CN116203293B - High-frequency coaxial probe tower and test probe hole - Google Patents
High-frequency coaxial probe tower and test probe hole Download PDFInfo
- Publication number
- CN116203293B CN116203293B CN202310486753.7A CN202310486753A CN116203293B CN 116203293 B CN116203293 B CN 116203293B CN 202310486753 A CN202310486753 A CN 202310486753A CN 116203293 B CN116203293 B CN 116203293B
- Authority
- CN
- China
- Prior art keywords
- probe
- hole
- test probe
- coaxial
- diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000523 sample Substances 0.000 title claims abstract description 246
- 238000012360 testing method Methods 0.000 title claims abstract description 126
- 229910052751 metal Inorganic materials 0.000 claims abstract description 59
- 239000002184 metal Substances 0.000 claims abstract description 58
- 239000011810 insulating material Substances 0.000 claims abstract description 53
- 230000008054 signal transmission Effects 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims description 12
- 230000000149 penetrating effect Effects 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 229910000838 Al alloy Inorganic materials 0.000 claims description 6
- 238000013461 design Methods 0.000 claims description 4
- 230000006978 adaptation Effects 0.000 claims description 3
- 229920006351 engineering plastic Polymers 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims 1
- 230000001105 regulatory effect Effects 0.000 abstract description 4
- 239000004020 conductor Substances 0.000 abstract description 3
- 238000009421 internal insulation Methods 0.000 abstract description 3
- 238000003780 insertion Methods 0.000 description 10
- 230000037431 insertion Effects 0.000 description 10
- 230000005540 biological transmission Effects 0.000 description 8
- 239000000956 alloy Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention relates to a high-frequency coaxial probe tower and a probe pinhole. After the coaxial module of the high-frequency coaxial probe tower is filled with the test probe, the test probe serves as a conductor, air in the metal shielding needle-filling shell and an insulating material in the metal shielding cover plate form internal insulation, and the metal shielding needle-filling shell serves as a shielding layer to form a coaxial structure. The metal shielding cover plate and the metal shielding needle-mounting shell can be respectively regulated and controlled to ensure that the impedance values are consistent. And when the high-frequency coaxial probe tower works, the test probe is compressed into the coaxial module, and the impedance values of all parts of the test probe are consistent when the test probe works, so that the signal transmission of high-speed, low-loss and high-signal shielding is greatly improved.
Description
Technical Field
The invention relates to the technical field of chip testing, in particular to a high-frequency coaxial probe tower and a testing probe pinhole.
Background
The probe tower is a connector for signal transmission between tested equipment and a probe card in a chip testing machine, along with development of scientific technology, corresponding traditional chip testing cannot meet the testing requirements of chips on high speed and low loss, corresponding high-speed testing basically requires bandwidth loss, impedance connection and signal shielding, and the probe tower of the traditional testing machine cannot meet the requirements of the testing technology corresponding to the technical innovation of signal transmission, namely the signal transmission rate of the traditional testing probe tower is lower, and cannot meet the requirements of the testing technology corresponding to high-speed signal transmission.
Patent TW097131866 discloses a probe tower and a manufacturing method thereof, wherein a grounding probe is directly tightly embedded into a probe tower body, and by setting different test areas of the probe tower to be made of different materials, the capability of the probe tower for processing stray signals is improved, and meanwhile, the impedance matching among the probe tower, tested equipment and a probe card is realized. To avoid signal loss and distortion, high-speed signals need to be transmitted with a standard impedance. In this patent design, an insulating spacer ring is used to isolate the test probe from the probe tower body, and as can be seen in FIG. 1, the spacer ring protrudes from the cover plate so that the test probe tip is exposed. The exposed portion of the needle cannot be impedance matched with the main portion of the probe disposed in the circular body, and the impedance of the probe is discontinuous, thereby causing reflection and loss of signal transmission, and loss and distortion of the signal transmitted on the probe.
