TWI808796B - Cooling system and server - Google Patents

Cooling system and server Download PDF

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TWI808796B
TWI808796B TW111122424A TW111122424A TWI808796B TW I808796 B TWI808796 B TW I808796B TW 111122424 A TW111122424 A TW 111122424A TW 111122424 A TW111122424 A TW 111122424A TW I808796 B TWI808796 B TW I808796B
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evaporator
cooling system
liquid
condenser
liquid pipe
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TW111122424A
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TW202402148A (en
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童凱煬
陳虹汝
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英業達股份有限公司
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Abstract

A cooling system includes a condenser, a first evaporator, a second evaporator, a first liquid tube, a second liquid tube, a first vapor tube, and a second vapor tube. The first liquid tube is connected to the condenser and the first evaporator. The second liquid tube is connected to the condenser and the second evaporator. The first vapor tube is connected to the condenser and the first evaporator. The second vapor tube is connected to the first evaporator and the second evaporator. A server includes a first processor, a second processor, and the above cooling system. The first evaporator is thermally coupled to the first processor. The second evaporator is thermally coupled to the second processor.

Description

冷卻系統及伺服器 Cooling System and Servers

本發明關於一種冷卻系統，尤指一種利用熱虹吸之冷卻系統及用於伺服器之冷卻系統。 The present invention relates to a cooling system, in particular to a cooling system using thermosiphon and a cooling system for a server.

一般一個熱虹吸裝置對一個發熱件提供散熱。對於多個發熱件(例如CPU)有散熱需求的情形，若使用多個獨立的熱虹吸裝置，熱虹吸裝置傳輸管(包含液體管及蒸氣管)的配置將會複雜，且容易相互干涉，增加傳輸管配置的困難。尤其是當多個發熱件相近設置時，前述問題更形嚴重。目前也有採用多個蒸發器串聯之方案，即單一組管路串接多個蒸發器，並連接至單一冷凝器。傳輸管會設計放大管徑，以提昇熱傳量，進而能滿足各個發熱元件的散熱需求。對於液體管而言，工作流體由於主要靠重力將冷凝後的液體自冷凝器輸送至各蒸發器，冷凝器與蒸發器間的高度差將影響其液體回收效果。此外，各蒸發器間一般不具有高度差，各蒸發器共用同一液體管，此將使得離冷凝器越遠的蒸發器，獲得越少的工作流體。離冷凝器較遠的蒸發器則有機會發生因進入的工作流體量不足而發生蒸乾的現象，進而失去對發熱件冷卻的作用，使得發熱件過熱。離冷凝器較近的蒸發器則可能因進入的工作流體量過高而改變其操作點，同樣會影響對發熱件的冷卻效果。 Generally, a thermosiphon device provides heat dissipation to a heating element. For the situation where multiple heat-generating components (such as CPU) have heat dissipation requirements, if multiple independent thermosiphon devices are used, the configuration of the transfer pipes (including liquid pipes and vapor pipes) of the thermosiphon devices will be complicated and easily interfere with each other, increasing the difficulty of the transfer pipe arrangement. Especially when a plurality of heat generating elements are arranged close to each other, the aforementioned problems are more serious. At present, there is also a scheme of using multiple evaporators in series, that is, a single set of pipelines connects multiple evaporators in series and connects them to a single condenser. The transmission tube will be designed to enlarge the tube diameter to increase the heat transfer, thereby meeting the heat dissipation requirements of each heating element. For the liquid pipe, since the working fluid mainly relies on gravity to transport the condensed liquid from the condenser to each evaporator, the height difference between the condenser and the evaporator will affect its liquid recovery effect. In addition, there is generally no height difference between the evaporators, and the evaporators share the same liquid pipe, which will make the evaporator farther away from the condenser obtain less working fluid. The evaporator farther away from the condenser may evaporate to dryness due to insufficient working fluid, and then lose its cooling effect on the heating element, causing the heating element to overheat. The evaporator closer to the condenser may change its operating point due to the high amount of working fluid entering, which will also affect the cooling effect on the heating element.

