TWI781677B - Method of manufacturing conductive ceramic by reduction firing using laser - Google Patents
Method of manufacturing conductive ceramic by reduction firing using laser Download PDFInfo
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- TWI781677B TWI781677B TW110124938A TW110124938A TWI781677B TW I781677 B TWI781677 B TW I781677B TW 110124938 A TW110124938 A TW 110124938A TW 110124938 A TW110124938 A TW 110124938A TW I781677 B TWI781677 B TW I781677B
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本發明係有關一種運用雷射還原燒成製造導電陶瓷之方法，係一種工業加工製造流程者。The present invention relates to a method of manufacturing conductive ceramics by using laser reduction firing, which is an industrial processing and manufacturing process.
陶瓷因具高硬度、高耐熱性等優良特性，所以在電子、機械與醫學等各領域裡都有廣泛的應用；Because of its high hardness, high heat resistance and other excellent characteristics, ceramics are widely used in various fields such as electronics, machinery and medicine;
但一般陶瓷不具導電特性，且因陶瓷與金屬由於膨脹係數、燒製方法與燒成溫度之不同，所以一般難以共同燒製，使其在應用上仍有一定的限制。However, general ceramics do not have electrical conductivity, and because ceramics and metals have different expansion coefficients, firing methods, and firing temperatures, it is generally difficult to co-fire them, which still limits their application.
有鑑於上述缺失弊端，本發明人認為具有改正之必要，遂以從事相關技術以及產品設計製造之多年經驗，秉持優良設計理念，針對以上不良處加以研究創作，在經過不斷的努力後，終乃推出本發明運用雷射還原燒成製造導電陶瓷之方法，期以更正產品結構以提升產品優良之功效。In view of the above shortcomings, the inventor believes that it is necessary to correct it. Based on his many years of experience in related technologies and product design and manufacturing, and adhering to the excellent design concept, he researched and created the above shortcomings. After continuous efforts, he finally achieved Introduced the method of the present invention using laser reduction firing to manufacture conductive ceramics, hoping to correct the product structure and improve the excellent efficacy of the product.
本發明運用雷射還原燒成製造導電陶瓷之方法之主要目的，係提供一種可在陶瓷上形成導電層的流程步驟者。The main purpose of the present invention is to provide a process step for forming a conductive layer on ceramics by using laser reduction firing to manufacture conductive ceramics.
爲達到前揭之目的，本發明運用雷射還原燒成製造導電陶瓷之方法包括有：In order to achieve the purpose disclosed above, the method of the present invention to manufacture conductive ceramics by using laser reduction firing includes:
材料設置程序，將氧化金屬材料設置於一陶瓷基板上；a material setting procedure, setting metal oxide material on a ceramic substrate;
燒結固定程序，使用一雷射裝置所產生的雷射來照射陶瓷基板上的氧化金屬材料，進而對氧化金屬材料產生還原燒效果，使其成為固著於陶瓷基板上的導電層；The sintering and fixing process uses the laser generated by a laser device to irradiate the oxidized metal material on the ceramic substrate, and then produces a reduction firing effect on the oxidized metal material, making it a conductive layer fixed on the ceramic substrate;
清理程序，清除導電層範圍外未受燒結的氧化金屬材料。Cleaning procedure to remove unsintered oxidized metal material outside the confines of the conductive layer.
而透過本發明利用雷射還原燒技術將不導電之氧化金屬經由雷射還原燒使其產生導電性，並使之附著於陶瓷表面的精確範圍，以製出含有陶瓷基板與導電層的複合式導電陶瓷後，即可擴大陶瓷材料的可應用範圍，例如於電子工程領域中製造具導電迴路的陶瓷零組件，或進一步延伸出光熱之應用，進而改善以往一般陶瓷無導電性的缺點，顯見本發明為一具有進步性的創作。Through the present invention, the laser reduction firing technology is used to make the non-conductive oxide metal conductive through laser reduction firing, and make it adhere to the precise range of the ceramic surface, so as to produce a composite formula containing a ceramic substrate and a conductive layer. After conducting conductive ceramics, the applicable range of ceramic materials can be expanded, such as the manufacture of ceramic components with conductive circuits in the field of electronic engineering, or further extend the application of light and heat, thereby improving the shortcomings of conventional ceramics without conductivity. It is obvious that this An invention is a progressive creation.
［請參閱第一圖與第二圖］本發明係有關一種運用雷射還原燒成製造導電陶瓷之方法，其包括以下步驟：[Please refer to Figure 1 and Figure 2] The present invention relates to a method of manufacturing conductive ceramics by laser reduction firing, which includes the following steps:
材料設置程序（Ｓ１），將氧化金屬材料設置於一陶瓷基板上；a material setting procedure (S1), setting the metal oxide material on a ceramic substrate;
燒結固定程序（Ｓ２），使用一雷射裝置所產生的雷射來照射陶瓷基板上的氧化金屬材料，進而對氧化金屬材料產生還原燒效果，使其成為固著於陶瓷基板上的導電層；The sintering and fixing procedure (S2), using a laser generated by a laser device to irradiate the oxidized metal material on the ceramic substrate, and then produce a reduction firing effect on the oxidized metal material, making it a conductive layer fixed on the ceramic substrate;
清理程序（Ｓ３），清除導電層範圍外未受燒結的氧化金屬材料。A cleaning procedure (S3), removing unsintered oxidized metal materials outside the range of the conductive layer.
