TWI819237B - Printed circuit board manufacturing method - Google Patents
Printed circuit board manufacturing method Download PDFInfo
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- TWI819237B TWI819237B TW109130784A TW109130784A TWI819237B TW I819237 B TWI819237 B TW I819237B TW 109130784 A TW109130784 A TW 109130784A TW 109130784 A TW109130784 A TW 109130784A TW I819237 B TWI819237 B TW I819237B
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- printed circuit
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- solder mask
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 37
- 229910000679 solder Inorganic materials 0.000 claims abstract description 43
- 238000004140 cleaning Methods 0.000 claims abstract description 20
- 238000005507 spraying Methods 0.000 claims abstract description 18
- 238000007747 plating Methods 0.000 claims abstract description 16
- 239000010931 gold Substances 0.000 claims description 16
- 229910052737 gold Inorganic materials 0.000 claims description 16
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- 239000007921 spray Substances 0.000 claims description 6
- 238000007639 printing Methods 0.000 claims description 4
- 239000008262 pumice Substances 0.000 claims description 2
- 238000007650 screen-printing Methods 0.000 abstract description 13
- 238000000034 method Methods 0.000 abstract description 11
- 239000002184 metal Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000003292 glue Substances 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
Description
本發明涉及印刷電路板製程技術領域，尤指一種利用防焊油墨噴塗之印刷電路板製程方法。 The present invention relates to the technical field of printed circuit board manufacturing, and in particular, to a printed circuit board manufacturing method using solder mask ink spraying.
印刷電路板表面通常會設置一層防焊層，其作用在於覆蓋印刷電路板表面不需要焊接的導體。目前印刷電路板製造業者普遍採用網版印刷以形成防焊層。 A layer of solder mask is usually provided on the surface of the printed circuit board, which is used to cover the conductors that do not need to be soldered on the surface of the printed circuit board. Currently, printed circuit board manufacturers generally use screen printing to form solder resist layers.
請參閱圖1所示習知印刷電路板製程方法之流程100，主要包括以下步驟：步驟101：第一次表面清潔處理；對印刷電路板的表面進行第一次清潔處理；將經過電鍍的印刷電路板的金屬層(例如，銅)表面的氧化膜、油脂等雜物去除，並對金屬層進行粗化處理；步驟102：網版印刷；將網版放置於印刷電路板表面，進行網版印刷；步驟103：第一次烘烤；將印刷電路板送入烘烤設備(例如，烤箱)中進行烘烤；第一次烘烤的作用是對油墨初步固化，以方便下一步驟的防焊曝光顯影； 步驟104：第一次曝光顯影；第一次曝光顯影是對前一步驟的防焊油墨進行曝光顯影；將需要鍍金的部分顯影掉而無需鍍金的部分使其曝光聚合；步驟105：第二次烘烤；將印刷電路板送入烘烤設備(例如，烤箱)中進行烘烤；第二次烘烤的作用是對油墨進一步固化，以減少降低在生產過程中油墨脫落刮傷而造成品質不良；步驟106：第二次表面清潔處理；對印刷電路板的表面進行第二次清潔處理；印刷電路板經過步驟103、105二次烘烤後，於印刷電路板金屬層表面會形成氧化層，因此藉由本步驟將氧化層去除；相較於步驟101的第一次表面清潔處理，第一次表面清潔處理是對金屬層的表面進行清潔、粗化，而第二次表面清潔處理是去除烘烤後的金屬層表面的氧化物，二者的清潔項目不同；步驟107：貼膜；將乾膜貼附於印刷電路板以利於後續的曝光顯影；乾膜的厚度例如可為2密耳(mil，又稱英絲或條)；步驟108：第二次曝光顯影；本步驟所進行的曝光顯影是針對進行步驟105~107之後的印刷電路板進行曝光顯影；將需要鍍金的部分顯影掉而無需鍍金的部分使其曝光聚合；步驟109：貼膠；請參閱圖2所示，習知採用網版印刷的印刷電路板20，網版印刷層21無法完全覆蓋印刷電路板20的表面，印刷電路板20的四周會有裸露的金屬層22，該裸露的金屬層22並不需要鍍金，因此必須以人工以抗鍍金膠帶封住金屬層22，以避免後續鍍金時形成金的浪費；步驟110：鍍金。 Please refer to the flow 100 of the conventional printed circuit board manufacturing method shown in Figure 1, which mainly includes the following steps: Step 101: first surface cleaning treatment; perform the first cleaning treatment on the surface of the printed circuit board; Remove the oxide film, grease and other impurities on the surface of the metal layer (for example, copper) of the circuit board, and roughen the metal layer; step 102: screen printing; place the screen on the surface of the printed circuit board and perform screen printing Printing; step 103: first baking; send the printed circuit board into the baking equipment (for example, oven) for baking; the function of the first baking is to initially solidify the ink to facilitate the prevention of the next step. Solder exposure and development; Step 104: First exposure and development; the first exposure and development is to expose and develop the solder mask ink in the previous step; develop the parts