Disclosure of Invention
In order to solve the technical problems, the invention provides a high-frequency coaxial probe tower and a probe pinhole.
A high frequency coaxial probe tower comprising:
frame, test probe and method of manufacturing the same
The coaxial module is positioned in the frame and sequentially comprises the following components from top to bottom:
the first metal shielding cover plate is provided with a plurality of first holes, hollow insulating materials are filled in the first holes, the insulating materials are arranged in a stepped shape, the upper thickness of the insulating materials is larger than the lower thickness of the insulating materials, and the hollow parts of the insulating materials are first probe holes;
the metal shielding needle-mounting shell is provided with a plurality of second probe holes, and the second probe holes are through holes penetrating through the metal shielding needle-mounting shell;
the second metal shielding cover plate is provided with a plurality of second holes, hollow insulating materials are filled in the second holes, the insulating materials are arranged in a stepped shape, the upper thickness of the insulating materials is smaller than the lower thickness of the insulating materials, and the hollow parts of the insulating materials are third probe holes;
the first probe hole, the second probe hole and the third probe hole are coaxially arranged to form a test probe hole penetrating through the coaxial module; the test probe penetrates through the test probe pin hole and is fixed by the insulating material, and the test probe is blocked from the metal shielding needle mounting shell by air; when the high-frequency coaxial probe tower works, the test probe is compressed into the coaxial module, and the impedance value of a signal transmitted on the test probe is consistent by adjusting the thickness of the insulating material and the thickness of the air.
Preferably, the test probe is assembled in a coaxial module comprising a diameter r 1 And a probe tip of diameter r 2 Is a probe needle tube; the insulating material positioned in the first hole comprises a first step and a second step, and the insulating material positioned in the second hole comprises a third step and a fourth step; the first step and the third step part are used for accommodating the probe needle, and the second step and the fourth step part are used for accommodating the probe needle tube.
Preferably, the thickness of the first step is d 1 The thickness of the second step part is d 2 The first hole diameter is R 1 The method comprises the following steps: r is (r) 1 =R 1 -2d 1 ,r 2 =R 1 -2d 2 The method comprises the steps of carrying out a first treatment on the surface of the The thickness of the third step part is d 3 The thickness of the fourth step part is d 4 The third hole diameter is R 3 The method comprises the following steps: r is (r) 1 =R 3 -2d 3 ,r 2 =R 3 -2d 4 The method comprises the steps of carrying out a first treatment on the surface of the The diameter R of the second probe hole 2 Is larger than the diameter r of the probe needle tube 2 。
Preferably, the metal shielding needle housing comprises a first needle housing component and a second needle housing component, and the first needle housing component and the second needle housing component are stacked up and down to form the metal shielding needle housing.
Preferably, the coaxial module further comprises a probe positioning plate, the probe positioning plate is arranged between the first metal shielding cover plate and the first needle mounting shell assembly, a fourth probe hole corresponding to the first metal shielding cover plate and the first needle mounting shell assembly is arranged on the probe positioning plate, and the fourth probe hole is formed in the probe positioning plateDiameter R of four probe holes 4 Diameter r with the probe needle tube 2 Adaptations, i.e. R 4 =r 2 。
Preferably, the coaxial module is made of 7-series aluminum alloy material with high strength and conductivity, and comprises: aviation aluminum alloy AL7075-T651.
Preferably, the coaxial module further comprises a ground probe hole, the ground probe hole penetrates through the coaxial module, a ground probe is arranged in the ground probe hole, and the ground probe is embedded into the ground probe hole in a tight fit mode and is electrically conducted with a metal part of the coaxial module.
Preferably, the high-frequency coaxial probe tower further comprises a common module placed in the frame, and the common module is made of engineering plastic materials and is used for being connected with a common signal transmission area.
The utility model provides a test probe hole, test probe hole is coaxial design, is applicable to the coaxial module of high frequency coaxial probe tower, test probe hole main part sets up to the through-hole, and its both ends set up to be close to the diameter of one side of test probe hole main part is greater than and is close to the echelonment of one side of test probe hole terminal point.
