TWI798012B - Carrier tray assembly - Google Patents
Carrier tray assembly Download PDFInfo
- Publication number
- TWI798012B TWI798012B TW111107576A TW111107576A TWI798012B TW I798012 B TWI798012 B TW I798012B TW 111107576 A TW111107576 A TW 111107576A TW 111107576 A TW111107576 A TW 111107576A TW I798012 B TWI798012 B TW I798012B
- Authority
- TW
- Taiwan
- Prior art keywords
- carrier
- tray
- pressing
- wall
- stacking assembly
- Prior art date
Links
Images
Landscapes
- Packaging Frangible Articles (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
- Mechanical Operated Clutches (AREA)
- Led Device Packages (AREA)
- Packaging For Recording Disks (AREA)
Abstract
Description
本揭露是有關於一種承載件及其應用，且特別是有關於一種承載盤及承載盤堆疊組件。The disclosure relates to a carrier and its application, and more particularly to a carrier and a carrier stack assembly.
承載盤主要是用來承載背光模組或螢幕等電子物品，且承載盤可互相堆疊，以達到節省空間以及方便搬運之目的。The trays are mainly used to carry electronic items such as backlight modules or screens, and the trays can be stacked to save space and facilitate transportation.
一般而言，電子物品外都會包覆一層保護膜，當電子物品裝設在承載盤中後，通常是靠上方之承載盤的承載面來壓制保護膜，但此種方式的夾持面積少，故垂直壓制力度也較低，並無法有效固定保護膜，導致整體包裝可靠度不佳。另一方面，習知的承載盤設計，主要是利用上下相鄰之承載盤以垂直軸向為基準做相差180度之方向堆疊來形成容置電子物品的空間，此種做法需花費較多的組裝時間及成本。Generally speaking, electronic items are covered with a layer of protective film. When electronic items are installed in the carrier tray, the protective film is usually pressed against the carrier surface of the upper carrier tray. However, the clamping area of this method is small. Therefore, the vertical pressing force is also low, and the protective film cannot be effectively fixed, resulting in poor reliability of the overall packaging. On the other hand, the conventional carrier tray design mainly utilizes the upper and lower adjacent trays to be stacked in a direction with a difference of 180 degrees based on the vertical axis to form a space for accommodating electronic items. This method requires more cost. Assembly time and cost.
因此，本揭露之實施例之一目的是在於提供一種承載盤，其具有夾固並壓制承載件之保護膜之功能，並可提升整體包裝的穩定性與生產線的組配或包裝效率。Therefore, one purpose of the embodiments of the present disclosure is to provide a carrier tray, which has the function of clamping and pressing the protective film of the carrier, and can improve the stability of the overall packaging and the assembly or packaging efficiency of the production line.
根據本揭露之實施例之上述目的，提出一種承載盤堆疊組件。承載盤堆疊組件包含二承載盤與緩衝單元。承載盤互相疊合，且共同在承載盤之間形成容置空間，容置空間配置以容納承載件，其中每一承載盤包含至少一壓制部設在承載盤之表面上且朝容置空間延伸。緩衝單元設置在容置空間中，且配置於承載件與位於上方的承載盤之間。其中壓制部配置以該緩衝單元進行干涉壓制，以縮減緩衝單元的厚度。According to the above objectives of the embodiments of the present disclosure, a tray stacking assembly is proposed. The tray stacking assembly includes two trays and a buffer unit. The carrying trays are superimposed on each other and jointly form an accommodating space between the carrying trays, the accommodating space is configured to accommodate the carrier, wherein each carrying tray includes at least one pressing portion arranged on the surface of the carrying tray and extending toward the accommodating space . The buffer unit is arranged in the accommodating space, and is arranged between the bearing part and the upper bearing plate. The pressing part is configured to perform interference pressing with the buffer unit, so as to reduce the thickness of the buffer unit.
依據本揭露之一實施例，上述之壓制部所圍成的外輪廓小於承載件的外輪廓，且位於承載件之外輪廓之內。According to an embodiment of the present disclosure, the outer contour surrounded by the pressing portion is smaller than the outer contour of the carrier and is located within the outer contour of the carrier.
依據本揭露之一實施例，上述之緩衝單元包覆在承載件之表面。According to an embodiment of the present disclosure, the above-mentioned buffer unit is covered on the surface of the carrier.
依據本揭露之一實施例，上述之緩衝單元包含二緩衝材分別對應設置在承載件之頂面與底面上。According to an embodiment of the present disclosure, the above-mentioned buffer unit includes two buffer materials respectively correspondingly disposed on the top surface and the bottom surface of the carrier.
依據本揭露之一實施例，上述之壓制部縮減緩衝單元之厚度為至少0.5釐米。According to an embodiment of the present disclosure, the above-mentioned pressed portion reduces the thickness of the buffer unit to at least 0.5 cm.
依據本揭露之一實施例，上述之至少一壓制部包含設置在承載盤之表面的環狀凸出結構。According to an embodiment of the present disclosure, the at least one pressing portion includes an annular protruding structure disposed on the surface of the carrier tray.
