TWI802226B - 表面處理銅箔、覆銅積層板及印刷配線板 - Google Patents

表面處理銅箔、覆銅積層板及印刷配線板 Download PDF

Info

Publication number: TWI802226B
Authority: TW; Taiwan
Prior art keywords: copper foil; treatment layer; treated; vmp; treated copper
Prior art date: 2021-07-09

Application number

TW111101712A

Other languages

English (en)

Chinese (zh)

Other versions

TW202304264A (zh

Inventor

松岡佑樹

岩沢翔平

五刀郁浩

中島誓哉

三木敦史

Original Assignee

日商Ｊｘ金屬股份有限公司

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2021-07-09

Filing date

2022-01-14

Publication date

2023-05-11

2022-01-14 Application filed by 日商Ｊｘ金屬股份有限公司 filed Critical 日商Ｊｘ金屬股份有限公司

2023-01-16 Publication of TW202304264A publication Critical patent/TW202304264A/zh

2023-05-11 Application granted granted Critical

2023-05-11 Publication of TWI802226B publication Critical patent/TWI802226B/zh

Links

RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 166
239000011889 copper foil Substances 0.000 title claims abstract description 151
239000010949 copper Substances 0.000 title description 23
229910052802 copper Inorganic materials 0.000 title description 15
239000010410 layer Substances 0.000 claims abstract description 111
239000002335 surface treatment layer Substances 0.000 claims abstract description 77
239000011347 resin Substances 0.000 claims description 58
229920005989 resin Polymers 0.000 claims description 58
238000007788 roughening Methods 0.000 claims description 33
239000000463 material Substances 0.000 claims description 31
238000005530 etching Methods 0.000 claims description 5
230000008859 change Effects 0.000 abstract description 12
239000002245 particle Substances 0.000 description 72
239000000758 substrate Substances 0.000 description 36
ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 35
239000000243 solution Substances 0.000 description 35
238000007747 plating Methods 0.000 description 34
238000005259 measurement Methods 0.000 description 33
238000009713 electroplating Methods 0.000 description 29
230000015572 biosynthetic process Effects 0.000 description 28
238000009826 distribution Methods 0.000 description 19
238000000034 method Methods 0.000 description 17
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 16
239000007787 solid Substances 0.000 description 16
239000000203 mixture Substances 0.000 description 15
BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 14
239000006087 Silane Coupling Agent Substances 0.000 description 14
230000008878 coupling Effects 0.000 description 14
238000010168 coupling process Methods 0.000 description 14
238000005859 coupling reaction Methods 0.000 description 14
229910000077 silane Inorganic materials 0.000 description 14
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
239000011701 zinc Substances 0.000 description 11
229910018605 Ni—Zn Inorganic materials 0.000 description 9
239000011362 coarse particle Substances 0.000 description 9
230000000052 comparative effect Effects 0.000 description 8
230000000694 effects Effects 0.000 description 8
239000003921 oil Substances 0.000 description 8
239000000853 adhesive Substances 0.000 description 7
230000001070 adhesive effect Effects 0.000 description 7
WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 7
229910052721 tungsten Inorganic materials 0.000 description 7
239000010937 tungsten Substances 0.000 description 7
WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 6
229910045601 alloy Inorganic materials 0.000 description 6
239000000956 alloy Substances 0.000 description 6
230000005540 biological transmission Effects 0.000 description 6
239000011651 chromium Substances 0.000 description 6
239000011247 coating layer Substances 0.000 description 6
239000004020 conductor Substances 0.000 description 6
229920001721 polyimide Polymers 0.000 description 6
