TWI806575B - Method of fabricating probe socket structure - Google Patents

Method of fabricating probe socket structure Download PDF

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TWI806575B
TWI806575B TW111116108A TW111116108A TWI806575B TW I806575 B TWI806575 B TW I806575B TW 111116108 A TW111116108 A TW 111116108A TW 111116108 A TW111116108 A TW 111116108A TW I806575 B TWI806575 B TW I806575B
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probe
glue
layer
socket structure
manufacturing
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TW111116108A
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Chinese (zh)
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TW202343917A (en
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魏遜泰
王偉丞
曹富雄
高瑋呈
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中華精測科技股份有限公司
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Abstract

A method of fabricating a probe socket structure includes forming a plastic coating layer with a first thickness on a surface of a probe by using a coating process, forming a through hole on a housing, and inserting the probe with the plastic coating layer into the through hole to fix the probe to the base, so that production time and cost are improved, as well as enhancing the yield.

Description

探針插座結構的製作方法Manufacturing method of probe socket structure

本發明是有關一種探針插座結構，特別是指一種探針插座結構的製作方法。The invention relates to a probe socket structure, in particular to a manufacturing method of the probe socket structure.

積體電路(integrated circuit，IC)無論在封裝前或封裝後都需經過測試系統測試，除了用以進行良品篩選，還能提取各種電氣特性參數，建立用於電路設計的器件模型，進而提升產品的市場競爭力。Integrated circuits (integrated circuit, IC) need to be tested by the test system before or after packaging. In addition to screening good products, various electrical characteristic parameters can be extracted to establish device models for circuit design, thereby improving products. market competitiveness.

利用探針進行IC測試，無需製作專門的測試夾具，可以節省大量測試成本。現今應用於同軸插座(coaxial socket)的製作方法，亦即一種探針插座的製作方法，需優先進行座體(housing)鑽孔，之後灌膠於孔內形成灌膠層，再進行灌膠層鑽孔，最後才植針。由此可見，傳統探針插座的製作步驟繁瑣，且精密度要求高，更不易控制。進一步而言，現有製程方法存在如下缺點：1. 膠層鑽孔不易控制，因膠層質地較軟，鑽孔困難度大，容易造成孔徑大小或成孔位置不符要求的問題；2. 灌膠須注意平坦度，平坦度影響電性特性；3. 膠層是否與探針緊密無法從外檢查；4. 現有製程方法阻抗控制不易，影響高頻電氣特性；5. 先座體鑽孔後灌膠層鑽孔的工序無法分割，耗時而不利於產能提升。以上任一流程若失誤，會使整個socket無法再使用，降低良率，導致高昂的時間成本及製作成本。Using probes for IC testing does not need to make special test fixtures, which can save a lot of testing costs. The manufacturing method applied to coaxial sockets (coaxial sockets), that is, a method of manufacturing probe sockets, needs to firstly drill holes in the housing, and then pour glue into the holes to form a glue layer, and then carry out the glue layer The holes are drilled and the needles are implanted at the end. It can be seen that the manufacturing steps of the traditional probe socket are cumbersome and require high precision, which is even more difficult to control. Furthermore, the existing process method has the following disadvantages: 1. The drilling of the adhesive layer is not easy to control, because the texture of the adhesive layer is soft, the drilling difficulty is high, and it is easy to cause the problem that the size of the hole or the position of the hole does not meet the requirements; 2. The glue filling Attention should be paid to the flatness, which affects the electrical characteristics; 3. Whether the adhesive layer is tightly connected to the probe cannot be checked from the outside; 4. The existing process method is not easy to control the impedance, which affects the high-frequency electrical characteristics; 5. Drilling the base first and then filling The drilling process of the adhesive layer cannot be divided, which is time-consuming and not conducive to the improvement of production capacity. Any mistake in the above process will make the entire socket unusable, reduce the yield rate, and lead to high time cost and production cost.

本發明之一目的在於提供一種探針插座結構的製作方法，用以改善生產時間成本及製作成本，並提升良率。An object of the present invention is to provide a method for manufacturing a probe socket structure, which is used to improve the production time cost and production cost, and improve the yield rate.

為達到前述目的，本發明提供一種探針插座結構的製作方法，包括：利用一鍍層工藝在一探針的表面形成具有第一厚度的鍍膠層；在一座體上形成一通孔；及將具有該鍍膠層的探針置入該通孔，以固定該探針於該座體。In order to achieve the aforementioned object, the present invention provides a method for manufacturing a probe socket structure, comprising: utilizing a plating process to form a glue-coated layer with a first thickness on the surface of a probe; forming a through hole on the base; The probe of the glue-coated layer is inserted into the through hole to fix the probe on the base.