依據本揭露之一實施例，上述之每一承載盤之壓制部包含複數個凸塊，且每一承載盤之凸塊分布在承載盤之表面上。According to an embodiment of the present disclosure, the above-mentioned pressing portion of each carrier includes a plurality of bumps, and the bumps of each carrier are distributed on the surface of the carrier.
依據本揭露之一實施例，上述之凸塊包含至少一第一凸塊與至少一第二凸塊。第一凸塊具有第一壓制高度，第二凸塊具有第二壓制高度。其中第一壓制高度與第二壓制高度不同。According to an embodiment of the present disclosure, the above-mentioned bumps include at least one first bump and at least one second bump. The first bump has a first pressing height, and the second bump has a second pressing height. Wherein the first pressing height is different from the second pressing height.
依據本揭露之一實施例，上述之至少一第二凸塊環繞於至少一第一凸塊，第一壓制高度大於第二壓制高度。According to an embodiment of the present disclosure, the at least one second protrusion surrounds the at least one first protrusion, and the first pressing height is greater than the second pressing height.
依據本揭露之一實施例，上述之兩個第二凸塊之間設有至少一第一凸塊，第一壓制高度大於第二壓制高度。According to an embodiment of the present disclosure, at least one first protrusion is disposed between the above two second protrusions, and the first pressing height is greater than the second pressing height.
由上述可知，本揭露之承載盤具有凹陷結構，且透過將凹陷結構的開口的第二距離小於凹陷空間的第一距離的設計，可使上方之承載盤之凹陷結構的底部得以承載在下方之承載盤之承載部上。因此，凹陷結構除了在承載盤互相堆疊時提供支撐功能外，亦可進一步夾持承載件之保護膜，將夾持面積大幅增加，故垂直壓制力相對提升，強化保護膜之固定效果，且在生產線的組配或包裝效率上更為提升。From the above, it can be seen that the carrier tray of the present disclosure has a concave structure, and by designing the second distance of the opening of the concave structure to be smaller than the first distance of the recessed space, the bottom of the concave structure of the upper carrier tray can be carried by the lower one. On the carrying part of the carrying plate. Therefore, in addition to providing support when the carrier plates are stacked, the concave structure can further clamp the protective film of the carrier, greatly increasing the clamping area, so the vertical pressing force is relatively increased, and the fixing effect of the protective film is strengthened. The assembly or packaging efficiency of the production line is further improved.
請先參照圖1，圖1係繪示依照本揭露之一實施方式之一種承載盤堆疊組件之結構示意圖。本實施方式主要提供一種承載盤200，承載盤200主要是用來承載物件(例如圖4所示之承載件B1)，且承載盤200可互相堆疊，形成承載盤堆疊組件100。在本實施例中，承載盤200除了具有承載且可互相堆疊的功能外，亦具有夾持限位包覆在承載件B1外之保護膜B2之功能(如圖4所示)。Please refer to FIG. 1 first. FIG. 1 is a schematic structural diagram of a tray stacking assembly according to an embodiment of the present disclosure. This embodiment mainly provides a
