TWI797689B - 檢查電子元件內部缺陷的裝置及方法 - Google Patents
檢查電子元件內部缺陷的裝置及方法 Download PDFInfo
- Publication number
- TWI797689B TWI797689B TW110127311A TW110127311A TWI797689B TW I797689 B TWI797689 B TW I797689B TW 110127311 A TW110127311 A TW 110127311A TW 110127311 A TW110127311 A TW 110127311A TW I797689 B TWI797689 B TW I797689B
- Authority
- TW
- Taiwan
- Prior art keywords
- electronic component
- light source
- infrared light
- image capture
- capture unit
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
- G01N21/9505—Wafer internal defects, e.g. microcracks
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MYPI2021002864 | 2021-05-24 | ||
| MYPI2021002864 | 2021-05-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202246761A TW202246761A (zh) | 2022-12-01 |
| TWI797689B true TWI797689B (zh) | 2023-04-01 |
Family
ID=84440647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110127311A TWI797689B (zh) | 2021-05-24 | 2021-07-26 | 檢查電子元件內部缺陷的裝置及方法 |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR102592277B1 (ko) |
| TW (1) | TWI797689B (ko) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201118369A (en) * | 2009-09-02 | 2011-06-01 | Gp Inspect Gmbh | Method and device for detecting defects in an object |
| TW201930864A (zh) * | 2014-12-05 | 2019-08-01 | 美商克萊譚克公司 | 在工作件中用於缺陷偵測的裝置，方法及電腦程式產品 |
| TW202009476A (zh) * | 2018-08-30 | 2020-03-01 | 馬來西亞商正齊科技有限公司 | 一種用於對電子元件進行紅外線檢查的裝置及方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012501539A (ja) * | 2008-09-01 | 2012-01-19 | ネーデルランツ オルガニサティー フォール トゥーゲパストナトゥールヴェテンシャッペリーク オンデルズーク テーエンオー | ピックアンドプレース機 |
| KR101323035B1 (ko) | 2009-05-29 | 2013-10-29 | 로세브 테크놀로지 코포레이션 | 다결정 웨이퍼의 검사 방법 |
-
2021
- 2021-07-26 TW TW110127311A patent/TWI797689B/zh active
- 2021-07-28 KR KR1020210099004A patent/KR102592277B1/ko active IP Right Grant
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201118369A (en) * | 2009-09-02 | 2011-06-01 | Gp Inspect Gmbh | Method and device for detecting defects in an object |
| TW201930864A (zh) * | 2014-12-05 | 2019-08-01 | 美商克萊譚克公司 | 在工作件中用於缺陷偵測的裝置，方法及電腦程式產品 |
| TW202009476A (zh) * | 2018-08-30 | 2020-03-01 | 馬來西亞商正齊科技有限公司 | 一種用於對電子元件進行紅外線檢查的裝置及方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20220158572A (ko) | 2022-12-01 |
| KR102592277B1 (ko) | 2023-10-19 |
| TW202246761A (zh) | 2022-12-01 |
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