TWI787466B - Protective film forming device - Google Patents

Protective film forming device Download PDF

Info

Publication number
TWI787466B
TWI787466B TW108105373A TW108105373A TWI787466B TW I787466 B TWI787466 B TW I787466B TW 108105373 A TW108105373 A TW 108105373A TW 108105373 A TW108105373 A TW 108105373A TW I787466 B TWI787466 B TW I787466B
Authority
TW
Taiwan
Prior art keywords
water
nozzle
wafer
resin
protective film
Prior art date
Application number
TW108105373A
Other languages
Chinese (zh)
Other versions
TW201934207A (en
Inventor
吉田博斗
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201934207A publication Critical patent/TW201934207A/en
Application granted granted Critical
Publication of TWI787466B publication Critical patent/TWI787466B/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Dicing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Coating Apparatus (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Laser Beam Processing (AREA)

Abstract

[課題]於在隔著膠帶而被支持於環形框之晶圓的上面形成保護膜之時，效率佳地進行除去附著於環形框之上面的樹脂。 [解決手段]在保護膜形成裝置(2)中，因供給手段(23)具備對工件組(WS)之晶圓(W)之上面中央供給水溶性樹脂的樹脂噴嘴(24)，和對工件組(WS)之環形框(F)之上面供給水的水噴嘴(25)，和對工件組(WS)之環形框(F)之上面供給氣體的氣體噴嘴(26)，樹脂噴嘴(24)和水噴嘴(25)和氣體噴嘴(26)被配設在於保持台(20)之保持面方向延伸的臂部(27)，比起水噴嘴(25)，氣體噴嘴(26)被配設在保持台(20)之旋轉方向下游側，故在晶圓(W)之上面形成水溶性保護膜之時，也可以效率佳地洗淨環形框(F)之上面，不會使水溶性樹脂殘存在環形框(F)之上面。[Problem] When forming a protective film on the upper surface of a wafer supported by a ring frame through an adhesive tape, efficiently remove the resin adhering to the upper surface of the ring frame. [Solution] In the protective film forming device (2), since the supply means (23) is equipped with a resin nozzle (24) for supplying a water-soluble resin to the center of the upper surface of the wafer (W) of the workpiece set (WS), and for the workpiece A water nozzle (25) for supplying water on the ring frame (F) of the set (WS), a gas nozzle (26) for supplying gas to the upper face of the ring frame (F) of the workpiece set (WS), and a resin nozzle (24) The water nozzle (25) and the gas nozzle (26) are arranged on the arm portion (27) extending in the direction of the holding surface of the holding table (20). Compared with the water nozzle (25), the gas nozzle (26) is arranged on the The downstream side of the rotation direction of the holding table (20) can efficiently clean the top surface of the ring frame (F) when forming a water-soluble protective film on the wafer (W) without leaving water-soluble resin residues. Exists above the ring frame (F).

Description

保護膜形成裝置Protective film forming device

本發明係關於在晶圓之上面包覆保護膜之保護膜形成裝置。The present invention relates to a protective film forming device for covering a protective film on a wafer.

在沿著形成有裝置之晶圓之分割預定線對藉由分割預定線而被區劃的區域，照射相對於晶圓具有吸收性之波長的脈衝雷射束而分割晶圓的剝蝕加工中，為了防止由於雷射束之照射使得晶圓熔融而產生殘渣附著於裝置之情形，於雷射束之照射前在晶圓之上面形成水溶性保護膜而保護裝置。再者，於雷射束之照射後，藉由對水溶性保護膜供給水，將水溶性保護膜與附著於水溶性保護膜之殘渣一起除去。In an ablation process in which a wafer is divided by irradiating a pulsed laser beam having an absorptive wavelength with respect to the wafer along the planned dividing line of the wafer on which the device is formed, to the region partitioned by the planned dividing line, in order to To prevent the residue from adhering to the device due to the melting of the wafer due to the irradiation of the laser beam, a water-soluble protective film is formed on the wafer before the irradiation of the laser beam to protect the device. Furthermore, after the irradiation of the laser beam, by supplying water to the water-soluble protective film, the water-soluble protective film is removed together with the residue adhering to the water-soluble protective film.

朝晶圓上面形成水溶性保護膜時，藉由將晶圓之下面黏貼於以封閉該開口部之方式黏貼在中央具有開口部之環形框的黏著膠帶之黏著面，形成工件組而藉由環形框支持晶圓。而且，將適量的水溶性液狀樹脂滴下於晶圓上，使工件組旋轉而使水溶性液狀樹脂擴散而予以乾燥，依此在晶圓之上面包覆水溶性保護膜。When forming a water-soluble protective film on the wafer, the lower surface of the wafer is attached to the adhesive surface of the adhesive tape that is attached to the ring-shaped frame with the opening in the center in such a way as to close the opening to form a workpiece group. The frame supports the wafer. Then, an appropriate amount of water-soluble liquid resin is dropped onto the wafer, and the workpiece group is rotated to spread and dry the water-soluble liquid resin, thereby covering the upper surface of the wafer with a water-soluble protective film.

如此一來，使工件組旋轉而將水溶性液狀樹脂包覆在晶圓上面時，在環形框之上面也附著水溶性樹脂。而且，當在環形框之上面附著樹脂時，有藉由其水溶性樹脂吸收空氣中之水分等而具備黏著力之情形。因此，當搬運手段吸附環形框而欲進行搬運時，有由於水溶性樹脂具備的黏著力，環形框黏住搬運手段之墊片上，環形框無法從墊片分離之問題。於是，也提案有對附著於環形框之水溶性樹脂灑水而除去水溶性樹脂(例如，參照專利文獻1)。 [先前技術文獻] [專利文獻]In this way, when the workpiece group is rotated to coat the wafer with the water-soluble liquid resin, the water-soluble resin also adheres to the ring frame. Moreover, when the resin is attached to the top surface of the ring frame, the water-soluble resin may absorb moisture in the air and have adhesive force. Therefore, when the conveying means absorbs the ring frame and intends to carry it, there is a problem that the ring frame sticks to the gasket of the conveying means due to the adhesive force of the water-soluble resin, and the ring frame cannot be separated from the gasket. Then, it is also proposed to spray water on the water-soluble resin attached to the ring frame to remove the water-soluble resin (for example, refer to Patent Document 1). [Prior Art Literature] [Patent Document]

[專利文獻1]日本特開2017-092379號公報[Patent Document 1] Japanese Patent Laid-Open No. 2017-092379

[發明之概要] [發明所欲解決之課題][Outline of Invention] [Problem to be Solved by the Invention]

但是，在上述專利文獻1所記載之發明中，於在晶圓包覆保護膜並使乾燥之後，藉由在環形框灑水，並使其水滯留，使附著於環形框之樹脂熔解，藉由氣體之噴出，從環形框除去樹脂，有樹脂之除去需要時間的問題。However, in the invention described in the aforementioned Patent Document 1, after the wafer is covered with a protective film and dried, water is sprinkled on the ring frame and the water is retained to melt the resin adhering to the ring frame. Removing the resin from the annular frame by blowing out the gas has a problem that it takes time to remove the resin.