另請一併參照圖2A至圖4，其中圖2A係繪示依照本揭露之一實施方式之一種承載盤之結構剖面示意圖，圖2B係繪示圖2A之A部分的放大示意圖，圖3係繪示沿著圖1之A-A剖面線剖切的剖面圖，圖4係繪示依照本揭露之一實施方式之一種承載盤之結構使用狀態示意圖。本實施方式之承載盤200包含承載部210、圍繞壁部220及至少一凹陷結構230。其中，圍繞壁部220環設於承載部210。在一實施例中，圍繞壁部220上可設置複數個對位部222，可確保圍繞壁部220的結構強度，在另一實施例中，位於相對兩側的圍繞壁部220上可對稱設置複數個對位部222，故操作人員在收拾空的承載盤時，不需要顧慮防呆對位的方向，能夠提升生產線的組配或包裝效率。凹陷結構230凹陷於承載部210，如圖3及圖4所示，當兩個承載盤200互相堆疊時，上方之承載盤200的承載部210與設置在下方相鄰之承載盤200之承載部210共同形成承載空間A1，且上方之承載盤200的凹陷結構230是與下方之承載盤200之凹陷結構230對應疊合。藉此，承載件B1可設置在位於下方之承載盤200的承載部210上，並位於承載空間A1中，且承載件B1外包覆的保護膜B2可受到上方之承載盤200的凹陷結構230壓制而限位。Please also refer to FIG. 2A to FIG. 4 , wherein FIG. 2A is a schematic cross-sectional view of a carrier tray according to an embodiment of the present disclosure, FIG. 2B is an enlarged schematic view of part A of FIG. 2A , and FIG. 3 is a It shows a cross-sectional view taken along the line A-A of FIG. 1 , and FIG. 4 is a schematic view showing the structure and use state of a carrier tray according to an embodiment of the present disclosure. The carrier tray 200 of this embodiment includes a
如圖2A及圖2B所示，承載部210具有頂面211以及相對頂面211之底面212。凹陷結構230具有凹陷空間230a與開口230b，其中凹陷空間230a是經開口230b對外連通。具體而言，凹陷結構230具有內壁231、外壁232及底部233，其中內壁231、外壁232與底部233共同定義出凹陷空間230a。此外，外壁232相較於內壁231更為鄰近圍繞壁部220，且內壁231與外壁232是由承載部210朝遠離底面212的方向延伸而出，底部233連接於內壁231與外壁232之間。在本實施例中，凹陷空間230a沿一方向C1的剖面具有第一距離D1，開口230b沿方向C1的剖面具有第二距離D2，其中第一距離D1大於第二距離D2。在一實施例中，承載盤200之凹陷結構230的底面設有限位結構234，且限位結構234是朝向遠離承載部210方向延伸而出之凸出結構。藉此，如圖3及圖4所示，上方之承載盤200的凹陷結構230的底部233可完全覆蓋在下方相鄰之承載盤200之凹陷結構230的開口230b，且貼合並承載於下方之承載盤200的承載部210上，故上方之承載盤200的限位結構234可伸入至下方之承載盤200的凹陷空間230a中，藉此可將包覆在承載件B1外的保護膜B2壓入凹陷空間230a中。由於上方之承載盤200的凹陷結構230是以大面積垂直方向的壓力向下貼合到下方之承載盤200的承載部210上，所以能夠把保護膜B2穩固夾緊，以達到限位保護膜B2之目的。As shown in FIG. 2A and FIG. 2B , the
再者，限位結構234的凸面可與保護膜B2互相接觸，並增加其與保護膜B2之間的摩擦力，特別是水平方向的摩擦力，進一步強化保護膜B2的固定效果。Furthermore, the convex surface of the
另請同時參照圖2A至圖5，其中圖5係繪示依照本揭露之一實施方式之一種承載盤堆疊組件之局部剖示圖。在一實施例中，內壁231具有第一板部231a、連接部231b及第二板部231c，其中連接部231b連接第一板部231a與第二板部231c。內壁231的第一板部231a連接於底部233。連接部231b的一端連接第一板部231a，另一端往凹陷空間230a延伸。內壁231之第二板部231c自承載部210延伸並連接於連接部231b之另一端。由此可知，內壁231概呈S型階狀結構設計，且內壁231之連接部231b、第二板部231c與承載部210之底面212共同形成第一支撐空間S1。同樣地，外壁232具有第一板部232a、連接部232b及第二板部232c，其中連接部232b連接第一板部232a與第二板部232c。外壁232的第一板部232a連接於底部233。連接部232b的一端連接第一板部232a，另一端往凹陷空間230a延伸。外壁232之第二板部232c自承載部210延伸並連接於連接部232b之另一端。也就是說，外壁232概呈S型階狀結構設計，且外壁232之連接部232b、第二板部232c與承載部210之底面212共同形成第二支撐空間S2。Please also refer to FIG. 2A to FIG. 5 , wherein FIG. 5 is a partial cross-sectional view of a tray stacking assembly according to an embodiment of the present disclosure. In one embodiment, the
在本實施例中，外壁232與內壁231為對稱之結構，內壁231的第二板部231c與外壁232的第二板部232c皆與承載部210的底面212連接。其中，凹陷空間230a的至少一部分是被內壁231的第一板部231a與外壁232的第一板部232a所圍繞，且內壁231的第一板部231a與外壁232的第一板部232a共同界定出前述之第一距離D1。開口230b是被內壁231的第二板部231c的至少一部分與外壁232的第二板部232c的至少一部分所圍繞，且可由內壁231的第二板部231c與外壁232的第二板部232c共同界定出前述之第二距離D2。藉此，透過開口230b的第二距離D2小於凹陷空間230a的第一距離D1的設計，可使上方之承載盤200之凹陷結構230的底部233得以承載在下方之承載盤200之承載部210上，且上方之凹陷結構230的底部233貼合於下方之承載盤200的承載部210的部分，是位於第一支撐空間S1與第二支撐空間S2的上方。欲陳明者，透過將內壁231與外壁232設計成概呈S型階狀結構除了可以增加內壁231與外壁232本身的結構強度與支撐強度外，利用S型階狀結構所產生的第一支撐空間S1與第二支撐空間S2能夠進一步提供負重緩衝吸震的功能。In this embodiment, the