that need to be gold-plated without exposing and polymerizing the parts that do not need gold-plating; Step 105: the second time Baking; send the printed circuit board into the baking equipment (for example, oven) for baking; the second baking function is to further solidify the ink to reduce the ink falling off and scratching during the production process and causing poor quality. ; Step 106: Second surface cleaning treatment; Perform second cleaning treatment on the surface of the printed circuit board; After the printed circuit board is baked twice in steps 103 and 105, an oxide layer will be formed on the surface of the metal layer of the printed circuit board. Therefore, the oxide layer is removed through this step; compared with the first surface cleaning process in step 101, the first surface cleaning process is to clean and roughen the surface of the metal layer, while the second surface cleaning process is to remove the oxidation layer. The oxide on the surface of the baked metal layer has different cleaning items; Step 107: Apply the film; attach the dry film to the printed circuit board to facilitate subsequent exposure and development; the thickness of the dry film can be, for example, 2 mils (mil) , also known as English wire or strip); Step 108: Second exposure and development; The exposure and development performed in this step is for the printed circuit board after steps 105~107; the parts that need to be gold-plated are developed without The gold-plated part is exposed and polymerized; Step 109: Apply glue; please refer to Figure 2. In conventional printed circuit boards 20 using screen printing, the screen printing layer 21 cannot completely cover the surface of the printed circuit board 20. The printed circuit board 20 cannot completely cover the printed circuit board 20. There will be an exposed metal layer 22 around the board 20. The exposed metal layer 22 does not need to be gold-plated, so the metal layer 22 must be manually sealed with anti-gold plating tape to avoid gold waste during subsequent gold plating; Step 110: Gold plated.
由於步驟106~107中以乾膜覆蓋了印刷電路板的板面(包含要鍍金的區域)，因此必須進行步驟108的第二次曝光顯影，把需要鍍金的部分顯影掉而無需鍍金的部分使其曝光聚合蓋住印刷電路板面；步驟108主要是針對覆蓋於印刷電路板上的乾膜進行曝光顯影。 Since the surface of the printed circuit board (including the area to be gold-plated) is covered with dry film in steps 106 to 107, the second exposure and development in step 108 is necessary to develop the parts that need to be gold-plated without using the parts that need to be gold-plated. The exposure polymerization covers the surface of the printed circuit board; step 108 is mainly to expose and develop the dry film covering the printed circuit board.
以製作120片尺寸為17.8x23.8英吋的印刷電路板而言，於步驟102需要一套網版，且需要大約0.4公斤油墨；於步驟104需要一套曝光底片；於步驟107需要一卷尺寸為250x23.5x400英呎的乾膜；於步驟109需要8~9卷長度為66公尺的抗鍍金膠布。至於花費的時間，步驟102約需1小時，步驟106、107約需花費3小時，步驟109約需4小時，總共約需8小時。 For the production of 120 printed circuit boards with a size of 17.8x23.8 inches, a set of screens and about 0.4 kg of ink are required in step 102; a set of exposure films are required in step 104; and a roll is required in step 107 The size of the dry film is 250x23.5x400 feet; in step 109, you need 8~9 rolls of anti-gold plating tape with a length of 66 meters. As for the time spent, step 102 takes about 1 hour, steps 106 and 107 take about 3 hours, step 109 takes about 4 hours, and the total takes about 8 hours.
上述步驟顯示，習知印刷電路板製程由於採用網版印刷，不僅耗費大量人工時間，而且須花費乾膜及抗鍍金膠帶的成本。 The above steps show that the conventional printed circuit board manufacturing process uses screen printing, which not only consumes a lot of labor time, but also requires the cost of dry film and anti-gold plating tape.
據此，如何發展出一種「印刷電路板製程方法」，可簡化印刷電路板製程及製造成本，是相關技術領域人士亟待解決之課題。 Accordingly, how to develop a "printed circuit board manufacturing method" that can simplify the printed circuit board manufacturing process and manufacturing costs is an urgent issue for people in the relevant technical field to solve.