依此，本發明之目的在於在隔著膠帶而被支持於環形框之晶圓的上面形成保護膜之情況，可以效率佳地進行除去附著於環形框之上面的樹脂的保護膜形成裝置。 [用以解決課題之手段]Accordingly, an object of the present invention is to form a protective film forming apparatus that can efficiently remove resin adhering to the upper surface of the annular frame when a protective film is formed on the upper surface of the wafer supported by the annular frame through an adhesive tape. [Means to solve the problem]

當藉由本發明時，提供一種保護膜形成裝置，其係在晶圓之上面形成水溶性保護膜，該保護膜形成裝置具備：保持台，其係保持晶圓被黏貼於封閉環形框之開口且黏貼在該環形框之膠帶而被構成的工件組；旋轉手段，其係以該保持台之保持面之中心為軸而使該保持台旋轉；及供給手段，其係對該保持台保持的晶圓之上面供給水溶性樹脂，樹脂噴嘴，其係對該保持台保持的工件組之晶圓之上面中央供給水溶性樹脂；水噴嘴，其係對該保持台保持的工件組之環形框之上面供給水；及氣體噴嘴，其係對該保持台保持的工件組之該環形框之上面供給氣體，該樹脂噴嘴和該水噴嘴和該氣體噴嘴被配設在於該保持台之保持面方向延伸的臂部，比起該水噴嘴，該氣體噴嘴被配設該保持台之旋轉方向下游側。 [發明效果]According to the present invention, a protective film forming device is provided, which forms a water-soluble protective film on a wafer, and the protective film forming device has: a holding table, which is used to hold the wafer to be pasted on the opening of the closed ring frame and The workpiece group is formed by sticking the tape on the ring frame; the rotating means is to rotate the holding table with the center of the holding surface of the holding table as the axis; and the supply means is to hold the crystal on the holding table Water-soluble resin is supplied on the upper surface of the circle, and the resin nozzle is used to supply water-soluble resin to the upper center of the wafer of the workpiece group held by the holding table; the water nozzle is used on the upper surface of the ring frame of the workpiece group held by the holding table supplying water; and a gas nozzle for supplying gas to the upper surface of the annular frame of the workpiece group held by the holding table, the resin nozzle, the water nozzle and the gas nozzle being arranged on the side extending in the direction of the holding surface of the holding table. In the arm portion, the gas nozzle is arranged on the downstream side of the rotation direction of the holding table rather than the water nozzle. [Invention effect]

當藉由本發明之保護膜形成裝置時，在晶圓之上面形成水溶性保護膜之時，也可以效率佳地洗淨環形框之上面。因此，若藉由本發明時，不會使水溶性樹脂殘存在環形框之上面，當利用例如搬運手段將形成有水溶性保護膜之工件組搬運至加工台之時，不會有水溶性樹脂附著於搬運手段之情形。When the protective film forming apparatus of the present invention is used to form a water-soluble protective film on the wafer, the upper surface of the ring frame can also be efficiently cleaned. Therefore, according to the present invention, the water-soluble resin will not remain on the ring frame, and when the workpiece group formed with the water-soluble protective film is transported to the processing table by, for example, a transport means, there will be no water-soluble resin adhesion. In the case of means of transportation.

圖1所示之晶圓W係具有圓形板狀之基板的被加工物之一例，在其上面，於藉由格子狀之分割預定線S被區劃的各區域形成有裝置D。為了以中央開口之環形框F支持晶圓W，以封閉環形框F之開口之方式，在環形框F之下面黏貼膠帶T，將晶圓W黏貼在從環形框F之開口部分露出之膠帶T而使上面朝向露出。如此一來，形成隔著封閉環形框F之開口並黏貼的膠帶T而支持晶圓W的工件組WS。在工件組WS之形態下，被搬運至加工裝置1，對晶圓W之上面，被施予保護膜之形成雷射加工。The wafer W shown in FIG. 1 is an example of a workpiece having a circular plate-shaped substrate, on which devices D are formed in each region partitioned by grid-shaped dividing lines S. In order to support the wafer W by the ring frame F with the central opening, tape T is attached to the bottom of the ring frame F in such a way as to close the opening of the ring frame F, and the wafer W is attached to the tape T exposed from the opening of the ring frame F. And make the upper face exposed. In this way, the workpiece set WS supporting the wafer W is formed through the adhesive tape T that closes the opening of the ring frame F and is pasted. In the form of the workpiece set WS, it is transported to the processing device 1, and the upper surface of the wafer W is subjected to laser processing for forming a protective film.

加工裝置1具備裝置基座10，和被豎立設置在裝置基座10之Y軸方向後部側的柱體11。再者，加工裝置1具備：在裝置基座10之X軸方向前部側被鄰接配置在柱體11之與本發明有關的保護膜形成裝置2；具有吸引保持晶圓W之保持面12a的加工台12；使加工台12在加工進給方向(X軸方向)予以加工進給的加工進給手段14；使加工台12在分度進給方向(Y軸方向)予以分度進給的分度進給手段15；在加工台12和保護膜形成裝置2之間搬運晶圓W之搬運手段16；對構成工件組WS之晶圓W照射雷射束的雷射加工手段17；及控制各種驅動機構的控制手段18。The processing device 1 includes a device base 10 and a column 11 erected on the rear side of the device base 10 in the Y-axis direction. Furthermore, the processing device 1 includes: the protective film forming device 2 according to the present invention, which is arranged adjacent to the column 11 on the front side of the device base 10 in the X-axis direction; Processing table 12; processing feed means 14 for processing table 12 in the processing feed direction (X-axis direction); Index feeding means 15; transport means 16 for transporting wafer W between processing table 12 and protective film forming device 2; laser processing means 17 for irradiating laser beams to wafer W constituting work set WS; and control Control means 18 of various driving mechanisms.

