TWI790808B

TWI790808B - Molding fixture

Info

Publication number: TWI790808B
Application number: TW110141220A
Authority: TW
Inventors: 閔繁宇
Original assignee: 日月光半導體製造股份有限公司
Priority date: 2021-11-04
Filing date: 2021-11-04
Publication date: 2023-01-21
Also published as: TW202320187A

Abstract

A molding fixture is provided. The molding fixture includes a support portion and a guiding portion. The support portion is adjacent to the bottom of the molding fixture. The guiding portion protrudes from an inner side of the support portion. The guiding portion and the support portion collaboratively define a space. The guiding portion has an edge far from the support portion, and the support portion has an edge far from the guiding portion. The edges of guiding portion and the support portion collaboratively define a plane facing and recessing toward the inner side of the support portion.

Description

模封治具Molding fixture

本發明係關於一種模封治具，並且更具體地係關於用於模封電子封裝結構之模封治具。 The present invention relates to a molding jig, and more particularly to a molding jig for molding electronic packaging structures.

在執行模封操作時，以往的治具容易與基板上的晶粒擦撞，導致晶粒的損傷，或使治具無法密合地抵觸基板的上表面，使得模封材料容易溢散至基板的周邊區，導致封裝體的厚度異常。為解決上述問題，需要尋求新的治具及形成電子封裝結構之方法。 During the molding operation, the conventional jigs tend to collide with the die on the substrate, resulting in damage to the die, or the jig cannot be tightly contacted with the upper surface of the substrate, making it easy for the molding material to overflow to the substrate The peripheral area, resulting in an abnormal thickness of the package. In order to solve the above problems, it is necessary to seek new fixtures and methods for forming electronic packaging structures.

根據本發明之一些實施例，一種模封治具包括支撐部及導引部。支撐部鄰近治具之底部。導引部由支撐部的內側突出，並與支撐部共同界定一空間。導引部具有遠離支撐部之邊緣且支撐部之內側具有遠離導引部之邊緣，且導引部之邊緣至支撐部之內側之邊緣共同界定一平面，其中空間係自平面朝向支撐部之內側凹陷。 According to some embodiments of the present invention, a molding fixture includes a supporting part and a guiding part. The supporting portion is adjacent to the bottom of the jig. The guiding part protrudes from the inner side of the supporting part and defines a space together with the supporting part. The guide portion has an edge away from the support portion and the inner side of the support portion has an edge away from the guide portion, and the edge of the guide portion to the inner edge of the support portion jointly define a plane, wherein the space is from the plane toward the inner side of the support portion sunken.

根據本發明之一些實施例，一種用於模封治具包括支撐部及模封材料導引部。支撐部鄰近治具之底部，其包括支撐面及連接支撐面的內表面。模封材料導引部由支撐部的內表面突出，其包括底表面。在一剖視下，模封材料導引部之底表面與支撐部之內表面彼此相交所形成之角度包括直角或銳角。 According to some embodiments of the present invention, a molding fixture includes a supporting portion and a molding material guiding portion. The support portion is adjacent to the bottom of the jig, and includes a support surface and an inner surface connected to the support surface. The molding material guide protrudes from the inner surface of the support part, which includes a bottom surface. In a cross-sectional view, the angle formed by the intersection of the bottom surface of the molding material guide part and the inner surface of the support part Includes right or acute angles.

根據本發明之一些實施例，一種模封治具包括本體及導引部。導引部自本體之表面突出。本體係經構形以抵頂基板之上表面，且導引部係經構形以導引來自基板之上方並下落至基板之上表面的複數個材料，使材料減少下落至位於基板之上表面上且鄰近基板之邊緣之區域內。 According to some embodiments of the present invention, a molding fixture includes a body and a guide portion. The guide part protrudes from the surface of the body. The system is configured to abut against the upper surface of the substrate, and the guide portion is configured to guide a plurality of materials falling from above the substrate to the upper surface of the substrate, so that the materials are reduced from falling to the upper surface of the substrate In the area above and adjacent to the edge of the substrate.

100:治具 100: fixture

100':治具 100': fixture

110:頂部 110: top

110s1:表面 110s1: surface

110s2:表面 110s2: surface

110s3:表面 110s3: surface

120:連接部 120: connection part

120s1:表面 120s1: surface

120s2:表面 120s2: surface

120s3:表面 120s3: surface

120s4:表面 120s4: surface

130:支撐部 130: support part

130':支撐部 130': support part

130s1:表面 130s1: surface

130s1':表面 130s1': surface

130s2:表面 130s2: surface

130s2':表面 130s2': surface

130s3:表面 130s3: surface

130s3':表面 130s3': surface

130e:內側 130e: inside

140:導引部 140: Guide Department

140':導引部 140': Guide Department

140s1:表面 140s1: surface

140s1':表面 140s1': surface

140s2:表面 140s2: surface

140s2':表面 140s2': surface

200:基板 200: Substrate

200s1:表面 200s1: surface

200s2:表面 200s2: surface

210:晶粒 210: grain

230:封裝體 230: Encapsulation

230s1:表面 230s1: surface

230s2:表面 230s2: surface

230s3:表面 230s3: surface

300:電子封裝結構 300: Electronic Packaging Structure

400:操作 400: operation

402:模封材料 402: molding material

S:空間 S: space

S':空間 S': space

D1:長度 D1: length

D2:距離 D2: distance

E1:邊緣 E1: edge

E2:邊緣 E2: edge

E2':邊緣 E2': edge

H1:長度 H1: length

H2:長度 H2: length

H3:厚度 H3: Thickness

H4:厚度 H4: Thickness

L1:水平距離 L1: horizontal distance

L2:水平距離 L2: horizontal distance

P:平面 P: Plane

θ1:夾角 θ1: included angle

θ2:夾角 θ2: included angle

θ3:夾角 θ3: Angle

θ4:夾角 θ4: Angle

θ5:夾角 θ5: included angle

當與附圖一起閱讀以下詳細描述時，可以根據以下詳細描述容易地理解本發明之各態樣。應當注意的是，各種特徵可能未按比例繪製。實際上，為了論述之清楚起見，可以任意增大或減小各種特徵之尺寸。 Aspects of the present invention can be readily understood from the following detailed description when read with the accompanying drawings. It should be noted that the various features may not be drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or decreased for clarity of discussion.

圖1A係根據本發明之實施例之治具的上視圖。 FIG. 1A is a top view of a jig according to an embodiment of the present invention.

圖1B係圖1A之治具的剖面圖。 FIG. 1B is a cross-sectional view of the jig shown in FIG. 1A .

圖2A係根據本發明之實施例之治具與基板的剖面圖。 2A is a cross-sectional view of a jig and a substrate according to an embodiment of the present invention.

圖2B係圖2A的局部放大圖。 Fig. 2B is a partially enlarged view of Fig. 2A.

圖3A、圖3B、圖3C、圖3D及圖3E係根據本發明之實施例之形成電子封裝結構之不同階段的剖面圖。 3A, 3B, 3C, 3D and 3E are cross-sectional views of different stages of forming an electronic package structure according to an embodiment of the present invention.

圖4係根據本發明之實施例之治具與基板的剖面圖。 FIG. 4 is a cross-sectional view of a jig and a substrate according to an embodiment of the present invention.

全文之附圖及實施方式，使用共同的附圖標記或標號以標記相同或類似的組件。根據以下結合附圖進行之詳細描述，本揭露將更加明顯。 Throughout the drawings and embodiments, the same or similar components are marked with common reference numerals or numerals. The present disclosure will be more apparent from the following detailed description in conjunction with the accompanying drawings.

以下揭示內容提供了用於實施所提供主題之不同特徵之許多不同實施例或實例。以下描述了組件及配置之特定實例。當然，此等僅係實例並且不意欲係限制性的。在本發明中，對在第二特徵之上或上形成或設置第一特徵之引用可以包含將第一特徵及第二特徵被形成或設置為直接接觸之實施例，並且亦可以包含可以在第一特徵與第二特徵之間形成或設置另外的特徵使得第一特徵及第二特徵可以不直接接觸之實施例。另外，本發明可以在各個實例中重複附圖標記及/或字母。此種重複係為了簡單及清晰之目的並且本身並不指示所論述之各個實施例及/或組態之間的關係。 The following disclosure provides many different embodiments, or examples, for implementing different features of the presented subject matter. Specific examples of components and configurations are described below. Of course, these are examples only and are not intended to be limiting. In the present invention, the pair is formed on or over the second feature Or a reference to a first feature may include an embodiment in which the first feature and the second feature are formed or placed in direct contact, and may also include an embodiment in which another feature may be formed or placed between the first feature and the second feature such that An embodiment in which the first feature and the second feature may not be in direct contact. In addition, the present invention may repeat reference numerals and/or letters in each example. Such repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or configurations discussed.