Preferably, the diameter of the main body part of the test probe hole is larger than the diameter of the needle tube of the test probe arranged in the test probe hole, the diameter of one side of the two ends of the test probe needle hole, which is close to the main body of the test probe hole, is equal to the diameter of the needle tube of the test probe arranged in the test probe hole, and the diameter of one side of the two ends of the test probe needle hole, which is close to the end point of the test probe hole, is equal to the diameter of the needle head of the test probe arranged in the test probe hole.
Compared with the prior art, the technical scheme of the invention has the following advantages:
after the coaxial module of the high-frequency coaxial probe tower is filled with the test probe, the test probe serves as a conductor, air in the metal shielding needle-filling shell and an insulating material in the metal shielding cover plate form internal insulation, and the metal shell serves as a shielding layer to form a coaxial structure. The metal shielding cover plate and the metal shielding needle-mounting shell can be respectively regulated and controlled to ensure that the impedance values are consistent. And when the high-frequency coaxial probe tower works, the test probe is compressed into the coaxial module, and the impedance values of all parts of the test probe are consistent when the test probe works by adjusting the thickness of the insulating material and the air, so that the signal transmission of high speed, low loss and high signal shielding is greatly improved.
Drawings
In order that the invention may be more readily understood, a more particular description of the invention will be rendered by reference to specific embodiments thereof that are illustrated in the appended drawings.
Fig. 1 is a cross-sectional view of patent TW 097131866.
Fig. 2 is a schematic diagram of a high frequency coaxial probe tower of the present invention.
Fig. 3 is an exploded view of the high frequency coaxial probe tower of the present invention.
Fig. 4 is a cross-sectional view of a high frequency coaxial probe tower of the present invention.
Fig. 5 is an enlarged view of the coaxial module of the present invention.
Fig. 6 is a graph comparing characteristic impedance of the coaxial module of the present invention with that of the prior art.
Fig. 7 is a graph comparing the insertion loss of the coaxial module of the present invention with that of the prior art.
Fig. 8 is a graph comparing the return loss of the coaxial module of the present invention with that of the prior art.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and specific examples, which are not intended to be limiting, so that those skilled in the art will better understand the invention and practice it.
As shown in fig. 2 to 4, the high frequency coaxial probe tower of the present invention includes: the frame 1, the coaxial module 3 and the test probe 2, wherein fig. 4 shows only one test probe pin hole by way of example.
The test probe 2 is fitted in a coaxial module 3 for signal transmission, comprising a diameter r 1 And a probe tip of diameter r 2 Is a probe needle tube;
the coaxial module 3 is located in the frame 1, as shown in fig. 5, and includes, in order from top to bottom:
the first metal shielding cover plate 301 is provided with a plurality of first holes, the first holes are filled with hollow insulating materials 305, the insulating materials 305 are arranged in a step shape, the upper thickness of the insulating materials is larger than the lower thickness of the insulating materials, and the hollow parts of the insulating materials are first probe holes;
a metal shielding needle housing 303, wherein a plurality of second probe holes are arranged on the metal shielding needle housing 303, and the second probe holes are through holes penetrating through the metal shielding needle housing 303;
a second metal shielding cover plate 304, wherein a plurality of second holes are formed in the second metal shielding cover plate 304, hollow insulating materials 305 are filled in the second holes, the insulating materials 305 are arranged in a stepped shape, the upper thickness of the insulating materials is smaller than the lower thickness of the insulating materials, and the hollow parts of the insulating materials are third probe holes;
the first probe hole, the second probe hole and the third probe hole are coaxially arranged to form a testing probe hole penetrating through the coaxial module 3; the test probe 2 is arranged in the test probe pin hole in a penetrating way and is fixed by the insulating material 305, and the test probe and the metal shielding needle mounting shell are blocked by air; when the high-frequency coaxial probe tower works, the test probe 2 is compressed into the coaxial module 3, so that the impedance value of a signal transmitted on the test probe 2 is consistent.