鑑於先前技術中的問題，本發明之一目的在於提供一種冷卻系統，其使用同一個冷凝器以與兩個蒸發器進行熱交換，並縮減工作流體傳輸管的佈局。 In view of the problems in the prior art, an object of the present invention is to provide a cooling system that uses the same condenser for heat exchange with two evaporators and reduces the layout of the working fluid transmission pipes.

根據本發明之一冷卻系統包含一冷凝器、一第一蒸發器、一第二蒸發器、一第一液體管、一第二液體管、一第一蒸氣管及一第二蒸氣管。該第一液體管連接至該冷凝器及該第一蒸發器。該第二液體管連接至該冷凝器及該第二蒸發器。該第一蒸氣管連接至該冷凝器及該第一蒸發器。該第二蒸氣管連接至該第一蒸發器及該第二蒸發器。藉此，並聯配置的液體管使得各蒸發器能經由獨立的液體管自冷凝器取得足夠的工作流體量，串聯配置的蒸氣管可縮減蒸氣管路的佈局。相較於習知冷凝器、蒸發器一對一的配置，根據本發明之冷卻系統使用較小的管路佈局。 A cooling system according to the present invention includes a condenser, a first evaporator, a second evaporator, a first liquid pipe, a second liquid pipe, a first vapor pipe and a second vapor pipe. The first liquid pipe is connected to the condenser and the first evaporator. The second liquid pipe is connected to the condenser and the second evaporator. The first steam pipe is connected to the condenser and the first evaporator. The second steam pipe is connected to the first evaporator and the second evaporator. Accordingly, the liquid pipes arranged in parallel enable each evaporator to obtain a sufficient amount of working fluid from the condenser through an independent liquid pipe, and the vapor pipes arranged in series can reduce the layout of the vapor pipeline. Compared with the conventional one-to-one arrangement of condensers and evaporators, the cooling system according to the present invention uses a smaller pipeline layout.

本發明之另一目的在於提供一種伺服器，其冷卻系統使用同一個冷凝器以與兩個蒸發器進行熱交換，並縮減工作流體傳輸管的佈局。 Another object of the present invention is to provide a server whose cooling system uses the same condenser for heat exchange with two evaporators, and reduces the layout of working fluid transmission pipes.

根據本發明之一伺服器包含一第一處理器、一第二處理器及一冷卻系統。該冷卻系統包含一冷凝器、一第一蒸發器、一第二蒸發器、一第一液體管、一第二液體管、一第一蒸氣管及一第二蒸氣管。該第一液體管連接至該冷凝器及該第一蒸發器。該第二液體管連接至該冷凝器及該第二蒸發器。該第一蒸氣管連接至該冷凝器及該第一蒸發器。該第二蒸氣管連接至該第一蒸發器及該第二蒸發器。因此，該伺服器的冷卻系統採用並聯配置的液體管及串聯配置的蒸氣管，故各蒸發器能經由獨立的液體管自冷凝器取得足夠的工作流體量，該冷卻系統管路整體佈局也獲得抑制。相較於習知冷凝器、蒸發器一對一的配置，根據本發明之伺服器的冷卻系統使用較小的管路佈局。 A server according to the present invention includes a first processor, a second processor and a cooling system. The cooling system includes a condenser, a first evaporator, a second evaporator, a first liquid pipe, a second liquid pipe, a first vapor pipe and a second vapor pipe. The first liquid pipe is connected to the condenser and the first evaporator. The second liquid pipe is connected to the condenser and the second evaporator. The first steam pipe is connected to the condenser and the first evaporator. The second steam pipe is connected to the first evaporator and the second evaporator. Therefore, the cooling system of the server adopts liquid pipes arranged in parallel and steam pipes arranged in series, so that each evaporator can obtain sufficient working fluid from the condenser through independent liquid pipes, and the overall layout of the cooling system piping is also suppressed. Compared with the conventional one-to-one configuration of the condenser and the evaporator, the cooling system of the server according to the present invention uses a smaller pipeline layout.

