TWI813974B - Rigid heating film for electronic products and preparation method thereof - Google Patents
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Abstract
一種電子產品剛性發熱薄膜及其製備方法，在玻璃纖維、石英或耐火陶瓷等所構成的剛性耐高溫絕緣防水層上以噴塗，刷塗，滾塗，移印，轉印等的方法，設置一層耐高溫發熱材料，並添加奈米樹脂以及揮發性之溶劑，印刷後並進行高溫提純烘乾作業讓溶劑揮發，形成耐高溫發熱材料中與添加奈米無機樹脂進行物理性或混和化學性的架接或鍵結，成為高純度的發熱層附著在耐高溫絕緣防水層上，並在發熱層上黏貼或印刷一電極層及覆蓋一耐高溫絕緣防水層，製備成一輻射熱效益高的剛性發熱薄膜，或將電極層直接貼附在產品需加熱處。本發明以最大程度提高耐高溫發熱材料的功能，並降低使用耐高溫發熱材料成本及製程的侷限性，通過使用低廉的方式廣泛提高耐高溫發熱材料可使用的產品，進行最大程度行業批量生產。A rigid heating film for electronic products and a preparation method thereof. A layer is provided on a rigid high-temperature-resistant insulating waterproof layer composed of glass fiber, quartz or refractory ceramics by spraying, brushing, roller coating, pad printing, transfer printing, etc. High-temperature-resistant heating materials are added with nano-resin and volatile solvents. After printing, high-temperature purification and drying operations are performed to evaporate the solvents, forming a physical or mixed chemical framework between the high-temperature-resistant heating materials and the addition of nano-inorganic resins. Connect or bond to form a high-purity heating layer attached to the high-temperature-resistant insulating and waterproof layer, and paste or print an electrode layer on the heating layer and cover it with a high-temperature-resistant insulating and waterproof layer to prepare a rigid heating film with high radiant heat efficiency. Or attach the electrode layer directly to the area where the product needs to be heated. The present invention maximizes the function of high-temperature-resistant heating materials, reduces the cost of using high-temperature-resistant heating materials and the limitations of the manufacturing process, widely improves the products that can be used for high-temperature-resistant heating materials by using low-cost methods, and maximizes industrial mass production.
Description
本發明係有關一種電子產品剛性發熱薄膜及其製備方法，尤指一種製備成一輻射熱效益高的剛性發熱薄膜。The invention relates to a rigid heating film for electronic products and a preparation method thereof, in particular to a rigid heating film prepared with high radiant heat efficiency.
按，電熱爐、電咖啡壺、飲水機等3C電子產品，都會使用到電熱元件作為加熱源，而傳統3C電子產品的電熱元件係如圖1A及圖1B所示，一電熱爐60其基座61上設有一電熱板62，而該電熱板62是藉由該基座61內的電熱銅管63來提供熱源，如此一來，不僅耗電力且電熱管63設置須配合散熱風扇64及控制電路65等設備，因此較佔空間，導致該基座61的高度(厚度)無法降低等缺點。According to 3C electronic products such as electric stoves, electric coffee pots, and water dispensers, electric heating elements are used as heating sources. The electric heating elements of traditional 3C electronic products are as shown in Figures 1A and 1B. An
近年來，基於技術的演進，電子元件朝微小化的方向發展，其衍生的熱管理問題也受到一定的重視，許多高導熱材料如銀、銅、石墨片等被科學家廣泛研究。其中，石墨片的導熱性能受到極大的矚目，由於石墨片特殊的二維蜂巢狀晶格碳原子結構，使得其導熱係數優於金屬，因此廣泛地應用於電子元件上。In recent years, based on the evolution of technology, electronic components have developed in the direction of miniaturization, and the thermal management issues derived from them have also received certain attention. Many highly thermally conductive materials such as silver, copper, graphite sheets, etc. have been widely studied by scientists. Among them, the thermal conductivity of graphite sheets has received great attention. Due to the special two-dimensional honeycomb lattice carbon atom structure of graphite sheets, its thermal conductivity is better than that of metals, so it is widely used in electronic components.
傳統石墨片的生產製程中，首先，使用化學藥品提高石墨片純度與密度，接著再施以大於30Mpa的壓力去壓合石墨片，使石墨片彼此之間緊密的結合，最後再施以1800-3000度C的高溫，歷經數小時後，才能得到一石墨導熱基材，因此，不僅會消耗大量能源且製作時間冗長。故，如何研發一種製程簡單，不需使用高壓、高溫的製程步驟以製備石墨導熱材料，是此技術領域的相關技術人員所待突破的難題。In the traditional production process of graphite sheets, chemicals are first used to improve the purity and density of the graphite sheets, and then a pressure greater than 30Mpa is applied to press the graphite sheets so that the graphite sheets are tightly combined with each other, and finally 1800- It takes several hours at a high temperature of 3000 degrees C to obtain a graphite thermal conductive substrate. Therefore, it not only consumes a lot of energy but also takes a long time to produce. Therefore, how to develop a graphite thermal conductive material with a simple process that does not require the use of high-pressure and high-temperature process steps is a difficult problem that relevant technicians in this technical field need to overcome.