［請參閱第一圖與第二圖］在材料設置程序（Ｓ１）步驟中，所用的氧化金屬材料可為氧化鐵Fe 2O 3或碳酸銅CuCO 3； [Please refer to the first picture and the second picture] In the step of the material setting program (S1), the metal oxide material used can be iron oxide Fe 2 O 3 or copper carbonate CuCO 3 ;
而在燒結固定程序（Ｓ２）中，此處所用的雷射裝置為市面上所販售的二氧化碳雷射雕刻機，雷射功率為20W，雷射光點的直徑為0.2mm，而照射時是循多條平行間隔的路徑進行，照射氧化鐵時，光點的移動速度設定為1mm/sec，間隔為0.05mm，而照射碳酸銅時，光點的移動速度為4mm/sec，間隔為0.02mm；In the sintering and fixing procedure (S2), the laser device used here is a carbon dioxide laser engraving machine sold on the market, the laser power is 20W, and the diameter of the laser spot is 0.2mm. Multiple parallel and spaced paths are carried out. When iron oxide is irradiated, the moving speed of the light spot is set to 1mm/sec, and the interval is 0.05mm. When copper carbonate is irradiated, the moving speed of the light spot is 4mm/sec, and the interval is 0.02mm;
［請一併參閱第三圖與第四圖］完成燒結固定程序（Ｓ２）與清理程序（Ｓ３）後，再以三用電錶觸接已燒結的導電層來進行測量，發現由氧化鐵形成的導電層可通電並電阻為120Ω，而由碳酸銅形成的導電層同樣可導電並電阻為36Ω；[Please refer to the third picture and the fourth picture together] After completing the sintering and fixing procedure (S2) and the cleaning procedure (S3), touch the sintered conductive layer with a three-purpose electric meter to measure, and it is found that the iron oxide formed The conductive layer is electrically conductive and has a resistance of 120Ω, while the conductive layer formed of copper carbonate is also conductive and has a resistance of 36Ω;
而透過本方法製出含陶瓷基板與導電層的複合式導電陶瓷後，即可進一步拓展陶瓷的可應用範圍，例如應用於電子工程以製造具有導電迴路的陶瓷零組件等等。After the composite conductive ceramic containing the ceramic substrate and the conductive layer is produced by the method, the applicable range of the ceramic can be further expanded, for example, it can be applied to electronic engineering to manufacture ceramic components with conductive circuits, and the like.
唯以上所述者，僅為本發明之一較佳實施例而已，當不能以之限定本發明之範圍。即大凡依申請專利範圍所作之均等變化與修飾，皆應仍屬本創作專利涵蓋之範圍內。What is described above is only a preferred embodiment of the present invention, and should not be used to limit the scope of the present invention. That is to say, all equivalent changes and modifications made according to the scope of the patent application should still fall within the scope covered by this creation patent.
綜上所述，當知本發明具有新穎性、進步性，且本發明未見之於任何物，當符合專利法第２２條之規定。To sum up, it should be known that the present invention is novel and progressive, and the present invention has not been seen in anything before, and it should comply with the provisions of Article 22 of the Patent Law.
Ｓ１:材料設置程序S1: Material setting procedure
Ｓ２:燒結固定程序S2: Sintering fixation program
Ｓ３:清理程序S3: Cleanup procedure
第一圖係本發明運用雷射還原燒成製造導電陶瓷之方法之步驟流程圖。 第二圖係本發明運用雷射還原燒成製造導電陶瓷之方法的燒結固定程序之實際照片圖。 第三圖係依本發明運用雷射還原燒成製造導電陶瓷之方法製出的導電陶瓷之導電測試照片圖。 第四圖係依本發明運用雷射還原燒成製造導電陶瓷之方法製出的導電陶瓷之另一導電測試照片圖。 The first figure is a flow chart of the steps of the method for manufacturing conductive ceramics using laser reduction firing in the present invention. The second figure is the actual photo figure of the sintering and fixing procedure of the method of manufacturing conductive ceramics by using laser reduction firing in the present invention. The third figure is a conductive test photo of the conductive ceramics produced by the method of using laser reduction firing to produce conductive ceramics according to the present invention. The fourth figure is another conductive test photo of the conductive ceramics produced by using the method of laser reduction firing to produce conductive ceramics according to the present invention.
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S1:材料設置程序 S1: Material setting procedure
S2:燒結固定程序 S2: Sintering fixation program
S3:清理程序 S3: Cleanup program
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102202820A (en) * | 2008-08-25 | 2011-09-28 | 印可得株式会社 | Method for manufacturing metal flakes |
| TWI687394B (en) * | 2019-04-30 | 2020-03-11 | 李子介 | Method for reduction firing ceramics by laser |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102202820A (en) * | 2008-08-25 | 2011-09-28 | 印可得株式会社 | Method for manufacturing metal flakes |
| TWI687394B (en) * | 2019-04-30 | 2020-03-11 | 李子介 | Method for reduction firing ceramics by laser |
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