TWI800482B - 用於清潔塑膠表面的方法及用於執行該方法的設備 - Google Patents
用於清潔塑膠表面的方法及用於執行該方法的設備 Download PDFInfo
- Publication number
- TWI800482B TWI800482B TW106117602A TW106117602A TWI800482B TW I800482 B TWI800482 B TW I800482B TW 106117602 A TW106117602 A TW 106117602A TW 106117602 A TW106117602 A TW 106117602A TW I800482 B TWI800482 B TW I800482B
- Authority
- TW
- Taiwan
- Prior art keywords
- carrying
- plastic surfaces
- cleaning plastic
- cleaning
- plastic
- Prior art date
Links
- 238000000034 method Methods 0.000 title 2
- 238000004140 cleaning Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
- C02F1/461—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
- C02F1/46104—Devices therefor; Their operating or servicing
- C02F1/4618—Devices therefor; Their operating or servicing for producing "ionised" acidic or basic water
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/10—Salts
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
- C02F1/461—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
- C02F1/46104—Devices therefor; Their operating or servicing
- C02F1/4618—Devices therefor; Their operating or servicing for producing "ionised" acidic or basic water
- C02F2001/46195—Devices therefor; Their operating or servicing for producing "ionised" acidic or basic water characterised by the oxidation reduction potential [ORP]
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2201/00—Apparatus for treatment of water, waste water or sewage
- C02F2201/46—Apparatus for electrochemical processes
- C02F2201/461—Electrolysis apparatus
- C02F2201/46105—Details relating to the electrolytic devices
- C02F2201/46115—Electrolytic cell with membranes or diaphragms
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/18—Glass; Plastics
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Water Supply & Treatment (AREA)
- Environmental & Geological Engineering (AREA)
- Hydrology & Water Resources (AREA)
- Electrochemistry (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Water Treatment By Electricity Or Magnetism (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102016109771.3 | 2016-05-27 | ||
DE102016109771.3A DE102016109771B4 (de) | 2016-05-27 | 2016-05-27 | Verfahren zum Reinigen einer Kunststoffoberfläche |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201742677A TW201742677A (zh) | 2017-12-16 |
TWI800482B true TWI800482B (zh) | 2023-05-01 |
Family
ID=59067625
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106117602A TWI800482B (zh) | 2016-05-27 | 2017-05-26 | 用於清潔塑膠表面的方法及用於執行該方法的設備 |
Country Status (10)
Country | Link |
---|---|
US (2) | US11872603B2 (zh) |
EP (1) | EP3487639A1 (zh) |
JP (1) | JP2019519688A (zh) |
KR (1) | KR102424386B1 (zh) |
CN (1) | CN110099755A (zh) |
DE (1) | DE102016109771B4 (zh) |
IL (1) | IL263210A (zh) |
SG (1) | SG11201810844VA (zh) |
TW (1) | TWI800482B (zh) |
WO (1) | WO2017203007A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB201804881D0 (en) * | 2018-03-27 | 2018-05-09 | Lam Res Ag | Method of producing rinsing liquid |
CN109530374B (zh) * | 2018-11-21 | 2021-07-27 | 上海超硅半导体有限公司 | 一种晶圆盒清洗方法 |
CN110880449B (zh) * | 2019-09-30 | 2022-07-19 | 王偲偲 | 一种硅片清洗方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5578193A (en) * | 1993-01-08 | 1996-11-26 | Nec Corporation | Method and apparatus for wet treatment of solid surfaces |
US5635053A (en) * | 1994-10-28 | 1997-06-03 | Nec Corporation | Method and apparatus for cleaning electronic parts |
US6273107B1 (en) * | 1997-12-05 | 2001-08-14 | Texas Instruments Incorporated | Positive flow, positive displacement rinse tank |
JP2007123770A (ja) * | 2005-10-31 | 2007-05-17 | Kaijo Corp | ドアシェル洗浄装置及びドアシェル洗浄方法 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6114233A (ja) * | 1984-06-29 | 1986-01-22 | N V C:Kk | プラスチツク製品の洗浄方法 |
JP2830733B2 (ja) * | 1994-03-25 | 1998-12-02 | 日本電気株式会社 | 電解水生成方法および電解水生成機構 |
JP2743823B2 (ja) * | 1994-03-25 | 1998-04-22 | 日本電気株式会社 | 半導体基板のウエット処理方法 |