惟查，傳統的石墨烯薄膜轉移過程中，普遍存有下列三個問題：第一:在轉移之前，石墨烯薄膜長時間暴露在空氣中，導致接觸空氣的表面遭受空氣中懸浮顆粒的污染，而傳統的轉移方法是利用此一受污染的表面來製作器件。第二:傳統的轉移方法，將石墨烯薄膜轉移至硬襯底上，石墨烯和襯底之間的結合力只有凡德瓦力，導致石墨烯薄膜易脫落。第三:傳統的轉移方法，所需要的步驟複雜，在從金屬襯底上轉移至所需襯底上的過程中，使用的材料種類過多，易在轉移的過程中在石墨烯表面產生污染，且易導致石墨烯薄膜的晶體結構遭到破壞。以上三個缺陷限制了石墨烯薄膜的大規模生產和利用。Wei Cha found that there are three common problems in the traditional graphene film transfer process: First: before transfer, the graphene film is exposed to the air for a long time, causing the surface in contact with the air to be contaminated by suspended particles in the air. The traditional transfer method uses this contaminated surface to make devices. Second: The traditional transfer method transfers the graphene film to a hard substrate. The binding force between graphene and the substrate is only Van der Waals force, causing the graphene film to easily fall off. Third: The traditional transfer method requires complex steps. In the process of transferring from the metal substrate to the required substrate, too many types of materials are used, which can easily cause contamination on the graphene surface during the transfer process. And it can easily lead to the destruction of the crystal structure of the graphene film. The above three defects limit the large-scale production and utilization of graphene films.
是以，中國申請公布號為CN102807208A的專利，揭露一種石墨烯薄膜轉移方法，用以改善上述石墨烯薄膜轉移過程中所存在的問題點。其特徵在於：將石墨烯薄膜直接粘附於聚合物襯底上，使石墨烯薄膜和聚合物襯底形成共價結合，並將石墨烯薄膜接觸生長基底的一面暴露出來，作為製作功能器件的有效面。技術方案的實施步驟如下：步驟1)，將聚合物熔化或溶解使之處於流體狀態；步驟2)，將處於流體狀態的聚合物塗覆在生長有石墨烯的基底上，並將聚合物固化；步驟3)，使用氯化鐵或者硝酸鐵溶液將金屬薄片腐蝕掉，並將粘附有石墨烯薄膜的聚合物膜清洗，烘乾或者晾乾，得到轉移至聚合物材料上的石墨烯薄膜。Therefore, the Chinese patent application publication number CN102807208A discloses a graphene film transfer method to improve the above-mentioned problems existing in the graphene film transfer process. It is characterized in that: the graphene film is directly adhered to the polymer substrate, so that the graphene film and the polymer substrate form a covalent bond, and the side of the graphene film in contact with the growth substrate is exposed as a method for making functional devices. Effective side. The implementation steps of the technical solution are as follows: step 1), melt or dissolve the polymer to make it in a fluid state; step 2), coat the polymer in the fluid state on the substrate on which graphene is grown, and solidify the polymer ; Step 3), use ferric chloride or ferric nitrate solution to corrode the metal sheet, clean the polymer film with the graphene film attached, and dry or air-dry to obtain a graphene film transferred to the polymer material. .
次按，中國申請公布號為CN105898907A的專利，揭露一種石墨烯發熱膜及其製備方法，其特徵在於:包括第一絕緣防水層、電極層、發熱膜層和第二絕緣防水層，第一絕緣防水層、電極層、發熱膜層和第二絕緣防水層粘貼為一體結構，所述發熱膜層為石墨烯膜。技術方案的實施步驟如下：1)、石墨烯膜的製作；2)、在第二絕緣防水層上覆蓋粘合用膠；3)、將第二絕緣防水層與石墨烯膜粘合為一體；4)、去除石墨烯膜上的金屬基體；5)、在石墨烯膜上粘貼電極層；6)、在電極層上粘貼第一絕緣防水層；7)、將電極層與導線連接。Secondly, the Chinese patent application with publication number CN105898907A discloses a graphene heating film and a preparation method thereof, which is characterized by: including a first insulating waterproof layer, an electrode layer, a heating film layer and a second insulating waterproof layer. The first insulating waterproof layer The waterproof layer, electrode layer, heating film layer and second insulating waterproof layer are pasted into an integrated structure, and the heating film layer is a graphene film. The implementation steps of the technical solution are as follows: 1), making the graphene film; 2), covering the second insulating waterproof layer with adhesive glue; 3), bonding the second insulating waterproof layer and the graphene film into one body; 4) Remove the metal matrix on the graphene film; 5) Paste the electrode layer on the graphene film; 6) Paste the first insulating waterproof layer on the electrode layer; 7) Connect the electrode layer to the wire.