保護膜形成裝置2具有筒狀之加工室200，具備有保持工件組WS之保持台20、以保持台20之保持面20a之中心為軸使保持台20旋轉的旋轉手段21、保持被配設在保持台20之外周側的環狀框F的框架保持手段22、對保持台20保持的晶圓W之上面供給水溶性樹脂的供給手段23。The protective film forming apparatus 2 has a cylindrical processing chamber 200, a holding table 20 for holding the workpiece group WS, a rotating means 21 for rotating the holding table 20 around the center of the holding surface 20a of the holding table 20, and a holding device. The frame holding means 22 of the annular frame F on the outer peripheral side of the holding table 20 and the supply means 23 for supplying the water-soluble resin to the upper surface of the wafer W held by the holding table 20 are provided.

保持台20之上面成為吸引保持晶圓W之保持面20a。旋轉手段21具備無圖示之馬達，藉由馬達驅動，可以使保持台20以特定旋轉速度旋轉。在保持台20之外周側，配設有用以保持環形框F之複數(在圖示之例中為4個)之框架保持手段22。框架保持手段22具備載置環形框F之框架載置台220，和被載置於框架載置台220之環形框F夾持的夾持部221。The upper surface of the holding table 20 serves as a holding surface 20 a for attracting and holding the wafer W. The rotation means 21 includes a motor (not shown), and the holding table 20 can be rotated at a predetermined rotation speed by driving the motor. On the outer peripheral side of the holding table 20, a plurality of (four in the illustrated example) frame holding means 22 for holding the annular frame F are arranged. The frame holding means 22 includes a frame mounting table 220 on which the ring frame F is mounted, and a clamping portion 221 sandwiched by the ring frame F mounted on the frame mounting table 220 .

如圖2所示般，供給手段23具備對保持台20保持工件組WS之晶圓W之上面中央供給水溶性樹脂的樹脂噴嘴24，和對保持台20保持的工件組WS之環形框F之上面供給水的水噴嘴25，和對保持台20保持的工件組WS之環形框F之上面供給氣體的氣體噴嘴26。樹脂噴嘴24和水噴嘴25和氣體噴嘴26被配設在於保持台20之保持面方向延伸的臂部27。As shown in FIG. 2, the supply means 23 includes a resin nozzle 24 for supplying a water-soluble resin to the center of the upper surface of the wafer W holding the work set WS on the holding table 20, and a ring frame F for the work set WS held on the holding table 20. The water nozzle 25 supplies water to the upper surface, and the gas nozzle 26 supplies gas to the upper surface of the ring frame F of the workpiece group WS held by the holding table 20 . The resin nozzle 24 , the water nozzle 25 and the gas nozzle 26 are arranged on an arm portion 27 extending in the direction of the holding surface of the holding table 20 .

本實施型態所示的臂部27成為包含第1臂部27a和較第1臂部27a短的第2臂部27b。第1臂部27a及2臂部27b之內部形成流體流通的流路。第1臂部27a被形成其前端被定位至保持台20之中央側之程度的長度。第1臂部27a之前端朝下方彎曲，在如此的前端安裝樹脂噴嘴24。在樹脂噴嘴24連接有樹脂供給源。The arm portion 27 shown in this embodiment includes a first arm portion 27a and a second arm portion 27b shorter than the first arm portion 27a. The insides of the first arm portion 27a and the second arm portion 27b form channels through which the fluid flows. The first arm portion 27 a is formed in such a length that the front end thereof is positioned to the center side of the holding table 20 . The front end of the first arm portion 27a is bent downward, and the resin nozzle 24 is attached to such a front end. A resin supply source is connected to the resin nozzle 24 .

第2臂部27b被形成其前端被定位至保持台20之外周側之程度的長度。第2臂部27b之前端朝下方彎曲，在如此的前端安裝水噴嘴25。在水噴嘴25連接有水供給源。在與配設有噴嘴25之側相反側的第1臂部27a之側方側配置氣體噴嘴26。在氣體噴嘴26直線狀地排列形成有圖3所示的複數噴射口260。在氣體噴嘴26連接有氣體供給源。The second arm portion 27b is formed in such a length that the front end thereof is positioned to the outer peripheral side of the holding table 20 . The front end of the second arm portion 27b is bent downward, and the water nozzle 25 is attached to such a front end. A water supply source is connected to the water nozzle 25 . The gas nozzle 26 is arranged on the lateral side of the first arm portion 27a opposite to the side where the nozzle 25 is arranged. A plurality of injection ports 260 shown in FIG. 3 are formed in a straight line in the gas nozzle 26 . A gas supply source is connected to the gas nozzle 26 .

在臂部27之另一端連接有具有垂直方向之軸心的旋轉軸28。在旋轉軸28連接有能夠正轉、逆轉的馬達。當旋轉軸28藉由馬達之驅動而旋轉時，在被保持於保持台20之晶圓W之上方，臂部27在水平方向迴旋，使樹脂噴嘴24和水噴嘴25和氣體噴嘴26同時移動。依此，可以使樹脂噴嘴24從被保持於保持台20之工件組WS之外周緣，在晶圓W之中央部分之半徑區域做徑向往返移動，可以在被保持於保持台20之工件組WS之環形框F之上方側，使水噴嘴25和氣體噴嘴26做徑向往返移動。在供給手段23，可以藉由一個驅動源不會使樹脂噴嘴24和水噴嘴25和氣體噴嘴26彼此干擾，而移動至期待的位置。The other end of the arm portion 27 is connected to a rotation shaft 28 having a vertical axis. A motor capable of forward rotation and reverse rotation is connected to the rotary shaft 28 . When the rotating shaft 28 is driven by the motor to rotate, the arm portion 27 turns horizontally above the wafer W held on the holding table 20, and the resin nozzle 24, the water nozzle 25, and the gas nozzle 26 move simultaneously. Accordingly, the resin nozzle 24 can be moved radially back and forth from the outer periphery of the workpiece group WS held on the holding table 20 to the radius area of the central part of the wafer W, and the resin nozzle 24 can be moved back and forth in the radial direction of the workpiece group WS held on the holding table 20. On the upper side of the ring frame F of the WS, the water nozzle 25 and the gas nozzle 26 are moved back and forth in the radial direction. In the supply means 23, the resin nozzle 24, the water nozzle 25, and the gas nozzle 26 can be moved to a desired position by one driving source without interfering with each other.

