TWI816180B - Multi station clamping device - Google Patents

Multi station clamping device Download PDF

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TWI816180B
TWI816180B TW110133467A TW110133467A TWI816180B TW I816180 B TWI816180 B TW I816180B TW 110133467 A TW110133467 A TW 110133467A TW 110133467 A TW110133467 A TW 110133467A TW I816180 B TWI816180 B TW I816180B
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wafer
slot
bases
base
inclined surface
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TW202301530A (en
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朱政挺
張志軍
楊淵思
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大陸商杭州眾硅電子科技有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

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  • Condensed Matter Physics & Semiconductors (AREA)
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract

一種多工位夾取裝置，包括至少兩個卡爪單元，卡爪單元包括用於承托晶圓的至少兩個基座，及可帶動所有基座轉動的旋轉軸，當旋轉軸周向轉動時，基座可以交替處於工作位；每個基座上分別設有導向面及卡槽。旋轉軸周向轉動，晶圓可以沿著處於工作位的基座的導向面滑行、直至落入卡槽內，至少兩個卡爪單元的卡槽配合將晶圓夾持。A multi-station clamping device includes at least two claw units. The claw unit includes at least two bases for supporting wafers, and a rotating shaft that can drive all the bases to rotate. When the rotating shaft rotates circumferentially When working, the base can be alternately in the working position; each base is provided with a guide surface and a slot. The rotating shaft rotates circumferentially, and the wafer can slide along the guide surface of the base in the working position until it falls into the slot. The slots of at least two claw units cooperate to clamp the wafer.

Description

多工位夾取裝置Multi-station clamping device

本發明屬於半導體集成電路芯片製造技術領域，特別是針對晶圓固定方式，尤其是涉及一種多工位夾取裝置。The invention belongs to the technical field of semiconductor integrated circuit chip manufacturing, and is particularly directed to a wafer fixing method, and particularly relates to a multi-station clamping device.

在現有的半導體加工過程中，需要將晶圓進行多次抓取及輸送，且在一些特殊工藝中會用到兩種拋光液，為了避免拋光液直接的相互作用，以及對晶圓的污染，兩種拋光液相互之間不能接觸，但是晶圓抓取機構在傳輸晶圓過程中不可避免會接觸到晶圓上的拋光液，容易存在兩種以上拋光液殘留的問題，為解決上述問題，目前一般採用兩套夾取機構來抓取晶圓，但採用兩套夾取機構來存在成本高，佔據空間大等缺點。In the existing semiconductor processing process, the wafer needs to be grabbed and transported multiple times, and two polishing fluids are used in some special processes. In order to avoid direct interaction between the polishing fluids and contamination of the wafer, The two polishing fluids cannot come into contact with each other, but the wafer grabbing mechanism will inevitably come into contact with the polishing fluid on the wafer during the transfer of the wafer. It is easy to have the problem of residues of more than two polishing fluids. In order to solve the above problem, Currently, two sets of clamping mechanisms are generally used to grab wafers. However, using two sets of clamping mechanisms has the disadvantages of high cost and large space occupation.

況且，目前對於不同尺寸的晶圓，需採用不同的夾取機構，需根據晶圓的大小設置特定的夾取機構，不可一種夾取機構多用，成本較高。Moreover, currently, different clamping mechanisms need to be used for wafers of different sizes, and specific clamping mechanisms need to be set according to the size of the wafer. It is not possible to use one clamping mechanism for multiple purposes, and the cost is high.

為了克服現有技術的不足，本發明提供一種可以滿足多拋光液工藝的需求，使用成本降低，適應性高，佔據空間小的多工位夾取裝置。In order to overcome the shortcomings of the prior art, the present invention provides a multi-station clamping device that can meet the needs of multiple polishing liquid processes, has reduced operating costs, has high adaptability and occupies a small space.

本發明解決其技術問題所採用的技術方案是：一種多工位夾取裝置，包括至少兩個卡爪單元，所述卡爪單元包括用於承托晶圓的至少兩個基座，及可帶動所有基座轉動的旋轉軸，當所述旋轉軸周向轉動時，所述基座可以交替處於工作位；每個基座上分別設有導向面及卡槽，所述旋轉軸周向轉動，晶圓可以沿著處於工作位的基座的導向面滑行、直至落入卡槽內，至少兩個卡爪單元的卡槽配合將晶圓夾持。The technical solution adopted by the present invention to solve the technical problem is: a multi-station clamping device including at least two claw units. The claw unit includes at least two bases for supporting the wafer, and can A rotating shaft that drives all bases to rotate. When the rotating shaft rotates circumferentially, the bases can be in working positions alternately. Each base is provided with a guide surface and a slot respectively. The rotating shaft rotates circumferentially. , the wafer can slide along the guide surface of the base in the working position until it falls into the slot, and the slots of at least two claw units cooperate to clamp the wafer.

本發明在單個卡爪單元上設置至少兩個基座，基座在旋轉軸的帶動下可以旋轉交替處於夾持晶圓的工作位，從而當需要滿足不同拋光液的工藝需求時，可以將卡爪單元轉動一定角度實現基座替換，達到工序之間不會產生相互影響的目的，使用靈活方便；導向面的設置使得對不同晶圓的適應性更高，使用靈活度更佳。The present invention is provided with at least two bases on a single claw unit. The bases can rotate and alternately be in the working position of clamping the wafer driven by the rotating shaft, so that when the process requirements of different polishing fluids need to be met, the clamping jaws can be The claw unit rotates at a certain angle to replace the base, so that there will be no mutual influence between processes, making it flexible and convenient to use; the setting of the guide surface makes it more adaptable to different wafers and has better flexibility of use.