US5599438A (en) * | 1994-03-25 | 1997-02-04 | Nec Corporation | Method for producing electrolyzed water |
JP2737643B2 (ja) * | 1994-03-25 | 1998-04-08 | 日本電気株式会社 | 電解活性水の生成方法および生成装置 |
JP3181795B2 (ja) * | 1994-10-28 | 2001-07-03 | オルガノ株式会社 | 電解水製造装置 |
JP3313263B2 (ja) * | 1995-04-15 | 2002-08-12 | 株式会社東芝 | 電解水生成方法及びその生成装置、半導体製造装置 |
JP2832171B2 (ja) * | 1995-04-28 | 1998-12-02 | 信越半導体株式会社 | 半導体基板の洗浄装置および洗浄方法 |
TW338713B (en) * | 1995-09-06 | 1998-08-21 | Sharp Kk | A dishwasher |
JP3299662B2 (ja) | 1995-09-06 | 2002-07-08 | シャープ株式会社 | 食器洗い機 |
JP3590470B2 (ja) * | 1996-03-27 | 2004-11-17 | アルプス電気株式会社 | 洗浄水生成方法および洗浄方法ならびに洗浄水生成装置および洗浄装置 |
JP3378543B2 (ja) * | 1999-11-26 | 2003-02-17 | 株式会社半導体先端テクノロジーズ | ウェーハ・キャリア洗浄方法 |
JP4462513B2 (ja) * | 2000-01-12 | 2010-05-12 | 有限会社コヒーレントテクノロジー | 電解水の製造方法、洗浄水、及び洗浄方法 |
KR100389917B1 (ko) * | 2000-09-06 | 2003-07-04 | 삼성전자주식회사 | 산화성 물질을 포함하는 아노드 수 및/또는 환원성 물질을포함하는 캐소드 수를 사용하는 반도체 제조를 위한 습식공정 및 이 공정에 사용되는 아노드수 및/또는 캐소드수 |
JP2002153827A (ja) * | 2000-11-19 | 2002-05-28 | Nofil Corp | 洗浄方法 |
CA2468856C (en) | 2001-12-05 | 2011-07-26 | Osao Sumita | Method and apparatus for producing negative and positive oxidative reductive potential (orp) water |
KR100528286B1 (ko) * | 2004-09-02 | 2005-11-15 | 주식회사 에스에프에이 | 기판 세정장치 및 세정방법 |
JP2006255603A (ja) | 2005-03-17 | 2006-09-28 | Hitachi Chem Co Ltd | 電解水での洗浄方法及び洗浄装置 |
WO2008138357A1 (en) * | 2007-05-13 | 2008-11-20 | Magued George Amin | Electrolyzed alkaline water multipurpose cleaner ph 12.5+/-1.5 |
JP2010155435A (ja) * | 2009-01-05 | 2010-07-15 | Asahi Kasei E-Materials Corp | デブリー除去方法及びデブリー除去装置 |
CN102658270B (zh) * | 2012-05-09 | 2016-05-11 | 上海华虹宏力半导体制造有限公司 | 一种晶圆盒清洗装置及其清洗方法 |
US9579697B2 (en) | 2012-12-06 | 2017-02-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method of cleaning FOUP |
KR102107987B1 (ko) * | 2012-12-27 | 2020-05-08 | 세메스 주식회사 | 기판 처리 장치 |
CN104043605A (zh) * | 2013-03-13 | 2014-09-17 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 载体清洗装置和载体清洗方法 |
JP2015041756A (ja) * | 2013-08-23 | 2015-03-02 | 株式会社東芝 | ウェハキャリアの洗浄方法 |
JP6114233B2 (ja) | 2014-06-20 | 2017-04-12 | 株式会社バンダイナムコエンターテインメント | プログラム及びゲーム装置 |
-
2016
- 2016-05-27 DE DE102016109771.3A patent/DE102016109771B4/de active Active
-
2017
- 2017-05-24 CN CN201780032085.3A patent/CN110099755A/zh active Pending
- 2017-05-24 KR KR1020187037276A patent/KR102424386B1/ko active IP Right Grant
- 2017-05-24 EP EP17730392.2A patent/EP3487639A1/de not_active Withdrawn
- 2017-05-24 WO PCT/EP2017/062693 patent/WO2017203007A1/de unknown
- 2017-05-24 SG SG11201810844VA patent/SG11201810844VA/en unknown
- 2017-05-24 US US16/304,836 patent/US11872603B2/en active Active
- 2017-05-24 JP JP2019514856A patent/JP2019519688A/ja active Pending
- 2017-05-26 TW TW106117602A patent/TWI800482B/zh active
-
2018
- 2018-11-22 IL IL263210A patent/IL263210A/en unknown
-
2024
- 2024-01-16 US US18/413,863 patent/US20240226969A1/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5578193A (en) * | 1993-01-08 | 1996-11-26 | Nec Corporation | Method and apparatus for wet treatment of solid surfaces |
US5635053A (en) * | 1994-10-28 | 1997-06-03 | Nec Corporation | Method and apparatus for cleaning electronic parts |
US6273107B1 (en) * | 1997-12-05 | 2001-08-14 | Texas Instruments Incorporated | Positive flow, positive displacement rinse tank |
JP2007123770A (ja) * | 2005-10-31 | 2007-05-17 | Kaijo Corp | ドアシェル洗浄装置及びドアシェル洗浄方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201742677A (zh) | 2017-12-16 |
DE102016109771A1 (de) | 2017-11-30 |
JP2019519688A (ja) | 2019-07-11 |
SG11201810844VA (en) | 2019-01-30 |
US11872603B2 (en) | 2024-01-16 |
US20200043766A1 (en) | 2020-02-06 |
WO2017203007A1 (de) | 2017-11-30 |
KR20190035621A (ko) | 2019-04-03 |
IL263210A (en) | 2018-12-31 |
DE102016109771B4 (de) | 2020-09-10 |
EP3487639A1 (de) | 2019-05-29 |
US20240226969A1 (en) | 2024-07-11 |
KR102424386B1 (ko) | 2022-07-25 |
CN110099755A (zh) | 2019-08-06 |
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