惟查，傳統的石墨烯製備方法所製得的石墨烯表面缺陷較多，石墨烯片層容易發生折疊，捲曲，從而影響石墨烯的性能，並且還原之後得到的石墨烯表面幾乎沒有氧化基團，因而其表面呈疏水性，使其在水及一些常見有機溶劑中極易團聚從而發生沉降。目前製備石墨烯發熱膜的方法有很多，但是要想製備電學性能優異、無污染的石墨烯膜還很困難，主要的困難點在於石墨烯薄膜如何更好地轉移到目標基底上，製備出完整、無破損、工藝穩定、可靠的石墨烯發熱(導熱)膜。However, the surface of graphene produced by traditional graphene preparation methods has many defects. The graphene sheets are prone to folding and curling, which affects the performance of graphene. Moreover, the surface of graphene obtained after reduction has almost no oxidized groups. , so its surface is hydrophobic, making it easy to aggregate and settle in water and some common organic solvents. There are currently many methods for preparing graphene heating films, but it is still difficult to prepare graphene films with excellent electrical properties and no pollution. The main difficulty lies in how to better transfer the graphene film to the target substrate and prepare a complete , no damage, stable process and reliable graphene heating (thermal conduction) film.
再者，石墨烯業界在散熱噴塗的難題還包含:第高純度石墨烯噴塗後不能緊密排列的問題；以及一般樹脂塗料以攪拌混合方式，將石墨烯包裹，而影響輻射發射的問題。Furthermore, the problems faced by the graphene industry in thermal spraying also include: the problem that high-purity graphene cannot be arranged closely after spraying; and the problem that general resin coatings use a stirring and mixing method to wrap graphene, which affects radiation emission.
此外，石墨烯發熱(導熱)膜其厚度不易降低，且大都不具有撓性，如此一來，後續要運用在3C產品上，就產生了諸多問題而難以實施，因此十分困擾業界。In addition, the thickness of graphene heating (thermal conductive) films is difficult to reduce, and most of them are not flexible. As a result, subsequent use in 3C products will cause many problems and make it difficult to implement, which is very troublesome to the industry.
是以，如何解決傳統石墨烯發熱(導熱)膜之上述問題點，為本發明之主要課題。Therefore, how to solve the above-mentioned problems of traditional graphene heating (heat-conducting) films is the main subject of the present invention.
本發明主要目的，欲提供一種電子產品剛性發熱薄膜及其製備方法，其最大程度提高發熱材料顆粒(例如石墨烯)的功能，達到高發熱性之功效。The main purpose of the present invention is to provide a rigid heating film for electronic products and a preparation method thereof, which can maximize the function of heating material particles (such as graphene) and achieve high heating properties.
本發明再一目的，是提供一種電子產品剛性發熱薄膜及其製備方法，其具有降低使用發熱材料顆粒侷限性，通過使用塗佈方式廣泛提高發熱材料顆粒可使用的產品，進行最大程度行業批量生產。Another object of the present invention is to provide a rigid heating film for electronic products and a preparation method thereof, which can reduce the limitations of using heating material particles, widely increase the products that can be used for heating material particles through the use of coating methods, and maximize industry mass production. .