再者，在供給手段23中，比起水噴嘴25，氣體噴嘴26被配設在保持台20之旋轉方向下游側。因此，於除去附著於環形框F之上面的水溶性樹脂之時，邊從水噴嘴25對環形框F之上面供給洗淨水，邊從氣體噴嘴26對環形框F之上面供給氣體，依此可以藉由氣體將流至保持台20之旋轉方向下游側的洗淨水吹至環形框F之外側。如此一來，若藉由供給手段23時，由於可以與在晶圓W之上面形成水溶性保護膜，同時藉由洗淨水使附著於環形框F之上面的水溶性樹脂溶解而予以除去，故提升洗淨效率。In addition, in the supply means 23 , the gas nozzle 26 is arranged on the downstream side of the rotation direction of the holding table 20 with respect to the water nozzle 25 . Therefore, when removing the water-soluble resin adhering to the upper surface of the ring frame F, while supplying the cleaning water from the water nozzle 25 to the upper surface of the ring frame F, gas is supplied from the gas nozzle 26 to the upper surface of the ring frame F, and so on. The washing water flowing to the downstream side in the rotation direction of the holding table 20 may be blown to the outside of the annular frame F by air. In this way, if the supply means 23 is used, since the water-soluble protective film can be formed on the upper surface of the wafer W, the water-soluble resin attached to the ring frame F can be dissolved and removed by the washing water at the same time, Therefore, the cleaning efficiency is improved.

圖1所示之搬運手段16具備保工件組WS之保持部160、在X軸方向延伸的滾珠螺桿161、被連接於滾珠螺桿161之一端的馬達162、與滾珠螺桿161平行延伸的一對導軌163，和支持保持部160且能夠在X軸方向移動的移動部164。在移動部164滑接一對導軌163，在被形成在移動部164之中央部的螺帽螺合滾珠螺桿161。在以保持部160保持工件組WS之狀態，藉由馬達162被驅動的滾珠螺桿161轉動，依此移動部164沿著導軌163在X軸方向移動，可以在加工台12和保持台20之間搬運工件組WS。在加工台12之外周側，配設有複數保持環形框F之框架保持手段13。框架保持手段13具備載置環形框F之框架載置台130，和被載置於框架載置台130之環形框F夾持的夾持部131。The conveying means 16 shown in FIG. 1 includes a holding part 160 for securing the workpiece group WS, a ball screw 161 extending in the X-axis direction, a motor 162 connected to one end of the ball screw 161, and a pair of guide rails extending parallel to the ball screw 161. 163, and a moving part 164 that supports the holding part 160 and can move in the X-axis direction. A pair of guide rails 163 are slidably connected to the moving part 164 , and the ball screw 161 is screwed to a nut formed in the center of the moving part 164 . In the state where the workpiece group WS is held by the holding part 160, the ball screw 161 driven by the motor 162 rotates, so that the moving part 164 moves along the guide rail 163 in the X-axis direction, and can move between the processing table 12 and the holding table 20 The workpiece group WS is transported. On the outer peripheral side of the processing table 12, a plurality of frame holding means 13 for holding the ring frame F are arranged. The frame holding means 13 includes a frame mounting table 130 on which the ring frame F is mounted, and clamping portions 131 sandwiched by the ring frame F mounted on the frame mounting table 130 .

加工進給手段14具備有在X軸方向延伸的滾珠螺桿140，和被連接於滾珠螺桿140之一端的馬達141，和與滾珠螺桿140平行延伸的一對導軌142，和能夠在X軸方向移動的X軸基座143。在X軸基座143之一方之面支持加工台12，在X軸基座143之另一方之面滑接一對導軌142，在被形成在X軸基座143之中央部的螺帽螺合滾珠螺桿140。藉由馬達141被驅動的滾珠螺桿140轉動，X軸基座143沿著導軌142在X軸方向移動，可以使加工台12在X軸方向予以加工進給。The processing feed means 14 is equipped with a ball screw 140 extending in the X-axis direction, a motor 141 connected to one end of the ball screw 140, and a pair of guide rails 142 extending in parallel with the ball screw 140, and can move in the X-axis direction. X-axis base 143. The processing table 12 is supported on one side of the X-axis base 143, and a pair of guide rails 142 are slid on the other side of the X-axis base 143, and screwed to the nut formed at the center of the X-axis base 143. Ball screw 140. The ball screw 140 driven by the motor 141 rotates, and the X-axis base 143 moves along the guide rail 142 in the X-axis direction, so that the processing table 12 can be processed and fed in the X-axis direction.

分度進給手段15具備有在Y軸方向延伸的滾珠螺桿150，和被連接於滾珠螺桿150之一端的馬達151，和與滾珠螺桿150平行延伸的一對導軌152，和能夠在Y軸方向移動的Y軸基座153。在Y軸基座153之一方之面，經由加工進給手段14支持加工台12，在Y軸基座153之另一方之面滑接一對導軌152，在被形成在Y軸基座153之中央部的螺帽螺合滾珠螺桿150。藉由馬達151被驅動的滾珠螺桿150轉動，Y軸基座153沿著導軌152在Y軸方向移動，可以使加工台12在Y軸方向予以分度進給。The index feeding means 15 is equipped with a ball screw 150 extending in the Y-axis direction, a motor 151 connected to one end of the ball screw 150, and a pair of guide rails 152 extending in parallel with the ball screw 150, and can move in the Y-axis direction. Move the Y-axis base 153. On one side of the Y-axis base 153, the processing table 12 is supported via the processing feed means 14, and a pair of guide rails 152 are slid on the other side of the Y-axis base 153, formed on the Y-axis base 153. The ball screw 150 is screwed to the nut at the center. The ball screw 150 driven by the motor 151 rotates, and the Y-axis base 153 moves along the guide rail 152 in the Y-axis direction, so that the processing table 12 can be indexed and fed in the Y-axis direction.

雷射加工手段17具備在Y軸方向延伸的殼體170，和被配設在殼體170之前端的加工頭171。在殼體170之內部，收容相對於水溶性樹脂具有吸收性的波長之雷射束振盪的振盪器。在加工頭171之內部，內置用以聚光從振盪器振盪的雷射束的聚光透鏡(無圖示)。The laser processing means 17 includes a casing 170 extending in the Y-axis direction, and a processing head 171 arranged at the front end of the casing 170 . Inside the casing 170 is housed an oscillator for oscillating a laser beam of a wavelength that is absorptive to the water-soluble resin. Inside the processing head 171, a condensing lens (not shown) for condensing the laser beam oscillated from the oscillator is incorporated.

控制手段18具備CPU及記憶體等之記憶元件。控制手段18可以控制成從例如供給手段23之樹脂噴嘴24、水噴嘴25及氣體噴嘴26同時噴射流體。再者，在控制手段18中，亦能夠以在不同的時序噴射流體之方式控制樹脂噴嘴24和水噴嘴25及氣體噴嘴26。再者，在控制手段18之記憶體，記憶成為水溶性保護膜之形成條件、雷射加工條件、成為加工對象之晶圓W之資訊等。The control means 18 includes memory elements such as a CPU and a memory. The control means 18 can be controlled so that, for example, the resin nozzle 24, the water nozzle 25, and the gas nozzle 26 of the supply means 23 spray fluid simultaneously. Furthermore, in the control means 18, the resin nozzle 24, the water nozzle 25, and the gas nozzle 26 can also be controlled so that fluid may be injected at different timings. Furthermore, in the memory of the control means 18, the formation conditions of the water-soluble protective film, the laser processing conditions, the information of the wafer W to be processed, and the like are stored.