In a specific embodiment, the insulating material forms the first probe hole and the first probe hole by means of glue filling and then punching. The insulating material is a material with low dielectric constant and loss tangent value, and has good material fluidity, thereby being beneficial to glue filling molding.
In a specific embodiment, the first hole diameter on the first metal shielding cover plate 301 is R 1 The insulating material 305 is used to block the test probe 2 from the first metal shielding cover 301. The insulating material 305 in the first hole includes a first step for receiving a probe tip and a second step for receiving a probe needle cannula. The thickness of the first step is d 1 The thickness of the second stepped portion is d 2 . Specifically, the test probe 2, the insulating material 305, and the first hole size relationship are: r is (r) 1 =R 1 -2d 1 ,r 2 =R 1 -2d 2 . The first hole diameter R is typically designed according to the selected size of the test probe 2 1 And the impedance value of the portion of the test probe 2 located in the first hole can be controlled by changing the thickness distribution of the insulating material 305 according to the above relation.
In a specific embodiment, the second probe well diameter R 2 Is larger than the diameter r of the needle tube of the test probe 2 2 I.e. R 2 >r 2 The method comprises the steps of carrying out a first treatment on the surface of the At this time, there is an air barrier between the test probe 2 and the metal shielding pin housing 303. By designing the second probe hole diameter R 2 The impedance value of the part of the test probe 2 positioned in the second probe hole can be regulated and controlled by changing the thickness of the air barrier part.
In the above embodiment, the coaxial module 3 is made of a 7-series aluminum alloy material with high strength and conductivity, and includes: aviation aluminum alloy AL7075-T651. Because the metal shielding needle housing 303 has a relatively high height, the manufacturing of the through hole in the material requires extremely high process conditions, and in order to optimize the process requirements, the metal shielding needle housing 303 may be divided into a first needle housing assembly 3031 and a second needle housing assembly 3032, and the first needle housing assembly 3031 and the second needle housing assembly 3032 are stacked up and down to form the metal shielding needle housing 303.
In a specific embodiment, the second hole diameter on the second metal shielding cover 304 is R 3 The insulating material 305 is used to block the test probe 2 from the second metal shielding cover 304. The insulating material 305 in the second hole includes a third step portion for receiving a probe tip and a fourth step portion for receiving a probe needle. The thickness of the third step part is d 3 The thickness of the fourth step part is d 4 . Specifically, the test probe 2, the insulating material 305, and the second hole size relationship are: r is (r) 1 =R 3 -2d 3 ,r 2 =R 3 -2d 4 . The second hole diameter R is typically designed according to the selected size of the test probe 2 3 And the impedance value of the portion of the test probe 2 located in the second hole can be controlled by changing the thickness distribution of the insulating material 305 according to the above relation.
In a specific embodiment, when the impedance matching is performed on the coaxial module, the impedance calculation formula is as follows: 59.9586 ×ln (R) i /r j )/sqrt(ε k ) Wherein Z is an impedance value, R i For the external medium thickness, r j Is of thickness R i The diameter of the test probe at the corresponding location of the medium,ε k is the effective dielectric constant of the medium. As can be seen from the above, the impedance value is related to the external dielectric thickness, the diameter of the test probe, and the effective dielectric constant of the ring, so that the impedance matching can be achieved by adjusting the dielectric thickness according to the dielectric in the first metallic shielding cover plate 301, the metallic shielding needle housing 303, and the second metallic shielding cover plate 304, respectively.
