CN117241541A - Cooling system and server - Google Patents
Cooling system and server Download PDFInfo
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- CN117241541A CN117241541A CN202210637368.3A CN202210637368A CN117241541A CN 117241541 A CN117241541 A CN 117241541A CN 202210637368 A CN202210637368 A CN 202210637368A CN 117241541 A CN117241541 A CN 117241541A
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- evaporator
- liquid
- cooling system
- condenser
- tube
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- 238000001816 cooling Methods 0.000 title claims abstract description 80
- 239000007788 liquid Substances 0.000 claims abstract description 99
- 239000012530 fluid Substances 0.000 description 27
- 230000017525 heat dissipation Effects 0.000 description 12
- 230000000694 effects Effects 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 238000013473 artificial intelligence Methods 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000006855 networking Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application discloses a cooling system and a server. The cooling system comprises a condenser, a first evaporator, a second evaporator, a first liquid pipe, a second liquid pipe, a first vapor pipe and a second vapor pipe. The first liquid pipe is connected to the condenser and the first evaporator. The second liquid pipe is connected to the condenser and the second evaporator. The first vapor pipe is connected to the condenser and the first evaporator. The second vapor pipe is connected to the first evaporator and the second evaporator. The server comprises a first processor, a second processor and the cooling system. The first evaporator is thermally coupled to the first processor and the second evaporator is thermally coupled to the second processor.
Description
Technical Field
The present application relates to a cooling system, and more particularly, to a cooling system using thermosiphon and a cooling system for a server.
Background
Typically a thermosiphon provides heat dissipation to a heat generating component. In the case of a plurality of heat generating components (e.g., CPU) having heat dissipation requirements, if a plurality of independent thermosiphons are used, the arrangement of the thermosiphon transfer tubes (including the liquid tube and the vapor tube) will be complicated, and the mutual interference will be easy, increasing the difficulty in the arrangement of the transfer tubes. The foregoing problems are particularly acute when a plurality of heat generating members are closely disposed. There are also schemes for connecting multiple evaporators in series, i.e. a single set of pipes connects multiple evaporators in series and connects to a single condenser. The transmission pipe can be designed to be of an enlarged pipe diameter so as to improve heat transfer quantity, and then the heat dissipation requirement of each heating element can be met. For the liquid pipe, the condensed liquid is mainly conveyed to each evaporator by gravity through the working fluid, and the liquid recovery effect is affected by the height difference between the condenser and the evaporator. Furthermore, there is typically no height difference between the evaporators, which share the same liquid tube, which will result in less working fluid being available to the evaporators further from the condenser. The evaporator far from the condenser has the opportunity to evaporate due to insufficient amount of the entering working fluid, so that the cooling effect on the heating element is lost, and the heating element is overheated. The evaporator closer to the condenser may change its operating point due to too high an amount of working fluid entering, which may also affect the cooling effect on the heat generating components.
Disclosure of Invention
In view of the problems in the prior art, it is an object of the present application to provide a cooling system that uses the same condenser to exchange heat with two evaporators and reduces the layout of the working fluid transfer tubes.
A cooling system according to the present application includes a condenser, a first evaporator, a second evaporator, a first liquid pipe, a second liquid pipe, a first vapor pipe and a second vapor pipe. The first liquid pipe is connected to the condenser and the first evaporator. The second liquid pipe is connected to the condenser and the second evaporator. The first vapor pipe is connected to the condenser and the first evaporator. The second vapor pipe is connected to the first evaporator and the second evaporator. Thus, the liquid pipes arranged in parallel enable each evaporator to obtain enough working fluid from the condenser through the independent liquid pipe, and the vapor pipes arranged in series can reduce the layout of the vapor pipes. The cooling system according to the present application uses a smaller piping layout than the existing one-to-one configuration of condenser and evaporator.
Preferably, the flow resistance of the first liquid pipe and the second liquid pipe is the same.
Preferably, the length of the second liquid pipe is longer than that of the first liquid pipe, and the pipe diameter of the second liquid pipe is larger than that of the first liquid pipe.
Preferably, the length of the second liquid pipe is longer than that of the first liquid pipe, and a capillary structure is arranged in the second liquid pipe.
Preferably, wherein the second liquid pipe spans the first evaporator.
Preferably, the pipe diameter of the first steam pipe is larger than that of the second steam pipe.
Preferably, the condenser further comprises a liquid cooling plate, wherein the condenser is thermally coupled to the liquid cooling plate.