另請同時參照圖1、圖6及圖7，其中圖6係繪示依照本揭露之一實施方式之一種承載盤堆疊組件之另一視角結構示意圖，圖7係繪示沿著圖1之B-B剖面線剖切的剖面圖。在一實施例中，圍繞壁部220為立設於承載部210之周緣的彎折結構，其中圍繞壁部220的底部具有彎折空間221。如圖7所示，當兩個承載盤200互相堆疊時，上方之承載盤200的圍繞壁部220是套設在設置在下方相鄰之承載盤200上的圍繞壁部220外，藉此可避免下方之承載盤200的圍繞壁部220因承受物件重量而產生外擴的問題。在其他實施例中，如圖6所示，從承載盤200的底部觀之，至少二相鄰之凹陷結構230之間具有排氣通道240位於承載部210之底面，且排氣通道240連通圍繞壁部220的彎折空間221。排氣通道240的設計主要是在多個承載盤200互相堆疊時，承載空間A1內的空氣可以通過排氣通道240經由彎折空間221而排出至外界，避免上方之承載盤200的凹陷結構230完全封閉了其下方之承載盤200之間的承載空間A1，而產生真空吸附的問題。此外，由於本揭露中，藉由位於上方的限位結構234伸入下方的凹陷空間230a，即可確保上、下方的承載盤具有互相限位的功能，相較於習知承載盤，本揭露的上、下方承載盤200堆疊時，操作人員不需要以垂直軸向為基準做180度翻轉，因此可提升生產線的組配或包裝效率。Please also refer to FIG. 1 , FIG. 6 and FIG. 7 at the same time, wherein FIG. 6 is a structural schematic diagram of another viewing angle of a tray stacking assembly according to an embodiment of the present disclosure, and FIG. 7 is a diagram along B-B of FIG. 1 A section view cut by a section line. In one embodiment, the surrounding
本揭露中，凹陷結構亦可有不同的結構設計。如圖8所示，圖8係繪示依照本揭露之另一實施方式之一種承載盤堆疊組件之局部剖示圖。本實施方式之承載盤堆疊組件300是由至少二個承載盤400互相堆疊所形成。承載盤400的結構與前述之承載盤200的結構大致上相同，差異僅在於承載盤400的凹陷結構430具有不同的形狀。In the present disclosure, the concave structure may also have different structural designs. As shown in FIG. 8 , FIG. 8 is a partial cross-sectional view of a tray stacking assembly according to another embodiment of the present disclosure. The
如圖8所示，凹陷結構430具有凹陷空間430a與開口430b，其中凹陷空間430a是經開口430b對外連通。具體而言，凹陷結構430具有內壁431、外壁432及底部433，其中內壁431、外壁432與底部433共同定義出凹陷空間430a。在本實施例中，內壁431概呈S型階狀結構設計，外壁432為立面設計，且內壁431包含第一板部431a、連接部431b及第二板部431c，其中第一板431a連接於底部433。連接部431b的一端連接第一板部431a，另一端往凹陷空間430a延伸，第二板部431c連接於連接部431b之另一端。在本實施例中，凹陷空間430a的至少一部分是被第一板部431a所圍繞，開口430b的至少一部分是被外壁432與第二板部431c圍繞所形成。在本實施例中，凹陷空間430a沿一方向C2的剖面具有第一距離D3，開口430b沿方向C2的剖面具有第二距離D4，其中第一距離D3大於第二距離D4。藉此，當兩個承載盤400互相堆疊時，上方之承載盤400的凹陷結構430是與下方之承載盤400之凹陷結構430對應疊合，藉以達到限位位於下方之承載盤400中之承載件的保護膜之目的。在其他實施例中，凹陷結構430的底部設有限位結構434，故當兩個承載盤400互相堆疊時，上方之承載盤400的限位結構434可伸入至下方之承載盤400的凹陷空間430a中，藉此可進一步將位於下方之承載盤400中之承載件的保護膜壓入凹陷空間230a中，以達到夾緊並限位保護膜之目的。As shown in FIG. 8 , the recessed
請參照圖9，圖9係繪示依照本揭露之又一實施方式之一種承載盤堆疊組件之示意圖。在本實施例中，承載盤堆疊組件500包含二承載盤600與至少一緩衝單元700。在一些例子中，承載盤600可為與如圖1所示之承載盤200相同的設計。此二承載盤600可互相疊合，而共同在二承載盤600之間形成容置空間E1。容置空間E1可用以容納承載件B1。每個承載盤600具有一第一表面620及一第二表面621，第二表面621具有一承載部630以放置承載件B1，每一承載盤600包含至少一壓制部610，其中壓制部610可設在承載盤600之第一表面620上，且位於上方承載盤600的壓制部610是朝下方承載盤600的容置空間E1延伸。Please refer to FIG. 9 , which is a schematic diagram of a tray stacking assembly according to another embodiment of the present disclosure. In this embodiment, the
緩衝單元700設置在容置空間E1中，且介於承載件B1與承載盤600之間。在一實施例中，如圖9所示，緩衝單元700可包含單一緩衝材710，且此緩衝材710配置於承載件B1之頂面B11與位於上方的承載盤600之間，承載件B1之頂面B11與位於上方的承載盤600之間的容置空間E1被緩衝材710填充，使承載件B1相對於承載盤600維持在所放位置而不會發生相對位移，避免承載件B1在容置空間E1內移動或碰撞而損傷。在一示範例子中，承載件B1為層狀結構。The