The coaxial module 3 after the test probe 2 is installed is equivalent to that the test probe 2 acts as a conductor, the air in the metal shielding needle housing 303 and the insulating material 305 in the first metal shielding cover plate 301 and the second metal shielding cover plate 304 form internal insulation, and the metal shielding needle housing 303 is used as a shielding layer to form a coaxial structure. In order to achieve the purpose of impedance matching, the first metal shielding cover plate 301, the second metal shielding cover plate 304 and the metal shielding needle housing 303 can be respectively regulated and controlled to have identical impedance values, so that the impedance values of all parts of the test probe 2 are identical when the test probe works, and the signal transmission of high-speed, low-loss and high-signal shielding is greatly improved.
In a preferred embodiment, the coaxial module 3 further comprises a probe positioning plate 302 for fixing the test probes 2 and for positioning when the first metallic shielding cover plate 301 is covered. The probe positioning plate 302 is disposed between the first metal shielding cover plate 301 and the first needle housing assembly 3031, and corresponds to the first metal shielding cover plate 301 and the first needle housing assembly 3031A fourth probe well diameter R of 4 Diameter r with the probe needle tube 2 Adaptations, i.e. R 4 =r 2 . In a specific embodiment, the step of mounting the test probe 2 on the coaxial module 3 comprises: a second metal shielding cover plate 304, the metal shielding needle-holding shell 303 and the probe positioning plate 302 are placed in the frame 1, and after the test probe 2 is placed, the first metal shielding cover plate 301 is covered.
Preferably, when manufacturing the coaxial module 3, a plurality of probe holes for inserting the test probes 2 need to be manufactured on a metal or alloy material with high strength and conductivity, and when the area of the metal plate is too large, the surface of the metal plate is deformed due to the through probe holes, and the coaxial module 3 needs to be divided into a plurality of coaxial assemblies by the process limitation, wherein each coaxial assembly comprises a first metal shielding cover plate 301, a metal shielding needle housing 303, a second metal shielding cover plate 304 and a probe positioning plate 302.
When the high-frequency coaxial probe tower is in a working state, the upper surface of the coaxial module 3 is in contact with the first test plate, the lower surface of the coaxial module is in contact with the second test plate, and the needle heads of the test probes 2 are compressed into the coaxial module 3. At this time, the impedance value of the transmission signal on the test probe 2 is uniform, thereby avoiding distortion and loss of the transmission signal.
In a preferred embodiment, the coaxial module 3 further comprises a ground probe hole penetrating the coaxial module 3, wherein a ground probe is arranged in the ground probe hole, and the ground probe is embedded in the ground probe hole in a tight fit manner and is electrically connected with the metal component of the coaxial module 3. The arrangement can make the interference signal and leakage current of the test probe 2 grounded, so that the capability of the high-frequency coaxial probe tower for processing the interference signal and the leakage current is improved.
In an alternative embodiment, the high-frequency coaxial probe tower further comprises a common module 4 placed in the frame 1, wherein the common module 4 is made of engineering plastic material and is used for connecting with a common signal transmission area; the high-frequency coaxial probe tower can meet the requirement of simultaneous transmission of high-frequency signals and low-frequency signals.
As shown in fig. 5, the present invention further provides a test probe hole, wherein the test probe hole is of a coaxial design, the test probe hole body is provided with a through hole, and two ends of the test probe hole body are provided with a step shape, wherein the diameter of one side close to the test probe hole body is larger than that of one side close to the end point of the test probe hole. In a preferred embodiment, the diameter of the main body of the test probe hole is larger than the diameter of the needle tube of the test probe arranged in the test probe hole, the diameter of one side of the two ends of the test probe needle hole close to the main body of the test probe hole is equal to the diameter of the needle tube of the test probe arranged in the test probe hole, and the diameter of one side of the two ends of the test probe needle hole close to the end point of the test probe hole is equal to the diameter of the needle head of the test probe arranged in the test probe hole.
It should be noted that in the present invention, the machining precision in actual production is considered, and in order to avoid the problem of difficult needle mounting caused by too strict size, the inner diameter of the probe needle hole is slightly larger than the theoretical size in actual production.