進一步的，所述導向面為傾斜面，該傾斜面與第二傾斜面配合形成所述卡槽的相對兩個側壁，當旋轉軸帶動所述基座轉動靠近晶圓時，晶圓抵著傾斜面滑入卡槽內。傾斜面可以起到導向作用，使得晶圓定向滑入卡槽內，且儘量保持水平，卡槽對晶圓的夾持更加穩固，而且可以適配不同厚度的晶圓。Further, the guide surface is an inclined surface, and the inclined surface cooperates with the second inclined surface to form two opposite side walls of the slot. When the rotating shaft drives the base to rotate close to the wafer, the wafer is tilted against the inclined surface. Slide it into the card slot. The inclined surface can play a guiding role, allowing the wafer to slide into the slot in a direction that is as horizontal as possible. The slot holds the wafer more firmly and can adapt to wafers of different thicknesses.

進一步的，所述晶圓抵著傾斜面發生軸向移動直至滑入卡槽內，晶圓的上邊緣與第二傾斜面以點接觸或線接觸的方式相抵接，晶圓的下邊緣與傾斜面以點接觸或線接觸的方式相抵接。晶圓與傾斜面和第二傾斜面均以點接觸或線接觸的方式相抵，接觸面積小，對晶圓性能不會產生不利影響。Further, the wafer moves axially against the inclined surface until it slides into the slot, the upper edge of the wafer contacts the second inclined surface in a point contact or line contact, and the lower edge of the wafer contacts the inclined surface. The surfaces touch each other in point or line contact. The wafer is in point contact or line contact with the inclined surface and the second inclined surface. The contact area is small and will not adversely affect the performance of the wafer.

進一步的，所述基座上、位於卡槽的軸向上方還設有第三傾斜面，所述晶圓可以順著第三傾斜面滑落在傾斜面上。便於晶圓放置在傾斜面上，也起到一定的導向作用。Furthermore, a third inclined surface is provided on the base and located axially above the slot, and the wafer can slide onto the inclined surface along the third inclined surface. It is convenient for placing the wafer on the inclined surface and also plays a certain guiding role.

進一步的，所述旋轉軸上設有支架，該支架以旋轉軸的軸心為中心向外延伸形成一個或兩個或多個延伸臂，每個延伸臂上均設有基座。基座的數量可以任意設置，從而可滿足多拋光液工藝的需求，延伸臂的長度也可以根據需要進行選擇，使用的靈活度高。Further, a bracket is provided on the rotating shaft, and the bracket extends outward with the axis of the rotating shaft as the center to form one or two or more extension arms, and a base is provided on each extension arm. The number of bases can be set arbitrarily to meet the needs of multiple polishing fluid processes. The length of the extension arm can also be selected according to needs, providing high flexibility in use.

進一步的，所述基座上還設有凸部，所述導向面包括承托平面及斜面一，所述凸部下表面和承托平面之間形成所述卡槽，當旋轉軸帶動所述基座轉動時，晶圓在承托平面上、抵著斜面一滑入卡槽內。承托平面對晶圓的支撐作用更穩定，斜面一對晶圓的放置起到導向作用，晶圓可沿著斜面滑入晶圓承接平面，卡槽對晶圓起到限位作用，即使晶圓旋轉傾斜或移動也不會脫落。Furthermore, the base is also provided with a convex portion, and the guide surface includes a supporting plane and an inclined surface. The slot is formed between the lower surface of the convex portion and the supporting plane. When the rotating shaft drives the base, When the holder rotates, the wafer slides into the slot on the supporting plane and against the inclined surface. The supporting plane supports the wafer more stably, and the inclined plane guides the placement of the wafer. The wafer can slide into the wafer receiving plane along the inclined plane, and the slot limits the wafer, even if the wafer is placed. The circle will not fall off even if it is rotated, tilted or moved.

進一步的，所述導向面還包括設於凸部的斜面二，所述晶圓可以抵著斜面一和斜面二進入卡槽。斜面二在基座旋轉時具有導向作用，晶圓可沿著斜面二滑入卡槽。Furthermore, the guide surface further includes a bevel two provided on the convex portion, and the wafer can enter the slot against the bevel one and the bevel two. The second inclined surface has a guiding role when the base rotates, and the wafer can slide into the slot along the second inclined surface.

進一步的，所述基座的數量為兩個，其同軸設置，相鄰基座之間形成缺口部，該缺口部用於防止兩個基座上的液體接觸。缺口部的設置避免兩道工藝的拋光液相互接觸，產生不利影響，保證不同工藝的工序之間的獨立性。Further, the number of the bases is two, which are coaxially arranged, and a notch is formed between adjacent bases, and the notch is used to prevent liquid contact on the two bases. The setting of the notch prevents the polishing fluids of the two processes from contacting each other and causing adverse effects, and ensures the independence between the processes of different processes.

進一步的，所述卡槽的軸向高度大於晶圓的軸向厚度；所述卡槽的底壁和側壁相垂直。卡槽在起到限位作用的同時，避免對晶圓的表面造成擠壓，保證晶圓的性能Further, the axial height of the slot is greater than the axial thickness of the wafer; the bottom wall and the side wall of the slot are perpendicular to each other. The card slot not only plays a limiting role, but also avoids squeezing the surface of the wafer to ensure the performance of the wafer.