關於本發明之優點與精神可以藉由以下的發明詳述及所附圖式得到進一步的瞭解。 The advantages and spirit of the present invention can be further understood through the following detailed description of the invention and the accompanying drawings.

1,3:冷卻系統 1,3: cooling system

12:冷凝器 12: Condenser

14:第一蒸發器 14: The first evaporator

16:第二蒸發器 16: Second evaporator

18:第一液體管 18: First Liquid Tube

18a:入口 18a: Entrance

18b:出口 18b: Export

20:第二液體管 20: Second liquid pipe

20a:入口 20a: entrance

20b:出口 20b: Export

22:第一蒸氣管 22: The first steam pipe

24:第二蒸氣管 24: Second steam pipe

32:液冷板 32: Liquid cold plate

32a:第一外表面 32a: first outer surface

32b:第二外表面 32b: second outer surface

322:散熱鰭片 322: cooling fins

324:入口 324: entrance

326:出口 326: export

4:伺服器 4: Server

40:裝置殼體 40: device housing

42:主機板 42: Motherboard

44:第一處理器 44: First Processor

46:第二處理器 46: Second processor

D1:重力方向 D1: Gravity direction

第1圖為根據一第一實施例之一冷卻系統之示意圖。 FIG. 1 is a schematic diagram of a cooling system according to a first embodiment.

第2圖為根據一第二實施例之一冷卻系統之示意圖。 Fig. 2 is a schematic diagram of a cooling system according to a second embodiment.

第3圖為第2圖中冷卻系統之***圖。 Figure 3 is an exploded view of the cooling system in Figure 2.

第4圖為根據一第三實施例之一伺服器內部之示意圖。 Fig. 4 is a schematic view of the interior of a server according to a third embodiment.

請參閱第1圖。根據一第一實施例之一冷卻系統1包含一冷凝器12、一第一蒸發器14、一第二蒸發器16、一第一液體管18、一第二液體管20、一第一蒸氣管22、一第二蒸氣管24、及於前述構件內環循流動之一工作流體(未顯示於圖中)。第一液體管18連接至冷凝器12及第一蒸發器14。第二液體管20連接至冷凝器12及第二蒸發器16。第一蒸氣管22連接至冷凝器12及第一蒸發器14。第二蒸氣管24連接至第一蒸發器14及第二蒸發器16。藉此，透過工作流體於冷卻系統1內的循環，第一蒸發器14自一發熱元件(例如處理器，其於運作時會生熱且與蒸發器124熱耦合，例如直接接觸，其間亦可填充熱介面材料)吸收的熱能，可經由冷凝器12對外進行熱交換，以達到散熱的效果；同樣的，第一蒸發器14自一發熱元件(例如另一處理器，其相關說明同前述處理器，不另贅述)吸收的熱能，亦可經由冷凝器12對外進行熱交換，以達到散熱的效果。 See Figure 1. A cooling system 1 according to a first embodiment includes a condenser 12, a first evaporator 14, a second evaporator 16, a first liquid pipe 18, a second liquid pipe 20, a first vapor pipe 22, a second vapor pipe 24, and a working fluid (not shown) circulating in the aforementioned components. The first liquid pipe 18 is connected to the condenser 12 and the first evaporator 14 . The second liquid pipe 20 is connected to the condenser 12 and the second evaporator 16 . The first steam pipe 22 is connected to the condenser 12 and the first evaporator 14 . The second steam pipe 24 is connected to the first evaporator 14 and the second evaporator 16 . In this way, through the circulation of the working fluid in the cooling system 1, the heat energy absorbed by the first evaporator 14 from a heating element (such as a processor, which generates heat during operation and is thermally coupled with the evaporator 124, such as in direct contact, and can also be filled with a thermal interface material) can conduct heat exchange through the condenser 12 to achieve the effect of heat dissipation; similarly, the heat energy absorbed by the first evaporator 14 from a heating element (such as another processor, whose relevant description is the same as that of the aforementioned processor, will not be repeated) can also pass through the condenser 12 External heat exchange to achieve the effect of heat dissipation.