下文詳細論述了本發明之實施例。然而，應當理解的是，本發明提供了許多可以在各種各樣之特定環境下具體化之適用概念。所論述之特定實施例僅係說明性的，而不限制本發明之範疇。 Embodiments of the invention are discussed in detail below. It should be appreciated, however, that the present invention provides many applicable concepts that can be embodied in a wide variety of specific contexts. The specific embodiments discussed are illustrative only, and do not limit the scope of the invention.

在本揭露，外側表面亦可稱為外表面，內側表面亦可稱為內表面。 In this disclosure, the outer surface can also be called the outer surface, and the inner surface can also be called the inner surface.

參閱圖1A及1B，圖1A係根據本發明之實施例之治具100的上視圖，圖1B係圖1A之治具100沿A-A線段的剖面圖。需要說明的是，本揭露的治具100可應用於各種模組、設備、儀器及/或機台內，或為模組、設備、儀器及/或機台的一部分。在一些實施例，治具100可應用於製造電子封裝結構、半導體裝置結構或其他裝置的模組、設備、儀器及/或機台。例如，治具100可應用於執行模封(encapsulation)、蝕刻、沉積、電鍍、傳送之模組、設備、儀器及/或機台，但不限於此。在一些實施例，治具100可應用於執行模封的模組、設備、儀器及/或機台之腔室(chamber)內，此治具可放置於一基板(例如晶圓或其他載體)上，用以助於模封之材料更集中於基板之密封區，避免模封之材料(例如密封粉)位於非密封區上，以增進製造電子封裝結構之良率，以及減少模組、設備、儀器及/或機台的保養之頻率。需要注意的是，為了更清楚地敘述本揭露之技術特徵，圖1A及1B僅繪示出治具100的部分元件，所屬領域中具有通常知識者可以得知：當治具100應用於各種模組、設備、儀器及/或機台時，根據實際需求，治具100可更包含其他元件。 Referring to FIGS. 1A and 1B , FIG. 1A is a top view of a jig 100 according to an embodiment of the present invention, and FIG. 1B is a cross-sectional view of the jig 100 in FIG. 1A along line A-A. It should be noted that the jig 100 of the present disclosure can be applied in various modules, equipment, instruments and/or machines, or be a part of the modules, equipment, instruments and/or machines. In some embodiments, the jig 100 can be applied to modules, equipment, instruments and/or machines for manufacturing electronic packaging structures, semiconductor device structures or other devices. For example, the jig 100 can be applied to modules, equipment, instruments and/or machines for performing encapsulation, etching, deposition, electroplating, and transmission, but is not limited thereto. In some embodiments, the jig 100 can be applied in a chamber (chamber) of a module, equipment, instrument and/or machine for performing molding, and the jig can be placed on a substrate (such as a wafer or other carrier) On the one hand, the materials used to help the molding are more concentrated in the sealing area of the substrate, so as to prevent the molding material (such as sealing powder) from being located on the non-sealing area, so as to improve the yield of the electronic packaging structure and reduce the number of modules and equipment , The frequency of maintenance of instruments and/or machines. It should be noted that in order to more clearly describe the technical characteristics of this disclosure Figures 1A and 1B only show some components of the jig 100, those with ordinary knowledge in the field can know that when the jig 100 is applied to various modules, equipment, instruments and/or machines, according to the actual If required, the jig 100 may further include other components.

在一些實施例，治具100具有一本體。在一些實施例，本體包含環狀本體。上述環狀本體可具有圓形、橢圓形、矩形、三角形或其他形狀之輪廓。治具100的材料可包括金屬、合金、玻璃、陶瓷、高分子材料、上述之組合、且不限於此。 In some embodiments, the jig 100 has a body. In some embodiments, the body comprises an annular body. The aforementioned annular body may have a circular, elliptical, rectangular, triangular or other contour. The material of the jig 100 may include metals, alloys, glass, ceramics, polymer materials, combinations thereof, and are not limited thereto.

參閱圖1A及1B，在一些實施例，治具100包括頂部110、連接部120、支撐部130及導引部140。如圖1A所示，在一些實施例，頂部110可為治具100的最外層。在一些實施例，導引部140可為治具100的最內層。在一些實施例，連接部120位於頂部110及導引部140之間。在一些實施例，連接部120的一端連接頂部110，連接部120的另一端連接導引部140。在一些實施例，頂部110、連接部120及導引部140各別具有環形輪廓。因此，進一步而言，以上視圖觀之(如圖1A)，治具100具有環狀本體，故治具100的頂部110、連接部120、支撐部130(未顯示於圖1A)及導引部140係呈環狀，再參剖視圖(如圖1B)，治具100的頂部110、連接部120、支撐部130及導引部140係在垂直方向上彼此連接；在一些實施例中，頂部110、連接部120、支撐部130及導引部140係一體成形；又，連接部120與導引部140係向下且徑向地朝向治具100的環狀中心延伸，再者，導引部140自連接部120的一面向治具100內部的一表面突出且更進一步地朝向治具100的環狀中心延伸。 Referring to FIGS. 1A and 1B , in some embodiments, the jig 100 includes a top 110 , a connecting portion 120 , a supporting portion 130 and a guiding portion 140 . As shown in FIG. 1A , in some embodiments, the top 110 may be the outermost layer of the jig 100 . In some embodiments, the guiding part 140 may be the innermost layer of the jig 100 . In some embodiments, the connecting part 120 is located between the top part 110 and the guiding part 140 . In some embodiments, one end of the connection part 120 is connected to the top 110 , and the other end of the connection part 120 is connected to the guide part 140 . In some embodiments, the top 110 , the connecting portion 120 and the guiding portion 140 respectively have an annular profile. Therefore, further speaking, from the above view (as shown in FIG. 1A ), the jig 100 has a ring-shaped body, so the top 110 of the jig 100, the connecting portion 120, the supporting portion 130 (not shown in FIG. 1A ) and the guide portion 140 is ring-shaped, and referring to the sectional view (as shown in FIG. 1B ), the top 110, the connecting portion 120, the supporting portion 130 and the guiding portion 140 of the jig 100 are vertically connected to each other; in some embodiments, the top 110 , the connecting portion 120, the supporting portion 130 and the guiding portion 140 are integrally formed; again, the connecting portion 120 and the guiding portion 140 extend downward and radially towards the annular center of the jig 100; moreover, the guiding portion 140 protrudes from a surface of the connection portion 120 facing the inside of the jig 100 and further extends toward the annular center of the jig 100 .

如圖1B所示，頂部110可位於治具100的最高之水平高度。在一些實施例，治具100包含表面110s1、表面110s2及表面110s3。表面 110s1可大致與X軸平行(即大致呈水平表面)。表面110s1可與表面110s2大致平行，表面110s3可延伸於表面110s1及表面110s2之間。表面110s3可大致與Z軸平行(即大致呈垂直表面)。表面110s3可與表面110s1大致垂直。表面110s3可與表面110s2大致垂直。表面110s2可作為治具100的上表面。 As shown in FIG. 1B , the top 110 may be located at the highest level of the jig 100 . In some embodiments, the jig 100 includes a surface 110s1 , a surface 110s2 and a surface 110s3 . surface 110s1 may be substantially parallel to the X-axis (ie substantially a horizontal surface). The surface 110s1 may be substantially parallel to the surface 110s2 , and the surface 110s3 may extend between the surface 110s1 and the surface 110s2 . The surface 110s3 may be approximately parallel to the Z-axis (ie approximately a vertical surface). The surface 110s3 may be substantially perpendicular to the surface 110s1. The surface 110s3 may be substantially perpendicular to the surface 110s2. The surface 110s2 can serve as the upper surface of the jig 100 .

連接部120可從頂部110延伸。連接部120可具有表面120s1、表面120s2、表面120s3及表面120s4。連接部120的表面120s1可連接至支撐部130。連接部120的表面120s1可連接至表面120s2。在一些實施例，連接部120的表面120s1相對於表面120s2為傾斜表面。連接部120的表面120s1可為治具100的外側表面之一部分。 The connection part 120 may extend from the top 110 . The connection part 120 may have a surface 120s1 , a surface 120s2 , a surface 120s3 and a surface 120s4 . The surface 120s1 of the connection part 120 may be connected to the support part 130 . The surface 120s1 of the connection part 120 may be connected to the surface 120s2. In some embodiments, the surface 120s1 of the connecting portion 120 is an inclined surface relative to the surface 120s2 . The surface 120s1 of the connecting portion 120 can be a part of the outer surface of the jig 100 .

連接部120的表面120s2可延伸於連接部120的表面120s1及頂部110的表面110s1之間。連接部120的表面120s2可為治具100的外側表面之一部分。連接部120的表面120s2可連接至頂部110的表面110s1。連接部120的表面120s2可與頂部110的表面110s1垂直。 The surface 120s2 of the connection part 120 may extend between the surface 120s1 of the connection part 120 and the surface 110s1 of the top 110 . The surface 120s2 of the connecting portion 120 can be a part of the outer surface of the jig 100 . The surface 120s2 of the connection part 120 may be connected to the surface 110s1 of the top 110 . The surface 120s2 of the connection part 120 may be perpendicular to the surface 110s1 of the top 110 .