於一實施例中，本發明提出一種印刷電路板製程方法，包含下列步驟：步驟(a)：表面清潔處理；對印刷電路板的表面進行清潔處理；步驟(b)：防焊油墨噴塗；將已完成表面清潔處理的印刷電路板送入進行噴塗設備中進行防焊油墨噴塗以形成防焊層；步驟(c)：第一次烘烤；將已完成防焊油墨噴塗的印刷電路板送入烘烤設備進行第一次烘烤； 步驟(d)：防焊曝光顯影；對已完成第一次烘烤的印刷電路板進行防焊曝光顯影；步驟(e)：第二次烘烤；將已完成防焊曝光顯影的印刷電路板送入烘烤設備進行第二次烘烤；以及步驟(f)：鍍金；對已完成第二次烘烤的印刷電路板進行鍍金。 In one embodiment, the present invention proposes a printed circuit board manufacturing method, which includes the following steps: step (a): surface cleaning treatment; cleaning the surface of the printed circuit board; step (b): spraying solder mask ink; The printed circuit board that has completed the surface cleaning treatment is sent to the spraying equipment for solder mask ink spraying to form a solder mask layer; step (c): first baking; the printed circuit board that has completed the solder mask ink spraying is sent into The baking equipment performs the first baking; Step (d): Solder mask exposure and development; perform solder mask exposure and development on the printed circuit board that has completed the first baking; Step (e): second baking; perform solder mask exposure and development on the printed circuit board that has completed solder mask exposure and development Send it to the baking equipment for the second baking; and step (f): gold plating; perform gold plating on the printed circuit board that has completed the second baking.
先前技術： Previous technology:
100:習知印刷電路板製程方法之流程 100: Familiar with the process of printed circuit board manufacturing method
101~110:習知印刷電路板製程方法之流程之步驟 101~110: Familiar with the steps of the printed circuit board manufacturing process
20:習知採用網版印刷的印刷電路板 20: Commonly used printed circuit boards using screen printing
21:網版印刷層 21: Screen printing layer
22:金屬層 22:Metal layer
本發明： The present invention:
300:本發明印刷電路板製程方法之流程 300: Flow of the printed circuit board manufacturing method of the present invention
301~306:本發明印刷電路板製程方法之流程之步驟 301~306: Steps of the process of the printed circuit board manufacturing method of the present invention
40:本發明以防焊油墨噴塗形成防焊層的印刷電路板 40: The printed circuit board of the present invention is sprayed with solder resist ink to form a solder resist layer.
41:噴塗油墨 41:Spray ink
圖1為習知印刷電路板製程方法之流程圖。 Figure 1 is a flow chart of a conventional printed circuit board manufacturing method.
圖2為習知以網版印刷製成防焊層的印刷電路板的俯視結構示意圖。 FIG. 2 is a schematic top view of a conventional printed circuit board with a solder mask formed by screen printing.
圖3為本發明印刷電路板製程方法之一實施例之流程圖。 FIG. 3 is a flow chart of an embodiment of a printed circuit board manufacturing method of the present invention.
圖4為本發明被噴塗油墨完全覆蓋的印刷電路板的俯視結構示意圖。 Figure 4 is a schematic top structural view of a printed circuit board completely covered with spray ink according to the present invention.
請參閱圖3所示，本發明所印刷電路板製程方法之流程300，其包含主要包括以下步驟：步驟301：表面清潔處理；將經過電鍍的印刷電路板的金屬層(例如，銅)表面的氧化膜、油脂等雜物去除，並對金屬層進行粗化處理；於進行本步驟之前，印刷電路板可依需要先經噴砂(Pumice)處理或超粗化處理；步驟302：防焊油墨噴塗；將已完成表面清潔處理的印刷電路板送入進行噴塗設備中進行防焊油墨噴塗以形成防焊層；可藉由調整印刷電路板的前進速度、噴塗設備的油墨噴量，得到所需的防焊層的厚度；所採用的油
墨種類依所需而定；請參閱圖4所示，以防焊油墨噴塗形成防焊層的印刷電路板40，其表面可被噴塗油墨41完全覆蓋，於印刷電路板40四周不會有裸露的金屬層，因此不需要貼附抗鍍金膠帶；步驟303：第一次烘烤；將已完成防焊油墨噴塗的印刷電路板送入烘烤設備(例如，烤箱)中進行烘烤；烘烤設備可與前述噴塗設備連線以進行連續作業；，烘烤溫度例如可為攝氏75~78度，烘烤時間例如可為45~48分鐘；第一次烘烤的作用是對油墨初步固化，以方便下一步驟的防焊曝光顯影；步驟304：防焊曝光顯影；對已完成第一次烘烤的印刷電路板進行防焊曝光顯影；防焊曝光顯影是對防焊油墨噴塗的防焊油墨進行曝光顯影；將需要鍍金的部分顯影掉而無需鍍金的部分使其曝光聚合；步驟305：第二次烘烤；將已完成防焊曝光顯影的印刷電路板放入烘烤設備(例如，烤箱)中進行烘烤，烘烤溫度例如可為攝氏135度，烘烤時間例如可為30分鐘；第二次烘烤的作用是對油墨進一步固化，以減少降低在生產過程中油墨脫落刮傷而造成品質不良；步驟306：鍍金；對已完成第二次烘烤的印刷電路板進行鍍金。
Referring to Figure 3, the
以製作120片尺寸為17.8x23.8英吋的印刷電路板而言，於步驟302所花費的時間約為30分鐘，需要大約12公斤油墨。相較於習知以網版印刷製成防焊層的印刷電路板製程，本發明所提供之印刷電路板製程方法由於不需要習知印刷網版、曝光底片、乾膜、抗鍍金膠布等步驟，因此可節省約7.5小時的時間，而且可省去印刷網版、曝光底片、乾膜、抗鍍金膠布的材料成本。
For the production of 120 printed circuit boards with a size of 17.8x23.8 inches, the time spent in