接著，針對保護膜形成裝置2之動作例予以詳細敘述。在準備工件組WS之後，於以雷射加工手段7在晶圓W之上面實施雷射加工之前，先在晶圓W之上面形成保護膜。首先，如圖1所示般，在保持台20載置工件組WS，藉由無圖示之吸引源作動，以在保持面20a吸引保持晶圓W，同時藉由框架保持手段22保持環形框F。Next, an example of the operation of the protective film forming apparatus 2 will be described in detail. After the workpiece set WS is prepared, a protective film is formed on the wafer W before laser processing is performed on the wafer W by the laser processing means 7 . First, as shown in FIG. 1, the workpiece group WS is placed on the holding table 20, and the wafer W is sucked and held on the holding surface 20a by the operation of the suction source (not shown), while the ring frame is held by the frame holding means 22. F.

如圖2所示般，旋轉軸28藉由馬達例如逆時鐘方向旋轉，依此臂部27相對於保持台20之保持面20a在水平方向迴旋，如圖3所示般，使供給手段23從待機位置SP移動至供給位置P1。待機位置SP係樹脂噴嘴24、水噴嘴25及氣體噴嘴26中之任一者從工件組WS之上方側退避的位置。供給位置P1係樹脂噴嘴24被定位在晶圓W之中央之上方，被定位在水噴嘴25及氣體噴嘴26被定位在環形框F之上方的位置。As shown in FIG. 2 , the rotating shaft 28 is rotated counterclockwise by a motor, for example, so that the arm portion 27 rotates in the horizontal direction relative to the holding surface 20a of the holding table 20, and as shown in FIG. 3 , the supply means 23 is moved from The standby position SP moves to the supply position P1. The standby position SP is a position where any one of the resin nozzle 24 , the water nozzle 25 , and the gas nozzle 26 retreats from the upper side of the workpiece group WS. The supply position P1 is a position where the resin nozzle 24 is positioned above the center of the wafer W, and the water nozzle 25 and the gas nozzle 26 are positioned above the ring frame F. FIG.

藉由圖2所示之旋轉手段21使保持台20旋轉，使工件組WS朝例如箭頭A方向旋轉。樹脂噴嘴24係朝向晶圓W之上面滴下特定量之水溶性樹脂而予以塗佈。作為水溶性樹脂，使用例如PVP(聚乙烯吡咯烷酮)或PVA(聚乙烯醇)等之水溶性之液狀樹脂。而且，藉由在保持台20產生的離心力，從晶圓W之中央朝向外周緣使水溶性樹脂流動而擴散至晶圓W之上面的全面。The holding table 20 is rotated by the rotating means 21 shown in FIG. 2 , and the workpiece set WS is rotated in, for example, the arrow A direction. The resin nozzle 24 drops a predetermined amount of water-soluble resin toward the upper surface of the wafer W to apply it. As the water-soluble resin, for example, a water-soluble liquid resin such as PVP (polyvinylpyrrolidone) or PVA (polyvinyl alcohol) is used. Then, the water-soluble resin flows from the center of the wafer W toward the outer periphery by the centrifugal force generated on the holding table 20 and spreads over the entire upper surface of the wafer W.

在供給手段23中，從樹脂噴嘴24塗佈特定量之水溶性樹脂而在晶圓W之上形成水溶性保護膜之同時，從水噴嘴25對環形框F之上面供給洗淨水，並且從氣體噴嘴26之複數噴射口260對環形框F之上面噴射氣體。依此，即使在環形框F之上面附著水溶性樹脂，藉由洗淨水被除去，並且藉由由於保持台20之旋轉而產生的離心力和氣體，包含水溶性樹脂之洗淨水被吹至環形框F之外側。In the supply means 23, while applying a specific amount of water-soluble resin from the resin nozzle 24 to form a water-soluble protective film on the wafer W, cleaning water is supplied from the water nozzle 25 to the upper surface of the ring frame F, and from the A plurality of injection ports 260 of the gas nozzle 26 inject gas to the upper surface of the ring frame F. According to this, even if the water-soluble resin adheres to the upper surface of the ring frame F, the washing water is removed by the washing water, and the washing water containing the water-soluble resin is blown to the outside the ring frame F.

以覆蓋晶圓W之上面之全面之方式，形成期待的水溶性保護膜之後，如圖4所示般，旋轉軸28藉由馬達順時鐘旋轉，依此，臂部27相對於保持台20之保持面20a在水平方向迴旋，使供給手段23從供給位置P1移動至待機位置SP。之後，藉由圖1所示之搬運手段16，工件組WS被搬運至加工台12，藉由雷射加工手段17，在晶圓W之上面被施予特定雷射加工。After forming a desired water-soluble protective film so as to cover the entire upper surface of the wafer W, as shown in FIG. 4 , the rotating shaft 28 is rotated clockwise by the motor. The holding surface 20a turns in the horizontal direction to move the supply means 23 from the supply position P1 to the standby position SP. Afterwards, the workpiece group WS is transported to the processing table 12 by the transport means 16 shown in FIG.

如此一來，在與本發明有關之保護膜形成裝置2中，因供給手段23具備對保持台20保持的工件組WS之晶圓W之上面中央供給水溶性樹脂的樹脂噴嘴24，和對保持台20保持的工件組WS之環形框F之上面供給水的水噴嘴25，和對保持台20保持的工件組WS之環形框F之上面供給氣體的氣體噴嘴26，樹脂噴嘴24和水噴嘴25和氣體噴嘴26被配設在於保持台20之保持面方向延伸的臂部27，比起水噴嘴25，氣體噴嘴26被配設在保持台20之旋轉方向下游側，故在晶圓W之上面形成水溶性保護膜之時，也可以效率佳地洗淨環形框F之上面。因此，不會有在環形框F之上面殘存水溶性樹脂之情形。而且，以搬運手段16將形成有水溶性保護膜之工件組WS搬運至加工台12之時，在搬運手段16不會附著水溶性樹脂之情形。In this way, in the protective film forming apparatus 2 related to the present invention, since the supply means 23 includes the resin nozzle 24 for supplying the water-soluble resin to the center of the upper surface of the wafer W of the workpiece group WS held by the holding table 20, and the holding The water nozzle 25 for supplying water to the upper surface of the ring frame F of the workpiece group WS held by the table 20, the gas nozzle 26 for supplying gas to the upper surface of the ring frame F of the workpiece group WS held by the holding table 20, the resin nozzle 24 and the water nozzle 25 And the gas nozzle 26 is arranged on the arm portion 27 extending in the direction of the holding surface of the holding table 20. Compared with the water nozzle 25, the gas nozzle 26 is arranged on the downstream side of the rotation direction of the holding table 20, so it is on the upper surface of the wafer W. When the water-soluble protective film is formed, the upper surface of the annular frame F can also be cleaned efficiently. Therefore, the water-soluble resin does not remain on the ring frame F. FIG. Furthermore, when the workpiece group WS formed with the water-soluble protective film is conveyed to the processing table 12 by the conveyance means 16, the water-soluble resin does not adhere to the conveyance means 16.