連接部120的表面120s3可由頂部110的表面110s2延伸。連接部120的表面120s3可為治具100的內側表面之一部分。連接部120的表面120s3可在連接部120的表面120s4及頂部110的表面110s2之間延伸。在一些實施例，連接部120的表面120s3相對於頂部110的表面110s2為傾斜表面。 The surface 120s3 of the connection part 120 may extend from the surface 110s2 of the top 110 . The surface 120s3 of the connecting portion 120 can be a part of the inner surface of the jig 100 . The surface 120s3 of the connection part 120 may extend between the surface 120s4 of the connection part 120 and the surface 110s2 of the top 110 . In some embodiments, the surface 120s3 of the connecting portion 120 is an inclined surface relative to the surface 110s2 of the top 110 .

連接部120的表面120s4可連接至導引部140。連接部120的表面120s4可在導引部140及連接部120的表面120s3之間延伸。連接部120的表面120s4可為治具100的內側表面之一部分。在一些實施例，連接部120的表面120s4相對於頂部110的表面110s2為傾斜表面。在一些實施例，連接部120的表面120s4與Z軸所構成的夾角θ1小於表面120s3與Z軸方向所構成的夾角θ2。當連接部120的表面120s3或表面120s4為傾斜表面，有助於模封之材料集中於基板(未繪示)的密封區，或是能避免模封之材料堆積在治具的平面的表面上，導致模封之材料未確實地沉積或堆積在基板上。連接部120沿X軸方向具有長度(或徑向剖面寬度)D1，沿Z軸方向具有長度(或高度)H1。在一些實施例，長度D1小於長度H1。當長度D1小於長度H1，可減少治具100的X軸方向之尺寸。 The surface 120s4 of the connection part 120 may be connected to the guide part 140 . The surface 120s4 of the connection part 120 can extend between the guide part 140 and the surface 120s3 of the connection part 120 . The surface 120s4 of the connecting portion 120 can be a part of the inner surface of the jig 100 . In some embodiments, the surface 120s4 of the connecting portion 120 is an inclined surface relative to the surface 110s2 of the top 110 . In a In some embodiments, the angle θ1 formed by the surface 120s4 of the connecting portion 120 and the Z axis is smaller than the angle θ2 formed by the surface 120s3 and the Z axis. When the surface 120s3 or the surface 120s4 of the connecting portion 120 is an inclined surface, it is helpful for the molding material to concentrate on the sealing area of the substrate (not shown), or to prevent the molding material from accumulating on the flat surface of the jig , causing the molded material to not be deposited or accumulated on the substrate properly. The connecting portion 120 has a length (or radial section width) D1 along the X-axis direction, and a length (or height) H1 along the Z-axis direction. In some embodiments, length D1 is less than length H1. When the length D1 is smaller than the length H1, the size of the jig 100 in the X-axis direction can be reduced.

在一些實施例，支撐部130的一端可與導引部140連接。在一些實施例，支撐部130的另一端可與連接部120連接。在一些實施例，支撐部130具有表面130s1(或支撐面)、表面130s2(或內表面)及表面130s3。在一些實施例，支撐部130具有內側130e，內側130e面向另一相對的內側。在一些實施例，支撐部130的內側130e包含表面130s2。 In some embodiments, one end of the support part 130 may be connected with the guide part 140 . In some embodiments, the other end of the supporting part 130 may be connected to the connecting part 120 . In some embodiments, the supporting portion 130 has a surface 130s1 (or a supporting surface), a surface 130s2 (or an inner surface) and a surface 130s3 . In some embodiments, the support portion 130 has an inner side 130e facing another opposite inner side. In some embodiments, the inner side 130e of the support portion 130 includes a surface 130s2.

支撐部130的表面130s1可與大致X軸平行(即大致呈水平表面)。在一些實施例，支撐部130的表面130s1可位於治具100的最低的水平高度。支撐部130的表面130s1可作為治具100的下表面。在一些實施例，支撐部130的表面130s1係用以抵觸基板之表面。支撐部130的表面130s1延伸於支撐部130的表面130s2及表面130s3之間。在一些實施例中，支撐部130的表面130s1可作為治具100的本體的底部。 The surface 130s1 of the supporting portion 130 may be substantially parallel to the X-axis (that is, substantially a horizontal surface). In some embodiments, the surface 130s1 of the support portion 130 may be located at the lowest level of the jig 100 . The surface 130s1 of the supporting part 130 can serve as the lower surface of the jig 100 . In some embodiments, the surface 130s1 of the supporting portion 130 is used to contact the surface of the substrate. The surface 130s1 of the supporting part 130 extends between the surface 130s2 and the surface 130s3 of the supporting part 130 . In some embodiments, the surface 130s1 of the supporting part 130 may serve as the bottom of the jig 100 body.

支撐部130的表面130s2由表面130s1延伸。支撐部130的表面130s2可連接至導引部140。在一些實施例，支撐部130的表面130s2與支撐部130的表面130s1大抵上垂直。支撐部130的表面130s2可作為治具100的內側表面之一部分。 The surface 130s2 of the supporting part 130 is extended from the surface 130s1. The surface 130s2 of the support part 130 may be connected to the guide part 140 . In some embodiments, the surface 130s2 of the support portion 130 is substantially perpendicular to the surface 130s1 of the support portion 130 . The surface 130s2 of the support portion 130 can be used as a part of the inner surface of the jig 100 .

支撐部130的表面130s3可連接至連接部120。在一些實施例，支撐部130的表面130s3可在支撐部130的表面130s1與連接部120的表面120s1之間延伸。在一些實施例，支撐部130的表面130s3沿Z軸方向的長度大於支撐部130的表面130s2沿Z軸方向的長度。 The surface 130s3 of the support part 130 may be connected to the connection part 120 . in some implementations For example, the surface 130s3 of the supporting part 130 may extend between the surface 130s1 of the supporting part 130 and the surface 120s1 of the connecting part 120 . In some embodiments, the length of the surface 130s3 of the supporting part 130 along the Z-axis direction is greater than the length of the surface 130s2 of the supporting part 130 along the Z-axis direction.

在一些實施例，導引部140自連接部120的表面120s4突出並朝向治具100的中心延伸。在一些實施例，導引部140可由支撐部130朝向治具100的中心延伸。在一些實施例，導引部140由支撐部130的表面130s2突出。在一些實施例，導引部140的水平高度介於支撐部130的水平高度與連接部120的水平高度之間。在一些實施例，導引部140大致位於連接部120與支撐部130之間。在一些實施例，導引部140鄰近於支撐部130的表面130s1。在一些實施例，導引部140與支撐部130的表面130s1之間的距離小於導引部140與頂部110的表面110s2之間的距離。在一些實施例，導引部140在支撐部130的表面130s2中遠離表面130s1的一側周向地延伸。在一些實施例，導引部140與支撐部130定義一空間(或容置空間)S於導引部140下方。在一些實施例，導引部140具有表面140s1(或底表面)及表面140s2(或導引面、傾斜面)。 In some embodiments, the guiding part 140 protrudes from the surface 120s4 of the connecting part 120 and extends toward the center of the jig 100 . In some embodiments, the guiding part 140 may extend from the supporting part 130 toward the center of the jig 100 . In some embodiments, the guiding part 140 protrudes from the surface 130s2 of the supporting part 130 . In some embodiments, the level of the guiding part 140 is between the level of the supporting part 130 and the level of the connecting part 120 . In some embodiments, the guiding part 140 is roughly located between the connecting part 120 and the supporting part 130 . In some embodiments, the guiding part 140 is adjacent to the surface 130s1 of the supporting part 130 . In some embodiments, the distance between the guide part 140 and the surface 130s1 of the support part 130 is smaller than the distance between the guide part 140 and the surface 110s2 of the top 110 . In some embodiments, the guide part 140 extends circumferentially on a side of the surface 130s2 of the support part 130 away from the surface 130s1 . In some embodiments, the guiding part 140 and the supporting part 130 define a space (or accommodating space) S below the guiding part 140 . In some embodiments, the guiding portion 140 has a surface 140s1 (or bottom surface) and a surface 140s2 (or guiding surface, inclined surface).