壓制部610可對緩衝單元700進行干涉壓制，以縮減緩衝單元700之厚度。換句話說，緩衝材710是具有可壓縮性的，故緩衝材710可被壓制部610壓縮使承載件B1被固定於承載盤600的第二表面621且不會發生相對位移。在一實施例中，壓制部610縮減緩衝單元700之厚度至少0.5釐米。壓制部610縮減緩衝單元700之厚度與壓制部610對承載件600的干涉壓制程度大小有關。若縮減之厚度太小，則承載件600仍可能發生相對位移，或者層狀結構的承載件600內可能仍存有間隙，進而隱藏性異物容易在運輸過程中震入承載件B1內。The
承載盤堆疊組件之緩衝單元亦可包含多個緩衝材。請參照圖10，圖10係繪示依照本揭露之再一實施方式之一種承載盤堆疊組件之示意圖。在此實施例中，在承載盤堆疊組件500a內之緩衝單元700包含二緩衝材710。此二緩衝材710可分別對應設置在承載件B1之頂面B11與底面B12上。故，此二緩衝材710分別介於承載件B1之頂面B11與上方之承載盤600之間、以及承載件B1之底面B12與下方之承載盤600之間，而可避免承載件B1的表面被刮傷，同時對承載件B1之頂面B11與底面B12提供緩衝保護。在另一實施例中，緩衝單元700也可以是單一緩衝材710包覆於承載件B1之頂面B11與底面B12，以避免刮傷並提供緩衝保護。The buffer unit of the tray stack assembly can also include a plurality of buffer materials. Please refer to FIG. 10 . FIG. 10 is a schematic diagram of a tray stacking assembly according to yet another embodiment of the present disclosure. In this embodiment, the
請參照圖11A與圖11B，圖11A係繪示習知之承載盤堆疊組件之在異物朝承載件散布時的示意圖，圖11B係繪示依照本揭露之一實施方式之一種承載盤堆疊組件之在異物朝承載件散布時的示意圖。在一實施例中，承載件B1為多層膜片的堆疊結構。如圖11A所示，習知之承載盤堆疊組件1000對承載件B1而言不具有干涉壓制的效果。因此，承載件B1之膜片之間存有間隙。如此一來，在運輸過程中，周圍的隱藏性異物便容易因運輸時的震動被震入膜片之間，而影響承載件B1之膜片結構的光學品質，進而導致承載件B1的良率品質下降。Please refer to FIG. 11A and FIG. 11B . FIG. 11A is a schematic view of a known tray stacking assembly when foreign matter is scattered toward the carrier. FIG. 11B is a schematic diagram of a tray stacking assembly according to an embodiment of the present disclosure. Schematic diagram of foreign matter spreading towards the carrier. In one embodiment, the carrier B1 is a stacked structure of multi-layer films. As shown in FIG. 11A , the conventional
在本實施例中，如圖11B所示，本揭露之一實施方式之承載盤堆疊組件500a則藉由承載盤600上的壓制部610與分別對應設置在承載件B1之頂面B11與底面B12上的二緩衝材710的設計，使承載件B1受到干涉壓制，承載件B1內之各膜層間可不具有間隙或相當小的間隙，使得隱藏性異物無法進入這些膜片之間。因此，可有效阻絕異物，並降低運輸途中因異物或碰撞對承載件B1所造成的負面衝擊，進而可提升承載件B1的良率品質。In this embodiment, as shown in FIG. 11B , the
除此之外，如圖11C所示，承載盤600包含承載部630以及位於承載部630上的一內環溝631與一外環溝632，壓制部610則是以複數個形態分別形成在內環溝上631與外環溝632上，其位置可以互相交錯而不會對齊在X軸或Y軸。壓制部610既為壓制面也為結構加強筋，其多點平均分布的設計，可以提升承載盤600的結構強度、以及承載部630強度與緩衝材710固定性。In addition, as shown in FIG. 11C , the
請參照圖12，圖12係繪示依照本揭露之再一實施方式之一種承載盤堆疊組件之裝置示意圖。在一實施例中，每一承載盤600之壓制部610包含複數個凸塊612，且每一承載盤600之凸塊612分布在承載盤600之第一表面620上，即圖12的背面。這些凸塊612之壓制高度可彼此相同、彼此不同、或不全然不同。換言之，這些凸塊612在承載盤600之第一表面620上的凸伸高度可彼此相同、彼此不同、或不全然不同。本實施例可針對不同承載件，例如不同尺寸之承載件的壓制需求，調整壓制部610之各凸塊612之壓制高度，藉此達到穩固壓制與確實定位承載件的效果。在一實施例中，由於承載盤600是射出成形方式製作，故複數個凸塊612皆是從第一表面620朝下方承載盤600延伸而凸出，而每一個凸塊612的頂面可以形成共平面，使每一個凸塊612可均勻地對緩衝單元700進行干涉壓制，以確保承載件B1均勻地受力。Please refer to FIG. 12 . FIG. 12 is a schematic diagram of an apparatus of a tray stacking assembly according to yet another embodiment of the present disclosure. In one embodiment, the
在一實施例中，如圖12所示，壓制部610更可選擇性地包含設置在承載盤600之第一表面620的環狀凸出結構611，環狀凸出結構611是從第一表面620朝下方承載盤600延伸而凸出。環狀凸出結構611在承載盤600的第一表面620上圍成外輪廓F1。在一實施例中，壓制部610所圍成之外輪廓F1小於承載件B1之外輪廓F2，且位於承載件B1之外輪廓F2之內，故可確保壓制部610所施予的壓力可均勻地分散在承載件B1之所需壓制區域上，例如背光模組的發光面中央區域，而可避開非所需壓制區域外的邊緣區域，例如位於發光面外的燈條或框架結構上。藉此，可確保對承載件B1之所需壓制區域的提升干涉壓制效果。In one embodiment, as shown in FIG. 12 , the