進一步的，所述基座的數量為三個，其沿晶圓的周向間隔佈設。三個基座對晶圓的支撐和夾持更加穩固；而且三個基座可以達到只限制晶圓移動，而不對晶圓施加力的功能，保證不會夾碎晶圓。Further, the number of the bases is three, and they are arranged at intervals along the circumferential direction of the wafer. The three bases support and clamp the wafer more firmly; and the three bases can only limit the movement of the wafer without exerting force on the wafer, ensuring that the wafer will not be pinched.

本發明採用了一種可旋轉卡爪單元組合而成的多工位夾取裝置。夾取裝置在承載晶圓工位時，晶圓可垂直放在夾取裝置上，夾取裝置的卡爪單元在旋轉一定的角度後，夾取裝置進入固定晶圓工位，晶圓無法脫出，被穩穩地固定在夾取裝置上，而後夾取裝置可以做任意動作而不用擔心晶圓掉落或損傷。夾取裝置的卡爪單元再旋轉一定的角度後，可進入脫出晶圓工位，晶圓可水平脫出夾取裝置也可垂直脫出夾取裝置。夾取裝置上有至少兩個卡爪單元，可根據不同的工藝要求選擇不同的卡爪單元以傳輸不同的晶圓。The invention adopts a multi-station clamping device composed of a rotatable claw unit. When the clamping device is carrying the wafer station, the wafer can be placed vertically on the clamping device. After the claw unit of the clamping device rotates at a certain angle, the clamping device enters the fixed wafer station and the wafer cannot be removed. out, it is firmly fixed on the clamping device, and then the clamping device can make any movements without worrying about the wafer falling or being damaged. After the claw unit of the clamping device is rotated to a certain angle, it can enter the wafer ejection station, and the wafer can be ejected from the clamping device horizontally or vertically. There are at least two claw units on the clamping device, and different claw units can be selected according to different process requirements to transfer different wafers.

這種多工位的夾取裝置的卡爪單元可由單個或多個基座組成，在使用由兩個及以上基座組成的卡爪單元時，可滿足對應多拋光液或者多尺寸晶圓的需求。The claw unit of this multi-station clamping device can be composed of a single or multiple bases. When using a claw unit composed of two or more bases, it can meet the needs of multiple polishing fluids or multi-size wafers. need.

本發明的有益效果是：1）本發明的多工位夾取裝置可以旋轉，可以承載晶圓，也可以固定晶圓從而使之在翻轉或移動時不會掉落，使用方式更加靈活；2）本發明的多工位夾取裝置，單個夾取裝置上有至少兩個卡爪單元，每個卡爪單元的大小相同，可以滿足多拋光液的工藝需求，節約了時間、空間以及費用成本，使用範圍更加廣泛；3）本發明的多工位夾取裝置，單個夾取裝置上有多個卡爪單元，每個卡爪單元的大小可以是不相同的，可以滿足傳輸不同尺寸晶圓的工藝需求，節約了費用成本，使用範圍更加廣泛；4）本發明的多工位夾取裝置，單個夾取裝置上的卡爪單元的基座可以是2個及以上，可更換，不固定，靈活變換，基座之間的角度間距可以根據需求設置,可實現一個機多用。The beneficial effects of the present invention are: 1) The multi-station clamping device of the present invention can rotate, can carry wafers, and can also fix the wafers so that they will not fall when flipped or moved, and the use method is more flexible; 2 ) The multi-station clamping device of the present invention has at least two claw units on a single clamping device. Each claw unit is the same size, which can meet the process requirements of multiple polishing fluids and save time, space and cost. , the scope of use is wider; 3) The multi-station clamping device of the present invention has multiple claw units on a single clamping device, and the size of each claw unit can be different, which can meet the needs of transporting wafers of different sizes. process requirements, saving costs and having a wider range of use; 4) In the multi-station clamping device of the present invention, the bases of the claw units on a single clamping device can be 2 or more, which are replaceable and not fixed. , flexible transformation, the angular spacing between the bases can be set according to needs, allowing one machine to be used for multiple purposes.

為了使本技術領域的人員更好的理解本發明方案，下面將結合本發明實施例中的附圖，對發明實施例中的技術方案進行清楚、完整的描述，顯然，所描述的實施例僅僅是本發明的一部分實施例，而不是全部的實施例。基於本發明中的實施例，本領域普通技術人員在沒有做出創造性勞動前提下所獲得的所有其他實施例，都應當屬於本發明保護的範圍。In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only These are some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts should fall within the scope of protection of the present invention.

實施例一Embodiment 1

一種多工位夾取裝置，包括至少兩個卡爪單元1，卡爪單元1包括用於承托晶圓2的至少兩個基座3，及可以帶動所有的基座3轉動的旋轉軸4。當旋轉軸4周向轉動時，兩個或多個基座3可以交替處於工作位，此處的工作位指的是有晶圓2放置的工作狀態。A multi-station clamping device includes at least two claw units 1. The claw unit 1 includes at least two bases 3 for supporting wafers 2, and a rotation shaft 4 that can drive all the bases 3 to rotate. . When the rotating shaft 4 rotates circumferentially, two or more bases 3 can be in working positions alternately. The working position here refers to the working state in which the wafer 2 is placed.