導引部140的表面140s1可與支撐部130的表面130s2相連。導引部140的表面140s1面向空間S。在一些實施例，導引部140的表面140s1由支撐部130的表面130s2朝向治具100的中心延伸。導引部140的表面140s1可大致與X軸平行(即大致呈水平表面)或與支撐部130之表面130s1平行。在一些實施例，導引部140的表面140s1可與支撐部130的表面130s2定義空間S。在一些實施例，導引部140的表面140s1可與支撐部130的表面130s2大抵上垂直。導引部140的表面140s1的水平高度高於支撐部130的表面130s1的水平高度。導引部140的表面140s1 可作為導引部140的的下表面。在一些實施例，導引部140的表面140s1可與支撐部130的表面130s2的夾角θ4大致上等於90度，亦即，夾角θ4為直角。在一些實施例，導引部140的表面140s1自本體的內表面(例如支撐部130的表面130s1)突出。導引部140的表面140s1大致為水平延伸。 The surface 140s1 of the guiding part 140 may be connected to the surface 130s2 of the supporting part 130 . A surface 140s1 of the guide part 140 faces the space S. As shown in FIG. In some embodiments, the surface 140s1 of the guiding part 140 extends toward the center of the jig 100 from the surface 130s2 of the supporting part 130 . The surface 140s1 of the guiding part 140 may be substantially parallel to the X-axis (that is, substantially a horizontal surface) or parallel to the surface 130s1 of the supporting part 130 . In some embodiments, the surface 140s1 of the guiding part 140 may define a space S with the surface 130s2 of the supporting part 130 . In some embodiments, the surface 140s1 of the guiding part 140 may be substantially perpendicular to the surface 130s2 of the supporting part 130 . The level of the surface 140s1 of the guide part 140 is higher than the level of the surface 130s1 of the support part 130 . Surface 140s1 of the guide part 140 It can be used as the lower surface of the guide part 140 . In some embodiments, the included angle θ4 between the surface 140s1 of the guiding part 140 and the surface 130s2 of the supporting part 130 is substantially equal to 90 degrees, that is, the included angle θ4 is a right angle. In some embodiments, the surface 140s1 of the guiding part 140 protrudes from the inner surface of the body (eg, the surface 130s1 of the supporting part 130 ). The surface 140s1 of the guiding portion 140 extends substantially horizontally.

導引部140的表面140s2可由連接部120的表面120s4大致向治具100的環狀中心延伸。在一些實施例，導引部140的表面140s2相對於表面140s1為傾斜表面。在一些實施例，導引部140的表面140s2與空間S沿Z軸方向相互重疊。在一些實施例，導引部140的表面140s2自連接部120的表面120s4向下且徑向向內傾斜。在一些實施例，導引部140的表面140s2與連接部120的表面120s4不共面。在一些實施例，導引部140的表面140s2與Z軸之間的夾角θ3大於連接部120的表面120s4與Z軸之間的夾角θ1。當導引部140的表面140s2為傾斜表面，有助於模封之材料集中於基板的密封區，或是能避免模封之材料堆積在平坦的表面上，導致模封之材料未確實地沉積或堆積在基板上。在一些實施例，支撐部130之表面130s2與導引部140之側邊(表面140s2遠離表面130s2之邊)之間的水平距離L2(亦即，線段B-B與線段C-C之距離)會隨著表面130s2自表面130s1與表面130s2彼此相交構成之交線E1處向上延伸而大致固定。在一些實施例，治具100的本體之內表面(例如支撐部130的表面130s2)具有與本體之底表面(例如支撐部的表面130s1)及導引部140之表面140s2連接之一部分，且部分係大致與導引部140之表面140s1垂直相交。 The surface 140s2 of the guiding part 140 may extend approximately from the surface 120s4 of the connecting part 120 toward the center of the ring of the jig 100 . In some embodiments, the surface 140s2 of the guide part 140 is an inclined surface relative to the surface 140s1. In some embodiments, the surface 140s2 of the guiding portion 140 and the space S overlap each other along the Z-axis direction. In some embodiments, the surface 140s2 of the guiding portion 140 is inclined downward and radially inward from the surface 120s4 of the connecting portion 120 . In some embodiments, the surface 140s2 of the guiding portion 140 is not coplanar with the surface 120s4 of the connecting portion 120 . In some embodiments, the angle θ3 between the surface 140s2 of the guiding part 140 and the Z axis is larger than the angle θ1 between the surface 120s4 of the connecting part 120 and the Z axis. When the surface 140s2 of the guide part 140 is an inclined surface, it is helpful for the molding material to concentrate on the sealing area of the substrate, or it can prevent the molding material from accumulating on the flat surface, resulting in inaccurate deposition of the molding material or stacked on the substrate. In some embodiments, the horizontal distance L2 between the surface 130s2 of the support part 130 and the side of the guide part 140 (the side of the surface 140s2 away from the surface 130s2) (that is, the distance between the line segment B-B and the line segment C-C) will follow the surface 130s2 extends upward from the intersection line E1 formed by the intersection of the surface 130s1 and the surface 130s2 and is substantially fixed. In some embodiments, the inner surface of the body of the jig 100 (such as the surface 130s2 of the support part 130) has a part connected with the bottom surface of the body (such as the surface 130s1 of the support part) and the surface 140s2 of the guide part 140, and a part It is substantially perpendicular to the surface 140s1 of the guide portion 140 .

在一些實施例，連接部120的表面120s3、連接部120的表面120s4、支撐部130的表面130s2及導引部140的表面140s2可作為治具100的內側表面或內表面。上述表面面向治具100位於另一側的內側表面。在一些實施例，治具100的頂部110、連接部120、支撐部130及導引部140由相同的材料製成。在一些實施例，治具100的頂部110、連接部120、支撐部130及導引部140為一體成形。亦即，頂部110、連接部120、支撐部130及導引部140彼此之間沒有界面或明顯的邊界。 In some embodiments, the surface 120s3 of the connecting part 120 , the surface 120s4 of the connecting part 120 , the surface 130s2 of the supporting part 130 and the surface 140s2 of the guiding part 140 can serve as the inner surface or inner surface of the jig 100 . The above-mentioned surface faces the inner surface on the other side of the jig 100 noodle. In some embodiments, the top 110 , the connecting portion 120 , the supporting portion 130 and the guiding portion 140 of the jig 100 are made of the same material. In some embodiments, the top 110 , the connecting portion 120 , the supporting portion 130 and the guiding portion 140 of the jig 100 are integrally formed. That is, the top 110 , the connecting portion 120 , the supporting portion 130 and the guiding portion 140 have no interfaces or obvious boundaries among each other.

圖2A係根據本發明之實施例之治具100與基板200的剖面圖。圖2A繪示當治具100應用於製造電子封裝結構之模組、設備、儀器及/或機台時，治具100與基板200之間的位置關係。應該注意的是，圖2A及2B僅繪示出治具100或基板200的部分元件，所屬領域中具有通常知識者可以得知：根據實際需求，治具100及基板200可更包含其他元件。 FIG. 2A is a cross-sectional view of the jig 100 and the substrate 200 according to an embodiment of the present invention. FIG. 2A shows the positional relationship between the jig 100 and the substrate 200 when the jig 100 is applied to modules, equipment, instruments and/or machines for manufacturing electronic packaging structures. It should be noted that FIGS. 2A and 2B only show some components of the jig 100 or the substrate 200 , and those skilled in the art can know that the jig 100 and the substrate 200 may further include other components according to actual needs.

在一些實施例，基板200可為半導體基板、玻璃基板、陶瓷基板或其他適合的材料。半導體基板可包括但不限於晶圓。基板200的一表面200s1(如，上表面)具有密封區200A(或區域200A)及周邊區200B(或區域200B)。在一些實施例，密封區200A係用於定義封裝體形成的區域。在一些實施例，周邊區200B係用於定義基板200中不欲被封裝體所覆蓋的區域。在一些實施例，周邊區200B可作為基板200支撐治具100或其他元件之區域。在一些實施例，周邊區200B位於基板200的周邊，且環繞密封區200A。在一些實施例，周邊區200B位於基板200的表面200s1之邊緣。 In some embodiments, the substrate 200 can be a semiconductor substrate, a glass substrate, a ceramic substrate or other suitable materials. A semiconductor substrate may include, but is not limited to, a wafer. A surface 200s1 (eg, upper surface) of the substrate 200 has a sealing region 200A (or region 200A) and a peripheral region 200B (or region 200B). In some embodiments, the sealing area 200A is used to define the area where the package is formed. In some embodiments, the peripheral area 200B is used to define the area of the substrate 200 that is not intended to be covered by the package. In some embodiments, the peripheral region 200B can serve as a region where the substrate 200 supports the jig 100 or other components. In some embodiments, the peripheral region 200B is located at the periphery of the substrate 200 and surrounds the sealing region 200A. In some embodiments, the peripheral region 200B is located at the edge of the surface 200s1 of the substrate 200 .