230000003746 surface roughness Effects 0.000 description 6
150000003658 tungsten compounds Chemical class 0.000 description 6
229910000881 Cu alloy Inorganic materials 0.000 description 5
HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 5
229910052759 nickel Inorganic materials 0.000 description 5
229910052725 zinc Inorganic materials 0.000 description 5
XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
239000007864 aqueous solution Substances 0.000 description 4
229910017052 cobalt Inorganic materials 0.000 description 4
239000010941 cobalt Substances 0.000 description 4
GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 4
239000000470 constituent Substances 0.000 description 4
238000005868 electrolysis reaction Methods 0.000 description 4
239000003822 epoxy resin Substances 0.000 description 4
238000011156 evaluation Methods 0.000 description 4
239000011888 foil Substances 0.000 description 4
239000011521 glass Substances 0.000 description 4
238000000227 grinding Methods 0.000 description 4
JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 4
239000007788 liquid Substances 0.000 description 4
229920000647 polyepoxide Polymers 0.000 description 4
239000009719 polyimide resin Substances 0.000 description 4
KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 description 4
QWMFKVNJIYNWII-UHFFFAOYSA-N 5-bromo-2-(2,5-dimethylpyrrol-1-yl)pyridine Chemical compound CC1=CC=C(C)N1C1=CC=C(Br)C=N1 QWMFKVNJIYNWII-UHFFFAOYSA-N 0.000 description 3
229920000106 Liquid crystal polymer Polymers 0.000 description 3
239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 3
ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
238000004458 analytical method Methods 0.000 description 3
238000004873 anchoring Methods 0.000 description 3
229910052785 arsenic Inorganic materials 0.000 description 3
RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 3
229910052804 chromium Inorganic materials 0.000 description 3
230000002500 effect on skin Effects 0.000 description 3
238000004519 manufacturing process Methods 0.000 description 3
229910052750 molybdenum Inorganic materials 0.000 description 3
239000011733 molybdenum Substances 0.000 description 3
230000003287 optical effect Effects 0.000 description 3
229910052698 phosphorus Inorganic materials 0.000 description 3
239000011574 phosphorus Substances 0.000 description 3
238000003908 quality control method Methods 0.000 description 3
238000005096 rolling process Methods 0.000 description 3
239000010936 titanium Substances 0.000 description 3
VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
239000004593 Epoxy Substances 0.000 description 2
239000004642 Polyimide Substances 0.000 description 2
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
229910052782 aluminium Inorganic materials 0.000 description 2
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
230000002238 attenuated effect Effects 0.000 description 2
239000002131 composite material Substances 0.000 description 2
239000012141 concentrate Substances 0.000 description 2
238000012937 correction Methods 0.000 description 2
230000007423 decrease Effects 0.000 description 2
238000005238 degreasing Methods 0.000 description 2
238000010586 diagram Methods 0.000 description 2
239000003989 dielectric material Substances 0.000 description 2
239000004744 fabric Substances 0.000 description 2
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
229910052737 gold Inorganic materials 0.000 description 2
239000010931 gold Substances 0.000 description 2
LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
229910052742 iron Inorganic materials 0.000 description 2
229910052751 metal Inorganic materials 0.000 description 2
239000002184 metal Substances 0.000 description 2
PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 2
150000004767 nitrides Chemical class 0.000 description 2
238000005554 pickling Methods 0.000 description 2
238000012545 processing Methods 0.000 description 2
239000010731 rolling oil Substances 0.000 description 2
229910052709 silver Inorganic materials 0.000 description 2
239000004332 silver Substances 0.000 description 2
XMVONEAAOPAGAO-UHFFFAOYSA-N sodium tungstate Chemical compound [Na+].[Na+].[O-][W]([O-])(=O)=O XMVONEAAOPAGAO-UHFFFAOYSA-N 0.000 description 2
230000001629 suppression Effects 0.000 description 2
238000004381 surface treatment Methods 0.000 description 2
229910052715 tantalum Inorganic materials 0.000 description 2
GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
229910052718 tin Inorganic materials 0.000 description 2
239000011135 tin Substances 0.000 description 2
229910052719 titanium Inorganic materials 0.000 description 2
ZDDUSDYMEXVQNJ-UHFFFAOYSA-N 1H-imidazole silane Chemical compound [SiH4].N1C=NC=C1 ZDDUSDYMEXVQNJ-UHFFFAOYSA-N 0.000 description 1
WBHAUHHMPXBZCQ-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound COC1=CC=CC(C)=C1O WBHAUHHMPXBZCQ-UHFFFAOYSA-N 0.000 description 1
NLSFWPFWEPGCJJ-UHFFFAOYSA-N 2-methylprop-2-enoyloxysilicon Chemical compound CC(=C)C(=O)O[Si] NLSFWPFWEPGCJJ-UHFFFAOYSA-N 0.000 description 1
229910001200 Ferrotitanium Inorganic materials 0.000 description 1
239000000654 additive Substances 0.000 description 1
KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
238000000576 coating method Methods 0.000 description 1
239000003086 colorant Substances 0.000 description 1
238000004891 communication Methods 0.000 description 1
229910000365 copper sulfate Inorganic materials 0.000 description 1
ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
239000006059 cover glass Substances 0.000 description 1
SOCTUWSJJQCPFX-UHFFFAOYSA-N dichromate(2-) Chemical compound [O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O SOCTUWSJJQCPFX-UHFFFAOYSA-N 0.000 description 1
CMMUKUYEPRGBFB-UHFFFAOYSA-L dichromic acid Chemical compound O[Cr](=O)(=O)O[Cr](O)(=O)=O CMMUKUYEPRGBFB-UHFFFAOYSA-L 0.000 description 1
238000001035 drying Methods 0.000 description 1
238000005516 engineering process Methods 0.000 description 1
AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
238000007654 immersion Methods 0.000 description 1
238000010030 laminating Methods 0.000 description 1
229910052749 magnesium Inorganic materials 0.000 description 1
239000005011 phenolic resin Substances 0.000 description 1
229920001568 phenolic resin Polymers 0.000 description 1
BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
229920006267 polyester film Polymers 0.000 description 1
238000001556 precipitation Methods 0.000 description 1
125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
230000009467 reduction Effects 0.000 description 1
238000011160 research Methods 0.000 description 1
FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
229910000679 solder Inorganic materials 0.000 description 1
239000010935 stainless steel Substances 0.000 description 1
229910001220 stainless steel Inorganic materials 0.000 description 1
238000011410 subtraction method Methods 0.000 description 1
TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
230000002194 synthesizing effect Effects 0.000 description 1
239000012209 synthetic fiber Substances 0.000 description 1
229920002994 synthetic fiber Polymers 0.000 description 1
229910052720 vanadium Inorganic materials 0.000 description 1
LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
229910052724 xenon Inorganic materials 0.000 description 1
FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
229910052726 zirconium Inorganic materials 0.000 description 1