為達上述功效，本發明係所採用的方法，包括下列步驟： a).提供一第一耐高溫絕緣防水層，其選自包括:一玻璃纖維、石英或耐火陶瓷其中任一或其組合式所構成的剛性體，其厚度在0.015～0.2mm之間； b).在該第一耐高溫絕緣防水層上，設置一層耐高溫發熱材料漿液，該耐高溫發熱材料漿液的厚度在0.015～0.2mm之間，該耐高溫發熱材料漿液包含選自:以碳球、碳纖維、石墨或及其微粒、石墨烯、奈米碳管、氮化硼、人造鑽石、氧化鋁、氧化鋯、稀土、導熱金屬粒子，其中任一或其組合式所構成發熱材料顆粒，其重量比為25～85%，並混合有重量比10～50%的奈米樹脂，及重量比5～25%的溶劑介質所組成； c).進行提純作業︰以120°C～150°C的熱溫對該耐高溫發熱材料漿液進行烘乾30到50分鐘，以高溫將介質及溶劑揮發來提高純度，且該耐高溫發熱材料漿液與該第一耐高溫絕緣防水層，通過奈米樹脂進行物理性或混和化學性的鍵結或架接，最大程度使發熱材料顆粒裸露在該第一耐高溫絕緣防水層上，並呈緊密排列堆疊而未被包裹，又該奈米樹脂通過縮水聚合反應產生矽酸離子，使發熱材料顆粒穩定結合在該第一耐高溫絕緣防水層上，形成高純度的一耐高溫發熱層； d).在該發熱層上設置一電極層，該電極層的厚度在0.015～0.2mm之間； e).在該電極層上覆蓋一第二耐高溫絕緣防水層，該第二耐高溫絕緣防水層的厚度在0.015～0.2mm之間的剛性體；以及 f).提供一導線與該電極層電性連接，製備成一厚度在0.6mm以內的剛性發熱薄膜，並且其工作溫度可至攝氏600度的加熱範圍。 In order to achieve the above effects, the method adopted by the present invention includes the following steps: a). Provide a first high-temperature resistant insulating and waterproof layer, which is selected from: a rigid body composed of any one of glass fiber, quartz or refractory ceramics or a combination thereof, with a thickness between 0.015 and 0.2mm; b). On the first high-temperature-resistant insulating and waterproof layer, a layer of high-temperature-resistant heating material slurry is provided. The thickness of the high-temperature-resistant heating material slurry is between 0.015 and 0.2mm. The high-temperature resistant heating material slurry contains carbon. Heating material particles composed of balls, carbon fiber, graphite or its particles, graphene, carbon nanotubes, boron nitride, artificial diamond, alumina, zirconium oxide, rare earth, thermally conductive metal particles, any one of them or a combination thereof, Its weight ratio is 25 to 85%, and it is composed of nano resin with a weight ratio of 10 to 50% and a solvent medium with a weight ratio of 5 to 25%; c). Carry out purification operation: dry the slurry of the high-temperature-resistant heating material at a temperature of 120°C to 150°C for 30 to 50 minutes, evaporate the medium and solvent at high temperature to improve the purity, and the high-temperature-resistant heating material The slurry and the first high-temperature-resistant insulating and waterproof layer are physically or chemically bonded or connected through nano-resin, so that the heating material particles are exposed to the first high-temperature-resistant insulating and waterproof layer to the greatest extent, and are tightly Arranged and stacked without being wrapped, the nano-resin generates silicic acid ions through a shrinkage polymerization reaction, so that the heating material particles are stably bonded to the first high-temperature-resistant insulating and waterproof layer, forming a high-purity high-temperature-resistant heating layer; d). Set an electrode layer on the heating layer, the thickness of the electrode layer is between 0.015 and 0.2mm; e). Cover the electrode layer with a second high-temperature resistant insulating and waterproof layer. The thickness of the second high-temperature resistant insulating and waterproof layer is a rigid body between 0.015 and 0.2 mm; and f). Provide a wire to be electrically connected to the electrode layer, and prepare a rigid heating film with a thickness within 0.6 mm, and its operating temperature can reach a heating range of 600 degrees Celsius.
依據前揭特徵，該第二耐高溫絕緣防水層包括為一電子產品需加熱處所構成，且該電子產品需加熱處需為一絕緣體，並將該電極層直接貼附在產品需加熱處。According to the aforementioned characteristics, the second high-temperature resistant insulating and waterproof layer includes a place where an electronic product needs to be heated, and the place where the electronic product needs to be heated needs to be an insulator, and the electrode layer is directly attached to the place where the product needs to be heated.
依據前揭特徵，該奈米樹脂包括為水性或油性。其中，該水性奈米樹脂選自包括:水性奈米環氧改性丙烯酸或水性奈米有機硅(矽)改性聚氨酯。其中，該油性奈米樹脂選自包括:溶劑型奈米環氧改性丙烯酸或溶劑型奈米有機硅(矽)改性聚氨酯。According to the aforementioned characteristics, the nano-resin may be water-based or oil-based. Wherein, the water-based nano resin is selected from: water-based nano epoxy modified acrylic or water-based nano silicone (silicon) modified polyurethane. Wherein, the oily nano resin is selected from the group consisting of: solvent-based nano epoxy modified acrylic or solvent-based nano silicone (silicon) modified polyurethane.
依據前揭特徵，該耐高溫導熱層可包括為整面佈滿型態或是呈配合該電極層形狀的線條型態。According to the aforementioned characteristics, the high-temperature-resistant thermal conductive layer may be in a full surface type or in a line type that matches the shape of the electrode layer.
依據前揭特徵，該電極層可包括由導電金屬材料所構成。According to the aforementioned characteristics, the electrode layer may be composed of conductive metal material.
