠量測被吸附嘴吸附起來的壓電元件的位置的設備即可。壓電元件位置量測設備 係例如亦可為雷射量測設備等。 In addition, in the above embodiment, as for the piezoelectric element position measuring equipment, the piezoelectric vibration device manufacturing equipment 1 measures the position of the piezoelectric element P relative to the suction head 20 from the image captured by the camera 14 s position. However, the piezoelectric element position measuring device only needs to be a device capable of measuring the position of the piezoelectric element adsorbed by the adsorption nozzle. Piezoelectric element position measurement equipment The system may also be, for example, laser measurement equipment.

此外，在上述的實施型態中，攝像機14係配置在架台2上。然而，攝像機係亦可搭載在吸附頭。 Furthermore, in the above-mentioned embodiment, the camera 14 is arranged on the stand 2 . However, the camera system can also be mounted on the suction head.

此外，在上述的實施型態中，就保持構件位置量測設備而言，壓電震動裝置製造設備1係從雷射量測設備15所量測到的量測值來算出複數個保持構件H的位置。然而，保持構件位置量測設備係只要為能夠量測複數個保持構件的形狀的設備即可。保持構件位置量測設備係亦可為攝像機等。 In addition, in the above embodiment, as for the holding member position measuring equipment, the piezoelectric vibration device manufacturing equipment 1 calculates the plurality of holding members H from the measurement values measured by the laser measuring equipment 15 s position. However, the holding member position measuring device only needs to be a device capable of measuring the shapes of a plurality of holding members. The measuring device that maintains the position of the component may also be a camera, etc.

此外，在上述的實施型態中，吸附頭移動設備12係由單軸的直動單元構成。然而，吸附頭移動設備係只要為能夠將吸附頭從壓電元件供給位置移動到保持構件供給位置的設備即可。吸附頭移動設備係例如亦可為水平多關節機器人或垂直多關節機器人。針對壓電元件供給設備及保持構件供給設備亦同。 In addition, in the above-described embodiment, the suction head moving device 12 is composed of a single-axis linear motion unit. However, the suction head moving device only needs to be a device capable of moving the suction head from the piezoelectric element supply position to the holding member supply position. The suction head moving device may be a horizontal multi-joint robot or a vertical multi-joint robot, for example. The same applies to the piezoelectric element supply equipment and the holding member supply equipment.

此外，在上述的實施型態中，壓電震動裝置製造設備1係藉由1個保持構件供給設備11將複數個保持構件H供給至保持構件供給位置Sh。然而，壓電震動裝置製造設備係亦可具有複數個保持構件供給設備。壓電震動裝置製造設備係藉由具有複數個保持構件供給設備，而能夠在藉由其中一個保持構件供給設備進行的已完成壓電元件之配置的複數個保持構件的排出中，將壓電元件配置至藉由其他保持構件供給設備而被供給的複數個保持構件。 Furthermore, in the above-described embodiment, the piezoelectric vibration device manufacturing equipment 1 supplies a plurality of holding members H to the holding member supply position Sh by one holding member supplying device 11 . However, the piezoelectric vibration device manufacturing equipment may have a plurality of holding member supply equipment. The piezoelectric vibration device manufacturing equipment has a plurality of holding member supply equipment, so that the piezoelectric element can be discharged by one of the holding member supply equipment of the plurality of holding members in which the arrangement of the piezoelectric element has been completed. Arranged to a plurality of holding members supplied by other holding member supply equipment.

此外，在上述的實施型態中，在載盤T係具有供收納壓電元件P之用的凹部C。然而，載盤T係只要能夠將複數個壓電元件以配置成 矩陣狀的狀態供給即可。 Furthermore, in the above-described embodiment, the carrier T has the recessed portion C for accommodating the piezoelectric element P. However, the carrier T system only needs to be able to configure a plurality of piezoelectric elements into Just supply the state in matrix form.

此外，在上述的實施型態中，被供給至壓電震動裝置製造設備1的複數個保持構件H係連結成片狀。然而，複數個保持構件係只要能夠以配置成矩陣狀的狀態供給即可。複數個保持構件係例如亦可分別收容至以矩陣狀配置有複數個凹部的載盤。 Furthermore, in the above-described embodiment, the plurality of holding members H supplied to the piezoelectric vibration device manufacturing equipment 1 are connected in a sheet shape. However, the plurality of holding members may be supplied in a matrix-like state. For example, the plurality of holding members may be respectively accommodated in a carrier plate in which a plurality of recessed portions are arranged in a matrix.