每個基座3上分別設置有導向面31及卡槽32，當旋轉軸4周向轉動時，晶圓2可以沿著基座3，此處指的是處於工作位的基座3的導向面31滑行，直到晶圓2落在卡槽32內，成對的兩個卡爪單元1的卡槽32配合將晶圓2穩固夾持。Each base 3 is provided with a guide surface 31 and a slot 32 respectively. When the rotation axis 4 rotates circumferentially, the wafer 2 can move along the base 3. This refers to the guidance of the base 3 in the working position. The surface 31 slides until the wafer 2 falls into the slot 32 , and the slots 32 of the two pairs of claw units 1 cooperate to firmly clamp the wafer 2 .

如圖1-9所示，在本實施例中，導向面31為傾斜面311，以圖2所示方向為例，該傾斜面311自上而下、自內向外傾斜延伸，基座3上還形成有第二傾斜面33，該第二傾斜面33自下而上、自內向外傾斜延伸，上述的傾斜面311和第二傾斜面33上下相對、配合形成卡槽32的相對兩個側壁，換句話說，卡槽32的寬度各處不等。As shown in Figures 1-9, in this embodiment, the guide surface 31 is an inclined surface 311. Taking the direction shown in Figure 2 as an example, the inclined surface 311 extends obliquely from top to bottom and from inside to outside. A second inclined surface 33 is also formed. The second inclined surface 33 extends obliquely from bottom to top and from inside to outside. The above-mentioned inclined surface 311 and the second inclined surface 33 face each other up and down, and cooperate to form two opposite side walls of the slot 32 . , in other words, the width of the card slot 32 varies from place to place.

工作時，先將晶圓2放置在傾斜面311上，如圖2所示，此時晶圓2下表面的外邊緣架設在傾斜面311，兩個卡爪單元1成對出現將晶圓2支撐住，當然，在本實施例中，卡爪單元1的數量為三個，其沿著晶圓2的周向間隔佈設，對晶圓2的支撐更加平穩。接著，旋轉軸4旋轉帶動基座3轉動靠近晶圓2時，即晶圓2的圓心和基座3的軸心之間的距離發生變化，晶圓2抵著傾斜面311滑入卡槽32內，也就是晶圓2發生了軸向向上的位移，直至其滑入卡槽32內，晶圓2的上邊緣與第二傾斜面33以點接觸的方式相抵接，晶圓2的下邊緣與傾斜面311以點接觸的方式相抵接。當然在其他實施例中，晶圓2的上邊緣與第二傾斜面33也可以以線接觸的方式相抵接，晶圓2的下邊緣與傾斜面311也可以以線接觸的方式相抵接。When working, first place the wafer 2 on the inclined surface 311, as shown in Figure 2. At this time, the outer edge of the lower surface of the wafer 2 is set up on the inclined surface 311, and two claw units 1 appear in pairs to hold the wafer 2 To support, of course, in this embodiment, the number of claw units 1 is three, which are arranged at intervals along the circumferential direction of the wafer 2 to support the wafer 2 more stably. Then, when the rotating shaft 4 rotates and drives the base 3 to rotate close to the wafer 2 , that is, the distance between the center of the wafer 2 and the axis of the base 3 changes, the wafer 2 slides into the slot 32 against the inclined surface 311 , that is, the wafer 2 is displaced axially upward until it slides into the slot 32 , the upper edge of the wafer 2 abuts the second inclined surface 33 in a point contact manner, and the lower edge of the wafer 2 It is in point contact with the inclined surface 311 . Of course, in other embodiments, the upper edge of the wafer 2 and the second inclined surface 33 may also be in line contact, and the lower edge of the wafer 2 and the inclined surface 311 may also be in line contact.

在承接晶圓2的工作位時，基座3不在旋轉軸4與晶圓2圓心的連線上，旋轉時，基座3向旋轉軸4與晶圓2圓心的連線方向移動，從而將晶圓2卡入卡槽32內。晶圓2被傾斜面311和第二傾斜面33穩固夾持，從而即使晶圓2不處於水平位置，而是發生旋轉和移動時，均被穩固夾持，不會從卡槽32內脫落。而且晶圓2的上邊緣和下邊緣分別與第二傾斜面33和傾斜面311相抵，接觸面積小，與晶圓2的表面完全沒有接觸，對晶圓2起到了良好的保護作用，最大限度保證晶圓2本身的性能，而且可以適配不同厚度的晶圓2。When receiving the working position of wafer 2, the base 3 is not on the line connecting the rotation axis 4 and the center of the wafer 2. When rotating, the base 3 moves in the direction of the line connecting the rotation axis 4 and the center of the wafer 2, thereby moving the base 3 Wafer 2 is inserted into the card slot 32 . The wafer 2 is firmly clamped by the inclined surface 311 and the second inclined surface 33 , so that even if the wafer 2 is not in a horizontal position but rotates or moves, it is firmly clamped and will not fall off from the slot 32 . Moreover, the upper edge and the lower edge of the wafer 2 offset the second inclined surface 33 and the inclined surface 311 respectively. The contact area is small and has no contact with the surface of the wafer 2 at all, which plays a good protective role for the wafer 2 and maximizes the protection effect of the wafer 2. The performance of the wafer 2 itself is guaranteed, and it can be adapted to wafers 2 of different thicknesses.

為了方便晶圓2放置在傾斜面311上，基座3上、位於卡槽32的軸向上方還設有第三傾斜面34，其自上而下、自內向外傾斜延伸，且斜率大於傾斜面311的斜面，從而晶圓2可以順著或者說順著第三傾斜面34滑落在傾斜面311上，第三傾斜面34起到一個良好的導向作用。In order to facilitate placing the wafer 2 on the inclined surface 311, a third inclined surface 34 is provided on the base 3 and located axially above the slot 32, which extends obliquely from top to bottom and from the inside to the outside, and the slope is greater than the slope. The wafer 2 can slide on the inclined surface 311 along the third inclined surface 34, and the third inclined surface 34 plays a good guiding role.