依據前揭特徵，本發明所製成的電子產品撓性導熱薄膜，包含:一第一耐高溫絕緣防水層，該第一耐高溫絕緣防水層的厚度在0.015～0.2mm之間的剛性體；一耐高溫發熱層，塗佈在該第一耐高溫絕緣防水層上，該耐高溫發熱層的厚度在0.015～0.2mm之間，其具有發熱材料顆粒，並使該發熱材料顆粒裸露在該第一耐高溫絕緣防水層上，呈現緊密排列堆疊而未被包裹，使該發熱材料顆粒穩定結合在該第一耐高溫絕緣防水層上；一電極層，設置在該耐高溫發熱層上，該電極層的厚度在0.015～0.2mm之間；一第二耐高溫絕緣防水層，覆蓋在該電極層上，該第二耐高溫絕緣防水層的厚度在0.015～0.2mm之間的剛性體；以及一導線，與該電極層電性連接，據以構成一厚度在0.6mm以內的剛性發熱薄膜，並且其工作溫度可至攝氏600度的加熱範圍。According to the aforementioned characteristics, the flexible thermally conductive film for electronic products produced by the present invention includes: a first high-temperature-resistant insulating and waterproof layer, a rigid body with a thickness of 0.015 to 0.2 mm; A high-temperature-resistant heating layer is coated on the first high-temperature-resistant insulating and waterproof layer. The thickness of the high-temperature resistant heating layer is between 0.015 and 0.2 mm. It has particles of heating material and exposes the particles of heating material on the first layer. A high-temperature-resistant insulating and waterproof layer is tightly arranged and stacked without being wrapped, so that the heating material particles are stably combined on the first high-temperature-resistant insulating and waterproof layer; an electrode layer is provided on the high-temperature resistant heating layer, and the electrode The thickness of the layer is between 0.015~0.2mm; a second high temperature resistant insulating and waterproof layer covering the electrode layer, the thickness of the second high temperature resistant insulating and waterproof layer is between 0.015~0.2mm; and a rigid body; The wires are electrically connected to the electrode layer to form a rigid heating film with a thickness within 0.6 mm, and its operating temperature can reach a heating range of 600 degrees Celsius.
藉助上揭技術特徵，本發明所製備出的剛性發熱薄膜，發熱材料顆粒與奈米樹脂通過物理性或混和化學性的鍵結或架接，結構穩定。高純度發熱材料顆粒，噴塗後溶劑揮發，發熱材料顆粒裸露於素材表面，分子進行有效輻射發射，輻射傳遞，達到均熱，進行熱交換，迅速達到發熱效果，其工作溫度(加熱範圍)可達攝氏600度。進而本發明以「提純」技術手段解決業界導熱噴塗的難題包含:解決高純度發熱材料顆粒噴塗後不能緊密排列的問題；以及解決一般樹脂塗料以攪拌混合方式，將發熱材料顆粒包裹，而影響輻射發射的問題。With the help of the above-mentioned technical features, the rigid heating film prepared by the present invention has a stable structure in which the heating material particles and the nano-resin are bonded or connected through physical or mixed chemical bonding. High-purity heating material particles, the solvent evaporates after spraying, and the heating material particles are exposed on the surface of the material. The molecules effectively emit radiation, transfer radiation, achieve uniform heat, conduct heat exchange, and quickly achieve the heating effect. Its working temperature (heating range) can reach 600 degrees Celsius. Furthermore, the present invention uses "purification" technical means to solve the problems of thermal spraying in the industry, including: solving the problem that high-purity heating material particles cannot be closely arranged after spraying; and solving the problem that general resin coatings use a stirring and mixing method to wrap the heating material particles, which affects radiation. Launch issues.