此外，在上述的實施型態中，壓電元件供給設備10、保持構件供給設備11、吸附頭移動設備12、供給頭移動設備13、吸附頭20的吸附頭用水平移動機構21、吸附頭用鉛直移動機構24及吸附頭用旋轉移動機構26、供給頭30的供給頭用水平移動機構31及供給頭用鉛直移動機構34雖為以伺服馬達作為致動器的單軸的直動單元，但並無限定。壓電元件供給設備10、保持構件供給設備11、吸附頭移動設備12、供給頭移動設備13、吸附頭20的移動機構及供給頭30的移動機構係只要為線性馬達(linear motor)等能夠控制移動量的構成即可。 Furthermore, in the above-described embodiment, the piezoelectric element supply device 10, the holding member supply device 11, the suction head moving device 12, the supply head moving device 13, the suction head horizontal movement mechanism 21 of the suction head 20, the suction head horizontal movement mechanism 21, Although the vertical movement mechanism 24 and the rotation movement mechanism 26 for the suction head, the horizontal movement mechanism 31 for the supply head and the vertical movement mechanism 34 for the supply head 30 are single-axis linear motion units using a servo motor as an actuator, they are There is no limit. The piezoelectric element supply device 10 , the holding member supply device 11 , the suction head moving device 12 , the supply head moving device 13 , the moving mechanism of the suction head 20 and the moving mechanism of the supply head 30 can be controlled by linear motors or the like. The composition of the movement amount is sufficient.

此外，在上述的實施型態中，雷射量測設備15係構成為能夠旋轉及沿水平方向移動，以對各個保持構件H的水平方向中的位置及旋轉程度進行匹配。然而，在保持構件相對於保持構件供給設備高精度地配置的情形中，雷射量測設備係亦可構成為僅沿Y方向移動。此時，保持構件係藉由保持構件供給設備而沿X方向移動。也因此，雷射量測設備係能夠量測片狀的保持構件的形狀。雷射量測設備係藉由構成為僅能夠沿Y方向移動而抑制可動部分的鬆動、位置偏離等，因此，能夠更高精度地進行量測。或者，亦可構成為將雷射量測設備固定住，僅使保持構件藉由保持構件供給設備而能夠沿X方向及Y方向移動。 In addition, in the above-described embodiment, the laser measurement device 15 is configured to be able to rotate and move in the horizontal direction to match the position and rotation degree of each holding member H in the horizontal direction. However, in the case where the holding member is arranged with high precision relative to the holding member supply device, the laser measurement device may be configured to move only in the Y direction. At this time, the holding member is moved in the X direction by the holding member supply device. Therefore, the laser measuring equipment can measure the shape of the sheet-shaped holding member. The laser measurement equipment is configured to be movable only in the Y direction, thereby suppressing looseness, positional deviation, etc. of the movable part, and therefore can measure with higher accuracy. Alternatively, the laser measuring device may be fixed, and only the holding member may be moved in the X direction and the Y direction by the holding member supply device.

此外，在上述的實施型態中，保持構件H乃係具有能夠配置壓電元件P的凹部的箱體。保持構件H係在凹部內配置壓電元件P。然而，保持構件係亦可為不具有能夠配置壓電元件的凹部的平板狀構件。前述保持構件係在平板狀構件的平面上配置壓電元件。此時，保持構件係以具有凹部的蓋構件(深引伸罩蓋(cap)構造)覆蓋。 In addition, in the above-mentioned embodiment, the holding member H is a box body having a recessed portion in which the piezoelectric element P can be arranged. The holding member H arranges the piezoelectric element P in the recessed portion. However, the holding member may be a flat member without a recess in which the piezoelectric element can be arranged. The holding member arranges the piezoelectric element on the plane of the flat member. At this time, the holding member is covered with a cover member (deep extension cap structure) having a recessed portion.

此外，在上述的實施型態2中，搭載部110係具有4台壓電震動裝置製造設備1。然而，搭載部係亦可具有1台以上3台以下的壓電震動裝置製造設備。此外，搭載部係亦可具有5台以上的壓電震動裝置製造設備。 In addition, in the above-mentioned Embodiment 2, the mounting unit 110 has four piezoelectric vibration device manufacturing equipments 1 . However, the mounting unit may have one or more and three or more piezoelectric vibration device manufacturing equipments. In addition, the mounting department may also have more than 5 pieces of piezoelectric vibration device manufacturing equipment.