於第一實施例中，第一液體管18及第二液體管20採用並聯配置並分別經由第一蒸發器14及第二蒸發器16連接至冷凝器12，使得各蒸發器14、16能經由獨立的液體管18、20自冷凝器12取得足夠的工作流體量，此可避免習知技術中採串聯配置的蒸發器可能因離冷凝器較遠(例如位於末端的蒸發器)而導致獲得的工作流體量不足，造成蒸乾的現象。此外，第一蒸發器14及第二蒸發器16經由第一蒸氣管22及第二蒸氣管24而串聯連接至冷凝器12，相對於習知技術中同時使用多個獨立的熱虹吸裝置之配置，此第一實施例之配置可減少傳輸管設置空間。 In the first embodiment, the first liquid pipe 18 and the second liquid pipe 20 are arranged in parallel and are respectively connected to the condenser 12 through the first evaporator 14 and the second evaporator 16, so that each evaporator 14, 16 can obtain a sufficient amount of working fluid from the condenser 12 through the independent liquid pipes 18, 20, which can avoid the phenomenon that the evaporators arranged in series in the prior art may be far away from the condenser (such as the evaporator located at the end) to obtain insufficient amount of working fluid, resulting in evaporation. In addition, the first evaporator 14 and the second evaporator 16 are connected in series to the condenser 12 through the first steam pipe 22 and the second steam pipe 24. Compared with the configuration of using multiple independent thermosiphon devices in the prior art, the configuration of the first embodiment can reduce the installation space of the transmission pipe.

此外，於實作上，可透過設計第一液體管18及第二液體管20的流阻， 使得工作流體注入第一蒸發器14及第二蒸發器16的速率接近或相同，進而縮小或消除第一蒸發器14及第二蒸發器16的熱交換能力差異。於第一實施例中，第二液體管20的長度比第一液體管18的長度長，故實作上可透過使第二液體管20的管徑比第一液體管18的管徑大，以使第一液體管18及第二液體管20的流阻相同或相近。實作上亦可於第二液體管20內設置有毛細結構(例如管壁上形成溝槽、燒結層、或設置編織網等)，以幫助工作流體於第二液體管20內的傳遞，亦有助於工作流體注入第一蒸發器14及第二蒸發器16的速率接近或相同。 In addition, in practice, by designing the flow resistance of the first liquid pipe 18 and the second liquid pipe 20, The injection rate of the working fluid into the first evaporator 14 and the second evaporator 16 is close to or the same, thereby reducing or eliminating the difference in heat exchange capacity between the first evaporator 14 and the second evaporator 16 . In the first embodiment, the length of the second liquid pipe 20 is longer than that of the first liquid pipe 18, so in practice, the diameter of the second liquid pipe 20 can be made larger than the diameter of the first liquid pipe 18, so that the flow resistances of the first liquid pipe 18 and the second liquid pipe 20 are the same or similar. In practice, a capillary structure can also be provided in the second liquid pipe 20 (for example, grooves are formed on the pipe wall, a sintered layer, or a braided mesh is provided), so as to help the transfer of the working fluid in the second liquid pipe 20, and also help the speed of the working fluid injected into the first evaporator 14 and the second evaporator 16 to be close to or the same.