以下係藉由特定的具體實施例說明本發明之實施方式，熟習此技藝之人士可由本說明書所揭示之內容輕易地了解本發明之其他優點與功效。本發明亦可藉由其他不同的具體實施例加以施行或應用，本說明書中的各項細節亦可基於不同觀點與應用，在不悖離本發明之精神下進行各種修飾與變更。 首先，請參閱圖1～圖13所示，本發明一種電子產品剛性發熱薄膜的製備方法，包含下列步驟： The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments. Various details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. First, please refer to Figures 1 to 13. A method for preparing a rigid heating film for electronic products according to the present invention includes the following steps:
a).提供一第一耐高溫絕緣防水層10，該第一耐高溫絕緣防水層10，選自包括:一玻璃纖維、石英或耐火陶瓷其中任一或其組合式所構成的剛性體，但不限定於此；其厚度在0.015～0.2mm之間的剛性體。本實施例中，該玻璃纖維Fibreglass）是一種性能優異的無機非金屬材料，優點是絕緣性好、耐熱性強、抗腐蝕性好，機械強度高。它的軟化點為500~750℃，沸點1000℃，密度 2.4~2.76g/cm3，抗拉強度在標準狀態下是6.3～6.9 g/d，濕潤狀態5.4～5.8 g/d，密度2.54g/cm3，耐熱性好，溫度達300℃時對強度沒影響，有優良的電絕緣性，是高級的電絕緣材料，也用於絕熱材料。因此以玻璃纖維該第一耐高溫絕緣防水層10，為極佳的選擇。a). Provide a first high-temperature resistant insulating and
b).如圖3A～圖3C所示，在該第一耐高溫絕緣防水層10上，設置一層耐高溫發熱材料漿液20a，本發明以下所述的「設置」方法包括:以噴塗，刷塗，滾塗，移印，轉印等的方法，容不贅述，且不限定於此。b). As shown in Figures 3A to 3C, a layer of high temperature resistant
該耐高溫發熱材料漿液20a的厚度在0.015～0.2mm之間，該耐高溫發熱材料漿液20a包含選自:以碳球、碳纖維、石墨或及其微粒、石墨烯、奈米碳管、氮化硼、人造鑽石、氧化鋁、氧化鋯、稀土、導熱金屬粒子，其中任一或其組合式所構成發熱材料顆粒22，其重量比為25～85%，並混合有重量比10～50%的奈米樹脂，及重量比5～25%的溶劑介質所組成；本實施例中，該奈米樹脂21可為水性或油性；其中水性奈米樹脂21選自包括:水性奈米環氧改性丙烯酸或水性奈米有機硅(矽)改性聚氨酯...等。油性奈米樹脂選自包括:溶劑型奈米環氧改性丙烯酸或溶劑型奈米有機硅(矽)改性聚氨酯。該溶劑選自包括:酯類，酮類，醇類，成份依設製的方法進行調整。The thickness of the high-temperature-resistant
c).進行提純作業︰以120°C～150°C的熱溫對該耐高溫發熱材料漿液20a進行烘乾30到50分鐘，以高溫將溶劑等介質揮發來提高純度，且該耐高溫發熱材料漿液20a與該第一耐高溫絕緣防水層10，通過奈米樹脂21進行物理性或混和化學性的鍵結或架接，最大程度使發熱材料顆粒22裸露在該第一耐高溫絕緣防水層10上，並呈緊密排列堆疊而未被包裹，又該奈米樹脂21通過縮水聚合反應產生矽酸離子(如下方化學反應式所示):
c). Carry out purification operation: dry the high-temperature-resistant heat-generating
據此使熱材料顆粒22穩定結合在該第一耐高溫絕緣防水層10上，如圖3B所示，形成高純度的一耐高溫發熱層20；本實施例中，該耐高溫發熱層20就是由該耐高溫發熱材料漿液20a進行烘乾提純後所構成。Accordingly, the
上揭「提純」作業為本發明最重要的技術特徵，所謂「提純」(Purify)，是指將混合物中的雜質分離出來以此提高其純度。圖9是本發明耐高溫發熱層提純作業的溫度與時間的示意圖；因發熱材料顆粒22本來純度是百分之百，但是由於要附著在該第一耐高溫絕緣防水層10上，所以必須加入奈米樹脂21、溶劑、助劑…等介質才能以噴塗或印刷方式附著，附著後以120°C～150°C的高溫對該耐高溫發熱材料漿液20a進行烘乾30到50分鐘，如此本發明提純作業才能將介質及溶劑揮發，使發熱材料顆粒22的純度達到95%以上。如果溫度與時間沒有掌控適當，提純作業的效果會受到影響，無法使該發熱材料顆粒22與奈米樹脂21通過化學反應進行架接，達到結構穩定的效果。The "purification" operation mentioned above is the most important technical feature of the present invention. The so-called "purification" (Purify) refers to separating the impurities in the mixture to improve its purity. Figure 9 is a schematic diagram of the temperature and time of the high-temperature resistant heating layer purification operation of the present invention; because the