以上，說明了本發明的實施型態，但上述的實施型態只不過是實施方式的例示。也因此，本發明並不限定於上述的實施型態，能夠在不脫離本發明主旨的範圍內將上述的實施型態適宜地變形而實施。 The embodiments of the present invention have been described above. However, the above-described embodiments are merely examples of embodiments. Therefore, the present invention is not limited to the above-described embodiments, and the above-described embodiments can be appropriately modified and implemented without departing from the gist of the present invention.

1:壓電震動裝置製造設備 1: Piezoelectric vibration device manufacturing equipment

2:架台 2: Set up the platform

10:壓電元件供給設備 10: Piezoelectric component supply equipment

10a:載盤載置部 10a: Disk loading part

11:保持構件供給設備 11: Maintaining component supply equipment

11a:保持構件載置部 11a: Holding member placement part

12:吸附頭移動設備 12: Adsorption head mobile equipment

12a:吸附頭載置部 12a: Suction head placement part

13:供給頭移動設備 13: Supply head mobile equipment

13a:供給頭載置部 13a: Supply head mounting part

14:攝像機 14:Camera

15:雷射量測設備 15:Laser measurement equipment

20:吸附頭 20:Adsorption head

30:供給頭 30: Supply head

37:確認攝像機 37:Confirm camera

38:試吐部 38: Trial vomiting department

H:保持構件 H: keep component

P:壓電元件 P: Piezoelectric element

Sh:保持構件供給位置 Sh: maintain component supply position

Sp:壓電元件供給位置 Sp: Piezoelectric element supply position

T:載盤 T: load disk

W:待機位置 W: standby position

Wh:保持構件待機位置 Wh: Keep the component in the standby position

Wp:壓電元件待機位置 Wp: Piezoelectric element standby position

Claims (12)