請參閱圖1及圖3所示，相較於圖1所示習知印刷電路板製程方法之流程，圖3所示本發明印刷電路板製程方法之一實施例之流程只需要進行一次表面清潔處理(圖3之步驟301)，且由於不需要貼膜(圖1之步驟107)、貼膠(圖1之步驟109)，因此可以連帶省去第二次表面清潔處理(圖1之步驟106)、第二次曝光顯影(圖1之步驟108)，亦即，相較於圖1所示習知流程，本發明至少省去了四個步驟(圖1之步驟106~109)所必須花費的工時與成本。
Please refer to Figures 1 and 3. Compared with the process of the conventional printed circuit board manufacturing method shown in Figure 1, the process of one embodiment of the printed circuit board manufacturing method of the present invention shown in Figure 3 only requires one surface cleaning. (
雖然本發明所提供之印刷電路板製程方法所使用的油墨較多，但是相較於習知印刷電路板製程，尤其是貼附乾膜與抗鍍金膠帶所需的人工時間與成本，本發明不僅能簡化製程，據統計，更能降低約4.76%的成本。 Although the printed circuit board manufacturing method provided by the present invention uses more ink, compared with the conventional printed circuit board manufacturing process, especially the labor time and cost required for attaching dry film and anti-gold plating tape, the present invention not only It can simplify the manufacturing process and, according to statistics, can reduce costs by about 4.76%.
綜上所述，本發明所提供之印刷電路板製程方法，利用防焊油墨噴塗取代習知網版印刷，於印刷電路板表面形成防焊層，不僅大幅簡化印刷電路板製程，同時可節省貼附乾膜與抗鍍金膠帶所需的大量人工時間與成本。於本發明技術領域中，尚未見與本案相同的技術手段。 In summary, the printed circuit board manufacturing method provided by the present invention uses solder mask ink spraying instead of conventional screen printing to form a solder mask layer on the surface of the printed circuit board, which not only greatly simplifies the printed circuit board manufacturing process, but also saves on stickers. A lot of labor time and cost required to attach dry film and anti-gold plating tape. In the technical field of the present invention, the same technical means as in this case have not yet been found.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed above through embodiments, they are not intended to limit the present invention. Anyone with ordinary knowledge in the technical field may make some modifications and modifications without departing from the spirit and scope of the present invention. Therefore, The protection scope of the present invention shall be determined by the appended patent application scope.
300:本發明印刷電路板製程方法之流程300: Flow of the printed circuit board manufacturing method of the present invention
301~306:本發明印刷電路板製程方法之流程之步驟301~306: Steps of the process of the printed circuit board manufacturing method of the present invention
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| CN101572995A (en) * | 2008-04-29 | 2009-11-04 | 汉达精密电子(昆山)有限公司 | Method for forming conducting wire on insulated heat-conducting metal substrate in a vacuum sputtering way |
| CN110320749A (en) * | 2018-03-28 | 2019-10-11 | 太阳油墨制造株式会社 | The manufacturing method of photosensitive polymer combination, dry film and printed circuit board |
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2020
- 2020-09-08 TW TW109130784A patent/TWI819237B/en active
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|---|---|---|---|---|
| US5637426A (en) * | 1994-10-25 | 1997-06-10 | Fujitsu, Ltd. | Method and apparatus for forming resist pattern, and printed wiring board fabricated thereby |
| US6754551B1 (en) * | 2000-06-29 | 2004-06-22 | Printar Ltd. | Jet print apparatus and method for printed circuit board manufacturing |
| CN101572998A (en) * | 2008-04-29 | 2009-11-04 | 汉达精密电子(昆山)有限公司 | Method for forming conducting wire on insulated heat-conducting metal substrate in a vacuum sputtering way |
| CN101572995A (en) * | 2008-04-29 | 2009-11-04 | 汉达精密电子(昆山)有限公司 | Method for forming conducting wire on insulated heat-conducting metal substrate in a vacuum sputtering way |
| CN110320749A (en) * | 2018-03-28 | 2019-10-11 | 太阳油墨制造株式会社 | The manufacturing method of photosensitive polymer combination, dry film and printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202210962A (en) | 2022-03-16 |
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