此外，冷卻系統1利用熱虹吸作用以實現工作流體於冷卻系統1內的環循流動。於冷卻系統1的實際設置中，在重力方向D1(以箭頭表示於圖中)上，第一液體管18的入口18a高於出口18b，第二液體管20的入口20a高於出口20b。實作上可透過設計第一液體管18的出入口高度差(即入口18a與出口18b之高度差)小於第二液體管20的出入口高度差(例如使第二蒸發器16低於第一蒸發器14)，使得雖然第二液體管20較長，仍可使工作流體注入第一蒸發器14及第二蒸發器16的速率接近或相同。此外，於第一實施例中，第二液體管20雖跨過第一蒸發器14，但透過如前述關於第一液體管18及第二液體管20之設計說明，工作流體仍可於第二液體管20有效地流動，避免第二蒸發器16因接收的工作流體量不足而造成蒸乾的現象。 In addition, the cooling system 1 utilizes thermosiphon effect to realize the circulating flow of the working fluid in the cooling system 1 . In the actual configuration of the cooling system 1 , in the gravity direction D1 (shown by arrows in the figure), the inlet 18a of the first liquid pipe 18 is higher than the outlet 18b, and the inlet 20a of the second liquid pipe 20 is higher than the outlet 20b. In practice, the height difference between the entrance and exit of the first liquid pipe 18 (i.e., the height difference between the entrance 18a and the exit 18b) can be designed to be smaller than the height difference between the entrance and exit of the second liquid pipe 20 (for example, the second evaporator 16 is lower than the first evaporator 14), so that although the second liquid pipe 20 is longer, the rate of injection of the working fluid into the first evaporator 14 and the second evaporator 16 can still be close to or the same. In addition, in the first embodiment, although the second liquid pipe 20 crosses the first evaporator 14, the working fluid can still flow effectively through the second liquid pipe 20 through the above-mentioned design description of the first liquid pipe 18 and the second liquid pipe 20, so as to avoid the phenomenon that the second evaporator 16 is evaporated due to insufficient amount of working fluid received.

另外，一般而言，因蒸氣與液體密度差，第一蒸氣管22及第二蒸氣管24的管徑會大於第一液體管18及第二液體管20的管徑。又，於第一實施例中，第一蒸發器14內蒸發的工作流體會經由第一蒸氣管22回到冷凝器12，第二蒸發器16內蒸發的工作流體會依序經由第二蒸氣管24、第一蒸氣管22回到冷凝器12。於實作上，第一蒸氣管22的管徑可大於第二蒸氣管24的管徑，可避免或抑制因第一蒸氣管22內的工作流體壓力大於第二蒸氣管24內的工作流體壓力而影響第二蒸發器16內蒸發的工作流體於第二蒸氣管24內流動的程度。 In addition, generally speaking, the diameters of the first steam pipe 22 and the second steam pipe 24 are larger than those of the first liquid pipe 18 and the second liquid pipe 20 due to the density difference between the vapor and the liquid. Also, in the first embodiment, the working fluid evaporated in the first evaporator 14 will return to the condenser 12 through the first steam pipe 22, and the working fluid evaporated in the second evaporator 16 will return to the condenser 12 through the second steam pipe 24 and the first steam pipe 22 in sequence. In practice, the diameter of the first steam pipe 22 can be larger than that of the second steam pipe 24, which can avoid or suppress the flow of the working fluid evaporated in the second evaporator 16 in the second steam pipe 24 due to the pressure of the working fluid in the first steam pipe 22 being greater than the pressure of the working fluid in the second steam pipe 24.