一種壓電震動裝置製造設備，係供製造壓電震動裝置之用，該壓電震動裝置係至少具有壓電元件及保持前述壓電元件的保持構件，且前述壓電元件係藉由接合材而接合於前述保持構件，該壓電震動裝置製造設備係具有：複數個吸附頭，係一個一個地分別吸附前述壓電元件；及吸附頭移動設備，係搭載前述複數個吸附頭，且令前述複數個吸附頭同時於從被供給複數個前述壓電元件的壓電元件供給位置到被供給複數個前述保持構件的保持構件供給位置為止之間往復移動；複數個前述吸附頭係分別具有：吸附嘴，係吸附前述壓電元件；吸附頭用水平移動機構，係令前述吸附嘴沿水平方向移動；吸附頭用鉛直移動機構，係令前述吸附嘴沿鉛直方向移動；及吸附頭用旋轉移動機構，係令前述吸附嘴沿繞著鉛直軸旋轉的旋轉方向移動；並且，複數個前述吸附頭係在前述壓電元件供給位置藉由複數個前述吸附嘴而分別吸附被供給至前述壓電元件供給位置的前述壓電元件，且藉由前述吸附頭移動設備而從前述壓電元件供給位置移動到前述保持構件供給位置；前述吸附頭用水平移動機構、前述吸附頭用鉛直移動機構及前述吸附頭用旋轉移動機構係根據與複數個前述吸附嘴分別吸附起來的複數個前述壓電元件的位置有關的資訊及與被供給至前述保持構件供給位置的複數個 前述保持構件的位置有關的資訊，以能夠將複數個前述吸附嘴分別吸附著的前述壓電元件分別配置至對應的前述保持構件的方式分別獨立地個別調整前述吸附嘴的位置。 A piezoelectric vibration device manufacturing equipment for manufacturing a piezoelectric vibration device. The piezoelectric vibration device has at least a piezoelectric element and a holding member for holding the piezoelectric element, and the piezoelectric element is formed by a joining material. Joined to the holding member, the piezoelectric vibration device manufacturing equipment includes: a plurality of adsorption heads that adsorb the piezoelectric elements one by one; and an adsorption head moving device equipped with the plurality of adsorption heads, and the plurality of adsorption heads are Each suction head reciprocates simultaneously from a piezoelectric element supply position where a plurality of piezoelectric elements are supplied to a holding member supply position where a plurality of holding members are supplied; each of the plurality of suction heads has: a suction nozzle , is for adsorbing the aforementioned piezoelectric element; the adsorption head uses a horizontal movement mechanism, which makes the aforementioned adsorption nozzle move in the horizontal direction; the adsorption head uses a vertical movement mechanism, which makes the aforementioned adsorption nozzle move in the vertical direction; and the adsorption head uses a rotational movement mechanism, The suction nozzle is moved in a rotational direction about a vertical axis; and the plurality of suction heads are sucked and supplied to the piezoelectric element supply position by the plurality of suction nozzles at the piezoelectric element supply position. The piezoelectric element is moved from the piezoelectric element supply position to the holding member supply position by the suction head moving device; the horizontal movement mechanism for the suction head, the vertical movement mechanism for the suction head and the The rotational movement mechanism is based on information on the positions of the plurality of piezoelectric elements respectively sucked by the plurality of suction nozzles and the plurality of piezoelectric elements supplied to the supply position of the holding member. The information on the position of the holding member allows the positions of the suction nozzles to be independently adjusted so that the piezoelectric elements respectively suctioned by the plurality of suction nozzles are arranged on the corresponding holding members. 如請求項1所述之壓電震動裝置製造設備，係具有：複數個供給頭，係將前述接合材分別供給至前述保持構件；及供給頭移動設備，係搭載前述複數個供給頭，且令前述複數個供給頭同時於從前述複數個供給頭的待機位置到前述保持構件供給位置為止之間往復移動；前述複數個供給頭係分別具有：供給設備，係供給前述接合材；供給頭用水平移動機構，係令前述供給設備沿水平方向移動；及供給頭用鉛直移動機構，係令前述供給設備沿鉛直方向移動；其中，複數個前述供給頭係藉由前述供給頭移動設備而從前述待機位置移動到前述保持構件供給位置；前述供給頭用水平移動機構或前述供給頭用鉛直移動機構當中的至少一者係根據與被供給至前述保持構件供給位置的複數個前述保持構件的位置有關的資訊，以使複數個前述供給設備能夠將前述接合材分別供給至複數個前述保持構件的方式分別獨立地個別調整前述供給設備的位置。 The piezoelectric vibration device manufacturing equipment according to Claim 1 includes: a plurality of supply heads for supplying the joining materials to the holding members respectively; and a supply head moving device equipped with the plurality of supply heads, and The plurality of supply heads simultaneously move back and forth from the standby position of the plurality of supply heads to the supply position of the holding member; the plurality of supply heads respectively include: a supply device for supplying the aforementioned joining material; and a leveler for the supply head. a moving mechanism that moves the supply equipment in a horizontal direction; and a supply head vertical movement mechanism that moves the supply equipment in a vertical direction; wherein a plurality of the supply heads are moved from the standby state by the supply head moving equipment The position is moved to the holding member supply position; at least one of the horizontal movement mechanism for the supply head or the vertical movement mechanism for the supply head is based on the positions of the plurality of holding members supplied to the holding member supply position. The information is used to independently adjust the positions of the supply devices so that the plurality of supply devices can respectively supply the joining materials to the plurality of holding members. 