較佳地，該利用該鍍層工藝在該探針的表面形成具有該第一厚度的鍍膠層的步驟包括：在該探針上定義一鍍層範圍，且該鍍層範圍圍繞該探針的表面，使該鍍膠層延該鍍層範圍向外徑向形成該第一厚度。Preferably, the step of using the plating process to form a glue layer with the first thickness on the surface of the probe comprises: defining a coating range on the probe, and the coating range surrounds the surface of the probe, The glue coating layer extends radially outward from the coating layer to form the first thickness.

較佳地，該鍍膠層的第一厚度小於該座體的通孔的孔徑。Preferably, the first thickness of the adhesive layer is smaller than the diameter of the through hole of the seat body.

較佳地，該鍍膠層在一斷面方向上的相對二外側邊分別平行於該探針及該通孔在該斷面方向上的外側邊。Preferably, two opposite outer sides of the adhesive layer in a cross-sectional direction are respectively parallel to outer sides of the probe and the through hole in the cross-sectional direction.

較佳地，該座體形成該通孔的步驟與利用該鍍層工藝在該探針的表面形成具有該第一厚度的鍍膠層的步驟同時進行。Preferably, the step of forming the through hole on the base body and the step of forming the glue plating layer with the first thickness on the surface of the probe by using the plating process are performed simultaneously.

較佳地，該探針、該鍍膠層及該座體同軸，且該鍍膠層的上表面齊平於該座體的上表面，該鍍膠層的下表面齊平於該座體的下表面。Preferably, the probe, the glue-coated layer and the base are coaxial, and the upper surface of the glue-coated layer is flush with the upper surface of the base, and the lower surface of the glue-coated layer is flush with the base of the base. lower surface.

較佳地，該座體為鋁、銅或鎳之導電金屬材質所製。Preferably, the seat body is made of conductive metal material such as aluminum, copper or nickel.

較佳地，該鍍膠層的材料為氧化鋁或非導電之介電材質。Preferably, the material of the adhesive layer is aluminum oxide or non-conductive dielectric material.

本發明利用鍍層工藝在探針的表面上形成鍍膠層，而不需在座體的通孔內灌膠，更不用在灌膠層上鑽孔植針，可有效簡化製程工序，並確保鍍膠層的平坦度及精密度，及鍍膠層與探針的緊密結合，進而達到良好的阻抗控制。此外，座體的鑽孔與探針的鍍膠層為單獨分開的製程，互不影響，可同時在不同生產線同時進行，有效降低時間成本及製作成本，進而提升產能及提高良率。據此，本發明的探針插座結構的製作方法有效解決傳統探針插座的製作方法存在先座體鑽孔後灌膠層鑽孔的工序無法分割、生產時間成本及製作成本高昂、製程方法阻抗控制不易及良率低的問題。The present invention utilizes the plating process to form a glue-coated layer on the surface of the probe without pouring glue into the through hole of the seat body, let alone drilling holes and planting needles on the glue-filling layer, which can effectively simplify the manufacturing process and ensure the glue-plating The flatness and precision of the layer, and the tight combination of the glue layer and the probe, thereby achieving good impedance control. In addition, the drilling of the seat body and the glue coating of the probe are separate processes that do not affect each other. They can be carried out in different production lines at the same time, effectively reducing time costs and production costs, thereby increasing production capacity and improving yield. Accordingly, the manufacturing method of the probe socket structure of the present invention effectively solves the problems of the traditional probe socket manufacturing method that the process of first drilling the seat body and then drilling the glue layer cannot be divided, the production time cost and production cost are high, and the process resistance is high. Difficult control and low yield.

為使本發明的目的、技術手段及效果更加清楚、明確，以下參照圖式並舉實施例對本發明進一步詳細說明。應當理解，此處所描述的具體實施例僅用以解釋本發明，本發明說明書所使用的詞語“實施例”意指用作實例、示例或例證，並不用於限定本發明。此外，本發明說明書和所附申請專利範圍中所使用的冠詞“一”，一般地可以被解釋為意指“一個或多個”，除非另外指定或從上下文可以清楚確定單數形式。並且，在所附圖式中，結構、功能相似或相同的元件是以相同元件標號來表示。In order to make the purpose, technical means and effects of the present invention more clear and definite, the present invention will be further described in detail below with reference to the drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present invention, and the word "embodiment" used in the description of the present invention is meant to be used as an example, illustration or illustration, and is not intended to limit the present invention. In addition, the article "a" used in the present specification and appended claims can generally be interpreted as meaning "one or more", unless otherwise specified or the singular form is clearly determined from the context. Moreover, in the accompanying drawings, elements with similar or identical structures and functions are denoted by the same element numerals.