上述供給手段23雖然構成適合同時進行相對於晶圓W之上面的保護膜形成和環形框F之洗淨的構成，但是不限定於如此之構成。例如，圖5所示之供給手段23A係上述供給手段23之變形例，成為可以另外進行保護膜形成和框架洗淨的構成。供給手段23A與供給手段23相同具備樹脂噴嘴24a和水噴嘴25a和氣體噴嘴26a，樹脂噴嘴24a和水噴嘴25a和氣體噴嘴26a被配設在於保持台20之保持面方向延伸的臂部29。The above-mentioned supply means 23 has a configuration suitable for simultaneously performing the formation of the protective film on the upper surface of the wafer W and the cleaning of the ring frame F, but is not limited to such a configuration. For example, the supply means 23A shown in FIG. 5 is a modified example of the above-mentioned supply means 23, and has a configuration that can separately perform protective film formation and frame cleaning. The supply means 23A includes the resin nozzle 24a, the water nozzle 25a, and the gas nozzle 26a similarly to the supply means 23, and the resin nozzle 24a, the water nozzle 25a, and the gas nozzle 26a are arranged on the arm portion 29 extending in the holding surface direction of the holding table 20.

在臂部29之內部形成流體流動的流路。臂部29被形成其前端被定位至保持台20之中央側之程度的長度。樹脂噴嘴24a被配設在臂部29之前端。水噴嘴25a被配設在與配設有樹脂噴嘴24a之側相反側的臂部29之前端。氣體噴嘴26a係在水噴嘴25a側被配設在臂部29之側方側。在臂部29之另一端，與上述供給手段23相同，連接有具有垂直方向之軸心的旋轉軸28a。在旋轉軸28a連接有能夠正轉、逆轉的馬達(無圖示)。A channel through which fluid flows is formed inside the arm portion 29 . The arm portion 29 is formed in such a length that the front end thereof is positioned to the center side of the holding table 20 . The resin nozzle 24 a is arranged at the front end of the arm portion 29 . The water nozzle 25a is arranged at the front end of the arm portion 29 on the opposite side to the side where the resin nozzle 24a is arranged. The gas nozzle 26a is arranged on the lateral side of the arm portion 29 on the side of the water nozzle 25a. The other end of the arm portion 29 is connected to a rotating shaft 28a having an axis center in a vertical direction, similarly to the above-mentioned supply means 23 . A motor (not shown) capable of forward rotation and reverse rotation is connected to the rotary shaft 28a.

供給手段23A可以分別移動至樹脂供給位置P2和環形框洗淨位置P3和待機位置SP。樹脂供給位置P2係樹脂噴嘴24被定位在晶圓W之中央之上方的位置，環形框洗淨位置P3係水噴嘴25及氣體噴嘴26被定位在環形框F之上方的位置。The supply means 23A can move to the resin supply position P2, the ring frame cleaning position P3, and the standby position SP, respectively. The resin supply position P2 is a position where the resin nozzle 24 is positioned above the center of the wafer W, and the ring frame cleaning position P3 is a position where the water nozzle 25 and the gas nozzle 26 are positioned above the ring frame F.

在使用供給手段23A而在晶圓W之上面形成保護膜之情況，旋轉軸28a藉由馬達逆時鐘旋轉，臂部29相對於保持台20之保持面20a在水平方向迴旋，使供給手段23A從待機位置SP移動至樹脂供給位置P2。藉由圖2所示之旋轉手段21使保持台20旋轉，使工件組WS朝例如箭頭B方向旋轉。樹脂噴嘴24a係朝向晶圓W之上面滴下特定量之水溶性樹脂而予以塗佈。而且，以藉由在保持台20產生的離心力從晶圓W之中央朝向外周緣使水溶性樹脂流動而擴散至晶圓W之上面之全面，覆蓋晶圓W之上面之全面之方式，形成期待的水溶性保護膜。When using the supply means 23A to form a protective film on the wafer W, the rotating shaft 28a is rotated counterclockwise by the motor, and the arm part 29 turns in the horizontal direction relative to the holding surface 20a of the holding table 20, so that the supply means 23A moves from The standby position SP moves to the resin supply position P2. The holding table 20 is rotated by the rotating means 21 shown in FIG. 2 to rotate the workpiece set WS in the arrow B direction, for example. The resin nozzle 24 a drops a predetermined amount of water-soluble resin toward the upper surface of the wafer W for coating. Furthermore, the centrifugal force generated on the holding table 20 makes the water-soluble resin flow from the center of the wafer W toward the outer periphery, spreads to the entire upper surface of the wafer W, and covers the entire upper surface of the wafer W. water-soluble protective film.

當在晶圓W之上面形成水溶性保護膜之時，如圖6所示般，旋轉軸28a藉由馬達例如順時鐘旋轉，依此臂部29相對於保持台20之保持面20a在水平方向迴旋，使供給手段23A從樹脂供給位置P2移動至環形框洗淨位置P3。從水噴嘴25a對環形框F之上面供給洗淨水，並且從氣體噴嘴26a之複數噴射口260對環形框F之上面噴射氣體。依此，即使在環形框F之上面附著水溶性樹脂，亦藉由洗淨水被除去，並且藉由由於保持台20之旋轉而產生的離心力和氣體，包含水溶性樹脂之洗淨水被吹至環形框F之外側且被乾燥。When the water-soluble protective film is formed on the wafer W, as shown in FIG. 6, the rotating shaft 28a is rotated clockwise by the motor, for example, so that the arm portion 29 is in the horizontal direction relative to the holding surface 20a of the holding table 20. Rotate to move the supply means 23A from the resin supply position P2 to the ring frame cleaning position P3. Washing water is supplied to the upper surface of the ring frame F from the water nozzle 25a, and gas is injected to the upper surface of the ring frame F from the plurality of injection ports 260 of the gas nozzle 26a. Accordingly, even if the water-soluble resin adheres to the ring frame F, it is removed by the washing water, and the washing water containing the water-soluble resin is blown by the centrifugal force and gas generated by the rotation of the holding table 20. to the outside of ring frame F and dried.