請參照圖13及圖14，圖13及圖14係繪示依照本揭露之再一實施方式之一種承載盤堆疊組件之裝置示意圖。在一實施例中，承載盤堆疊組件800之承載盤900上設有複數個凸塊911所分布位置形成外輪廓F1。在一些例子中，凸塊911包含至少一第一凸塊911A與至少一第二凸塊911B，第一凸塊911A與第二凸塊911B皆是從上方承載盤900朝下方承載盤900延伸而凸出。請參照圖13A及圖14A，第一凸塊911A具有第一壓制高度H1，第二凸塊911B具有第二壓制高度H2，其中第一壓制高度H1與第二壓制高度H2不同。在一例子中，如圖13A所示，第二凸塊911B環繞於第一凸塊911A外，且第一壓制高度H1大於第二壓制高度H2。在一例子中，如圖14A所示，兩個第二凸塊911B之間設有至少一第一凸塊911A，且第一壓制高度H1大於第二壓制高度H2。較大的壓制高度可產生較大的干涉壓制效果，較小的壓制高度可減少承載盤900與承載件所受之壓力。故，搭配不同壓制高度的凸塊911，壓制部900所施予在承載件之壓力可集中在所需壓制區域上，並同時確保承載件整體所受的壓力不會過大而導致承載件的損壞。更佳的是，圖13中壓制高度較高的第一凸塊911A是環狀延伸，而圖14中壓制高度較高的第一凸塊911A是環形排列，以均勻地壓制承載件。Please refer to FIG. 13 and FIG. 14 . FIG. 13 and FIG. 14 are schematic diagrams illustrating a device of a tray stacking assembly according to yet another embodiment of the present disclosure. In one embodiment, the
由上述本揭露之實施例可知，本揭露之承載盤堆疊組件之承載盤上具有壓制部，且在承載件之頂面及/或底面上可設有緩衝材，故承載件可受到單面或雙面的干涉壓制而形成類真空之加乘固定效果，進而可有效固定與保護承載件。此外，透過調整壓制部所包含之凸塊的樣式、分布與壓制高度的方式，可調整欲重點壓制的承載件內的部件與干涉壓制的程度大小。凸塊與壓制部的樣式不受限於設計為何，惟其重點在於壓制部與壓制部內的凸塊之設計須確保干涉壓制程度大小與在壓制範圍內的均勻性，以避免在運輸過程中之隱藏性異物的入侵或承載件的損壞，進而可有效提升承載件的良率。It can be seen from the embodiments of the present disclosure above that the carrier tray of the carrier tray stack assembly of the present disclosure has a pressed portion, and a buffer material can be provided on the top surface and/or bottom surface of the carrier, so the carrier can be subjected to one-sided or The double-sided interference pressing forms a vacuum-like additive fixing effect, which can effectively fix and protect the carrier. In addition, by adjusting the pattern, distribution and pressing height of the bumps included in the pressing part, the components in the carrier to be pressed mainly and the degree of interference pressing can be adjusted. The style of the bump and the pressing part is not limited by the design, but the key point is that the design of the pressing part and the bump in the pressing part must ensure the degree of interference and the uniformity of the pressing range to avoid hiding during transportation The intrusion of sexual foreign matter or the damage of the carrier can effectively improve the yield of the carrier.
雖然本揭露之實施例已以實施例揭露如上，然其並非用以限定本揭露之實施例，任何所屬技術領域中具有通常知識者，在不脫離本揭露之實施例的精神和範圍內，當可作些許的更動與潤飾，故本揭露之實施例的保護範圍當視後附的申請專利範圍所界定者為準。Although the embodiments of the present disclosure have been disclosed as above, they are not intended to limit the embodiments of the present disclosure. Anyone with ordinary knowledge in the technical field, without departing from the spirit and scope of the embodiments of the present disclosure, when Slight changes and modifications can be made, so the scope of protection of the embodiments of the present disclosure should be defined by the scope of the appended patent application.