Preferably, the liquid cooling plate has a first outer surface and a second outer surface, the condenser is thermally coupled with the liquid cooling plate via the first outer surface, and the plurality of heat dissipation fins are disposed on the second outer surface.
Preferably, wherein the first outer surface is opposite the second outer surface.
Another object of the present application is to provide a server whose cooling system uses the same condenser to exchange heat with two evaporators and reduces the layout of the working fluid transfer pipes.
A server according to the present application includes a first processor, a second processor, and a cooling system. The cooling system comprises a condenser, a first evaporator, a second evaporator, a first liquid pipe, a second liquid pipe, a first vapor pipe and a second vapor pipe. The first liquid pipe is connected to the condenser and the first evaporator. The second liquid pipe is connected to the condenser and the second evaporator. The first vapor pipe is connected to the condenser and the first evaporator. The second vapor pipe is connected to the first evaporator and the second evaporator. Therefore, the cooling system of the server adopts the liquid pipes arranged in parallel and the vapor pipes arranged in series, so that each evaporator can obtain enough working fluid quantity from the condenser through the independent liquid pipe, and the overall layout of the cooling system pipeline is also inhibited. The cooling system of the server according to the present application uses a smaller piping layout than the existing one-to-one configuration of condenser and evaporator.
The advantages and spirit of the present application will be further understood from the following detailed description of the application and the accompanying drawings.
Drawings
Fig. 1 is a schematic diagram of a cooling system according to a first embodiment.
Fig. 2 is a schematic diagram of a cooling system according to a second embodiment.
Fig. 3 is an exploded view of the cooling system of fig. 2.
FIG. 4 is a schematic diagram of a server according to a third embodiment.
Symbol description:
1,3 Cooling System
12 condenser
14 first evaporator
16 second evaporator
18 first liquid pipe
18a inlet
18b outlet
20 second liquid pipe
20a inlet
20b outlet
22 first vapor tube
24 second steam pipe
32 liquid cooling plate
32a first outer surface
32b second outer surface
322 radiating fin
324 inlet port
326 outlet of
4 server
40 device housing
42 motherboard
44 first processor
46 second processor
D1 gravity direction
Detailed Description
Please refer to fig. 1. A cooling system 1 according to a first embodiment includes a condenser 12, a first evaporator 14, a second evaporator 16, a first liquid pipe 18, a second liquid pipe 20, a first vapor pipe 22, a second vapor pipe 24, and a working fluid (not shown) circulating in the above components. A first liquid line 18 is connected to the condenser 12 and the first evaporator 14. A second liquid line 20 is connected to the condenser 12 and the second evaporator 16. The first vapor pipe 22 is connected to the condenser 12 and the first evaporator 14. The second vapor tube 24 is connected to the first evaporator 14 and the second evaporator 16. Thus, through the circulation of the working fluid in the cooling system 1, the heat energy absorbed by the first evaporator 14 from a heating element (such as a processor, which generates heat during operation and is thermally coupled to the evaporator 124, such as in direct contact, and may be filled with a thermal interface material), can be subjected to heat exchange through the condenser 12, so as to achieve the heat dissipation effect; similarly, the heat energy absorbed by the first evaporator 14 from a heating element (e.g. another processor, which is not described in detail in the foregoing description), can also be exchanged to the outside via the condenser 12 to achieve the heat dissipation effect.
In the first embodiment, the first liquid pipe 18 and the second liquid pipe 20 are configured in parallel and are connected to the condenser 12 through the first evaporator 14 and the second evaporator 16, respectively, so that each evaporator 14, 16 can obtain a sufficient amount of working fluid from the condenser 12 through the independent liquid pipes 18, 20, which can avoid the phenomenon that the evaporators configured in series in the prior art may have insufficient amount of working fluid due to being far away from the condenser (such as the evaporator at the end), resulting in dryness. In addition, the first evaporator 14 and the second evaporator 16 are connected in series to the condenser 12 via the first vapor tube 22 and the second vapor tube 24, and the configuration of the first embodiment can reduce the installation space of the transfer tube compared to the configuration of using a plurality of independent thermosiphon devices in the prior art.
