TWI799873B - 測試座及其製造方法 - Google Patents

測試座及其製造方法 Download PDF

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Publication number
TWI799873B
TWI799873B TW110119211A TW110119211A TWI799873B TW I799873 B TWI799873 B TW I799873B TW 110119211 A TW110119211 A TW 110119211A TW 110119211 A TW110119211 A TW 110119211A TW I799873 B TWI799873 B TW I799873B
Authority
TW
Taiwan
Prior art keywords
manufacturing
same
test socket
socket
test
Prior art date
Application number
TW110119211A
Other languages
English (en)
Other versions
TW202146906A (zh
Inventor
申榮澤
李炳哲
Original Assignee
南韓商李諾工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南韓商李諾工業股份有限公司 filed Critical 南韓商李諾工業股份有限公司
Publication of TW202146906A publication Critical patent/TW202146906A/zh
Application granted granted Critical
Publication of TWI799873B publication Critical patent/TWI799873B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0458—Details related to environmental aspects, e.g. temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW110119211A 2020-06-01 2021-05-27 測試座及其製造方法 TWI799873B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2020-0065853 2020-06-01
KR1020200065853A KR102295761B1 (ko) 2020-06-01 2020-06-01 검사소켓

Publications (2)

Publication Number Publication Date
TW202146906A TW202146906A (zh) 2021-12-16
TWI799873B true TWI799873B (zh) 2023-04-21

Family

ID=77779704

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110119211A TWI799873B (zh) 2020-06-01 2021-05-27 測試座及其製造方法

Country Status (7)

Country Link
US (1) US20230228808A1 (zh)
EP (1) EP4158358A4 (zh)
JP (1) JP7513760B2 (zh)
KR (1) KR102295761B1 (zh)
CN (1) CN115698729A (zh)
TW (1) TWI799873B (zh)
WO (1) WO2021246719A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102315536B1 (ko) * 2021-08-31 2021-10-21 하병호 검사소켓 및 그 제조방법
KR102598055B1 (ko) * 2023-01-10 2023-11-06 하이콘 주식회사 반도체 소자 테스트용 소켓장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005180922A (ja) * 2003-12-15 2005-07-07 Yamaichi Electronics Co Ltd 検査装置用ケーブルの配線構造
JP2010060527A (ja) * 2008-09-05 2010-03-18 Yokowo Co Ltd グランド用コンタクトプローブを有する検査ユニット
TW201339583A (zh) * 2012-03-16 2013-10-01 Choice Sun Technology Co Ltd 測試用探針裝置
TW201723490A (zh) * 2015-12-18 2017-07-01 吳俊杰 探針裝置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0782026B2 (ja) * 1992-12-15 1995-09-06 日本電気株式会社 コンタクトプローブ
JP3233195B2 (ja) * 1996-07-02 2001-11-26 信越ポリマー株式会社 半導体素子検査用ソケット
US6788080B1 (en) * 2003-05-15 2004-09-07 Seymour Lenz Test probe assembly for circuits, circuit element arrays, and associated methods
JP2006250732A (ja) 2005-03-10 2006-09-21 Ricoh Co Ltd プローブピン及びｉｃソケット
JP4979214B2 (ja) * 2005-08-31 2012-07-18 日本発條株式会社 プローブカード
JP2009129877A (ja) 2007-11-28 2009-06-11 S Ii R:Kk 電子部品用ソケット
JP2011163807A (ja) * 2010-02-05 2011-08-25 Advantest Corp 電子部品試験装置
JP5960383B2 (ja) * 2010-06-01 2016-08-02 スリーエム イノベイティブ プロパティズ カンパニー 接触子ホルダ
KR101095907B1 (ko) * 2010-08-17 2011-12-21 리노공업주식회사 검사용 소켓
JP6157047B2 (ja) * 2011-02-01 2017-07-05 スリーエム イノベイティブ プロパティズ カンパニー Ｉｃデバイス用ソケット
US8708159B2 (en) 2011-02-16 2014-04-29 Oakwood Laboratories, Llc Manufacture of microspheres using a hydrocyclone
KR101552552B1 (ko) * 2014-08-22 2015-09-14 리노공업주식회사 테스트 소켓
JP6475479B2 (ja) 2014-11-27 2019-02-27 株式会社ヨコオ 検査ユニット
KR101762836B1 (ko) * 2015-09-10 2017-07-28 리노공업주식회사 프로브 소켓
KR101798853B1 (ko) * 2016-02-12 2017-11-20 리노공업주식회사 테스트 소켓
KR101882209B1 (ko) * 2016-03-23 2018-07-27 리노공업주식회사 동축 테스트소켓 조립체
KR101827860B1 (ko) * 2016-08-12 2018-02-12 주식회사 아이에스시 핀 블록 어셈블리
KR101975836B1 (ko) * 2017-08-11 2019-08-28 리노공업주식회사 검사장치
KR102044753B1 (ko) * 2018-05-25 2019-11-15 리노공업주식회사 검사장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005180922A (ja) * 2003-12-15 2005-07-07 Yamaichi Electronics Co Ltd 検査装置用ケーブルの配線構造
JP2010060527A (ja) * 2008-09-05 2010-03-18 Yokowo Co Ltd グランド用コンタクトプローブを有する検査ユニット
TW201339583A (zh) * 2012-03-16 2013-10-01 Choice Sun Technology Co Ltd 測試用探針裝置
TW201723490A (zh) * 2015-12-18 2017-07-01 吳俊杰 探針裝置

Also Published As

Publication number Publication date
EP4158358A1 (en) 2023-04-05
CN115698729A (zh) 2023-02-03
US20230228808A1 (en) 2023-07-20
KR102295761B1 (ko) 2021-09-01
TW202146906A (zh) 2021-12-16
JP7513760B2 (ja) 2024-07-09
EP4158358A4 (en) 2024-07-10
WO2021246719A1 (en) 2021-12-09
JP2023529323A (ja) 2023-07-10

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