Images

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
- B21B1/40—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling foils which present special problems, e.g. because of thinness
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B45/00—Devices for surface or other treatment of work, specially combined with or arranged in, or specially adapted for use in connection with, metal-rolling mills
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/16—Electroplating with layers of varying thickness
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Organic Chemistry (AREA)
Chemical Kinetics & Catalysis (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Electrochemistry (AREA)
Microelectronics & Electronic Packaging (AREA)
Mechanical Engineering (AREA)
General Chemical & Material Sciences (AREA)
Manufacturing Of Printed Wiring (AREA)
Electroplating Methods And Accessories (AREA)
Laminated Bodies (AREA)
Parts Printed On Printed Circuit Boards (AREA)

TW111101712A 2021-07-09 2022-01-14 表面處理銅箔、覆銅積層板及印刷配線板 TWI802226B (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2021114583		2021-07-09
JP2021-114583		2021-07-09

Publications (2)

Publication Number	Publication Date
TW202304264A TW202304264A (zh)	2023-01-16
TWI802226B true TWI802226B (zh)	2023-05-11

Family

ID=84801382

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW111101712A TWI802226B (zh)	2021-07-09	2022-01-14	表面處理銅箔、覆銅積層板及印刷配線板

Country Status (5)

Country	Link
JP (1)	JPWO2023281776A1 (ja)
KR (1)	KR20230154808A (ja)
CN (1)	CN116867929A (ja)
TW (1)	TWI802226B (ja)
WO (1)	WO2023281776A1 (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN106455341A (zh) *	2015-08-06	2017-02-22	Ｊｘ金属株式会社	附载体铜箔、积层体、印刷配线板的制造方法及电子机器的制造方法
TW202030380A (zh) *	2019-02-01	2020-08-16	長春石油化學股份有限公司	表面處理銅箔
TW202122641A (zh) *	2019-12-13	2021-06-16	日商Ｊｘ金屬股份有限公司	表面處理銅箔、覆銅積層板及印刷配線板
TW202126128A (zh) *	2019-12-27	2021-07-01	日商日鐵化學材料股份有限公司	覆金屬層疊板及電路基板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP2351876A1 (en) *	2008-11-25	2011-08-03	JX Nippon Mining & Metals Corporation	Copper foil for printed circuit
KR101328235B1 (ko) *	2010-05-07	2013-11-14	제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤	인쇄 회로용 동박
JP2012112009A (ja)	2010-11-26	2012-06-14	Hitachi Cable Ltd	銅箔、及び銅箔の製造方法
JP2014152352A (ja) *	2013-02-06	2014-08-25	Sh Copper Products Corp	複合銅箔および複合銅箔の製造方法
MY177676A (en) *	2015-07-03	2020-09-23	Mitsui Mining & Smelting Co Ltd	Roughened copper foil, copper-clad laminate and printed wiring board
JP6816193B2 (ja) *	2019-03-26	2021-01-20	古河電気工業株式会社	表面処理銅箔、並びにこれを用いた銅張積層板及びプリント配線板
JP2021095596A (ja) *	2019-12-13	2021-06-24	Ｊｘ金属株式会社	表面処理銅箔、銅張積層板及びプリント配線板

2022
- 2022-01-14 TW TW111101712A patent/TWI802226B/zh active
- 2022-01-14 CN CN202280011364.2A patent/CN116867929A/zh active Pending
- 2022-01-14 JP JP2023533045A patent/JPWO2023281776A1/ja active Pending
- 2022-01-14 KR KR1020237027721A patent/KR20230154808A/ko unknown
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JPWO2023281776A1 (ja)	2023-01-12
TW202304264A (zh)	2023-01-16
WO2023281776A1 (ja)	2023-01-12
CN116867929A (zh)	2023-10-10
KR20230154808A (ko)	2023-11-09

Publication	Publication Date	Title
TWI716210B (zh)	2021-01-11	表面處理銅箔、覆銅積層板及印刷配線板
TW202122642A (zh)	2021-06-16	表面處理銅箔、覆銅積層板及印刷配線板
TWI747088B (zh)	2021-11-21	表面處理銅箔、覆銅積層板及印刷配線板
TWI749827B (zh)	2021-12-11	表面處理銅箔、覆銅積層板及印刷配線板
TWI802226B (zh)	2023-05-11	表面處理銅箔、覆銅積層板及印刷配線板
TWI802225B (zh)	2023-05-11	表面處理銅箔、覆銅積層板及印刷配線板
TW202302918A (zh)	2023-01-16	表面處理銅箔、覆銅積層板及印刷配線板
WO2023281778A1 (ja)	2023-01-12	表面処理銅箔、銅張積層板及びプリント配線板
WO2023281777A1 (ja)	2023-01-12	表面処理銅箔、銅張積層板及びプリント配線板
WO2023281759A1 (ja)	2023-01-12	表面処理銅箔、銅張積層板及びプリント配線板
WO2022154102A1 (ja)	2022-07-21	表面処理銅箔、銅張積層板及びプリント配線板
WO2024070248A1 (ja)	2024-04-04	表面処理銅箔、銅張積層板及びプリント配線板
WO2024070246A1 (ja)	2024-04-04	表面処理銅箔、銅張積層板及びプリント配線板
WO2024070245A1 (ja)	2024-04-04	表面処理銅箔、銅張積層板及びプリント配線板
WO2024070247A1 (ja)	2024-04-04	表面処理銅箔、銅張積層板及びプリント配線板