本發明為一種製作探針插座結構的方法，用以提高產品精準度，提升良率，並改善生產工時成本及製作成本。具體地，通過本發明製作方法所製作的探針插座結構為一種同軸插座(coaxial socket)結構，可用於積體電路、5G通訊器件、高頻高速成品等器件的測試。請參閱圖1，其為本發明之探針插座結構的立體結構示意圖。本發明的探針插座結構1包括同軸設置的座體2、探針3及鍍膠層4。由於本發明旨在提供一種探針插座結構的改良製程，有關探針插座結構的細部構造及應用層面與常規技術相同，故在本申請實施例中並未詳細說明。The invention relates to a method for manufacturing a probe socket structure, which is used to improve product precision, improve yield rate, and improve production man-hour cost and production cost. Specifically, the probe socket structure produced by the production method of the present invention is a coaxial socket structure, which can be used for testing integrated circuits, 5G communication devices, high-frequency and high-speed finished products, and other devices. Please refer to FIG. 1 , which is a three-dimensional schematic view of the structure of the probe socket of the present invention. The probe socket structure 1 of the present invention includes a base body 2 , a probe 3 and a glue layer 4 arranged coaxially. Since the present invention aims to provide an improved manufacturing process of the probe socket structure, the detailed structure and application level of the probe socket structure are the same as the conventional technology, so it is not described in detail in the embodiment of the present application.

請參閱圖2，其為本發明之探針插座結構的製作方法流程圖。如圖2所示，本發明提供的探針插座結構的製作方法包括步驟S10：利用一鍍層工藝在一探針的表面形成具有第一厚度的鍍膠層、步驟S20：在一座體上形成一通孔，及步驟S30：將具有該鍍膠層的探針置入該通孔，以固定該探針於該座體。Please refer to FIG. 2 , which is a flow chart of the manufacturing method of the probe socket structure of the present invention. As shown in Fig. 2, the manufacturing method of the probe socket structure provided by the present invention includes step S10: using a coating process to form a glue coating layer with a first thickness on the surface of a probe, step S20: forming a through hole on the base hole, and step S30: placing the probe with the adhesive layer into the through hole to fix the probe on the base.

請參閱圖3，其為本發明之探針插座結構1的製作流程示意圖。具體地，步驟S10還包括：在探針3上定義一鍍層範圍30，且該鍍層範圍30圍繞該探針3的表面，使該鍍膠層4延該鍍層範圍30向外徑向形成第一厚度T1，亦即，該鍍膠層4完整包覆對應於該鍍層範圍30的探針3的表面，其中該第一厚度T1為該探針3的該表面至該鍍膠層4的外表面的距離。較佳地，探針3可為圓柱體，其材料可為銅、金或其他具良好導電特性的金属或合金材料。此外，需要注意的是，在探針3的鍍層範圍30形成鍍膠層4所採用的鍍層工藝可為常規使用的鍍層工藝，包括但不限於一般電鍍、真空電鍍、化學氣相沉積法、物理氣相沉積法等。較佳地，本發明的鍍膠層4的材料為氧化鋁或其他非導電之介電材質，用以避免探針3在訊號傳輸的過程受到外界干擾影響。Please refer to FIG. 3 , which is a schematic diagram of the manufacturing process of the probe socket structure 1 of the present invention. Specifically, step S10 also includes: defining a coating range 30 on the probe 3, and the coating range 30 surrounds the surface of the probe 3, so that the glue coating layer 4 extends radially outward from the coating range 30 to form a first Thickness T1, that is, the glue-coated layer 4 completely covers the surface of the probe 3 corresponding to the coating range 30, wherein the first thickness T1 is from the surface of the probe 3 to the outer surface of the glue-coated layer 4 distance. Preferably, the probe 3 can be a cylinder, and its material can be copper, gold or other metals or alloy materials with good electrical conductivity. In addition, it should be noted that the coating process used to form the glue layer 4 in the coating range 30 of the probe 3 can be a conventionally used coating process, including but not limited to general electroplating, vacuum electroplating, chemical vapor deposition, physical vapor deposition, etc. Preferably, the material of the adhesive layer 4 of the present invention is aluminum oxide or other non-conductive dielectric materials, so as to prevent the probe 3 from being affected by external interference during signal transmission.