每個卡爪單元1上至少設有兩個基座3，旋轉軸4上設有支架41，該支架41以旋轉軸4的軸心為中心向外延伸形成一個延伸臂411，每個延伸臂411上均設置有基座3。Each claw unit 1 is provided with at least two bases 3, and a bracket 41 is provided on the rotating shaft 4. The bracket 41 extends outward with the axis center of the rotating shaft 4 as the center to form an extension arm 411. Each extension arm 411 is equipped with a base 3.

如圖5所示，延伸臂411的數量為一個，兩個基座3均位於延伸臂411的外端，且兩個基座3同軸設置，相鄰基座3之間形成缺口部36，該缺口部36用於防止拋光液體在兩個基座3之間流通。As shown in Figure 5, the number of the extension arm 411 is one, and the two bases 3 are located at the outer ends of the extension arm 411, and the two bases 3 are coaxially arranged, and a notch 36 is formed between adjacent bases 3. The notch 36 is used to prevent polishing liquid from flowing between the two bases 3 .

上述結構下，兩個基座3之間需要轉換時，旋轉軸4轉動帶動兩個基座3均遠離晶圓2，取下晶圓2後，兩個基座3自身先發生周向轉動，使得之前處於工作位、夾持住晶圓2的基座3轉動朝向外側，另一個基座3轉動朝向內側。從而晶圓2使用不同的拋光液進行處理時，可以分別利用兩個基座3對其進行夾持，不會發生殘留拋光液影響另一道工藝的情形。Under the above structure, when the two bases 3 need to be switched, the rotation of the rotating shaft 4 drives the two bases 3 away from the wafer 2. After the wafer 2 is removed, the two bases 3 themselves first rotate circumferentially. The base 3 that was previously in the working position and holds the wafer 2 is rotated toward the outside, and the other base 3 is rotated toward the inside. Therefore, when the wafer 2 is processed using different polishing liquids, it can be clamped by two bases 3 respectively, and the residual polishing liquid will not affect another process.

當然，如圖6所示，延伸臂411的數量也可以是兩個，兩個基座3相互獨立，且對稱分佈在延伸臂411的外端。Of course, as shown in FIG. 6 , the number of extension arms 411 may also be two. The two bases 3 are independent of each other and are symmetrically distributed at the outer ends of the extension arms 411 .

上述結構下，兩個基座3之間需要轉換時，旋轉軸4轉動即可。以圖4所示為例進行說明，需要替換另一個基座3處於工作位時，旋轉軸4沿箭頭方向逆時針旋轉即可。Under the above structure, when it is necessary to switch between the two bases 3, the rotating shaft 4 can be rotated. Taking the example shown in Figure 4 as an example, when it is necessary to replace another base 3 in the working position, the rotating shaft 4 can be rotated counterclockwise in the direction of the arrow.

當然，如圖7、8所示，延伸臂411的數量還可以是三個、四個等任意數量，每個延伸臂411的外端均設置有基座3。Of course, as shown in FIGS. 7 and 8 , the number of extension arms 411 can also be three, four, or any other number. The outer end of each extension arm 411 is provided with a base 3 .

為了適應不同的晶圓2，也可以對應不同的拋光液，基座3和延伸臂411之間可拆卸連接，便於靈活變換。延伸臂411的長度也可以根據不同的晶圓2尺寸需求進行設置。In order to adapt to different wafers 2 and different polishing fluids, the base 3 and the extension arm 411 are detachably connected to facilitate flexible change. The length of the extension arm 411 can also be set according to different size requirements of the wafer 2 .

實施例二Embodiment 2

如圖10-18所示，在本實施例中，基座3上還設有凸部35，導向面31包括承托平面312及斜面一313，承托平面312為水平面，斜面一313自下而上、自外向內傾斜，晶圓2放置在承托平面312上，凸部35的下表面和承托平面312之間形成卡槽32。As shown in Figures 10-18, in this embodiment, the base 3 is also provided with a convex portion 35. The guide surface 31 includes a supporting plane 312 and an inclined plane 313. The supporting plane 312 is a horizontal plane, and the inclined plane 313 extends from the bottom to the bottom. The wafer 2 is tilted upward and from the outside inward, and is placed on the supporting plane 312 . A slot 32 is formed between the lower surface of the convex portion 35 and the supporting plane 312 .

當旋轉軸4帶動基座3轉動時，晶圓2在承托平面312上、抵著斜面一313滑入卡槽32內。如圖18所示，該卡槽32的軸向高度大於晶圓2的軸向厚度，即S1＞S2，且卡槽32的底壁和側壁相垂直，因此晶圓2的側壁可以與卡槽32的底壁接觸相抵，保證晶圓2被穩固夾持，且不會損壞晶圓2的上表面，保證其性能的穩定。When the rotating shaft 4 drives the base 3 to rotate, the wafer 2 slides into the slot 32 on the supporting plane 312 and against the inclined plane 313 . As shown in Figure 18, the axial height of the slot 32 is greater than the axial thickness of the wafer 2, that is, S1>S2, and the bottom wall and the side wall of the slot 32 are perpendicular, so the side wall of the wafer 2 can be aligned with the slot. The bottom walls of 32 are in contact with each other to ensure that the wafer 2 is firmly clamped without damaging the upper surface of the wafer 2, ensuring the stability of its performance.