如請求項2所述之壓電震動裝置製造設備，其中，複數個前述供給頭係在前述保持構件供給位置藉由複數個前述供給設備將前述接合材分別獨立地個別供給至複數個前述保持構件；複數個前述吸附頭係在前述保持構件供給位置將複數個前述吸附嘴分 別吸附著的前述壓電元件分別獨立地個別配置至已被供給前述接合材的複數個前述保持構件。 The piezoelectric vibration device manufacturing equipment according to claim 2, wherein the plurality of supply heads supply the joining materials to the plurality of holding members independently and individually through the plurality of supplying devices at the holding member supply positions. ; A plurality of the aforementioned suction heads are arranged at a supply position of the aforementioned holding member, and a plurality of the aforementioned suction nozzles are divided into The adsorbed piezoelectric elements are independently arranged on the plurality of holding members to which the bonding material has been supplied. 如請求項2或請求項3所述之壓電震動裝置製造設備，其中，前述複數個供給頭係藉由前述供給頭用水平移動機構或前述供給頭用鉛直移動機構的至少一者而能夠同時調整各個前述供給設備的位置。 The piezoelectric vibration device manufacturing equipment according to claim 2 or claim 3, wherein the plurality of supply heads can be simultaneously moved by at least one of the horizontal movement mechanism for the supply head or the vertical movement mechanism for the supply head. Adjust the position of each of the aforementioned supply equipment. 如請求項1所述之壓電震動裝置製造設備，其中，複數個前述吸附頭係藉由前述吸附頭用水平移動機構、前述吸附頭用鉛直移動機構或前述吸附頭用旋轉移動機構而能夠同時調整各個前述吸附嘴的位置。 The piezoelectric vibration device manufacturing equipment according to claim 1, wherein the plurality of suction heads can be moved simultaneously by the horizontal movement mechanism for the suction head, the vertical movement mechanism for the suction head, or the rotational movement mechanism for the suction head. Adjust the position of each of the aforementioned suction nozzles. 如請求項1所述之壓電震動裝置製造設備，係具有：壓電元件位置量測設備，係分別量測複數個前述吸附頭分別吸附起來的複數個前述壓電元件的水平方向的位置及前述壓電元件的擺向，以作為與前述壓電元件的位置有關的資訊；及保持構件位置量測設備，係分別量測被供給至前述保持構件供給位置的複數個前述保持構件的水平方向及鉛直方向的位置，以作為與前述保持構件的位置有關的資訊。 The piezoelectric vibration device manufacturing equipment described in claim 1 includes: a piezoelectric element position measuring device that measures the horizontal positions of the plurality of piezoelectric elements respectively adsorbed by the plurality of adsorption heads; The swing direction of the aforementioned piezoelectric element is used as information related to the position of the aforementioned piezoelectric element; and the holding member position measuring device is to respectively measure the horizontal directions of the plurality of aforementioned holding members supplied to the aforementioned holding member supply position. and the position in the vertical direction as information related to the position of the aforementioned holding member. 一種壓電震動裝置的製造方法，該壓電震動裝置係至少具有壓電元件及保持前述壓電元件的保持構件，且前述壓電元件係藉由接合材而接合於前述保持構件，該製造方法係含有下述步驟：壓電元件供給步驟，係將複數個前述壓電元件供給至壓電元件供給位置；壓電元件定位步驟，係將複數個前述壓電元件定位至壓電元件供給位置； 保持構件供給步驟，係將複數個前述保持構件供給至保持構件供給位置；保持構件定位步驟，係將複數個前述保持構件定位至保持構件供給位置；壓電元件搬送步驟，係將被定位至壓電元件供給位置的複數個前述壓電元件從前述壓電元件供給位置搬送到前述保持構件供給位置；及壓電元件位置調整步驟，係根據與從前述壓電元件供給位置搬送到前述保持構件供給位置的複數個前述壓電元件的位置有關的資訊及與被定位至前述保持構件供給位置的前述保持構件的位置有關的資訊，以能夠將從前述壓電元件供給位置搬送到前述保持構件供給位置的複數個前述壓電元件分別同時配置至對應的前述保持構件的方式，分別獨立地個別調整複數個前述壓電元件的水平方向、鉛直方向及繞著鉛直軸旋轉的旋轉方向的位置。 A method of manufacturing a piezoelectric vibration device, the piezoelectric vibration device having at least a piezoelectric element and a holding member that holds the piezoelectric element, and the piezoelectric element is joined to the holding member by a joining material, the manufacturing method The system includes the following steps: a piezoelectric element supply step, which supplies a plurality of the aforementioned piezoelectric elements to a piezoelectric element supply position; a piezoelectric element positioning step, which positions a plurality of the aforementioned piezoelectric elements to the piezoelectric element supply position; The holding member supply step is to supply a plurality of the aforementioned holding members to the holding member supply position; the holding member positioning step is to position the plurality of aforementioned holding members to the holding member supply position; and the piezoelectric element transporting step is to position the piezoelectric element to the holding member supply position. The plurality of piezoelectric elements at the electric element supply position are transported from the piezoelectric element supply position to the holding member supply position; and the piezoelectric element position adjustment step is based on the step of transporting the piezoelectric elements from the piezoelectric element supply position to the holding member supply position. Information on the positions of the plurality of piezoelectric elements and information on the position of the holding member positioned at the holding member supply position, so that the piezoelectric element supply position can be transferred to the holding member supply position The plurality of piezoelectric elements are simultaneously arranged on the corresponding holding members, and the positions of the plurality of piezoelectric elements in the horizontal direction, the vertical direction and the rotation direction about the vertical axis are independently adjusted. 