請參閱第2圖及第3圖。根據一第二實施例之一冷卻系統3相較於第一實施例之冷卻系統1，更包含一液冷板32。為簡化說明，冷卻系統3沿用冷卻系統1之元件符號，關於冷卻系統3之其他說明，請參閱前文關於冷卻系統1之相關說明，不另贅述。於第二實施例中，邏輯上，冷卻系統3包含冷卻系統1及液冷板32。冷凝器12熱耦合至液冷板32，例如但不限於冷凝器12直接密貼於液冷板32之一第一外表面32a上(實作上兩者之間可填充熱介面材料)，使得冷凝器12與液冷板32進行熱交換。藉此，冷卻系統3自第一蒸發器14及第二蒸發器16吸收之熱能，可經由液冷板32對外進行熱交換(例如液冷板32的入口324、出口326與外部管路(例如機櫃的歧管)連接，使得液冷板32內的工作流體經由管路流至外部的熱交換器以散熱)，以達到散熱的效果。 Please refer to Figure 2 and Figure 3. Compared with the cooling system 1 of the first embodiment, the cooling system 3 according to a second embodiment further includes a liquid cooling plate 32 . To simplify the description, the cooling system 3 follows the component symbols of the cooling system 1. For other descriptions of the cooling system 3, please refer to the relevant description of the cooling system 1 above, and will not be repeated here. In the second embodiment, logically, the cooling system 3 includes the cooling system 1 and the liquid cooling plate 32 . The condenser 12 is thermally coupled to the liquid cold plate 32, for example, but not limited to, the condenser 12 is directly attached to one of the first outer surfaces 32a of the liquid cold plate 32 (in practice, a thermal interface material can be filled between the two), so that the condenser 12 and the liquid cold plate 32 perform heat exchange. In this way, the heat energy absorbed by the cooling system 3 from the first evaporator 14 and the second evaporator 16 can be exchanged externally through the liquid cooling plate 32 (for example, the inlet 324 and the outlet 326 of the liquid cooling plate 32 are connected to external pipelines (such as the manifold of the cabinet), so that the working fluid in the liquid cooling plate 32 flows to the external heat exchanger through the pipeline to dissipate heat), so as to achieve the effect of heat dissipation.

此外，於第二實施例中，液冷板32具有相對於第一外表面32a之一第二外表面32b，液冷板32包含複數個散熱鰭片322設置於第二外表面32b上，有助於液冷板32的散熱效率。 In addition, in the second embodiment, the liquid cooling plate 32 has a second outer surface 32b opposite to the first outer surface 32a, and the liquid cooling plate 32 includes a plurality of cooling fins 322 disposed on the second outer surface 32b, which contributes to the heat dissipation efficiency of the liquid cooling plate 32.

請參閱第4圖。根據一第三實施例之一伺服器4包含一裝置殼體40(其上蓋未顯示於圖中，以便於顯示伺服器4內部配置)及設置於裝置殼體40內之一主機板42、一第一處理器44(其隱藏輪廓以虛線繪示於圖中)、一第二處理器46及一冷卻系統(為便於說明，以前述冷卻系統3為例，故關於冷卻系統3之相關說明，請參閱前文，不另贅述)；伺服器4其他組件(例如儲存裝置、電源供應器、風扇等)未顯示於圖中，以簡化圖面。第一處理器44及第二處理器46經由冷卻系統3散熱，其隱藏輪廓以虛線繪示於圖中。冷卻系統3經由第一蒸發器14與第一處理器44熱耦合；例如但不限於第一蒸發器14直接密貼於第一處理器44之上表面上(實作上兩者之間可填充熱介面材料)，冷卻系統3也經由第二蒸發器16與第二處理器46熱耦合；例如但不限於第二蒸發器16直接密貼於第二處理器46之上表面上(實作上兩者之間可填充熱介面材料)。冷卻系統3的液冷板32位於裝置殼體40 之後側，液冷板32的入口324及出口326原則上會突出於裝置殼體40，以便於與外部管路(例如機櫃的歧管)連接，例如液冷板32的工作流體經由此管路流至外部的熱交換器以散熱。藉此，第一處理器44及第二處理器46於運作時產生的熱可分別經由第一蒸發器14及第二蒸發器16散熱。 See Figure 4. A server 4 according to a third embodiment includes a device housing 40 (its upper cover is not shown in the figure, so as to facilitate the display of the internal configuration of the server 4) and a motherboard 42 disposed in the device housing 40, a first processor 44 (the hidden outline is shown in the figure with a dotted line), a second processor 46 and a cooling system (for ease of description, the aforementioned cooling system 3 is used as an example, so the relevant description of the cooling system 3 is referred to above, and will not be repeated); other components of the server 4 (such as storage devices, power supplies, fans, etc. ) are not shown in the figure to simplify the figure. The first processor 44 and the second processor 46 dissipate heat through the cooling system 3 , and their hidden contours are shown in dotted lines in the figure. The cooling system 3 is thermally coupled to the first processor 44 via the first evaporator 14; for example, but not limited to, the first evaporator 14 is directly attached to the upper surface of the first processor 44 (in practice, a thermal interface material can be filled between the two), and the cooling system 3 is also thermally coupled to the second processor 46 through the second evaporator 16; for example, but not limited to, the second evaporator 16 is directly attached to the upper surface of the second processor 46 (in practice, a thermal interface material can be filled between the two). The liquid cooling plate 32 of the cooling system 3 is located in the device housing 40 On the rear side, the inlet 324 and outlet 326 of the liquid cold plate 32 will protrude from the device housing 40 in principle, so as to be connected with external pipelines (such as the manifold of the cabinet), for example, the working fluid of the liquid cold plate 32 flows to the external heat exchanger through this pipeline to dissipate heat. Thereby, the heat generated by the first processor 44 and the second processor 46 during operation can be dissipated through the first evaporator 14 and the second evaporator 16 respectively.