在一些實施例，基板200包含複數個晶粒210。晶粒210可位於密封區200A上。在一些實施例，在一些實施例中，每個晶粒210可以包括晶粒(die)或晶片(chip)，例如信號處理晶粒(例如，數字信號處理(digital signal processing，DSP))、存儲器晶粒(例如，動態隨機存取存儲器(dynamic random access memory，DRAM)晶片、靜態隨機存取存儲器(static random access memory，SRAM)晶片等)、邏輯晶片(例如，應用處理器(application processor，AP)、晶片上系統(system-on-a-chip，SoC)、中央處理單元(central processing unit，CPU)、圖形處理單元)(graphics processing unit，GPU)、微控制器等、電源管理晶片(例如電源管理集成電路(power management integrated circuit，PMIC)晶片)、射頻(radio frequency，RF)晶片、傳感器晶片、微機電系統(micro-electro-mechanical-system，MEMS)晶粒、前端晶粒(例如，模擬前端(analog front-end，AFE)晶粒)或其他主動元件。在一些實施例中，主動元件可包括多個電晶體、二極體或其他主動元件。電晶體可以包括雙極性電晶體、金屬氧化物半導體場效電晶體、接面場效電晶體或其他電晶體。二極體可以包括齊納二極體、光電二極體、蕭特基二極體或其他二極體。在一些實施例，晶粒210的一部分可為虛置(dummy)晶粒。在一些實施例，位於空間S下方的晶粒210為虛置晶粒。虛置晶粒可用以調整基板200的翹曲(warpage)，來減少基板200的不同區域中的翹曲差異。在一些實施例，基板200的周邊區200B不具有晶粒210。 In some embodiments, the substrate 200 includes a plurality of dies 210 . Die 210 may be located on sealing region 200A. In some embodiments, in some embodiments, each die 210 may include a die or a chip, such as a signal processing die (eg, digital signal processing (DSP)), a memory Die (for example, dynamic random access memory (dynamic random access memory, DRAM) chip, static random access memory access memory (static random access memory, SRAM chip, etc.), logic chip (for example, application processor (application processor, AP), system-on-a-chip (SoC), central processing unit (central processing unit (CPU), graphics processing unit (graphics processing unit, GPU), microcontroller, etc., power management chip (such as power management integrated circuit (power management integrated circuit, PMIC) chip), radio frequency (radio frequency, RF) chip, sensor chip, micro-electro-mechanical-system (MEMS) die, front-end die (eg, analog front-end (AFE) die) or other active components. In some embodiments, the active element may include a plurality of transistors, diodes, or other active elements. Transistors may include bipolar transistors, metal oxide semiconductor field effect transistors, junction field effect transistors, or other transistors. The diodes may include Zener diodes, photodiodes, Schottky diodes, or other diodes. In some embodiments, a portion of the die 210 may be a dummy die. In some embodiments, the die 210 located under the space S is a dummy die. The dummy die can be used to adjust the warpage of the substrate 200 to reduce warpage differences in different regions of the substrate 200 . In some embodiments, the peripheral region 200B of the substrate 200 does not have the die 210 .

治具100可位於基板200的周邊區200B上。在一些實施例，治具100的支撐部130位於基板200上，並抵觸(抵頂且碰觸)基板200的表面200s1。在一些實施例，治具100在Z方向上至少與密封區200A的一部份重疊。在一些實施例，治具100在Z方向上至少與一個晶粒210重疊。在一些實施例，治具100的導引部140在Z方向上至少覆蓋晶粒210。在一些實施例，治具100的頂部110與基板200沿Z方向並未重疊。在一些實施例，治具100的連接部120的一部分與基板200沿Z方向重疊。在一些實施例，治具100的連接部120的一部分與基板200沿Z方向未重疊。 The jig 100 can be located on the peripheral area 200B of the substrate 200 . In some embodiments, the supporting portion 130 of the jig 100 is located on the substrate 200 , and is in contact with (abuts against and touches) the surface 200s1 of the substrate 200 . In some embodiments, the jig 100 overlaps at least a part of the sealing area 200A in the Z direction. In some embodiments, the jig 100 overlaps at least one die 210 in the Z direction. In some embodiments, the guiding portion 140 of the jig 100 at least covers the die 210 in the Z direction. In some embodiments, the top 110 of the jig 100 does not overlap with the substrate 200 along the Z direction. In some embodiments, a part of the connecting portion 120 of the jig 100 overlaps with the substrate 200 along the Z direction. In some embodiments, a part of the connecting portion 120 of the jig 100 does not overlap with the substrate 200 along the Z direction.

圖2B係圖2A的局部放大圖。在一些實施例，治具100的支撐部130的表面130s1接觸基板200的表面200s1(或上表面)。在一些實施例，由治具100的支撐部130及導引部140定義的空間S係用以容納晶粒210。在一些實施例，空間S由治具100的支撐部130、導引部140及基板200的表面200s1所定義。在一些實施例，治具100的導引部140的表面140s1覆蓋至少一個晶粒210的一部分。在一些實施例，治具100不會接觸晶粒210。在一些實施例，導引部140的表面140s1大致面向基板200，且經抵觸(抵頂及碰觸)後大致與基板200之表面200s1平行。 Fig. 2B is a partially enlarged view of Fig. 2A. In some embodiments, the surface 130s1 of the support portion 130 of the jig 100 contacts the surface 200s1 (or upper surface) of the substrate 200 . In some embodiments, the space S defined by the supporting part 130 and the guiding part 140 of the jig 100 is used to accommodate the die 210 . In some embodiments, the space S is defined by the supporting part 130 of the jig 100 , the guiding part 140 and the surface 200s1 of the substrate 200 . In some embodiments, the surface 140s1 of the guiding portion 140 of the jig 100 covers at least a part of the die 210 . In some embodiments, the jig 100 does not contact the die 210 . In some embodiments, the surface 140s1 of the guiding portion 140 is substantially facing the substrate 200 , and is substantially parallel to the surface 200s1 of the substrate 200 after being bumped against (butted against and touched).

在一些實施例，治具100的支撐部130之表面130s1至導引部140之一距離(亦即表面130s2沿Z方向的長度H2)約介於0.8毫米至約2毫米，例如0.8毫米、1毫米、1.3毫米、1.5毫米、1.8毫米或2毫米。當長度H2介於上述範圍時，空間S能用於容納晶粒210。在一些實施例，基板200之表面200s2(或側表面)與治具100的支撐部130的表面130s2之間沿X方向的距離D2大致小於5毫米，例如5毫米、4.5毫米、3.5毫米、2.5毫米、1.5毫米或0.5毫米。當距離D2介於上述範圍時，基板200之表面200s1可具有更多的空間用來形成晶粒210。在一些實施例，位於基板200最外側的晶粒210與基板200的表面200s2的距離大致上介於約3毫米至約10毫米，例如3毫米、4毫米、5毫米、6毫米、7毫米、8毫米、9毫米或10毫米。 In some embodiments, the distance between the surface 130s1 of the support portion 130 of the jig 100 and the guide portion 140 (that is, the length H2 of the surface 130s2 along the Z direction) is about 0.8 mm to about 2 mm, such as 0.8 mm, 1 mm, 1.3mm, 1.5mm, 1.8mm or 2mm. When the length H2 is within the above range, the space S can be used to accommodate the die 210 . In some embodiments, the distance D2 along the X direction between the surface 200s2 (or side surface) of the substrate 200 and the surface 130s2 of the support portion 130 of the jig 100 is substantially less than 5 millimeters, such as 5 millimeters, 4.5 millimeters, 3.5 millimeters, 2.5 millimeters, mm, 1.5 mm or 0.5 mm. When the distance D2 is within the above range, the surface 200s1 of the substrate 200 may have more space for forming the crystal grain 210 . In some embodiments, the distance between the outermost die 210 of the substrate 200 and the surface 200s2 of the substrate 200 is approximately 3 mm to 10 mm, such as 3 mm, 4 mm, 5 mm, 6 mm, 7 mm, 8mm, 9mm or 10mm.

在一些實施例，導引部140具有遠離支撐部130之邊緣E2，支撐部之內側130e具有遠離導引部140之邊緣E1，導引部140之邊緣E2至支撐部130之內側130e之邊緣E1共同界定平面P。在一些實施例，空間S自平面P朝向支撐部130之內側130e凹陷。在一些實施例，平面P 會通過空間S。在一些實施例，支撐部130的邊緣E1包括表面130s1與表面130s2彼此相交所構成之一交線。在一些實施例，導引部140的邊緣E2包括表面140s遠離支撐部130之一側邊。在一些實施例，導引部140的表面140s1面向基板200。 In some embodiments, the guide portion 140 has an edge E2 away from the support portion 130, the inner side 130e of the support portion has an edge E1 away from the guide portion 140, and the edge E2 of the guide portion 140 reaches the edge E1 of the inner side 130e of the support portion 130. jointly define the plane P. In some embodiments, the space S is recessed from the plane P toward the inner side 130e of the supporting portion 130 . In some embodiments, the plane P will pass through the space S. In some embodiments, the edge E1 of the supporting portion 130 includes an intersection line formed by the intersection of the surface 130s1 and the surface 130s2 . In some embodiments, the edge E2 of the guiding part 140 includes a side of the surface 140s away from the supporting part 130 . In some embodiments, the surface 140s1 of the guiding portion 140 faces the substrate 200 .