再者，如圖8所示，高純度石墨烯22噴塗後溶劑等介質揮發，石墨烯22裸露並藉由該奈米樹脂21附著在該第一耐高溫絕緣防水層10(素材)表面，該發熱材料顆粒22分子進行有效輻射發射，輻射傳遞，達到均熱，進行熱交換，迅速達到發熱效果。是以，本發明最重要的「提純」技術手段可以解決業界散熱噴塗的難題包含:第一、解決高純度發熱材料顆粒22噴塗後不能緊密排列的問題。第二、解決一般樹脂塗料以攪拌混合方式，將發熱材料顆粒22包裹，而影響輻射發射的問題。Furthermore, as shown in Figure 8, after the high-
d).在該耐高溫發熱層20上黏貼或印刷一電極層30，該電極層的厚度在0.015～0.2mm之間；本實施例中，該電極層30由導電金屬材料所構成，其可包括粘貼銅箔或印刷銀漿等手段達成，但不限定於此。d). Paste or print an
在第一實施例中，如圖3A～圖3C所示，該耐高溫發熱層20為整面佈滿型態，但不限定於此。又如在第二實施例中，如圖4A～圖4C所示，該耐高溫發熱層20是可呈配合該電極層30形狀的線條型態。此乃該耐高溫發熱層20具有極佳導熱性，能輻射熱能，因此線條型態也能進行有效輻射發射。In the first embodiment, as shown in FIGS. 3A to 3C , the high-temperature-resistant heat-generating
e).在該電極層30上覆蓋一第二耐高溫絕緣防水層40，該第二耐高溫絕緣防水層40選自包括:一玻璃纖維、石英或陶瓷其中任一或其組合式所構成的剛性體，其厚度在0.015～0.2mm之間的剛性體；本實施例中，但不限定於此。亦即該第二耐高溫絕緣防水層40，如圖5A、圖5B所示，包括為一產品需加熱處40A所構成，且該電子產品需加熱處40A需為一絕緣體，例如:陶瓷、玻璃纖維或石英，並將該電極層30直接貼附在產品需加熱處40A。e). Cover the
f).提供一導線31與該電極層30電性連接，該導線31將陽極及陰極接入，導電後短路而發熱，製備成一厚度在0.6mm以內的剛性導熱薄膜50，並且其工作溫度可至攝氏600度的加熱範圍。f). Provide a
如圖6所示，依據本發明前揭特徵所製成的電子產品剛性發熱薄膜50，包含有:一第一耐高溫絕緣防水層10，該第一耐高溫絕緣防水層10的厚度在0.015～0.2mm之間的剛性體；一耐高溫發熱層20，塗佈在該第一耐高溫絕緣防水層10上，該耐高溫發熱層20的厚度在0.015～0.2mm之間，並使發熱材料顆粒22裸露在該第一耐高溫絕緣防水層10上，呈現緊密排列堆疊而未被包裹，使發熱材料顆粒22穩定結合在該第一耐高溫絕緣防水層10上；一電極層30，黏貼或印刷在該耐高溫發熱層20上，該電極層的厚度在0.015～0.2mm之間；一第二耐高溫絕緣防水層40，覆蓋在該電極層30上，該第二耐高溫絕緣防水層40的厚度在0.015～0.2mm之間的剛性體；以及一導線31，與該電極層30電性連接，據以構成一厚度在0.6mm以內的剛性發熱薄膜50，其工作溫度(加熱範圍)可達攝氏600度，因此為極佳的發熱材。As shown in Figure 6, the
基於上述製備方法，本發明所製備出的剛性發熱薄膜50具有如下的功效需在闡明者:
一、本發明的剛性發熱薄膜50，通過發熱材料顆粒22與奈米樹脂21進行物理性或混和化學性的鍵結或架接，因此結構穩定；高純度石墨烯，噴塗後溶劑揮發，發熱材料顆粒22裸露於素材表面，分子進行有效輻射發射，輻射傳遞，達到均熱，進行熱交換，達到極佳的發熱效果，其工作溫度(加熱範圍)可達攝氏600度。是以，本發明以「提純」技術手段解決業界導熱噴塗的難題包含:解決傳統高純度發熱材料顆粒22塗後不能緊密排列的問題；以及解決一般樹脂塗料以攪拌混合方式，將發熱材料顆粒22包裹，而影響輻射發射的問題。
二、本發明的剛性導熱薄膜50，其厚度可在0.6mm以內，厚度薄且具剛性。因此，本發明的剛性導熱薄膜50的產品適用性就可以很廣泛的擴展。例如:如圖11所揭示，該剛性發熱薄膜50使用在電熱爐51的狀態參考圖；或是如圖12所揭示，該剛性發熱薄膜50使用在保溫墊52的狀態參考圖；亦或如圖13所揭示，該剛性發熱薄膜50使用在地暖53的狀態參考圖。是以，本發明的剛性發熱薄膜50，可以取代傳統的銅管或烯土加熱的方式，使用上更便捷且成本更低的功效增進。
Based on the above preparation method, the
綜上所述，本發明所揭示之技術手段，確具「新穎性」、「進步性」及「可供產業利用」等發明專利要件，祈請 鈞局惠賜專利，以勵發明，無任德感。In summary, the technical means disclosed in the present invention indeed meet the requirements for invention patents such as "novelty", "progressivity" and "available for industrial utilization". We pray that the Jun Bureau will grant patents to encourage inventions without any restrictions. Sense of morality.