當然，在其他實施例中，如圖19所示，卡槽32的底壁321也可以是斜面，其自上而下、自內向外傾斜，從而晶圓2的上邊緣與卡槽32的底壁321接觸，保證晶圓2被穩固夾持，且不會損壞晶圓2的上表面，保證其性能的穩定。即使晶圓2不處於水平位置，而是發生旋轉和移動時，均能被穩固夾持，不會從卡槽32內脫落。Of course, in other embodiments, as shown in FIG. 19 , the bottom wall 321 of the slot 32 may also be a slope, which is inclined from top to bottom and from the inside to the outside, so that the upper edge of the wafer 2 is in contact with the bottom of the slot 32 . The walls 321 are in contact to ensure that the wafer 2 is firmly clamped without damaging the upper surface of the wafer 2, ensuring the stability of its performance. Even if the wafer 2 is not in a horizontal position but rotates or moves, it can be firmly clamped and will not fall off from the card slot 32 .

為了便於晶圓2順利滑入卡槽32內，導向面31還包括設置在凸部35側面的斜面二351，如圖14所示，斜面二351自上而下、朝著著晶圓2移動的方向傾斜。從而當晶圓2置於基座3後，其可以抵著斜面一313和斜面二351進入卡槽32，即使晶圓2發生一定的傾斜，斜面二351也可以將其下壓進入卡槽32內。In order to facilitate the smooth sliding of the wafer 2 into the card slot 32, the guide surface 31 also includes a second inclined surface 351 provided on the side of the convex portion 35. As shown in FIG. 14, the second inclined surface 351 moves from top to bottom toward the wafer 2. direction is tilted. Therefore, when the wafer 2 is placed on the base 3, it can enter the slot 32 against the first bevel 313 and the second bevel 351. Even if the wafer 2 is tilted to a certain extent, the second bevel 351 can press it down into the slot 32. within.

如圖14所示，一個卡爪單元1上基座3的數量為兩個，且同軸設置在旋轉軸4的頂端面上，相鄰基座3之間也形成缺口部36。當其中一個基座3處於工作位完成工作後，旋轉180度即可將另一個基座3轉動至工作位，繼續工作。As shown in FIG. 14 , the number of bases 3 on one claw unit 1 is two, and they are coaxially arranged on the top surface of the rotating shaft 4 . Notches 36 are also formed between adjacent bases 3 . When one of the bases 3 is in the working position and has completed its work, the other base 3 can be rotated 180 degrees to the working position to continue working.

上述實施例一和實施例二中結構的多工位夾取裝置，可以應用在大型化學機械平坦化設備中，晶圓轉載台連接拋光單元和清潔單元，待拋光的晶圓進入拋光單元和拋光完畢的晶圓要進入清潔單元都要經過轉載台，多工位夾取裝置可應用在轉載臺上，用於固定晶圓，便於將晶圓傳輸進清潔單元。The multi-station clamping device structured in the first and second embodiments above can be used in large-scale chemical mechanical planarization equipment. The wafer transfer table is connected to the polishing unit and the cleaning unit, and the wafer to be polished enters the polishing unit and the polishing unit. The completed wafers must pass through the transfer stage before entering the cleaning unit. The multi-station clamping device can be used on the transfer stage to fix the wafers and facilitate the transfer of the wafers into the cleaning unit.

上述具體實施方式用來解釋說明本發明，而不是對本發明進行限制，在本發明的精神和申請專利的保護範圍內，對本發明作出的任何修改和改變，都落入本發明的保護範圍。The above-mentioned specific embodiments are used to explain the present invention, rather than to limit the present invention. Within the spirit of the present invention and the protection scope of the patent application, any modifications and changes made to the present invention fall within the protection scope of the present invention.

1:卡爪單元 2:晶圓 3:基座 31:導向面 311:傾斜面 312:承托平面 313:斜面一 32:卡槽 321:底壁 33:第二傾斜面 34:第三傾斜面 35:凸部 351:斜面二 36:缺口部 4:旋轉軸 41:支架 411:延伸臂 1: Claw unit 2:wafer 3: base 31:Guide surface 311: Inclined surface 312:Supporting plane 313: Incline 1 32:Card slot 321: Bottom wall 33: Second inclined surface 34:Third inclined plane 35:convex part 351: Incline 2 36: Notch part 4:Rotation axis 41: Bracket 411:Extended arm

