TWI799988B - 鍍覆材料及電子零件 - Google Patents

鍍覆材料及電子零件 Download PDF

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Publication number
TWI799988B
TWI799988B TW110134066A TW110134066A TWI799988B TW I799988 B TWI799988 B TW I799988B TW 110134066 A TW110134066 A TW 110134066A TW 110134066 A TW110134066 A TW 110134066A TW I799988 B TWI799988 B TW I799988B
Authority
TW
Taiwan
Prior art keywords
electronic parts
plating materials
plating
materials
electronic
Prior art date
Application number
TW110134066A
Other languages
English (en)
Other versions
TW202212590A (zh
Inventor
片山晃一
成井浩徳
大江淳雄
Original Assignee
日商Ｊｘ金屬股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ｊｘ金屬股份有限公司 filed Critical 日商Ｊｘ金屬股份有限公司
Publication of TW202212590A publication Critical patent/TW202212590A/zh
Application granted granted Critical
Publication of TWI799988B publication Critical patent/TWI799988B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/54—Electroplating: Baths therefor from solutions of metals not provided for in groups C25D3/04 - C25D3/50
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
TW110134066A 2020-09-14 2021-09-13 鍍覆材料及電子零件 TWI799988B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2020-154101 2020-09-14
JP2020154101A JP7080942B2 (ja) 2020-09-14 2020-09-14 電子部品用めっき材料及び電子部品

Publications (2)

Publication Number Publication Date
TW202212590A TW202212590A (zh) 2022-04-01
TWI799988B true TWI799988B (zh) 2023-04-21

Family

ID=80631659

Family Applications (2)

Application Number Title Priority Date Filing Date
TW110134066A TWI799988B (zh) 2020-09-14 2021-09-13 鍍覆材料及電子零件
TW112101584A TW202322483A (zh) 2020-09-14 2021-09-13 鍍覆材料及電子零件

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW112101584A TW202322483A (zh) 2020-09-14 2021-09-13 鍍覆材料及電子零件

Country Status (3)

Country Link
JP (1) JP7080942B2 (zh)
TW (2) TWI799988B (zh)
WO (1) WO2022054953A1 (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010265540A (ja) * 2009-05-18 2010-11-25 Kyowa Densen Kk リードフレーム及びこの製造方法、これを用いた電子部品及び電子デバイス、並びにこれに用いられるめっき材
JP2012140678A (ja) * 2010-12-28 2012-07-26 Kyowa Densen Kk 曲げ加工部のウィスカ発生を防止するめっき被膜部材、これを用いた電気電子部品、並びにめっき被膜部材の製造方法とめっき皮膜部材のウィスカ発生防止方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11279791A (ja) * 1998-03-27 1999-10-12 Nippon Mining & Metals Co Ltd 錫−インジウムはんだ合金めっき層の形成方法
JP2010084228A (ja) 2008-10-02 2010-04-15 Kyowa Densen Kk リードフレーム材、それを用いた半導体装置
JP7135963B2 (ja) 2019-03-26 2022-09-13 株式会社オートネットワーク技術研究所 金属材および接続端子対

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010265540A (ja) * 2009-05-18 2010-11-25 Kyowa Densen Kk リードフレーム及びこの製造方法、これを用いた電子部品及び電子デバイス、並びにこれに用いられるめっき材
JP2012140678A (ja) * 2010-12-28 2012-07-26 Kyowa Densen Kk 曲げ加工部のウィスカ発生を防止するめっき被膜部材、これを用いた電気電子部品、並びにめっき被膜部材の製造方法とめっき皮膜部材のウィスカ発生防止方法

Also Published As

Publication number Publication date
WO2022054953A1 (ja) 2022-03-17
JP2022048003A (ja) 2022-03-25
TW202322483A (zh) 2023-06-01
JP7080942B2 (ja) 2022-06-06
TW202212590A (zh) 2022-04-01

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