In a specific embodiment, the prior art signal transmission effect and the present invention provide a coaxial module 3 transmission effect, as shown in fig. 6-8. Through comparison result analysis, the prior art can only support transmission of MHz-GHz bandwidth signals, and the scheme can support transmission of 10GHz signals.
Fig. 6 is a graph comparing the characteristic impedance of the coaxial module 3 of the present invention with the characteristic impedance of the prior art, with a tolerance range of 10% for a characteristic impedance of 45ohm matching. Curve 61 is a characteristic impedance curve of the prior art and curve 62 is a characteristic impedance curve of the coaxial module 3 of the present invention. The maximum value of the characteristic impedance of the prior art corresponds to the position of the channel corresponding to the probe of the upper cover plate, and the second impedance high point corresponds to the probe of the upper cover plate. The maximum value of the characteristic impedance is 65ohm, which is out of the tolerance range by 10 percent; the characteristic impedance of the inventive coaxial module 3 has a maximum value of 47ohm, within a tolerance range of 10%, a specific value of 5% of the target characteristic impedance. And it can be seen from fig. 6 that the characteristic impedance continuity of the coaxial module 3 of the present invention is significantly better than the prior art.
Fig. 7 is a graph comparing the insertion loss of the coaxial module 3 of the present invention with that of the prior art, and using the insertion loss of-1 dB as an index. Curve 71 is a prior art insertion loss curve and curve 72 is an insertion loss curve for the coaxial module 3 of the present invention. The insertion loss caused by the discontinuity of impedance in the prior art is up to-1 dB when the signal of 2.72GHz is transmitted, namely, the insertion loss is larger when the signal is transmitted with the signal bandwidth of more than 2.72 GHz; the coaxial module 3 can support the transmission of 9.99GHz signal bandwidth on the premise of taking the insertion loss as an index of-1 dB, namely, the coaxial module can support the requirement of higher bandwidth signal transmission. And it can be seen from fig. 7 that the insertion loss of the inventive coaxial module 3 is still better than the prior art solution over a broad frequency range.
Fig. 8 is a graph comparing the return loss of the coaxial module 3 of the present invention with that of the prior art, and the return loss is-10 dB. Curve 81 is a prior art return loss curve and curve 82 is a coaxial module 3 return loss curve of the present invention. In the prior art, the return loss caused by the discontinuity of impedance reaches-10 dB when a signal of 2.46GHz is transmitted, namely, the return loss is larger when the signal is transmitted with the signal bandwidth of more than 2.46 GHz; the coaxial module 3 can support the transmission of 9.99GHz signal bandwidth on the premise of taking the return loss as an index of-10 dB and the insertion loss as an index of-1 dB, namely, the coaxial module can support the requirement of higher bandwidth signal transmission. And it can be seen from fig. 8 that the return loss of the inventive coaxial module 3 is still better than in the prior art solution over a broad frequency range.
The embodiment is limited. Other variations and modifications of the present invention will be apparent to those of ordinary skill in the art in light of the foregoing description. It is not necessary here nor is it exhaustive of all embodiments. And obvious variations or modifications thereof are contemplated as falling within the scope of the present invention.
Claims (10)
1. A high frequency coaxial probe tower comprising:
frame, test probe and method of manufacturing the same
The coaxial module is positioned in the frame and sequentially comprises the following components from top to bottom:
the first metal shielding cover plate is provided with a plurality of first holes, hollow insulating materials are filled in the first holes, the insulating materials are arranged in a stepped shape, the upper thickness of the insulating materials is larger than the lower thickness of the insulating materials, and the hollow parts of the insulating materials are first probe holes;
the metal shielding needle-mounting shell is provided with a plurality of second probe holes, and the second probe holes are through holes penetrating through the metal shielding needle-mounting shell;
the second metal shielding cover plate is provided with a plurality of second holes, hollow insulating materials are filled in the second holes, the insulating materials are arranged in a stepped shape, the upper thickness of the insulating materials is smaller than the lower thickness of the insulating materials, and the hollow parts of the insulating materials are third probe holes;
the first probe hole, the second probe hole and the third probe hole are coaxially arranged to form a test probe hole penetrating through the coaxial module; the test probe penetrates through the test probe pin hole and is fixed by the insulating material, and the test probe is blocked from the metal shielding needle mounting shell by air; when the high-frequency coaxial probe tower works, the test probe is compressed into the coaxial module, and the impedance value of a signal transmitted on the test probe is consistent by adjusting the thickness of the insulating material and the thickness of the air.