在一比較例，治具並未有容置空間用以容納晶粒，在此情況下，治具的底部容易擦撞晶粒，導致晶粒損傷。此外，當治具的底部壓到晶粒時，會導致治具無法按壓在基板的上表面，使得治具與基板無法形成封閉的區域，在這樣的情況下執行模封操作時，模封之材料會在基板移動時，經由未封閉的區域掉落至基板的密封區外，導致封膜時產生破片。在本揭露實施例，治具100具有空間S容納晶粒210。空間S由互相垂直的支撐部130的表面130s2及導引部140的表面140s1所定義，此空間S的形狀(或輪廓)順應晶粒210的形狀(或輪廓)，且空間S距離基板200的表面200s1的距離大於晶粒210的厚度。因此，在將治具100放置到基板200的表面200s1時，能避免晶粒210受到損害。在一些實施例，治具100的支撐部130的表面130s1與基板200的表面200s1並未有縫隙。因此，在基板200移動的過程中，沒有路徑讓密封之材料移動至基板200外的可能性。因此，搭配治具100，能提升形成電子封裝結構的良率。在此實施例，導引部140亦可稱為模封材料導引部。 In a comparative example, the jig does not have an accommodating space for accommodating the die. In this case, the bottom of the jig easily collides with the die, resulting in damage to the die. In addition, when the bottom of the jig is pressed against the die, the jig cannot be pressed against the upper surface of the substrate, so that the jig and the substrate cannot form a closed area. When the substrate is moving, the material will fall through the unsealed area to the outside of the sealing area of the substrate, resulting in fragments during sealing. In the disclosed embodiment, the jig 100 has a space S for accommodating the die 210 . The space S is defined by the surface 130s2 of the support part 130 and the surface 140s1 of the guide part 140 which are perpendicular to each other. The distance of the surface 200s1 is greater than the thickness of the grain 210 . Therefore, when the jig 100 is placed on the surface 200s1 of the substrate 200, the die 210 can be prevented from being damaged. In some embodiments, there is no gap between the surface 130s1 of the support portion 130 of the jig 100 and the surface 200s1 of the substrate 200 . Therefore, there is no possibility for the sealing material to move out of the substrate 200 during the movement of the substrate 200 . Therefore, with the jig 100 , the yield rate of the electronic packaging structure can be improved. In this embodiment, the guiding part 140 can also be called a molding material guiding part.

圖3A、圖3B、圖3C、圖3D及圖3E係根據本發明之實施例之形成電子封裝結構300之不同階段的剖面圖。 3A , 3B, 3C, 3D and 3E are cross-sectional views of different stages of forming an electronic package structure 300 according to an embodiment of the present invention.

參閱圖3A，提供治具100及基板200。治具100具有頂部110、連接部120、支撐部130及導引部140。基板200具有密封區200A及環繞密封區200A的周邊區200B。晶粒210位於基板200的表面200s1 上。在一些實施例，治具100的導引部140具有表面140s2，表面140s2係朝下且朝向基板200之密封區200A傾斜。在一些實施例，治具100的支撐部130的表面130s1抵觸(抵頂及接觸)於基板200的表面200s1上。在一些實施例，治具100的支撐部130的表面130s1及導引部140的表面140s1定義空間S容納晶粒210。晶粒210緊鄰治具100且位於治具100之導引部140之下側。 Referring to FIG. 3A , a jig 100 and a substrate 200 are provided. The jig 100 has a top 110 , a connecting portion 120 , a supporting portion 130 and a guiding portion 140 . The substrate 200 has a sealing area 200A and a peripheral area 200B surrounding the sealing area 200A. The die 210 is located on the surface 200s1 of the substrate 200 superior. In some embodiments, the guide portion 140 of the jig 100 has a surface 140s2 , and the surface 140s2 is downward and inclined toward the sealing area 200A of the substrate 200 . In some embodiments, the surface 130s1 of the support portion 130 of the jig 100 is in contact with (butted against and in contact with) the surface 200s1 of the substrate 200 . In some embodiments, the surface 130s1 of the supporting part 130 and the surface 140s1 of the guiding part 140 of the jig 100 define a space S for accommodating the die 210 . The die 210 is adjacent to the jig 100 and located under the guide portion 140 of the jig 100 .

參閱圖3B，執行操作400，使得複數個模封材料402沉積或堆積於基板200的表面200s1上。在一些實施例，操作400可包括但不限於點膠操作。 Referring to FIG. 3B , operation 400 is performed such that a plurality of molding materials 402 are deposited or accumulated on the surface 200 s1 of the substrate 200 . In some embodiments, operations 400 may include, but are not limited to, dispensing operations.

模封材料402由模制材料(例如密封粉)所製成，所述模制材料可包含酚醛清漆基樹脂、環氧基樹脂、聚矽氧基樹脂或其它合適的模制材料。模封材料402還可包含合適的填料，例如粉末SiO₂。模封材料402可沉積或堆積基板200的密封區200A上。模封材料402可經由治具100的傾斜表面，例如連接部120的表面120s3、表面120s4及導引部140的表面140s2而集中在基板200的密封區200A上，而避免堆積在平坦的表面上，造成模封材料402並未確實的沉積或堆積在基板200的密封區200A上。在此實施例，治具100之本體係經構形以抵頂基板200之表面200s1，導引部140經構形以導引來自基板200之上方並下落至該基板200之表面200s1的密封材料(例如密封粉末)，使密封材料減少下落至位於基板200之表面200s1上且鄰近該基板之表面200s2(亦即表面200s1之邊緣)之周邊區200B內。如圖3B所示，導引部140的表面140s2位於周邊區200B的上方。 The molding material 402 is made of a molding material such as sealing powder, and the molding material may include novolac-based resin, epoxy-based resin, polysiloxy resin or other suitable molding materials. The molding material 402 may also contain suitable fillers, such as powdered SiO ₂ . The molding material 402 can be deposited or accumulated on the sealing area 200A of the substrate 200 . The molding material 402 can be concentrated on the sealing area 200A of the substrate 200 through the inclined surface of the jig 100, such as the surface 120s3, the surface 120s4 of the connecting part 120, and the surface 140s2 of the guiding part 140, so as to avoid accumulation on the flat surface , causing the molding material 402 to not be reliably deposited or accumulated on the sealing region 200A of the substrate 200 . In this embodiment, the body of the jig 100 is configured to abut against the surface 200s1 of the substrate 200, and the guide part 140 is configured to guide the sealing material that comes from above the substrate 200 and falls to the surface 200s1 of the substrate 200. (such as sealing powder), so as to reduce the sealing material falling into the peripheral area 200B on the surface 200s1 of the substrate 200 and adjacent to the surface 200s2 of the substrate (ie, the edge of the surface 200s1 ). As shown in FIG. 3B , the surface 140s2 of the guiding portion 140 is located above the peripheral area 200B.

參閱圖3C，在操作400的過程中，模封材料402沉積或堆積在基板200的密封區200A上，形成封裝體230。在一些實施例，模封材料402可進入由治具100的支撐部130的表面130s1及導引部140的表面140s2定義空間S內。在一些實施例，支撐部130的表面130s1抵觸(抵頂及接觸)基板200的表面200s1而形成空間S。由於支撐部130的表面130s1抵觸(抵頂及接觸)基板200的表面200s1，模封材料402不會經由支撐部130的表面130s1與基板200的表面200s1之間的空隙而溢出至基板200的周邊區200B。亦即，空間S有助於模封材料402集中於基板200的密封區200A上。在一些實施例，封裝體230具有表面230s1及環繞表面230s1的表面230s2。表面230s1並未與治具100的導引部140沿Z軸方向重疊，表面230s2與治具100的導引部140沿Z軸方向重疊。在一些實施例，封裝體230的表面230s1為非平坦表面。在一些實施例，封裝體230的表面230s2為平坦表面，或相較於表面230s1平坦。封裝體230在對應表面230s1處沿Z軸方向具有厚度H3，在對應表面230s2處沿Z軸方向具有厚度H4。在一些實施例，厚度H3大於厚度H4。 Referring to FIG. 3C , during operation 400 , a molding material 402 is deposited or accumulated on the sealing area 200A of the substrate 200 to form the package body 230 . In some embodiments, the molded The material 402 can enter into the space S defined by the surface 130s1 of the supporting part 130 and the surface 140s2 of the guiding part 140 of the jig 100 . In some embodiments, the surface 130s1 of the support portion 130 collides (butts against and contacts) the surface 200s1 of the substrate 200 to form a space S. Referring to FIG. Since the surface 130s1 of the support part 130 is in contact with (butted against and in contact with) the surface 200s1 of the substrate 200, the molding material 402 will not overflow to the periphery of the substrate 200 through the gap between the surface 130s1 of the support part 130 and the surface 200s1 of the substrate 200 District 200B. That is, the space S helps the molding material 402 concentrate on the sealing area 200A of the substrate 200 . In some embodiments, the package body 230 has a surface 230s1 and a surface 230s2 surrounding the surface 230s1. The surface 230s1 does not overlap with the guide portion 140 of the jig 100 along the Z-axis direction, and the surface 230s2 overlaps with the guide portion 140 of the jig 100 along the Z-axis direction. In some embodiments, the surface 230s1 of the package body 230 is an uneven surface. In some embodiments, the surface 230s2 of the package body 230 is a flat surface, or is flatter than the surface 230s1. The package body 230 has a thickness H3 along the Z-axis direction at the corresponding surface 230s1 , and has a thickness H4 along the Z-axis direction at the corresponding surface 230s2 . In some embodiments, thickness H3 is greater than thickness H4.