圖1為本發明實施例一的使用狀態立體圖。 圖2為本發明實施例一中（晶圓架設在導向面、未完全落入卡槽）的局部主視圖。 圖3為本發明實施例一中（晶圓完全落入卡槽）的局部主視圖。 圖4為本發明實施例一的使用狀態俯視圖。 圖5為本發明實施例一中卡爪單元的結構示意圖一。 圖6為本發明實施例一中卡爪單元的結構主視圖。 圖7為本發明實施例一中卡爪單元的結構示意圖二。 圖8為本發明實施例一中卡爪單元的結構示意圖三。 圖9為本發明實施例一中卡爪單元的結構示意圖四。 圖10為本發明實施例二的使用狀態立體圖。 圖11為本發明實施例二中卡爪單元的立體圖。 圖12為本發明實施例二中卡爪單元的主視圖。 圖13為本發明實施例二的另一種結構的使用狀態立體圖。 圖14為本發明實施例二中另一種結構的卡爪單元的立體圖。 圖15為本發明實施例二中卡爪單元的工作過程示意圖一。 圖16為本發明實施例二中卡爪單元的工作過程示意圖二，此時卡爪單元夾持晶圓。 圖17為本發明實施例二中卡爪單元夾持晶圓時的主視圖。 圖18為圖17中的A處結構放大圖。 圖19為圖17中的A處另一種結構放大圖。 Figure 1 is a perspective view of the use state of Embodiment 1 of the present invention. FIG. 2 is a partial front view of Embodiment 1 of the present invention (the wafer is set on the guide surface and does not completely fall into the slot). FIG. 3 is a partial front view of Embodiment 1 of the present invention (the wafer is completely dropped into the slot). Figure 4 is a top view of the use state of Embodiment 1 of the present invention. Figure 5 is a schematic structural diagram of the claw unit in Embodiment 1 of the present invention. Figure 6 is a structural front view of the claw unit in Embodiment 1 of the present invention. Figure 7 is a second structural schematic diagram of the claw unit in Embodiment 1 of the present invention. Figure 8 is a schematic third structural diagram of the claw unit in Embodiment 1 of the present invention. Figure 9 is a schematic diagram 4 of the structure of the claw unit in Embodiment 1 of the present invention. Figure 10 is a perspective view of the use state of the second embodiment of the present invention. Figure 11 is a perspective view of the claw unit in Embodiment 2 of the present invention. Figure 12 is a front view of the claw unit in Embodiment 2 of the present invention. Figure 13 is a perspective view of another structure in use according to Embodiment 2 of the present invention. Figure 14 is a perspective view of a claw unit with another structure in Embodiment 2 of the present invention. Figure 15 is a schematic diagram 1 of the working process of the claw unit in Embodiment 2 of the present invention. FIG. 16 is a second schematic diagram of the working process of the claw unit in Embodiment 2 of the present invention. At this time, the claw unit clamps the wafer. FIG. 17 is a front view of the jaw unit clamping the wafer in Embodiment 2 of the present invention. Figure 18 is an enlarged view of the structure at point A in Figure 17. Figure 19 is an enlarged view of another structure at position A in Figure 17.

1:卡爪單元 1: Claw unit

2:晶圓 2:wafer

Claims (8)