In addition, in practice, the flow resistance of the first liquid tube 18 and the second liquid tube 20 can be designed such that the rate of the working fluid injected into the first evaporator 14 and the second evaporator 16 is close to or the same as each other, thereby reducing or eliminating the difference in heat exchange capacities between the first evaporator 14 and the second evaporator 16. In the first embodiment, the length of the second liquid tube 20 is longer than that of the first liquid tube 18, so that the flow resistance of the first liquid tube 18 and the flow resistance of the second liquid tube 20 are the same or similar by making the diameter of the second liquid tube 20 larger than that of the first liquid tube 18. In practice, a capillary structure (such as grooves formed on the wall of the tube, a sintered layer, or a woven mesh) may be disposed in the second liquid tube 20 to facilitate the transfer of the working fluid in the second liquid tube 20, and also facilitate the injection rate of the working fluid into the first evaporator 14 and the second evaporator 16 to be close to or the same as each other.
Furthermore, the cooling system 1 utilizes a thermosiphon effect to achieve a circulating flow of the working fluid within the cooling system 1. In the actual arrangement of the cooling system 1, the inlet 18a of the first liquid pipe 18 is higher than the outlet 18b and the inlet 20a of the second liquid pipe 20 is higher than the outlet 20b in the gravity direction D1 (shown by the arrow). In practice, the inlet-outlet height difference of the first liquid tube 18 (i.e. the height difference between the inlet 18a and the outlet 18 b) is designed to be higher than the inlet-outlet height difference of the second liquid tube 20 (e.g. the second evaporator 16 is lower than the first evaporator 14), so that the rate of injecting the working fluid into the first evaporator 14 and the second evaporator 16 can be made to be close to or the same even though the second liquid tube 20 is longer. In addition, in the first embodiment, the second liquid pipe 20 spans the first evaporator 14, but through the above-mentioned design description about the first liquid pipe 18 and the second liquid pipe 20, the working fluid can still flow effectively in the second liquid pipe 20, so as to avoid the phenomenon that the second evaporator 16 is evaporated to dryness due to insufficient amount of the received working fluid.
In general, the diameters of the first vapor tube 22 and the second vapor tube 24 are larger than those of the first liquid tube 18 and the second liquid tube 20 due to the difference in the densities of the vapor and the liquid. In the first embodiment, the working fluid evaporated in the first evaporator 14 returns to the condenser 12 through the first vapor tube 22, and the working fluid evaporated in the second evaporator 16 returns to the condenser 12 through the second vapor tube 24 and the first vapor tube 22 in sequence. In practice, the pipe diameter of the first vapor pipe 22 may be larger than the pipe diameter of the second vapor pipe 24, so as to avoid or inhibit the influence of the working fluid pressure in the first vapor pipe 22 on the flow of the working fluid evaporated in the second evaporator 16 in the second vapor pipe 24 due to the working fluid pressure in the first vapor pipe 22 being larger than the working fluid pressure in the second vapor pipe 24.
Please refer to fig. 2 and 3. A cooling system 3 according to a second embodiment further includes a liquid cooling plate 32 as compared with the cooling system 1 of the first embodiment. For simplicity of description, the cooling system 3 is denoted by reference numeral 1, and for other description of the cooling system 3, please refer to the description of the cooling system 1 above, and the description is omitted. In the second embodiment, logically, the cooling system 3 includes the cooling system 1 and the liquid cooling plate 32. The condenser 12 is thermally coupled to the liquid cooling plate 32, such as, but not limited to, the condenser 12 being directly adhered to a first outer surface 32a of the liquid cooling plate 32 (in practice, a thermal interface material may be filled therebetween) such that the condenser 12 exchanges heat with the liquid cooling plate 32. Accordingly, the heat energy absorbed by the cooling system 3 from the first evaporator 14 and the second evaporator 16 can be subjected to heat exchange (for example, the inlet 324 and the outlet 326 of the liquid cooling plate 32 are connected with external pipelines (for example, the manifold of the cabinet) through the liquid cooling plate 32, so that the working fluid in the liquid cooling plate 32 flows to the external heat exchanger through the pipelines to dissipate heat), thereby achieving the heat dissipation effect.
In addition, in the second embodiment, the liquid cooling plate 32 has a second outer surface 32b opposite to the first outer surface 32a, and the liquid cooling plate 32 includes a plurality of heat dissipation fins 322 disposed on the second outer surface 32b, which is helpful for heat dissipation efficiency of the liquid cooling plate 16.