參閱圖3D，移除治具100，並硬化封裝體230。在一些實施例，在封裝體230尚未硬化的狀態中，移動基板200，將基板200移入至用於硬化封裝體230的模組、設備、儀器及/或機台(未繪示)內，將封裝體230硬化。 Referring to FIG. 3D , the jig 100 is removed, and the encapsulation body 230 is hardened. In some embodiments, when the package body 230 is not hardened, the substrate 200 is moved, and the substrate 200 is moved into a module, equipment, instrument and/or machine (not shown) for hardening the package body 230, and the The package body 230 is cured.

參閱圖3E，可執行平坦化操作，移除封裝體230的表面230s1及/或表面230s2的一部分，使得封裝體230具有平坦的表面230s3，以形成電子封裝結構300。 Referring to FIG. 3E , a planarization operation may be performed to remove a part of the surface 230s1 and/or the surface 230s2 of the package body 230 so that the package body 230 has a flat surface 230s3 to form the electronic package structure 300 .

圖4係根據本發明之實施例之治具100'與基板200的剖面圖。圖4所示的治具100'與圖2B的治具100相似，不同處在於：支撐部130'的表面130s2'相對於支撐部130'的表面130s1'為傾斜表面。在一些實施例，支撐部130'的表面130s2'與導引部140s1'的表面構成的夾角θ5小於90度，亦即，夾角θ5為銳角。在一些實施例，支撐部130'之表面130s2'與導引部140'之側邊(亦即，邊緣E2')之間的水平距離L2(亦即，線段D-D與線段E-E之距離)會隨著表面130s2'自表面130s1'與表面130s2'彼此相交構成之交線(亦即，邊緣E1)處向上延伸而逐漸增加。 FIG. 4 is a cross-sectional view of a jig 100 ′ and a substrate 200 according to an embodiment of the present invention. The jig 100 ′ shown in FIG. 4 is similar to the jig 100 shown in FIG. 2B , except that the surface 130s2 ′ of the support portion 130 ′ is an inclined surface relative to the surface 130s1 ′ of the support portion 130 ′. in some real In an embodiment, the included angle θ5 formed by the surface 130s2' of the supporting part 130' and the surface of the guiding part 140s1' is less than 90 degrees, that is, the included angle θ5 is an acute angle. In some embodiments, the horizontal distance L2 (ie, the distance between the line segment D-D and the line segment E-E) between the surface 130s2' of the supporting part 130' and the side of the guiding part 140' (ie, the edge E2') will vary with The landing surface 130s2' extends upward from the intersection line formed by the intersection of the surface 130s1' and the surface 130s2' (that is, the edge E1) and gradually increases.

在其他實施例，空間S'進一步往表面140s1'的方向延伸超過側邊(亦即，邊緣E2)的水平高度，亦即，表面140s1'往表面130s2'的方向向上延伸。在此實施例，導引部140'的表面140s1'相對於支撐部130'的表面130s2'為傾斜表面。在此實施例，支撐部130'的表面130s2'與導引部140'的表面140s1'構成的夾角小於90度。 In other embodiments, the space S′ further extends toward the surface 140s1 ′ beyond the level of the side (ie, the edge E2 ), that is, the surface 140s1 ′ extends upward toward the surface 130s2 ′. In this embodiment, the surface 140s1' of the guiding part 140' is an inclined surface relative to the surface 130s2' of the supporting part 130'. In this embodiment, the angle formed by the surface 130s2' of the supporting part 130' and the surface 140s1' of the guiding part 140' is less than 90 degrees.

在比較例中，治具並未有容置空間用以容納晶粒，在此情況下，治具的底部容易擦撞晶粒，導致晶粒損傷。且當密封粉沉積或堆積完成，尚未硬化的狀態下，在密封粉沉積體的周邊並未有平坦的表面，這使得在移動基板至用於硬化封裝體230的模組、設備、儀器及/或機台的過程中，密封粉會沿著傾斜的周邊表面散落至基板的非密封區，造成密封粉沉積體的厚度異常。在本揭露一些實施例，治具100形成的空間S讓封裝體230在周邊處具有相對平坦的表面230s2，使得在封裝體230尚未硬化的狀態下移動基板200時，密封粉較不會滑落至基板200的周邊區200B。如此，可避免封裝體230的厚度異常，能提升形成電子封裝結構300的良率。 In the comparative example, the jig does not have an accommodating space for accommodating the die. In this case, the bottom of the jig easily collides with the die, resulting in damage to the die. And when the sealing powder deposition or accumulation is completed, in the unhardened state, there is no flat surface on the periphery of the sealing powder deposition body, which makes it difficult to move the substrate to the modules, equipment, instruments and/or hardening packages 230 During the process of the machine or the machine, the sealing powder will be scattered along the inclined peripheral surface to the non-sealing area of the substrate, resulting in abnormal thickness of the sealing powder deposit. In some embodiments of the present disclosure, the space S formed by the jig 100 allows the package body 230 to have a relatively flat surface 230s2 at the periphery, so that when the package body 230 is not hardened and the substrate 200 is moved, the sealing powder is less likely to slip to the The peripheral region 200B of the substrate 200 . In this way, abnormal thickness of the package body 230 can be avoided, and the yield rate of the electronic package structure 300 can be improved.

在本文中可以為了便於描述而使用本文所用之如「下方」、「之下」、「下面」、「上方」、「之上」、「上面」、「下部」、「上部」、「左側」、「右側」等空間相對術語來描述如附圖所示之一個組件或特徵與另一或多個組件或特徵之關係。除了在附圖中描繪之定向之外，空間相對術語亦意欲涵蓋裝置在使用時或操作時之不同定向。可以以其他方式定向設備(旋轉80度或處於其他定向)，並且同樣可以以相應的方式解釋本文中使用之空間相對描述語。應當理解，當組件被稱為「連接至」或「耦接至」另一組件時，上述組件可以直接連接至或耦接至另一組件，或者可以存在中間組件。 As used herein, terms such as "below", "under", "below", "above", "above", "above", "lower", "upper", "left side" may be used herein for convenience of description , "right" and other spatially relative terms to describe the relationship between one component or feature and another or more components as shown in the drawings relationship between items or features. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 80 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may be present.

如本文所用，術語「大約」、「基本上」、「基本」及「約」用於描述及解釋小的變化。當結合事件或情形使用時，上述術語可以係指事件或情形精確發生之實例以及事件或情形接近發生之實例。如本文關於給定值或給定範圍所使用，術語「約」總體上意謂處於給定值或範圍之±10%、±5%、±1%或±0.5%內。本文中可以將範圍表示為一個端點至另一端點或介於兩個端點之間。本文所揭示之所有範圍都包含端點，除非另外指明。術語「基本上共面」可以指兩個表面沿同一平面定位之位置差處於數微米(μm)內，如沿同一平面定位之位置差處於10μm內、5μm內、1μm內或0.5μm內。當將數值或特性稱為「基本上」相同時，上述術語可以指處於上述值之平均值之±10%、±5%、±1%或±0.5%內的值。 As used herein, the terms "about", "substantially", "substantially" and "approximately" are used to describe and account for small variations. When used in connection with an event or circumstance, the above terms can refer to instances in which the event or circumstance occurs exactly as well as instances in which the event or circumstance occurs nearly. As used herein with respect to a given value or a given range, the term "about" generally means within ±10%, ±5%, ±1%, or ±0.5% of the given value or range. Ranges may be expressed herein as being from one endpoint to the other or as being between two endpoints. All ranges disclosed herein are inclusive of endpoints unless otherwise indicated. The term "substantially coplanar" may mean that two surfaces are positioned along the same plane within a few micrometers (μm), such as within 10 μm, within 5 μm, within 1 μm, or within 0.5 μm of being positioned along the same plane. When values or properties are referred to as being "substantially" the same, the above terms may refer to values that are within ±10%, ±5%, ±1%, or ±0.5% of the mean value of the recited values.

前述內容概述了幾個實施例之特徵及本發明之詳細態樣。本發明中描述之實施例可以容易地用作設計或修改其他製程及結構以便於實施相同或類似目的及/或實現本文介紹之實施例之相同或類似優點的基礎。此類等同構造並不背離本發明之精神及範疇，並且在不背離本發明之精神及範疇的情況下，可以作出各種改變、替代及變更。 The foregoing has outlined features of several embodiments and detailed aspects of the invention. The embodiments described in this disclosure may be readily used as a basis for designing or modifying other processes and structures in order to carry out the same or similar purposes and/or achieve the same or similar advantages of the embodiments presented herein. Such equivalent constructions do not depart from the spirit and scope of the present invention, and various changes, substitutions, and alterations can be made without departing from the spirit and scope of the present invention.