惟，上述所揭露之圖式、說明，僅為本發明之較佳實施例，大凡熟悉此項技藝人士，依本案精神範疇所作之修飾或等效變化，仍應包括在本案申請專利範圍內。However, the above disclosed drawings and descriptions are only preferred embodiments of the present invention. Modifications or equivalent changes made by those familiar with the art in accordance with the spirit and scope of this case should still be included in the patent application scope of this case.
10:第一耐高溫絕緣防水層
20:耐高溫發熱層
20a:耐高溫發熱材料漿液
21:奈米樹脂
22:發熱材料顆粒
30:電極層
31:導線
40:第二耐高溫絕緣防水層
40A:產品需加熱處
50:剛性發熱薄膜
51:電熱爐
52:保溫墊
53:地暖
10: The first high temperature resistant insulation and waterproof layer
20: High temperature
圖1A是習用電熱爐的外觀示意圖。 圖1B是習用電熱爐的內部示意圖。 圖2是本發明製備方法之流程圖。 圖3A是本發明第一可行實施例的分解立體圖(一)。 圖3B是本發明第一可行實施例的分解立體圖(二)。 圖3C是本發明第一可行實施例的組合立體圖。 圖4A是本發明第二可行實施例的分解立體圖(一)。 圖4B是本發明第二可行實施例的分解立體圖(二)。 圖4C是本發明第二可行實施例的組合立體圖。 圖5A是本發明剛性發熱薄膜的使用狀態參考圖(一)。 圖5B是本發明剛性發熱薄膜的使用狀態參考圖(二)。 圖6是本發明剛性發熱薄膜的結構剖視圖。 圖7A是圖6中7A-7A斷面剖視圖。 圖7B是圖7A中之部分結構放大示意圖。 圖8是本發明耐高溫發熱層的斷面剖視圖。 圖9是本發明耐高溫發熱層提純作業的溫度與時間的示意圖。 圖10是本發明耐高溫發熱層的電子顯微鏡圖。 圖11是本發明剛性發熱薄膜使用在電熱爐的狀態參考圖。 圖12是本發明剛性發熱薄膜使用在保溫墊的狀態參考圖。 圖13是本發明剛性發熱薄膜使用在地暖的狀態參考圖。 Figure 1A is a schematic diagram of the appearance of a conventional electric furnace. Figure 1B is an internal schematic diagram of a conventional electric furnace. Figure 2 is a flow chart of the preparation method of the present invention. FIG. 3A is an exploded perspective view (1) of the first feasible embodiment of the present invention. Figure 3B is an exploded perspective view (2) of the first feasible embodiment of the present invention. Figure 3C is a combined perspective view of the first feasible embodiment of the present invention. Figure 4A is an exploded perspective view (1) of the second feasible embodiment of the present invention. Figure 4B is an exploded perspective view (2) of the second feasible embodiment of the present invention. Figure 4C is a combined perspective view of the second feasible embodiment of the present invention. Figure 5A is a reference diagram (1) of the use state of the rigid heating film of the present invention. Figure 5B is a reference diagram (2) of the use state of the rigid heating film of the present invention. Figure 6 is a structural cross-sectional view of the rigid heating film of the present invention. FIG. 7A is a cross-sectional view along 7A-7A in FIG. 6 . FIG. 7B is an enlarged schematic diagram of part of the structure in FIG. 7A. Figure 8 is a cross-sectional view of the high-temperature resistant heating layer of the present invention. Figure 9 is a schematic diagram of the temperature and time of the purification operation of the high-temperature resistant heating layer of the present invention. Figure 10 is an electron microscope picture of the high temperature resistant heating layer of the present invention. Figure 11 is a reference diagram of the rigid heating film of the present invention being used in an electric furnace. Figure 12 is a reference diagram of the rigid heating film of the present invention being used in a thermal insulation pad. Figure 13 is a reference diagram of the rigid heating film of the present invention being used in floor heating.
Claims (10)
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| TW110112388A TWI813974B (en) | 2021-04-06 | 2021-04-06 | Rigid heating film for electronic products and preparation method thereof |
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| TW110112388A TWI813974B (en) | 2021-04-06 | 2021-04-06 | Rigid heating film for electronic products and preparation method thereof |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107454691A (en) * | 2017-08-08 | 2017-12-08 | 湖南源创高科工业技术有限公司 | A kind of heater |
| WO2019056074A1 (en) * | 2017-09-22 | 2019-03-28 | Intelli Particle Pty Ltd | Electrothermic compositions and composites |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107454691A (en) * | 2017-08-08 | 2017-12-08 | 湖南源创高科工业技术有限公司 | A kind of heater |
| WO2019056074A1 (en) * | 2017-09-22 | 2019-03-28 | Intelli Particle Pty Ltd | Electrothermic compositions and composites |
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