續請參閱圖3，在步驟S20中，利用製孔工藝在該座體2形成一通孔20，該通孔20穿透該座體2的上表面21及下表面22，其中該製孔工藝可通過鑽孔進行。較佳地，該座體2為鋁、銅或鎳之導電金屬材質所製，其作用為一種遮蔽層，以遮蔽外界訊號干擾，進一步確保探針3的訊號傳輸穩定。需要注意的是，該通孔20的徑向寬度需與該鍍膠層4的第一厚度T1搭配。具體地，該鍍膠層4的第一厚度T1小於該通孔20的孔徑，且該鍍膠層4的第二厚度T2，亦即，該鍍膠層4的外表面之間的徑向寬度等於或略大於該通孔20的孔徑。Please refer to FIG. 3 again. In step S20, a through hole 20 is formed in the base body 2 by a hole-making process, and the through hole 20 penetrates the upper surface 21 and the lower surface 22 of the base body 2, wherein the hole-making process can This is done by drilling. Preferably, the seat body 2 is made of conductive metal material such as aluminum, copper or nickel, which acts as a shielding layer to shield external signal interference and further ensure stable signal transmission of the probe 3 . It should be noted that the radial width of the through hole 20 needs to match the first thickness T1 of the adhesive layer 4 . Specifically, the first thickness T1 of the glue layer 4 is smaller than the diameter of the through hole 20, and the second thickness T2 of the glue layer 4, that is, the radial width between the outer surfaces of the glue layer 4 equal to or slightly larger than the diameter of the through hole 20 .

此外，如圖1所示，該鍍膠層4在一斷面方向A-A上的相對兩外側邊分別平行於該探針3及該通孔20在該斷面方向上的外側邊，以利後續組配。In addition, as shown in FIG. 1 , the opposite two outer sides of the adhesive layer 4 in a section direction A-A are respectively parallel to the outer sides of the probe 3 and the through hole 20 in the section direction, so that Benefit from the follow-up assembly.

續請參閱圖3，在完成步驟S10及步驟S20之後，該探針3與該鍍膠層4形成一件式物件，而該座體2形成另一件物件，兩者可分別在不同的產線完成。亦即，該座體形成該通孔的步驟與利用該鍍層工藝在該探針的表面形成具有該第一厚度的鍍膠層的步驟可同時進行。之後，將具有該鍍膠層4的探針3置入該座體2的通孔20，以固定該探針3及該鍍膠層4於該座體2。於此實施例中，該鍍膠層4與該座體2可採用緊配合的方式固定，但並不以此為限。本發明的探針插座結構1完成組裝後，該鍍膠層4的上表面41齊平於該座體2的上表面21，該鍍膠層4的下表面42齊平於該座體2的下表面22，使鍍膠層4與座體2之間具有良好的平坦度。Continue referring to FIG. 3 , after step S10 and step S20 are completed, the probe 3 and the glue layer 4 form a one-piece object, and the base body 2 forms another object, both of which can be produced in different line complete. That is, the step of forming the through hole on the seat body and the step of forming the glue layer with the first thickness on the surface of the probe by using the coating process can be performed simultaneously. Afterwards, the probe 3 with the glue layer 4 is inserted into the through hole 20 of the base body 2 to fix the probe 3 and the glue layer 4 on the base body 2 . In this embodiment, the adhesive layer 4 and the base body 2 can be fixed in a tightly fitting manner, but it is not limited thereto. After the probe socket structure 1 of the present invention is assembled, the upper surface 41 of the glue-coated layer 4 is flush with the upper surface 21 of the base body 2, and the lower surface 42 of the glue-coated layer 4 is flush with the bottom surface of the base body 2. The lower surface 22 ensures good flatness between the glue layer 4 and the base body 2 .

請參閱圖4，其為本發明之探針插座結構1的使用狀態示意圖。如圖4所示，該探針3的一端延伸出該鍍膠層4的上表面41並連接一測試系統5，另一端延伸出該鍍膠層4的下表面42形成至少一探測頭31，進而可對待測物6進行測試。Please refer to FIG. 4 , which is a schematic diagram of the use state of the probe socket structure 1 of the present invention. As shown in Figure 4, one end of the probe 3 extends out of the upper surface 41 of the glue-coated layer 4 and is connected to a test system 5, and the other end extends out of the lower surface 42 of the glue-coated layer 4 to form at least one probe head 31, Then the object 6 to be tested can be tested.