2. The high frequency coaxial probe tower of claim 1, wherein the test probe is assembled in a coaxial module comprising a diameter r 1 And a probe tip of diameter r 2 Is a probe needle tube; the insulating material positioned in the first hole comprises a first step and a second step, and the insulating material positioned in the second hole comprises a third step and a fourth step; the first step and the third step part are used for accommodating the probe needle, and the second step and the fourth step part are used for accommodating the probe needle tube.
3. The high frequency coaxial probe tower of claim 2, wherein the first step has a thickness d 1 The thickness of the second step part is d 2 The first hole diameter is R 1 The method comprises the following steps: r is (r) 1 =R 1 -2d 1 ,r 2 =R 1 -2d 2 The method comprises the steps of carrying out a first treatment on the surface of the The thickness of the third step part is d 3 The thickness of the fourth step part is d 4 The third hole diameter is R 3 The method comprises the following steps: r is (r) 1 =R 3 -2d 3 ,r 2 =R 3 -2d 4 The method comprises the steps of carrying out a first treatment on the surface of the The diameter R of the second probe hole 2 Is larger than the diameter r of the probe needle tube 2 。
4. The high frequency coaxial probe tower of claim 2, wherein the metallic shielding needle housing comprises a first needle housing assembly and a second needle housing assembly, the first needle housing assembly and the second needle housing assembly being stacked one above the other to form the metallic shielding needle housing.
5. The high frequency coaxial probe tower of claim 4, wherein the coaxial module further comprises a probe positioning plate disposed between the first metallic shield cover plate and the first needle housing assembly, having disposed thereon a fourth probe aperture corresponding to the first metallic shield cover plate, the first needle housing assembly, the fourth probe aperture diameter R 4 Diameter r with the probe needle tube 2 Adaptations, i.e. R 4 =r 2 。
6. The high-frequency coaxial probe tower according to claim 1, wherein the coaxial module is made of 7-series aluminum alloy with high strength and conductivity, and comprises: aviation aluminum alloy AL7075-T651.
7. The high frequency coaxial probe tower of claim 1, wherein the coaxial module further comprises a ground probe hole extending through the coaxial module, a ground probe disposed within the ground probe hole, the ground probe being closely received within the ground probe hole and in electrical communication with the coaxial module hardware.
8. The high frequency coaxial probe tower of claim 1, further comprising a common module disposed within the frame, the common module being of engineering plastic material for connection to a common signal transmission area.
9. The utility model provides a test probe hole, its characterized in that, test probe hole is coaxial design, is applicable to the coaxial module of high frequency coaxial probe tower, test probe hole main part sets up to the through-hole, and its both ends set up to be close to the diameter of one side of test probe hole main part is greater than and is close to the echelonment of one side of test probe hole tip.