如請求項7所述之壓電震動裝置的製造方法，係含有下述步驟：接合材供給位置調整步驟，係在前述保持構件供給位置，根據與被供給至前述保持構件供給位置的前述保持構件的位置有關的資訊，調整供給至前述保持構件的前述接合材的供給位置。 The manufacturing method of a piezoelectric vibration device according to Claim 7, further comprising the following steps: a step of adjusting a joining material supply position, which is performed at the holding member supply position based on the holding member being supplied to the holding member supply position. The supply position of the joining material supplied to the holding member is adjusted based on the information about the position. 如請求項8所述之壓電震動裝置的製造方法，係含有下述步驟：接合材供給步驟，係在前述保持構件供給位置，將前述接合材分別供給至複數個前述保持構件；及 壓電元件接合步驟，係在前述保持構件供給位置，將從前述壓電元件供給位置搬送到前述保持構件供給位置的複數個前述壓電元件分別配置至已被供給前述接合材的複數個前述保持構件。 The manufacturing method of a piezoelectric vibration device according to Claim 8 includes the following steps: a joining material supply step, in which the joining material is supplied to a plurality of the holding members respectively at the holding member supply position; and The piezoelectric element bonding step is to arrange the plurality of piezoelectric elements transported from the piezoelectric element supply position to the holding member supply position to the plurality of holders to which the bonding material has been supplied, respectively. component. 如請求項8或請求項9所述之壓電震動裝置的製造方法，其中，前述接合材供給位置調整步驟係同時分別調整將前述接合材供給至複數個前述保持構件的位置之步驟。 The manufacturing method of a piezoelectric vibration device according to Claim 8 or Claim 9, wherein the step of adjusting the joining material supply position is a step of simultaneously adjusting the positions of supplying the joining material to the plurality of holding members respectively. 如請求項7所述之壓電震動裝置的製造方法，其中，前述壓電元件位置調整步驟係以能夠分別配置至前述保持構件的方式同時分別調整前述複數個壓電元件的位置之步驟。 The method of manufacturing a piezoelectric vibration device according to claim 7, wherein the step of adjusting the position of the piezoelectric elements is a step of simultaneously adjusting the positions of the plurality of piezoelectric elements in a manner that they can be individually arranged on the holding member. 如請求項7所述之壓電震動裝置的製造方法，係含有下述步驟：壓電元件位置資訊取得步驟，係分別取得與從前述壓電元件供給位置搬送到前述保持構件供給位置的複數個前述壓電元件的水平方向的位置及前述壓電元件的擺向有關的資訊；及保持構件位置資訊取得步驟，係分別取得與被供給至前述保持構件供給位置的複數個前述保持構件的水平方向及鉛直方向的位置有關的資訊。 The method of manufacturing a piezoelectric vibration device according to claim 7, further comprising the following steps: a step of acquiring piezoelectric element position information, which is a step of acquiring and transporting a plurality of piezoelectric element position information from the piezoelectric element supply position to the holding member supply position. Information related to the horizontal position of the piezoelectric element and the swing direction of the piezoelectric element; and the step of obtaining position information of the holding member respectively obtain the horizontal directions of the plurality of holding members supplied to the holding member supply position. and vertical position information.
TW111124121A 2021-06-29 2022-06-28 Piezoelectric oscillation device manufacturing apparatus and method for manufacturing piezoelectric oscillation device TWI823447B (en)

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JP2011114775A (en) * 2009-11-30 2011-06-09 Kyocera Kinseki Corp Apparatus for mounting piezoelectric vibration element

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JP2012099560A (en) * 2010-10-29 2012-05-24 Kyocera Kinseki Corp Element component mounting apparatus
JP5845546B1 (en) * 2014-10-31 2016-01-20 アキム株式会社 Conveying apparatus, assembling apparatus and assembling method
JP6502666B2 (en) * 2014-12-26 2019-04-17 京セラ株式会社 Piezoelectric device and method of manufacturing the same

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TW200952333A (en) * 2008-02-26 2009-12-16 Seiko Instr Inc Piezoelectric vibrating piece and method of fabricating piezoelectric vibrating piece
JP2011114775A (en) * 2009-11-30 2011-06-09 Kyocera Kinseki Corp Apparatus for mounting piezoelectric vibration element

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