100:承載盤堆疊組件 200:承載盤 210:承載部 211:頂面 212:底面 220:圍繞壁部 221:彎折空間 222:對位部 230:凹陷結構 230a:凹陷空間 230b:開口 231:內壁 231a:第一板部 231b:連接部 231:第二板部 232:外壁 232a:第一板部 232b:連接部 232c:第二板部 233:底部 234:限位結構 240:排氣通道 300:承載盤堆疊組件 400:承載盤 430:凹陷結構 430a:凹陷空間 430b:開口 431:內壁 431a:第一板部 431b:連接部 431c:第二板部 432:外壁 433:底部 434:限位結構 500:承載盤堆疊組件 500a:承載盤堆疊組件 600:承載盤 610:壓制部 611:環狀凸出結構 612:凸塊 620:第一表面 621:第二表面 630:承載部 631:內環溝 632:外環溝 700:緩衝單元 710:緩衝材 800:承載盤堆疊組件 900:承載盤 910:壓制部 911:凸塊 911A:第一凸塊 911B:第二凸塊 1000:承載盤堆疊組件 A1:承載空間 B1:承載件 B2:保護膜 B11:頂面 B12:底面 C1:方向 C2:方向 D1:第一距離 D2:第二距離 D3:第一距離 D4:第二距離 E1:容置空間 F1:外輪廓 F2:外輪廓 H1:第一壓制高度 H2:第二壓制高度 S1:第一支撐空間 S2:第二支撐空間 100: Carrier tray stacking assembly 200: carrier plate 210: bearing part 211: top surface 212: Bottom 220: around the wall 221: Bending space 222: Counterpoint Department 230: concave structure 230a: Recessed space 230b: opening 231: inner wall 231a: the first board 231b: connection part 231: The second board 232: outer wall 232a: the first board part 232b: connection part 232c: the second board part 233: bottom 234: limit structure 240: exhaust channel 300: Carrier tray stacking assembly 400: carrying plate 430: Depression structure 430a: Recessed space 430b: opening 431: inner wall 431a: the first board 431b: connection part 431c: the second board 432: outer wall 433: bottom 434: limit structure 500: Carrier tray stack assembly 500a: carrier tray stack assembly 600: carrier plate 610: Press Department 611: Annular protruding structure 612: Bump 620: first surface 621: second surface 630: bearing part 631: inner ring groove 632: outer ring ditch 700: buffer unit 710: buffer material 800: Carrier tray stack assembly 900: carrying plate 910: Press Department 911: Bump 911A: First bump 911B: Second bump 1000: Carrier tray stack assembly A1: carrying space B1: Carrier B2: Protective film B11: top surface B12: Bottom C1: Direction C2: Direction D1: first distance D2: second distance D3: first distance D4: second distance E1: storage space F1: Outer contour F2: Outer contour H1: first pressing height H2: second pressing height S1: The first support space S2: Second support space
為了更完整了解實施例及其優點，現參照結合所附圖式所做之下列描述，其中： 圖1係繪示依照本揭露之一實施方式之一種承載盤堆疊組件之結構示意圖； 圖2A係繪示依照本揭露之一實施方式之一種承載盤之結構剖面示意圖； 圖2B係繪示圖2A之A部分的放大示意圖； 圖3係繪示沿著圖1之A-A剖面線剖切的剖面圖； 圖4係繪示依照本揭露之一實施方式之一種承載盤之結構使用狀態示意圖； 圖5係繪示依照本揭露之一實施方式之一種承載盤堆疊組件之局部剖示圖； 圖6係繪示依照本揭露之一實施方式之一種承載盤堆疊組件之另一視角結構示意圖； 圖7係繪示沿著圖1之B-B剖面線剖切的剖面圖； 圖8係繪示依照本揭露之另一實施方式之一種承載盤堆疊組件之局部剖示圖； 圖9係繪示依照本揭露之又一實施方式之一種承載盤堆疊組件之示意圖； 圖10係繪示依照本揭露之再一實施方式之一種承載盤堆疊組件之示意圖； 圖11A係繪示習知之承載盤堆疊組件之在異物朝承載件散布時的示意圖； 圖11B係繪示依照本揭露之一實施方式之一種承載盤堆疊組件之在異物朝承載件散布時的示意圖； 圖11C係繪示依照本揭露之一實施方式之一種承載盤堆疊組件之局部剖示圖； 圖12係繪示依照本揭露之再一實施方式之一種承載盤堆疊組件之裝置示意圖； 圖13係繪示依照本揭露之再一實施方式之一種承載盤堆疊組件之裝置示意圖； 圖13A係繪示依照本揭露之再一實施方式之一種承載盤堆疊組件之裝置局部放大示意圖； 圖14係繪示依照本揭露之再一實施方式之一種承載盤堆疊組件之裝置示意圖；以及 圖14A係繪示依照本揭露之再一實施方式之一種承載盤堆疊組件之裝置局部放大示意圖。 For a more complete understanding of the embodiments and advantages thereof, reference is now made to the following description taken in conjunction with the accompanying drawings, in which: FIG. 1 is a schematic structural diagram of a tray stacking assembly according to an embodiment of the present disclosure; FIG. 2A is a schematic cross-sectional view of a carrier tray according to an embodiment of the present disclosure; FIG. 2B is an enlarged schematic view of part A of FIG. 2A; Fig. 3 is a sectional view cut along the section line A-A of Fig. 1; FIG. 4 is a schematic view showing the structure and use state of a carrier tray according to an embodiment of the present disclosure; FIG. 5 is a partial cross-sectional view of a tray stacking assembly according to an embodiment of the present disclosure; FIG. 6 is a structural schematic diagram showing another viewing angle of a tray stacking assembly according to an embodiment of the present disclosure; Fig. 7 is a sectional view cut along the B-B section line of Fig. 1; FIG. 8 is a partial cross-sectional view of a tray stacking assembly according to another embodiment of the present disclosure; FIG. 9 is a schematic diagram of a tray stacking assembly according to another embodiment of the present disclosure; FIG. 10 is a schematic diagram of a tray stacking assembly according to yet another embodiment of the present disclosure; FIG. 11A is a schematic diagram of a conventional tray stacking assembly when foreign objects are scattered toward the carrier; FIG. 11B is a schematic diagram of a tray stacking assembly according to an embodiment of the present disclosure when foreign matter spreads toward the carrier; 11C is a partial cross-sectional view of a tray stacking assembly according to an embodiment of the present disclosure; FIG. 12 is a schematic diagram of a device for a tray stacking assembly according to yet another embodiment of the present disclosure; FIG. 13 is a schematic diagram of a device for a tray stacking assembly according to yet another embodiment of the present disclosure; FIG. 13A is a partially enlarged schematic diagram of a device for a tray stacking assembly according to yet another embodiment of the present disclosure; FIG. 14 is a schematic diagram of a device for a tray stacking assembly according to yet another embodiment of the present disclosure; and FIG. 14A is a partially enlarged schematic diagram of a device for a tray stacking assembly according to yet another embodiment of the present disclosure.