10. The test probe pin hole according to claim 9, wherein the diameter of the main body of the test probe hole is larger than the diameter of the needle tube of the test probe which is arranged in the test probe hole, the diameter of one side of the two ends of the test probe pin hole close to the main body of the test probe hole is equal to the diameter of the needle tube of the test probe which is arranged in the test probe hole, and the diameter of one side of the two ends of the test probe pin hole close to the end point of the test probe hole is equal to the diameter of the needle head of the test probe which is arranged in the test probe hole.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202310486753.7A CN116203293B (en) | 2023-05-04 | 2023-05-04 | High-frequency coaxial probe tower and test probe hole |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202310486753.7A CN116203293B (en) | 2023-05-04 | 2023-05-04 | High-frequency coaxial probe tower and test probe hole |
Publications (2)
Publication Number | Publication Date |
---|---|
CN116203293A CN116203293A (en) | 2023-06-02 |
CN116203293B true CN116203293B (en) | 2023-07-14 |
Family
ID=86508045
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202310486753.7A Active CN116203293B (en) | 2023-05-04 | 2023-05-04 | High-frequency coaxial probe tower and test probe hole |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN116203293B (en) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4731577A (en) * | 1987-03-05 | 1988-03-15 | Logan John K | Coaxial probe card |
CN204302321U (en) * | 2014-12-02 | 2015-04-29 | 上海韬盛电子科技有限公司 | Be applicable to the chip testing socket of high-frequency test |
CN110247218A (en) * | 2019-07-03 | 2019-09-17 | 法特迪精密科技(苏州)有限公司 | A kind of hyperfrequency socket for inspection suitable for integrated circuit |
CN215933995U (en) * | 2021-09-02 | 2022-03-01 | 法特迪精密科技(苏州)有限公司 | Coaxial connector |
-
2023
- 2023-05-04 CN CN202310486753.7A patent/CN116203293B/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN116203293A (en) | 2023-06-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5565788A (en) | Coaxial wafer probe with tip shielding | |
CN109921164B (en) | Non-contact ridge waveguide microstrip coupling slit probe transition circuit | |
CN108711665A (en) | Rectangular waveguide micro-strip hermetic seal transition circuit | |
US10234479B2 (en) | Resonance suppression structure of a wideband near-field magnetic probe and a construction method thereof | |
JP2010175371A (en) | Inspection socket | |
CN110676551B (en) | Microstrip coaxial conversion structure with air cavity and interconnection method thereof | |
CN111430850B (en) | Coaxial microstrip-to-coaxial connector applicable to cavity filter and assembling method | |
TW202229889A (en) | Hybrid shielding sockets with impedance tuning for integrated circuit device test tooling | |
CN102288826B (en) | Impedance probe head with two-in-one characteristic | |
US7053640B2 (en) | System and method for providing high RF signal isolation and low common ground inductance in an RF circuit testing environment | |
CN116203293B (en) | High-frequency coaxial probe tower and test probe hole | |
CN113078521B (en) | Switching device for testing integrity of Gbit-level high-speed bus signals | |
CN112433098A (en) | Self-correcting radio frequency fuzz button high-frequency performance testing tool and testing method | |
CN216117715U (en) | Chip testing seat | |
CN216698694U (en) | Millimeter wave waveguide coaxial microstrip conversion structure | |
CN105891261A (en) | Plating material passive intermodulation online testing device based on dual-mode transmission line structures | |
CN211829444U (en) | High-density chip packaging box | |
Jakob et al. | WR12 to planar transmission line transition on organic substrate | |
CN211297130U (en) | Auxiliary test circuit board | |
CN113466588B (en) | Transverse electromagnetic wave chamber | |
CN213275778U (en) | Millimeter wave ceramic antenna test step PCB device | |
CN217034095U (en) | Special impedance radio frequency test probe | |
KR102251907B1 (en) | Board mounting coaxial connector | |
CN214201601U (en) | Self-correcting radio frequency fuzz button high-frequency performance testing tool | |
CN216389679U (en) | Waveguide CPW transition conversion device suitable for submillimeter wave frequency band |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address |
Address after: No. 200 Xingpu Road, Industrial Park, Suzhou City, Jiangsu Province, 215000, 5 # 101, 102, 201, 202 Patentee after: Suzhou Fatedi Technology Co.,Ltd. Country or region after: China Address before: No. 200 Xingpu Road, Industrial Park, Suzhou City, Jiangsu Province, 215000, 5 # 101, 102, 201, 202 Patentee before: FTDEVICE TECHNOLOGY (SUZHOU) CO.,LTD. Country or region before: China |
|
CP03 | Change of name, title or address |