以覆蓋晶圓W之上面之全面之方式，形成期待的水溶性保護膜，並且洗淨環形框F之上面之後，如圖7所示般，旋轉軸28藉由馬達進一步順時鐘旋轉，依此，臂部29相對於保持台20之保持面20a在水平方向迴旋，使供給手段23A從環形框洗淨位置P3移動至待機位置SP。之後，藉由圖1所示之搬運手段16，工件組WS被搬運至加工台12，藉由雷射加工手段17，在晶圓W之上面被施予特定雷射加工。即使在供給手段23A，可以藉由一個驅動源不會使樹脂噴嘴24a和水噴嘴25a和氣體噴嘴26a彼此干擾，而移動至期待的位置。After forming a desired water-soluble protective film covering the entire surface of the wafer W and cleaning the top of the ring frame F, as shown in FIG. 7 , the rotating shaft 28 is further rotated clockwise by the motor, and accordingly Then, the arm part 29 turns horizontally with respect to the holding surface 20a of the holding table 20, and moves the supply means 23A from the ring frame cleaning position P3 to the standby position SP. Afterwards, the workpiece group WS is transported to the processing table 12 by the transport means 16 shown in FIG. Even in the supply means 23A, the resin nozzle 24a, the water nozzle 25a, and the gas nozzle 26a can be moved to a desired position by one drive source without interfering with each other.

上述實施型態所示之保護膜形成裝置2雖然係組裝於加工裝置1而構成，但是即使為從加工裝置1獨立的單體之構成亦可。Although the protective film forming device 2 shown in the above-mentioned embodiment is configured by being incorporated in the processing device 1 , it may be configured as a single body independent of the processing device 1 .

1‧‧‧加工裝置 10‧‧‧裝置基座 11‧‧‧柱體 12‧‧‧加工台 13‧‧‧框架保持手段 14‧‧‧加工進給手段 140‧‧‧滾珠螺桿 141‧‧‧馬達 142‧‧‧導軌 143‧‧‧X軸基座 15‧‧‧分度進給手段 150‧‧‧滾珠螺桿 151‧‧‧馬達 152‧‧‧導軌 153‧‧‧Y軸基座 16‧‧‧搬運手段 160‧‧‧保持部 161‧‧‧滾珠螺桿 162‧‧‧馬達 163‧‧‧導軌 164‧‧‧移動部 17‧‧‧雷射加工手段 170‧‧‧殼體 171‧‧‧加工頭 18‧‧‧控制手段 2‧‧‧保護膜形成裝置 200‧‧‧加工室 20‧‧‧保持台 21‧‧‧旋轉手段 22‧‧‧框架保持手段 23、23A‧‧‧供給手段 24、24a‧‧‧樹脂噴嘴 25、25a‧‧‧水噴嘴 26、26a‧‧‧氣體噴嘴 27‧‧‧臂部 27a‧‧‧第1臂部 27b‧‧‧第2臂部 28‧‧‧旋轉軸 29‧‧‧臂部1‧‧‧Processing device 10‧‧‧Device base 11‧‧‧Cylinder 12‧‧‧Processing table 13‧‧‧Frame holding means 14‧‧‧Processing feed means 140‧‧‧Ball screw 141‧‧‧motor 142‧‧‧Guide rail 143‧‧‧X-axis base 15‧‧‧Indexing feed means 150‧‧‧Ball screw 151‧‧‧motor 152‧‧‧Guide rail 153‧‧‧Y-axis base 16‧‧‧Transportation means 160‧‧‧maintenance department 161‧‧‧Ball screw 162‧‧‧motor 163‧‧‧Guide rail 164‧‧‧Mobile Department 17‧‧‧Laser processing method 170‧‧‧shell 171‧‧‧Processing head 18‧‧‧Control means 2‧‧‧Protective film forming device 200‧‧‧Processing room 20‧‧‧Holding table 21‧‧‧rotation means 22‧‧‧Frame holding means 23. 23A‧‧‧means of supply 24, 24a‧‧‧Resin nozzle 25, 25a‧‧‧water nozzle 26, 26a‧‧‧gas nozzle 27‧‧‧arm 27a‧‧‧1st arm 27b‧‧‧Second arm 28‧‧‧rotation axis 29‧‧‧arm

圖1為表示加工裝置及保護膜形成裝置之構成的斜視圖。 圖2為表示保護膜形成裝置之構成的放大斜視圖。 圖3為表示供給手段被定位在供給位置之狀態的俯視圖。 圖4為表示供給手段被定位在待機位置之狀態的俯視圖。 圖5為表示供給手段之變形例被定位在樹脂供給位置之狀態的俯視圖。 圖6為表示供給手段之變形例被定位在環形框洗淨位置之狀態的俯視圖。 圖7為表示供給手段之變形例被定位在待機位置之狀態的俯視圖。Fig. 1 is a perspective view showing the configuration of a processing device and a protective film forming device. Fig. 2 is an enlarged perspective view showing the configuration of a protective film forming apparatus. Fig. 3 is a plan view showing a state in which supply means is positioned at a supply position. Fig. 4 is a plan view showing a state where supply means is positioned at a standby position. Fig. 5 is a plan view showing a state where a modified example of the supply means is positioned at a resin supply position. Fig. 6 is a plan view showing a state in which a modified example of the supply means is positioned at the washing position of the ring frame. Fig. 7 is a plan view showing a state in which a modified example of the supply means is positioned at a standby position.