Please refer to fig. 4. A server 4 according to a third embodiment includes a device housing 40 (the top cover thereof is not shown in the drawings to show the internal configuration of the server 4), a motherboard 42 disposed in the device housing 40, a first processor 44 (the hidden outline thereof is shown in the drawings by dashed lines), a second processor 46 and a cooling system (for convenience of explanation, the cooling system 3 is taken as an example, so please refer to the related description of the cooling system 3 and the description is omitted herein); other components of the server 4 (e.g., storage device, power supply, fan, etc.) are not shown in the figure to simplify the drawing. The first processor 44 and the second processor 46 dissipate heat via the cooling system 3, the hidden outline of which is shown in dashed lines. The cooling system 3 is thermally coupled with the first processor 44 via the first evaporator 14; such as, but not limited to, the first evaporator 14 being directly affixed to the upper surface of the first processor 44 (in practice, a thermal interface material may be filled therebetween), the cooling system 3 also being thermally coupled to the second processor 46 via the second evaporator 16; such as, but not limited to, the second evaporator 16 being directly adhered to the upper surface of the second processor 46 (in practice, a thermal interface material may be filled therebetween). The liquid cooling plate 32 of the cooling system 3 is located at the rear side of the device housing 40, and the inlet 324 and the outlet 326 of the liquid cooling plate 16 protrude from the device housing 40 in principle, so as to be connected to an external pipeline (for example, a manifold of a cabinet), through which the working fluid of the liquid cooling plate 32 flows to an external heat exchanger for heat dissipation. Thus, heat generated by the first processor 44 and the second processor 46 during operation can be dissipated via the first evaporator 14 and the second evaporator 16, respectively.
In addition, in the third embodiment, the first processor 44 and the second processor 46 are arranged in tandem, the first processor 44 is located between the second processor 46 and the liquid cooling plate 32, and the second liquid pipe 20 spans over the first evaporator 14. The cooling fins 322 of the liquid cooling plate 32 extend parallel to the front-rear direction of the device housing 40, which is advantageous for heat dissipation by the flow of heat dissipation air (shown by the outline arrow in the figure, for example, generated by a fan) within the device housing 40.
In an embodiment of the present application, the cooling system and the server of the present application can be used for artificial intelligence (Artificial Intelligence, abbreviated as AI) operation and Edge Computing (Edge Computing) operation, and can also be used as a 5G server, a cloud server or a car networking server.
The foregoing description is only of the preferred embodiments of the application, and all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Claims (10)
1. A cooling system, comprising:
a condenser;
a first evaporator;
a second evaporator;
a first liquid pipe connecting the condenser and the first evaporator;
a second liquid pipe connecting the condenser and the second evaporator;
a first vapor pipe connected to the condenser and the first evaporator; and
and the second vapor pipe is connected with the first evaporator and the second evaporator.
2. The cooling system of claim 1, wherein the flow resistance of the first liquid tube and the second liquid tube are the same.
3. The cooling system of claim 1, wherein the second liquid tube has a length longer than the first liquid tube and a tube diameter greater than the tube diameter of the first liquid tube.
4. The cooling system of claim 1, wherein the second liquid tube has a length longer than the first liquid tube, and wherein a capillary structure is disposed within the second liquid tube.
5. The cooling system of claim 1, wherein the second liquid tube spans the first evaporator.
6. The cooling system of claim 1, wherein the first vapor tube has a tube diameter greater than the tube diameter of the second vapor tube.
7. The cooling system of claim 1, further comprising a liquid cooling plate, wherein the condenser is thermally coupled to the liquid cooling plate.
8. The cooling system of claim 7, wherein the liquid cooling plate has a first outer surface and a second outer surface, the condenser being thermally coupled to the liquid cooling plate via the first outer surface, a plurality of heat fins being disposed on the second outer surface.
9. The cooling system of claim 8, wherein the first outer surface is opposite the second outer surface.
10. A server, comprising:
a first processor;
a second processor; and
the cooling system of any one of claims 1 to 9, the first evaporator being thermally coupled to the first processor, the second evaporator being thermally coupled to the second processor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210637368.3A CN117241541A (en) | 2022-06-07 | 2022-06-07 | Cooling system and server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210637368.3A CN117241541A (en) | 2022-06-07 | 2022-06-07 | Cooling system and server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117241541A true CN117241541A (en) | 2023-12-15 |
Family
ID=89088577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210637368.3A Pending CN117241541A (en) | 2022-06-07 | 2022-06-07 | Cooling system and server |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117241541A (en) |
-
2022
- 2022-06-07 CN CN202210637368.3A patent/CN117241541A/en active Pending
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