一種多工位夾取裝置，包括至少兩個卡爪單元，其中所述卡爪單元包括用於承托晶圓的至少兩個基座，及可帶動所有基座轉動的旋轉軸，所述旋轉軸周向轉動，所述基座可以交替處於工作位；每個基座上分別設有導向面及卡槽，當所述旋轉軸周向轉動時，晶圓可以沿著處於工作位的基座的導向面滑行、直至落入卡槽內，至少兩個卡爪單元的卡槽配合將晶圓夾持，其中所述導向面為傾斜面，該傾斜面與第二傾斜面配合形成所述卡槽的相對兩個側壁，當旋轉軸帶動所述基座轉動靠近晶圓時，晶圓抵著傾斜面滑入卡槽內，並且所述基座上、位於卡槽的軸向上方還設有第三傾斜面，所述晶圓可以順著第三傾斜面滑落在傾斜面上。 A multi-station clamping device includes at least two claw units, wherein the claw unit includes at least two bases for supporting wafers, and a rotation shaft that can drive all bases to rotate, and the rotation The shaft rotates circumferentially, and the bases can alternately be in the working position; each base is provided with a guide surface and a slot. When the rotating shaft rotates circumferentially, the wafer can move along the base in the working position. The guide surface slides until it falls into the slot, and the slots of at least two claw units cooperate to clamp the wafer. The guide surface is an inclined surface, and the inclined surface cooperates with the second inclined surface to form the clamping surface. On the two opposite side walls of the slot, when the rotating shaft drives the base to rotate close to the wafer, the wafer slides into the slot against the inclined surface, and there is also a wafer on the base located axially above the slot. The third inclined surface, the wafer can slide onto the inclined surface along the third inclined surface. 一種多工位夾取裝置，包括至少兩個卡爪單元，其中所述卡爪單元包括用於承托晶圓的至少兩個基座，及可帶動所有基座轉動的旋轉軸，所述旋轉軸周向轉動，所述基座可以交替處於工作位；每個基座上分別設有導向面及卡槽，當所述旋轉軸周向轉動時，晶圓可以沿著處於工作位的基座的導向面滑行、直至落入卡槽內，至少兩個卡爪單元的卡槽配合將晶圓夾持，其中所述導向面為傾斜面，該傾斜面與第二傾斜面配合形成所述卡槽的相對兩個側壁，當旋轉軸帶動所述基座轉動靠近晶圓時，晶圓抵著傾斜面滑入卡槽內，並且所述旋轉軸上設有支架，該支架以 旋轉軸的軸心為中心向外延伸形成一個或兩個或多個延伸臂，每個延伸臂上均設有基座。 A multi-station clamping device includes at least two claw units, wherein the claw unit includes at least two bases for supporting wafers, and a rotation shaft that can drive all bases to rotate, and the rotation The shaft rotates circumferentially, and the bases can alternately be in the working position; each base is provided with a guide surface and a slot. When the rotating shaft rotates circumferentially, the wafer can move along the base in the working position. The guide surface slides until it falls into the slot, and the slots of at least two claw units cooperate to clamp the wafer. The guide surface is an inclined surface, and the inclined surface cooperates with the second inclined surface to form the clamping surface. On the two opposite side walls of the slot, when the rotating shaft drives the base to rotate close to the wafer, the wafer slides into the slot against the inclined surface, and a bracket is provided on the rotating shaft, and the bracket is The axis of the rotating shaft extends outward from the center to form one or two or more extension arms, and each extension arm is provided with a base. 一種多工位夾取裝置，包括至少兩個卡爪單元，其中所述卡爪單元包括用於承托晶圓的至少兩個基座，及可帶動所有基座轉動的旋轉軸，所述旋轉軸周向轉動，所述基座可以交替處於工作位；每個基座上分別設有導向面及卡槽，當所述旋轉軸周向轉動時，晶圓可以沿著處於工作位的基座的導向面滑行、直至落入卡槽內，至少兩個卡爪單元的卡槽配合將晶圓夾持，其中所述基座上還設有凸部，所述導向面包括承托平面，及斜面一，所述凸部下表面和承托平面之間形成所述卡槽，當旋轉軸帶動所述基座轉動時，晶圓在承托平面上、抵著斜面一滑入卡槽內。 A multi-station clamping device includes at least two claw units, wherein the claw unit includes at least two bases for supporting wafers, and a rotation shaft that can drive all bases to rotate, and the rotation The shaft rotates circumferentially, and the bases can alternately be in the working position; each base is provided with a guide surface and a slot. When the rotating shaft rotates circumferentially, the wafer can move along the base in the working position. The guide surface slides until it falls into the slot, and the slots of at least two claw units cooperate to clamp the wafer, wherein the base is also provided with a convex portion, the guide surface includes a supporting plane, and Incline 1, the slot is formed between the lower surface of the protrusion and the supporting plane. When the rotating shaft drives the base to rotate, the wafer slides into the slot on the supporting plane against the inclined plane. 如請求項3所述的多工位夾取裝置，其中所述導向面還包括設於凸部的斜面二，所述晶圓可以抵著斜面一和斜面二進入卡槽。 The multi-station clamping device as claimed in claim 3, wherein the guide surface further includes a bevel two provided on the convex portion, and the wafer can enter the slot against the bevel one and the bevel two. 如請求項3所述的多工位夾取裝置，其中所述基座的數量為兩個，其同軸設置，相鄰基座之間形成缺口部，該缺口部用於防止兩個基座上的液體接觸。 The multi-station clamping device according to claim 3, wherein the number of the bases is two, which are arranged coaxially, and a notch is formed between adjacent bases, and the notch is used to prevent the two bases from liquid contact. 如請求項3所述的多工位夾取裝置，其特徵在於：所述卡槽的軸向高度大於晶圓的軸向厚度；所述卡槽的底壁和側壁相垂直。 The multi-station clamping device according to claim 3, wherein the axial height of the slot is greater than the axial thickness of the wafer; the bottom wall and the side wall of the slot are perpendicular to each other. 一種多工位夾取裝置，包括至少兩個卡爪單元，其中所述卡爪單元包括用於承托晶圓的至少兩個基座，及可帶動所 有基座轉動的旋轉軸，所述旋轉軸周向轉動，所述基座可以交替處於工作位；每個基座上分別設有導向面及卡槽，當所述旋轉軸周向轉動時，晶圓可以沿著處於工作位的基座的導向面滑行、直至落入卡槽內，至少兩個卡爪單元的卡槽配合將晶圓夾持，其中所述基座的數量為三個，其沿晶圓的周向間隔佈設。 A multi-station clamping device includes at least two claw units, wherein the claw unit includes at least two bases for supporting wafers, and can drive all There is a rotating shaft for rotating the base. The rotating shaft rotates circumferentially, and the base can be in the working position alternately. Each base is provided with a guide surface and a slot. When the rotating shaft rotates circumferentially, The wafer can slide along the guide surface of the base in the working position until it falls into the slot, and the slots of at least two claw units cooperate to clamp the wafer, wherein the number of the bases is three, They are arranged at intervals along the circumferential direction of the wafer. 一種多工位夾取裝置，包括至少兩個卡爪單元，其中所述卡爪單元包括用於承托晶圓的至少兩個基座，及可帶動所有基座轉動的旋轉軸，所述旋轉軸周向轉動，所述基座可以交替處於工作位；每個基座上分別設有導向面及卡槽，當所述旋轉軸周向轉動時，晶圓可以沿著處於工作位的基座的導向面滑行、直至落入卡槽內，至少兩個卡爪單元的卡槽配合將晶圓夾持，其中所述導向面為傾斜面，該傾斜面與第二傾斜面配合形成所述卡槽的相對兩個側壁，當旋轉軸帶動所述基座轉動靠近晶圓時，晶圓抵著傾斜面滑入卡槽內，並且所述基座的數量為兩個，其同軸設置，相鄰基座之間形成缺口部，該缺口部用於防止兩個基座上的液體接觸。 A multi-station clamping device includes at least two claw units, wherein the claw unit includes at least two bases for supporting wafers, and a rotation shaft that can drive all bases to rotate, and the rotation The shaft rotates circumferentially, and the bases can alternately be in the working position; each base is provided with a guide surface and a slot. When the rotating shaft rotates circumferentially, the wafer can move along the base in the working position. The guide surface slides until it falls into the slot, and the slots of at least two claw units cooperate to clamp the wafer. The guide surface is an inclined surface, and the inclined surface cooperates with the second inclined surface to form the clamping surface. On the two opposite side walls of the slot, when the rotation axis drives the base to rotate close to the wafer, the wafer slides into the slot against the inclined surface, and the number of the bases is two, which are coaxially arranged and adjacent to each other. A notch is formed between the bases, and the notch is used to prevent liquid contact on the two bases.
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