TWI799479B - 印刷電路板以及具有該印刷電路板的相機模組 - Google Patents

印刷電路板以及具有該印刷電路板的相機模組 Download PDF

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Publication number
TWI799479B
TWI799479B TW107145536A TW107145536A TWI799479B TW I799479 B TWI799479 B TW I799479B TW 107145536 A TW107145536 A TW 107145536A TW 107145536 A TW107145536 A TW 107145536A TW I799479 B TWI799479 B TW I799479B
Authority
TW
Taiwan
Prior art keywords
same
circuit board
printed circuit
camera module
camera
Prior art date
Application number
TW107145536A
Other languages
English (en)
Other versions
TW201931962A (zh
Inventor
金智勳
李容直
丘奉完
金範俊
朴永誧
Original Assignee
南韓商三星電機股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南韓商三星電機股份有限公司 filed Critical 南韓商三星電機股份有限公司
Publication of TW201931962A publication Critical patent/TW201931962A/zh
Application granted granted Critical
Publication of TWI799479B publication Critical patent/TWI799479B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Structure Of Printed Boards (AREA)
  • Lens Barrels (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
TW107145536A 2018-01-04 2018-12-18 印刷電路板以及具有該印刷電路板的相機模組 TWI799479B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2018-0001312 2018-01-04
??10-2018-0001312 2018-01-04
KR1020180001312A KR102550170B1 (ko) 2018-01-04 2018-01-04 인쇄회로기판 및 이를 포함하는 카메라 모듈

Publications (2)

Publication Number Publication Date
TW201931962A TW201931962A (zh) 2019-08-01
TWI799479B true TWI799479B (zh) 2023-04-21

Family

ID=67254131

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107145536A TWI799479B (zh) 2018-01-04 2018-12-18 印刷電路板以及具有該印刷電路板的相機模組

Country Status (3)

Country Link
JP (1) JP7271830B2 (zh)
KR (1) KR102550170B1 (zh)
TW (1) TWI799479B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021029829A (ja) * 2019-08-28 2021-03-01 株式会社三洋物産 遊技機
KR20220042655A (ko) * 2020-09-28 2022-04-05 엘지이노텍 주식회사 카메라 모듈
KR20230068114A (ko) * 2021-11-10 2023-05-17 삼성전자주식회사 카메라 모듈 및 이를 포함하는 전자 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102098876A (zh) * 2006-04-27 2011-06-15 日本电气株式会社 用于电路基板的制造工艺
TW201436660A (zh) * 2012-12-31 2014-09-16 Samsung Electro Mech 多層基板及其製造方法
TW201628469A (zh) * 2015-01-22 2016-08-01 三星電機股份有限公司 印刷電路板及其製造方法
CN107105570A (zh) * 2016-02-22 2017-08-29 太阳诱电株式会社 电路板及其制造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050029042A (ko) 2003-09-19 2005-03-24 주식회사 복스오라테크놀로지코리아 고주파 동축 스위치
JP4779826B2 (ja) * 2006-06-29 2011-09-28 パナソニック株式会社 フレキシブルプリント基板
KR20100095760A (ko) * 2009-02-23 2010-09-01 삼성전기주식회사 카메라 모듈
JP2014067975A (ja) * 2012-09-27 2014-04-17 Hitachi Chemical Co Ltd 多層配線基板の製造方法
JP5594452B1 (ja) 2013-03-27 2014-09-24 株式会社村田製作所 カメラモジュール
KR102494333B1 (ko) * 2016-01-07 2023-02-02 삼성전기주식회사 인쇄회로기판 및 이를 구비한 카메라 모듈
KR102494343B1 (ko) * 2016-01-11 2023-02-01 삼성전기주식회사 인쇄회로기판
JP2017130553A (ja) 2016-01-20 2017-07-27 株式会社ミマキエンジニアリング 電子素子設置基材の製造方法、電子部材の製造方法、及び造形装置
KR20170105842A (ko) * 2016-03-10 2017-09-20 삼성전기주식회사 카메라 모듈
KR102662856B1 (ko) * 2016-03-31 2024-05-07 삼성전기주식회사 인쇄회로기판 및 이를 구비한 카메라 모듈

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102098876A (zh) * 2006-04-27 2011-06-15 日本电气株式会社 用于电路基板的制造工艺
TW201436660A (zh) * 2012-12-31 2014-09-16 Samsung Electro Mech 多層基板及其製造方法
TW201628469A (zh) * 2015-01-22 2016-08-01 三星電機股份有限公司 印刷電路板及其製造方法
CN107105570A (zh) * 2016-02-22 2017-08-29 太阳诱电株式会社 电路板及其制造方法

Also Published As

Publication number Publication date
TW201931962A (zh) 2019-08-01
JP2019121803A (ja) 2019-07-22
KR102550170B1 (ko) 2023-07-03
KR20190083538A (ko) 2019-07-12
JP7271830B2 (ja) 2023-05-12

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