100:治具 100: fixture

110:頂部 110: top

110s1:表面 110s1: surface

110s2:表面 110s2: surface

110s3:表面 110s3: surface

120:連接部 120: connection part

120s1:表面 120s1: surface

120s2:表面 120s2: surface

120s3:表面 120s3: surface

120s4:表面 120s4: surface

130:支撐部 130: support part

130s1:表面 130s1: surface

130s2:表面 130s2: surface

130s3:表面 130s3: surface

130e:內側 130e: inside

140:導引部 140: Guide Department

140s1:表面 140s1: surface

140s2:表面 140s2: surface

S:空間 S: space

D1:長度 D1: Length

H1:長度 H1: Length

L1:水平距離 L1: horizontal distance

θ1:夾角 θ1: included angle

θ2:夾角 θ2: included angle

θ3:夾角 θ3: Angle

θ4:夾角 θ4: Angle

Claims

一種模封治具，包括：一支撐部，其鄰近該治具之一底部；以及一導引部，由該支撐部的一內側突出，並與該支撐部共同界定一空間；其中該導引部具有遠離該支撐部之一邊緣且該支撐部之該內側具有遠離該導引部之一邊緣，且該導引部之該邊緣至該支撐部之該內側之該邊緣共同界定一平面，其中該空間係自該平面朝向該支撐部之該內側凹陷。 A mold sealing fixture, comprising: a support portion adjacent to a bottom of the jig; and a guide part protrudes from an inner side of the support part and defines a space together with the support part; Wherein the guide portion has an edge away from the support portion and the inner side of the support portion has an edge away from the guide portion, and the edge of the guide portion is jointly defined by the inner side of the support portion A plane, wherein the space is recessed from the plane toward the inner side of the supporting part.

如申請專利範圍第1項之治具，其中該支撐部包括一支撐面且該支撐部之該內側具有與該支撐面連接之一內表面，該導引部由該支撐部之該內表面突出並包括一底表面，該支撐部的該邊緣為該支撐面與該內表面彼此相交所構成之一交線，該導引部的該邊緣為該底表面之一側邊。The jig according to item 1 of the scope of the patent application, wherein the supporting part includes a supporting surface and the inner side of the supporting part has an inner surface connected with the supporting surface, and the guiding part protrudes from the inner surface of the supporting part It also includes a bottom surface, the edge of the supporting part is an intersection line formed by the intersection of the supporting surface and the inner surface, and the edge of the guiding part is a side of the bottom surface.

如申請專利範圍第2項之治具，其中該空間進一步朝向該導引部之該底表面的方向延伸並超過該底表面之該側邊的一水平高度。The jig according to claim 2 of the patent application, wherein the space further extends towards the direction of the bottom surface of the guide part and exceeds a level of the side of the bottom surface.

如申請專利範圍第2項之模封治具，其中該支撐部之該內表面與該導引部之該側邊之間之一水平距離會隨著該內表面自該支撐面與該內表面彼此相交所構成之該交線處向上延伸而保持固定或逐漸增加。As for the mold sealing fixture of item 2 of the scope of application, wherein a horizontal distance between the inner surface of the support part and the side of the guide part will follow the inner surface from the support surface to the inner surface The intersecting lines formed by intersecting each other extend upward and remain fixed or gradually increase.

如申請專利範圍第2項之模封治具，其中，在一剖視下，該支撐部之該內表面與該導引部之該底表面的一夾角不超過90度。As for the mold-sealing jig set forth in claim 2 of the patent application, wherein, in a cross-sectional view, the angle between the inner surface of the support part and the bottom surface of the guide part does not exceed 90 degrees.

如申請專利範圍第2項之模封治具，其中該導引部的該底表面與該支撐部的該內表面大抵上垂直。The mold sealing fixture as claimed in claim 2, wherein the bottom surface of the guide part is substantially perpendicular to the inner surface of the support part.

如申請專利範圍第2項之模封治具，其中該導引部具有一導引面位於該空間上方，該導引部的該上表面相對於該導引部的該底表面為一傾斜表面。The mold sealing fixture as claimed in item 2 of the scope of the patent application, wherein the guide part has a guide surface located above the space, and the upper surface of the guide part is an inclined surface relative to the bottom surface of the guide part .

如申請專利範圍第2項之模封治具，其中該支撐部的該支撐面係用以抵觸一半導體基板之一表面。As the mold sealing fixture of claim 2, wherein the supporting surface of the supporting part is used to contact a surface of a semiconductor substrate.

如申請專利範圍第8項之模封治具，其中該空間係用以容納該基板上之一晶粒。For example, the molding fixture of claim 8, wherein the space is used to accommodate a die on the substrate.

如申請專利範圍第8項之模封治具，其中該導引部的該底表面大致面向該基板，且經抵觸後大致與該基板之該表面平行。In the mold sealing fixture according to claim 8 of the patent application, wherein the bottom surface of the guide part is generally facing the substrate, and is roughly parallel to the surface of the substrate after collision.

一種模封治具，包括：一支撐部，其鄰近該治具之一底部，包括一支撐面及連接該支撐面的一內表面；以及一模封材料導引部，由該支撐部的該內表面突出，包括一底表面，其中在一剖視下，該模封材料導引部之該底表面與該支撐部之該內表面彼此相交所形成之一角度包括一直角或一銳角。 A mold sealing fixture, comprising: a support portion, adjacent to a bottom of the jig, including a support surface and an inner surface connected to the support surface; and a molding material guide protruding from the inner surface of the supporting part, including a bottom surface, wherein in a cross-sectional view, the bottom surface of the molding material guiding part and the inner surface of the supporting part are mutually An angle formed by the intersection includes a right angle or an acute angle.

如申請專利範圍第12項之模封治具，其中該模封材料導引部包括一導引面位於該導引部之該底表面上方，該導引面相對於該底表面為一傾斜表面。For example, the molding fixture according to claim 12 of the patent application, wherein the molding material guiding part includes a guiding surface located above the bottom surface of the guiding part, and the guiding surface is an inclined surface relative to the bottom surface.

如申請專利範圍第11項之模封治具，其中該支撐部之該內表面大致垂直於該支撐部之該支撐面。The mold sealing fixture according to claim 11 of the patent application, wherein the inner surface of the support part is substantially perpendicular to the support surface of the support part.

一種模封治具，包括：一本體；及一自該本體之一表面突出之導引部；其中該本體係經構形以抵頂一基板之一上表面，且其中該導引部係經構形以導引來自該基板之上方並下落至該基板之該上表面的複數個材料，以使該等材料減少下落至位於該基板之該上表面上且鄰近該基板之一邊緣之一區域內。 A mold sealing fixture, comprising: a body; and a guide protruding from a surface of the body; wherein the body is configured to abut against an upper surface of a substrate, and wherein the guide is configured to guide a plurality of materials falling from above the substrate to the upper surface of the substrate, to The materials are reduced from falling into an area on the upper surface of the substrate adjacent an edge of the substrate.

如請求項14之模封治具，其中該基板的該上表面上至少具有一晶粒，該晶粒位於該導引部之下側。The molding fixture as claimed in claim 14, wherein there is at least one crystal grain on the upper surface of the substrate, and the crystal grain is located under the guiding portion.

如請求項14之模封治具，其中該導引部包括一導引面位於該區域上方。The molding fixture as claimed in claim 14, wherein the guide portion includes a guide surface located above the area.

如請求項14之模封治具，其中該本體為一環狀本體，且該導引部係在該環狀本體之一內表面上周向地延伸。According to claim 14, the molding fixture, wherein the body is an annular body, and the guide portion extends radially on an inner surface of the annular body.

如請求項17之模封治具，其中該導引部具有一傾斜面，其中該傾斜面係自該環狀本體之該內表面向下且徑向向內傾斜。The molding fixture according to claim 17, wherein the guide portion has an inclined surface, wherein the inclined surface is inclined downward and radially inward from the inner surface of the annular body.

如請求項17之模封治具，其中該導引部具有自該環狀本體之該內表面突出並朝向該基板之一表面，且其中該導引部的該表面係大致水平延伸。The molding fixture according to claim 17, wherein the guide portion has a surface protruding from the inner surface of the annular body and facing the substrate, and wherein the surface of the guide portion extends substantially horizontally.

如請求項19之模封治具，其中該環狀本體之該內表面具有與該環狀本體之一底表面及該導引部之該表面連接之一部分，且其中該部分係大致與該導引部之該表面垂直相交。The mold sealing fixture as claimed in claim 19, wherein the inner surface of the annular body has a portion connected to a bottom surface of the annular body and the surface of the guide portion, and wherein the portion is approximately connected to the guide portion The surfaces of the leads intersect perpendicularly.