2‧‧‧保護膜形成裝置 2‧‧‧Protective film forming device

20‧‧‧保持台 20‧‧‧Holding table

20a‧‧‧保持面 20a‧‧‧Retaining surface

21‧‧‧旋轉手段 21‧‧‧rotation means

22‧‧‧框架保持手段 22‧‧‧Frame holding means

23‧‧‧供給手段 23‧‧‧Supply means

24‧‧‧樹脂噴嘴 24‧‧‧Resin nozzle

25‧‧‧水噴嘴 25‧‧‧Water nozzle

26‧‧‧氣體噴嘴 26‧‧‧gas nozzle

27‧‧‧臂部 27‧‧‧arm

27a‧‧‧第1臂部 27a‧‧‧1st arm

27b‧‧‧第2臂部 27b‧‧‧Second arm

28‧‧‧旋轉軸 28‧‧‧rotation axis

200‧‧‧加工室 200‧‧‧Processing room

220‧‧‧框架載置台 220‧‧‧Frame carrier

221‧‧‧夾持部 221‧‧‧Clamping part

Claims (1)

一種保護膜形成裝置，其係在晶圓之上面形成水溶性保護膜，該保護膜形成裝置之特徵在於，具備：保持台，其係保持晶圓被黏貼於封閉環形框之開口且黏貼在該環形框之膠帶而被構成的工件組；旋轉手段，其係以該保持台之保持面之中心為軸而使該保持台旋轉；及供給手段，其係對該保持台保持的晶圓之上面供給水溶性樹脂，該供給手段包含：樹脂噴嘴，其係對該保持台保持的工件組之晶圓之上面中央供給水溶性樹脂，水噴嘴，其係對該保持台保持的工件組之環形框之上面供給水；及氣體噴嘴，其係對該保持台保持的工件組之該環形框之上面供給氣體，該樹脂噴嘴和該水噴嘴和該氣體噴嘴被配設在於該保持台之保持面方向延伸的臂部，比起該水噴嘴，該氣體噴嘴被配設該保持台之旋轉方向下游側，該臂部能夠以一端作為軸而在與該保持面平行的方向迴旋，該樹脂噴嘴係於使該臂部迴旋而對該環形框之上面供 給來自該氣體噴嘴之氣體及來自該水噴嘴之水之時，以位於該環狀框之外側上方之方式被配設在該臂部。 A protective film forming device, which forms a water-soluble protective film on a wafer, the protective film forming device is characterized in that it has: a holding table, which is used to hold the wafer to be pasted on the opening of the closed ring frame and pasted on the A workpiece group composed of adhesive tape of a ring-shaped frame; a rotating means, which rotates the holding table with the center of the holding surface of the holding table as an axis; and a supply means, which is the upper surface of the wafer held by the holding table The water-soluble resin is supplied, and the supply means includes: a resin nozzle, which supplies the water-soluble resin to the center of the upper surface of the wafer of the workpiece group held by the holder, and a water nozzle, which is an annular frame of the workpiece group held by the holder. Water is supplied on the upper surface; and a gas nozzle is used to supply gas to the upper surface of the annular frame of the workpiece group held by the holding table, and the resin nozzle, the water nozzle and the gas nozzle are arranged in the direction of the holding surface of the holding table The extended arm is arranged on the downstream side of the rotation direction of the holding table compared with the water nozzle, and the arm can rotate in a direction parallel to the holding surface with one end as an axis. The resin nozzle is attached to Rotate the arm to provide the upper surface of the ring frame The air from the gas nozzle and the water from the water nozzle are arranged on the arm so as to be located above the outer side of the annular frame.
TW108105373A 2018-02-20 2019-02-19 Protective film forming device TWI787466B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018027830A JP7108424B2 (en) 2018-02-20 2018-02-20 Protective film forming device
JP2018-027830 2018-02-20

Publications (2)

Publication Number Publication Date
TW201934207A TW201934207A (en) 2019-09-01
TWI787466B true TWI787466B (en) 2022-12-21

Family

ID=67689314

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108105373A TWI787466B (en) 2018-02-20 2019-02-19 Protective film forming device

Country Status (4)

Country Link
JP (1) JP7108424B2 (en)
CN (1) CN110176412B (en)
SG (1) SG10201900645RA (en)
TW (1) TWI787466B (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002270592A (en) * 2000-12-04 2002-09-20 Dainippon Screen Mfg Co Ltd Apparatus and method for treating substrate
JP2017092379A (en) * 2015-11-16 2017-05-25 株式会社ディスコ Protective film coating method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10199852A (en) * 1997-01-13 1998-07-31 Dainippon Screen Mfg Co Ltd Rotary substrate treatment device
JP3958539B2 (en) * 2001-08-02 2007-08-15 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
JP4871096B2 (en) * 2006-11-15 2012-02-08 株式会社ディスコ Resin coating apparatus and laser processing apparatus
JP5148156B2 (en) * 2007-04-18 2013-02-20 東京エレクトロン株式会社 Substrate cleaning apparatus and substrate cleaning method
JP5512424B2 (en) * 2010-07-06 2014-06-04 東京エレクトロン株式会社 Substrate cleaning apparatus and substrate cleaning method
JP6141212B2 (en) * 2014-01-24 2017-06-07 東京エレクトロン株式会社 Treatment liquid nozzle and coating treatment apparatus
JP6494451B2 (en) * 2015-07-06 2019-04-03 株式会社ディスコ Chuck table and cleaning device
JP6672091B2 (en) * 2016-06-24 2020-03-25 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing method and substrate processing apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002270592A (en) * 2000-12-04 2002-09-20 Dainippon Screen Mfg Co Ltd Apparatus and method for treating substrate
JP2017092379A (en) * 2015-11-16 2017-05-25 株式会社ディスコ Protective film coating method

Also Published As

Publication number Publication date
CN110176412A (en) 2019-08-27
SG10201900645RA (en) 2019-09-27
JP7108424B2 (en) 2022-07-28
CN110176412B (en) 2024-05-31
JP2019145642A (en) 2019-08-29
TW201934207A (en) 2019-09-01

Similar Documents

Publication Publication Date Title
TWI460024B (en) Protective film coating method and protective film covering device
JP6739873B2 (en) Wafer processing method
JP5881464B2 (en) Wafer laser processing method
KR20140045874A (en) Laser machining apparatus and its intake passage cleaning method
KR20170057145A (en) Method for coating a protective film
JP6277021B2 (en) Wafer processing apparatus and wafer processing method
TWI669201B (en) Cutting device
TWI694504B (en) Laser processing method
JP5637769B2 (en) Laser processing equipment
TWI787466B (en) Protective film forming device
TWI653675B (en) Processing device and wafer processing method
JP4966709B2 (en) Resin coating apparatus and laser processing apparatus
JP4776431B2 (en) Protective film coating equipment
JP6305750B2 (en) Processing machine with static eliminator
JP2018192546A (en) Cutting device
JP2021034647A (en) Protective film coating device and laser processing apparatus equipped with protective film coating device
KR101687423B1 (en) Machining apparatus
JP2021176640A (en) Processing method for workpiece
JP2014220449A (en) Processing device
JP2008119740A (en) Resin coating apparatus and laser beam machine
JP2022124206A (en) Laser processing device
JP6276982B2 (en) Spinner cleaning device
JP2023026854A (en) Liquid resin coating device
JP2024006600A (en) Wafer processing method and processing device
JP2014217805A (en) Liquid resin coating device