國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic deposit information (please note in order of depositor, date, and number) none Overseas storage information (please note in order of storage country, institution, date, and number) none
100:承載盤堆疊組件 100: Carrier tray stacking assembly
200:承載盤 200: carrier plate
210:承載部 210: bearing part
220:圍繞壁部 220: around the wall
230:凹陷結構 230: concave structure
Claims (9)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120455646.4 | 2021-03-03 | ||
| CN202120455646.4U CN214493762U (en) | 2021-03-03 | 2021-03-03 | Bearing plate and bearing plate stacking assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202235331A TW202235331A (en) | 2022-09-16 |
| TWI798012B true TWI798012B (en) | 2023-04-01 |
Family
ID=78227052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111107576A TWI798012B (en) | 2021-03-03 | 2022-03-02 | Carrier tray assembly |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN214493762U (en) |
| TW (1) | TWI798012B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115298100A (en) | 2021-03-03 | 2022-11-04 | 瑞仪(广州)光电子器件有限公司 | Bearing plate and bearing plate stacking assembly |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110042266A1 (en) * | 2006-07-19 | 2011-02-24 | Miraial Co., Ltd | Wafer container with cushion sheets |
| CN204453129U (en) * | 2015-02-02 | 2015-07-08 | 昆山龙腾光电有限公司 | Pallet |
| TWM523964U (en) * | 2016-03-09 | 2016-06-11 | Au Optronics Corp | Tray and tray stacking structure having the same |
-
2021
- 2021-03-03 CN CN202120455646.4U patent/CN214493762U/en active Active
-
2022
- 2022-03-02 TW TW111107576A patent/TWI798012B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110042266A1 (en) * | 2006-07-19 | 2011-02-24 | Miraial Co., Ltd | Wafer container with cushion sheets |
| CN204453129U (en) * | 2015-02-02 | 2015-07-08 | 昆山龙腾光电有限公司 | Pallet |
| TWM523964U (en) * | 2016-03-09 | 2016-06-11 | Au Optronics Corp | Tray and tray stacking structure having the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202235331A (en) | 2022-09-16 |
| CN214493762U (en) | 2021-10-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI798012B (en) | Carrier tray assembly | |
| CN108962033B (en) | Display module and display device | |
| KR20090019707A (en) | Semiconductor chip housing tray | |
| WO2018099054A1 (en) | Packaging tray structure and substrate packaging structure | |
| US6168026B1 (en) | Component carrier having high strength pocket | |
| TWI468806B (en) | Slim border design of display device and backlight module thereof | |
| JP2012140180A (en) | Box for transporting | |
| TWI406797B (en) | Packing system for plate-shaped materials and holding tray thereof | |
| JP6990275B2 (en) | Lens modules and electronic devices | |
| WO2022184099A1 (en) | Carrier tray stacking assembly | |
| WO2020073449A1 (en) | Support member assembly and package box using same | |
| CN211281976U (en) | Display panel's packing carton, packing box and case lid | |
| WO2016074271A1 (en) | Injection-moulded packaging box for liquid crystal panels | |
| TWM523964U (en) | Tray and tray stacking structure having the same | |
| US20070054524A1 (en) | Packing module and packing assembly comprising the same | |
| TW202043104A (en) | Plate packaging box and plate packaging box group | |
| KR20230139832A (en) | Tray | |
| JP3734147B2 (en) | CRT panel packaging box | |
| JP6357898B2 (en) | Packing method for plate | |
| CN114039011B (en) | Display device | |
| CN215814925U (en) | Bottom shell of LED display screen module | |
| US8794814B2 (en) | Foaming material frame and display structure using the same | |
| CN217836809U (en) | Lens packing plate and lens packing box | |
| TWI669255B (en) | Packing structure and packing box structure packing the same | |
| JP7361614B2 (en) | Semiconductor chip tray and method for storing semiconductor chips |