綜上所述，本發明利用鍍層工藝在探針的表面上形成鍍膠層，而不需在座體的通孔內灌膠，更不用在灌膠層上鑽孔植針，可有效簡化製程工序，並確保鍍膠層的平坦度及精密度，及鍍膠層與探針的緊密結合，進而達到良好的阻抗控制。此外，座體的鑽孔與探針的鍍膠層為分開單獨的製程，互不影響，可同時在不同生產線同時進行，有效降低時間成本及製作成本，進而提升產能及提高良率。據此，本發明的探針插座結構的製作方法有效解決傳統探針插座的製作方法存在先座體鑽孔後灌膠層鑽孔的工序無法分割、生產時間成本及製作成本高昂、製程方法阻抗控制不易及良率低的問題。To sum up, the present invention utilizes the plating process to form a glue-coated layer on the surface of the probe without pouring glue into the through hole of the seat body, let alone drilling holes and planting needles on the glue-filling layer, which can effectively simplify the manufacturing process , and ensure the flatness and precision of the glue layer, and the tight combination of the glue layer and the probe, so as to achieve good impedance control. In addition, the drilling of the seat body and the glue coating of the probe are separate and independent processes that do not affect each other. They can be carried out in different production lines at the same time, effectively reducing time costs and production costs, thereby increasing production capacity and improving yield. Accordingly, the manufacturing method of the probe socket structure of the present invention effectively solves the problems of the traditional probe socket manufacturing method that the process of first drilling the seat body and then drilling the glue layer cannot be divided, the production time cost and production cost are high, and the process resistance is high. Difficult control and low yield.

上述實施例用以說明本發明的技術思想，而並非用以限定本發明的技術思想，因此本發明的權利範圍並不限定於本實施例。本發明的保護範圍應由權利要求書解釋，應解釋為與上述保護範圍相同或等同的所有技術思想均包括在本發明的權利範圍內。The above embodiments are used to illustrate the technical ideas of the present invention, but not to limit the technical ideas of the present invention, so the scope of rights of the present invention is not limited to the embodiments. The protection scope of the present invention should be interpreted by the claims, and it should be interpreted that all technical ideas identical or equivalent to the above protection scope are included in the scope of the present invention.

1:探針插座結構1: Probe socket structure

2:座體2: seat body

20:通孔20: Through hole

21:上表面21: upper surface

22:下表面22: lower surface

3:探針3: Probe

30:鍍層範圍30: Coating range

31:探測頭31: probe head

4:鍍膠層4: Glue layer

41:上表面41: upper surface

42:下表面42: lower surface

5:測試系統5: Test system

6:待測物6: The object to be tested

S10,S20,S30:步驟S10, S20, S30: steps

T1:第一厚度T1: first thickness

T2:第二厚度T2: second thickness

圖1為本發明之探針插座結構的立體結構示意圖。 圖2為本發明之探針插座結構的製作方法流程圖。 圖3為本發明之探針插座結構的製作流程示意圖。 圖4為本發明之探針插座結構的使用狀態示意圖。 FIG. 1 is a schematic perspective view of the structure of the probe socket of the present invention. Fig. 2 is a flow chart of the manufacturing method of the probe socket structure of the present invention. 3 is a schematic diagram of the manufacturing process of the probe socket structure of the present invention. Fig. 4 is a schematic view of the use state of the probe socket structure of the present invention.

1:探針插座結構 1: Probe socket structure

2:座體 2: seat body

20:通孔 20: Through hole

21:上表面 21: upper surface

22:下表面 22: lower surface

3:探針 3: Probe

30:鍍層範圍 30: Coating range

4:鍍膠層 4: Glue layer

41:上表面 41: upper surface

42:下表面 42: lower surface

T1:第一厚度 T1: first thickness

T2:第二厚度 T2: second thickness

Claims (8)