此外，於第三實施例中，第一處理器44及第二處理器46前後排列，第一處理器44位於第二處理器46與液冷板32之間，第二液體管20雖跨過第一蒸發器14上方。液冷板32的散熱鰭片322平行於裝置殼體40前後方向延伸，此有益於利用裝置殼體40內之散熱氣流(以空心箭頭表示於圖中，例如由風扇產生)散熱。 In addition, in the third embodiment, the first processor 44 and the second processor 46 are arranged one behind the other, the first processor 44 is located between the second processor 46 and the liquid cold plate 32 , and the second liquid pipe 20 crosses over the first evaporator 14 . The heat dissipation fins 322 of the liquid cooling plate 32 extend parallel to the front and rear directions of the device housing 40 , which is beneficial to utilize the heat dissipation airflow (indicated by a hollow arrow in the figure, such as generated by a fan) in the device housing 40 to dissipate heat.

在本發明的一實施例中，本發明之冷卻系統及伺服器係可用於人工智慧(Artificial Intelligence，簡稱AI)運算、邊緣運算(Edge Computing)，亦可當作5G伺服器、雲端伺服器或車聯網伺服器使用。 In an embodiment of the present invention, the cooling system and server of the present invention can be used for artificial intelligence (AI) computing, edge computing (Edge Computing), and can also be used as a 5G server, cloud server or Internet of Vehicles server.

以上所述僅為本發明之較佳實施例，凡依本發明申請專利範圍所做之均等變化與修飾，皆應屬本發明之涵蓋範圍。 The above descriptions are only preferred embodiments of the present invention, and all equivalent changes and modifications made according to the scope of the patent application of the present invention shall fall within the scope of the present invention.

1:冷卻系統 1: cooling system

12:冷凝器 12: Condenser

14:第一蒸發器 14: The first evaporator

16:第二蒸發器 16: Second evaporator

18:第一液體管 18: First Liquid Tube

18a:入口 18a: Entrance

18b:出口 18b: Export

20:第二液體管 20: Second liquid pipe

20a:入口 20a: entrance

20b:出口 20b: Export

22:第一蒸氣管 22: The first steam pipe

24:第二蒸氣管 24: Second steam pipe

D1:重力方向 D1: Gravity direction

Claims (10)

一種冷卻系統，包含：一冷凝器；一第一蒸發器；一第二蒸發器；一第一液體管，連接該冷凝器及該第一蒸發器；一第二液體管，連接該冷凝器及該第二蒸發器；一第一蒸氣管，連接該冷凝器及該第一蒸發器；以及一第二蒸氣管，連接該第一蒸發器及該第二蒸發器；其中，該第一液體管及該第二液體管採用並聯配置。 A cooling system comprising: a condenser; a first evaporator; a second evaporator; a first liquid pipe connecting the condenser and the first evaporator; a second liquid pipe connecting the condenser and the second evaporator; a first vapor pipe connecting the condenser and the first evaporator; and a second vapor pipe connecting the first evaporator and the second evaporator; wherein the first liquid pipe and the second liquid pipe are arranged in parallel. 如請求項1所述之冷卻系統，其中該第一液體管及該第二液體管的流阻相同。 The cooling system as claimed in claim 1, wherein the first liquid pipe and the second liquid pipe have the same flow resistance. 如請求項1所述之冷卻系統，其中該第二液體管的長度比該第一液體管的長度長，且該第二液體管的管徑比該第一液體管的管徑大。 The cooling system according to claim 1, wherein the length of the second liquid pipe is longer than that of the first liquid pipe, and the diameter of the second liquid pipe is larger than that of the first liquid pipe. 如請求項1所述之冷卻系統，其中該第二液體管的長度比該第一液體管的長度長，該第二液體管內設置有毛細結構。 The cooling system according to claim 1, wherein the length of the second liquid pipe is longer than that of the first liquid pipe, and a capillary structure is arranged in the second liquid pipe. 如請求項1所述之冷卻系統，其中該第二液體管跨過該第一蒸發器。 The cooling system as claimed in claim 1, wherein the second liquid pipe crosses the first evaporator. 如請求項1所述之冷卻系統，其中該第一蒸氣管的管徑大於第二蒸氣管的管徑。 The cooling system as claimed in claim 1, wherein the diameter of the first steam pipe is larger than the diameter of the second steam pipe. 如請求項1所述之冷卻系統，更包含一液冷板，其中該冷凝器熱耦合至該液冷板。 The cooling system as claimed in claim 1, further comprising a liquid cold plate, wherein the condenser is thermally coupled to the liquid cold plate. 如請求項7所述之冷卻系統，其中該液冷板具有一第一外表面及一第二外表面，該冷凝器經由該第一外表面與該液冷板熱耦合，複數個散熱鰭片設置於該第二外表面上。 The cooling system according to claim 7, wherein the liquid cold plate has a first outer surface and a second outer surface, the condenser is thermally coupled to the liquid cold plate through the first outer surface, and a plurality of cooling fins are arranged on the second outer surface. 如請求項8所述之冷卻系統，其中該第一外表面相對於該第二外表面。 The cooling system as claimed in claim 8, wherein the first outer surface is opposite to the second outer surface. 一種伺服器，包含：一第一處理器；一第二處理器；以及如請求項1至9其中任一請求項所述之冷卻系統，該第一蒸發器熱耦合至該第一處理器，該第二蒸發器熱耦合至該第二處理器。 A server, comprising: a first processor; a second processor; and the cooling system according to any one of claims 1 to 9, the first evaporator is thermally coupled to the first processor, and the second evaporator is thermally coupled to the second processor.
TW111122424A 2022-06-16 2022-06-16 Cooling system and server TWI808796B (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070089861A1 (en) * 2003-01-21 2007-04-26 Mitsubishi Electric Corporation Vapor-lift pump heat transport apparatus
CN109244051A (en) * 2018-10-30 2019-01-18 中国航天空气动力技术研究院 A kind of parallel heat radiation device for loop heat pipe for server chips heat dissipation
CN114245687A (en) * 2021-12-28 2022-03-25 北京微焓科技有限公司 Evaporator, condenser and loop heat pipe

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070089861A1 (en) * 2003-01-21 2007-04-26 Mitsubishi Electric Corporation Vapor-lift pump heat transport apparatus
CN109244051A (en) * 2018-10-30 2019-01-18 中国航天空气动力技术研究院 A kind of parallel heat radiation device for loop heat pipe for server chips heat dissipation
CN114245687A (en) * 2021-12-28 2022-03-25 北京微焓科技有限公司 Evaporator, condenser and loop heat pipe

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