一種探針插座結構的製作方法，包括：利用一鍍層工藝在一探針的表面形成具有第一厚度的鍍膠層；利用一製孔工藝在一座體上形成一通孔，使該座體具有一內表面，且該座體為導電金屬材質所製；及將具有該鍍膠層的探針置入該通孔，並使該鍍膠層的外表面接觸該座體的內表面，以固定該探針於該座體。 A method for manufacturing a probe socket structure, comprising: using a coating process to form a glue-plated layer with a first thickness on the surface of a probe; using a hole-making process to form a through hole on a base, so that the base has a inner surface, and the seat is made of conductive metal material; and the probe with the glue-coated layer is inserted into the through hole, and the outer surface of the glue-coated layer contacts the inner surface of the seat to fix the The probe is on the base. 如請求項1所述的探針插座結構的製作方法，其中該利用該鍍層工藝在該探針的表面形成具有該第一厚度的鍍膠層的步驟包括：在該探針上定義一鍍層範圍，且該鍍層範圍圍繞該探針的表面，使該鍍膠層延該鍍層範圍向外徑向形成該第一厚度。 The manufacturing method of the probe socket structure as claimed in item 1, wherein the step of forming a coating layer with the first thickness on the surface of the probe by using the coating process includes: defining a coating range on the probe , and the coating range surrounds the surface of the probe, so that the glue coating layer radially forms the first thickness outward along the coating range. 如請求項2所述的探針插座結構的製作方法，其中該鍍膠層的第一厚度小於該座體的通孔的孔徑。 The manufacturing method of the probe socket structure as claimed in claim 2, wherein the first thickness of the glue plating layer is smaller than the diameter of the through hole of the base body. 如請求項1所述的探針插座結構的製作方法，其中該鍍膠層在一斷面方向上的相對兩外側邊分別平行於該探針及該通孔在該斷面方向上的外側邊。 The manufacturing method of the probe socket structure as claimed in item 1, wherein the two opposite outer sides of the glue plating layer in a cross-sectional direction are respectively parallel to the outer sides of the probe and the through hole in the cross-sectional direction side. 如請求項1所述的探針插座結構的製作方法，其中該座體形成該通孔的步驟與利用該鍍層工藝在該探針的表面形成具有該第一厚度的鍍膠層的步驟同時進行。 The manufacturing method of the probe socket structure as claimed in item 1, wherein the step of forming the through hole on the base body and the step of forming the glue plating layer with the first thickness on the surface of the probe by using the plating process are performed simultaneously . 如請求項1所述的探針插座結構的製作方法，其中該探針、該鍍膠層及該座體同軸，且該鍍膠層的上表面齊平於該座體的上表面，該鍍膠層的下表面齊平於該座體的下表面。 The manufacturing method of the probe socket structure as claimed in item 1, wherein the probe, the glue layer and the base are coaxial, and the upper surface of the glue layer is flush with the upper surface of the base, and the plated The lower surface of the adhesive layer is flush with the lower surface of the base. 如請求項1所述的探針插座結構的製作方法，其中該座體為鋁、銅或鎳之導電金屬材質所製。 The manufacturing method of the probe socket structure as claimed in item 1, wherein the socket body is made of conductive metal material such as aluminum, copper or nickel. 如請求項1所述的探針插座結構的製作方法，其中該鍍膠層的材料為非導電之介電材質。The manufacturing method of the probe socket structure as claimed in item 1, wherein the material of the glue plating layer is a non-conductive dielectric material.
TW111116108A 2022-04-27 2022-04-27 Method of fabricating probe socket structure TWI806575B (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1607749A2 (en) * 2004-06-17 2005-12-21 Aries Electronics, Inc Test probe assembly for IC chips
TW201839407A (en) * 2017-04-21 2018-11-01 南韓商李諾工業股份有限公司 Probe socket
TWI676803B (en) * 2017-11-07 2019-11-11 南韓商李諾工業股份有限公司 Test probe assembly, test socket and method of manufacturing a test probe assembly
TWM613325U (en) * 2021-03-16 2021-06-11 倢通科技股份有限公司 Microwave probe contact structure
TWM620750U (en) * 2021-08-31 2021-12-01 范劉文玲 Pogo pin

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1607749A2 (en) * 2004-06-17 2005-12-21 Aries Electronics, Inc Test probe assembly for IC chips
TW201839407A (en) * 2017-04-21 2018-11-01 南韓商李諾工業股份有限公司 Probe socket
TWI676803B (en) * 2017-11-07 2019-11-11 南韓商李諾工業股份有限公司 Test probe assembly, test socket and method of manufacturing a test probe assembly
TWM613325U (en) * 2021-03-16 2021-06-11 倢通科技股份有限公司 Microwave probe contact structure
TWM620750U (en) * 2021-08-31 2021-12-01 范劉文玲 Pogo pin

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